SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`SNx4HC153 Dual 4-Line To 1-Line Data Selectors/Multiplexers
`
`1 Features
`• Wide operating voltage range of 2 V to 6 V
`• Outputs can drive up to 15 LSTTL loads
`• Low power consumption, 80-μA max ICC
`• Typical tpd = 9 ns
`• ±6-mA output drive at 5 V
`• Low input current of 1 μA max
`• Permit multiplexing from n lines to one line
`• Perform parallel-to-serial conversion
`• Strobe (enable) line provided for cascading
`(N lines to n lines)
`
`2 Description
`The SNx4HC153 is a dual data selector/multiplexer
`containing full binary decoding to select one of
`four data sources. Both channels are controlled by
`the same address select inputs, and each channel
`includes its own strobe (G) input. A high level at the
`strobe terminal forces the repective output low.
`Device Information
`PACKAGE(1)
`BODY SIZE (NOM)
`SOIC (16)
`9.90 mm × 3.90 mm
`PDIP (16)
`19.31 mm × 6.35 mm
`SO (16)
`6.20 mm × 5.30 mm
`TSSOP (16)
`5.00 mm × 4.40 mm
`CDIP (16)
`24.38 mm × 6.92 mm
`LCCC (20)
`8.89 mm × 8.45 mm
`
`PART NUMBER
`SN74HC153D
`SN74HC153N
`SN74HC153NS
`SN74HC153PW
`SN54HC153J
`SNJ54HC153FK
`
`(1)
`
`For all available packages, see the orderable addendum at
`the end of the data sheet.
`
`Pin numbers are for the D, J, N, NS, PW, and W packages.
`Functional Block Diagram
`
`An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
`intellectual property matters and other important disclaimers. PRODUCTION DATA.
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 1 of 31
`
`

`

`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`www.ti.com
`
`Table of Contents
`1 Features............................................................................1
`7.1 Overview.....................................................................8
`2 Description.......................................................................1
`7.2 Functional Block Diagram...........................................8
`3 Revision History.............................................................. 2
`7.3 Device Functional Modes............................................9
`8 Power Supply Recommendations................................10
`4 Pin Configuration and Functions...................................3
`9 Layout.............................................................................10
`5 Specifications.................................................................. 4
`9.1 Layout Guidelines..................................................... 10
`5.1 Absolute Maximum Ratings........................................ 4
`10 Device and Documentation Support..........................11
`5.2 Recommended Operating Conditions(1) .................... 4
`5.3 Thermal Information....................................................4
`10.1 Receiving Notification of Documentation Updates.. 11
`5.4 Electrical Characteristics.............................................5
`10.2 Support Resources................................................. 11
`5.5 Switching Characteristics ...........................................5
`10.3 Trademarks............................................................. 11
`5.6 Switching Characteristics ...........................................6
`10.4 Electrostatic Discharge Caution.............................. 11
`5.7 Operating Characteristics........................................... 6
`10.5 Glossary.................................................................. 11
`6 Parameter Measurement Information............................ 7
`11 Mechanical, Packaging, and Orderable
`7 Detailed Description........................................................8
`Information.................................................................... 11
`
`3 Revision History
`NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
`Page
`Changes from Revision D (October 2003) to Revision E (February 2022)
`• Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect
`modern data sheet standards.............................................................................................................................1
`
`2
`
`Submit Document Feedback
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 2 of 31
`
`

`

`www.ti.com
`
`4 Pin Configuration and Functions
`
`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`J, W, D, N, NS, or PW Package
`16-Pin CDIP, CFP, SOIC, PDIP, SO, or TSSOP
`Top View
`
`NC - No internal connection
`FK Package
`20-Pin LCCC
`Top View
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Submit Document Feedback
`
`3
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 3 of 31
`
`

`

`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`5 Specifications
`5.1 Absolute Maximum Ratings
`over operating free-air temperature range (unless otherwise noted)(1)
`
`VCC
`IIK
`IOK
`IO
`
`TJ
`Tstg
`
`Supply voltage range
`Input clamp current(2)
`Output clamp current(2)
`Continuous output current
`Continuous current through VCC or GND
`Junction temperature
`Storage temperature
`
`VI < 0 or VI > VCC
`VO < 0 or VO > VCC
`VO = 0 to VCC
`
`www.ti.com
`
`MIN
`–0.5
`
`–65
`
`MAX
`7
`±20
`±20
`±35
`±70
`150
`150
`
`UNIT
`V
`mA
`mA
`mA
`mA
`°C
`°C
`
`(1)
`
`(2)
`
`Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
`only and functional operation of the device at these or any other conditions beyond those indicated under Section 5.2 is not implied.
`Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
`The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
`
`5.2 Recommended Operating Conditions(1)
`
`Supply voltage
`
`High-level input voltage
`
`Low-level input voltage
`
`Input voltage
`Output voltage
`
`VCC = 2 V
`VCC = 4.5 V
`VCC = 6 V
`VCC = 2 V
`VCC = 4.5 V
`VCC = 6 V
`
`Input transition rise/fall time
`
`VCC = 2 V
`VCC = 4.5 V
`VCC = 6 V
`Operating free-air temperature
`
`SN74HC153
`NOM
`5
`
`SN54HC153
`NOM
`5
`
`MIN
`2
`1.5
`3.15
`4.2
`
`0
`0
`
`−55
`
`MAX
`6
`
`0.5
`1.35
`1.8
`VCC
`VCC
`1000
`500
`400
`125
`
`MIN
`2
`1.5
`3.15
`4.2
`
`0
`0
`
`−40
`
`MAX
`6
`
`0.5
`1.35
`1.8
`VCC
`VCC
`1000
`500
`400
`85
`
`UNIT
`
`V
`
`V
`
`V
`
`V
`V
`
`ns
`
`°C
`
`VCC
`
`VIH
`
`VIL
`
`VI
`VO
`
`Δt/Δv
`
`TA
`
`(1)
`
`All unused inputs of the device must be held at VCCor GND to ensure proper device operation. Refer to the TI application report,
`Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
`
`5.3 Thermal Information
`
`THERMAL METRIC(1)
`Junction-to-ambient thermal
`R θJA
`resistance
`
`D (SOIC)
`16 PINS
`
`73
`
`N (PDIP)
`16 PINS
`
`67
`
`NS (SO)
`16 PINS
`
`64
`
`PW (TSSOP)
`16 PINS
`
`108
`
`UNIT
`
`°C/W
`
`(1)
`
`For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
`report.
`
`4
`
`Submit Document Feedback
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 4 of 31
`
`

`

`www.ti.com
`
`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`5.4 Electrical Characteristics
`over recommended operating free-air temperature range (unless otherwise noted)
`SN54HC153
`TA = 25°C
`VCC
`(V)
`TYP
`MIN
`MAX
`2
`1.998
`1.9
`4.5
`4.499
`4.4
`6
`5.999
`5.9
`4.5
`4.3
`3.7
`6
`5.8
`5.2
`2
`0.002
`4.5
`0.001
`6
`0.001
`4.5
`0.17
`6
`0.15
`6
`±0.1
`6
`2 to 6
`
`MIN
`1.9
`4.4
`5.9
`3.98
`5.48
`
`MAX
`
`0.1
`0.1
`0.1
`0.26
`0.26
`±100
`8
`10
`
`3
`
`SN74HC153
`MIN
`MAX
`1.9
`4.4
`5.9
`3.84
`5.34
`
`0.1
`0.1
`0.1
`0.33
`0.33
`±1000
`80
`10
`
`0.1
`0.1
`0.1
`0.4
`0.4
`±1000
`160
`10
`
`PARAMETER
`
`TEST CONDITIONS(1)
`
`IOH = −20 μA
`
`IOH = −6 mA
`IOH = −7.8 mA
`
`IOL = 20 μA
`
`IOL = 6 mA
`IOL = 7.8 mA
`VI = VCC or 0
`VI = VCC or 0, IO = 0
`
`VOH
`
`VOL
`
`II
`ICC
`Ci
`
`(1)
`
`VI = VIH or VIL, unless otherwise noted.
`
`5.5 Switching Characteristics
`over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 6)
`SN54HC153
`SN74HC153
`TA = 25°C
`FROM
`TO
`PARAMETER
`VCC (V)
`(INPUT)
`(OUTPUT)
`TYP
`MIN
`MAX
`MIN
`MAX
`90
`225
`190
`21
`45
`38
`17
`38
`32
`73
`189
`158
`17
`42
`35
`14
`35
`29
`38
`150
`125
`11
`28
`24
`9
`24
`20
`20
`90
`75
`8
`18
`15
`6
`15
`13
`
`MIN
`
`2
`4.5
`6
`2
`4.5
`6
`2
`4.5
`6
`2
`4.5
`6
`
`MAX
`150
`30
`26
`126
`28
`23
`95
`19
`16
`60
`12
`10
`
`A or B
`
`Data
`(Any C)
`
`G
`
`Y
`
`Y
`
`Y
`
`Y
`
`tpd
`
`tt
`
`UNIT
`
`V
`
`V
`
`nA
`μA
`pF
`
`UNIT
`
`ns
`
`ns
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Submit Document Feedback
`
`5
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 5 of 31
`
`

`

`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`www.ti.com
`
`5.6 Switching Characteristics
`over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 6)
`SN54HC153
`SN74HC153
`TA = 25°C
`FROM
`TO
`PARAMETER
`VCC (V)
`(INPUT)
`(OUTPUT)
`TYP MAX
`MIN MAX
`MIN MAX
`105
`235
`355
`295
`27
`47
`71
`59
`21
`41
`60
`51
`93
`220
`335
`274
`23
`44
`67
`55
`19
`38
`57
`48
`60
`185
`280
`230
`17
`37
`56
`46
`14
`32
`48
`40
`45
`210
`315
`265
`17
`42
`63
`53
`13
`36
`53
`45
`
`MIN
`
`2
`4.5
`6
`2
`4.5
`6
`2
`4.5
`6
`2
`4.5
`6
`
`UNIT
`
`ns
`
`ns
`
`A or B
`
`Y
`
`Data
`(Any C)
`
`G
`
`tpd
`
`tt
`
`Y
`
`Y
`
`Y
`
`5.7 Operating Characteristics
`TA = 25℃
`
`Cpd
`
`PARAMETER
`Power dissipation capacitance per multiplexer
`
`TEST CONDITIONS
`No load
`
`TYP
`40
`
`UNIT
`pF
`
`6
`
`Submit Document Feedback
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 6 of 31
`
`

`

`www.ti.com
`
`6 Parameter Measurement Information
`tpd is the maximum between tPLH and tPHL
`
`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`Figure 6-1. Load Circuit
`
`Figure 6-2. Voltage Waveforms
`Propagation Delay and Output Transition Times
`
`Figure 6-3. Voltage Waveform
`Input Rise and Fall Times
`
`A. CL includes probe and jig capacitance.
`B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators
`having the following charactersitics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
`C. The outputs are measured one at a time with one input transition per measurement.
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Submit Document Feedback
`
`7
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 7 of 31
`
`

`

`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`www.ti.com
`
`7 Detailed Description
`7.1 Overview
`Each of these data selectors/multiplexers contains inverters and drivers to supply full binary decoding data
`selection to the AND-OR gates. Separate strobe (G) inputs are provided for each of the two 4-line sections.
`7.2 Functional Block Diagram
`
`Pin numbers are for the D, J, N, NS, PW, and W packages.
`
`8
`
`Submit Document Feedback
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 8 of 31
`
`

`

`www.ti.com
`
`7.3 Device Functional Modes
`
`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`SELECT(1)
`
`INPUTS
`DATA
`
`B
`X
`L
`L
`L
`L
`H
`H
`H
`H
`
`A
`X
`L
`L
`H
`H
`L
`L
`H
`H
`
`C0
`X
`L
`H
`X
`X
`X
`X
`X
`X
`
`C1
`X
`X
`X
`L
`H
`X
`X
`X
`X
`
`C2
`X
`X
`X
`X
`X
`L
`H
`X
`X
`
`C3
`X
`X
`X
`X
`X
`X
`X
`L
`H
`
`(1)
`
`Select inputs A and B are common to both sections.
`
`G
`
`H
`L
`L
`L
`L
`L
`L
`L
`L
`
`OUTPUT Y
`
`L
`L
`H
`L
`H
`L
`H
`L
`H
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Submit Document Feedback
`
`9
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 9 of 31
`
`

`

`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`www.ti.com
`
`8 Power Supply Recommendations
`The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
`Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power
`disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps
`to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The
`bypass capacitor should be installed as close to the power terminal as possible for best results.
`9 Layout
`9.1 Layout Guidelines
`When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many
`cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a
`triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left
`unconnected because the undefined voltages at the outside connections result in undefined operational states.
`All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the
`input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular
`unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever
`makes more sense for the logic function or is more convenient.
`
`10
`
`Submit Document Feedback
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 10 of 31
`
`

`

`www.ti.com
`
`SN54HC153, SN74HC153
`SCLS112E – DECEMBER 1982 – REVISED FEBRUARY 2022
`
`10 Device and Documentation Support
`TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
`generate code, and develop solutions are listed below.
`10.1 Receiving Notification of Documentation Updates
`To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
`Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
`change details, review the revision history included in any revised document.
`10.2 Support Resources
`TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
`from the experts. Search existing answers or ask your own question to get the quick design help you need.
`Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
`not necessarily reflect TI's views; see TI's Terms of Use.
`10.3 Trademarks
`TI E2E™ is a trademark of Texas Instruments.
`All trademarks are the property of their respective owners.
`10.4 Electrostatic Discharge Caution
`This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
`with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
`ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
`be more susceptible to damage because very small parametric changes could cause the device not to meet its published
`specifications.
`
`10.5 Glossary
`This glossary lists and explains terms, acronyms, and definitions.
`TI Glossary
`11 Mechanical, Packaging, and Orderable Information
`The following pages include mechanical, packaging, and orderable information. This information is the most
`current data available for the designated devices. This data is subject to change without notice and revision of
`this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
`
`Copyright © 2022 Texas Instruments Incorporated
`
`Submit Document Feedback
`
`11
`
`Product Folder Links: SN54HC153 SN74HC153
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 11 of 31
`
`

`

`PACKAGE OPTION ADDENDUM
`
`14-Oct-2022
`
`MSL Peak Temp
`(3)
`
`Op Temp (°C)
`
`Device Marking
`(4/5)
`
`Samples
`
`N / A for Pkg Type
`
`-55 to 125
`
`5962-8409301VE
`
`Lead finish/
`Ball material
`(6)
`SNPB
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`AS
`
`NV54HC153J
`5962-8409301VF
`
`AS
`
`NV54HC153W
`84093012A
`SNJ54HC
`153FK
`8409301EA
`SNJ54HC153J
`SN54HC153J
`
`HC153
`
`HC153
`
`SNPB
`
`N / A for Pkg Type
`
`-55 to 125
`
`SNPB
`
`N / A for Pkg Type
`
`-55 to 125
`
`SNPB
`
`SNPB
`
`N / A for Pkg Type
`
`-55 to 125
`
`N / A for Pkg Type
`
`-55 to 125
`
`NIPDAU
`
`Level-1-260C-UNLIM
`
`-40 to 85
`
`www.ti.com
`
`PACKAGING INFORMATION
`
`Orderable Device
`
`Status
`(1)
`
`Package Type Package
`Drawing
`
`Pins Package
`Qty
`
`Eco Plan
`(2)
`
`5962-8409301VEA
`
`ACTIVE
`
`CDIP
`
`J
`
`16
`
`25
`
`5962-8409301VFA
`
`ACTIVE
`
`CFP
`
`W
`
`16
`
`25
`
`84093012A
`
`ACTIVE
`
`LCCC
`
`FK
`
`20
`
`8409301EA
`
`ACTIVE
`
`CDIP
`
`SN54HC153J
`
`ACTIVE
`
`CDIP
`
`SN74HC153D
`
`SN74HC153DR
`
`ACTIVE
`
`ACTIVE
`
`SOIC
`
`SOIC
`
`J
`
`J
`
`D
`
`D
`
`16
`
`16
`
`16
`
`16
`
`16
`
`1
`
`1
`
`1
`
`40
`
`Non-RoHS
`& Green
`
`Non-RoHS
`& Green
`
`Non-RoHS
`& Green
`
`Non-RoHS
`& Green
`Non-RoHS
`& Green
`RoHS & Green
`
`2500 RoHS & Green
`
`NIPDAU | SN
`
`Level-1-260C-UNLIM
`
`-40 to 85
`
`2500
`
`TBD
`
`Call TI
`
`Call TI
`
`-40 to 85
`
`SN74HC153DRE4
`
`ACTIVE
`
`SOIC
`
`SN74HC153N
`
`SN74HC153NE4
`
`SN74HC153NSR
`
`ACTIVE
`
`ACTIVE
`
`ACTIVE
`
`PDIP
`
`PDIP
`
`SO
`
`SN74HC153PW
`
`ACTIVE
`
`TSSOP
`
`SN74HC153PWR
`
`ACTIVE
`
`TSSOP
`
`SN74HC153PWT
`
`ACTIVE
`
`TSSOP
`
`SNJ54HC153FK
`
`ACTIVE
`
`LCCC
`
`D
`
`N
`
`N
`
`NS
`
`PW
`
`PW
`
`PW
`
`FK
`
`SNJ54HC153J
`
`ACTIVE
`
`CDIP
`
`J
`
`
`
`16
`
`16
`
`16
`
`16
`
`16
`
`16
`
`20
`
`16
`
`25
`
`25
`
`RoHS & Green
`
`NIPDAU
`
`N / A for Pkg Type
`
`-40 to 85
`
`SN74HC153N
`
`RoHS & Green
`
`NIPDAU
`
`N / A for Pkg Type
`
`-40 to 85
`
`SN74HC153N
`
`2000 RoHS & Green
`
`NIPDAU
`
`Level-1-260C-UNLIM
`
`-40 to 85
`
`90
`
`RoHS & Green
`
`NIPDAU
`
`Level-1-260C-UNLIM
`
`-40 to 85
`
`2000 RoHS & Green
`
`NIPDAU | SN
`
`Level-1-260C-UNLIM
`
`-40 to 85
`
`250
`
`RoHS & Green
`
`NIPDAU
`
`Level-1-260C-UNLIM
`
`-40 to 85
`
`1
`
`1
`
`Non-RoHS
`& Green
`
`Non-RoHS
`& Green
`
`SNPB
`
`N / A for Pkg Type
`
`-55 to 125
`
`SNPB
`
`N / A for Pkg Type
`
`-55 to 125
`
`HC153
`
`HC153
`
`HC153
`
`HC153
`
`84093012A
`SNJ54HC
`153FK
`8409301EA
`SNJ54HC153J
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Samples
`
`Addendum-Page 1
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 12 of 31
`
`

`

`www.ti.com
`
`PACKAGE OPTION ADDENDUM
`
`14-Oct-2022
`
`(1) The marketing status values are defined as follows:
`ACTIVE: Product device recommended for new designs.
`LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
`NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
`PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
`OBSOLETE: TI has discontinued the production of the device.
`
`(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
`do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
`reference these types of products as "Pb-Free".
`RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
`Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
`flame retardants must also meet the <=1000ppm threshold requirement.
`
`(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
`
`(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
`
`(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
`of the previous line and the two combined represent the entire Device Marking for that device.
`
`(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
`lines if the finish value exceeds the maximum column width.
`
`Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
`provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
`continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
`TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
`
`In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
`
` OTHER QUALIFIED VERSIONS OF SN54HC153, SN54HC153-SP, SN74HC153 :
`• Catalog : SN74HC153, SN54HC153
`
`• Military : SN54HC153
`
`• Space : SN54HC153-SP
`
`Addendum-Page 2
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 13 of 31
`
`

`

`www.ti.com
`
` NOTE: Qualified Version Definitions:
`• Catalog - TI's standard catalog product
`
`• Military - QML certified for Military and Defense Applications
`
`• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
`
`PACKAGE OPTION ADDENDUM
`
`14-Oct-2022
`
`Addendum-Page 3
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 14 of 31
`
`

`

`
`www.ti.com
`
`
`
`TAPE AND REEL INFORMATION
`
`REEL DIMENSIONS
`
`PACKAGE MATERIALS INFORMATION
`
`17-Aug-2022
`
`TAPE DIMENSIONS
` P1
`
`K0
`
`B0 W
`
`Reel
`Diameter
`
`Cavity
`
`A0
`
`A0
`B0
`K0
`W
`P1
`
`Dimension designed to accommodate the component width
`Dimension designed to accommodate the component length
`Dimension designed to accommodate the component thickness
`Overall width of the carrier tape
`Pitch between successive cavity centers
`
`Reel Width (W1)
`QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
`
`Sprocket Holes
`
`Q1
`
`Q2
`
`Q1
`
`Q2
`
`Q3
`
`Q4
`
`Q3
`
`Q4
`
`User Direction of Feed
`
`Pocket Quadrants
`
`
`*All dimensions are nominal
`Device
`
`SN74HC153DR
`SN74HC153DR
`SN74HC153DR
`SN74HC153NSR
`SN74HC153PWR
`SN74HC153PWR
`SN74HC153PWR
`SN74HC153PWT
`
`Package
`Type
`
`Package
`Drawing
`
`Pins
`
`SPQ
`
`SOIC
`SOIC
`SOIC
`SO
`TSSOP
`TSSOP
`TSSOP
`TSSOP
`
`D
`D
`D
`NS
`PW
`PW
`PW
`PW
`
`16
`16
`16
`16
`16
`16
`16
`16
`
`2500
`2500
`2500
`2000
`2000
`2000
`2000
`250
`
`Reel
`Diameter
`(mm)
`330.0
`330.0
`330.0
`330.0
`330.0
`330.0
`330.0
`330.0
`
`Reel
`Width
`W1 (mm)
`16.4
`16.4
`16.4
`16.4
`12.4
`12.4
`12.4
`12.4
`
`A0
`(mm)
`
`B0
`(mm)
`
`K0
`(mm)
`
`P1
`(mm)
`
`W
`(mm)
`
`Pin1
`Quadrant
`
`6.5
`6.5
`6.6
`8.2
`6.9
`6.9
`6.85
`6.9
`
`10.3
`10.3
`9.3
`10.5
`5.6
`5.6
`5.45
`5.6
`
`2.1
`2.1
`2.1
`2.5
`1.6
`1.6
`1.6
`1.6
`
`8.0
`8.0
`8.0
`12.0
`8.0
`8.0
`8.0
`8.0
`
`16.0
`16.0
`16.0
`16.0
`12.0
`12.0
`12.0
`12.0
`
`Q1
`Q1
`Q1
`Q1
`Q1
`Q1
`Q1
`Q1
`
`Pack Materials-Page 1
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 15 of 31
`
`

`

`
`www.ti.com
`
`
`
`TAPE AND REEL BOX DIMENSIONS
`
`PACKAGE MATERIALS INFORMATION
`
`17-Aug-2022
`
`Width (mm)
`
`H
`
`W
`
`L
`
`
`*All dimensions are nominal
`Device
`
`SN74HC153DR
`SN74HC153DR
`SN74HC153DR
`SN74HC153NSR
`SN74HC153PWR
`SN74HC153PWR
`SN74HC153PWR
`SN74HC153PWT
`
`Package Type
`
`Package Drawing Pins
`
`SOIC
`SOIC
`SOIC
`SO
`TSSOP
`TSSOP
`TSSOP
`TSSOP
`
`D
`D
`D
`NS
`PW
`PW
`PW
`PW
`
`16
`16
`16
`16
`16
`16
`16
`16
`
`SPQ
`
`2500
`2500
`2500
`2000
`2000
`2000
`2000
`250
`
`Length (mm) Width (mm) Height (mm)
`
`340.5
`356.0
`366.0
`356.0
`356.0
`356.0
`366.0
`356.0
`
`336.1
`356.0
`364.0
`356.0
`356.0
`356.0
`364.0
`356.0
`
`32.0
`35.0
`50.0
`35.0
`35.0
`35.0
`50.0
`35.0
`
`Pack Materials-Page 2
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 16 of 31
`
`

`

`PACKAGE MATERIALS INFORMATION
`
`17-Aug-2022
`
`L - Tube length
`
`
`www.ti.com
`
`
`
`TUBE
`
`
`
`T - Tube
`height
`
`W - Tube
`width
`
`B - Alignment groove width
`
`
`
`*All dimensions are nominal
`Device
`
`5962-8409301VFA
`84093012A
`SN74HC153D
`SN74HC153N
`SN74HC153N
`SN74HC153NE4
`SN74HC153NE4
`SN74HC153PW
`SNJ54HC153FK
`
`Package Name Package Type
`
`Pins
`
`SPQ
`
`L (mm) W (mm)
`
`T (µm)
`
`B (mm)
`
`W
`FK
`D
`N
`N
`N
`N
`PW
`FK
`
`CFP
`LCCC
`SOIC
`PDIP
`PDIP
`PDIP
`PDIP
`TSSOP
`LCCC
`
`16
`20
`16
`16
`16
`16
`16
`16
`20
`
`25
`1
`40
`25
`25
`25
`25
`90
`1
`
`506.98
`506.98
`507
`506
`506
`506
`506
`530
`506.98
`
`26.16
`12.06
`8
`13.97
`13.97
`13.97
`13.97
`10.2
`12.06
`
`6220
`2030
`3940
`11230
`11230
`11230
`11230
`3600
`2030
`
`NA
`NA
`4.32
`4.32
`4.32
`4.32
`4.32
`3.5
`NA
`
`Pack Materials-Page 3
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 17 of 31
`
`

`

`PACKAGE OUTLINE
`SOP - 2.00 mm max height
`SOP
`
`C
`
`SEATING PLANE
`
`0.1 C
`
`NS0016A
`
`SCALE 1.500
`
`A
`
`1
`
`10.4
`10.0
`NOTE 3
`
`8.2
`7.4 TYP
`
`PIN 1 ID
`AREA
`
`14X 1.27
`
`16
`
`2X
`8.89
`
`8
`
`B
`
`5.4
`5.2
`NOTE 4
`
`9
`
`16X 0.51
`0.35
`0.25
`
`C A B
`
`2.00 MAX
`
`0.15 TYP
`
` SEE DETAIL A
`
`0.25
`GAGE PLANE
`
`0.3
`0.1
`
`0 - 10
`
`1.05
`0.55
`
`DETAIL A
`TYPICAL
`
`(1.25)
`
`4220735/A 12/2021
`
`NOTES:
`
`1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
` per ASME Y14.5M.
`2. This drawing is subject to change without notice.
`3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
` exceed 0.15 mm, per side.
`4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
`
`
`
`www.ti.com
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 18 of 31
`
`

`

`NS0016A
`
`EXAMPLE BOARD LAYOUT
`SOP - 2.00 mm max height
`SOP
`
`16X (1.85)
`
`SYMM
`
`1
`
`8
`
`16X (0.6)
`
`14X (1.27)
`
`(R0.05) TYP
`
`SEE
`DETAILS
`
`16
`
`SYMM
`
`9
`
`(7)
`
`LAND PATTERN EXAMPLE
`SCALE:7X
`
`METAL
`
`SOLDER MASK
`OPENING
`
`SOLDER MASK
`OPENING
`
`METAL
`
`0.07 MAX
`ALL AROUND
`
`NON SOLDER MASK
`DEFINED
`
`0.07 MIN
`ALL AROUND
`
`SOLDER MASK
`DEFINED
`
`SOLDER MASK DETAILS
`
`4220735/A 12/2021
`
`NOTES: (continued)
`
`5. Publication IPC-7351 may have alternate designs.
`6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
`
`
`www.ti.com
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 19 of 31
`
`

`

`NS0016A
`
`EXAMPLE STENCIL DESIGN
`SOP - 2.00 mm max height
`SOP
`
`16X (1.85)
`
`SYMM
`
`16X (0.6)
`
`14X (1.27)
`
`1
`
`8
`
`(R0.05) TYP
`
`(7)
`
`SOLDER PASTE EXAMPLE
`BASED ON 0.125 mm THICK STENCIL
`SCALE:7X
`
`SYMM
`
`16
`
`9
`
`NOTES: (continued)
`
`7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
` design recommendations.
`8. Board assembly site may have different recommendations for stencil design.
`
`
`4220735/A 12/2021
`
`www.ti.com
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 20 of 31
`
`

`

`Smart Mobile Technologies LLC, Exhibit 2007
`Page 21 of 31
`
`

`

`Smart Mobile Technologies LLC, Exhibit 2007
`Page 22 of 31
`
`

`

`Smart Mobile Technologies LLC, Exhibit 2007
`Page 23 of 31
`
`

`

`PW0016A
`
`SCALE 2.500
`
`PACKAGE OUTLINE
`TSSOP - 1.2 mm max height
`SMALL OUTLINE PACKAGE
`
`C
`
`SEATING
`PLANE
`
`0.1 C
`
`A
`
`1
`
`5.1
`4.9
`NOTE 3
`
`8
`
`B
`
`6.6
`6.2
`
` TYP
`
`PIN 1 INDEX AREA
`
`14X 0.65
`
`16
`
`2X
`4.55
`
`4.5
`4.3
`NOTE 4
`
`9
`
`16X 0.30
`0.19
`0.1
`
`C A B
`
`1.2 MAX
`
`SEE DETAIL A
`
`(0.15) TYP
`
`0.25
`GAGE PLANE
`
`0.15
`0.05
`
`0.75
`0.50
`
`-80
`
`A 20DETAIL A
`TYPICAL
`
`4220204/A 02/2017
`
`NOTES:
`
`1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
` per ASME Y14.5M.
`2. This drawing is subject to change without notice.
`3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
` exceed 0.15 mm per side.
`4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
`5. Reference JEDEC registration MO-153.
`
`
`www.ti.com
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 24 of 31
`
`

`

`PW0016A
`
`EXAMPLE BOARD LAYOUT
`TSSOP - 1.2 mm max height
`SMALL OUTLINE PACKAGE
`
`16X (1.5)
`
`SYMM
`
`1
`16X (0.45)
`
`14X (0.65)
`
`8
`
`(R0.05) TYP
`
`SYMM
`
`16
`
`9
`
`(5.8)
`
`LAND PATTERN EXAMPLE
`EXPOSED METAL SHOWN
`SCALE: 10X
`
`SOLDER MASK
`OPENING
`
`METAL
`
`METAL UNDER
`SOLDER MASK
`
`SOLDER MASK
`OPENING
`
`EXPOSED METAL
`
`EXPOSED METAL
`
`0.05 MAX
`ALL AROUND
`
`NON-SOLDER MASK
`DEFINED
`(PREFERRED)
`
`SOLDER MASK DETAILS
`
`15.000
`
`0.05 MIN
`ALL AROUND
`
`SOLDER MASK
`DEFINED
`
`NOTES: (continued)
`
`6. Publication IPC-7351 may have alternate designs.
`7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
`
`
`4220204/A 02/2017
`
`www.ti.com
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 25 of 31
`
`

`

`PW0016A
`
`EXAMPLE STENCIL DESIGN
`TSSOP - 1.2 mm max height
`SMALL OUTLINE PACKAGE
`
`16X (1.5)
`
`SYMM
`
`1
`16X (0.45)
`
`14X (0.65)
`
`8
`
`(R0.05) TYP
`
`16
`
`SYMM
`
`9
`
`(5.8)
`
`SOLDER PASTE EXAMPLE
`BASED ON 0.125 mm THICK STENCIL
`SCALE: 10X
`
`NOTES: (continued)
`
`8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
` design recommendations.
`9. Board assembly site may have different recommendations for stencil design.
`
`
`4220204/A 02/2017
`
`www.ti.com
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 26 of 31
`
`

`

`Smart Mobile Technologies LLC, Exhibit 2007
`Page 27 of 31
`
`

`

`Smart Mobile Technologies LLC, Exhibit 2007
`Page 28 of 31
`
`

`

`Smart Mobile Technologies LLC, Exhibit 2007
`Page 29 of 31
`
`

`

`Smart Mobile Technologies LLC, Exhibit 2007
`Page 30 of 31
`
`

`

`IMPORTANT NOTICE AND DISCLAIMER
`TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
`DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
`AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
`IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
`PARTY INTELLECTUAL PROPERTY RIGHTS.
`These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
`TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
`standards, and any other safety, security, regulatory or other requirements.
`These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
`application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
`is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
`will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
`resources.
`TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
`such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
`TI products.
`TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
`
`Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
`Copyright © 2022, Texas Instruments Incorporated
`
`Smart Mobile Technologies LLC, Exhibit 2007
`Page 31 of 31
`
`