`US 8,355,766 B2
`(10) Patent No.:
`(12)
`MacNeish,III et al.
`(45) Date of Patent:
`Jan. 15, 2013
`
`
`US008355766B2
`
`(54) CERAMIC EMITTER SUBSTRATE
`
`(73) Assignee: Masimo Corporation, Irvine, CA (US)
`(*) Notice:
`Subject to any disclaimer, the term ofthis
`patent is extended or adjusted under 35
`US.C. 154(b) by 1104 days.
`
`.
`(21) Appl. No.: 12/248,841
`:
`(22)
`Filed:
`Oct. 9, 2008
`
`(65)
`
`Prior Publication Data
`
`US 2009/0156913 Al
`
`Jun. 18, 2009
`
`(51)
`
`Related U.S. Application Data
`oe
`..
`(60) Provisional application No. 60/998,659, filed on Oct.
`12, 2007, provisional application No. 61/192,131,
`filed on Sep. 14, 2008.
`Int. Ch.
`(2006.01)
`AGIB 5/00
`(52) US. Ch. ce eeecesneeneeseeseseeeneees 600/310; 600/309
`(58) Field of Classification Search .................. 600/309,
`600/310, 322, 323, 331
`See applicationfile for complete search history.
`
`(56)
`
`References Cited
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`Inventors: RetaJackMaeNeish.ue costa
`(75)
`
`esa,CA(US); Mohamed K.Diab, D359,546 S 6/1995 Savageetal.
`
`
`
`Ladera Ranch, CA (US); David Dalke,
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`(Continued)
`Primary Examiner — Jeffrey G Hoekstra
`(74) Attorney, Agent, or Firm — Knobbe, Martens, Olson &
`Bear, LLP
`ABSTRACT
`(67)
`Aceramic emitter substrate has a substrate body with top and
`bottomsides and a cavity disposed onthe top side. Bonding
`pads are disposed within the cavity and solder pads are dis-
`posed on the bottom side. Light emitting diodes (LEDs) are
`electrically connected to the bonding pads. Low-resistance
`conductors are disposed within the ceramic substrate body so
`as to interconnect the bonding pads andthe solder pads. The
`interconnect is configured so that the LEDscan beindividu-
`ally activated as an array via row and column drive signals
`applied to the solder pads.
`
`4,867,557 A *
`4,960,128 A
`4,964,408 A
`5,041,187 A
`5,069,213 A
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`8/1994 Branigan
`
`8 Claims, 26 Drawing Sheets
`
`
`
`1
`
`APPLE 1061
`Apple v. Masimo
`IPR2022-01299
`
`APPLE 1061
`Apple v. Masimo
`IPR2022-01299
`
`1
`
`
`
`US 8,355,766 B2
`
`Page 2
`
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`
`2
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`
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`US 8,355,766 B2
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`7,295,866 B2
`7,328,053 Bl
`7,332,784 B2
`7,340,287 B2
`340,
`7,341,559 B2
`7,343,186 B2
`D566.282 §
`7355512 BL
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`
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`7,376,453 Bl
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`7418907 BD
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`7,428,432 B2
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`2006/0211922 A1*
`aos
`.
`cited by examiner
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`:
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`
`3
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`U.S. Patent
`
`Jan. 15, 2013
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`Sheet 1 of 26
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`US 8,355,766 B2
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`FIG.1A
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`4
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`U.S. Patent
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`Jan. 15, 2013
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`Sheet 2 of 26
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`US 8,355,766 B2
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`Jan. 15, 2013
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`Sheet 3 of 26
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`US 8,355,766 B2
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`Jan. 15, 2013
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`Sheet 4 of 26
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`US 8,355,766 B2
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`Jan. 15, 2013
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`Sheet 5 of 26
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`US 8,355,766 B2
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`FIG.4B
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`Jan. 15, 2013
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`Jan. 15, 2013
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`Sheet 17 of 26
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`US 8,355,766 B2
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`1
`CERAMIC EMITTER SUBSTRATE
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`
`The present application claims priority benefit under 35
`US.C. §119(e) to U.S. Provisional Patent Application Ser.
`No. 60/998,659, filed Oct. 12, 2007, titled Ceramic Emitter
`Substrate; and U.S. Provisional Patent Application Ser. No.
`61/192,131 filed Sep. 14, 2008, titled Ceramic Emitter Sub-
`strate; all of the above applications incorporated by reference
`herein.
`
`INCORPORATION BY REFERENCE OF
`COPENDING RELATED CASES
`
`The present disclosure is generally related to U.S. patent
`application Ser. No. 12/056,179, filed Mar. 26, 2008, titled
`Multiple Wavelength Optical Sensor, hereby incorporated by
`reference herein.
`
`BACKGROUNDOF THE INVENTION
`
`Pulse oximetry systems for measuring constituentsofcir-
`culating blood have gained rapid acceptance in a widevariety
`of medical applications, including surgical wards, intensive
`care and neonatal units, general wards, home care, physical
`training, and virtually all types of monitoring scenarios. A
`pulse oximetry system generally includes an optical sensor
`applied to a patient, a monitor for processing sensorsignals
`and displaying results and a patient cable electrically inter-
`connecting the sensor and the monitor. A pulse oximetry
`sensor haslight emitting diodes (LEDs), typically one emit-
`ting a red wavelength and one emitting an infrared (IR) wave-
`length, and a photodiode detector. The emitters and detector
`are attached to a patient tissue site, such as a finger. The
`patient cable transmits drive signals to these emitters from the
`monitor, and the emitters respond to the drive signals to
`transmit light into the tissue site. The detector generates a
`signal responsive to the emitted light after attenuation by
`pulsatile blood flow within the tissue site. The patient cable
`transmits the detector signal to the monitor, which processes
`the signal to provide a numerical readout of physiological
`parameters such as oxygen saturation (SpO,) and pulserate.
`Advanced physiological monitoring systemsutilize multiple
`wavelength sensors and multiple parameter monitors to pro-
`vide enhanced measurement capabilities including,
`for
`example, the measurement of carboxyhemoglobin (HbCO),
`methemoglobin (HbMet) and total hemoglobin (Hbt).
`Pulse oximeters capable of reading through motion
`induced noise are disclosed in at least U.S. Pat. Nos. 6,770,
`028, 6,658,276, 6,650,917, 6,157,850, 6,002,952, 5,769,785,
`and 5,758,644; low noise pulse oximetry sensors are dis-
`closed in at least U.S. Pat. Nos. 6,088,607 and 5,782,757; all
`of which are assigned to Masimo Corporation, Irvine, Calif.
`(“Masimo”) and are incorporated by reference herein.
`Physiological monitors and corresponding multiple wave-
`length optical sensors are described in at least U.S. patent
`application Ser. No. 11/367,013, filed Mar. 1, 2006 and
`entitled Multiple Wavelength Sensor Emitters and U.S. patent
`application Ser. No. 11/366,208, filed Mar. 1, 2006 and
`entitled Noninvasive Multi-Parameter Patient Monitor, both
`assigned to Masimo Laboratories, Irvine, Calif. (Masimo
`Labs) and both incorporated by reference herein.
`Further, physiological monitoring systemsthat include low
`noise optical sensors and pulse oximetry monitors, such as
`any of LNOP® adhesive or reusable sensors, SofTouch™
`
`2
`sensors, Hi-Fi Trauma™or Blue™sensors; and any of Radi-
`cal®, SatShare™, Rad-9™, Rad-5™, Rad-5v™ or PPO+™
`Masimo SET® pulse oximeters, are all available from
`Masimo. Physiological monitoring systems including mul-
`tiple wavelength sensors and corresponding noninvasive
`blood parameter monitors, such as Rainbow™adhesive and
`reusable sensors and RAD-57™and Radical-7™ monitors
`
`for measuring SpO,, pulse rate, perfusion index, signal qual-
`ity, HbCO and HbMet amongotherparametersare also avail-
`able from Masimo.
`
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`SUMMARYOF THE INVENTION
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`FIGS. 1A-B illustrate a physiological monitoring system
`100 capable of generating SpO, and in multiple wavelength
`configurations additional blood parameter measurements
`such as HbCO, HbMetand Hbt. The physiological monitor-
`ing system 100 has a monitor 110 and a sensor 150. The
`sensor 150 attachesto a tissue site 1 and includesa plurality
`of emitters 122 capable of irradiating the tissue site with
`differing wavelengths of light, such as the red and infrared
`(IR) wavelengths utilized in pulse oximeters and, in some
`configurations, multiple wavelengths different than or in
`addition to those red and IR wavelengths. The sensor 150 also
`includes one or more detectors 154 capable of detecting the
`light after attenuation bythetissuesite 1.
`As shown in FIGS. 1A-B, the monitor 110 communicates
`with the sensor 150 to receive one or more intensity signals
`indicative of one or more physiological parameters and dis-
`plays the parameter values. Drivers 114 convert digital con-
`trol signals into analog drive signals capable of driving sensor
`emitters 152. A front-end 112 converts composite analog
`intensity signal(s) from light sensitive detector(s) 154 into
`digital data 115 input to the DSP 120. Thedigital data 115 is
`representative of a change in the absorption of particular
`wavelengths of light as a function of the changes in body
`tissue resulting from pulsing blood. The DSP 120 may com-
`prise a wide variety of data and/or signal processors capable
`of executing programsfor determining physiological param-
`eters from input data.
`Also shown in FIGS. 1A-B, the instrument manager 130
`may comprise one or more microcontrollers controlling sys-
`tem management, such as monitoring the activity of the DSP
`120. The instrument manager 130 also has a display driver
`132, an audio driver 134 and an input/output (I/O) port 138
`that provides a user and/or device interface for communicat-
`ing with the monitor 110.
`Further shown in FIGS. 1A-B are one or more user /O
`devices 140 including a display 142, an audible indicator 144
`and a keypad 148. The display 142 is capable of displaying
`indicia representative of calculated physiological parameters
`such as one or more of a pulse rate (PR), signal quality and
`values of blood constituents in body tissue, including for
`example, oxygen saturation (SpO,). The monitor 110 may
`also be capable of storing or displayinghistorical or trending
`data related to one or more of the measured parameters or
`combinations of the measured parameters. Displays 142
`include for example readouts, colored lights or graphics gen-
`erated by LEDs, LCDs or CRTs to name a few. Audible
`indicators 144 include, for example, tones, beeps or alarms
`generated by speakers or other audio transducers to name a
`few. The user input device 148 may include, for example, a
`keypad, touch screen, pointing device, voice recognition
`device,or the like.
`FIG.2 illustrates an emitter array 200 for a multiple wave-
`length optical sensor having multiple emitters 210 capable of
`emitting light 202 having multiple wavelengths into a tissue
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`site 1. Row drivers 270 and column drivers 280 are electri-
`cally connected to the emitters 210 and activate one or more
`emitters 210 by addressing at least one row 220 andat least
`one column 240 of an electrical grid. In one embodiment, the
`emitters 210 each include a first contact 212 and a second
`contact 214. The first contact 212 of a first subset 230 of
`emitters is in communication with a first conductor 220 of the
`
`electrical grid. The second contact 214 of a second subset 250
`of emitters is in communication with a second conductor 240.
`
`Each subset comprises at least two emitters, and at least one
`ofthe emitters of the first and second subsets 230, 250 are not
`in common.A detector 290 is capable of detecting the emitted
`light 202 and outputting a sensor signal 295 responsive to the
`emitted light 202 after attenuation by the tissue site 1. As
`such,the sensor signal 295 is indicative of at least one physi-
`ological parameter corresponding to the tissue site 1, as
`described above.
`
`FIG. 3 illustrates an emitter array 300 embodiment having
`light emitting diodes (LEDs) 301 connected within an elec-
`trical grid of n rows and m columnstotaling n+m drive lines
`350, 360, where n and m are integers greater than one. The
`electrical grid minimizes the numberofdrivelines required to
`activate the LEDs 301 while preserving flexibility to selec-
`tively activate individual LEDs 301 in any sequence and
`multiple LEDs 301 simultaneously. The electrical grid also
`facilitates setting LED currents so as to control intensity at
`each wavelength, determining operating wavelengths and
`monitoring total grid current soas to limit powerdissipation.
`The emitter array 300 is also physically configured in rows
`310. This physical organization facilitates clustering LEDs
`301 according to wavelength so as to minimize pathlength
`variations andfacilitates equalization of LED intensities.
`As shown in FIG. 3, one embodiment of an emitter array
`300 comprises up to sixteen LEDs 301 configured in an
`electrical grid offour rows 310 and four columns 320. Eachof
`the four row drive lines 350 provide a common anode con-
`nection to four LEDs 301, and each of the four columndrive
`lines 360 provide acommoncathode connection to four LEDs
`301. Thus, the sixteen LEDs 301 are driven with only eight
`wires, including four anode drive lines 312 and four cathode
`drive lines 322. This compares favorably to conventional
`common anode or cathode LED configurations, which
`require more drive lines.
`Also shownin FIG.3, row drivers 370 and column drivers
`380 located in the monitor 110 selectively activate the LEDs
`301. In particular, row and column drivers 370, 380 function
`together as switches to Vee and current sinks ta ground,
`respectively, to activate LEDs and as switches to ground and
`Vee, respectively, to deactivate LEDs. This push-pull drive
`configuration prevents parasitic current flow in deactivated
`LEDs. In a particular embodiment, only one row drive line
`350 is switched to Vcc at a time. One to four column drive
`
`lines 360, however, can be simultaneously switchedto a cur-
`rent sink so as to simultaneously activate multiple LEDs
`within a particular row. Activation oftwo or more LEDsofthe
`same wavelength facilitates intensity equalization.
`A ceramic emitter substrate advantageously houses,
`mechanically mounts andelectrically interconnects an emit-
`ter array, as described with respect to FIGS. 2-3, above.
`Ceramic lends mechanicalandstructural precision over other
`substrate materials. Further, the ceramic substrate provides
`uniform thermal properties that allow accurate measurement
`of emitter temperatures utilizing a co-mounted thermistor or
`similar temperature responsive device. The ceramic substrate
`also provides a cavity which protects the emitter array and
`accepts encapsulants. Encapsulants may include one or more
`of an attenuating epoxy over selected emitter components so
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`4
`as to equalize emitter intensities and clear fill epoxy with or
`withouta dispersed diffusing media, as examples. In addition,
`the ceramic media is multi-layered, allowing internal routing
`for the matrix that interconnects the emitter array. A ceramic
`emitter substrate incorporated into an optical sensor and also
`encapsulants disposed in a ceramic emitter substrate cavity
`are described with respect to U.S. patent application Ser. No.
`12/056,179, cited above and incorporated by reference
`herein.
`
`In particularly advantageous embodiments, special atten-
`tion is given to the ceramic substrate multi-layer conductors
`to achieve very low resistance. Low resistance in the emitter
`array interconnect minimizesthe resistive heating of the sub-
`strate and corresponding spurious wavelength shifts. Also,
`low interconnect resistance lessens parasitic voltage drops
`between emitters and drivers that negatively impact available
`drive current.
`
`One aspect of a ceramic emitter substrate is an optical
`medical device that transmits optical radiation into a fleshy
`tissue site. The optical radiation is detected after absorption
`by pulsatile blood flow within the fleshy tissue site so as to
`compute constituents ofthe pulsatile blood flow. A generally
`rectangular-cross-sectioned ceramic body has a top side, a
`bottom side and an edge adjoining the sides. A cavity is
`defined by the ceramic body and disposed on the top side.
`Conductive bonding padsare disposed withinthe cavity. Con-
`ductive solder pads are disposed on the bottom side proximate
`the edge. Conductive traces and vias form an interconnect of
`the bonding pads and the solder pads. Light emitting diodes
`(LEDs) can be attached to the bonding pads and individually
`activated as an emitter array via row and column drive signals
`applied to the solder pads in order to transmitoptical radiation
`out ofthe cavity.
`In an embodiment, the ceramic body comprisesfirst, sec-
`ond, third and fourth layers. Thefirst layer defines the top side
`and the cavity. The second layer underlies the first layer. The
`third layer underlies the second layer. A fourth layer underlies
`the third layer and defines the bottom side. A first portion of
`the bonding pads are disposed on the second layer. A second
`portion of the bonding pads are disposed on the third layer.
`LEDsare mountedto the bonding padsonthe third layer and
`wire bonded to the bonding pads on the secondlayer. In a
`particularly advantageous embodiment, each combination of
`traces, vias and pads constituting a conductive path between
`the solder pads and the bonding padsfor any oneofthe drive
`signals has a combinedresistance less than about 310 millio-
`hms.
`In an embodiment, a thermistor is mounted within the
`cavity and electrically connected to the bonding pads so that
`the resistance ofthe thermistor can be read via the solder pads
`and the interconnect. A portion of the third layer creates a
`raised partition within the cavity that separates the floorofthe
`cavity into a first area and a second area. LEDs are mounted
`within the first area and the thermistor is mounted within the
`
`second area. An encapsulant may be disposed within the
`cavity over at least a portion of the LEDs, where the encap-
`sulant functions as an opticalfilter or an optical diffuser or
`both.
`In a particularly advantageous embodiment,
`the
`ceramic bodyis constructed ofa substantially light absorbing
`material so as to substantially block LED emitted optical
`radiation from being transmitted through the ceramic body.
`Anotheraspect of a ceramic emitter substrate comprises a
`ceramic body having a top side, an opposite bottom side and
`an edge disposed between and alongthe periphery of the top
`and bottom sides. The ceramic body hasa first layer corre-
`spondingto the top side, a secondlayer adjacentthefirst layer,
`a third layer adjacent the second layer and a fourth layer
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`corresponding to the bottom side. A cavity is defined by the
`first layer. Solder pads are disposed on the fourth layer on the
`bottom side proximate the edge. Bonding padsare disposed
`on the second layer and onthe third layer. The bonding pads
`are accessible via the cavity. Traces are disposed on the sec-
`ond, third and fourth layers and vias are disposed between the
`second,third and fourth layersso as to interconnectthe solder
`pads and the bonding pads.
`In a particularly advantageous embodiment, the traces
`have a substantial width relative to the area of the ceramic
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`body sides so as to have a low resistance. In an embodiment,
`the resistance of any oneof the traces is less than about 290
`milliohms. In an embodiment, the ceramic body measures
`about 0.23x0.15x0.04 inches and the cavity measures about
`0.18x0.10 inches. In an embodiment, the ceramic body com-
`prises a dark material that substantially absorbs light trans-
`mitted from the light emitting diodes so as to substantially
`block optical leakage through the ceramic body edge and
`bottom side.
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`ceramic substrate means. Low resistance conductive means
`are for interconnecting the solder pad meansandthe bonding
`pad means.
`In various embodiments, the ceramic substrate means com-
`prisesa first ceramic layer meansfor defining a cavity within
`the ceramic substrate means. A third ceramic layer meansis
`for defining a device bonding area along a cavity floor. A
`second ceramic layer meansis for defining a wire bonding
`area raised above the cavity floor disposed betweenthefirst
`and second ceramic layer means. A fourth ceramic layer
`meansis for defining a soldering area disposed adjacent the
`third ceramic layer means. A first set of the bonding pad
`meansis for mounting electrical components disposed along
`the device bonding area. A second set of the bonding pad
`means is for wiring bonding to electrical components dis-
`posed along the wire bonding area. Solder pad meansare for
`soldering the ceramic substrate to a flexible circuit disposed
`along the soldering area. Low resistance conductive means
`are for interconnecting betweenthe solder pad meansandthe
`first and second sets of bonding pad means.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`A further aspect of a ceramic emitter substrate is a method
`ofconstructing an optical sensor having emitters that transmit
`optical radiation having multiple wavelengths into a tissue
`site and a detector that generates a sensor signal responsive to
`the optical radiation after absorption by the tissue site. A
`ceramic substrate having a top side and a bottom side is
`provided. A cavity is defined in the top side of the ceramic
`substrate. Light emitting devices are mounted within the cav-
`ity. Low-resistance conductors are routed on and within the
`ceramic substrate so as to transmit drive signals to the light
`emitting devices from a source external to the ceramic sub-
`strate.
`
`FIGS. 1A-Bare a perspective view and general block dia-
`gram of a physiological measurement system utilizing an
`optical sensor;
`FIG.2 is a general block diagram of an emitter array for a
`multiple wavelength optical sensor;
`FIG.3 is a schematic diagram of an emitter array;
`FIGS. 4A-Bare top and bottom exploded views of a mul-
`tiple wavelength sensor assembly utilizing a ceramic emitter
`substrate;
`FIGS. 5A-B are perspective and perspective cross sectional
`views, respectively, of a ceramic emitter substrate;
`FIGS. 6-14 are views of a ceramic emitter substrate
`In various embodiments bonding pads are plated on the top
`embodiment;
`side within the cavity. Solder pads are plated on the bottom
`FIGS. 6A-Daretop, half-end cross sectional, bottom and
`side. The solder pads are interconnected with the bonding
`half-side cross sectional views, respectively, of a ceramic
`pads. The light emitting devices are bonded to the bonding
`emitter substrate;
`pads so as to transmit optical radiation from the cavity in
`FIG. 7 is a plan view of ceramic emitter substrate bonding
`response to drive signals applied to the solder pads. In an
`pads;
`embodiment, plating bonding pads comprises plating upper
`FIGS. 8-11 are plan views of ceramic emitter substrate first
`through fourth layers;
`bonding pads on a second layer of the ceramic substrate,
`FIG. 12-13 are plan views of ceramic emitter substrate
`plating lower bonding pads on a third layer of the ceramic
`solder pads and an aluminacoatlayer, respectively;
`substrate and sandwiching the secondlayer andthe third layer
`FIGS. 14A-C are top, side and bottom viewsof an array of
`betweenafirst layer of the ceramic substrate that defines the
`45
`ceramic emitter substrates formed from a multilayer ceramic
`top side and the cavity and a fourth layer that defines the
`sheet;
`bottom side. In an embodiment, Interconnecting comprises
`FIGS. 15-23 are views of a low-resistance ceramic emitter
`disposing traces on the second, third and fourth layers, which
`substrate embodiment;
`may comprise substantially maximizing the width of each of
`FIG. 15 is a resistance chart for a low-resistance ceramic
`the traces that conductthe drive signals given the number of
`emitter substrate;
`traces and the area ofthe layers so as to substantially mini-
`FIGS. 16A-F are top, half-end cross sectional, bottom and
`mize the resistanceofthe traces. In an embodiment,traces of
`half-side cross sectional views and top and bottom perspec-
`sufficient width are provided so that each of the traces that
`tive views, respectively, of a low-resistance ceramic emitter
`conductthe drive signals has a resistance less than about 290
`substrate;
`milliohms. Solder pads, bonding pads and vias are provided
`FIG. 17 is a bonding plan view of a low-resistance ceramic
`so that the resistance from solder pad to bonding pad for each
`emitter substrate;
`of the drive signals is less than about 310 milliohms.
`FIGS. 18-21 are plan viewsoffirst through fourth layers,
`Anotheraspect of a ceramic emitter substrate is configured
`respectively, for a low-resistance ceramic emitter substrate
`to mount in an optical sensor and to transmitoptical radiation
`embodiment; and
`into a fleshy tissue site, the optical radiation detected after
`FIGS. 22-23 are plan views of solder pads and an alumina
`absorption by pulsatile blood flow, a signal responsive to the
`coatlayer, respectively, for a low-resistance ceramic emitter
`substrate.
`detected optical radiation communicated to a monitor that
`computes constituents of the pulsatile blood flow. The
`ceramic emitter substrate comprises a ceramic substrate
`means for housing LEDs. A solder pad meansis for