as) United States
`a2) Patent Application Publication 10) Pub. No.: US 2008/0164326 Al
`
`
`(43) Pub. Date:Iwakataetal. Jul. 10, 2008
`
`US 20080164326A1
`
`(54) CONNECTING PART FOR MOUNTINGIC
`CHIP, ANTENNA CIRCUIT, IC INLET, IC TAG
`
`AND METHOD OF ADJUSTING
`CAPACITANCE
`Inventors:
`Yuichi Iwakata, Tokyo (JP); Taiga
`Matsushita, Tokyo (JP)
`
`(75)
`
`Correspondence Address:
`SoCAL IP LAW GROUP LLP
`310 N. WESTLAKE BLVD.STE 120
`WESTLAKEVILLAGE,CA 91362
`
`(73) Assignee:
`(21) Appl. No.:
`—
`(22)
`Filed:
`
`Lintee Corporation, Tokyo (JP)
`11/969.177
`,
`Jan. 3, 2008
`
`(30)
`
`Foreign Application Priority Data
`
`Jan. 4, 2007
`
`(IP) woeeecceesesescteeeceneneeeeees 2007-126
`
`30 1C TAG
`
`Publication Classification
`
`GD ae (2006.01)
`HO5SK 7/00
`(2006.01)
`HOLL 21/50
`(2006.01)
`(52) U.S.CL........ 235/492; 361/807; 438/6; 257/E21.499
`
`(57)
`ABSTRACT
`Whenat least one IC chip is mounted on electrode parts, a
`connecting part for mounting IC chip accordingto the present
`invention can control an area of an overlap betweenthe elec-
`trode parts onwhich each IC chip is mounted and each IC chip
`according to a mounting position ofeach IC chip. An antenna
`circuit according to the present invention includes a connect-
`ing part for mounting IC chip and an antenna unit of the
`present invention. An IC inlet according to the present inven-
`tion includes at least one IC chip on the connecting part for
`mounting IC chip of the antennacircuit of the present inven-
`tion.
`
`y
`
`TOANTENNA CIRCUIT
`
`7 1C CHIP
`13 SURFACE SUBSTRATE FOR PRINTING
`
`6 CIRCUIT SUBSTRATE
`
`12a ADHESIVE
`12
`AGENT LAYER|poupLE-s!pEp
`
`12b BONDING
`ADHESIVE
`AGENT LAYER} MATERIAL
`15RELEASE
`MATERIAL
`
`14 SUPPORT
`
`Infineon Exhibit 1031
`Infineon v. AmaTech
`Infineon v. AmaTech
`
` Infineon Exhibit 1031
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 1 of 7
`
`US 2008/0164326 Al
`
`FIG.1
`
`4 JUMPER
`
`10 ANTENNA CIRCUIT
`
`3 INSULATING RESIST
`
`
`
`6 CIRCUIT
`SUBSTRATE
`
`2 CONNECTING PART FOR
`MOUNTING IC CHIP
`
`FIG.2
`4 JUMPER
`
`20 1C INLET
`
`3 INSULATING RESIST
`
`2 CONNECTING PART FOR
`MOUNTING IG CHIP
`
`5 PLANE COIL
`|
`6 CIRCUIT
`SUBSTRATE
`
`+ ie CHIP
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 2 of 7
`
`US 2008/0164326 Al
`
`C
`
`B
`
`A
`
`0
`
`FIG.3
`
`c
`
`b
`
`a
`
`C
`
`8
`
`A
`
`0
`
`7 1G CHIP
`
`PATTERN 1
`
`FIG.4A
`
`C
`
`71 CHIP
`
`
`
`PATTERN 2
`
`FIG.4B
`
`7 1C CHIP
`
`C
`
`PATTERN 3
`
`FIG.4C
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 3 of 7
`
`US 2008/0164326 Al
`
`FIG.5
`
`4 JUMPER
`
`30 1C TAG
`
`3 INSULATING RESIST
`
`2 CONNECTING PART FOR
`MOUNTING IG CHIP
`
`S PLANE COIL
`
`6 CIRCUIT
`SUBSTRATE
`
`710 CHIP
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 4 of 7
`
`US 2008/0164326 Al
`
`
` INIGNOE921G4G1S-FTENOd}wayyqNaoyolJAISFHAY&ZL
`
`AAISSHQV
`AWIMSLV|MAAV1LINGO
`
`
`
`JLVYLSENSLINDYED9
`
`ASVATAUSL=LYOddAS71
`YNNALNYOL
`
`DVL91OF
`
`9°OI
`
`WEYLYW
`
`
`
` ONTINIYdYO4FLVYLSENSFov4unsELdIHOO12JLINOYIO
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 5 of 7
`
`US 2008/0164326 Al
`
`
`
`7a
`
`TEST CONNECTING
`TERMINAL
`FIG.8B
`
`x
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 6 of 7
`
`US 2008/0164326 Al
`
`FIG.9A
`
`4
`FIG.9B
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 7 of 7
`
`US 2008/0164326 Al
`
`
`A 0
`
`C
`
`B
`
`A
`
`0
`
`2
`
`C
`
`B
`
`PATTERN 3
`FIG.10D
`
`100 um
`FIG.10A
`
`PATTERN 1
`FIG.10B
`
`0
`
`0
`
`PATTERN 2
`FIG.10C
`
`

`

`US 2008/0164326 Al
`
`Jul. 10, 2008
`
`CONNECTING PART FOR MOUNTINGIC
`CHIP, ANTENNA CIRCUIT, IC INLET, IC TAG
`AND METHOD OF ADJUSTING
`CAPACITANCE
`
`RELATED APPLICATION INFORMATION
`
`[0001] This application claims, under 35 USC 119, priority
`of Japanese Application No. 2007-126 filed on Jan. 4, 2007.
`
`BACKGROUNDOF THE INVENTION
`
`Description of the Background Art
`
`[0002] The presentinventionrelates to a connecting part for
`mounting IC chip, an antenna circuit, an IC inlet, an IC tag
`and a method of adjusting capacitance.
`[0003] A non-contact IC tag receives electric power by
`acquiring resonance frequency which resonates with trans-
`mission frequency of a reader-writer. The fed electric power
`drives an IC chip, and enables reading/writing ofdata. To feed
`sufficient electric power, transmission frequency needs to
`resonate with resonance frequency.
`[0004] Whenthe IC tag is mass-produced,variationin reso-
`nance frequency may occur due to variation generated in a
`manufacturing process of the IC chip or an antennacircuit.
`[0005]
`For this reason, at manufacturing ofthe IC tag,it is
`necessary to make an adjustment so as to obtain resonance
`frequency resonating with transmission frequency.
`[0006] As represented by the following relational expres-
`sion (1), the resonance frequency fis determined by capaci-
`tance C of the whole IC inlet and an inductance L of the
`antennacircuit.
`
`fan(LOYS
`
`(1)
`
`[0007] Conventional methods of adjusting the resonance
`frequency at manufacturing of the IC tag include,
`for
`instance, a method of providing an adjusting capacitor in a
`circuit and cutting a part of the adjusting capacitor after
`mounting of the IC chip. Moreover, another methodincludes
`a methodofproviding a plurality of adjusting capacitors in a
`circuit and selecting an optimum path while varying a mount-
`ing site of the IC chip as described in Japanese patent Laid-
`Open No. 2004-78768.
`[0008] However, since the conventional methodsof adjust-
`ing resonance frequency using the adjusting capacitor
`requires a trimmingstep of adjusting frequency after mount-
`ing of the IC chip, the numberof steps of manufacturing the
`IC tag is increased.
`[0009] Moreover, since the latter conventional method of
`selecting an optimum path for adjustment has the step of
`selecting the mountingsite of the IC chip amongthe plurality
`of adjusting capacitors, there is another problem that options
`for adjustmentare limited.
`
`SUMMARYOF THE INVENTION
`
`invention is to adjust
`[0010] An object of the present
`capacitance of an IC chip to be mounted with a simple struc-
`ture while making a manufacturing process moreefficient.
`[0011] Whenat least one IC chip is mounted on electrode
`parts, a connecting part for mounting IC chip ata first aspect
`can control an area of an overlap between the electrode parts
`on which each IC chip is mounted and each IC chip according
`to the mounting position of each IC chip.
`
`Ina connecting part for mounting IC chip at a sec-
`[0012]
`ond aspect,the electrodepartsatthefirst aspect have different
`spaces between the electrode parts in the longitudinal direc-
`tion ofthe electrode parts.
`[0013]
`Inaconnecting part for mounting IC chip at a third
`aspect, wherein the electrode partsatthefirst or second aspect
`are shaped to be symmetrical between the electrodeparts.
`[0014]
`Inaconnecting part for mounting IC chip at a fourth
`aspect, the electrode parts at the first or second aspect are
`shaped to be asymmetrical between the electrode parts.
`[0015] An antennacircuitat a fifth aspect includes a con-
`necting part for mounting IC chip which, whenatleast one IC
`chip is mounted on electrode parts, can control an area of an
`overlap between the electrode parts on which each IC chip is
`mounted and each IC chip according to the mounting position
`of each IC chip; and an antenna unit.
`[0016]
`Inan antennacircuit at a sixth aspect, the electrode
`parts at the fifth aspect have different spaces between the
`electrode parts in the longitudinal direction of the electrode
`parts.
`In an antennacircuit at a seventh aspect, the elec-
`[0017]
`trode parts at the fifth or sixth aspect are shaped to be sym-
`metrical between the electrode parts.
`[0018]
`In an antennacircuit at an eighth aspect, the elec-
`trode partsat the fifth or sixth aspect are shaped to be asym-
`metrical between the electrode parts.
`[0019] An IC inlet at a ninth aspect includes a connecting
`part for mounting IC chip which, whenat least one IC chip is
`mounted on electrode parts, can control an area of an overlap
`betweenthe electrode parts on which each IC chip is mounted
`and each IC chip according to the mounting position of each
`IC chip; at least one IC chip mounted on the connecting part
`for mounting IC chip; and an antenna unit.
`[0020]
`In an IC chip inlet at a tenth aspect, the electrode
`parts at the ninth aspect have different spaces between the
`electrode parts in the longitudinal direction of the electrode
`parts.
`In an IC inlet at an eleventh aspect, the electrode
`[0021]
`parts at the ninth or tenth aspect are shaped to be symmetrical
`between the electrode parts.
`[0022]
`Inan IC inlet at a twelfth aspect, the electrode parts
`at the ninth or tenth aspect are shaped to be asymmetrical
`between the electrode parts.
`[0023] An IC tag at a thirteenth aspect includes an IC inlet
`including a connecting part for mounting IC chip which,
`whenat least one IC chip is mounted on electrode parts, can
`control an area of an overlap between the electrode parts on
`which each IC chip is mounted and each IC chip according to
`the mounting position of each IC chip; at least one IC chip
`mounted on the connecting part for mounting IC chip; and an
`antenna unit.
`
`In an IC tag at a fourteenth aspect, the electrode
`[0024]
`parts at the thirteenth aspect have different spaces between
`the electrode parts in the longitudinal direction of the elec-
`trode parts.
`[0025]
`Inan IC tag at a fifteenth aspect, the electrode parts
`at the thirteenth or fourteenth aspect are shaped to be sym-
`metrical between the electrode parts.
`[0026]
`InanIC tag ata sixteenth aspect, the electrode parts
`at the thirteenth or fourteenth aspect are shaped to be asym-
`metrical between the electrode parts.
`[0027] A method of adjusting capacitance at a seventeenth
`aspect includes, when at least one IC chip is mounted on
`electrode parts of a connecting part for mounting IC chip, a
`
`

`

`US 2008/0164326 Al
`
`Jul. 10, 2008
`
`step of adjusting a capacitance determined by each IC chip
`and the electrode parts by varying an area of an overlap
`betweenthe electrode parts on which each IC chip is mounted
`and each IC chip according to the mounting position of each
`IC chip.
`[0028] At the above-mentioned aspects, the capacitance of
`the IC inlet can be adjusted with a simple structure while
`making a manufacturing process more efficient. As a result,
`resonance frequency which enables supply ofsufficient elec-
`tric power can be adjusted, thereby optimizing functions of
`the IC tag.
`
`DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 isa structure diagram of an antennacircuit in
`[0029]
`accordance with a first embodiment;
`[0030]
`FIG. 2 is a structure diagram of an IC inlet in accor-
`dance with the first embodiment;
`[0031] FIG.3 isa view showingthe shapeofelectrode parts
`of a connecting part for mounting IC chip in accordance with
`the first embodiment;
`[0032]
`FIG. 4A is a view showinga difference in an areaS
`of an overlap between electrode parts and an IC chip ina state
`where a mounting position of the IC chip in accordance with
`the first embodimentis varied (1);
`[0033]
`FIG. 4B isa view showing difference in the area S of
`the overlap between the electrode parts and the IC chip in the
`state where the mounting position of the IC chip in accor-
`dance with the first embodimentis varied (2);
`[0034] FIG.4C isa view showing difference in the area S of
`the overlap between the electrode parts and the IC chip in the
`state where the mounting position of the IC chip in accor-
`dance with the first embodimentis varied (3);
`[0035]
`FIG. 5 is a structure diagram of an IC tag in accor-
`dance with the first embodiment;
`[0036]
`FIG. 6 isa sectional view ofthe IC tag in accordance
`with the first embodiment;
`[0037] FIG.7 is aview showing a modification ofthe shape
`of the electrode parts of a connecting part for mounting IC
`chip in accordance with the first embodiment(1);
`[0038]
`FIG. 8A is a view showing a modification of the
`shapeofthe electrode parts of the connecting part for mount-
`ing IC chip in accordancewith the first embodiment(2-1);
`[0039]
`FIG. 8B is a view showing a modification of the
`shapeofthe electrode parts of the connecting part for mount-
`ing IC chip in accordancewith the first embodiment(2-2);
`[0040]
`FIG. 9A is a view showing a modification of the
`shapeofthe electrode parts of the connecting part for mount-
`ing IC chip in accordancewith the first embodiment(3-1);
`[0041]
`FIG. 9B is a view showing a modification of the
`shapeofthe electrode parts of the connecting part for mount-
`ing IC chip in accordancewith the first embodiment(3-2);
`[0042]
`FIG. 10A is a view for describing an example of
`mounting of the IC chip in accordance with the first embodi-
`ment;
`
`FIG. 10B is a view for describing an example of
`[0043]
`mounting of the IC chip in accordance with the first embodi-
`ment;
`
`FIG. 10C is a view for describing an example of
`[0044]
`mounting of the IC chip in accordance with the first embodi-
`ment; and
`
`FIG. 10D is a view for describing an example of
`[0045]
`mounting of the IC chip in accordance with the first embodi-
`ment.
`
`DESCRIPTION OF THE PREFERRED
`EMBODIMENTS
`
`(A) First Embodiment
`[0046]
`[0047] Hereinafter, a connecting part for mounting IC chip,
`an antenna circuit, an IC inlet, an IC tag and a method of
`adjusting capacitance in accordance with a first embodiment
`of the present invention will be described referring to draw-
`ings.
`(A-1) Structure of First Embodiment
`[0048]
`(A-1-1) Structure of Antenna Circuit and IC Inlet
`[0049]
`FIG. 1 is astructure diagram showing a structure of
`[0050]
`the antenna circuit having the connecting part for mounting
`IC chip in accordance with the first embodiment. FIG. 2 is a
`structure diagram showing a structure ofthe IC inlet in accor-
`dance with the first embodiment.
`
`InFIG.1, the antenna circuit 10 includes a plane coil
`[0051]
`(antenna unit) 5, a jumper 4, an insulating resist 3 and a
`connecting part for mounting IC chip 2 ona plane ofa circuit
`substrate 6. The antenna circuit 10 shown in FIG. 1 is an
`
`opened circuit and becomesa closed circuit when an IC chip
`is mounted on the connecting part for mounting IC chip 2.
`[0052]
`In FIG.2, an IC inlet 20 refers to a circuit in a state
`where an IC chip 7 is mounted on the connecting part for
`mounting IC chip 2 ofthe antenna circuit 10 shown in FIG.1.
`In the first embodiment, althoughthe single antenna circuit 10
`is equipped with one IC chip 7, a plurality of IC chips 7 may
`be mounted.
`
`[0053] Asthe circuit substrate 6, a synthetic resin film made
`of polyethylene, polypropylene, polyethylene terephthalate,
`polyvinyl chloride, polyimide or polycarbonate and a sheet
`material such as paper including woodfree paper, coated
`paper, glassine paper, nonwoven fabric may be employed.
`The thickness of the circuit substrate 6 is not specifically
`limited, preferably 5 to 300 um, more preferably 10 to 200
`uum.
`[0054] The plane coil 5 forming the antenna unit mainly
`functions as an antenna and serves to feed electric power. The
`plane coil 5 can be formed by using a method of winding a
`coated copperwire in the shape ofa coil, a methodofprinting
`a conductive paste in the shape of a coil, a method of forming
`a conductive metal layer which is made of copperorthe like
`laminated onthe circuit substrate 6 to be shapedlike a coil by
`etching or a similar method. Metal particles of gold, silver,
`nickel or the like dispersed in a binder can be used as the
`conductive paste. Polyester resin, polyurethane resin, epoxy
`resin can be used as the binder. The numberof turns, width
`and spacing circuit wire of the plane coil 5 can be arbitrarily
`set according to desirable resonance frequency.
`[0055] An end (outermost end) located on an outer side of
`the plane coil 5 is connected to one electrode part of the
`connecting part for mounting IC chip 2 which is located on an
`innerside of the plane coil 5 via the jumper 4. An end (inner-
`most end) located on the inner side of the plane coil 5 is
`connected to the other electrodepart ofthe connecting part for
`mounting IC chip 2.
`[0056] The jumper4 servesto electrically connect the outer
`end and the inner endofthe plane coil 5. A conductive paste
`or a conductive ink having dispersed metal particles of gold,
`silver, nickel or the like can be used as the jumper4.
`
`

`

`US 2008/0164326 Al
`
`Jul. 10, 2008
`
`Theinsulatingresist 3 is disposed below the jumper
`[0057]
`4. The insulating resist 3 achieves isolation between the
`jumper 4 and each loop of the plane coil 5. For example,
`insulating resin having acrylic resin, urethane resin, acrylic
`urethane resin as main ingredients can be usedas the insulat-
`ing resist 3.
`[0058] The connecting part for mounting IC chip 2 is
`formed ofa pair of electrode parts on which the IC chip 7 is
`mounted. Electrode parts ofthe connecting part for mounting
`IC chip 2 may be made ofa conductive material such as metal
`such as copper and aluminum or conductive ink of silver paste
`or the like.
`
`[0065] When the IC chip 7 is mounted, by changing the
`mounting position of the IC chip 7 to adjust the area S of the
`overlap betweenthe electrode parts ofthe connecting part for
`mounting IC chip 2 andthe IC chip 7, the capacitance C ofthe
`overall IC inlet can be adjusted.
`[0066] That is, the capacitance C of the overall IC inlet can
`be increased by making the area S larger and the capacitance
`C ofthe overall IC inlet can be decreased by making the area
`S smaller.
`
`FIG. 3 is a view showingthe shapeofthe electrode
`[0067]
`parts ofthe connecting part for mounting IC chip 2. FIGS. 4A
`to 4C are views showing a difference in the area S in a state
`where the mounting position of the IC chip 7 mounted on the
`electrode parts of the connecting part for mounting IC chip 2
`shown in FIG.3 is varied.
`
`[0059] When the IC chip 7 is mountedonthe electrode parts
`ofthe connecting part for mounting IC chip 2, the IC chip 7 is
`connected to the electrode parts of the connecting part for
`mounting IC chip 2 by using a connecting material. Solder,
`anisotropic conductive adhesive, anisotropic conductive
`adhesive film or the like can be used as the connecting mate-
`rial. A material including epoxyresin having dispersed metal
`particles therein as main ingredients can be used as the aniso-
`tropic conductive adhesive and the anisotropic conductive
`adhesive film.
`
`[0060] The electrode parts of the connecting part for
`mounting IC chip 2 is shaped so that an area of an overlap
`betweenthe electrode parts of the connecting part for mount-
`ing IC chip 2 and the IC chip 7 can be adjusted by changing a
`mounting position ofthe IC chip 7 in mounting the IC chip 7.
`[0061]
`Since the electrode parts of the connecting part for
`mounting IC chip 2 is shaped as described above,the area of
`the overlap betweenthe electrode parts ofthe connecting part
`for mounting IC chip 2 and the IC chip 7 can be changed by
`changing the mounting position of the IC chip 7 in mounting
`the IC chip 7. Thus, capacitance (mounting capacitance of
`installing state with IC chip) C, generating in the overlap
`betweenthe electrode parts of the connecting part for mount-
`ing IC chip 2 and the IC chip 7 can be adjusted. As a result, the
`IC inlet can be adjusted to have desired resonance frequency.
`[0062] Generally, when the IC chip 7 is mounted on the
`electrode parts of the connecting part for mounting IC chip 2,
`an area S of the overlap between the electrode parts of the
`connecting part for mounting IC chip 2 and the IC chip 7
`correlates with a mounting capacitance C, depending on the
`mounted chip 7 and the electrode parts according to the fol-
`lowing relational expression. €,
`represents a dielectric con-
`stant in vacuum,€,
`represents a relative dielectric constant
`and d represents a distance between the IC chip 7 and the
`electrode parts.
`C3=€€,(S/d)
`
`(2)
`
`In FIG. 3, the shape of the electrode parts of the
`[0068]
`connecting part for mounting IC chip 2 varies depending on
`the space between both of the electrode parts in the longitu-
`dinal direction ofthe electrode parts ofthe connecting part for
`mounting IC chip 2. That is, the electrode parts of the con-
`necting part for mounting IC chip 2 is symmetric so that a
`space between both ofthe electrode parts in a section from a
`point O to a point A is a space a, a space between both ofthe
`electrode parts in a section from the point A to a point B isa
`space b and a space between both of the electrode parts in a
`section from the point B to a point C is a space c.
`[0069]
`FIG. 4A shows a mounting pattern (pattern 1) ina
`case where the IC chip 7 is mounted in the section from the
`point B to the pointC ofthe electrodeparts of the connecting
`part for mounting IC chip 2. FIG. 4B shows a mounting
`pattern (pattern 2) in a case where the IC chip 7 is mounted in
`the section from the point A to the point B of the electrode
`parts of the connecting part for mounting IC chip 2. FIG. 4C
`shows a mounting pattern (pattern 3) in a case where the IC
`chip 7 is mounted in the section from the point O to the point
`A ofthe electrode parts of the connecting part for mounting
`IC chip 2.
`[0070] Thus, when the mounting position ofthe IC chip 7 is
`varied, as shown in FIGS. 4A to 4C, the area S (hatched
`portion in FIGS. 4A to 4C) of the overlap betweenthe elec-
`trode parts of the connecting part for mounting IC chip 2 and
`the IC chip 7 can be increasedin the order ofFIG. 4A, FIG. 4B
`and FIG. 4C. Consequently, the mounting capacitance C, can
`be madelarger in this order.
`[0071] When the connecting part for mounting IC chip 2
`having a predetermined shape is provided in advancein this
`manner, the area S can be easily adjusted merely by changing
`the mounting position ofthe IC chip 7 in mounting the IC chip
`7. As a result, the capacitance of the whole IC inlet can be
`adjusted.
`Thatis, the mounting capacitance C, depending on
`[0063]
`[0072] Although the IC chip 7 is mounted in the section
`the mounted chip 7 and the electrode parts is proportional to
`with the uniform space between bothofthe electrode parts in
`the area S of the overlap between the electrode parts of the
`FIGS. 4A to 4C, the IC chip 7 may be mounted over sections
`connecting part for mounting IC chip 2 and the IC chip 7 in the
`with different spaces between both ofthe electrode parts.
`above expression (2). As explained referring to the above
`[0073]
`(A-1-2) Structure of IC Tag
`expression (1), the resonance frequency f is determined by
`[0074] Next, structure of the IC tag in accordance with a
`adjusting the capacitance C of the overall IC inlet.
`first embodimentwill be described referring to drawings.
`[0064]
`Inthe actualIC inlet, the capacitance C ofthe overall
`
`[0075] FIG. 5 isastructure diagram showing the IC tag in
`accordance with the first embodiment. FIG.6 is a side sec-
`IC inlet can be represented as a sum ofthe following compo-
`nents. Given that the original capacitance ofthe IC chip is C,,
`tional view showingastructure of a cross section ofthe IC tag
`in accordance with thefirst embodiment.
`stray capacitance generated from the antennacircuit is C, and
`the mounting capacitance is C,,
`the following relational
`expression 1s satisfied.
`C=C4+C2C3
`
`[0076] The IC tag 30 is shapedlike a tag obtained by apply-
`ing predeterminedtag processing to the IC inlet 20 shown in
`FIG.2.
`
`(3)
`
`

`

`US 2008/0164326 Al
`
`Jul. 10, 2008
`
`resin and long-chain alkyl-based resin may be used as the
`release agent used for the release agent layer of the release
`material 15. A thickness of the release material 15 is prefer-
`ably 5 to 300 um, more preferably 10 to 200 um. A thickness
`of the release agent layer is not specifically limited and may
`be appropriately selected according to applications.
`[0083] The surface substrate for printing 13 is a substrate
`for printing visible information such as information on a
`product thereon. The surface substrate for printing 13 is also
`a substrate formed on one surface of the IC inlet 20 as nec-
`
`essary to protect the IC inlet. For example, visible informa-
`tion including product information (e.g. product number and
`product name), price, bar code, pattern and mark is printed on
`the surface substrate for printing 13. It is preferred that a
`surface of the surface substrate for printing 13 has the suit-
`ability for printing. Various materials for the surface substrate
`for printing 13 such as synthetic resin film, synthetic paper,
`nonwovenfabric and paper can be used. As necessary, a layer
`for various types of record such as heat-sensitive record,
`pressure-sensitive record, thermaltransfer record, laser beam
`record and ink jet record may be formed on the surface sub-
`strate for printing 13. The surface substrate for printing 13
`may be a transparent substrate or an opaque substrate. A
`thickness of the surface substrate for printing 13 is not spe-
`cifically limited, and is preferably 5 to 200 um, moreprefer-
`ably 10 to 150 um. The surface substrate for printing 13 can be
`laminated by using an adhesive such as polyethylene,
`polypropylene, polyester or the same adhesiveas the pressure
`sensitive adhesive agent layer 12a. As the thickness of the
`pressure sensitive adhesive agent layer 12a, the thickness of
`these adhesives (not shown) is preferably 5 to 100 um, more
`preferably 10 to 70 um.
`[0084]
`(A-2) Operations of First embodiment
`[0085] Next, a method of manufacturing the IC tag 30 in
`accordancewiththefirst embodiment and a method ofadjust-
`ing the capacitance of the whole IC inlet according to an
`mounting position of the IC chip 7 mounted on the electrode
`parts of the connecting part for mounting IC chip 2 will be
`described.
`
`[0077] As shownin FIG.6, the IC tag 30 mainly includes
`the circuit substrate 6, the antenna circuit 10, the IC chip 7, a
`double-sided pressure sensitive adhesive material 12, a sur-
`face substrate for printing 13 and a release material 15. In
`FIG.6, each layer is shownto be thick for facilitating under-
`standing. However, in fact, the whole thickness from the
`surface substrate for printing 13 to the release material 15 is
`about less than 1 mm.
`
`[0078] The double-sided pressure sensitive adhesive mate-
`rial 12 is an pressure sensitive adhesive material for bonding
`an adherend (for example, an article such as a product) to the
`antenna circuit 10 in a state where the pressure sensitive
`adhesive material 12 is laminated on a surface of the antenna
`circuit 10. The double-sided pressure sensitive adhesive
`material 12 includes a support 14, a pressure sensitive adhe-
`sive agent layer 12a and a bonding agent layer 126. As a
`modification, the double-sided pressure sensitive adhesive
`material 12 may include a single pressure sensitive adhesive
`agent layer without the support 14 and the bonding agent
`layer 126.
`[0079]
`For example, the support 14 forming the double-
`sided pressure sensitive adhesive material 12 may be made of
`synthetic resin film, paper, nonwovenfabric or the like. For
`example, whenthe synthetic resin film is used, various mate-
`rials for the film including polyethylene terephthalate,
`polypropylene, polyvinyl] chloride, polyurethane and polyim-
`ide may be employed. A thickness of the support 14 made of
`such material is preferably, 5 to 100 um, and more preferably
`10 to 80 um.
`[0080] The pressure sensitive adhesive agent layer 12a is a
`layer which is formed on one surface of the support 14 and
`seals the antenna circuit 10 and the mountedIC chip 7,fol-
`lowing irregularity thereof. The material of the pressure sen-
`sitive adhesive agent layer 12a is not specifically limited and
`various materials can be employed as long as the pressure
`sensitive adhesive agent layer 12a has enough adhesion/ad-
`hesive force to bond the IC chip 7 and the antennacircuit 10
`on the support 14. For example, rubber-based, acrylic-based,
`silicone-based and polyurethane-based pressure sensitive
`adhesives may be used. Especially, acrylic-based pressure
`sensitive adhesives are excellent in adhesion/adhesive force.
`
`[0086] The IC tag 30 in accordance with the first embodi-
`ment is manufactured mainly by below describedfirst step to
`A thicknessofthe pressure sensitive adhesive agent layer 12a
`fifth step.
`is preferably 5 to 100 wm, more preferably 10 to 70 um.
`[0087]
`First step (conductive layer forming step): The plane
`[0081] The bonding agent layer 126 is a bonding agent
`coil 5 of the antenna circuit 10 and a conductive layer of the
`layer which is formed on the other surface of the support 14
`connecting part for mounting IC chip 2 are formed on a sheet
`and bonds the IC tag 30 to the adherend (for example, an
`material for the circuit substrate 6 simultaneously.
`article such as a product). To protect the bonding agent layer
`125, the release material 15 is formed on the surface of the
`[0088] Theconductive layer is formed by using a method of
`bonding a copper or aluminum foil formed in the predeter-
`bonding agent layer 125. As long as the bonding agentlayer
`mined shapeof a coil by punching in advance on the circuit
`124 enables the IC tag 30 to be bonded to the adherend,
`substrate 6 via an adhesive layer (not shown), a method of
`various materials for the bonding agent layer 125 can be used.
`forming a metallayer onthe circuit substrate 6 by ion plating,
`For example, rubber-based, acrylic-based, silicone-based and
`deposition orthe like and then applying etchingresist printing
`polyurethane-based pressure sensitive adhesives may be
`such as screen printing to the metal layer and applying an
`used. A thickness ofthe bonding agent layer 12is preferably
`exposedportion to etching processing to form the metal layer
`5 to 100 um, more preferably 10 to 70 um,like the thickness
`in the shape of a coil, or a method of forming a metal paste
`of the pressure sensitive adhesive agent layer 12a.
`such asasilver paste in the predetermined shapeofa coil by
`[0082] The release material 15 serves to protect the bond-
`screen printing or the like. The type of a conductive material
`ing agent layer 125.It is preferable to form a release agent
`is not limited. When the conductive layer is formed, the
`layer on the surface contacting the bonding agent layer 125 as
`adhesive layer may be formed on a copperor aluminum foil in
`necessary. For example, paper such as polyethylene lami-
`advance.
`nated paper, coated paper and glassine paper and a synthetic
`resin film made of polyethylene, polypropylene, polyethyl-
`ene terephthalate or the like may be usedas the release mate-
`rial 15. For example, silicone-based resin, fluorine-based
`
`Second step (insulating layer forming step): An
`[0089]
`insulating layer forming the insulating resist 3 of the antenna
`circuit 10 is formed.
`
`

`

`US 2008/0164326 Al
`
`Jul. 10, 2008
`
`[0090] Any known methodof forming the insulating layer
`can be used and the type of an insulating material is not
`limited. Since the area where the insulating layer is formed is
`small, it is easy to apply screen printing.
`[0091] Third step (Gumper forming step): A conductive
`layer forming the jumper4 ofthe antennacircuit 101s formed.
`[0092] This conductive layer can be formed by printing
`processing using any of methods including metal paste such
`as screen printing and bonding of a metal foil. The type ofa
`conductive material is not limited.
`
`Thefirst step, the second step andthethird step are
`[0093]
`steps of forming the antenna circuit 10. Throughthefirst step
`to third step, conductive layers forming the plane coil 5 and
`the connecting part for mounting IC chip 2 as well as the
`insulating resist 3 and the jumper 4 can be formed.
`[0094]
`Fourth step (IC chip mounting step): The predeter-
`mined IC chip 7 is mountedat a predeterminedposition ofthe
`electrode parts of the connecting part for mounting IC chip 2
`on the antenna circuit 10 by using a connecting material.
`Thus, the IC inlet 20 is produced.
`[0095] At this time, the IC chip 7 is mountedat the prede-
`terminedpositionofthe electrode parts ofthe connecting part
`for mounting IC chip 2 by using, for example, an IC chip
`mounting machine. The position of the IC chip 7 where
`desired resonance frequency can be obtained is searched by
`changing the mounting position of the IC chip 7 and the IC
`chip 7 is mountedat the searched position.
`[0096]
`Inthis manner, when the mountedIC chips 7 having
`different capacitances C, are used, variation in the capaci-
`tance C of the whole IC inlet can be eliminated. Moreover,
`when the whole IC inlet having different capacitance C is
`manufactured, desired capacitance can be easily obtained by
`of the IC tag 30 will be described.
`changing the mounting position of the IC chip 7.
`[0107]
`First, a copper foil laminate film (manufactured by
`[0097]
`Fifth step (tag processing step): When formation of
`NIKKAN INDUSTRIES Co. Ltd.: product name “NIKAF-
`electric circuit components and mounting are finished, sur-
`LEX F-10T50C11”) obtained by bonding a copper foil (35
`face substrate for printing is coated by use of an adhesive or a
`um in thickness) on a polyethylene terephthalate (PET) resin
`pressure sensitive adhesive. For example, there is produced to
`film (50 ym in thickness) in advance was usedas the circuit
`any shape such asa card, a label andaseal.
`substrate 6.
`[0098]
`[Modifications]
`[0099] Although FIG. 3 shows the shape ofthe electrode
`parts of the connecting part for