(12) United States Patent
`Riess et al.
`
`USOO6849837B2
`US 6,849,837 B2
`*Feb. 1, 2005
`
`(10) Patent No.:
`(45) Date of Patent:
`
`(54) METHOD OF ADHESIVE BONDING BY
`INDUCTION HEATING
`
`(56)
`
`(75) Inventors: Edward A. Riess, Cincinnati, OH (US);
`Adam G. Malofsky, Symmes
`Township, OH (US); John P. Barber,
`Kettering, OH (US); David P. Bauer,
`Xenia, OH (US)
`(73) Assignee: Nexicor LLC, Loveland, OH (US)
`(*) Notice:
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`This patent is Subject to a terminal dis
`claimer.
`
`(21) Appl. No.: 10/661,655
`(22) Filed:
`Sep. 12, 2003
`(65)
`Prior Publication Data
`US 2004/0050839 A1 Mar. 18, 2004
`Related U.S. Application Data
`(60) Continuation of application No. 10/302,158, filed on Nov.
`22, 2002, now Pat. No. 6,639,197, and a continuation of
`application No. 10/302.692, filed on Nov. 22, 2002, now Pat.
`No. 6,710,314, which is a division of application No.
`09/705,282, filed on Nov. 2, 2000, now Pat. No. 6,509,555.
`(60) Provisional application No. 60/163,301, filed on Nov. 3,
`1999.
`(51) Int. Cl. .................................................. H05B 6/10
`(52) U.S. Cl. ........................ 219/634; 219/633; 219/645
`(58) Field of Search ................................. 219/600-603,
`219/618, 633-635, 645; 156/272.2, 272.4,
`275.1, 275.3; 428/516–519, 521, 523
`
`References Cited
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`1,566,500 A 12/1925 Northrup
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`2,429,819 A 10/1947 Jordan
`(List continued on next page.)
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`
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`(List continued on next page.)
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`“Rapid Adhesive Bonding of Composites,” NASA Tech
`Brief, 2 pages (Jan./Feb. 1986).
`(List continued on next page.)
`Primary Examiner Tu Hoang
`(74) Attorney, Agent, or Firm-Frederick H. Gribbell, LLC
`(57)
`ABSTRACT
`A method for using magnetic fields to heat magnetically
`Susceptible materials within and/or adjacent to adhesives, So
`as to bond, bind, or fasten Solid materials to one another. The
`System uses alternating magnetic fields that induce eddy
`currents and generate heat within Susceptors. An induction
`heating tool is used to emit the magnetic field at its work
`coil, and an electronic controller measures the energy being
`used by a power converter that generates the alternating
`current driving the work coil which creates the magnetic
`field. The heating tool is used in a method of adhesive
`bonding in which the thickness of the conductive layer of the
`Susceptor is in the range of 0.01-3.0 mils, or the heating
`event time interval is in the range of 0.05-10.0 seconds, or
`the average power density of the magnetic field at the
`susceptor is in the range of 10-5000 Watts per square inch.
`20 Claims, 26 Drawing Sheets
`
`
`
`
`
`
`
`86O
`
`
`
`
`
`1 -870
`
`N
`ZZZZZZZZZZZZZZZZZZ
`SN NYNNYAN
`SUBSTRATE 5///...///
`YN
`
`85O
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0001
`
`

`

`US 6,849.837 B2
`Page 2
`
`4,845,332
`4,847,746
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`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0002
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`

`US 6,849.837 B2
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`* cited by examiner
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0003
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0011
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 9 of 26
`
`US 6,849,837 B2
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0012
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0012
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`
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`
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`

`U.S. Patent
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`US 6,849,837 B2
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0013
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`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 11 of 26
`
`US 6,849,837 B2
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`4-OO
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0014
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 12 of 26
`
`US 6,849,837 B2
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0015
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0015
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 13 of 26
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`US 6,849,837 B2
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0016
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0016
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 14 of 26
`
`US 6,849,837 B2
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0017
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0017
`
`

`

`U.S. Patent
`
`Feb.1, 2005
`
`Sheet 15 of 26
`
`US 6,849,837 B2
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0018
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0018
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 16 of 26
`
`US 6,849,837 B2
`
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0019
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 17 of 26
`
`US 6,849,837 B2
`
`POWER APPLIED N-700
`7O2- NITIALIZE
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`TURN OFF FAN-NO
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`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0020
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 18 of 26
`
`US 6,849,837 B2
`
`734
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`RAMP STOPPNG
`CURRENT REACHED
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`INTERVAL
`TIME
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`
`
`
`COMPUTE
`POWER 8
`ACCUMULATE JOULES
`(D)
`
`764
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`(E)
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0021
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 19 of 26
`
`US 6,849,837 B2
`
`766
`
`YES
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`
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`p
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`
`TURN OFF BUCK;
`DISPLAY & STORE
`FAULT
`784
`
`TURN OFF RUNLIGHT;
`STORE FRING RESULTS
`
`(E)
`
`F.G. 17C
`
`(G)
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0022
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 20 of 26
`
`US 6,849,837 B2
`
`
`
`786
`NO/WORKLIGHNYES
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`TURN ON
`WORKLIGHT
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`EXPRED
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`
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`YES
`
`
`
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`
`
`
`798
`
`F.G. 1 7D
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0023
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`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 21 of 26
`
`US 6,849,837 B2
`
`3O4.
`
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`NSULATIVE
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`NSULATIVE
`LAYER
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0024
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 22 of 26
`
`US 6,849,837 B2
`
`
`
`
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`1.
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`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0025
`
`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 23 of 26
`
`US 6,849,837 B2
`
`
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0026
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`

`

`U.S. Patent
`
`Feb. 1, 2005
`
`Sheet 24 of 26
`
`US 6,849,837 B2
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`
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0027
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0027
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`

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`U.S. Patent
`
`Feb.1, 2005
`
`Sheet 25 of 26
`
`
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0028
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0028
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`

`

`U.S. Patent
`
`US 6,849,837 B2
`
`
`
`GOOGLE AND SAMSUNG EXHIBIT 1011, 0029
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`

`

`US 6,849,837 B2
`
`1
`METHOD OF ADHESIVE BONDING BY
`INDUCTION HEATING
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`The present application is a continuation of applications
`Ser. No. 10/302,158, titled METHOD OF ADHESIVE
`BONDING BY INDUCTION HEATING, filed on Nov. 22,
`2002 now U.S. Pat. No. 6,639,197, and Ser. No. 10/302,692,
`titled INTEGRAL HAND-HELD INDUCTION HEATING
`TOOL, filed on Nov. 22, 2002 now U.S. Pat. No. 6,710,314;
`which are divisional applications of Ser. No. 09/705,282,
`filed on Nov. 2, 2000, now U.S. Pat. No. 6,509,555; which
`claims priority to provisional application, Ser. No. 60/163,
`301, filed on Nov. 3, 1999.
`
`15
`
`TECHNICAL FIELD
`The present invention relates generally to induction heat
`ing equipment and is particularly directed to a hand held
`induction tool of the type which produces a magnetic field
`in a predetermined direction. The invention is specifically
`disclosed as an induction heating tool that induces eddy
`currents in thin foil Susceptors to raise the temperature of the
`Susceptors to melt or Soften an adhesive coating on the
`Susceptor's Surface, for bonding trim to wallboard.
`
`25
`
`2
`It should be noted that the ideal adhesive system is one
`where the adhesive cures on demand, is reversible on
`demand, has unlimited shelf life, has no VOC's (volatile
`organic compounds), and is safe and easy to handle.
`Currently, the only Such Systems that exist are the light
`curable Systems, such as those employing UV (ultraViolet)
`and visible light. UV and visible light systems are unique in
`today's adhesives world. They are liquid Systems that cure
`only upon exposure to light. Optically transparent parts can
`be bonded in seconds or less to virtually any substrate. Such
`Systems, where useful, have virtually replaced all other
`adhesive or mechanical fastening Systems. An example
`would be automotive headlamp assemblies that do not need
`to be disassembled. It should be noted that UV-curable
`adhesives involve chemical handling and are not currently
`reversible.
`There are two basic types of adhesive Systems: one group
`of Systems allows for pre-positioning of the parts to be
`bonded, yet by default, requires long cure times; the other
`group of Systems provides very short, almost instantaneous
`cure times, but yet prevents pre-positioning of the parts.
`Before describing Some of the major adhesive Systems
`available, one should be aware of the following general
`application notes that affect adhesive utility.
`(1) Many product assembly sites are often dirty and
`difficult to keep clean. Certain adhesive Systems cannot
`handle Such situations.
`(2) Temperature fluctuations at many assembly sites could
`be extreme, whether for an interior or exterior application.
`For example, a new home being built in the middle of the
`winter could see interior temperatures below 0° F. Exterior
`applications could easily See temperatures even lower.
`Another typical example could involve automotive body
`repair, if done inside a non-heated building.
`(3) Where humidity may be important, it is clear that the
`humidity around a manufacturing facility in Arizona would
`be far lower than that in and around a facility in Florida.
`(4) The ability to directly heat many product components
`to cure adhesives is extremely limited, particularly as many
`plastic components can melt, and wood-based or cellulose
`based millwork can burn.
`One family of fast-curing adhesives is called “Super
`glues” (cyanoacrylates). These adhesives allow for an
`extremely rapid adhesive Setting, but cannot in any way be
`pre-positioned before placement as the adhesive cures dur
`ing positioning. Thus, there is no room for error. These
`adhesives are generally the most expensive adhesives.
`Furthermore, they are difficult to handle, and have a limited
`shelf life. Finally, there is no way to easily reverse
`cyanoacrylate, or Super glue, bonds. Companies in this
`industry include Loctite Corporation, Henkel A.G., and
`National Starch.
`Another instant adhesive technology, not often employed
`in Structural applications, is pressure-Sensitive adhesive
`(PSA) tapes. Like Super glues, such products allow for
`extremely rapid adhesive bonding, but again, are extremely
`limited with regard to pre-positioning and, as with the
`“Superglues, again, there is no room for error. Furthermore,
`preSSure-Sensitive adhesives are limited in their ultimate
`Strengths unless they are thermosetting. In the case of a
`thermosetting PSA, some form of heat- or moisture
`activation is required which is generally impractical for
`non-heat-resistant products, or where humidity controls are
`unavailable.
`The latter two above thermosetting processes are time
`intensive. Even more importantly, pressure Sensitive adhe
`
`BACKGROUND OF THE INVENTION
`Historically, bonding materials quickly without use of
`mechanical fastenerS has been quite difficult. Some of the
`problem areas which exist include: assembly time, cost of
`materials and labor, quality of the bond between component
`Structures being assembled, reliability of the process of
`assembly, the typical requirement of fairly difficult finishing
`Steps, convenience (or lack thereof) of use for the end-users,
`worker Safety issues, and the difficulty in maintaining a good
`quality of appearance of the finished goods.
`In the 1940’s, mechanical fasteners dominated the assem
`bly industry, and adhesives were not as important to industry
`during this period. From the 1930's through World War II,
`the United States and Germany began to develop plastics
`and adhesives technology in response to the growing Scar
`city of natural products. In many cases, particularly early on,
`adhesives have been used either in combination with
`mechanical fasteners or where no mechanical fastener could
`be effectively employed. Beginning in the 1950s, the mod
`ern adhesives industry began to develop. Some of today's
`more common adhesive Systems, developed at that time,
`included heat-curable thermosets (epoxies), thermoplastic
`hot melts, pressure-sensitive adhesives (PSAs), contact
`cements, water-based wood glues, and the Super glues
`(cyanoacrylates). These were major disruptive technologies
`that have evolved over the last 45 years and which have
`Slowly grown the fastening market and have significantly
`replaced traditional mechanical fasteners in many markets.
`Adhesive bonding is generally Superior to mechanical
`fastening, but present technology doesn't allow for cost
`effective pre-positioning and rapid development of a Strong
`bond on demand with one Step. Pre-positioning of
`components, prior to fastening, is very important, particu
`larly in non-automated assembly Systems. Millwork is an
`excellent example of Such an assembly System. No current
`adhesive System allows for pre-positioning coupled with
`instantaneous bonding. Most of today's adhesives are slow
`to cure, requiring minutes to hours, thus requiring clamping
`and other direct personal attention by the installer.
`
`35
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`40
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`45
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`50
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`55
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`60
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`65
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`GOOGLE AND SAMSUNG EXHIBIT 1011, 0030
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`

`3
`Sives can be applied only in very narrow temperature ranges,
`typically from 55° F to 90° F. Furthermore, above 90° F.,
`many common PSA's weaken dramatically. As a further
`note on PSAs, they are incapable of flow without heat to
`accommodate uneven Surfaces, and if exposed to dust or
`other particulates, they immediately lose much of their
`potential adhesive Strength. Finally, it is extremely difficult,
`if not impossible in most cases, to disassemble parts that use
`PSAs. Examples of companies that manufacture PSA's are
`3M and Avery-Dennison, which are the two largest of the
`group. The cost of PSA's can range from being Some of the
`most inexpensive to Some of the most expensive adhesives
`available today.
`Hot melt adhesives are another example of an instanta
`neous or fast-cure System that Significantly limits the ability
`to pre-position parts. Such adhesives are melted either in a
`large tank or in a Small glue gun and are then dispensed as
`a molten material onto the parts. The parts are then quickly
`mated, and the bond forms as the adhesive cools. The
`cooling process can be as short as a few Seconds to possibly
`as long as ten or twenty Seconds. AS with the other instan
`taneous adhesives, there is little room for error, particularly
`where a clean and thin bond line is desired. Such limitations
`are the reasons that hot melt adhesives are used most
`extensively in the packaging industry and also for bonding
`Small parts or Surface areas. They are particularly useful in
`highly automated production Systems, Such as for Sealing
`cereal boxes. Furthermore, Such adhesives cannot be
`reheated after product assembly without significantly or
`entirely heating the product assembly.
`On the positive side, hot melt adhesives are one
`component, Solid-State, Zero VOC Systems that have indefi
`nite Shelf life and, for the most part, are considered as
`plastics for regulatory and Safety purposes. Furthermore,
`most hot melt adhesives are moderate to low in cost,
`especially when compared to the Super glueS or the light
`curable adhesives. Examples of Some leading hot melt
`manufacturers are Henkel A.G., Jowat, National Starch,
`H.B. Fuller, and Ato-Findley.
`Other types of adhesive Systems are those which are
`pre-positionable, but have long cure times. The most well
`known pre-positionable adhesives are the epoxies. Epoxy
`adhesives generally have slow cure times, usually on the
`order of minutes to hours, or even days. Most epoxies are
`two-part Systems that, when mixed, become activated and
`cure. The catalysts are in one or both parts and their
`concentrations determine how quickly the epoxy adhesive
`will cure. In fact, if enough catalyst is added, epoxies can
`become instantaneous Systems that are not pre-positionable.
`Epoxies are not difficult to handle, but do require Special
`care as exposure can Sometimes be detrimental to human
`health (causing skin irritations and burning).
`Epoxies are among the Strongest adhesives known, but
`require heat to achieve ultimate Strength. A major problem
`with two-part epoxies is that cure time can vary dramatically
`with temperature. In fact, Some Systems cure So rapidly at
`temperatures above 90 F. that they become almost unus
`able. At colder temperatures, e.g., below 60 F., Some
`Systems may take days or more to cure. There also are
`one-component epoxies that cure only upon exposure to
`heat. Once heated, many one-component Systems can cure in
`less than one minute. Epoxy bonds cannot be easily
`reversed. Examples of leading epoxy manufacturers include
`Ciba-Giegy, Shell Chemical, Henkel A.G., and Loctite.
`Urethanes are another well-known, pre-positionable
`adhesive group. Like the epoxies, there are both two-part
`
`15
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`25
`
`35
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`40
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`45
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`50
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`55
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`US 6,849,837 B2
`
`4
`and one-part Systems. After epoxies, urethanes are probably
`the Second Strongest class of commonly used adhesives.
`Two-part Systems are the most common and generally take
`minutes to hours to cure. There are many one-part Systems
`becoming available today which are moisture-curable (the
`moisture is actually a second part). Both Systems have the
`problem that one component of the two, the isocyanate, is
`moisture-Sensitive. If water gets into the adhesive, or if the
`humidity is too high, the isocyanate will react with the water,
`generate a gas, and cause foaming to occur. Even worse, if
`the moisture gets into a container unbeknownst to the user,
`and the container is then closed, the container can explode.
`AS a result, two-component and moisture-cure urethanes are
`generally only used by Skilled or specially trained perSonnel.
`Furthermore, because of their reactive nature and environ
`mental Susceptibility, most urethane adhesive Systems
`require Specialized mixing and dispensing equipment that
`must be cleaned on a frequent basis.
`The primary advantage of most urethane adhesives is the
`availability of room temperature, moisture-curing, one-part
`Systems that possess an overall lower application Viscosity.
`This is as opposed to a two-part, room temperature epoxy
`that must be mixed, or a one-component hot melt that must
`be melted. Applications for urethane adhesives range from
`automotive assembly, to marine and aerospace assembly, to
`the millwork, furniture, and cabinetry industries.
`It is important to note that certain adhesives have already
`been used with induction devices for many years. For
`example, Such technologies are used for high Strength bonds
`using relatively long cure-time (fifteen minutes to hours)
`adhesives. Furthermore, this technology generally employs
`high pressures to facilitate bond formation. This technology
`is used, for example, by Boeing, in the construction of
`composite-based passenger aircraft. The adhesive Systems
`employed by Boeing are mainly epoxies. Such adhesives
`must be pre-positionable, and further must be cured over a
`long period of time because of the Strict performance
`requirements mandated by the government for passenger
`and military aircraft.
`Another company that employs similar technology is
`Emabond, a subsidiary of Ashland Chemical. Emabond
`develops the same types of long-time-cure adhesives
`(epoxies) as does Boeing, however, Emabond employs par
`ticulate Susceptors which activate at higher frequencies that
`require operator Shielding for Safety. Emabond equipment is
`primarily geared toward automotive component assembly. A
`Special piece of induction equipment is typically required for
`any two automotive components to be assembled.
`Emabond employs a number of adhesive technologies,
`including epoxies, urethanes, and hot melt adhesives. Most
`of the adhesive Systems used by Emabond are heat-activated
`by particulate Susceptors, not foil Susceptors, at higher
`frequencies that are known to be dangerous to human health
`(e.g., above 5 MHz). Moreover, the Emabond systems,
`primarily for the automotive industry, are part specific and
`are designed to bond generally irregular Surfaces. The par
`ticulate SusceptorS allow for the use of liquid adhesives that
`can easily conform to these irregularities.
`One method of bonding Structures together utilizes Sus
`ceptors made of an electrically conductive material that is
`heating by an alternating magnetic field to activate an
`adhesive material that resides on at least one Surface of the
`Susceptor. The magnetic field induces el