USOO8245764B2
`
`(12) United States Patent
`Eriksen
`
`(10) Patent No.:
`45) Date of Patent:
`
`US 8.245,764 B2
`Aug. 21, 2012
`
`9
`
`(54) COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`
`w
`(75) Inventor: André Sloth Eriksen, Aalborg C (DK)
`
`(73) Assignee: Asetek A/S, Bronderslev (DK)
`
`(*) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`(21) Appl. No.: 13/269,234
`(22) Filed:
`Oct. 7, 2011
`(65)
`Prior Publication Data
`
`US 2012/OO61058 A1
`
`Mar. 15, 2012
`
`Related U.S. Application Data
`(63) Continuation of application No. 1 1/919,974, filed as
`application No. PCT/DK2005/000310 on May 6,
`2005.
`(51) Int. Cl.
`(2006.01)
`F28F 7700
`(2006.01)
`H05K 7/20
`(52) U.S. Cl. ....................................... 165/80.4; 361/699
`(58) Field of Classification Search ................. 165/80.2,
`165/80.4, 104.21, 104.31, 104.33: 361/699,
`361/702, 720; 417/423.1
`See application file for complete search history.
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
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`EP
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`6,019,165 A * 2/2000 Batchelder ................... 165,803
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`6,263,957 B1
`7/2001 Chen et al.
`6,305,463 B1
`10/2001 Salmonson
`6,343,478 B1
`2/2002 Chang
`6,415,860 B1
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`6,551,734 B1
`4/2003 SMENA.
`6,668,911 B2 12/2003 Bingler
`6,725,682 B2
`4/2004 Scott
`6,749,012 B2
`6/2004 Gwin et al.
`6,892,802 B2
`5/2005 Kelly et al.
`6,967,841 B1
`1 1/2005 Chu et al.
`(Continued)
`FOREIGN PATENT DOCUMENTS
`0574823 A2 12/1993
`(Continued)
`Primary Examiner — Frantz Jules
`Assistant Examiner — Emmanuel Duke
`(74) Attorney, Agent, or Firm — Finnegan, Henderson,
`Farabow, Garrett & Dunner, LLP
`(57)
`ABSTRACT
`The invention relates to a cooling system for a computer
`system, said computer system comprising at least one unit
`such as a central processing unit (CPU) generating thermal
`energy and said cooling system intended for cooling the at
`least one processing unit and comprising a reservoir having
`an amount of cooling liquid, said cooling liquid intended for
`accumulating and transferring of thermal energy dissipated
`from the processing unit to the cooling liquid. The cooling
`system has a heat exchanging interface for providing thermal
`contact between the processing unit and the cooling liquid for
`dissipating heat from the processing unit to the cooling liquid,
`Different embodiments of the heat exchanging system as well
`as means for establishing and controlling a flow of cooling
`liquid and a cooling strategy constitutes the invention of the
`cooling system.
`
`18 Claims, 12 Drawing Sheets
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`S
`SSNS
`NSN NS s
`F.W. 22 L'A23-32
`3.32%
`2
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`Page 2
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`U.S. PATENT DOCUMENTS
`12, 2005
`Minamitani et al.
`6,972,954
`B2
`5/2007
`Hata et al.
`7,215,546
`B2
`Campbell et al.
`11/2007
`7,298,617
`B2
`2, 2008
`Malone et al.
`7,325,588
`B2
`2, 2008
`Duan et al.
`7,325,591
`B2
`4, 2008
`Stefanoski et al.
`7,359, 197
`B2
`1, 2003
`2003/0010050
`Scott
`A1
`8, 2003
`2003/O151895
`A1
`3, 2004
`2004/0052048
`A1
`3, 2004
`2004/0052049
`A1
`6, 2004
`2004/O105232
`A1
`
`Wu et al.
`Wu et al.
`Ito et al.
`
`3, 2005
`3, 2005
`4, 2005
`6, 2006
`
`2005/0061482 A1*
`2005, OO69432 A1*
`2005, 0083.656 A1
`2006, O113066 A1
`
`Lee et al. ........................ 165.96
`Tomioka .................... 417/423.1
`Hamman
`Mongia et al.
`FOREIGN PATENT DOCUMENTS
`8, 1994
`O610826 A2
`EP
`4/2001
`WOO1/2.5881 A
`WO
`2, 2005
`WO WO 2005/O17468 A2
`5, 2005
`WO WO 2005/045654 A2
`* 11, 2006
`WO PCT, DK2005.000310
`* cited by examiner
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`U.S. Patent
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`Aug. 21, 2012
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`FIG 16
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`FIG. 19
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`ZZZZZZ |
`+ L_2
`RN
`SOEN ?
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`47A
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`4A
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`FIG. 20
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`US 8,245,764 B2
`
`1.
`COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`
`This application is a continuation of U.S. application Ser.
`No. 1 1/919,974, filed Jan. 6, 2009, which is a U.S. National
`Phase Application of PCT/DK2005/000310, filed May 6,
`2005, which is incorporated herein by reference in its entirety.
`
`5
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`BACKGROUND OF THE INVENTION
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`10
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`2
`processing unit to the cooling liquid, a heat exchanging inter
`face for providing thermal contact between the processing
`unit and the cooling liquid for dissipating heat from the pro
`cessing unit to the cooling liquid, a pump being provided as
`part of an integrate element, said integrate element compris
`ing the heat exchanging interface, the reservoir and the pump,
`said pump intended for pumping the cooling liquid into the
`reservoir, through the reservoir and from the reservoir to a
`heat radiating means, said heat radiating means intended for
`radiating thermal energy from the cooling liquid, dissipated
`to the cooling liquid, to Surroundings of the heat radiating
`CaS.
`By providing an integrate element, it is possible to limit the
`number of separate elements of the system. However, there is
`actually no need for limiting the number of elements, because
`often there is enough space within a cabinet of a computer
`system to encompass the different individual elements of the
`cooling system. Thus, it is Surprisingly that, at all, any attempt
`is conducted of integrating some of the elements.
`In possible embodiments according to this aspect of the
`invention, the entire pump is placed inside the reservoir with
`at least an inlet or an outlet leading to the liquid in the
`reservoir. In an alternative embodiment the pump is placed
`outside the reservoir in the immediate vicinity of the reservoir
`and wherein at least an inlet oran outlet is leading directly to
`the liquid in the reservoir. By placing the pump inside the
`reservoir or in the immediate vicinity outside the reservoir,
`the integrity of the combined reservoir, heat exchanger and
`pump is obtained, so that the element is easy to employ in new
`and existing computer systems, especially mainstream com
`puter systems.
`In a preferred embodiment, the pumping member of the
`pump and a driven part of the motor of the pump. Such as a
`rotor of en electrical motor, is placed inside the reservoir
`embedded in the cooling liquid, and wherein a stationary part
`of the motor of the pump. Such as a stator of an electrical
`motor, is placed outside the reservoir. By having the driven
`part of the motor placed inside the reservoir submerged in the
`cooling liquid and the stationary part of the motor outside the
`reservoir, there is no need for encapsulating the stationary
`part in a liquid-proof insulation. However, problems may
`occur having then stationary part driving the driven part.
`However, the present invention provide means for obtaining
`Such action, although not at all evident how to solve this
`problem.
`The object may also be obtained by a cooling system for a
`computer system, said computer system comprising: at least
`one unit such as a central processing unit (CPU) generating
`thermal energy and said cooling system intended for cooling
`the at least one processing unit, a reservoir having an amount
`of cooling liquid, said cooling liquid intended for accumulat
`ing and transferring of thermal energy dissipated from the
`processing unit to the cooling liquid, a heat exchanging inter
`face for providing thermal contact between the processing
`unit and the cooling liquid for dissipating heat from the pro
`cessing unit to the cooling liquid, a pump intended for pump
`ing the cooling liquid into the reservoir, through the reservoir
`and from the reservoir to a heat radiating means, said cooling
`system being intended for thermal contact with the process
`ing unit by means of existing fastening means associated with
`the processing unit, and said heat radiating means intended
`for radiating from the cooling liquid thermal energy, dissi
`pated to the cooling liquid, to Surroundings of the heat radi
`ating means.
`The use of existing fastening means has the advantage that
`fitting of the cooling system is fast and easy. However, once
`again there is no problem for the person skilled in the art to
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`The present invention relates to a cooling system for a
`central processing unit (CPU) or other processing unit of a
`computer system. More specifically, the invention relates to a
`liquid-cooling system for a mainstream computer system
`such as a PC.
`During operation of a computer, the heat created inside the
`CPU or other processing unit must be carried away fast and
`efficiently, keeping the temperature within the design range
`specified by the manufacturer. As an example of cooling
`systems, various CPU cooling methods exist and the most
`used CPU cooling method to date has been an air-cooling
`arrangement, wherein a heat sink in thermal contact with the
`CPU transports the heat away from the CPU and as an option
`a fan mounted on top of the heat sinkfunctions as an airfan for
`removing the heat from the heat sink by blowing air through
`segments of the heat sink. This air-cooling arrangement is
`sufficient as long as the heat produced by the CPU is kept at
`today’s level, however it becomes less useful in future cooling
`arrangements when considering the development of CPUs
`since the speed of a CPU is said to double perhaps every 18
`months, thus increasing the heat production accordingly.
`Another design used today is a CPU cooling arrangement
`where cooling liquid is used to cool the CPU by circulating a
`cooling liquid inside a closed system by means of a pumping
`unit, and where the closed system also comprises a heat
`exchanger past which the cooling liquid is circulated.
`A liquid-cooling arrangement is more efficient than an
`air-cooling arrangement and tends to lower the noise level of
`the cooling arrangement in general. However, the liquid
`cooling design consists of many components, which
`increases the total installation time, thus making it less desir
`able as a mainstream solution. With a trend of producing
`Smaller and more compact PCs for the end-users, the greater
`amount of components in a typical liquid-cooling arrange
`ment is also undesirable. Furthermore, the many components
`45
`having to be coupled together incurs a risk of leakage of
`cooling liquid from the system.
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`SUMMARY
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`It may be one object of the invention to provide a small and
`compact liquid-cooling solution, which is more efficient than
`existing air-cooling arrangements and which can be produced
`at a low cost enabling high production Volumes. It may be
`another object to create a liquid-cooling arrangement, which
`is easy-to-use and implement, and which requires a low level
`of maintenance or no maintenance at all. It may be still
`another object of the present invention to create a liquid
`cooling arrangement, which can be used with existing CPU
`types, and which can be used in existing computer systems.
`This object may be obtained by a cooling system for a
`computer system, said computer system comprising: at least
`one unit such as a central processing unit (CPU) generating
`thermal energy and said cooling system intended for cooling
`the at least one processing unit, a reservoir having an amount
`of cooling liquid, said cooling liquid intended for accumulat
`ing and transferring of thermal energy dissipated from the
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`adopt specially adapted mounting means for any element of
`the cooling system, because there are numerous possibilities
`in existing cabinets of computer systems for mounting any
`kind of any number of elements, also elements of a cooling
`system.
`In preferred embodiments according to this aspect of the
`invention, the existing fastening means are means intended
`for attaching a heat sink to the processing unit, or the existing
`fastening means are means intended for attaching a cooling
`fan to the processing unit, or the existing fastening means are
`means intended for attaching a heat sink together with a
`cooling fan to the processing unit. Existing fastening means
`of the kind mentioned is commonly used for air cooling of
`CPUs of computer systems, however, air cooling arrange
`ments being much less complex than liquid cooling systems.
`Nevertheless, it has ingeniously been possible to develop a
`complex and effective liquid cooling system capable of ulti
`lizing such existing fastening means for simple and less effec
`tive air cooling arrangements.
`According to an aspect of the invention, the pump is
`selected from the following types: Bellows pump, centrifugal
`pump, diaphragm pump, drum pump, flexible finer pump,
`flexible impeller pump, gear pump, peristaltic tubing pump,
`piston pump, processing cavity pump, pressure washer pump,
`rotary lobe pump, rotary vane pump and electro-kinetic
`pump. By adopting one or more of the Solution of the present
`invention, a wide variety of pumps may be used without
`departing from the scope of the invention.
`According to another aspect of the invention, driving
`means for driving the pump is selected among the following
`driving means: electrically operated rotary motor, piezo-elec
`trically operated motor, permanent magnet operated motor,
`fluid-operated motor, capacitor-operated motor. As is the case
`when selecting the pump to pump the liquid, by adopting one
`or more of the solution of the present invention, a wide variety
`of pumps may be used without departing from the scope of the
`invention.
`The object may also be obtained by a cooling system for a
`computer system, said computer system comprising: at least
`one unit such as a central processing unit (CPU) generating
`thermal energy and said cooling system intended for cooling
`the at least one processing unit, a reservoir having an amount
`of cooling liquid, said cooling liquid intended for accumulat
`ing and transferring of thermal energy dissipated from the
`processing unit to the cooling liquid, a heat exchanging inter
`face for providing thermal contact between the processing
`unit and the cooling liquid for dissipating heat from the pro
`cessing unit to the cooling liquid, a pump intended for pump
`50
`ing the cooling liquid into the reservoir, through the reservoir
`and from the reservoir to a heat radiating means, and said
`cooling system further comprising a pump wherein the pump
`is driven by an AC electrical motor by a DC electrical power
`Supply of the computer system, where at least part of the
`electrical power from said power Supply is intended for being
`converted to AC being supplied to the electrical motor.
`It may be advantageous to use an AC motor, Such as a 12V
`AC motor, for driving the pump in order to obtain a stabile
`unit perhaps having to operate 24hours a day, 365 days a year.
`However, the person skilled in the art will find it unnecessary
`to adopt as example a 12V motor because high Voltage Such as
`220V or 110V is readily accessible as this is the electrical
`Voltage used to power the Voltage Supply of the computer
`system itself. Although choosing to use a 12V motor for the
`pump, it has never been and will never be the choice of the
`person skilled in the art to use an AC motor. The voltage
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`Supplied by the Voltage Supply of the computer system itself
`is DC, thus this will be the type of voltage chosen by the
`skilled person.
`In preferred embodiments according to any aspect of the
`invention, an electrical motor is intended both for driving the
`pump for pumping the liquid and for driving the a fan for
`establishing a flow of air in the vicinity of the reservoir, or an
`electrical motor is intended both for driving the pump for
`pumping the liquid and for driving the a fan for establishing a
`flow of air in the vicinity of the heat radiating means, or an
`electrical motor is intended both for driving the pump for
`pumping the liquid, and for driving the a fan for establishing
`a flow of air in the vicinity of the reservoir, and for driving the
`a fan for establishing a flow of air in the vicinity of the heat
`radiating means.
`By utilizing a single electrical motor for driving more than
`one element of the cooling system according to any of the
`aspects of the invention, the lesser complexity and the reli
`ability of the cooling system will be further enhanced.
`The heat exchanging interface may be an element being
`separate from the reservoir, and where the heat exchanging
`interface is secured to the reservoir in a manner so that the
`heat exchanging interface constitutes part of the reservoir
`when being secured to the reservoir. Alternatively, the heat
`exchanging interface constitutes an integrate surface of the
`reservoir, and where the heat exchanging Surface extends
`along an area of the Surface of the reservoir, said area of
`Surface being intended for facing the processing unit and said
`area of Surface being intended for the close thermal contact
`with the processing unit. Evenalternatively, the heat exchang
`ing interface is constitutes by a free surface of the processing
`unit, and where the free surface is capable of establishing heat
`dissipation between the processing unit and the cooling liquid
`through an aperture provided in the reservoir, and where the
`aperture extends along an area of the Surface of the reservoir,
`said Surface being intended for facing the processing unit.
`Possibly, an uneven Surface Such as pins or fins extending
`from the copper plate provide a network of channels across
`the inner Surface of the heat exchanging interface. A network
`of channels ensure the cooling liquid being passed along the
`inner Surface of the interface Such as a copper plate in a way
`that maximizes the retention time of the cooling liquid along
`the heat exchanging interface and in a way that optimizes the
`thermal exchange between the heat exchanging interface and
`the cooling liquid as long as the cooling liquid is in thermal
`contact with heat exchanging interface.
`Possibly, the cooling system may be provided with a heat
`exchanging interface for providing thermal contact between
`the processing unit and the cooling liquid for dissipating heat
`from the processing unit to the cooling liquid, a pumping
`means being intended for pumping the cooling liquid into the
`reservoir, through the reservoir and from the reservoir to a
`heat radiating means, said heat radiating means intended for
`radiating thermal energy from the cooling liquid, dissipated
`to the cooling liquid, to Surroundings of the heat radiating
`means, said heat exchanging interface constituting a heat
`exchanging Surface being manufactured from a material Suit
`able for heat conducting, and with a first side of the heat
`exchanging Surface facing the central processing unit being
`substantially plane and with a second side of the heat
`exchanging Surface facing the cooling liquid being Substan
`tially plane and said reservoir being manufactured from plas
`tic, and channels or segments being provided in the reservoir
`for establishing a certain flow-path for the cooling liquid
`through the reservoir.
`Providing a plane heat exchanging Surface, both the first,
`inner side being in thermal contact with the cooling liquid and
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`the second, outer side being in thermal contact with the heat
`generating processing unit, results in the costs for manufac
`turing the heat exchanging Surface is reduced to an absolute
`minimum.
`According to the above possible solution, an inlet of the
`pumping means is positioned in immediate vicinity of the
`heat exchanging interface for thereby obtaining a turbulence
`of flow of the cooling liquid in the immediate vicinity of the
`heat exchanging interface. The turbulence of flow is advan
`tageous for obtaining a heat dissipation. If the heat exchang
`ing interface is plane, the inlet of the pump being positioned
`as mentioned above, may result in a turbulence of flow occur
`ring along the heat exchanging interface, at least in the vicin
`ity of the inlet of the pump, but possibly also distant form the
`inlet.
`Alternatively, or additionally, an outlet of said pumping
`means being positioned in immediate vicinity of the heat
`exchanging interface for thereby obtaining a turbulence of
`flow of the cooling liquid in the immediate vicinity of the heat
`exchange interface. The turbulence of flow is advantageous
`for obtaining a heat dissipation. If the heat exchanging inter
`face is plane, the inlet of the pump being positioned as men
`tioned above, may result in a turbulence of flow occurring
`along the heat exchanging interface, at least in the vicinity of
`the inlet of the pump, but possibly also distant form the inlet.
`However, a plane first, inner Surface may also result in the
`cooling liquid passing the heat exchanging Surface too fast.
`This may be remedied by providing grooves along the inner
`Surface, thereby providing a flow path in the heat exchanging
`Surface. This however results in the costs for manufacturing
`the heat exchanging Surface increasing.
`The solution to this problem has been dealt with by pro
`viding channels or segments in the reservoir housing instead.
`The reservoir housing may be manufactured by injection
`molding or by casting, depending on the material which the
`reservoir housing is made from. Proving channels or seg
`ments during molding or casting of the reservoir housing is
`much more cost-effective than milling grooves along the
`inner Surface of the heat exchanging Surface.
`Possibly, the cooling system may be provided with at least
`one liquid reservoir mainly for dissipating or radiating heat,
`said heat being accumulated and transferred by said cooling
`liquid, said cooling system being adapted Such as to provide
`transfer of said heat from a heat dissipating Surface to a heat
`radiating Surface where said at least one liquid reservoir being
`provided with one aperture intended for being closed by
`placing said aperture covering part of alternatively covering
`the whole of the at least one processing unit in Sucha way that
`a free Surface of the processing unit is in direct heat exchang
`ing contact with an interior of the reservoir, and thus in direct
`heat exchanging contact with the cooling liquid in the reser
`Voir, through the aperture.
`Heat dissipation from the processing unit to the cooling
`liquid must be very efficient to ensure proper cooling of the
`processing unit, Especially in the case, where the processing
`unit is a CPU, the surface for heat dissipation is limited by the
`surface area of the CPU. This may be remedied by utilizing a
`heat exchanging Surface being made of a material having a
`high thermal conductivity Such as copper or aluminum and
`ensuring a proper thermal bondage between the heat
`exchanging interlace and the CPU.
`However, in a possible embodiment according to the fea
`tures in the above paragraph, the heat dissipation takes place
`directly between the processing unit and the cooling liquid by
`providing an aperture in the reservoir housing, said aperture
`being adapted for taking up a free surface of the processing
`unit. Thereby, the free surface of the processing unit extends
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`into the reservoir or constitutes a part of the boundaries of the
`reservoir, and the cooling liquid has direct access to the free
`Surface of the processing unit.
`A possible heat exchanging interface may be the direct
`contact between the heat generating unit Such as a CPU and
`the cooling liquid, where at least one unit Such as a central
`processing unit (CPU) generating thermal energy and said
`cooling system intended for cooling the at least one process
`ing unit comprising at least one liquid reservoir mainly for
`dissipating or radiating heat, said heat being accumulated and
`transferred by said cooling liquid, said cooling system being
`adapted Such as to provide transfer of said heat from a heat
`dissipating interface to a heat radiating Surface where said at
`least one liquid reservoir being provided with one aperture
`intended for being closed by placing said aperture covering
`part of, alternatively covering the whole of the at least one
`processing unit in Such a way that a free Surface of the pro
`cessing unit is in direct heat exchanging contact with an
`interior of the reservoir, and thus in direct heat exchanging
`contact with the cooling liquid in the reservoir, through the
`aperture.
`The aperture of the reservoir may be intended for being
`closed by attaching boundaries of said aperture to a free
`Surface of a the processing unit, said boundaries being liquid
`proof when attached to the free surface of the processing unit
`so that the liquid may flow freely across the free surface
`without the risk of the liquid dissipating through the bound
`aries. Alternatively, but posing the same technical effect, the
`aperture of the reservoir is intended for being closed by
`attaching boundaries of said aperture along boundaries of a
`free surface of the processing unit.
`If a heat sink is provided as an aid in dissipating heat from
`the heat generating unit such as a CPU, the aperture of the
`reservoir may be intended for being closed by attaching
`boundaries of said aperture to a free Surface of a heat sink.
`Alternatively, the aperture of the reservoir may be intended
`for being closed by attaching boundaries of said aperture
`along boundaries of a free Surface of a heat sink. Alterna
`tively, possibly, the heat exchanging interface may be pro
`vided as a first reservoir intended for being closed by attach
`ing boundaries of an aperture in the first reservoir to,
`alternatively along, a free Surface of a said processing unit,
`and a second reservoir intended for being closed by attaching
`boundaries of an aperture in the second reservoir to, alterna
`tively along, a free surface of a to a free Surface of a heat sink,
`and liquid conducting means provided between the first res
`ervoir and the second reservoir.
`The first reservoir may be closed by attaching said first
`reservoir to a heat exchanging Surface element being in close
`thermal contact with the processing unit, said heat exchang
`ing Surface intended for dissipating heat from the processing
`unit to cooling liquid in the first reservoir, and wherein a
`second reservoir is closed by attaching said second reservoir
`to a Surface of a heat sink, said heat sink intended for radiating
`heat from cooling liquid in the second reservoir to the exterior
`Surroundings.
`Also, the first reservoir and said second reservoir may be
`provided as a monolithic structure comprising both the first
`reservoir and the second reservoir and where both a heat
`dissipation from the processing unit to the cooling liquid in
`the first reservoir and heat radiation from the cooling liquid in
`the second reservoir to exterior surrounding is provided by
`the monolithic structure. The said monolithic structure may
`preferably be manufactured at least partly from plastic, pref
`erably being manufactured fully in plastic, and said mono
`lithic structure thus being manufactured by injection mold
`1ng.
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`Shenzhen Apaltek Co., Ltd. Ex. 1001, Page 17 of 30
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
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`Transfer of said cooling liquid from an outlet of the first
`reservoir to an inlet of the second reservoir, and from an outlet
`of the second reservoir to an inlet of the first reservoir, and
`circulating the cooling liquid within said liquid conducting
`means is provided by a pumping means being intended for
`pumping the cooling liquid. One of said reservoirs of said
`monolithic structure may comprise said pumping means.
`An inlet and/oran outlet and/or a pumping member of said
`pumping means, may be provided in the vicinity of said
`substantially plane side in order to provide a turbulence of
`flow and hereby improve the exchange of heat between said
`cooling liquid and Substantially plane side, and the inlet of the
`pumping means may be provided within the first reservoir and
`the outlet may be provided within the second reservoir.
`According to one aspect of the invention, a method is
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`envisaged, said method of cooling a computer system com
`prising at least one unit Such as a central processing unit
`(CPU) generating thermal energy and said method utilizing a
`cooling system for cooling the at least one processing unit
`and, said cooling system comprising a reservoir, at least one
`heat exchanging interface and a pumping means, said method
`of cooling comprising the steps of establishing, or defining, or
`selecting an operative status of the pumping means; control
`ling the operation of the motor of the pumping means in
`response to the following parameters; the necessary direction
`of movement for obtaining a pumping action of a pumping
`member of the pumping means, the possible direction of
`movement of a driving part of the motor of the pumping
`means; and in accordance with the operative status being
`established, defined or selected, controlling the operation of
`the computer system in order to achieve the necessary direc
`tion of movement of the driving part of the motor for estab
`lishing the necessary direction of movement for obtaining he
`pumping action of the pumping member.
`There may be pumping means, where the pumping mem
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`ber is only operable in one direction but where the motor
`driving the pumping member is operable in two directions.
`The solution to this problem is to either choose a pumping
`member operable in both directions or to chose a motor being
`operable in only one direction. According to the invention, a
`Solution is provided where a one-way directional pumping
`member may be operated any a two-way directional motor.
`Despite the contradictory na