(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2006/0185830 A1
`(43) Pub. Date:
`Aug. 24, 2006
`Duan
`
`US 2006O185830A1
`
`(54)
`(75)
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`(73)
`(21)
`(22)
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`(51)
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`(52)
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`COOLING PLATE MODULE
`
`(57)
`
`ABSTRACT
`
`Inventor: Qiang-Fei Duan, Chung-Ho City (TW)
`Correspondence Address:
`HDSL
`4331 STEVENS BATTLE LANE
`FAIRFAX, VA 22033 (US)
`Assignee: Cooler Master Co. Ltd.
`Appl. No.:
`11/060,442
`
`Filed:
`
`Feb. 18, 2005
`
`Publication Classification
`
`Int. C.
`(2006.01)
`F28D I5/00
`... 165/104.33
`U.S. Cl. .....................................................
`
`A cooling plate module includes a cooling plate and a liquid
`driving module. The liquid driving module includes an
`accommodation chamber and a liquid driving unit used to
`driving cooling liquid. The liquid driving module includes a
`liquid inlet communicated to the accommodation chamber
`and a first liquid outlet is communicated to the bottom of the
`accommodation chamber. A cap encloses the first liquid
`outlet and a second liquid outlet is defined on the cap. The
`cooling plate is assembled with the cap to define a closed
`space therein and the first liquid outlet is corresponding to
`the heat-dissipating plates. Therefore, there is no duct con
`necting between the cooling plate and the liquid driving
`module, the stagnant problem caused by pressure difference
`can be prevented and the cool liquid can directly flush the
`heat-dissipating plates for enhancing heat dissipation effi
`ciency.
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 1 of 14
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`Patent Application Publication Aug. 24, 2006 Sheet 2 of 10
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`US 2006/0185830 A1
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`FIG. 2
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`Patent Application Publication Aug. 24, 2006 Sheet 3 of 10
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`US 2006/0185830 A1
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`Patent Application Publication Aug. 24, 2006 Sheet 4 of 10
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`US 2006/0185830 A1
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 5 of 14
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`Patent Application Publication Aug. 24, 2006 Sheet 5 of 10
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`US 2006/0185830 A1
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`
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 6 of 14
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`Patent Application Publication Aug. 24, 2006 Sheet 6 of 10
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`US 2006/0185830 A1
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 7 of 14
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`Patent Application Publication Aug. 24, 2006 Sheet 7 of 10
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`US 2006/0185830 A1
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 8 of 14
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`Patent Application Publication Aug. 24, 2006 Sheet 8 of 10
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`US 2006/0185830 A1
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 9 of 14
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`Patent Application Publication Aug. 24, 2006 Sheet 9 of 10
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`US 2006/0185830 A1
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 10 of 14
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`Patent Application Publication Aug. 24, 2006 Sheet 10 of 10
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`US 2006/0185830 A1
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`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 11 of 14
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`US 2006/01 85830 A1
`
`Aug. 24, 2006
`
`COOLING PLATE MODULE
`
`BACKGROUND OF THE INVENTION
`0001) 1. Field of the Invention
`0002 The present invention relates to a cooling plate
`module, and more particularly to a cooling plate module
`used for heat emitting device such as a CPU.
`0003 2. Description of Prior Art
`0004 The computers are developed with more powerful
`function and computation speed. Beside performance issue,
`the product appearance, the construction and motherboard
`connection ways are also under extensive exploited. As
`downsize of form factor and increasing of processing speed,
`the heat dissipation for central processing unit (CPU) is also
`an important issue to Solve.
`0005 FIG. 1 shows a perspective view of a prior art
`liquid-cooling heat dissipation system 100a. As shown in
`this figure, the liquid-cooling heat dissipation system 100a
`comprises a heat dissipation stage 10a, a water outlet 101 a
`and a water inlet 102a on both ends of the heat dissipation
`system stage 10a, respectively, a duct 103a connected
`between the water inlet 102a and a water outlet 201a of a
`water pump 20a, a duct 104a connected between the water
`outlet 101a and a water inlet 301a of a cooling stage 30a,
`which is composed of a plurality of heat-dissipating fins
`303a. The cooling stage 30a comprises a water outlet 302a
`connected to a water inlet 401a of a water tank 40a through
`a duct 402a. The water tank 4.0a comprises a water outlet
`connected to the water inlet 202a of the water pump 20a,
`thus forming the liquid-cooling heat dissipation system
`100a. During operation, the water pump 20a conveys cool
`water to the heat dissipation stage 10a for heat exchanging
`into hot water. Afterward, hot water flows to the cooling
`stage 30a through the duct 104.a for heat exchanging into
`cool water there and cool water flows back to the water tank
`40a through the duct 304a. The above operations are
`repeated for cyclic heat exchange.
`0006. However, above-described prior art liquid-cooling
`heat dissipation system 100a is composed of separate heat
`dissipation stage 10a, water pump 20a, cooling stage 30a
`and water tank 4.0a and ducts 103a, 104a, 304a and 402a
`interconnecting between above devices. The liquid-cooling
`heat dissipation system 100a thus formed is bulky and hard
`to assemble. This is adverse to the compact trend of com
`puter.
`
`SUMMARY OF THE INVENTION
`0007. The present invention provides a cooling plate
`module wherein the cooling plate is integrally formed with
`the liquid driving module Such that the layout of the cooling
`plate module can be minimized to reduce space.
`0008. The present invention further provides a cooling
`plate module, wherein there is no duct connecting between
`the cooling plate and the liquid driving module, the stagnant
`problem caused by pressure difference can be prevented and
`the cool liquid can directly flush the heat-dissipating plates
`for enhancing heat dissipation efficiency.
`0009. According to one aspect of the present invention,
`the cooling plate module is applied to a liquid cooling cyclic
`mechanism and comprises a cooling plate and a liquid
`
`driving module. The liquid driving module includes an
`accommodation chamber and a liquid driving unit used to
`driving cooling liquid. The liquid driving module includes a
`liquid inlet communicated to the accommodation chamber
`and a first liquid outlet is communicated to the bottom of the
`accommodation chamber. A cap encloses the first liquid
`outlet and a second liquid outlet is defined on the cap. The
`cooling plate is assembled with the cap to define a closed
`space therein and the first liquid outlet is corresponding to
`the heat-dissipating plates.
`0010. According to another aspect of the present inven
`tion, the cooling plate module is communicated with the
`water tank module through ducts. The water tank module
`comprises a box with a liquid entrance region and a liquid
`exit region provided on both sides of the water tank,
`respectively. The box comprises a cooling stage at center
`thereof and composed of a plurality of Stacked heat-dissi
`pating fins arranged in rows. Runners are defined between
`rows of the heat-dissipating fins; both ends of the runner are
`communicated with the liquid entrance region and the liquid
`exit region. When the hot liquid in the liquid entrance region
`flows to the liquid exit region through the runners, the hot
`liquid is first heat exchanged with the heat-dissipating fins
`into cool liquid and then the cool liquid flows to the liquid
`exit region.
`BRIEF DESCRIPTION OF DRAWING
`0011. The features of the invention believed to be novel
`are set forth with particularity in the appended claims. The
`invention itself however may be best understood by refer
`ence to the following detailed description of the invention,
`which describes certain exemplary embodiments of the
`invention, taken in conjunction with the accompanying
`drawings in which:
`0012 FIG. 1 shows a perspective view of a prior art
`liquid-cooling heat dissipation system.
`0013 FIG. 2 shows an exploded view of the cooling
`plate module according to the present invention.
`0014 FIG.3 shows another exploded view of the cooling
`plate module according to the present invention.
`0015 FIG. 4 shows an exploded view of the cooling
`plate before assembling to the box.
`0016 FIG. 5 shows a perspective view of the cooling
`plate module according to the present invention.
`0017 FIG. 6 shows a sectional view of the liquid cooling
`cyclic mechanism according to the present invention.
`0018 FIG. 7 shows a sectional view of the cooling plate
`module according to the present invention.
`0019 FIG. 8 shows another sectional view of the cooling
`plate module according to the present invention.
`0020 FIG.9 shows another preferred embodiment of the
`present invention.
`0021 FIG. 10 shows still another preferred embodiment
`of the present invention.
`DETAILED DESCRIPTION OF THE
`INVENTION
`0022. With reference to FIGS. 2 and 6, the cooling plate
`module 10 according to the present invention is applied to a
`
`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 12 of 14
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`IPR2022-01317
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`US 2006/01 85830 A1
`
`Aug. 24, 2006
`
`liquid cooling cyclic mechanism 100, which is used for the
`heat dissipation of a CPU200 and composed of the cooling
`plate module 10 and a water tank module 20 connected with
`the cooling plate module 10 through ducts. The cooling plate
`module 10 comprises a cooling plate 1 and a liquid driving
`module 2. The cooling plate 1 comprises a heat absorbing
`face 11 on bottom thereof and being in contact with a heat
`Source. A plurality of heat-dissipating plates 12 are formed
`on top face of the cooling plate 1 and can be arranged in
`longitudinal or transverse manner. A runner is defined
`between the plurality of heat-dissipating plates 12 and forms
`a closed loop.
`0023. With reference to FIGS. 2, 3 and 4, the liquid
`driving module 2 comprises an accommodation chamber 21
`and a liquid driving unit 22 located in the accommodation
`chamber 21 and used to driving the cool liquid. The liquid
`driving unit 22 comprises a coil stage 221, an upper cover
`222, an impeller stage 223, a sealing washer 224 and a lower
`cover 225. The lower cover 225 comprises a liquid inlet 23
`communicated with the accommodation chamber 21. A first
`liquid outlet 24 is communicated to the bottom of the
`accommodation chamber 21 and is enclosed by a cap 3. A
`second liquid outlet 31 is defined on the cap 3. The cooling
`plate 1 is assembled with the cap 3 to define a closed space
`therein and the first liquid outlet 24 is corresponding to the
`heat-dissipating plates 12. In the present invention, the
`liquid driving module 2 can be reciprocating pump, cen
`trifugal pump or axial-flow pump.
`0024. To assemble the cooling plate module 10, the coil
`stage 221, the upper cover 222, the impeller stage 223, the
`sealing washer 224 and the lower cover 225 are assembled
`to the accommodation chamber 21 in turn. Thereafter,
`sealing pads 32 are provided between the cap 3 and the
`cooling plate 1 and provided atop the cap 3, and are retained
`by bolt units 4. The cooling plate 1 is fixed to bottom of the
`cap 3 and the heat-dissipating plates 12 are located in the cap
`3 and corresponding to the first liquid outlet 24. The thus
`assembled cooling plate module 10 is shown in FIG. 5.
`0025. As shown in FIG. 6, the water tank 20 of the liquid
`cooling cyclic mechanism 100 comprises a box 5 with a
`liquid entrance region 51 and a liquid exit region 52 pro
`vided on both sides of the water tank 20, respectively. The
`box 5 comprises a cooling stage 53 at center thereof and
`composed of a plurality of stacked heat-dissipating fins 531
`arranged in rows. Runners 532 are defined between rows of
`the heat-dissipating fins 531; both ends of the runner 532 are
`communicated with the liquid entrance region 51 and the
`liquid exit region 52. When the hot liquid in the liquid
`entrance region 51 flows to the liquid exit region 52 through
`the runners 532, the hot liquid is first heat exchanged with
`the heat-dissipating fins 531 into cool liquid and then the
`cool liquid flows to the liquid exit region 52.
`0026.
`In the present invention, during the assembling of
`the liquid cooling cyclic mechanism 100, the liquid inlet 23
`of the cooling plate module 10 is communicated to the liquid
`outlet 521 of the liquid exit region 52 of the water tank 20
`through duct 6. Moreover, the second liquid outlet 31 of the
`cooling plate module 10 is communicated to the liquid inlet
`511 of the liquid entrance region 51 of the water tank 20
`through duct 6, thus forming the liquid cooling cyclic
`mechanism 100 with continuous cycles. Thereafter, the
`liquid cooling cyclic mechanism 100 is assembled to the
`
`CPU200 with the heat absorbing face 11 being in contact
`with the CPU200 for heat dissipating the CPU 200.
`0027. With reference to FIGS. 7 and 8, during operation
`of the present invention, the cool liquid in the water tank 20
`is conveyed to the accommodation chamber 21 through the
`duct 6 and the liquid inlet 23 of the cooling plate module 10
`and driven by the liquid driving unit 22. The cool liquid then
`flows to the cap 3 through the first liquid outlet 24 for heat
`dissipating the heat-dissipating plates 12 in the cap 3. More
`particularly, the cool liquid is heat exchanged with the
`heat-dissipating plates 12 into hot liquid. The hot liquid then
`flows to the liquid entrance region 51 of the water tank 20
`through the second liquid outlet 31 of the cooling plate
`module 10 and another duct 6.
`0028. The hot liquid flowing into the liquid entrance
`region 51 of the water tank 20 will be conveyed to each
`runner 532 and heat exchanged with the heat-dissipating fins
`531 into cool liquid. The cool liquid flows to the liquid exit
`region 52 of the water tank 20 and then flows to the cooling
`plate module 10 through the duct 6 connected to the liquid
`exit region 52, thus performing cyclic heat exchange.
`0029 FIG.9 shows another preferred embodiment of the
`present invention, the liquid driving module 2 is integrally
`formed at center of the cap 3 such that the cool liquid
`flowing into the accommodation chamber 21 will directly
`flow out of the first liquid outlet 24 and flush the heat
`dissipating plates 12 to heat dissipate the heat-dissipating
`plates 12 with enhanced efficiency.
`0030 FIG. 10 shows still another preferred embodiment
`of the present invention, the cap 3 comprises two second
`liquid outlets 31 thereon. In case of only one water tank 20,
`one liquid outlet 31 is connected to the liquid inlet 511 of the
`liquid entrance region 51 of the water tank 20 through a duct
`6. The liquid outlet 521 of the liquid exit region 52 of the
`water tank 20 is connected to the liquid inlet 23 of the
`cooling plate module 10 through another duct 6. When two
`water tanks 20 are to be used, the two second liquid outlets
`31 are connected to the two water tanks 20 through respec
`tive duct 6.
`0031. In the present invention, the cooling plate 1 is
`integrally formed with the liquid driving module 2 such that
`the layout of the cooling plate module 10 can be minimized
`to reduce space. Moreover, there is no duct connecting
`between the cooling plate 1 and the liquid driving module 2.
`the stagnant problem caused by pressure difference can be
`prevented and the cool liquid can directly flush the heat
`dissipating plates 12 for enhancing heat dissipation effi
`ciency.
`0032. Although the present invention has been described
`with reference to the preferred embodiment thereof, it will
`be understood that the invention is not limited to the details
`thereof. Various Substitutions and modifications have Sug
`gested in the foregoing description, and other will occur to
`those of ordinary skill in the art. Therefore, all such substi
`tutions and modifications are intended to be embraced
`within the scope of the invention as defined in the appended
`claims.
`
`What is claimed is:
`1. A cooling plate module used in a liquid cooling cyclic
`mechanism for removing heat from a heat source, compris
`ing
`
`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 13 of 14
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
`
`

`

`US 2006/01 85830 A1
`
`Aug. 24, 2006
`
`a cooling plate comprising a heat absorbing face on
`bottom thereof and being in contact with a heat source,
`and a plurality of heat-dissipating plates on top face of
`the cooling plate;
`
`a liquid driving module comprising an accommodation
`chamber and a liquid driving unit used to driving a
`cooling liquid, the liquid driving module comprising a
`liquid inlet communicated to the accommodation
`chamber and a first liquid outlet communicated to a
`bottom of the accommodation chamber; a cap enclos
`ing the first liquid outlet and a second liquid outlet
`being defined on the cap;
`wherein the cooling plate is assembled with the cap to
`define a closed space therein and the first liquid outlet
`is corresponding to the heat-dissipating plates.
`
`2. The cooling plate module as in claim 1, wherein the
`heat-dissipating plates are arranged in one of longitudinal
`manner and transverse manner.
`3. The cooling plate module as in claim 1, wherein the
`heat-dissipating plates are such arranged that a runner is
`defined between the plurality of heat-dissipating plates and
`forms a closed loop.
`4. The cooling plate module as in claim 1, wherein the
`liquid driving module is a reciprocating pump.
`5. The cooling plate module as in claim 1, wherein the
`liquid driving module is a centrifugal pump.
`6. The cooling plate module as in claim 1, wherein the
`liquid driving module is an axial-flow pump.
`7. The cooling plate module as in claim 1, wherein a
`sealing pad is provided between the cap and the cooling
`plate.
`
`Shenzhen Apaltek Co., Ltd. Ex. 1006, Page 14 of 14
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
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