Paper No. 21
`Dated: November 30, 2020
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`____________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`____________
`
`COOLIT SYSTEMS, INC.,
`Petitioner,
`
`v.
`ASETEK DANMARK A/S,
`Patent Owner.
`____________
`
`Case No. IPR2020-00523
`U.S. Patent No. 10,078,354
`____________
`
`
`
`
`PATENT OWNER’S RESPONSE
`
`
`
`
`
`
`
`
`
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`TABLE OF CONTENTS
`
`I.
`Preliminary Statement ..................................................................................... 1
`The ’354 patent ................................................................................................ 2
`II.
`III. Claim Construction .......................................................................................... 6
`IV. Petition Prior Art .............................................................................................. 7
`A.
`Batchelder .............................................................................................. 7
`B.
`Shin ...................................................................................................... 12
`C.
`Cheon ................................................................................................... 14
`V. Ground 1 of the Petition Does Not Establish Obviousness of Claims 1,
`8, or 15 Based on Batchelder and Shin .......................................................... 15
`A.
`Batchelder in view of Shin does not disclose “the lower
`chamber includes a plurality of channels configured to … direct
`the cooling liquid from the central region toward the perimeter
`of the lower chamber” as required by claim 1 .................................... 16
`1.
`Batchelder does not disclose flow of cooling liquid from
`a central region of its alleged “lower chamber” towards
`the perimeter; rather, Batchelder discloses the opposite
`flow direction ............................................................................ 18
`Nor does Shin disclose flow of cooling liquid from a
`central region of its alleged “lower chamber” towards the
`perimeter ................................................................................... 25
`There is no motivation, or reasonable expectation of
`success, for modifying the flow direction in Batchelder’s
`device ........................................................................................ 26
`Batchelder in view of Shin does not disclose a “first passage”
`that “directs the cooling liquid into the lower chamber where
`the cooling liquid splits and is directed along a plurality of
`channels from a central region of the lower chamber outward,”
`as recited in claim 15 ........................................................................... 29
`
`2.
`
`3.
`
`B.
`
`
`
`ii
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`U.S. Patent No. 10,078,354
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`C.
`
`Batchelder in view of Shin does not disclose a “second passage
`positioned at a perimeter of the lower chamber” that directs
`cooling liquid from the “lower chamber,” as recited in claim 15 ....... 35
`D. A person skilled in the art would not have been motivated to
`modify Batchelder to have a “radiator spaced apart from and
`fluidly coupled to the reservoir,” as required by each of the
`independent claims 1, 8, and 15 .......................................................... 37
`VI. Ground 2 of the Petition Does Not Establish Obviousness of Claims 4,
`14, or 19 Based on Batchelder, Shin, and Cheon .......................................... 42
`A.
`Batchelder, Shin, and Cheon do not disclose a control system
`“configured to adjust a rotational speed of a fan and a rotational
`speed of a pump” as required by claim 14 .......................................... 42
`VII. Secondary Considerations Weigh Against Obviousness of the
`Challenged Claims ......................................................................................... 46
`A.
`There is a Presumed Nexus Between Asetek’s Patented Design
`and the Objective Indicia of Nonobviousness ..................................... 47
`B. Objective Indicia Demonstrate the Nonobviousness of the
`Challenged Claims .............................................................................. 61
`1.
`Long-Felt Need and Failure of Others ...................................... 61
`2.
`Commercial success .................................................................. 66
`3.
`Industry Praise ........................................................................... 68
`VIII. Conclusion ..................................................................................................... 71
`
`
`
`iii
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`TABLE OF AUTHORITIES
`
` Page(s)
`
`Federal Cases
`Active Video Networks, Inc. v. Verizon Commc’ns, Inc.,
`694 F.3d 1312 (Fed. Cir. 2012) .................................................................... 29, 37
`Advanced Display Sys., Inc. v. Kent State Univ.,
`212 F.3d 1272 (Fed. Cir. 2000) .......................................................................... 62
`Allen Archery, Inc. v. Browning Mfg. Co.,
`819 F.2d 1087 (Fed. Cir. 1987) .......................................................................... 68
`Arctic Cat Inc. v. Polaris Indus., Inc.,
`795 F. App’x 827 (Fed. Cir. 2019) ..................................................................... 41
`Arendi S.A.R.L. v. Apple Inc.,
`832 F.3d 1355 (Fed. Cir. 2016) .......................................................................... 35
`Belden Inc. v. Berk-Tek LLC,
`805 F.3d 1064 (Fed. Cir. 2015) .......................................................................... 34
`Brown & Williamson Tobacco Corp. v. Philip Morris Inc.,
`229 F.3d 1120 (Fed. Cir. 2000) .......................................................................... 48
`Corning Glass Works v. Sumitoto Elec. U.S.A. Inc.,
`671 F. Supp 1369 (S.D.N.Y. 1987), aff’d 868 F.2d 1251 (Fed. Cir.
`1989) ................................................................................................................... 68
`Crocs, Inc. v. Int’l Trade Comm’n,
`598 F.3d 1294 (Fed. Cir. 2010) .......................................................................... 47
`
`In re Cyclobenzaprine Hydrochloride Extended- Release Capsule
`Patent Litig.,
`676 F.3d 1063 (Fed. Cir. 2012) .......................................................................... 46
`FOX Factory, Inc. v. SRAM, LLC,
`944 F.3d 1366 (Fed. Cir. 2019) .......................................................................... 48
`
`
`
`iv
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`
`In re Giannelli,
`739 F.3d 1375 (Fed. Cir. 2014) .................................................................... 28, 37
`In re Gordon,
`733 F.2d 900 (Fed. Cir. 1984) ............................................................................ 40
`In re Gurley,
`27 F.3d 551 (Fed. Cir. 1994) .............................................................................. 41
`Harari v. Lee,
`656 F.3d 1331 (Fed. Cir. 2011) .......................................................................... 45
`Leo Pharm. Prods., Ltd. v. Rea,
`726 F.3d 1346 (Fed. Cir. 2013) .................................................................... 47, 66
`In re Mahurkar Double Lumen Hemodialysis Catheter Patent Litig.,
`831 F. Supp. 1354 (N.D. Ill. 1993), aff’d, 71 F.3d 1573 (Fed. Cir.
`1995) ................................................................................................................... 62
`Millennium Pharms., Inc. v. Sandoz Inc.,
`862 F.3d 1356 (Fed. Cir. 2017) .................................................................... 28, 34
`Minn. Mining & Mfg. Co. v. Johnson & Johnson Orthopaedics, Inc.,
`976 F.2d 1559 (Fed. Cir. 1992) .......................................................................... 62
`Ortho-McNeil Pharm. Inc. v. Mylan Labs., Inc.,
`520 F.3d 1358 (Fed. Cir. 2008) .......................................................................... 46
`Otsuka Pharm. Co. v. Sandoz, Inc.,
`678 F.3d 1280 (Fed. Cir. 2012) .......................................................................... 28
`Personal Web Techs., Inc. v. Apple Inc.,
`848 F.3d 987 (Fed. Cir. 2017) ............................................................................ 29
`Plas-Pak Indus., Inc. v. Sulzer Mixpac AG,
`600 F. App’x 755 (Fed. Cir. 2015) ............................................................... 39, 40
`Polaris Indus., Inc. v. Arctic Cat, Inc.,
`882 F.3d 1056 (Fed. Cir. 2018) .......................................................................... 48
`Rambus Inc. v. Rea,
`731 F.3d 1248 (Fed. Cir. 2013) .......................................................................... 66
`
`
`
`v
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`
`In re Ratti,
`270 F.2d 810 (C.C.P.A. 1959) ................................................................ 28, 35, 39
`Tec Air, Inc. v. Denso Mfg. Michigan Inc.,
`192 F.3d 1353 (Fed. Cir. 1999) .................................................................... 62, 66
`Vivid Techs., Inc. v. Am. Sci. & Eng’g, Inc.,
`200 F.3d 795 (Fed. Cir. 1999) .............................................................................. 6
`
`
`
`
`
`
`vi
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`I.
`
`Preliminary Statement
`Petitioner’s asserted Grounds 1 and 2 for unpatentability are based on alleged
`
`obviousness. Petitioner’s allegations fail for several reasons, but principally because
`
`the prior art does not disclose a critical element of the claimed invention — the flow
`
`of cooling liquid from the center of the “lower chamber,” where the cold plate is the
`
`hottest, to the periphery in the “lower chamber.” Indeed, Petitioner’s expert
`
`conceded during deposition that none of Petitioner’s prior art references discloses
`
`this limitation, and that Petitioner’s lead reference (Batchelder) instead discloses the
`
`opposite, cooling liquid flowing from the periphery to the center of the “lower
`
`chamber.” Petitioner attempts to fill this critical gap in the prior art by arguing that
`
`it would have been a simple design choice to change the fluid flow direction in the
`
`lower chamber of Batchelder from periphery-to-center to center-to-periphery, but
`
`none of the prior art discloses that alleged design choice. Instead, Petitioner’s only
`
`basis for its alleged change to Batchelder is impermissible hindsight and the route
`
`taken by the inventor. These arguments are legally impermissible and should be
`
`rejected for that reason alone. But Petitioner’s arguments would also require
`
`significant reconstruction of Batchelder, which Petitioner has not articulated how to
`
`do, and for which a person of ordinary skill would not have had a reasonable
`
`expectation of success. Petitioner’s arguments fail for these reasons as well.
`
`As explained in further detail below, Petitioner has not sustained its burden
`
`1
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`and the claims of the ’354 patent should be held patentable.
`
`II. The ’354 patent
`Computers (and particularly their central processing units, or “CPUs”)
`
`generate heat during operation, which must be dissipated efficiently and effectively
`
`for computers to operate reliably. Ex. 2018, ¶26. As technology advances and
`
`computers become faster and more powerful, they generate increasing amounts of
`
`heat that must be managed. Id. Various heat dissipation methods, including air
`
`cooling and liquid cooling, are used to manage heat in computer systems. Id. at ¶27.
`
`While air cooling systems are cheaper and easier to install, they are not as efficient
`
`as liquid cooling systems at heat removal. Id. Prior art liquid cooling systems were
`
`bulky and posed significant risk of leakage from having several components (such
`
`as a heat exchanger, a liquid reservoir, a pump, and a heat radiator) coupled together
`
`using tubes. Id. Such a configuration is illustrated in prior Art Figure 3 of the ’354
`
`patent (depicted below), showing a prior art heat exchanger 7, a prior art liquid
`
`reservoir 8, a prior art pump 9, and a prior art heat radiator 11 connected in a closed
`
`loop using tubes.
`
`2
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`
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`Ex. 1001, Figure 3.
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`The liquid cooling technology described and claimed in the Asetek patents,
`
`including the ’354 patent, addressed this leakage problem, among others, and
`
`resulted in a highly efficient yet compact (narrow profile) liquid cooling device that
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`has been widely accepted by the industry (and copied by competitors like CoolIT).
`
`See Ex. 2018, ¶¶28, 30. Among other things, Asetek’s patented technology is a
`
`significant advancement from the modular approach of prior art liquid cooling
`
`devices. Id. at ¶28. Figures 9 and 15 of the ’354 patent represents embodiments of
`
`the claimed invention. As evident from these figures and the patent claims, Asetek’s
`
`invention has, among other features, a pump unit that combines a pump, a dual-
`
`chambered “reservoir,” and a “heat exchanging interface” (i.e., a cold plate) into a
`
`single component. Id. The “reservoir” in Asetek’s patented design is divided into
`
`3
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`two chambers, the referred to as the “upper chamber” and “lower chamber” in the
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`’354 patent claims. See, e.g., Ex. 1001, claims 1, 8, and 15; Ex. 2018, ¶28. The dual
`
`chambers are vertically spaced apart and fluidly coupled together to allow for heat
`
`dissipation from the CPU via the “heat exchanging interface,” i.e., the boundary wall
`
`of the “lower chamber” which is placed in thermal contact with the CPU. Ex. 2018,
`
`¶28. This configuration, among other features of the patented inventions, enables
`
`separate and independent optimization of the pumping function in the “upper
`
`chamber” and the heat transfer function in the “lower chamber.” Id. The unique dual-
`
`chambered “reservoir” concept also made manufacturing of liquid cooling products
`
`simpler and less costly, and has also made installation of liquid cooling products by
`
`users easier as compared to installation of the kit-based modular liquid cooling
`
`components (shown in prior art Figure 3 of the ’354 patent). Ex. 2018, ¶30.
`
`Ex. 1001, Figure 15 (annotations added); Ex. 2018, ¶28
`
`4
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`
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`The ’354 patent further describes and claims a very specific configuration for
`
`
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`the dual-chambered “reservoir,” where cooling liquid enters the “lower chamber”
`
`from the “upper chamber” through a first passage that is substantially central to the
`
`“lower chamber,” as shown in Figure 9, depicted below. Ex. 2018, ¶¶28-29. Coolant
`
`entering the “lower chamber” splits and flows outwardly along a plurality of
`
`channels from the central region towards the perimeter of the “lower chamber,”
`
`where a second passage collects the heated coolant and directs it out of the “lower
`
`chamber.” Ex. 1001, 15:25-30, Fig. 9; Ex. 2018, ¶29. Positioning the first passage at
`
`the central region of the “lower chamber” allows the cooling liquid to make thermal
`
`contact with the center of the “heat exchanging interface” first, before collecting any
`
`heat from the perimeter of the “lower chamber.” Ex. 2018, ¶29. This arrangement is
`
`important for heat-removal efficiency because the center of the “heat exchanging
`
`interface” is positioned right above the heat-generating processing unit and is
`
`therefore hotter compared to the peripheries of the interface. Id. Allowing coolant to
`
`enter at the center of the “lower chamber” (as opposed to the perimeter) ensures
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`more efficient heat removal from the hottest and the most critical region of the “heat
`
`exchanging interface.” Id. Moreover, pressure drop and flow resistance through the
`
`channels is reduced when coolant enters each channel at midway along its length,
`
`splits into two sub-flows, and flows outwardly along only half of the channel’s
`
`5
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`length, as shown below in annotated Figure 9, instead of coolant traveling through
`
`the full length of each channel from one end of the “lower chamber” to the other. Id.
`
`
`
`
`
`
`
`Ex. 1001, Figure 9 (annotation added); Ex. 2018, ¶29.
`
`III. Claim Construction
`In the Institution Decision, the Board found no claim terms needed express
`
`construction. DI at 10-11. Asetek agrees that no claim construction is required to
`
`resolve the dispute between the parties in this IPR proceeding. Vivid Techs., Inc. v.
`
`Am. Sci. & Eng’g, Inc., 200 F.3d 795, 803 (Fed. Cir. 1999) (“[O]nly those terms
`
`need to be construed that are in controversy, and only to the extent necessary to
`
`6
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`resolve the controversy.”). Asetek has applied the plain and ordinary meaning for all
`
`relevant claim terms in this Response.
`
`IV. Petition Prior Art
`A. Batchelder
`Batchelder discloses a heat exchange apparatus for transferring heat from a
`
`heat source to a heat absorber, which in turn transfers the heat to surrounding
`
`atmosphere. Ex. 1006, Title, Abstract, 2:41-45, 3:35-44; Ex. 2018, ¶31. The
`
`apparatus comprises an active heat spreader plate with internal flow channels for
`
`circulating a heat transfer fluid (also referred to herein as cooling liquid), and a
`
`means to circulate the fluid through the channels. Ex. 1006, Abstract; Ex. 2018, ¶31.
`
`Petitioner’s expert, Dr. Hodes, refers to two different embodiments of
`
`Batchelder in his analysis of the Challenged Claims. Pet. at 11-12, 17, 18. The first
`
`embodiment is shown in Figure 2, annotated below, and the second embodiment is
`
`shown in Figures 7 and 8. The basic components of Batchelder’s heat exchange
`
`apparatus — heat spreader plate 20, heat absorbing device 28, and fan housing 30
`
`— are annotated in Figure 2, below. Ex. 2018, ¶32. Heat enters heat spreader plate
`
`20 through its lower surface 24 and is conducted into a metallic fin array 52, from
`
`where heat is transferred to a heat transfer fluid sealed in flow channels 50 inside
`
`heat spreader plate 20. Ex. 1006, 5:1-32; Ex. 2018, ¶32. The fluid is circulated inside
`
`plate 20 by an impeller 54. Ex. 1006, 5:1-32; Ex. 2018, ¶32. The fluid releases heat
`
`7
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`near the top surface 26 of plate 20, where the heat is conducted into heat absorbing
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`device 28. Ex. 1006, 5:1-32; Ex. 2018, ¶32. Air is blown through heat absorbing
`
`device 28 by fan blades 34 to transfer heat to the atmosphere. Ex. 1006, 5:1-32; Ex.
`
`2018, ¶32. Fan blades 32 are attached to a motor and rotor 32 within fan housing 30.
`
`Ex. 1006, 5:1-32; Ex. 2018, ¶32. A permanent magnet 56 attached to the base of
`
`rotor 32 causes impeller 54 to rotate and thereby circulate the heat transfer fluid
`
`within active spreader plate 20. Ex. 1006, 5:1-32; Ex. 2018, ¶32.
`
`
`
`
`
`Ex. 1006, Fig. 2 (annotations added); Ex. 2018, ¶32.
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`The embodiment shown in Figures 7 and 8, i.e., heat sink assembly 240, also
`
`includes a heat spreader plate 20, which is “designed to be stamped from sheets and
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`8
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`subsequently assembled with adhesives, ultrasonic bonding, solvent bonding, or
`
`welding.” Ex. 1006, 8:4-12; Ex. 2018, ¶33. Specifically, heat spreader plate 20 is
`
`formed by assembling multiple sheets and plates—a bottom sheet 202, a lower
`
`stamped plate 204, a medial sheet 206, an upper stamped plate 208, channel forming
`
`plate 210, and a top sheet 212. Ex. 1006, 7:23-8:1; Ex. 2018, ¶33. Dr. Hodes refers
`
`to the space between upper stamped plate 208 and channel forming plate 210 as the
`
`“upper chamber,” and lower stamped plate 204 as the “lower chamber.” Ex. 1003,
`
`¶61; Ex. 2018, ¶33.
`
`In addition to the heat spreader plate 20, heat sink 240 in Figures 7 and 8
`
`includes a fan housing 30 and a heat absorbing device 28, just as in the embodiment
`
`shown in Figure 2. Ex. 1006, Fig. 7 (right hand-side image) (annotated below). The
`
`fins of heat absorbing device 28 are attached to the upper surface 26 of top sheet 212
`
`of the heat spreader plate assembly. Id.; Ex. 2018, ¶34. A fan housing 30, rotor 32,
`
`and fan blades 34 are attached to the top of heat absorbing device 28, as in the
`
`embodiment shown in Figure 2. Ex. 1006, Fig. 7; Ex. 2018, ¶34. A heat source 2 is
`
`attached to the bottom sheet 202 of the heat spreader plate assembly through a
`
`compliant insulating layer 14. Ex. 1006, Fig. 7; Ex. 2018, ¶34. Heat from the heat
`
`source passes through the bottom surface 24 of the bottom sheet 202 and into a fin
`
`means 52 contained in a pocket 230 of the lower stamped plate 204 (i.e., alleged
`
`“lower chamber”). Ex. 1006, Fig. 7; Ex. 2018, ¶34.
`
`9
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`
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`Ex. 1006, Fig. 7 (annotations added); Ex. 2018, ¶34.
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`Figure 8 of Batchelder, annotated below, shows the flow pattern through the
`
`heat spreader plate 20 described in Figure 7. Heat transfer fluid enters the corners of
`
`“lower chamber” through four holes 228 in medial sheet 206, passes in contact with
`
`the centrally-located fin means 52 to collect heat, and the heated fluid exits through
`
`slots 232 (also in medial sheet 206), and enters coaxial cavity 220 (i.e., the alleged
`
`“upper chamber”). Ex. 1006, 7:23-8:1, Fig. 8; Ex. 2018, ¶35. A rotatable impeller
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`54 is housed in the alleged “upper chamber,” which impels the fluid rising through
`
`slots 232 to flow radially away from the impeller through channels 222 in upper
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`stamped plate 204, then to flow in the plane of channel forming plate 210 and in
`
`10
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`thermal communication with the fins of heat absorbing device 28 to release heat
`
`from the fluid. Ex. 1006, 7:23-8:1, Fig. 8; Ex. 2018, ¶35. The cooled fluid from
`
`channel forming plate 210 flows downward into channels 226 in upper stamped plate
`
`204 and then flows radially towards impeller 54. Ex. 1006, 7:23-8:1, Fig. 8; Ex.
`
`2018, ¶35. The cooled fluid in channels 226 then enters the “lower chamber” through
`
`holes 228, and the flow cycle repeats. Ex. 1006, 7:23-8:1, Fig. 8; Ex. 2018, ¶35.
`
`Ex. 1006, Fig. 8 (annotations added); Ex. 2018, ¶35.
`
`
`
`
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`11
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`
`Shin
`B.
`Shin discloses a cooling device comprising a pump 5 and a heat sink 4, which
`
`
`
`are installed as an “integral structure” on an electronic heat generating element 1 to
`
`remove heat from that element. Ex. 1007, Abstract, Figs. 1 and 2 (reproduced
`
`below); Ex. 2018, ¶36. Pump 5 comprises an impeller case 11 (the alleged “upper
`
`chamber”) and a motor 12. Ex. 1007, ¶[0018]; Ex. 2018, ¶36; Ex. 1003, ¶62. Heat
`
`sink 4 is the alleged “lower chamber” in Shin. Ex. 1003, ¶62; Ex. 2018, ¶36. A hose
`
`6 connects the alleged “upper chamber” to one end of the alleged “lower chamber.”
`
`Ex. 1007, ¶[0013], Figs. 1 and 3; Ex. 2018, ¶36. Moreover, Dr. Hodes contends that
`
`impeller case 11, heat sink 4, hose 6, and couplers 7 and 9 together form the claimed
`
`“reservoir.” Ex. 1003, ¶58. In the embodiment shown in Figure 1, a vibration
`
`absorbing member 19 is positioned between pump 5 and heat sink 4 so that vibration
`
`of the pump does not affect the functioning of the electronic component. Ex. 1007,
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`¶[0013]; Ex. 2018, ¶36.
`
`12
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`
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`Ex. 1007, Figs. 1 and 2 (annotations added); Ex. 2018, ¶36.
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`
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`Coolant entering heat sink 4, i.e., the alleged “lower chamber,” is “split into a
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`plurality of channels formed inside the heat sink and flows in snaking fashion,
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`absorbing the heat of the heat generating element 1,” and then exits heat sink 4
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`through hose 16 and flows into a heat exchange section 27 that cools the coolant.
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`Ex. 1007, ¶¶[0013], [0025]; Ex. 2018, ¶37. Cooled coolant from heat exchange
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`system 27 is returned to pump 5 by hose 13, is pressurized again by the pump, and
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`then supplied to heat sink 4. Ex. 1007, ¶¶[0013], [0025]; Ex. 2018, ¶36.
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`
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`Shin also teaches that the speed of pump motor 12 can be changed by changing
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`the DC voltage supplied to the motor, thus enabling control of cooling power. Ex.
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`1007, ¶[0019]; Ex. 2018, ¶38. Moreover, “making the motor into a DC brushless
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`13
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`motor makes it possible to implement a pump of low noise and long service life.”
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`Ex. 1007, ¶[0019]; Ex. 2018, ¶38.
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`C. Cheon
`Cheon discloses a cooling system for a computer that comprises one or more
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`
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`passive cold plates 12, 30, which are referred to as a “heat transfer devices.” Ex.
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`1008, Abstract, Figs. 1 and 2 (Figure 1 reproduced below); Ex. 2018, ¶39. The “heat
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`transfer devices” are placed in thermal contact with heat-generating computer
`
`components. Ex. 1008, Figs. 1 and 2; Ex. 2018, ¶39. Coolant is circulated through
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`conduits from a reservoir 48 to the “heat transfer devices” where the coolant collects
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`heat from the computer components, and the heated coolant then flows back to
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`reservoir 48 where it is cooled by radiator 42. Ex. 2018, ¶39. Radiator 42 is mounted
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`on the outside of the computer housing and is placed in thermal contact with
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`reservoir 48 via a Peltier effect cooling module 46. Ex. 1008, Figs. 1 and 2, 4:49-55;
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`Ex. 2018, ¶39. A pump (P) having a brushless electric motor is mounted in the
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`reservoir casing 50 to circulate the coolant between the reservoir and the “heat
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`transfer devices.” Ex. 1008, Abstract, Figs. 1 and 2; Ex. 2018, ¶39.
`
`14
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`Ex. 1008, Fig. 1 (annotations added); Ex. 2018, ¶39.
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`
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`Cheon discloses that its cooling system has a control circuit that controls
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`circulation of coolant based on feedback from sensors indicating the temperatures of
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`the electronic components to which the “heat transfer devices” are attached. Ex.
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`1008, 5:66–6:16; Ex. 2018, ¶40.
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`V. Ground 1 of the Petition Does Not Establish Obviousness of Claims 1, 8,
`or 15 Based on Batchelder and Shin
`In Ground 1, the Petition alleges that claims 1, 8, and 15 are rendered obvious
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`by the combination of Batchelder and Shin. But as discussed below, Batchelder and
`
`15
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`U.S. Patent No. 10,078,354
`Shin, alone or in combination, do not disclose “the lower chamber includes a
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`plurality of channels configured to … direct the cooling liquid from the central
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`region toward the perimeter of the lower chamber” as required by claim 1; a “first
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`passage” that “directs the cooling liquid into the lower chamber where the cooling
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`liquid splits and is directed along a plurality of channels from a central region of the
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`lower chamber outward” as recited in claim 15; or a “second passage positioned at
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`a perimeter of the lower chamber” that directs cooling liquid from the “lower
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`chamber” as also required by claim 15. Moreover, a person skilled in the art would
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`not have been motivated to modify Batchelder to have a “radiator spaced apart from
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`and fluidly coupled to the reservoir,” as required by claims 1, 8, and 15.
`
`A. Batchelder in view of Shin does not disclose “the lower chamber
`includes a plurality of channels configured to … direct the cooling
`liquid from the central region toward the perimeter of the lower
`chamber” as required by claim 1
`Claim 1 recites that the “first passage that fluidly couples the lower chamber
`
`to the upper chamber … is substantially central to the lower chamber” and the “lower
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`chamber includes a plurality of channels configured to split the flow of cooling
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`liquid and direct the cooling liquid from the central region toward the perimeter of
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`the lower chamber.” Ex. 1001, 19:3-11. The embodiment shown in Figure 9 of the
`
`’354 patent, annotated below, discloses this split-flow arrangement where cooling
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`liquid enters the “lower chamber” through inlet 15 provided at a central region of
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`the “lower chamber.” Ex. 1001, Fig. 9, 15:25-30; Ex. 2018, ¶41. The plurality of
`
`16
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`channels in the “lower chamber” split the cooling liquid and direct the flow of the
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`liquid from the central region towards outlet 16 provided at the perimeter of the
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`lower chamber. Ex. 1001, Fig. 9, 15:25-30; Ex. 2018, ¶41.
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`
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`Ex. 1001, Figure 9 (annotations added); Ex. 2018, ¶41.
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`Neither Batchelder nor Shin discloses cooling liquid flow from a central
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`region of the alleged “lower chamber” towards the perimeter. Ex. 2018, ¶42. Instead,
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`both Batchelder and Shin disclose the opposite — i.e., cooling liquid flows from the
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`perimeter towards a central region of the alleged “lower chamber.” Id.
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`
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`
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`17
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`1.
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`IPR2020-00523
`U.S. Patent No. 10,078,354
`Batchelder does not disclose flow of cooling liquid from a
`central region of its alleged “lower chamber” towards the
`perimeter; rather, Batchelder discloses the opposite flow
`direction
`In the embodiment shown in Figure 2 of Batchelder, annotated below, the
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`arrows annotated in red ovals show that cooling liquid flows from the perimeter of
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`the alleged “lower chamber” towards the centrally-located fin array 52 (rather than
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`the reverse as recited in claim 1). Ex. 2018, ¶43. Even Petitioner’s expert, Dr. Hodes,
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`agreed during his deposition that in Batchelder’s Figure 2, cooling liquid flows from
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`the perimeter of the alleged “lower chamber” towards fin array 52 located in the
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`center of the same chamber:
`
`Q. And in Figure 2 of Batchelder, that flow
`from the upper chamber back down toward the lower
`chamber is shown by the two arrows in spreader
`plate 20 that point downward, agreed?
`. . .
`THE WITNESS: Agreed.
`. . .
`Q. And after the fluid flows down in Figure
`2, as shown by the two down-pointing arrows that we
`just discussed, it then enters the lower chamber in
`Figure 2, agreed?
`A. Agreed.
`
`18
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`Q. And then from there, the fluid flows from
`the perimeter of the lower chamber toward fin array
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`52 in the low --