(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2006/0185829 A1
`Duan et al.
`(43) Pub. Date:
`Aug. 24, 2006
`
`US 2006O185829A1
`
`(54) LIQUID-COOLING HEAT DISSIPATION
`APPARATUS
`
`(75) Inventors: Qiang-Fei Duan, Chung-Ho City (CN);
`Lieh-Feng Lo, Chung-Ho City (TW)
`Correspondence Address:
`HDSL
`4331 STEVENS BATTLE LANE
`FAIRFAX, VA 22033 (US)
`9
`(73) Assignee: Cooler Master Co., Ltd
`es
`(21) Appl. No.:
`11/060,419
`
`(22) Filed:
`
`Feb. 18, 2005
`
`Publication Classification
`
`(51) Int. Cl.
`F28D I5/00
`
`(2006.01)
`
`(52) U.S. Cl. ........................................................ 165/104.33
`
`(57)
`
`ABSTRACT
`
`A going heat E. Earl side in.
`1ng, a st compartment eline 1n the casing for assembling
`a liquid driving unit, a cooling plate module on bottom of the
`casing, a second compartment defined between an inner
`space of the casing and the cooling plate module and
`containing a cooling liquid therein. At least one liquid inlet
`and liquid outlet are defined on the casing and communi
`cated through the second compartment. Therefore, the liquid
`driving unit and the cooling plate module can be advanta
`geously integrated into the casing while the duct is reduced
`to achieve compact space. Moreover, the overall structure
`achieves liquid storing, circulating and heat conveying func
`tion.
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 1 of 12
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`IPR2022-01317
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 2 of 12
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`IPR2022-01317
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`Patent Application Publication Aug. 24, 2006 Sheet 2 of 8
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`US 2006/0185829 A1
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`
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 3 of 12
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`IPR2022-01317
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`Patent Application Publication Aug. 24, 2006 Sheet 3 of 8
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`US 2006/0185829 A1
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`
`
`FIG. 3
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 4 of 12
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`Patent Application Publication Aug. 24, 2006
`
`Sheet 4 of 8
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`US 2006/0185829 A1
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`
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 5 of 12
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`Patent Application Publication Aug. 24, 2006 Sheet 5 of 8
`
`US 2006/0185829 A1
`
`OO
`
`
`
`FIG. 5
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`Patent Application Publication Aug. 24, 2006 Sheet 6 of 8
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`US 2006/0185829 A1
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`PMP
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 7 of 12
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`Patent Application Publication Aug. 24, 2006 Sheet 7 of 8
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`US 2006/0185829 A1
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 8 of 12
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`IPR2022-01317
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`Patent Application Publication Aug. 24, 2006 Sheet 8 of 8
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`US 2006/0185829 A1
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`NS
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 9 of 12
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
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`US 2006/0185829 A1
`
`Aug. 24, 2006
`
`LIQUID-COOLING HEAT DISSIPATION
`APPARATUS
`
`BACKGROUND OF THE INVENTION
`0001) 1. Field of the Invention
`0002 The present invention relates to a liquid-cooling
`heat dissipation apparatus, and more particularly to a liquid
`cooling heat dissipation apparatus used for heat emitting
`device such as a CPU.
`0003 2. Description of Prior Art
`0004 The computers are developed with more powerful
`function and computation speed. Beside performance issue,
`the product appearance, the construction and motherboard
`connection ways are also under extensive exploited. As
`downsize of form factor and increasing of processing speed,
`the heat dissipation for central processing unit (CPU) is also
`an important issue to Solve.
`0005 FIG. 1 shows a perspective view of a prior art
`liquid-cooling heat dissipation system 100a. As shown in
`this figure, the liquid-cooling heat dissipation system 100a
`comprises a heat dissipation stage 10a, a water outlet 101 a
`and a water inlet 102a on both ends of the heat dissipation
`system stage 10a, respectively, a duct 103a connected
`between the water inlet 102a and a water outlet 201a of a
`water pump 20a, a duct 104a connected between the water
`outlet 101a and a water inlet 301a of a cooling stage 30a,
`which is composed of a plurality of heat-dissipating fins
`303a. The cooling stage 30a comprises a water outlet 302a
`connected to a water inlet 401a of a water tank 4.0a through
`a duct 402a. The water tank 40a comprises a water outlet
`connected to the water inlet 202a of the water pump 20a,
`thus forming the liquid-cooling heat dissipation system
`100a. During operation, the water pump 20a conveys cool
`water to the heat dissipation stage 10a for heat exchanging
`into hot water. Afterward, hot water flows to the cooling
`stage 30a through the duct 104.a for heat exchanging into
`cool water there and cool water flows back to the water tank
`40a through the duct 304a. The above operations are
`repeated for cyclic heat exchange.
`0006. However, above-described prior art liquid-cooling
`heat dissipation system 100a is composed of separate heat
`dissipation stage 10a, water pump 20a, cooling stage 30a
`and water tank 4.0a and ducts 103a, 104a, 304a and 402a
`interconnecting between above devices. The liquid-cooling
`heat dissipation system 100a thus formed is bulky and hard
`to assemble. This is adverse to the compact trend of com
`puter.
`
`SUMMARY OF THE INVENTION
`0007. The present invention provides a liquid-cooling
`heat dissipation apparatus with Such mechanical design that
`the liquid driving unit and the cooling plate module can be
`advantageously integrated into the casing while the duct is
`reduced to achieve compact space.
`0008 Moreover, the present invention provides a liquid
`cooling heat dissipation apparatus with overall structure
`achieves liquid storing, circulating and heat conveying func
`tion.
`0009. According to one aspect of the present invention,
`the liquid-cooling heat dissipation apparatus comprises a
`
`casing comprising a first compartment, a liquid driving unit
`placed in the first compartment, a cooling plate module on
`bottom of the casing, a second compartment defined
`between an inner space of the casing and the cooling plate
`module and containing a cooling liquid, at least one liquid
`inlet and liquid outlet being defined on the casing and
`communicated through the second compartment. Therefore,
`the cooling liquid is circulated when the liquid driving unit
`operates.
`0010. According to another aspect of the present inven
`tion, the at least one liquid inlet and liquid outlet are
`communicated through a plurality of ducts and further
`communicated with a liquid cooling array through another
`end of the duct. The liquid cooling array comprises a box,
`wherein a liquid inlet and a liquid outlet are arranged on both
`sides of the box, respectively. A plurality of heat-dissipating
`fins are stacked in the center of the box and arranged in a
`plurality of rows, wherein runner is defined between two
`rows of heat-dissipating fins and communicates with the
`liquid inlet and the liquid outlet. When the hot water in the
`liquid inlet flows into the liquid outlet through the runner,
`the hot water is heat exchanged with the heat-dissipating fins
`into cool water and then the cool water flows to the liquid
`outlet.
`
`BRIEF DESCRIPTION OF DRAWING
`0011. The features of the invention believed to be novel
`are set forth with particularity in the appended claims. The
`invention itself however may be best understood by refer
`ence to the following detailed description of the invention,
`which describes certain exemplary embodiments of the
`invention, taken in conjunction with the accompanying
`drawings in which:
`0012 FIG. 1 shows a perspective view of a prior art
`liquid-cooling heat dissipation system.
`0013 FIG. 2 shows an exploded view of the liquid
`cooling heat dissipation apparatus according to the present
`invention.
`0014 FIG. 3 shows another exploded view of the liquid
`cooling heat dissipation apparatus according to the present
`invention.
`0015 FIG. 4 shows a perspective view of the liquid
`cooling heat dissipation apparatus to be assembled with a
`frame.
`0016 FIG. 5 shows a perspective view of the liquid
`cooling heat dissipation apparatus already assembled with
`the frame.
`0017 FIG. 6 shows a perspective view of the liquid
`cooling heat dissipation apparatus.
`0018 FIG. 7 shows a sectional view of the liquid-cooling
`heat dissipation apparatus.
`0019 FIG. 8 shows another sectional view of the liquid
`cooling heat dissipation apparatus.
`
`DETAILED DESCRIPTION OF THE
`INVENTION
`0020. The present invention is intended to provide a
`liquid-cooling heat dissipation apparatus. FIGS. 2 and 3
`show a preferred embodiment of the present invention,
`
`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 10 of 12
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`IPR2022-01317
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`

`US 2006/0185829 A1
`
`Aug. 24, 2006
`
`wherein the liquid-cooling heat dissipation apparatus 100 is
`used for heat dissipating a heat emitting device 200 (such as
`CPU 200). The heat dissipation apparatus 100 comprises a
`casing 1, a first compartment 13 defined in the casing 1 and
`used for mounting a liquid driving unit 2, a cooling plate
`module 3 arranged on bottom of the casing 1, a second
`compartment 14 defined between inner space of the casing
`1 and filled with cooling liquid, at least one liquid inlet 11
`and liquid outlet 12 defined on the casing 1 for communi
`cating the second compartment 14. The cooling liquid is
`circulated when the liquid driving unit 2 operates.
`0021. In the present invention, the liquid driving unit 2
`comprises a coil stage 21, an upper cover 22, an impeller
`stage 23, and a lower cover 24 in the first compartment 13.
`Moreover, at least one runner 241 is defined on bottom face
`of the lower cover 24 and corresponding to the liquid inlet
`11 of the casing 1, as shown in FIG. 7.
`0022. The cooling plate module 3 comprises a bottom
`plate 31 fixed to bottom of the casing 1, a heat-dissipating
`plate 32 arranged on center of the bottom plate 31 and
`attached to the CPU 200, a plurality of heat-dissipating fins
`33 provided atop the bottom plate 31. Sealing pads 15. 34
`are provided between the bottom of the casing 1 and the
`bottom plate 31. Bolt members 16 fix the bottom plate 31 to
`the bottom of the casing 1; and the sealing pads 15, 34 place
`between the casing 1 and the bottom plate 31 hermitically to
`prevent leakage of the cooling liquid.
`0023. With reference to FIGS. 4 and 5, a frame 4 is
`screwed to bottom of the cooling plate module 3 and having
`an opening 41 defined at center thereof such that the
`heat-dissipating plate 32 exposes out from the opening 41
`and is in contact with the CPU 200. Locking tabs 42 extend
`outward from two opposite sides of the frame 4 and function
`as fixing unit to mount on the motherboard 300.
`0024. With reference now to FIG. 6, a liquid cooling
`array 20 comprises a box 5, wherein a liquid inlet 51 and a
`liquid outlet 52 are arranged on both sides of the box 5.
`respectively. A plurality of heat-dissipating fins 53 are
`stacked in the center of the box 5 and arranged in a plurality
`of rows, wherein runner 532 is defined between two rows of
`heat-dissipating fins 53 and communicates with the liquid
`inlet 51 and the liquid outlet 52. When the hot water in the
`liquid inlet 51 flows into the liquid outlet 52 through the
`runner 532, the hot water is heat exchanged with the
`heat-dissipating fins 53 into cool water and then the cool
`water flows to the liquid outlet 52.
`0025. In the shown embodiment, there are two liquid
`outlets 12 on the casing 1. In case of only one liquid cooling
`array 20, one outlet 12 is connected to the entrance 511 of
`the liquid inlet 51 through a duct 6; the exit 521 of the liquid
`outlet 52 of the liquid cooling array 20 is connected to the
`liquid inlet 11 of the casing 1 through a duct 6'. When two
`set of liquid cooling arrays 20 are to be used, two liquid
`outlets 12 on the casing 1 are connected to the two liquid
`cooling arrays 20 through the ducts 6.
`0026. To assemble the liquid-cooling heat dissipation
`apparatus according to the present invention, the liquid
`cooling heat dissipation apparatus 100 is first arranged atop
`the CPU200 and the locking tabs 42 of the frame 4 is locked
`to the motherboard 300 by the bolt unit 7. Therefore, the
`casing 1 is assembled atop the CPU 200 and liquid is
`
`circulated between the casing 1 and the liquid cooling array
`20 through the ducts 6 and 6'.
`0027. In the present invention, a vent hole (not shown) is
`additionally defined on the casing 1 and sealed by a cover
`(not shown). The cover is removed when liquid is to be filled
`into the casing 1. Therefore, the casing 1 is no longer a
`closed space and liquid is filled into the second compartment
`14 through the liquid inlet 11 of the casing 1.
`0028. With reference to FIGS. 7 and 8, during operation
`of the liquid-cooling heat dissipation apparatus according to
`the present invention, cooling liquid in the liquid cooling
`array 20 is driven, by the liquid driving unit 2, into the
`runner 241 of the lower cover 24 through the liquid inlet 11
`of the casing 1. Thereafter, cooling liquid is conveyed
`downward from the exit of the runner 241 of the lower cover
`24 to the plurality of heat-dissipating fins 33 for heat
`exchanging into hot water. Therefore, the cooling plate
`module 3 has fast heat dissipation and the heat dissipation
`for the CPU 200 can be enhanced. Afterward, hot liquid
`flows to the liquid inlet 51 of the liquid cooling array 20
`from the liquid outlet 12 of the casing 1 and through the duct
`6.
`0029. The hot liquid such as hot water conveyed to the
`liquid inlet 51 of the liquid cooling array 20 then flows to the
`runner 532 and undergoes heat exchange into cool water by
`the heat-dissipating fins 53 beside the runner 532. The cool
`water is conveyed to the liquid outlet 52 of the liquid cooling
`array 20. Thereafter, the cool water is sent to the second
`compartment 14 of the casing 1 through the duct 6' for next
`cycle of heat exchange.
`0030 The liquid driving unit 2 and the cooling plate
`module 3 can be advantageously integrated into the casing
`1 according to the present invention, while the duct is
`reduced to achieve compact space. Moreover, the overall
`structure achieves liquid storing, circulating and heat con
`veying function.
`0031. Although the present invention has been described
`with reference to the preferred embodiment thereof, it will
`be understood that the invention is not limited to the details
`thereof. Various Substitutions and modifications have Sug
`gested in the foregoing description, and other will occur to
`those of ordinary skill in the art. Therefore, all such substi
`tutions and modifications are intended to be embraced
`within the scope of the invention as defined in the appended
`claims.
`
`What is claimed is:
`1. A liquid-cooling heat dissipation apparatus used to
`convey heat from a heat source, comprising
`a casing comprising a first compartment, a liquid driving
`unit, a cooling plate module on bottom of the casing, a
`second compartment defined between an inner space of
`the casing and the cooling plate module and containing
`a cooling liquid, at least one liquid inlet and liquid
`outlet being defined on the casing and communicated
`through the second compartment, whereby the cooling
`liquid is circulated when the liquid driving unit oper
`ates.
`2. The liquid-cooling heat dissipation apparatus as in
`claim 1, wherein fixing units are provided on peripheral of
`the cooling plate module and assemble the cooling plate
`
`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 11 of 12
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
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`US 2006/0185829 A1
`
`Aug. 24, 2006
`
`module with a heat emitting device, wherein a bottom of the
`cooling plate module is in close contact with the heat
`emitting device.
`3. The liquid-cooling heat dissipation apparatus as in
`claim 1, wherein a frame is assembled to a bottom of the
`cooling plate module, and the frame keeps the bottom of the
`cooling plate module in close contact with the heat emitting
`device.
`4. The liquid-cooling heat dissipation apparatus as in
`claim 1, wherein the at least one liquid inlet and liquid outlet
`
`are communicated through a plurality of ducts and further
`communicated with a liquid cooling array through another
`end of the duct.
`5. The liquid-cooling heat dissipation apparatus as in
`claim 1, further comprising at least one sealing pad placed
`between the casing and the cooling plate module.
`6. The liquid-cooling heat dissipation apparatus as in
`claim 1, wherein the cooling plate module comprises a
`plurality of heat-dissipating fins on top face thereof.
`
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`Shenzhen Apaltek Co., Ltd. Ex. 1007, Page 12 of 12
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
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