`US008245764Cl
`c12) INTER PARTES REEXAMINATION CERTIFICATE (1409th)
`us 8,245,764 Cl
`United States Patent
`(10) Number:
`Eriksen
`(45) Certificate Issued:
`Apr. 17, 2017
`
`(54) COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`
`(75)
`
`Inventor: Andre Sloth Eriksen, Aalborg C (DK)
`
`(73) Assignee: ASETEK A/S, Bronderslev (DK)
`
`Reexamination Request:
`No. 95/002,386, Sep. 15, 2012
`
`Reexamination Certificate for:
`8,245,764
`Patent No.:
`Aug. 21, 2012
`Issued:
`13/269,234
`Appl. No.:
`Oct. 7, 2011
`Filed:
`
`Certificate of Correction issued Sep. 25, 2012
`Related U.S. Application Data
`
`(63) Continuation of application No. 11/919,974, filed as
`application No. PCT/DK2005/000310 on May 6,
`2005.
`
`(51)
`
`Int. Cl.
`F28F 7100
`H05K 7120
`H0JL 231473
`G06F 1120
`F04D 15100
`(52) U.S. Cl.
`CPC ........ H0JL 231473 (2013.01); F04D 1510066
`(2013.01); G06F 1120 (2013.01); G06F 11206
`
`(2006.01)
`(2006.01)
`(2006.01)
`(2006.01)
`(2006.01)
`
`(2013.01); G06F 2200/201 (2013.01); H0JL
`2924/00 (2013.01); H0JL 2924/0002 (2013.01)
`(58) Field of Classification Search
`None
`See application file for complete search history.
`
`(56)
`
`References Cited
`
`To view the complete listing of prior art documents cited
`during the proceeding for Reexamination Control Number
`95/002,386, please refer to the USPTO's public Patent
`Application Information Retrieval (PAIR) system under the
`Display References tab.
`
`Primary Examiner -
`
`Joseph Kaufman
`
`ABSTRACT
`(57)
`The invention relates to a cooling system for a computer
`system, said computer system comprising at least one unit
`such as a central processing unit (CPU) generating thermal
`energy and said cooling system intended for cooling the at
`least one processing unit and comprising a reservoir having
`an amount of cooling liquid, said cooling liquid intended for
`accumulating and transferring of thermal energy dissipated
`from the processing unit to the cooling liquid. The cooling
`system has a heat exchanging interface for providing ther(cid:173)
`mal contact between the processing unit and the cooling
`liquid for dissipating heat from the processing unit to the
`cooling liquid, Different embodiments of the heat exchang(cid:173)
`ing system as well as means for establishing and controlling
`a flow of cooling liquid and a cooling strategy constitutes the
`invention of the cooling system.
`
`34
`
`47A
`
`48
`
`47A
`
`Shenzhen Apaltek Co., Ltd. Ex. 1002, Page 1 of 2
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
`
`
`
`US 8,245,764 Cl
`
`1
`INTER PARTES
`REEXAMINATION CERTIFICATE
`
`THE PATENT IS HEREBY AMENDED AS
`INDICATED BELOW.
`
`Matter enclosed in heavy brackets [ ] appeared in the
`patent, but has been deleted and is no longer a part of the
`patent; matter printed in italics indicates additions made
`to the patent.
`
`AS A RESULT OF REEXAMINATION, IT HAS BEEN
`DETERMINED THAT:
`
`10
`
`2
`2 4. The cooling system of claim 10, wherein the one or
`more passages include a plurality of passages positioned
`within the reservoir that opens into the thermal exchange
`chamber.
`25. The cooling system of claim 12, wherein an entire
`surface of the heat-exchange interface in contact with the
`cooling liquid in the reservoir forms a boundary wall of the
`thermal exchange chamber.
`26. The cooling system of claim 10, wherein the reservoir
`further includes an inlet configured to direct the cooling
`liquid into the reservoir and an outlet configured to dis(cid:173)
`charge the cooling liquid from the reservoir.
`2 7. The cooling system of claim 15, wherein the pump
`15 chamber and the thermal exchange chamber are fluidly
`coupled together by one or more passages, the one or more
`passages including a passage configured to direct cooling
`liquid from the pump chamber directly into the thermal
`exchange chamber.
`28. The cooling system of claim 15, wherein the pump
`chamber and the thermal exchange chamber are fluidly
`coupled together by a plurality of passages positioned
`within the reservoir that open into the thermal exchange
`chamber.
`29. The cooling system of claim 15, wherein an entire
`surface of the heat-exchanging interface in contact with the
`cooling liquid in the reservoir forms a boundary wall of the
`thermal exchange chamber.
`30. The cooling system of claim 15, wherein the pump
`chamber and the thermal exchange chamber are fluidly
`coupled together by one or more passages, and the reservoir
`further includes an inlet configured to direct the cooling
`liquid into the reservoir and an outlet configured to dis(cid:173)
`charge the cooling liquid from the reservoir.
`
`The patentability of claims 1-18 is confirmed.
`New claims 19-30 are added and determined to be
`patentable.
`19. The cooling system of claim 1, wherein the one or
`more passages include a passage configured to direct cool(cid:173)
`ing liquid from the pump chamber directly into the thermal 20
`exchange chamber.
`20. The cooling system of claim 1, wherein the one or
`more passages include a plurality of passages positioned
`within the reservoir that opens into the thermal exchange
`chamber.
`21. The cooling system of claim 1, wherein an entire
`surface of the heat-exchanging interface in contact with the
`cooling liquid in the reservoir forms the boundary wall of
`the thermal exchange chamber.
`22. The cooling system of claim 1, wherein the reservoir
`further includes an inlet configured to direct the cooling
`liquid into the reservoir and an outlet configured to dis(cid:173)
`charge the cooling liquid from the reservoir.
`23. The cooling system of claim 10, wherein the one or
`more passages include a passage configured to direct cool-
`ing liquid from the pump chamber directly into the thermal
`exchange chamber.
`
`25
`
`30
`
`35
`
`* * * * *
`
`Shenzhen Apaltek Co., Ltd. Ex. 1002, Page 2 of 2
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
`
`