I 1111111111111111 1111111111 11111 111111111111111 IIIII IIIII IIIIII IIII IIII IIII
`US010078355B2
`
`(12) United States Patent
`Eriksen
`
`(10) Patent No.: US 10,078,355 B2
`(45) Date of Patent:
`*Sep. 18, 2018
`
`(54) COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`
`(71) Applicant: Asetek Danmark A/S, Aalborg Bast
`(DK)
`
`(72)
`
`luveutor: Andre Sloth Eriksen, Nibe (DK)
`
`(73) Assignee: Asetck Danmark A/S, AaJborg East
`(DK)
`
`( *) Notice:
`
`Subject to any disclaimer, the tenn of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by O days.
`Th.is patent is subject to a terminal dis(cid:173)
`claimer.
`
`(21) Appl. No.: 15/626,706
`
`(22) Filed:
`
`Jun. 19, 2017
`
`(65)
`
`Prio r Publication Data
`US 2017/0329376 Al
`Nov. 16, 2017
`Related U.S. Application Data
`
`(63) Continuation of application No. 13/861 ,593, filed on
`Apr. 12, 2013, now Pat. No. 9,733,681, which is a
`(Continued)
`
`(51)
`
`lnt. Cl.
`F28F 7100
`G06F 1120
`
`(2006.01)
`(2006.01)
`(Continued)
`
`(52) U.S. Cl.
`C PC ......... G06F 11206 (2013.01); f'04D 1510066
`(2013.01); G06F 1120 (2013.01);
`(Continued)
`(58) Field of Classification Search
`CPC ...... G06F 1/206; G06F 1/20; G06F 2200/201 ;
`F04D 15/0066; H0l L 23/473; H0I L
`2924/0002; H05K 7/20263; H05K
`7/20272
`
`(56)
`
`References Cited
`
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`
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`
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`(Continued)
`
`FOREJGN PATENT DOCUMENTS
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`CN
`
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`1387311 A
`(Continued)
`
`OTHER PUBLICATIONS
`
`Notice of Allowabitity with Examioer's Reason for Allowance
`dated May 17, 2012 in U.S. Appl. No. 12/826,768 (4 pages).
`(Continued)
`
`Primary Examiner - Davis Hwu
`(74) Attorney, Agent, or Firm - Finuegan, Henderson,
`Farabow, Garrett & Dunner LLP
`
`(57)
`
`ABSTRACT
`
`The invention relates to a cooling system for a computer
`system, said computer system comprising at least one unit
`such as a ce!ltral processing unit (CPU) generating tbem1al
`energy and said cooling system intended for cooling the at
`least one processing unit and comprising a reservoir having
`a n a mount of cooling liquid, said cooling liquid intended for
`accumulating and transferring of them1al energy dissipated
`from the processing unit to the cooling liquid. The cooling
`system has a heat exchanging interface for providing ther(cid:173)
`mal contact between the processing ullt and the cooling
`liquid for dissipating beat from the processing unit to the
`cooling liquid. Different embodiments of the heat exchang(cid:173)
`ing system as well as means for establishing and controlling
`a flow of cooling liquid and a cooling strategy constitutes the
`invention of the cooling system.
`
`(Continued)
`
`16 Claims, 17 Drawing Sheets
`
`CoolIT Systems, Inc. Ex. 1001
`Page 1 of 35
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`

`US 10,078,355 B2
`Page 2
`
`Related U.S. Application Data
`
`continuation of application No. 11/919,974, filed as
`application No. PCT/DK2005/000310 on May 6,
`2005.
`
`(51)
`
`(2006.01)
`(2006.01)
`(2006.01)
`
`Int. Cl.
`llOIL 231473
`F04D 15100
`H05K 7120
`(52) U.S. Cl.
`CPC ....... H0JL 23/473 (2013.01); H0SK 7120263
`(2013.01); H0SK 7/20272 (2013.01); G06F
`2200/201 (2013.01); H0JL 2924/0002
`(2013.01)
`
`(58) Field of Classification Search
`USPC . ... ... ... .. ... ......... ... .. ... ... ... ... ... .. .... .. ... .. 165/80.4
`See application file for complete search history.
`
`(56)
`
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`
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`US 10,078,355 B2
`Page 3
`
`(56)
`
`References Cited
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`* cited by examiner
`
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`U.S. Patent
`
`Sep.18,2018
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`Sheet 1 of 17
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`US 10,078,355 B2
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`2
`
`FIG. 1
`Prior Art
`
`FIG. 2
`Prior Art
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`Sheet 5 of 17
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`US 10,078,355 B2
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`24
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`./
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`FIG. 7
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`16
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`FIG. 9
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`Sheet 8 of 17
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`US 10,078,355 B2
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`FIG- 10
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`Sheet 9 of 17
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`US 10,078,355 B2
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`FIG. 11
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`FIG. 12
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`Sheet 11 of 17
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`US 10,078,355 B2
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`FIG~ 13
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`Sheet 12 of 17
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`FIG. 14
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`Sheet 14 of 17
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`I
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`FIG. 16
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`Sheet 15 of 17
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`US 10,078,355 B2
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`/', /\
`
`,
`
`l
`/ 0
`
`C'\l
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`Sheet 16 of 17
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`US 10,078,355 B2
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`39
`
`~37
`
`FIG. 18
`
`f
`\
`
`0°
`
`90° 180" 270° 360°
`
`FIG. 19
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`Sheet 17 of 17
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`US 10,078,355 B2
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`47A
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`48
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`FIG. 20
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`US 10,078,355 B2
`
`l
`COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`
`Titis application is a continuation of U.S. application Ser.
`No. 13/861 ,593, filed Apr. 12, 2013, which is a continuation
`of U.S. application Ser. No. 11/9 19/974, filed Jan. 6, 2009,
`wbicb is a U.S. National Stage Application of PCT/DK2005/
`000310, filed May 6, 2005, which are incorporated herein by
`reference in their entirety.
`
`BACKGROUND
`
`2
`thennal energy and said cooling system intended for cooling
`the at least one processing unit, a reservoir having an amount
`of cooling liquid, said cooling liquid intended for accumu(cid:173)
`lating and transferring of thermal energy dissipated from the
`s processing unit to the cooliJ1g liquid, a heat exchanging
`interface for providing them1al contact between the process(cid:173)
`ing urtit and the cooling liquid for dissipating heat from the
`processing unit to the cooling liquid, a pttmp being provided
`as part of an integrate element, said integrate element
`10 comprising the beat exchanging interface, the reservoir and
`the pump, said pump intended for pwuping the cooling
`liquid into the reservoir, through the reservoir and from the
`reservoir to a heat radiating means, said heat radiating means
`intended for radiating then11al energy from the cooling
`15 liquid, dissipated to the cooling liquid, to surroundings of
`the heat radiating means.
`By providing an integrate element, it is possible to Jim.it
`the number of separate elements of the system. However.
`there is actually no need for limiting the number of elements,
`20 because often there is enough space with.in a cabinet of a
`computer system to encompass the different individual ele(cid:173)
`ments of the cooling system. Thus, it is surprisingly that, at
`all, any attempt is conducted of il1tegr:ati11g some of the
`e lemeuts.
`Jn possible embodiments according to this aspect of the
`inveution, the entire pump is placed inside the reservoir with
`at least an inlet or an outlet leading to the liquid in the
`reservoir. In an alternative embodiment the pump is placed
`outside the reservoir in the immediate vicinity of the reser-
`30 voir and wherein at least an inlet or an outlet is leading
`directly to the liquid in the reservoir. By placing the pump
`inside the reservoir or in the immediate vicittity outside the
`reservoir, the integrity of the combined reservoir, heat
`exchauger and pump is obtained, so that the element is easy
`35 to employ in new and existing computer systems, especially
`mainstream computer systems.
`In a preferred embodiment, the pumping member of the
`ptmJp and a driven part of the motor of the pump, such as a
`rotor of en electrical motor, is placed inside the reservoir
`40 embedded in the cooling liquid, and wherein a stationary
`part of the motor of the pump, such as a stator of an electrical
`motor, is placed outside the reservoir. By having the driven
`part of the motor placed inside the reservoir submerged in
`the cooling liquid and the stationary part of the motor
`45 outside the reservoir, there is no need for encapsulating the
`stationary pa.rt in a liquid-proof insulation. However, prob(cid:173)
`lems may occur having then stationary part driving the
`driven part. However, the present invention provide means
`-for obtaitting such action, although not at all evident how to
`so solve this problem.
`The object may also be obtained by a cooliug system for
`a computer system, said computer system comprising: at
`least one u1tit such as a central processing unit (CPU)
`generating thenual energy and said coolit1g system intended
`55 for cooling the at least one processing unit, a reservoir
`having an amom11 of cooling liquid, said cooling liquid
`intended for accumulating and transferring of then11al
`energy dissipated from the processing unit to tbe cooling
`liquid, a heat exchangit1g interface for providiug thermal
`60 contact between the processing unit and the cooling liquid
`for dissipating heat from the processing mtit to the cooling
`liquid, a pump intended for pumping the cooling liquid into
`the reservoir, through the reservoir and from the reservoir to
`a heat radiating means, said cooling system beit1g intended
`65 for thermal contact with the processing unit by means of
`existing fastening means associated with the processing 1mit,
`and said heat radiating means intended for radiating from the
`
`The present invention relates to a cooling system for a
`central processing unjt (CPU) <ir other processing tmit of a
`computer system. More specifically, tbe invention relates to
`a liquid-cooling system for a mainstream computer system
`such as a PC.
`During operation of a computer. tbe heat created inside
`the CPU or other processing mtit must be carried away fast
`and efficiently, keeping the temperature witltin the design
`range specified by the manufacturer. As an example of
`cooling systems, various CPU cooling methods exist and the
`most used CPU cooling method to date has been an air(cid:173)
`cooling arrangement, wherein a heat sink ij) thermal contact
`with the CPU transports the heat away from the CPU and as 25
`an option a fan mounted on top of the heat sink functions as
`an air fan for removing the heat from the heat sink by
`blowing air th.rough segments of the heat sink. This air(cid:173)
`cooling arrangement is sufficient as long as the beat pro(cid:173)
`duced by the C PU is kept at today's level, however it
`becomes less useful in foture cooling arrangements when
`considering the development of CPUs since the speed of a
`CPU is said to double perhaps every 18 months, thus
`increasing the heat production accordingly.
`Another design used today is a CPU cooling arrangement
`where cooling liquid is used to cool the CPU by circulating
`a cooling liquid inside a closed system by means of a
`pumping unit, and where the closed system also comprises
`a heat exchanger past which the cooling liquid is circulated.
`A liquid-cooling arrangement is more efficient than an
`air-cooling arrangement and tends to lower the noise level of
`the cooling arrangement in general. However, the liquid(cid:173)
`cooling design consists of many components, wlJich
`increases the total installation time, thus making it less
`desirable as a mainstream solution. With a trend of produc(cid:173)
`ing smaJler and more compact PCs for the end-users, the
`greater amount of compouents in a typica l liquid-cooling
`arrangement is also undesirable. Furthermore, the many
`components having to be coupled together incurs a risk of
`leakage of cooling liquid from the system.
`
`SUMMARY
`
`Jt may be one object of the invention to provide a small
`and compact liquid-cooling solution, which is more efficient
`than existing air-cooling arrangements and which can be
`produced at a low cost enabling high production volumes. It
`may be another object to create a liquid-cooling ammge(cid:173)
`ment, which is easy-to-use and implement, and which
`requires a low level of maintenance or no maintenance at all.
`Jt may be still another object of the present invention to
`create a liquid-cooling arrangement, which can be used with
`existing CPU types, and which can be used in existing
`computer systems.
`Th.is object may be obtained by a cooling system for a
`computer system, said computer system comprising: at least
`one unit such as a central processing tUJit (CPU) generating
`
`Page 21 of 35
`
`Shenzhen Apaltek Co., Ltd. Ex. 1016, Page 21 of 35
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
`
`

`

`US 10,078,355 B2
`
`3
`cooling liquid thermal energy, dissipated to the cooling
`liquid, to surroundings of the heat radiating means.
`The use of existing fastening means has the advantage
`that fitting of the cooling system is fast and easy. However,
`once again there is no problem for the person skilled in the
`art to adopt specially adapted mounting means for any
`element of the cooling system, because there are numerous
`possibilities in existing cabinets of computer systems for
`mounting any kind of any munber of elements, also elements
`of a cooling system.
`In preferred embodiments according to this aspect of the
`invention, the existing fastening means are means intended
`for attaching a heat sink to the processing unit, or the
`existing fastening means are means intended for anaching a
`cooling fan 10 the processing unit, or the existing fastening
`means are means intended for anaching a heat sink together
`with a cooling fan to the processing unit. Existing fastening
`means of the kind mentioned is commonly used for air
`cooling of CPUs of computer systems, however, air cooling
`arrangements being much less complex than liqttid cooling
`systems. Nevertheless, it has ingeniously been possible to
`develop a complex and effective liquid cooling system
`capable of utilising such existing .fastening means for simple
`and less effective air cooling arrangements.
`According to an aspect of the invention, the pump is 25
`selected from the following types: Bellows pump, centrifi.t-
`gal pump, diaphragm pump, drum pump, flexible liner
`pump, flexible impeller pump, gear pump, peristaltic mbing
`pump, piston pump, processing cavity pump, pressure
`washer pump, rotary lobe pump, rotary vane pump and
`electro-kinetic pump. By adopting one or more of the
`solution of the present invention, a wide variety of pumps
`may be used without departing from the scope of tl1e
`invention.
`According to another aspect of the invention. driving
`means for driving the pump is selected among the following
`driving means: electrically operated rotary motor, piezo(cid:173)
`electrically operated motor, permanent magnet operated
`motor, fluid-operated motor, capacitor-operated motor. As is
`the case when selecting the pump to pump the Ii.quid, by
`adopting one or more of the solution of the present inven(cid:173)
`tion, a wide variety of pumps may be US{.-d without departing
`from the scope of the invention.
`The object may also be obtained by a cooling system for
`a computer system, said computer system comprising: at
`least one unit such as a central processing unit (CPU)
`generating thermal energy and said cooling system intended
`for cooling the at least one processing unit, a reservoir
`having an amotmt of cooling liquid, said cooling liquid
`intended for accumulating and transferring of thermal
`energy dissipated from the processing unit to the cooling
`liquid, a heat exchanging interface for providing thennal
`contact between the processing unit and the cooling liquid
`for dissipating heat from the processing unit to the cooling
`liquid, a pump intended for pumping the cooling liquid into
`the reservoir, through the reservoir and from the reservoir to
`a heal radiating means, and said cooling system forther
`comprising a pump wherein the pump is driven by an AC
`electrical motor by a DC electrical power supply of the
`computer system, where at least part of the electrical power
`.fron1 said power supply is intended for being converted to
`AC being supplied to the electrical motor.
`lt may be advantageous to use an AC motor, such as a 12V
`AC motor, for driving the pump in order to obtain a stabile
`unit perhaps having to operate 24 hours a day, 365 days a
`year. l:lowever, the person skilled in the art will find it
`unnecessary to adopt as example a 12V motor because high
`
`4
`voltage such as 220V or I lOV is readily accessible as this is
`the electrical voltage used to power the voltage supply of the
`computer system itself Although choosing to use a 12V
`motor for the pump, it has never been and will never be the
`s choice of the person skilled in the art to use an AC motor.
`The voltage supplied by the voltage supply of the computer
`system itself is DC, thus this will be the type of voltage
`chosen by the skilled person.
`In preferred embodiments accordiug to any aspect of the
`10 invention, an electrical motor is intended both for driving the
`pml1p for pumping the liquid and for driving the a fan for
`establishing a flow of air in the vicinity of the reservoir, or
`an electrical motor is intended both for driving the pump for
`pmnping tbe liquid and for driving the a fan for establishing
`15 a flow of air in the vicinity of the beat radiating means, or
`an electrical motor is intended both for driving the pump for
`pumping the liquid, and for driving the a fan for establishing
`a flow of air in the vicinity of the reservoir, and for driving
`the a fan tor establishing a flow of air in the vicinity of the
`20 heat radiating means.
`By utilising a single electrical motor for driving more than
`one element of the cooling system according to any of the
`aspects of the invention, the lesser complexity and tbe
`reliability of the cooling system will be further enhanced.
`111e beat exchanging interface may be an element being
`separate from the reservoir, and where the beat exchanging
`intedace is secured to the reservoir in a manner so that the
`heat exchanging interface constitutes part of the reservoir
`when being secured to the reservoir. Alternatively, the heat
`30 exchanging interface constitutes an integrate surface of the
`reservoir, and where the heat exchanging surface extends
`along an area of the surface of the reservoir, said area of
`surface being intended for facing the processing tmit and
`said area of surface being intended for the close thennal
`35 contact with the processing unit. Even alternatively, the heat
`exchanging interface is constinnes by a free surface of the
`processing unit, and where the free surface is capable of
`establishing heat dissipation between the processing unit and
`the cooling liquid through au aperture provided in the
`40 reservoir, and where the apern1re extends along an area of
`the surface of the reservoir, said surface being intended for
`facing the processing tmit.
`Possibly, an uneven surface. such as pins or fins extending
`from tbe copper plate provide a network of channels across
`45 the inner surface of the heat exchanging interface. A network
`of challllels ensure the cooling liquid being passed along the
`i1mer surface of the interface such as a copper plate in a way
`that maximises the retention time of the cooling liquid along
`the heat exchanging interface and in a way that optimises the
`so thermal exchange between the heat exchanging interface and
`the cooling liquid as long as the cooling liquid is in thenual
`contact with heat exchanging interface.
`Possibly, the cooliJ1g system may be provided with a heat
`exchanging interface for providing thermal contact between
`55 the processing unit and the cooling liquid for dissipating
`heat from the processing t11tit to the cooling liquid, a
`pumping means being intended for pumping the cooling
`liquid into the reservoir, through the reservoir and from the
`reservoir to a heat radiating means, said heat radiating means
`60 intended for radiating thermal energy from the cooling
`liquid, dissipated 10 the cooling liquid, 10 surroundings of
`the heat radiating means, said heat exchanging interface
`constituting a heat exchanging surface being manufacnired
`from a material suitable for heat conducting, and with a first
`65 side of the heat exchanging surface facing the central
`processing unit being substantially plane and with a second
`side of the heat exchanging surface facing the cooling liquid
`
`Page 22 of 35
`
`Shenzhen Apaltek Co., Ltd. Ex. 1016, Page 22 of 35
`Shenzhen Apaltek Co., Ltd. v. Asetek Danmark A/S
`IPR2022-01317
`
`

`

`US 10,078,355 B2
`
`10
`
`5
`being substantially plane and said reservoir being manufac(cid:173)
`tured from plastic, and challllels or segments being provided
`in the reservoir for establishing a certain flow-path for the
`cooling liquid through the reservoir.
`Providing a plane heat exchanging surface, both the first, 5
`inner side being in thermal contact with the cooling liquid
`and the second, outer side being in thenual contact with the
`heat generating processing unit, results in the costs for
`manufact11ring the heat exchanging surface is reduced to an
`absolute minimum.
`According to the above possible solution, a11 inlet of the
`pumping means is positioned in immediate vicinity of the
`heat exchanging interface for thereby obtaining a turbulence
`of flow of the cooling liquid in the immediate vicinity of the
`heat exchanging interface. The t11rbulence of flow is advan(cid:173)
`tageous for obtaining a heat dissipation. If the heat exchang(cid:173)
`ing interface is plane, the inlet of the pump being positioned
`as mentioned above, may result in a turbulence of flow
`occurring along the heat excbaJ1ging interface, at least in the
`vicinity of the inlet of the pump, but possibly also distant
`form the inlet.
`Alternatively, or additionally, an outlet of said pumping
`means being positioned in immediate vicinity of the heat
`exchanging interface for thereby obtaining a t11rbulencc of
`flow of the cooling liquid in the immediate vicinity of the
`heat exchange interface. TI1e turbulence of flow is advanta(cid:173)
`geous for obtaining a heat dissipation. Jfthe heat exchanging
`interface is plane, the iulet of the pump being positioned as
`mentioned above, may result in a mrbulence of flow occur- 30
`ring along the heat exchanging interface, at least in the
`vicinity of the inlet of the pump, but possibly also distant
`form the inlet.
`However, a plane first, inner Stl!face. may also result in the
`cooling liquid passing the heat exchanging surface too fast.
`This may be remedied by providing grooves along the illller
`surface, thereby providing a flow path in the heat exchang(cid:173)
`ing surface. This however results in the costs for manufac(cid:173)
`turing the heat exchanging surface increasing.
`Toe solution to this problem has been dealt with by 40
`providing channels or segments in the reservoir housing in
`stead. The reservoir housing may be manufact11J'ed by injec.'C(cid:173)
`tion moulding or by casting, depending on the material
`which the reservoir housing is made from. Proving channels
`or segments during moulding or casting of the reservoir
`housing is much more cost-effective than milling grooves
`along the i1mer surface of the heat exchanging surface.
`Possibly, the cooling system may be provided with at least
`one liquid reservoir mainly for dissipating or radiating heat,
`said heat being accumulated and transferred by said cooling
`liquid, said cooling system bei11g adapted such as to provide
`transfer of said heat from a heat dissipating surface to a heat
`radiating surface where said at least one liquid reservoir
`being provided with one aperture intended for being closed
`by placing said aperture covering part of, alternatively
`covering the whole of, the at least one processing unit in
`such a way that a free surface of the processing unit is in
`rurect heat exchanging contact with an interior of the res(cid:173)
`ervoir, and thus in direct heat exchanging contact with the
`cooling liquid in the reservoir, through the aperture.
`Heat dissipation from the processing unit 10 the cooling
`liquid must be very etlicient to ensure proper cooling of the
`processing unit, Especially in the case, where th