(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2013/0126622 A1
`Finn
`(43) Pub. Date:
`May 23, 2013
`
`US 2013 0126622A1
`
`54) OFFSETTING SHIELDING AND ENHANCING
`COUPLNG IN METALLIZED SMART CARDS
`
`(71) Applicant: David Finn, Tourmakeady County Mayo
`(IE)
`(72) Inventor: David Finn, Tourmakeady County Mayo
`(IE)
`
`(21) Appl. No.: 13/744,686
`
`(22) Filed:
`
`Jan. 18, 2013
`
`Related U.S. Application Data
`(63) Continuation-in-part of application No. 13/600,140
`filed on Aug. 30, 2012 Continuation-in-p art of appli-
`N78)
`is
`a continuation-in-p arto f application No 1331 O718
`filed on Dec. 3, 2011, now Pat. No. 8.3 6 6. O09 Con-
`tinuation-in-part of application No 3 f2O s 600 filed
`Aug. 8, 2011
`s
`s
`On Aug. 8,
`(60) Provisional application No. 61/589.434, filed on Jan.
`23, 2012, provisional application No. 61/619,951,
`filed on Apr. 4, 2012, provisional application No.
`61/693.262, filed on Aug. 25, 2012, provisional appli
`cation No. 61/732,414, filed on Dec. 3, 2012, provi
`sional application No. 61/697,825, filed on Sep. 7,
`
`2012, provisional application No. 61/737.746, filed
`, f4 to, Illed On
`proV1S1onal application No.
`Dec. 15, 2012, provisional application No. 61/586,
`781, filed on Jan. 14, 2012, provisional application No.
`61/624,384, filed on Apr. 15, 2012.
`
`Publication Classification
`
`(51) Int. Cl.
`G06K 9/077
`(52) U.S. Cl.
`CPC ................................ G06K 19/07771 (2013.01)
`USPC ................................ 235/492; 29/600: 29/601
`
`(2006.01)
`
`ABSTRACT
`(57)
`A dual-interface Smart card having a booster antenna with
`coupler coil in its card body, and a metallized face plate
`having a window opening for the antenna module. Perfor
`mance may be improved by one or more of making the win
`dow opening Substantially larger than the antenna module,
`providing perforations through the face plate, disposing fer
`rite material between the face plate and the booster antenna.
`Additionally, by one or more of modifying contact pads on
`the antenna module, disposing a compensating loop under the
`booster antenna, offsetting the antenna module with respect
`to the coupler coil, arranging the booster antenna as a quasi
`dipole, providing the module antenna with capacitive stubs,
`and disposing a ferrite element in the antenna module
`between the module antenna and the contact pads.
`
`Stacktip of a Metalized Card
`
`
`
`ANEENNA VOLE
`(AM)
`
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`Patent Application Publication May 23, 2013 Sheet 1 of 11
`
`US 2013/O126622 A1
`
`FG.
`Eua interface {E}} Smart Carci, and Readers
`
`
`
`Contact easier
`
`
`
`
`
`recess is C3 or Av
`
`FG. A
`Booster Antenna BA with Coupier Coit CC
`
`
`
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`Patent Application Publication May 23, 2013 Sheet 2 of 11
`
`US 2013/O126622 A1
`
`
`
`
`
`
`
`
`
`
`
`Layer(s) 4
`ilayer(s) 5
`Layer(s) {
`
`FG. 2A
`Stackup of a Metailized Card
`
`200 y
`
`ANEENNA y{}}E
`(AM)
`
`
`
`
`
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`Patent Application Publication May 23, 2013 Sheet 3 of 11
`
`US 2013/O126622 A1
`
`FIG 3A
`N Y-32
`
`OOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOO
`
`
`
`FG. 3B
`foooooooooooooooo
`to o O O o O O Q o O O o O O o
`\
`O
`322
`
`O.
`&
`VO coo C coo coo O coo O A
`
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`Patent Application Publication May 23, 2013 Sheet 4 of 11
`
`US 2013/O126622 A1
`
`FIG. 4A
`Compensating loop (C), with gap
`
`C3
`
`FIG. 4B
`Compensating Loop (CL), no gap
`
`C3
`
`
`
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`Patent Application Publication May 23, 2013 Sheet 5 of 11
`
`US 2013/O126622 A1
`
`FIG. 5
`contact pads (CP)
`
`opening in MT
`
`MA
`
`FIG. 5A
`contact pad layout/asignments
`
`
`
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`Patent Application Publication May 23, 2013 Sheet 6 of 11
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`US 2013/O126622 A1
`
`FIG. 6A
`cxtciding the edges of some of the contact pais (C)
`
`extended edge
`
`extended edge
`---
`
`F.G. 6B
`trianninge edges of some of the contact pads (CP)
`
`
`
`trinamed edge
`
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`Patent Application Publication May 23, 2013 Sheet 7 of 11
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`US 2013/O126622 A1
`
`F.G. 6C
`increasing the gap between some of the contact pads (CP)
`
`increased gap
`
`FIG 6D
`modifying the gap between some of the contact ads (CP)
`
`
`
`modified gap
`
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`Patent Application Publication May 23, 2013 Sheet 8 of 11
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`US 2013/O126622 A1
`
`FIG 7A
`perforating the contact pads (CP)
`
`
`
`slots
`
`3B
`
`FIG 7B
`thinning the contact pads (CP)
`
`MA-1
`
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`Patent Application Publication May 23, 2013 Sheet 9 of 11
`
`US 2013/O126622 A1
`
`FIG. 8A
`Etchei or Wound VA
`
`
`
`MA -
`
`FIG. 8B
`Perforated C’s
`
`
`
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`Patent Application Publication
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`May 23, 2013 Sheet 10 of 11
`
`US 2013/O126622 A1
`
`FIG. 9A
`perforations in a logo patter:
`
`.
`
`.
`
`.
`.
`
`.
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`at: .
`.
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`sees set
`a
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`. its
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`is .
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`
`FIG.
`perforations in a io
`9. k
`
`patter
`
`/
`
`
`
`
`
`
`
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`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
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`Patent Application Publication May 23, 2013 Sheet 11 of 11
`
`US 2013/O126622 A1
`
`FIG. OA
`two modiale antenna segments (MA, MA2)
`
`FIG. OB
`two antenna segments (OS, ES connected as quasi-dipoie
`
`
`
`AS --
`
`substrate - OS
`
`9
`
`connection
`
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`US 2013/0126622 A1
`
`May 23, 2013
`
`OFFSETTING SHIELDING AND ENHANCING
`COUPLING IN METALLIZED SMART CARDS
`
`CROSS-REFERENCES TO RELATED
`APPLICATIONS
`0001. This is a non-provisional filing of...
`0002 61/589.434 filed Jan. 23, 2012
`0003. 61/619,951 filed Apr. 4, 2012
`0004. 61/693.262 filed Aug. 25, 2012
`0005 61/732,414 filed Dec. 3, 2012
`0006 61/697,825 filed Sep. 7, 2012
`0007. 61/737,746 filed Dec. 15, 2012
`0008. This is a continuation-in-part of 13/600,140 filed
`Aug. 30, 2012 which is a nonprovisional of...
`0009 61/586,781 filed Jan. 14, 2012
`0010) 61/624,384 filed Apr. 15, 2012
`0011. This is a continuation-in-part of 13/730,811 filed
`Dec. 28, 2012, which is a continuation-in-part of 13/310,718
`filed Dec. 3, 2011 (publication 2012/0074233)
`0012. This is a continuation-in-part of 13/205,600 filed
`Aug. 8, 2011 (publication 2012/0038445)
`
`TECHNICAL FIELD
`0013 The invention (in some aspects) relates to “secure
`documents' such as electronic passports, electronic ID cards
`and Smart cards (data carriers) having RFID (radio frequency
`identification) chips or chip modules (CM) and operating in a
`contactless mode (ISO 14443) including dual interface (DI,
`or DIF) cards which can also operate in contact mode (ISO
`7816-2), and more particularly to improving coupling
`between components within the Smart card, such as between
`a module antenna (MA) connected with the RFID chip (CM)
`and a boosterantenna (BA) in the cardbody (CB) of the smart
`card and inductively coupled with the module antenna (MA)
`and consequent improvements in the RFID chip (CM) inter
`acting with external RFID readers.
`0014. The invention (in some aspects) relates to passive
`RFID Smart cards having a conductive metal or metallized
`layer which shields the electromagnetic field generated by a
`reader. In particular, dual interface cards which operate on the
`principle of reactive coupling.
`
`BACKGROUND
`0015 For purposes of this discussion, an RFID transpon
`der generally comprises a Substrate, an RFID chip (or chip
`module) disposed on or in the Substrate, and an antenna
`disposed on or in the Substrate. The transponder may form the
`basis of a secure document such as an electronic passport,
`Smart card or national ID card.
`0016. The chip module may operate solely in a contactless
`mode (such as ISO 14443), or may be a dual interface (DIF)
`module which can operate also in contact mode (such as ISO
`7816-2) and a contactless mode. The chip module may har
`vest energy from an RF signal supplied by an external RFID
`reader device with which it communicates.
`0017. The substrate, which may be referred to as an “inlay
`substrate' (for electronic passport) or “card body' (for smart
`card) may comprise one or more layers of material Such as
`Polyvinyl Chloride (PVC), Polycarbonate (PC), polyethyl
`ene (PE), PET (doped PE), PET-G (derivative of PE), Tes
`linTM, Paper or Cotton/Noil, and the like. When “inlay sub
`strate' is referred to herein, it should be taken to include “card
`body', and vice versa, unless explicitly otherwise stated.
`
`0018. The chip module may be a leadframe-type chip
`module or an epoxy-glass type chip module. The epoxy-glass
`module can be metallized on one side (contact side) or on both
`sides with through-hole plating to facilitate the interconnec
`tion with the antenna. When “chip module' is referred to
`herein, it should be taken to include “chip', and vice versa,
`unless explicitly otherwise stated.
`0019. The antenna may be a self-bonding (or self-adher
`ing) wire. A conventional method of mounting an antenna
`wire to a substrate is to use a Sonotrode (ultrasonic) tool which
`vibrates, feeds the wire out of a capillary, and embeds it into
`or sticks it onto the surface of the substrate. A typical pattern
`for an antenna is generally rectangular, in the form of a flat
`(planar) coil (spiral) having a number of turns. The two ends
`of the antenna wire may be connected, such as by thermo
`compression (TC) bonding, to terminals (or terminal areas, or
`contact pads) of the chip module. See, for example U.S. Pat.
`No. 6,698,089 and U.S. Pat. No. 6,233,818, incorporated by
`reference herein.
`0020. A problem with any arrangement which incorpo
`rates the antenna into the chip module (antenna module) is
`that the overall antenna area is quite Small (Such as approxi
`mately 15mmx15 mm), in contrast with a more conventional
`antenna which may beformed by embedding several (such as
`4 or 5) turns of wire around a periphery of the of the inlay
`Substrate or card body of the secure document, in which case
`the overall antenna area may be approximately 80 mmx50
`mm (approximately 20 times larger). When an antenna is
`incorporated with the chip module, the resulting entity may
`be referred to as an “antenna module'.
`
`Some Prior Art
`(0021
`U.S. Pat. No. 8,261,997 (NXP) discloses a carrier
`assembly for receiving an RFID transponder chip has an
`attachment side for being attached to a consumer device and
`an operation side for receiving an RF signal in operational use
`of the RFID transponder chip.
`0022 there is provided an electrically conductive
`shielding layer at the attachment side. The effect of this
`layer is that it effectively shields the transponder from
`the material of the surface on which the transponder is to
`be provided. The shielding layer has some detuning
`effect on the resonance frequency, but once this detuning
`effect has been taken into account in the antenna design,
`there is hardly any further detuning effect due to the
`surface on which the RFID transponder is provided, i.e.
`the RFID transponder comprising the carrier assembly
`of the invention is suitable for virtually any surface.
`0023 the magnetic layer comprises a ferrite foil or a
`ferrite plate.
`0024 the electrically conductive shielding layer com
`prises a material selected from a group comprising: cop
`per, aluminum, silver, gold, platinum, conductive paste,
`and silverink. (Claim 1) A carrier assembly for receiving
`an RFID transponder chip, the carrier assembly having
`an attachment side for being attached to a consumer
`device and having an operation side for receiving an RF
`signal in operational use of the RFID transponder chip,
`wherein: the carrier assembly comprises a layer stack
`that includes an antenna layer, a magnetic layer, and an
`electrically conductive shielding layer, the antenna layer
`is arranged between the operation side and the magnetic
`layer; the electrically conductive shielding layer is
`arranged between the magnetic layer and the attachment
`
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`
`side; the antenna layer comprises an antenna having
`contacts for being coupled to the RFID transponder
`chip; and an outer contour of a first projection of the
`antenna in a direction perpendicular to the antenna layer
`fully encloses an outer contour of a second projection of
`the electrically conductive shielding layer in the direc
`tion perpendicular to the antenna layer.
`0025 EP1854222 A2 (NXP) discloses A mobile commu
`nication device (1,10) comprises shielding components that
`provide electromagnetic shielding or attenuation between a
`first area (A) and a second area (B. B1, B2) within and/or
`external of the communication device (1,10). In said first area
`(A) an antenna (4) and at least one ferrite (6) are arranged,
`which ferrite (6) is provided to interact with said antenna (4)
`and to guide a magnetic flux between said first area (A) and
`said second area (B. B1, B2).
`0026 a mobile communication device comprising
`shielding components, which cause electromagnetic
`shielding or attenuation between a first area and a second
`area within and/or external of the communication
`device.
`0027. A mobile communication device comprising
`shielding components, which cause electromagnetic
`shielding or attenuation between a first area and a second
`area within and/or external of the communication
`device, wherein in said first area an antenna and at least
`one ferrite are arranged, which ferrite is provided to
`interact with said antenna and to guide a magnetic flux
`between said first area and said second area.
`0028. The first device portion 1a contains a carrier 3, such
`as a printed circuit board. The FIGS. 1-2 also show a first area
`A and a second area, the latter consisting of an internal second
`area B1 and an external second area B2. The first area A and
`the internal second area B1 within first device portion 1a are
`separated from each other by the carrier 3. On the surface of
`this carrier 3, facing said first area A, an antenna 4 and a reader
`5 are located. The antenna 4 is assumed to be a metallic layer
`on carrier 3 and is thus not visible in the side views of FIGS.
`1 and 2. The reader 5 sends and receives electromagnetic
`signals via the antenna 4. For instance, the reader 5 may be
`configured as a near-field communication device or as an
`RFID device for communicating with wireless RF transpon
`ders. Second device portion 1b shields electromagnetic fields,
`either due to electromagnetically shielding materials used for
`structural elements of said second device portion 1 b, or due to
`electromagnetically shielding means and elements incorpo
`rated in said second device portion 1 b, such as a display with
`metallic layers, a PCB with grounding layers, batteries, elec
`tronic components or the like.
`0029 although this is not shown in the FIGS. 3-4 the
`mobile communication device 10 may also comprise an
`internal second area B1 and an external second area B2
`as shown FIGS. 1-2 in the case where the first device
`portion 10a comprises shielding components (i.e. the
`carrier 3).
`0030 (Claim 1) 1. A mobile communication device (1,
`10) comprising shielding components, which cause
`electromagnetic shielding or attenuation between a first
`area (A) and a second area (B. B1, B2) within and/or
`external of the communication device (1,10), wherein in
`said first area (A) an antenna (4) and at least one ferrite
`(6) are arranged, which ferrite (6) is provided to interact
`
`with said antenna (4) and provided to guide a magnetic
`flux between said first area (A) and said second area (B.
`B1, B2).
`0031 US 20120055013 (Finn: 2012: “S32) discloses
`microstructures such as connection areas, contact pads,
`antennas, coils, plates for capacitors and the like may be
`formed using nanostructures such as nanoparticles, nanow
`ires and nanotubes. A laser may be used to assistin the process
`of microstructure formation, and may also be used to form
`other features on a Substrate Such as recesses or channels for
`receiving the microstructures. A Smart mobile phone sticker
`(MPS) mounted to a cellphone with a self-sticking shielding
`element comprising a core layer having ferrite particles.
`0032 EP 02063489 A1 (Tyco) discloses an antenna ele
`ment and method for manufacturing same There is provided
`a more easily manufactured antenna device used in a tag
`composing an RFID (Radio Frequency Identification) sys
`tem. The antenna device (10) has (A) a laminar magnetic
`element formed of a magnetic composition containing a mag
`netic material and a polymer material, and (B) antenna wiring
`provided on one of the Surfaces of the laminar magnetic
`element.
`0033 RFID systems have been beginning to be used in
`various fields and their convenience has been demon
`strated. As a result, it is expected that the RFID systems
`maybe utilized in many other fields to take advantage of
`their convenience. On the other hand, various problems
`have been pointed out with respect to the technology
`related to the RFID systems and solutions therefore are
`desirable from now on.
`0034. One of such problems is a problem as to the
`antenna which tags, readers/writers or the like as units
`for forming the RFID systems include. The antenna is
`used in signal transmission and/or power Supply by uti
`lizing the electromagnetic induction effect.
`0035. Such an antenna is known to be greatly influenced
`by the environment in which it is placed. In particular, if
`a metallic article is present close to the antenna, an eddy
`current caused by the magnetic flux generated by the
`antenna flows on the metal surface in the reader/writer.
`As a result, carrier waves are significantly attenuated,
`and with respect to the tag, the intensity of the magnetic
`flux flowing through the antenna is attenuated, which
`may make communication impossible.
`0036. In order to suppress the effect generated by such
`a metallic article, combining a member formed of a
`magnetic material with the antenna has been proposed.
`For example, a non-contact type IC card reader/writer
`provided with a magnetic material in the form of a flex
`ible sheet under the antenna has been proposed in order
`to prevent the adverse effects to the communication
`caused by the metallic article as well as to reduce occu
`pied space (see Patent Reference 1 below). In this reader/
`writer, the antenna and the magnetic material in the form
`of the sheet are bonded with double sided adhesive tape.
`Foil Composite Card
`0037 US 2009/0169776 (2009: Herslow) discloses com
`posite cards which include a security layer comprising a
`hologram or diffraction grating formed at, or in, the center, or
`core layer, of the card. The hologram may be formed by
`embossing a designated area of the core layer with a diffrac
`tion pattern and depositing a thin layer of metal on the
`embossed layer. Additional layers may be selectively and
`
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`symmetrically attached to the top and bottom surfaces of the
`core layer. A laser may be used to remove selected portions of
`the metal formed on the embossed layer, at selected Stages of
`forming the card, to impart a selected pattern or information
`to the holographic region. The cards may be “lasered” when
`the cards being processed are attached to, and part of a large
`sheet of material, whereby the “lasering of all the cards on
`the sheet can be done at the same time and relatively inex
`pensively. Alternatively, each card may be individually
`“lasered to produce desired alpha numeric information, bar
`codes information or a graphic image, after the sheets are
`die-cut into cards.
`0038 claim 18. A method for forming a document com
`prising the steps of:
`0039 forming a pattern on a surface of a clear plastic
`sheet defining the core layer of said document;
`0040 vapor depositing one of a thin layer of a
`selected metal and a metal compound on a designated
`area of the formed pattern for producing a patterned
`layer and causing a light pattern to be produced cor
`responding to the formed pattern in response to inci
`dent light;
`0041 attaching a selected number of clear plastic
`buffer layers to the patterned layer formed on said
`Surface of the core layer, arbitrarily defining said Sur
`face as the top surface, and a like number of clear
`plastic buffer layers on the bottom surface of the core
`layer, the first clear plastic layer being of approxi
`mately the same thickness as the second clear plastic
`layer, and
`0042 selectively modifying the thin layer of said
`selected metal and metal compound to customize the
`document.
`
`Metal Card
`
`0043 US 2011/0189620 (2011; Herslow) discloses a
`method and apparatus for treating a selected region of a metal
`layer, used to form a metal card, by annealing the selected
`metal region so the selected region becomes Soft and ductile,
`while the rest of the metal layer remains stiff. The softened,
`ductile, selected metal region can be embossed with reduced
`power and with reduced wear and tear on the embossing
`equipment. Alternatively, the annealed metal layer can
`undergo additional processing steps to form an assembly
`which can then be embossed. The method may include the use
`of a fixture for holding the metal layer, with the fixture having
`a window region for enabling heat to be applied to soften the
`region of the metal layer within the window region. The
`fixture includes apparatus for cooling the portion of the metal
`layer outside of the window region and for preventing the
`temperature of the metal layer outside the window region
`from rising above predetermined limits.
`
`Ferrite
`
`0044) U.S. Pat. No. 8,158,018 (2012: TDK) discloses a
`ferrite sintered body of the present invention contains main
`components consisting of 52 to 54 mol% Fe. Sub.2O.Sub.3,35
`to 42 mol% MnO and 6 to 11 mol% ZnO as oxide equivalents
`and additives including Co, Ti, Si and Ca in specified
`amounts, and has a temperature at which the power loss is a
`minimal value (bottom temperature) of higher than 120.de
`gree. C. in a magnetic field with an excitation magnetic flux
`
`density of 200 mT and a frequency of 100 kHz, and a power
`loss of 350 kW/m.sup.3 or less at the bottom temperature.
`0045 U.S. Pat. No. 7,948,057 (2011; TDK) discloses a
`ferrite substrate, a winding-embedded ferrite resin layer, and
`an IC-embedded ferrite resin layer are laminated, the ferrite
`substrate has a ferrite first protruding part that protrudes into
`the ferrite resin layer from the surface thereof, the winding
`inside the ferrite resin layer is arranged winding around the
`first protruding part, and the IC overlaps the first protruding
`part in the resin layer. According to this configuration, high
`integration can be achieved, and the IC is arranged at a site
`where the ferrite first protruding part, the height of which
`fluctuates little as a result of thermal expansion, overlaps the
`ferrite resin layer, the thickness of which is thinned by the first
`protruding part and varies little as a result of thermal expan
`Sion, minimizing variations in the gap between the winding
`and the IC as a result of thermal expansion, and achieving
`greater stability of electrical characteristics.
`0046 U.S. Pat. No. 6,817,085 (2004; TDK) discloses a
`method of manufacturing a multi-layer ferrite chip inductor
`array including an element main body composed by laminat
`ing a ferrite layer and a conductor layer in Such a manner that
`the laminated face thereof is vertical with an element mount
`ing Surface. The method also includes furnishing a plurality
`of coil shaped internal conductors within the element main
`body, in which a coiling direction of the coil shaped internal
`conductor is in parallel with the element mounting Surface,
`forming the ferrite sheets with through-holes and printing the
`ferrite sheets with a plurality of coil shaped internal conduc
`tors and conductor patterns with an electrically conductive
`material.
`0047 U.S. Pat. No. 6,329,958 (2001; TDK) discloses an
`antenna structure may be formed by arranging a current
`restricting structure upon a conductive Surface. The current
`restricting structure may be formed from a ferrite material,
`and may be in forms including a belt, tiles, or a patterned
`deposited layer. The conductive Surface may be associated
`with a vehicle or structure. The current-restricting structure
`alters the paths taken by current on or beneath the conductive
`Surface when a Voltage is applied between portions of the
`Surface.
`
`SUMMARY
`0048. It is an object of the invention to improve coupling
`between an RFID reader and a chip module in a smart card
`having a metal or metallized layer. Generally, various modi
`fications and/or additions may be made to the structure of
`such smart cards to offset the effects of shielding by the metal
`or metallized card body Substrates during electromagnetic
`coupling, with the goal of improving coupling between the
`smart card and an external RFID (electromagnetic) reader. A
`dual interface (DI) Smart card has contact pads (CP) extend
`ing through an opening in the metal layer for interfacing with
`an external contact (electrical) reader.
`0049 Generally, a dual-interface smart card comprises a
`boosterantenna (BA) with coupler coil (CC) in its card body
`(CB), and a metallized face plate (202. 302) having a window
`opening (220, 320) for an antenna module (AM) having a
`module antenna (MA). Attenuation caused by the metallized
`face plate may be reduced (overall performance may be
`improved) by one or more of
`0050 making the window opening substantially larger
`than the antenna module (AM),
`
`AmaTech Group Limited Exhibit 2017
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`IPR2022-00650
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`US 2013/0126622 A1
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`May 23, 2013
`
`roviding perforations through the face plate, dis
`OOS1
`p
`gp
`9.
`p
`posing ferrite material between the face plate and the
`booster antenna,
`0.052
`modifying contact pads (CP) on the antenna mod
`ule (AM),
`0053 disposing a compensating loop (CL) under the
`booster antenna (BA),
`0054 offsetting the antenna module (AM) with respect
`to the coupler coil (CC),
`0055 arranging the booster antenna as a quasi-dipole,
`0056 providing the module antenna (MA) with capaci
`tive stubs, and
`0057 disposing a ferrite element (FE) in the antenna
`module (AM) between the module antenna (MA) and
`the contact pads (CP).
`0058 According to an embodiment of the invention, a
`Smart card having a metallized face plate with a window
`opening for accepting an antenna module, and a card body
`with a booster antenna including a coupler coil, wherein the
`window opening has a baseline size approximately equal to a
`size of the antenna module, may be characterized in that the
`window opening is Substantially larger than the antenna mod
`ule. The window opening may be at least 10% larger than the
`antenna module, resulting in a gap between inner edges of the
`window opening and the antenna module. A ferrite layer may
`be disposed between the face plate and the boosterantenna. A
`plurality of perforations may be formed in the face plate
`extending around at least one of the window opening and the
`periphery of the face plate. At least some of these perforations
`may reduce the amount of faceplate material in an area Sur
`rounding the window opening or around the periphery of the
`face plate by 25-50%. A compensation loop may be disposed
`behind the boosterantenna. The compensation loop may have
`a gap, and two free ends, may comprise a conductive material
`Such as copper, and may comprise ferrite.
`0059. One or more of the following features may be
`included in the Smart card:
`0060 the booster antenna may be configured as a quasi
`dipole, with or without a coupler coil;
`0061 the booster antenna may be provided with an
`extension;
`0062 the booster antenna may comprise two overlap
`ping booster antennas;
`0063 the booster antenna may be provided primarily in
`an upper portion of the Smart card;
`0064 the module antenna may be offset from the cou
`pler coil.
`0065. The smart card may further comprise at least one of
`the following features:
`0.066
`a ferrite element may be disposed between the
`module antenna and contact pads of the antenna module;
`0067 capacitive stubs may be added to the module
`antenna,
`0068 the module antenna may comprise two separate
`coils;
`0069 the module antenna may comprise two windings
`connected in a quasi-dipole configuration;
`0070 perforations in the contact pads of the antenna
`module.
`0071. According to an embodiment of the invention, a
`method of minimizing attenuation of coupling by the face
`plate of a metallized Smart card having a boosterantenna with
`a coupler coil in its card body, may comprising one or more
`of:
`
`0072 making a window opening in the faceplate larger
`than the antenna module;
`0.073
`providing perforations through the face plate:
`0.074
`providing ferrite material between the face plate
`and the booster antenna;
`0075 disposing a compensating loop under the booster
`antenna.
`0076. The antenna module may be offset with respect to
`the coupler coil. The booster antenna may be arranged as a
`quasi-dipole; the module antenna may be provided with
`capacitive stubs; ferrite may be provided in the antenna mod
`ule between the module antenna and the contact pads. The
`contact pads may be trimmed or perforated.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`0077 Reference will be made in detail to embodiments of
`the disclosure, non-limiting examples of which may be illus
`trated in the accompanying drawing figures (FIGs). The fig
`ures are generally in the form of diagrams. Some elements in
`the figures may be exaggerated, others may be omitted, for
`illustrative clarity. Some figures may be in the form of dia
`grams. Although the invention is generally described in the
`context of various exemplary embodiments, it should be
`understood that it is not intended to limit the invention to these
`particular embodiments, and individual features of various
`embodiments may be combined with one another. Any text
`(legends, notes, reference numerals and the like) appearing on
`the drawings are incorporated by reference herein.
`0078 FIG. 1 is a cross-sectional view of a dual interface
`(DI) Smart card, and readers.
`007.9
`FIG. 1A is a diagrammatic top view of a booster
`antenna (BA) with coupler coil (CC).
`0080 FIG. 2 is a diagrammatic cross-sectional view of a
`Smart card with metallization.
`I0081
`FIG. 2A is a partial diagrammatic perspective view
`of a Smart card with metallization.
`I0082 FIGS. 3A.B.C are diagrammatic top views of
`embodiments of a face plate (ML) for a smart card.
`I0083 FIG. 4A is diagram of a layer with a compensating
`loop having a gap.
`I0084 FIG. 4B is diagram of a layer with a compensating
`loop, without a gap.
`I0085 FIG. 5 is a plan view of a typical arrangement of
`contact pads (CP) on a module tape (MT).
`I0086
`FIG. 5A is a diagram showing an exemplary contact
`pad layout and assignments.
`I0087 FIG. 6A is a plan view illustrating extending outer
`edges of contact pads (CP).
`I0088 FIG. 6B is a plan view illustrating trimming outer
`edges of contact pads (CP).
`I0089
`FIG. 6C is a plan view illustrating increasing the gap
`between contact pads (CP).
`0090 FIG. 6D is a plan view illustrating modifying the
`gap between contact pads (CP).
`0091
`FIG. 7A is a plan view illustrating perforating the
`contact pads (CP).
`0092 FIG. 7B is a cross-sectional view illustrating thin
`ning the contact pads (CP).
`0093 FIG. 8A is a plan view illustrating the underside of
`a module tape (MT).
`0094 FIG. 8B is a plan view illustrating perforating the
`contact pads (CP).
`0.095
`FIG. 9A is a plan view illustrating perforating the
`contact pads (CP).
`
`AmaTech Group Limited Exhibit 2017
`Page 16 of 27
`IPR2022-00650
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`US 2013/0126622 A1
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`May 23, 2013
`
`0096 FIG.9B is a plan view illustrating perforating the
`contact pads (CP).
`0097 FIG. 10A is plan view of the underside of an (AM),
`having two antenna segments.
`0098 FIG. 10B is a diagrammatic view of an antenna
`structure (AS).
`
`DESCRIPTION
`0099 Various embodiments will be described to illustrate
`teachings of the invention(s), and should be construed