as) United States
`a2) Patent Application Publication co) Pub. No.: US 2011/0205140 Al
`
` Amadeoetal. (43) Pub. Date: Aug. 25, 2011
`
`
`US 20110205140A1
`
`Publication Classification
`
`(51)
`
`(54) VARIABLE PITCH MANDREL WOUND
`Int.cl
`ANTENNAS AND SYSTEMS AND METHODS
`HO1O 7/00
`(2006.01)
`OF MAKING SAME
`HOIP 11/00
`(2006.01)
`(52) US. CM. cececcccessccssesscssessessesseseseesees 343/866; 29/600
`Inventors:
`(us)Amadeo, San nie, CA
`US); Jose Flores, Chula Vista, CA
`(57)
`ABSTRACT
`(US); Robert Kraft, Escondido,
`A system and method for fabricating a mandrel wound
`CA (US)
`antenna are provided. The method includes securingafirst
`(73) Assignee:
`Cubic Corporation, San Diego,
`end of a wire to a first portion of a mandrel tool, where the
`CA (US)
`mandrel tool includes a faceplate supporting a plurality of
`posts, and the posts arranged and disposed to define non-
`overlapping circumferential patterns. The method also
`includes wrapping the wire around outer peripheries of the
`plurality of posts to form non-overlapping wire coils around
`the plurality of circumferential patterns to provide an
`antenna. The method further includes securing a second end
`ofthe wire to a second portion ofthe mandrel tool, cutting the
`wire in proximity to the second end,attaching the antenna to
`a substrate separate from the faceplate, and detaching the
`antenna from the faceplate.
`
`(75)
`
`(21) Appl. No.:
`
`12/950,636
`
`(22)
`
`Filed:
`
`Nov. 19, 2010
`
`Related U.S. Application Data
`
`(60) Provisional application No. 61/262,836,filed on Nov.
`19, 2009.
`
`1020
`
`1035
`
`1022
`
`Infineon Exhibit 1024
`Infineon Exhibit 1024
`Infineon v. AmaTech
`
`Infineon v. AmaTech
`
`

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`510
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`Coating
`Subsystem
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` 500
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`Memory
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`Fig. 5
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`POSITION POSTS TO PROVIDE
`DESIRED ANTENNA AREA,WIRE
`LENGTH AND PITCH
`
`SECURE FIRST END WIRE TO
`MANDREL TOOL
`
`WRAP WIRE AROUND POSTS TO
`FORM NON-OVERLAPPING WIRE
`COILS
`
`SECURE SECOND END OF WIRE
`TO MANDREL TOOL AND CUT
`WIRE
`
`ATTACH ANTENNA TOA
`SUBSTRATE
`
`DETACH ANTENNA FROM
`FACEPLATE
`
`FIG. 13
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`

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`US 2011/0205140 Al
`
`Aug. 25, 2011
`
`VARIABLE PITCH MANDREL WOUND
`ANTENNAS AND SYSTEMS AND METHODS
`OF MAKING SAME
`
`In one embodiment, a mandrel tool includes spring-
`[0008]
`loaded pogopinsset to a desired pitch. A wiring head wraps
`an antenna wire around these pogo pins to form a complete
`coil antenna. The tool can be heated sothat the antenna could
`
`be hot-stamped into a plastic substrate. The tool can be
`designedso that the pogo pins can be positioned alongatrack,
`[0001] This application claimspriority to U.S. Provisional
`allowing for a tunable pitch.
`Patent Application No. 61/262,836, filed on Nov. 19, 2009,
`entitled
`“VARIABLE PITCH MANDREL WOUND
`[0009]
`Systems and methodsin accordance withthe disclo-
`sure in various embodiments can provide the following capa-
`bilities:
`
`ANTENNAS”, which is hereby expressly incorporated by
`reference in its entirety for all purposes.
`
`BACKGROUND
`
`variable pitch coiled wire antenna to allow for
`[0010]
`tuning of mutual inductance;
`[0011]
`hot stamp tool to simultaneously implant mul-
`tiple antennasinto a plastic substrate;
`[0002] Coil antennas are used to receive signals at a reso-
`nant frequency of a carrier signal. Some coil antennas are
`[0012]
`inexpensive antenna material;
`tuned to provide a mutual inductance that results in the
`[0013]
`inexpensive tooling;
`antenna being excited by the resonant frequency. Some coil
`[0014]
`low maintenance;
`antennas are so-called mandrel wound antennas. Mandrel
`[0015]
`faster production times compared to ultrasonic
`wound antennasare typically manufactured by winding the
`embedded antennas; and/or
`coils of the antenna on top of each other. Since the relative
`[0016] wider range of plastic substrates compared to
`spacing ofthe coils in this type of mandrel wound antennais
`ultrasonic embedded antennas(e.g., polyvinyl chloride
`unpredictable, the mutual inductance ofthese mandrel wound
`(PVC), polyethylene terephthalate (PET), Polycarbon-
`antennas is unpredictable. These types of mandrel wound
`ate (PC), Teslin™ andothers).
`antennas are tuned by adjusting the length of the wire while
`[0017]
`Inone embodiment, a methodof fabricating a man-
`fabricating the antenna.
`drel wound antennaincludes securingafirst end of a wire to
`[0003]
`In contrast to the unpredictable nature of normal
`a first portion of a mandrel tool, where the mandrel tool
`mandrel wound antennas, variable pitch antennas are
`includes a faceplate supporting a plurality of posts, and the
`designed with a precise spacing between the coils of the
`posts arranged and disposed to define a plurality of non-
`antenna that allow for fine tuning of the mutual inductance
`overlapping circumferential patterns. The method also
`between antenna coils. By adjustingthe pitch, overall antenna
`includes wrapping the wire around outer peripheries of the
`area can be maximized while maintaining the correct total
`plurality of posts to form a plurality of non-overlapping wire
`inductance and resonant frequencyofthe coil.
`coils around the plurality of circumferential patterns to pro-
`[0004] Coil antennas are commonly used in contactless
`vide an antenna, securing a second end ofthe wire to a second
`smart cards. Currently, the majority of variable pitch contact-
`portion of the mandrel tool, cutting the wire in proximity to
`less smart card antennas are manufactured with etched or
`the second end, attaching the antenna to a substrate separate
`printed antennas. Etching and printing processes are expen-
`from the faceplate, and detaching the antenna from the face-
`sive and entail the use of various materials that are environ-
`plate.
`mentally unfriendly. These disadvantages are addressed by
`In another embodiment, a mandrel tool system for
`[0018]
`coil antennas manufactured in accordance with the systems
`fabricating a mandrel woundantennais disclosed. The man-
`and methods described herein.
`drel tool system includesa first substrate configured to sup-
`port a plurality of posts arranged and disposed to define a
`plurality of non-overlapping circumferential patterns. The
`system further includes a wiring head configured to receive a
`wire and dispense the wire, and a manipulation subsystem
`coupledto at least oneofthe first substrate or the wiring head.
`The manipulation subsystem is configured to movethefirst
`substrate and/or the wiring headrelative to each other to wrap
`the wire being dispensed by the wiring head around outer
`peripheries of the plurality of posts to form a plurality of
`non-overlapping wire coils corresponding to the circumfer-
`ential patterns to provide an antenna.A first end ofthe wire is
`securedata first portion ofthefirst substrate, anda second end
`of the wire being secured to a second portion of the first
`substrate. The system further includes a wire cutter config-
`ured to cut the wire in proximity to the second end. The first
`substrate is configured such that the antenna is detachable
`from the first substrate and the antenna is configured to be
`attached to a second substrate.
`
`Some variable pitch smart card antennas using
`[0005]
`round wire employ ultrasonics to embed the wire into the
`plastic substrate. These ultrasonic generators are expensive,
`as are the horns requiredto transmit the ultrasonic energy into
`the wire andplastic. In addition, the horns wear down over
`time and need maintenanceor replacement. Further, the ultra-
`sonic embedding process is time consuming and can only be
`performed on a limited numberofplastic materials.
`
`SUMMARY
`
`[0006] The ensuing description provides preferred exem-
`plary embodiment(s) only, and is not intended to limit the
`scope, applicability or configuration ofthe disclosure. Rather,
`the ensuing description of the preferred exemplary embodi-
`ment(s) will provide those skilled in the art with an enabling
`description for implementing a preferred exemplary embodi-
`ment. It being understood that various changes may be made
`in the function and arrangement of elements without depart-
`ing from the spirit and scope as set forth in the appended
`claims.
`
`[0007] Embodimentsas described herein enable the manu-
`facture of coiled wire antennas for contactless smart cards
`
`with variable pitch between antennacoils utilizing a mandrel.
`
`In yet another embodiment, a mandrel wound
`[0019]
`antenna is provided. The mandrel wound antenna includes a
`single piece ofwire including a first end and a second end and
`a length ofwire betweenthefirst end and the second end. The
`single piece of wire is shaped and disposed to define an
`antenna including a plurality of non-overlapping circumfer-
`
`

`

`US 2011/0205140 Al
`
`Aug. 25, 2011
`
`DESCRIPTION
`
`Systems and methods ofmakingvariable pitch man-
`[0034]
`drel wound antennas are provided. Methods in accordance
`with the disclosure include wrapping a conductive wire
`around posts protruding above a surface of a first substrate,
`e.g., a faceplate (hereinafter “faceplate’’), to form a plurality
`of antenna coils. The posts are disposed on the faceplate with
`predetermined spacing,i.e., pitch, between the posts in order
`to provide a predictable mutual inductance betweenthe coils
`ofthe antenna. After completing the wrapping ofthe antenna,
`the antennais attached to a second substrate,e.g., a plastic or
`paper substrate (hereinafter “substrate”), by pressing the
`faceplate and antennacoils onto the substrate. The attaching
`can include embedding the antenna after heating the face-
`plate. The resulting antenna has a predictable inductance and
`capacitance and does not require tuning as with normal man-
`drel wound antennas.
`[0035] Referringfirst to FIG. 1, a plan view of a smart card
`100 is shown. The smart card 100 includes a body 105, a
`coiled antenna 110 and a chip 115. The body 105 is formed of
`multiple layers which can include twoplastic outer layers,
`and one or more intermediate circuitry layers. The outer lay-
`ers can be madeofplastic or other insulating material. The
`one or morecircuitry layers can include the antenna 110, the
`chip 115 and connections 120 connecting the chip to the
`antenna 110 and/orother circuitry.
`[0036] The antenna 110 is a mandrel wound antenna
`including multiple coils (not shown). Normal mandrel-
`wound antennasutilize fixed corner posts (not shown) that the
`antenna wire is wrapped around using a wiring head. The
`coils of the normal mandrel antenna are wrapped onto them-
`selves multiple times. Becausethe coils of the antenna are in
`contact with each other, inductance of the entire antenna is
`[0021] FIG.1is a plan view of a smart card.
`
`affected. The total inductance ofthe normal mandrel wrapped
`[0022]
`FIG. 2 is a plan view of a substrate sheet used in
`manufacture of smart cards such as the smart card of FIG.1.
`antenna is unpredictable because ofthe unpredictable spacing
`of the coils. Tuning of a normal mandrel antenna to the
`capacitance of the chip 115 is accomplished by adjusting the
`length ofthe antenna wire, and hence changingthe area ofthe
`antenna, to match a desired resonant frequency. Antennas are
`completed by joining the coils typically with polyimide.
`[0037] Referring to FIG. 2, a plan view of a substrate sheet
`200 used in manufacture of smart cards is shown. The sheet
`
`ential wire coils includingat leasta first wire coil anda second
`wire coil. Each of the circumferential wire coils includes at
`
`least three comers includingfirst, second and third corners,
`and a plurality of intra-coil edges between adjacent ones of
`the corners of the corresponding circumferential wire coil.
`Eachofthe plurality of circumferential wire coils, except an
`outer-most circumferential wire coil, includes an inter-coil
`edge between oneof the corners of an inner one ofthe cir-
`cumferential wire coils and oneof the corners of an outer one
`of the circumferential coils. The inter-coil and intra-coil
`edges are all substantially straight. Pitch distances between
`the intra-coil and the inter coil edges, the length of the wire,
`and an area of the outer-most circumferential wire coil are
`
`sized and disposed to provide determinable mutual induc-
`tances betweenthe plurality of circumferential wire coils, and
`the determinable mutual inductances combine to provide a
`total inductance that, when coupled to a chip with a known
`chip capacitance, results in the antenna providing a desired
`resonant frequency. The mandrel wound antenna further
`includes a polymer layer coating the plurality of circumfer-
`ential wire coils to physically couple the plurality of circum-
`ferential wire coils to maintain the pitch distancespriorto the
`antenna being attachedto a substrate.
`[0020]
`Further areas of applicability of the present disclo-
`sure will become apparent from the detailed description pro-
`vided hereinafter. It should be understood that the detailed
`
`description and specific examples, while indicating various
`embodiments, are intended for purposes of illustration only
`and are not intended to necessarily limit the scope of the
`disclosure.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIGS. 3A and 3B are exploded plan views of a
`[0023]
`cornerportion of a faceplate of a mandrel tool used to make a
`variable pitch antenna for the smart card of FIG. 1.
`[0024]
`FIG. 4 is a plan view of a quadruple (a.k.a. 4-up)
`faceplate used to manufacture smart cards on the substrate
`sheet of FIG. 2.
`
`[0025] FIG.5isaperspective view of a mandrel tool system
`for fabricating mandrel woundantennas.
`[0026]
`FIG. 6 is an exploded perspective view of a wiring
`head wrapping an antenna wire aroundposts of a faceplate of
`the mandrel tool system of FIG. 5.
`[0027] FIG.7isaplan view ofa configuration ofa faceplate
`with a variable pitch mandrel wound antennaattached to a
`smart card chip on the faceplate.
`[0028]
`FIG. 8 is a side view of a faceplate with spring
`loaded pogo-pins used as posts.
`[0029]
`FIG. 9 is a side view of a faceplate with sharp pins
`for piercing a substrate sheet.
`[0030]
`FIGS. 10A, 10B and 108C are a side view, an
`exploded side view and a plan view of a configuration of a
`faceplate with telescoping posts for wrapping a mandrel
`woundantenna.
`
`FIGS. 11A and 11Bare an exploded side view and
`[0031]
`exploded plan view ofa telescoping faceplate.
`[0032]
`FIG. 12 is a plan view of a faceplate with tracked
`pins for adjusting the pitch of the pins.
`[0033]
`FIG. 13 isa flowchart ofa process for manufacturing
`a mandrel woundantenna.
`
`200 is made ofplastic, paper or some other type of flexible,
`insulating material. The sheet 200 is divided into sections 205
`within which smart cards 100 are formed.In this embodiment
`there are four rows and ten columnsof sections 205. Other
`embodiments can have fewer or more rows and/or columns of
`sections 205. One of the antennas 110 is attached to the sheet
`200 within each of the sections 205. The antenna 110 can be
`
`attached using an adhesive or by some other method. One of
`the chips 115 is also attached to the sheet 200. The two ends
`of the antennawire are electrically connected to terminals of
`the chip 115.
`[0038] An alternative to tuning coil antennas by adjusting
`the length of the antenna wire is to manufacture the antennas
`with a mandrel tool having precisely spaced posts which the
`antenna wire is wrapped around using a wiring head. The
`mandrel tool includesa faceplate that includes the posts. The
`wiring headis integrated with the mandrel tool such that the
`faceplate is movedrelative to the wiring head, or vice-versa,
`thereby wrapping the antenna wire aroundthe posts.
`[0039] Referring to FIGS. 3A and 3B, exploded plan views
`of a corner portion of a faceplate 300 of a mandrel tool are
`shown. The faceplate 300 includes a front surface 305 that
`
`

`

`US 2011/0205140 Al
`
`Aug. 25, 2011
`
`includes a center portion 310. The center portion 310 can be
`araised portion in the shape of a smart card. Having the center
`portion 310 raised allows the center portion to press against
`the sheet 200 to attach the antenna 110 to the sheet 200. In one
`
`embodiment, the faceplate 300 is heated and the raised por-
`tion 310 presses the antenna 110 into the sheet 200.
`[0040] The faceplate 300 also includes posts 315. In the
`embodimentshown,there are four pairs of posts 315 in each
`of the four corners of the faceplate 300. The spacing between
`the posts 315 are sized to provide the desired inductance and
`antenna area for the antenna 110. In some configurations, the
`faceplate 300 includes tracks such that the posts 315 can be
`moved alongthe tracks, allowing for a tunable pitch.
`[0041] An antenna wire 320 is wrapped aroundthe posts
`315, thereby forming four coils displaced from each otherat
`predetermined, and predictable distances. The antenna wire
`320 can be wrapped aroundthe post by clampinga first end of
`the antenna wire 320 to the faceplate 310 at a first point 330,
`movingthe faceplate 300 laterally relative to the wiring head,
`or vice-versa, such that the antenna wire 320 wraps around a
`different pair ofthe posts 315 on eachrotation ofthe faceplate
`300. After the last coil of the antenna wire 320 has been
`
`wrapped, a second endof the antenna wire 320 is clamped to
`the faceplate 310 at a second point 335. After clamping the
`second endof the antenna wire 320, the antenna wire 320 is
`cut. As an alternative to clampingthefirst and second ends of
`the antenna wire 320 to the faceplate 310, the ends can be
`looped arounda first post 315 anda last post 315.
`[0042] As shown in FIG. 3B, the faceplate 300 includes a
`chip area 325. The chip area 325 can be an indented area such
`that a chip 115 that is already attached to the sheet 200 will be
`accepted into the chip area 325. In this way, the chip 115 will
`not be pushed against when the faceplate 300 is pressed
`against the sheet 200 while attaching the antenna 110. In
`addition, the faceplate 300 could include indented portions
`wherethe ends of the antenna wire 320 are received, thereby
`preventing the ends from being embeddedin the sheet 200. In
`another configuration, the chip area 325 is configured to hold
`the chip 115. In this configuration, the two ends ofthe antenna
`110 could be coupled (e.g., welded or soldered) to the chip
`115 and then the antenna 110 and chip 115 could be attached
`to the sheet 200. In embodiments where the faceplate 300 is
`heated, the chip area 325 could be thermally insulated from
`the heated antenna portion of the faceplate such that the chip
`115 is not damaged.
`[0043] Referring to FIG. 4, a plan view of a quadruple
`(a.k.a. 4-up) faceplate 400 is shown. The 4-up faceplate 400
`includesfour ofthe faceplates 300. The wiring head wraps the
`antenna wire 320 around each ofthe faceplates 300 using the
`procedure described abovein reference to FIGS. 3A and 3B.
`After the antenna wire 320 is wrapped aroundthe posts 315 of
`all four faceplates 300, the 4-up faceplate 400 is pressed
`against oneof the rowsofsections 205 to attach the antennas
`110 (and the chip 115 in some embodiments) to the sheet 200.
`This process is repeated until antennas 110 (and possibly
`chips 115) are attachedtoall of the sections 205 of the sheet
`200.
`
`[0044] The sheet 200 can be pre-processed in different
`waysprior to attaching the antennas 110. Holes can be formed
`in the sheet 200. The holes can be for attaching circuitry, in a
`later processing step, to the antenna 110. The antenna 110 can
`be positioned over the holes such that the circuitry can be
`coupledto the antenna 110. The holes can also be positioned
`to be in the chip area 325 such that the chip 115 contacts
`
`coincide with the holes. The chip 115 can beinserted into the
`holes prior to attaching the antenna 110, during the attaching
`of the antenna 110, or after the attaching of the antenna 110,
`depending on the configuration. The chip 115 could be ona
`separate sheet that is then attached to the sheet 200.
`[0045]
`In embodiments where the 4-up faceplate 400 is
`heated and the antenna 110 is hot-pressed into the sheet 200,
`the antenna 110 is embedded into the sheet 200. This can
`
`reduce the thickness of the completed smart card. Instead of
`heating the tool for hot-pressing into plastic, the entire tool
`could be tuned to an ultrasonic generator to allow for ultra-
`sonic implanting.
`[0046]
`Asan alternative to pressing the antenna 110 to the
`sheet 200, the antenna 110 can be sprayed with a polymerto
`form a rigid (or semi-rigid) structure and then the antenna can
`be placed on the sheet 200 for attachment. For example, the
`antenna 110 coil could be coated with polyimide or other
`plasticizer to retain the pitch and form of the antenna and the
`antenna 110 could then be transferred or glued to the substrate
`in a later processing step.
`[0047] After the antennas 110 are attachedto the sheet 200,
`an encapsulating sheet is attached to the antennas 110 and the
`sheet 200 to encapsulate the antennas 110 betweenthe sheet
`200 and the encapsulating sheet. Another encapsulating sheet
`can be attached on the opposite side of the sheet 200 to
`insulate any circuitry and chip connections that protrude
`through the sheet 200. The entire encapsulated assembly can
`then be laminated to further strengthen the smart cards 100.
`[0048] The precise spacing of the posts 315 allowsprecise
`controllability of the distances between the coils. The posts
`can be located at positions of the faceplate 300 that provide
`for a maximum outer dimension, providing a maximum
`antenna area, thereby providing an increased range at which
`the antenna can be powered by the powersignal of a card
`reader. The positions of the posts 315 will vary depending on
`the capacitance of the chip 115 and the desired resonant
`frequency. In some embodiments, the faceplate 300 includes
`tracks such that the posts 315 can be moved alongthetracks,
`allowing for a tunable pitch.
`[0049] Referring to FIG.5, a perspective view of a mandrel
`tool system 500 for fabricating mandrel woundantennasis
`shown. The mandrel tool system 500 includes a main housing
`505 and a wiring housing 510. The main housing 505 houses
`a processing system, illustrated by functional blocks. The
`processing system is usedto control the mechanical operation
`of the mandrel
`tool system 500. The processing system
`includes a processor 550, memory 555 a manipulation sub-
`system 560 and one or more of a heat source 544 and/or an
`ultrasonic generator 548. The processor 550 is a program-
`mable device, e.g., a central processing unit (CPU), such as
`those made by Intel® Corporation or AMD®, a microcon-
`troller, an application specific integrated circuit (ASIC), a
`field programmable gate array (FPGA), and/or logic gates
`etc. The memory 555 includes random access memory
`(RAM)and/or read-only memory (ROM). The memory 555
`stores a computer program product comprising computer-
`readable, computer-executable software code containing
`instructions that are configured to, when executed, cause the
`processor 550 and/or other subsystems to perform various
`functions described herein. Alternatively, the software may
`not be directly executable by the processor 550 but configured
`to cause the processor 550, e.g., when the instructions are
`compiled and executed, to perform the functions described.
`
`

`

`US 2011/0205140 Al
`
`Aug. 25, 2011
`
`[0055] Yet another alternative for attaching the antenna to
`the substrate includes a coating system 565. The coating
`system 565 applies an adhesive to the antenna wire 535. The
`adhesive can be a glue,a tape or other type of adhesive. After
`application of the adhesive, the faceplate 520 rotates and
`presses the antenna wire against the substrate 517 to attach the
`antenna to the substrate 517. Alternatively, the coating system
`565 can apply a polymer, such as polyimide, for example, to
`the antenna wire 535 to coat the wrapped antenna to be
`semi-rigid. After the polymer has hardened, the antenna can
`be attached to the substrate 517. The antenna can be attached
`
`by hand or using the faceplate 520, in conjunction with an
`adhesive,to attach the antennato the substrate 517. Adhesives
`and polymers can be used with paper substrates 517,e.g., for
`limited use (LU) smart cards, as well as with plastic substrates
`517. For LU cards, the substrate 517 can be an adhesive
`backed paperorthin plastic which can include heat activated
`adhesiveorpress activated adhesive. The antenna wire 535 of
`an LU card could be made of aluminum or aluminum alloy to
`further reduce the cost.
`
`[0050] The main housing 505 includes a substrate surface
`515 configured to support a substrate sheet 517 upon which
`mandrel wound antennaswill be attached to the substrate 517
`(e.g., to form smart cards). The substrate 517 can be a plastic,
`e.g., polyvinyl chloride (PVC), polyethylene terephthalate
`(PET), Polycarbonate (PC), Teslin™, or paper. A faceplate
`520 is rotatably coupled to a winding platform 525. The
`faceplate 520 ofthis configuration includes posts 522 to form
`a single mandrel wound antenna. Other configurations can
`includea faceplate with multiple sets ofposts 522 for forming
`multiple antennas(e.g., a 4-up faceplate as shownin FIG.4).
`[0051] A wiring head 530 is mechanically coupled to actua-
`tion motors (not shown) housed in the wiring housing 510.
`FIG.6 showsan exploded perspective view ofthe wiring head
`530 in the process of wrapping an antenna wire 535 around
`the posts 522 ofthe faceplate 520. The actuation motors move
`the wiring head 530 precisely around the posts 522 to wrap
`the antenna wire 535 aroundthe posts 522 to form a mandrel
`wound antenna. The actuation motors are controlled by the
`manipulation subsystem 560. The manipulation subsystem is
`controlled by the processor 550 and/or parameters stored in
`the memory 555. The actuation motors and manipulation
`subsystem 560 are similar in design and function to a high
`precision robot such as, for example, a pick-and-place robot
`used to populate printed circuit boards.
`[0052]
`Inoneconfiguration, the posts 522 are configured to
`be raised and loweredrelative to the faceplate 520 during the
`wrapping process. The manipulation subsystem 560 controls
`the position of the posts during the wrapping process. The
`wrapping can start with all the posts in the lowered position.
`The manipulation subsystem 560 raises the inner most posts
`first and raises the outer posts as the wiring head 530 wraps
`the outer coils. The posts 522 can be raised by pushing them
`up throughthe faceplate 520. Alternatively, the posts 522 can
`be rotatable and rotated from being parallel with the faceplate
`520 to being perpendicular to the faceplate 520.
`[0053] The antenna wire 535 can be copper, aluminum or
`other suitable conductive metal. The antenna wire 535 is
`typically insulated, but non-insulated wire can be used in
`some configurations as discussed below. The antenna wire
`535 is supplied from a wire source 540 housedin the wiring
`housing 510. The wiring head 530 can include a wire cutter
`(not shown) for cutting the antenna wire 535. The faceplate
`[0057] The posts 522 and 722ofthe faceplates 520 and 720
`520 includes meansfor clamping the antenna wire 535 to the
`can take on several configurations. Inafirst configuration, the
`faceplate 520. After the antenna wire 535 has been wrapped
`postsare fixed posts attachedto the faceplate. In this configu-
`aroundall the posts 522 and cut, the rotatable faceplate 520 is
`ration, the substrate 517 can include holes where the posts are
`rotated, as indicated by the dashed arrow and the dashed
`located. In this way, the posts can protrude throughthe holes
`faceplate 520, to press the faceplate 520 and the antenna wire
`of the substrate when the antenna and/or chip are being
`535 against the substrate sheet 517 and thereby attach the
`attachedto the substrate.
`mandrel wound antenna to the substrate 517.
`
`[0056] Alternative designs for faceplates, such as the face-
`plates 300, 400 and 520 discussed above, will now bedis-
`cussed. Referring to FIG.7, a plan view of a configuration of
`a faceplate 700 includes a variable pitch mandrel wound
`antenna attached to a smart card chip 705 on the faceplate
`720. The chip 705 is positioned in a recess area such as the
`chip area 325 illustrated in FIGS. 3 and 6. A first end of an
`antenna wire 735 is attached to the chip 705at a first connec-
`tion point 710 and a second end of the antenna wire 735 is
`attached to the chip 705 at a second connection point 715. The
`antenna wire is wrapped around posts 722. The faceplate 700
`includesthree posts 722 in three comers and four posts 722 in
`the fourth corner nearest the chip 705. The antenna wire 735
`can be welded to the chip 705 using, for example, compres-
`sion welding. The antenna wire 735 can be insulated or not
`insulated. When the antenna wire 735 is insulated, the com-
`pression welding blowsofthe insulation such that the antenna
`wire 735 is coupledto the first and second connection points
`710 and 715. When the antenna wire 735 is not insulated, an
`insulation layer or bridge, e.g., mylar, can be applied in a
`cross-over area 740 such that the second end of the antenna
`wire 735 does not short circuit with the antenna wire 735 in
`the three coils.
`
`[0054] The heat source 544 is thermally coupled to the
`faceplate 520. The heat source 544 can be an electrical coil, a
`hot water or steam source or other heat source. The heat
`
`source heats the faceplate and the wrapped antenna wire 535
`to a temperature sufficient to soften the plastic substrate 517
`and embed the antenna into the substrate 517 whenthe face-
`
`plate 520 is pressed against the substrate 517. In an alternative
`configuration, an ultrasonic generator 548 is tuned and
`coupled to the faceplate 520. The ultrasonic generator 548
`can be an ultrasonic horn. The ultrasonic generator vibrates
`the faceplate 520 and the antenna wire 535 such that the
`plastic substrate is heated to a temperature such that the
`antenna wire 535 is embeddedin the substrate 517 upon being
`pressed by the faceplate 520.
`
`[0058] Referring to FIG.8, a secondfaceplate 820 configu-
`ration includes posts 822 that are spring-loaded andreferred
`to as pogo-pins 822. The pogo-pins 822 are contained in
`cylinders 825. The cylinders 825 house a lowerportion ofthe
`pogo-pins and a spring 830. The springs 830 are pre-loaded
`such that the pogo-pins 322 protrude out ofthe faceplate 820.
`When the faceplate 820 is pressed against a substrate, to
`attach an antennato the substrate, the springs 825 are com-
`pressed allowing the antenna wire (not shown) to be pressed
`against the substrate.
`[0059] Referring to FIG. 9, a third faceplate 920 configu-
`ration includes posts 922 that have sharp pointed ends 923
`and are referred to as pins 922. The pointed ends 923 are
`configured to pierce the substrate 517 whenthe faceplate 920
`
`

`

`US 2011/0205140 Al
`
`Aug. 25, 2011
`
`presses against the substrate 517. In this way, the substrate
`517 does not have to provide holes for fixed posts to pass
`through.
`[0060] Referring to FIGS. 10A, 10B and 10C, a fourth
`faceplate 1020 configuration includes telescoping posts
`1022. The telescoping posts 1022 comprise three stepped
`rings 1024 that are configured to collapse within themselves,
`as illustrated by the arrows in FIG. 10B, whenthe faceplate
`1020 is pressed against the substrate. Whenthe stepped rings
`1024 collapse, antenna wire 1035 can be attached, e.g., by
`being embedded, to the substrate. As shown in FIGS. 10B and
`10C,the antenna wire 1035 is wrapped arounda different ring
`1024 ofthe telescoping posts 1022 to form the three coils, in
`this configuration, of the mandrel wound antenna. In this
`configuration, a chip recess 1025 is providedin the faceplate
`1020. Connection wires 1040 and 1045 connecting first and
`second ends of the antenna wire 1035 to the chip recess 1025,
`can optionally be attached to the faceplate 1020. Alterna-
`tively, the connection wires 1040 and 1045 can be attached to
`the antenna wire 1035 after the antenna has been attached to
`the substrate 517.
`
`or non-adjustable, are arranged and disposedto define a plu-
`rality of non-overlapping circumferential patterns.
`[00