`U.S. Patent No. 6,603,343 by Apple
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`1(a)
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`Claim
`A phase correction circuit
`for a transistor,
`comprising:
`
`Application to USI 339M00104 used in Exemplary Apple iPhone 12 Pro
`Arigna makes these contentions based on the information reasonably available at this time. Its investigation is
`ongoing. Defendant Apple Inc. has not produced documents concerning its infringement of U.S. Patent
`6,603,343 (the “’343 Patent”). Claim construction proceedings have not commenced. Invalidity contentions
`have not been served. Arigna reserves its right to modify, supplement, and/or amend these contentions as
`additional evidence and information becomes available, including in light of discovery, invalidity contentions,
`prior art, claim construction, or any information provided by Apple or any other party or nonparty to this action.
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`The Universal Scientific Industrial 339M00104 semiconductor device is a device that enables mobile devices,
`such as smartphones and tablets, to connect to 5G mobile networks. See, e.g.:
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`The USI 339M00104 includes within it the HG11-PG660-200 RF die.
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`Defendant Apple makes, uses, sells, offers for sale, and/or imports mobile devices that contain the USI
`339M00104. For example, the exemplary Apple iPhone 12 Pro incorporates the USI 339M00104. See, e.g.:
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`1
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`EXHIBIT 1007
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`Defendant Apple also makes,uses,sells, offers for sale, and/or imports mobile devices that contain the Murata
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` Exemplary Accused Product: Apple iPhone 12 Pro
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`1XR-484. For example, the Apple iPhone 12 Pro Maxincorporates the Murata 1XR-484.See,e.g.: The Murata 1XR-484 includes within it the HG11-PG660-200 RF die.
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`
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`The Apple iPhone 12 Pro is depicted herein as an exemplary device representative of Apple’s Accused
`Products. On information and belief, Apple’s other Accused Products, as identified in Arigna’s Disclosures
`pursuant to this Court’s November 17, 2021 Standing Order Governing Proceedings – Patent Cases, infringe
`the ’343 Patent in a manner identical or substantially similar to that described below and depicted for the Apple
`iPhone 12 Pro. These other Accused Products, including the iPhone 12, iPhone 12 Mini, iPhone 12 Pro Max,
`iPhone 13, iPhone 13 Pro, iPhone 13 mini, and iPhone 13 Pro Max, contain mmWave antenna modules or
`components including, e.g., the USI 339M00104, Murata 1XR-484, Murata 1V4B, Murata 1V4K, Qualcomm
`SMR525, Qualcomm SMR526, and/or other mmWave antenna modules or components that, on information
`and belief, contain an HG11-PG660-200 RF die or substantially similar RF die. As shown in this claim chart,
`the HG11-PG660-200 RF die infringes claim 1 of the ’343 Patent. See infra. Because antenna modules or
`components of the other Apple Accused Products contain the HG11-PG660-200 RF die just as does the USI
`339M00104 antenna module in the exemplary Apple iPhone 12 Pro charted herein, or an RF die substantially
`similar to the HG11-PG660-200 RF die, on information and belief, there are no material differences between
`the accused instrumentalities that affect Arigna’s infringement theories for the other Apple Accused Products
`not specifically charted herein.
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`The images and circuit diagrams herein are provided to further explain Arigna’s infringement theory but are
`exemplary and not limiting. The absence or incompleteness of an image or circuit diagram, if any, should not
`be construed as any kind of disclaimer of any infringement by similar or substantially similar functionality.
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`3
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`As shown in this claim chart, the HG11-PG660-200 RF die in the USI 339M00104 infringes claim 1 of the
`’343 Patent. See infra.
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`To the extent this preamble is considered limiting, the HG11-PG660-200 RF die contains a phase correction
`circuit for a transistor. For example, the following annotated and exemplary circuit diagram of the HG11-
`PG660-200 RF die identifies a power amplifier stage (boxed in gold). See, e.g.:
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`4
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`The power amplifier stage, as identified above, contains a phase correction circuit for a transistor. The
`following annotated and exemplary circuit extraction of the power amplifier stage of the HG11-PG660-200 RF
`die identifies a phase correction circuit (boxed in red) for a transistor (boxed in green).
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`5
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`Arigna asserts that each element of claim 1 is present literally in Apple’s accused devices and methods,
`including but not limited to the exemplary iPhone 12 Pro, as represented by the exemplary information cited
`for each element below; but to the extent that any claim construction or other circumstance results in the
`accused devices and methods falling outside the literal scope of any asserted claim, Arigna asserts in the
`alternative that each element of each asserted claim is met by Apple’s accused devices and methods through
`the doctrine of equivalents because Apple’s accused devices and methods are insubstantially different than the
`patented devices and methods and perform the same functions, in substantially the same ways, to achieve the
`same results as the patented devices and methods.
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`6
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`The phase correction circuit for a transistor in the HG11-PG660-200 RF die comprises a circuit element having
`an output terminal connected to a gate of a transistor to which a control signal line is connected, and an input
`terminal, wherein the circuit element has a reactance component (i.e. capacitance) that changes with potential
`difference between the input terminal and the output terminal.
`
`(b)
`
`a circuit element having
`an output terminal
`connected to a gate of a
`transistor to which a
`control signal line is
`connected, and an input
`terminal, wherein the
`circuit element has a
`reactance that changes
`with potential difference
`between the input
`terminal and the
`output terminal; and
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`7
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`The ’343 Patent specification at 4:46-51 and 5:3-8 identifies the “reactance component” as equivalent to
`“capacitance” (“Cd”). Further, Figures 7 and 8 of the ’343 Patent explain that capacitance Cd of the circuit
`element decreases as the potential difference across its terminals increases (Fig. 7) or as the temperature
`increases (Fig. 8). See, e.g.:
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`The MOS-C circuit element in the HG11-PG660-200 RF die has a reactance component (i.e. capacitance) that
`changes with potential difference between the input terminal and the output terminal.
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`10
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`For example, the following exemplary figure showsthat theJy circuit element has a reactance component
`(i.e. capacitance), that changes with potential difference across its input terminal and output terminal. Vab is
`represented by Biasin this figure.
`
`0.4
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`03
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`=&
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`uvo
`§ 0.2
`s; 0:1
`5
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`0
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`ge
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`=9
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`=f
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`0
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`1
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`2
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`Bias (V)
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`--- 1MHz --:- 20GHz
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`5GHz «-: 55 GHz
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`See, e.g.: Ming Lietal., Investigation of CMOS Varactors for High-GHz-Range Applications, in JOURNAL OF
`ELECTRICAL AND COMPUTER ENGINEERING,at 2 (2009),
`https://www.hindawi.com/journals/jece/2009/535809/.
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`11
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`The phase correction circuit for a transistor in the HG11-PG660-200 RF die comprises a voltage control circuit
`supplying a voltage to the input terminal of the circuit element so that the reactance component (i.e.
`capacitance) of the circuit element decreases in response to an increase in potential of the gate, wherein a sum
`of the reactance component (i.e. capacitance) of the circuit element and a gate-source reactance component (i.e.
`capacitance) of the transistor remains substantially constant.
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`1(c)
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`a voltage control circuit
`supplying a voltage to the
`input terminal of the
`circuit element so that the
`reactance of the circuit
`element decreases in
`response to an increase in
`potential of the gate,
`wherein a sum of the
`reactance of the circuit
`element and a gate-source
`reactance of the transistor
`remains substantially
`constant.
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`12
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`Ee. As shown in the following annotated and exemplary graph, the capacitance of
`HE decreases as the gate voltage ofdrops,since Bias corresponds to Va, and Va (gate voltage) is
`decreasing.See, e.g.:
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`Capacitance(pF) o io
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`Bias (V)
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`--- 1MHz ---- 20GHz
`— 5GHz
`-:::: 55 GHz
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`See, e.g.: Ming Lietal., Investigation of CMOS Varactors for High-GHz-Range Applications, in JOURNAL OF
`ELECTRICAL AND COMPUTER ENGINEERING,at 2 (2009),
`https://www.hindawi.com/journals/jece/2009/535809/.
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`As the gate voltage (VG in the figure below) decreases, the gate-source voltage becomes more negative
`(equivalently, the magnitude or absolute value of the
` gate source voltage increases) and, as shown,
`correspondingly the capacitance of the
` transistor increases. Gate-source capacitance of a pMOS
`device versus gate-source voltage (VG) is shown below.
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`See, e.g.: Philipp Hehenberger, Advanced Characterization of the Bias Temperature Instability § 2.6 (2011),
`https://www.iue.tuwien.ac.at/phd/hehenberger/dissse9.html.
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