muito):OldSN691Zh
`
`DannyL. Williams
`Terry D. Morgan
`J. Mike Amerson
`Kenneth D. Goodman
`Jeffrey A. Pyle
`Jaison C. John
`RubenS.Bains
`Paul R. Juhasz
`
`WILLIAMS, MORGAN & AMERSON,P.C.
`10333 RICHMOND, STE. 1100, HOUSTON, TEXAS 77042
`(713) 934-7000
`FAX: (713) 934-701 I
`
`113013U.S.PTO11/151098
`
`Raymund F.Eich, Ph.D.*
`MarkW.Sincell, Ph.D.*
`Sanjeev K. Singh, Ph.D.*
`
`*Patent Agent
`
`Writer's Direct Dial:
`FILE:—2000.079600
`713.934.4053
`June 13, 2005
`
`Customer No. 23720
`
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA 22313-1450
`
`EXPRESS MAIL MAILING LABEL
`
`NUMBEREV512318925US
`DATEOF DEPOSIT June 13, 2005
`I hereby certify that this paper or fee is being deposited with the
`United States Postal Service with sufficient postage "EXPRESS
`MAIL POST OFFICE TO ADDRESSEE"service under 37 C.F.R.
`1.10
`on the date
`indicated above
`and is
`addressed to:
`Commissioner for Patents, PO Box 1450, Alexandria, VA 22313-
`
`1450 by:
`
`RE:
`
`U-SS. Patent Application Entitled “Agent Reactive Scheduling In An Automated
`Manufacturing Environment”
`Inventor(s): Gustavo Mata, Steven C. Nettles, Larry D. Barto, and Yiwei Li
`Client’s Reference: TT4739
`
`Sir:
`
`Transmitted herewith for filing are:
`
`‘
`
`(1) Request for Filing Continuation Application;
`(2) Preliminary Amendment;
`(3) Declaration;
`(4) 55-page patent specification with claims and an abstract (also Figures 1-7b on 6
`sheets);
`(5) Information Disclosure Statement and one reference.
`
`All correspondence, notices, official letters and other communications should be
`directed to Customer No. 23720,andall telephone calls should be directed to Jeffrey A. Pyle at
`(713) 934-4053.
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 1
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 1
`
`

`

`WILLIAMS, MORGAN & AMERSON, PC.
`Commissionerfor Patents
`June 13, 2005
`Page 2
`
`The Director is authorized to deduct the fee of $1,110 for filing this Continuation
`and any other fees required under 37 C.F.R. §§ 1.16 to 1.21 from Advanced Micro Devices,
`Inc. Deposit Account No. 01-0365/TT4739.'
`
`FILING FEE CALCULATION
`
`
`Total Claims
`$
`.
`Independent Claims
`2-3
`0
`orx $200 =
`$
`0.00
`
`
`Multiple Dependent Claim(s)
`or+$360= $
`0.00
`Basic Filing Fee:
`or + $300 =
`$ 300.00
`
`Search Fee:
`or+ $500 =
`$ 500.00
`
`Examination Fee:
`or + $200 =
`$ 200.00
`
`(for each add’1 50
`Application Size Fee:
`or+$250= $
`0.00
`
`pages over 100)
`
`Assignment Recording Fee:
`($40 per assignee)
`+
`=
`$
`0.00
`
`
`$1,
`TOTAL FILING FEES
`
`Pursuant to 37 C.F.R. § 1.10 the Applicants request that the Patent and Trademark Office-
`accept this application and accordaserial numberandfiling date as of the date this application is
`deposited with the U.S. Postal Service for Express Mail.
`
`Please date stamp and return the enclosed postcard to evidence receipt of these materials.
`
`Respectfully submitted,
`
`
`
`Reg. No. 34,90
`Attorney for Applicants
`
`Date: June 13, 2005
`
`WILLIAMS, MORGAN & AMERSON
`10333 Richmond Dr., Suite 1100
`Houston, Texas 77042
`(713) 934-4053 ph
`(713) 934-7011 fx
`
`the Director is authorized to withdraw funds from
`' In the event the monies in that account are insufficient,
`Williams, Morgan & Amerson, P.C. Deposit Account No. 50-0786/2000.079696.
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 2
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 2
`
`

`

`wu,Ld'S'flGob
`
`IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`
`PATENT
`
`hn re Applicationof:
`GUSTAVO MATAET AL.
`
`Group Art Unit: Unknown
`
`Serial No.: Unknown
`
`Examiner:
`
`Unknown
`
`
`
`Filed: Atty. Dkt.No.:—2000.079696/TT4739Herewith
`
`
`
`For: Agent Reactive Scheduling In An
`Automated Manufacturing Environment
`
`CUSTOMERNO.23720
`
`REQUEST FOR FILING CONTINUATION APPLICATION
`UNDER37 C.F.R.§ 1.53(b)
`
`EXPRESS MAIL MAILING LABEL
`NUMBER EV512318925US
`DATE OF DEPOSIT June 13, 2005
`I hereby certify that this paper or fee is being deposited
`with the United States Postal Service with sufficient
`postage
`"EXPRESS MAIL POST OFFICE TO
`ADDRESSEE"service under 37 C.F.R. 1.10 on the date
`indicated above and is addressed to: Commissioner for
`
`Commissioner for Patents
`P.O. Box 1450
`
`Alexandria, VA 22313-1450
`
`Dear Sir:
`
`This is a request for filing a continuation application under Rule 53(b) (37 C.F.R.
`
`§ 1.53(b)) of co-pending prior U. S. Patent No. 6,907,305 to be granted on June 14, 2005,
`
`entitled, “AGENT REACTIVE SCHEDULING IN AN AUTOMATED MANUFACTURING
`
`ENVIRONMENT.”
`
`x
`
`1.
`
`Enclosed is a copy of the prior application Serial No. 10/135,145 as originally
`
`filed, including specification, claims, drawings, and declaration. The undersigned
`
`hereby verifies that the attached papers are a true copy ofthe prior application as
`
`originally filed and identified above, that no amendments (if any) referred to in
`
`the declaration filed to complete the prior application introduced new matter
`
`therein, and further that this statement was made with the knowledgethat willful
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 3
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 3
`
`

`

`false statements and the like so made are punishable by fine or imprisonment or
`
`both, under Section 1001 of Title 18 of the United States Code, and that such
`
`willful false statement may jeopardizethe validity of the application or any patent
`
`issuing thereon.
`
`(a)
`
`EA
`
`The inventorship is the same as prior Application Serial No.
`
`10/135,145.
`
`CLAIMS AS FILED IN THE PRIOR APPLICATION
`
`
`
` Total Claims
`or x $50
`
`Independent Claims
`2-3
`3
`orx $200 =
`$
`0.00
`Multiple Dependent Claim(s)
`or+ $360=
`$
`
`Basic Filing Fee:
`or + $300 =
`$ 300.00
`
`Search Fee:
`or + $500 =
`$ 500.00
`
`
`Examination Fee:
`or+$200 =
`$ 200.00
`
`(for each add’] 50
`or+$250= $
`0.00
`Application Size Fee:
`pages over 100)
`
`Assignment Recording Fee:
`($40 per assignee)
`$
`
`3
`TOTAL FILING FEES
`
`
`
`xX
`
`xX]
`
`iA
`
`Xx
`
`3.
`
`4.
`
`5.
`
`6.
`
`Enclosed is a copy of the current Declaration in the prior application.
`
`Addressall future communicationsto:
`
`Jeffrey A. Pyle
`WILLIAMS, MORGAN & AMERSON,P.C.
`10333 Richmond, Suite 1100
`Houston, Texas 77042
`(713) 934-4053 PH
`
`The prior application is presently assigned to Advanced Microdevices, Inc..
`
`Amendthe specification by inserting before the first line the sentence: --This is a
`
`continuation of co-pending application Serial No. 10/135,145 filed April 30,
`
`2002--.
`
`x 7.
`
`Return Receipt Postcard (should be specifically itemized).
`
`2
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 4
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 4
`
`

`

`Respectfully submitted,
`
` A
`
`Jef;
`NOY
`Re. No. 34,904
`Attorney for Applicants
`
`Date: June 13, 2005
`
`WILLIAMS, MORGAN & AMERSON
`10333 RichmondDr., Suite 1100
`Houston, Texas 77042
`(713) 934-4053 ph
`(713) 934-7011 fx
`
`3
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 5
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 5
`
`

`

`)
`
`}‘
`
`}
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`Application for United States Letters Patent
`
`for
`
`AGENT REACTIVE SCHEDULING IN AN AUTOMATED
`MANUFACTURING ENVIRONMENT
`by
`
`Gustavo Mata
`Steven C. Nettles
`Larry D. Barto
`Yiwei Li
`
`EXPRESS MAIL MAILING LABEL
`
`number GL 52 Z¢ YS SP US
`DATE OF DEPOSITC-
`BCfL 2
`
`Signature
`
`I hereby certify that this paper or fee is being deposited with the United States
`Postal Service with sufficient postage “EXPRESS MAIL POST OFFICE TO
`ADDRESSEE”service under 37 C.F.R. 1.10 on the date indicated above and is
`addressed to:
`BOX PATENT APPLICATION, Assistant Commissioner
`for
`Patents, Waspin
`, D.C. 20231.
`
`GLices
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 6
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 6
`
`

`

`te
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`AGENT REACTIVE SCHEDULING IN AN AUTOMATED
`MANUFACTURING ENVIRONMENT
`
`BACKGROUNDOF THE INVENTION
`
`The United States Governmenthas a paid-up license in this invention and the rightin
`
`limited circumstances to require the patent owner to license others on reasonable terms as
`
`provided for by the terms of Award No. 70NANB7H3041 awarded by the United States
`
`Department of Commerce, National Institute of Standards and Technology(“NIST”).
`
`1.
`
`FIELD OF THE INVENTION
`
`This
`
`invention pertains to automated manufacturing environments, and, more
`
`particularly, to scheduling in an automated manufacturing environment.
`
`2.
`
`DESCRIPTION OF THE RELATED ART
`
`Growing technological requirements and the worldwide acceptance of sophisticated
`
`electronic devices have created an unprecedented demandfor large-scale, complex, integrated
`
`circuits. Competition in the semiconductor industry requires that products be designed,
`
`manufactured, and marketed in the most efficient manner possible.
`
`This
`
`requires
`
`improvements in fabrication technology to keep pace with the rapid improvements in the
`
`electronics industry. Meeting these demands spawns many technological advances in
`
`materials and processing equipment and significantly increases the number of integrated
`
`circuit designs. These improvementsalso require effective utilization of computing resources
`
`and other highly sophisticated equipmentto aid, not only design and fabrication, but also the
`
`scheduling, control, and automation of the manufacturing process.
`
`Turning first to fabrication, integrated circuits, or microchips, are manufactured from
`
`modern semiconductor devices containing numerousstructures or features, typically the size
`
`of a few micrometers. The fabrication process generally involves processing a number of
`
`wafers through a series of fabrication tools. Layers of materials are added to, removed from,
`
`and/or treated on a semiconducting substrate during fabrication to create the integrated
`
`circuits. The fabrication essentially comprises the following four basic operations:
`
`20
`
`25
`
`30
`
`Page 2 of 55
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 7
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 7
`
`

`

`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`°
`
`°
`
`e
`
`°
`
`layering, or adding thin layers of various materials to a wafer from which a
`
`semiconductoris produced;
`
`patterning, or removing selected portions of addedlayers;
`
`doping, or placing specific amounts of dopants in selected portions of the
`
`wafer through openingsin the added layers; and
`
`heat treating, or heating and cooling the materials to produce desired effects in
`
`the processed wafer.
`
`Although there are only four basic operations, they can be combined in hundredsofdifferent
`
`ways, depending upon the particular
`
`fabrication process.
`
`See, e.g., Peter Van Zant,
`
`Microchip Fabrication A Practical Guide to Semiconductor Processing (3d Ed.
`
`1997
`
`McGraw-Hill Companies, Inc.) (SBN 0-07-067250-4). Each fabrication tool performs one
`
`or more of four basic operations. The four basic operations are performed in accordance with
`
`an overall processto finally produce the finished semiconductordevices.
`
`Controlling a semiconductor factory fabricating such integrated circuits, however, is a
`
`challenging task. A semiconductor
`
`factory (“fab”)
`
`is a complex environment where
`
`numerousparts, typically 40,000 wafers or more, and numerouspart types, typically 100 part
`
`types or more, are simultaneously being manufactured. As each wafer moves through the
`
`semiconductor factory (or, “fab”), it may undergo more than 300 processing steps, many of
`
`which use the same machines. A large factory may contain approximately 500 computer-
`
`controlled machines to perform this wafer processing. Routing, scheduling, and tracking
`
`material through the fab is a difficult and complicated task, even with the assistance of a
`
`computerized factory control system.
`
`Efficient managementofa facility for manufacturing products such as semiconductor
`
`chips requires monitoring various aspects of the manufacturing process. For example,it is
`
`typically desirable to track the amount of raw materials on hand,
`
`the status of work-in-
`
`process and the status and availability of machines andtools at every step in the process. One
`
`of the most important decisions is selecting which lot should run on each machine at any
`
`given time. Additionally, most machines used in the manufacturing process require
`scheduling of routine preventative maintenance (“PM”) and equipmentqualification (“Qual”)
`
`procedures, as well as other diagnostic and reconditioning procedures that must be performed
`
`20
`
`25
`
`30
`
`Page 3 of 55
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 8
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 8
`
`

`

`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`on a regular basis. These procedures should be performed such that they do not impedethe
`manufacturing processitself.
`
`One approach to this issue implements an automated “Manufacturing Execution
`System” (“MES”). An automated MES enables a user to view and manipulate, to a limited
`extent, the status of machines and tools, or “entities,” in a manufacturing environment.
`In
`addition, an MES permits dispatching and tracking of lots or work-in-process through the
`manufacturing process to enable resources to be managed in the most efficient manner.
`Specifically,
`in response to MES prompts, a user inputs requested information regarding
`work-in-process and entity status. For example, when a user performs a PM ona particular
`entity, the operator logs the performance of the PM (an “event”) into an MESscreen to
`update the information stored in the MES database with respect to the status of that entity.
`Alternatively, if an entity is to be put down for repair or maintenance, the operatorwill log
`this information into the MES database, which then prevents use of the entity until
`it
`is
`
`subsequently logged back up.
`
`20
`
`25
`
`30
`
`Although MESsystemsare sufficient for tracking lots and machines, such systems
`suffer several deficiencies,
`the most obvious of which are their passive nature,
`lack of
`advance scheduling and inability to support highly automated factory operations. Current
`
`MESsystems largely depend on manufacturing personnel for monitoring factory state and
`initiating activities at the correct time. For example, a lot does not begin processing until a
`wafer fab technician (“WFT”)
`issues the appropriate MES command. And, prior to
`processing, a WFT must issue an MES commandto retrieve the lot from the automated
`material handling system (“AMHS”)with sufficient advance planningthat thelot is available
`
`at the machine when the machine becomesavailable.
`
`If the WFT does notretrieve the lot
`
`soon enough, or neglects to initiate processing at the earliest available time, the machine
`
`becomesidle and production is adversely impacted.
`
`These types of deficiencies in the typical automated MES emphasize the importance
`of the WFTin the efficient operation of the manufacturing process. WFTs perform many
`vital functions. For instance, WFTsinitiate dispatching, transport, and processing as their
`attention and time permits. They make scheduling decisions such as whether to run an
`incomplete batch, as opposedto waiting for additional approaching lots, or performing PM or
`
`Page 4 of 55
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 9
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 9
`
`

`

`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`qualification procedures instead of processing lots. WFTs perform non-value added MES
`
`transactions and utilize conventional factory control systemsthat are passive.
`
`In this context,
`
`the term “passive” means activities in the control system must beinitiated by the WFT,as
`
`opposedto being self-startingorself-initiating.
`
`However, the presence of WFTsalso inevitably introduces someinefficiencies. There
`
`typically is a large difference between the performance of the best WFT and the performance
`
`of the worst WFT. A WEFTtypically simultaneously monitors the processing of multiple
`
`tools and lots, making it difficult to focus on an individual lot or tool. Furthermore, the size
`
`and complexity of the modern fabrication process flows makes it exceedingly difficult for a
`
`WFT to foresee and prevent downstream bottlenecks or shortages arising from upstream
`
`activities. Shift changes, rest breaks, and days off for the WFT also create inefficiencies or
`
`machine idle time that adversely impact
`
`the manufacturing process flow.
`
`Just as the
`
`importance of the WFT is magnified by the deficiencies of the automated MES,so are the
`
`inefficiencies of the WFT magnified by his importance.
`
`Thus, factory control systems utilized in today’s wafer fabs are passive and do not
`
`enable a high degree of automation. These systems are very dependent on WFTsand other
`
`factory staff to monitor the state of the factory, to continuously react to change, to make rapid
`
`20
`
`logistical decisions, and to initiate and coordinate factory control activity in a timely manner.
`
`These WFTs are agents, providing the active element that is lacking in factory control
`
`systems. Asaresult, factory effectiveness in the highly competitive semiconductor industry
`
`is quite dependent on the availability, productivity, skill
`
`level, and consistency of these
`
`human agents. WFTs must monitor and operate a numberoftools located in various bays in
`
`a fab. They are forced to multiplex across tools, bays, material handling systems and a
`
`variety of factory control systems. As a fab’s production ramps and more complex processes
`
`are introduced,
`
`it becomes more difficult
`
`to meet the increased complexity and volume
`
`without increasing staff or system capabilities. WFTsvisibility of upstream and downstream
`
`operations, tool state, work-in-process and resource availability is limited.
`
`25
`
`30
`
`However, key logistical decisions are frequently based on this limited and dated
`
`information, which is only partially provided by factory control systems. WFTs spend a
`significant amount of time interacting with systems, monitoring factory events and state
`
`Page 5 of 55
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 10
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 10
`
`

`

`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`changes, and performing other non-value added functions, such as MES logging.
`
`Shift
`
`changes disrupt the operation of the fab as the technicians are temporarily unable to provide
`
`required monitoring and coordination. Despite the best efforts of the technicians, utilization
`
`oftools suffer, adversely impacting other key factory metrics including cycle time, inventory
`levels, factory output and mix. With the needfor intrabay material handling to transport 12-
`inch wafers in new 300 mm wafer fabs, significant additional complexity is introduced.
`
`Conventional factory control systems are not capable of providing this level of detailed
`
`scheduling and execution control.
`
`The present invention is directed to resolving, or at least reducing, one or all of the
`
`problems mentioned above.
`
`SUMMARYOF THE INVENTION
`
`The invention, in its various aspects and embodiments, is a method and apparatus for
`
`scheduling in an automated manufacturing environment.
`
`In one embodiment, a method
`
`comprises detecting an occurrence of a predetermined event in a process flow; notifying a
`software scheduling agent of the occurrence; and reactively scheduling an action from the
`
`software scheduling agent
`
`responsive to the detection of the predetermined event.
`
`Alternative embodiments include a computing system programmed to perform this method
`
`and a computer-readable program storage medium encoded with instructions to implement
`
`this method.
`
`In still another embodiment, the invention includes automated manufacturing
`
`environment, comprising a process flow and a computing system. The computing system
`
`further includes a plurality of software scheduling agents residing thereon,
`
`the software
`
`scheduling agents being capable of reactively scheduling appointments for activities in the
`
`process flow responsiveto a plurality of predetermined events.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`The invention may be understood by reference to the following description taken in
`
`conjunction with the accompanying drawings, in which like reference numerals identify like
`
`elements, and in which:
`
`20
`
`25
`
`30
`
`Page 6 of 55
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 11
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 11
`
`

`

`2
`
`)
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`FIG. 1 conceptually depicts a portion of one particular embodimentof a process flow
`
`constructed and operated in accordance with the present invention;
`
`FIG. 2 conceptually depicts,
`
`in a partial block diagram, selected portions of the
`
`hardware and software architectures, respectively, of the computing devices in FIG.1;
`
`FIG.3 conceptually depicts one particular implementation ofthe apparatus of FIG.1,
`
`ie., in a portion of a process flow from a semiconductor fabrication facility, and the manner
`
`in whichit schedules appointments for the consumption of resources;
`
`FIG.4 conceptually depicts a calendar of booked appointments;
`
`FIG. 5 conceptually illustrates three related calendars of booked appointments;
`
`FIG. 6A and FIG. 6B conceptually illustrates the changing of booked appointments
`
`to take advantageofearly start times; and
`
`FIG. 7A and FIG. 7B conceptually illustrate two circumstances in which booked
`
`appointments are changed to accommodate unexpectedly long durations for preceding
`
`booked appointments.
`
`While the invention is susceptible to various modifications and alternative forms,
`
`specific embodiments thereof have been shown by way of example in the drawings and are
`
`herein described in detail.
`
`It should be understood, however, that the description herein of
`
`specific embodimentsis not intendedto limit the invention to the particular formsdisclosed,
`
`but on the contrary, the intention is to coverall modifications, equivalents, and alternatives
`
`falling within the spirit and scope of the invention as defined by the appendedclaims.
`
`
`DETAILED DESCRIPTION OF THE INVENTION
`
`Illustrative embodiments of the invention are described below.
`
`In the interest of
`
`clarity, not all features of an actual implementation are describedin this specification.
`
`It will
`
`of course be appreciated that in the development of any such actual embodiment, numerous
`implementation-specific decisions must be made to achieve the developers’ specific goals,
`such as compliance with system-related and business-related constraints, which will vary
`
`from one implementation to another. Moreover,
`
`it will be appreciated that such a
`
`developmenteffort, even if complex and time-consuming, would be a routine undertaking for
`
`those ofordinary skill in the art having the benefit of this disclosure.
`
`20
`
`25
`
`30
`
`Page 7 of 55
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 12
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 12
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`n
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`4
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`WMA DocketNo. 2000.079600
`Client Docket No. TT4739
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`FIG. 1 conceptually illustrates a portion of one particular embodiment of a process
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`flow 100 constructed and operated in accordance with the present invention. The process
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`flow 100 fabricates semiconductor devices. However, the invention may be applied to other
`types of manufacturing processes. Thus, in the process flow 100 discussed above, the lots
`130 of wafers 135 may be more generically referred to as “work pieces.” The process tools
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`115 and any process operations performed thereon need not necessarily be related to the
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`manufacture of semiconductor devices in all embodiments. However, for the sake ofclarity
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`and to further an understanding ofthe invention, the terminology pertaining to semiconductor
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`fabrication is
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`retained in disclosing the invention in the context of the illustrated
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`embodiments.
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`The illustrated portion of the process flow 100 includes two stations 105, each station
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`105 including a computing device 110 communicating with a process tool 115. The stations
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`105 communicate with one another over communications links 120.
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`In the illustrated
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`embodiment,
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`the computing devices 110 and the communications links 120 comprise a
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`portion of a larger computing system, e.g., a network 125. The process tools 115 in FIG. 1
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`are processing lots 130 of wafers 135 that will eventually becomeintegrated circuit devices.
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`The process flow 100 also includes portions of a MES and an automated materials handling
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`system (“AMHS”), neither of which is shown for the sake of clarity, and other integrated
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`factory controls. The AMHS “handles” the lots 130 and facilitates their transport from one
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`station 105 to another, as well as other locations in the process flow 100.
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`As mentioned above, the computing devices 110 maybe part of a larger computing
`system 125 by a connection over the communications links 120. Exemplary computing
`systems in such an implementation would include local area networks (“LANs”), wide area
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`networks (“WANs”), system area networks (“SANs”), intranets, or even the Internet. The
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`computing system 125 employs a networked client/server architecture, but alternative
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`embodiments may employ a peer-to-peer architecture.
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`Thus,
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`in some alternative
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`embodiments, the computing devices 110 may communicate directly with one another. The
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`communications links 120 may be wireless, coaxial cable, optical fiber, or twisted wire pair
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`links, for example. The computing system 125,
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`in embodiments employing one, and the
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`communications links 120 will be implementation specific and may be implemented in any
`suitable manner knownto the art. The computing system 125 may employ any suitable
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`Page 8 of 55
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`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 13
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 13
`
`

`

`)
`
`)
`
`WMADocket No.2000.079600
`Client Docket No. TT4739
`
`communications protocol known to the art, e.g, Transmission Control Protocol/Internet
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`Protocol (“TCP/IP”).
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`FIG. 2 depicts selected portions of the hardware and software architectures of the
`computing devices 110. Some aspects of the hardware and software architecture (e.g., the
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`individual cards, the basic input/output system (“BIOS”), input/output drivers, efc.) are not
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`shown. These aspects are omitted for the sake ofclarity, and so as not to obscure the present
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`invention. As will be appreciated by those of ordinary skill in the art having the benefit of
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`this disclosure, however, the software and hardware architectures of the computing devices
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`110 will include many suchroutine features.
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`In the illustrated embodiment, the computing device 110 is a workstation, employing
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`a UNIX-based operating system 200, but the invention is not so limited. The computing
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`device 110 may be implementedin virtually any type of electronic computing device such as
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`a notebook computer, a desktop computer, a mini-computer, a mainframe computer, or a
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`supercomputer. The computing device 110 may even be, in somealternative embodiments,a
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`processor or controller embedded in the process tool 115. The invention also is notlimited to
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`UNIX-based operating systems. Alternative operating systems (e.g., Windows™-, Linux™-,
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`or disk operating system ("DOS") -based) may also be employed. The invention is not
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`limited by the particular implementation of such features in the computing device 110.
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`The computing device 110 also includes a processor 205 communicating with storage
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`210 over a bus system 215. The storage 210 typically includes at least a hard disk (not
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`shown) and random access memory (“RAM”)(also not shown). The computing device 110
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`mayalso, in some embodiments, include removable storage such as an optical disk 230, or a
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`floppy electromagnetic disk 235, or some other form, such as a magnetic tape (not shown)or
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`a zip disk (not shown). The computing device 110 includes a monitor 240, keyboard 245,
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`and a mouse 250, which together, along with their associated user interface software 255
`comprise a user interface 260. The user interface 260 in the illustrated embodimentis a
`graphical user interface (“GUI”), although this is not necessary to the practice of the
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`30
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`invention.
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`Page 9 of 55
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`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 14
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 14
`
`

`

`+/
`
`‘ow
`
`WMADocket No. 2000.079600
`Client Docket No. TT4739
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`Each computing device 110 includes, in the illustrated embodiment, a software agent
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`265 residing in the storage 210. Note that the software agents 265 mayreside in the process
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`flow 100 in places other than the computing devices 110. The situs of the software agent 265
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`is not material to the practiceof the invention. Note also that, since the situs of the software
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`agents 265 is not material, some computing devices 110 may have multiple software agents
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`265 residing thereon while other computing devices 110 may not have any. Thus, there need
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`not be a one-to-one correspondence between the computing devices 100 and the process tools
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`115. Software component(s) 270, 280 of an automated MES, such as WORKSTREAM™,
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`and of an AMHS,respectively, also reside on at least one computing device 110. As with the
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`software agent(s) 265, the software components 270, 280 may reside anywhere within the
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`process flow 100.
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`Referring now to FIG. 1 and FIG. 2, the software agents 265 each represent some
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`“manufacturing domain entity,” e.g., a lot 130, a process tool 115, a resource, a PM,or a
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`Qual. A process tool 115 may be a fabrication tool used to fabricate some portion of the
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`wafers 135, ie., layer, pattern, dope, or heat treat the wafers 135. Or, the process tool 115
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`may be a metrology tool used to evaluate the performanceofvarious parts of the process flow
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`100. The software agents 265, collectively, are responsible for efficiently scheduling and
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`controlling the lots 130 of wafers 135 through the fabrication process.
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`In furtherance of these
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`objectives, the software agents 265 interface with the software components 270, 280 of the
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`MES and AMHS,respectively, and are integrated with other existing factory control systems
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`(not shown). The software agents 265, where appropriate, also interface with the process
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`tools 115 and other equipmentthrough a software implemented “equipmentinterface” (“EI”)
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`(not shown). As will be apparent to those skilled in the art having the benefit of this
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`disclosure,
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`the manner in which this interface and integration occurs is implementation
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`specific, depending upon the makeup and configuration of the MES, the AMHS, and the
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`other factory control systems.
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`Of particular interest to the present
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`invention,
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`the software agents 265 reactively
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`schedule, initiate, and execute activities on behalf of their respective manufacturing domain
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`entities.
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`In the illustrated embodiment, the software agents 265 also proactively schedule
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`activities. Collectively, the software agents 265, amongother things, schedule ahead for each
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`lot 130 one or more operations on a specific qualified process tool 115, including transports
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`Page 10 of 55
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`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 15
`
`Petitioner STMICROELECTRONICS, INC.,
`Ex. 1005, IPR2022-00681, Pg. 15
`
`

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`)
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`)
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`WMADocketNo. 2000.079600
`Client Docket No. TT4739
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`and required resources, as discussed further below.
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`This includes making optimizing
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`decisions such as running an incomplete batch, as opposed to waiting for an approachinglot
`130,
`and
`scheduling opportunistic
`preventive maintenance
`(“PM”) procedures or
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`qualification tests (“Quals’”) to meet specifications. The software agents 265 schedule and
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`initiate activities such as lot transport and processing; perform MEStransactions; monitor
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`processing and transport; and react to unscheduled activities or deviations from scheduled
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`activities.
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`Furthermore,
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`in the illustrated embodiment,
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`the software agents 265 are
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`configurable in a mannerthat allows a user to influence their behavior in order to tune the
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`performanceof the process flow 100.
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`In the
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`illustrated embodiment,
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`the scheduling agents 265 are typed by the
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`manufacturing domain entities they represent.
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`There may be many different
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`types of
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`scheduling agents 265, depending on the implementations. Theprinciple types of scheduling
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`agents 265 in the illustrated embodiment, shownin FIG.3,include:
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`°
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`°
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`e
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`°
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`a Lot Scheduling Agent (“LSA”) 305 that schedulesactivities on behalf of lots
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`130 of wafers 135;
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`a Machine Scheduling Agent (“MSA”) 310 that schedules activities on behalf
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`of process tools 115;
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`a PM Scheduling Agent (“PMSA”) 315 that schedules activities on behalf of
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`PMsand Quals (not shown); and
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`a Resource Scheduli