14
`
`SUN.LGI.420
`
`First, referring to FIG. 14,
`
`the wireless power receiver 1000 according to the fifth
`
`embodiment may include a magnetic substrate 100, a coil unit 200 and a connecting unit 300.
`
`According to one embodiment, the wireless power receiver 1000 can wirelessly receive
`
`power from the transmission side using electromagnetic induction. In this case, the coil 230 of
`
`5
`
`the coil unit 200 can wirelessly receive power through the electromagnetic induction with a coil
`
`of the transmission side.
`
`According to one embodiment, the wireless power receiver 1000 can wirelessly receive
`
`powerfrom the transmission side using resonance.
`
`The magnetic substrate 100 may changethe dircction of the magnetic ficld reccived from
`
`10
`
`the transmissionside.
`
`The magnetic substrate 100 can reduce the amount of the magnetic field leaked to the
`
`outside by changing the direction of the magnetic field received from the transmissionside.
`
`The magnetic substrate 100 can change the direction of the magnetic field received from
`
`the transmission side in the lateral direction such that
`
`the magnetic field can be more
`
`15
`
`concentrated onto the coil unit 200.
`
`The magnetic substrate 100 can absorb some of the magnetic field received from the
`
`transmission side and leaked to the outside to dissipate the magnetic field as heat. If the amount
`
`of the magnetic field leaked to the outside is reduced, the bad influence of the magnetic field
`
`exerted on the human body can be reduced.
`
`20
`
`Referring to FIG. 16, the magnctic substrate 100 may include a magnct 110 and a support
`
`120.
`
`The magnet 110 may include a particle or a ceramic. According to one embodiment, the
`
`magnet 110 may be one ofa spinel type magnet, a hexa type magnet, a sendust type magnet and
`
`a permalloy type magnet.
`
`25
`
`The support 120 may include thermosetting resin or thermoplastic resin and support the
`
`magnetic substrate 100.
`
`The magnetic substrate 100 may be prepared in the form of a sheet and may have a
`
`flexible property.
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
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`GOOGLE EXHIBIT 1012 (part 4 of 4)
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`Page 1250 of 1385
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`GOOGLE EXHIBIT 1012 (part 4 of 4)
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`

`

`15
`
`SUN.LGI.420
`
`Referring again to FIG. 14, the coil unit 200 may include a first connection terminal 210,
`
`a second connection terminal 220 and a coil 230. The coil 230 may formed. as a conductive layer
`
`or a conductive pattern.
`
`The coil unit 200 may be disposed inside the magnetic substrate 100. In detail, the coil
`
`unit 200 may be buried inside the magnetic substrate 100. In more detail, the magnetic substrate
`
`100 may include a pattern groove and the coil unit 200 may be disposed in the pattern groove.
`
`The pattern groove may be formed as a conductive pattern or a conductive layer similar to the
`
`coil unit 200.
`
`The coil unit 200 has a thickness smaller than that of the magnctic substrate 100 and an
`
`10
`
`upper portion of the coil unit 200 may be exposed out of the magnetic substrate 100.
`
`A process for manufacturing the wireless power receiver 1000 by disposing the coil unit
`
`200 and the connecting unit 300 in the magnetic substrate 100 will be described later with
`
`reference to FIGS. 17 to 21.
`
`The first connection terminal 210 of the coil unit 200 is located at one end ofthe coil 230
`
`15
`
`and the second connection terminal 220 of the coil unit 200 is located at the other end of the coil
`
`230.
`
`Thefirst and second connection terminals 210 and 220 of the coil unit 200 are necessary
`
`for connection with the connecting unit 300.
`
`The coil 230 may be formed as a coil pattern which is obtained by winding a conductive
`
`20
`
`line several times. According to onc embodiment, when viewed from the top, the coil pattern
`
`may have a spiral shape. However, the embodimentis not limited thereto, and various patterns
`
`may be formed.
`
`The coil unit 200 may transfer the power wirelessly received from the transmission side
`
`to the connecting unit 300. The coil unit 200 maytransfer the power wirelessly received from the
`
`25
`
`transmission side using the electromagnetic induction or resonance to the connecting unit 300.
`
`The connecting unit 300 may include a first connection terminal 310, a second
`
`connection terminal 320 and a printed circuit board 330.
`
`The first connection terminal 310 of the connecting unit 300 may be connectedto the first
`
`connection terminal 210 of the coil unit 200 and the second connection terminal 320 of the
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
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`Page 1251 of 1385
`
`Page 1251 of 1385
`
`

`

`16
`
`SUN.LGI.420
`
`connecting unit 300 may be connected to the second connection terminal 220 of the coil unit
`
`200.
`
`The printed circuit board 330 may include a wiring layer and the wiring layer may
`
`include a wireless powerreceiving circuit, which will be described later.
`
`The connecting unit 300 connects the wireless power receiving circuit (not shown) with
`
`the coil unit 200 to transfer the power received from the coil unit 200 to a load (not shown)
`
`through the wireless power receiver circuit. The wireless power receiver circuit may include a
`
`rectifier circuit (not shown) for converting AC powerinto DC powerand a smoothing circuit for
`
`transferring the DC powcrto the load after removing ripple components from the DC power.
`
`10
`
`FIGS. 15 and 16 show the detailed structure of the wireless power receiver 1000
`
`according to the fifth embodiment when the coil unit 200 is connected to the connecting unit
`
`300.
`
`other.
`
`FIG. 15 showsthe coil unit 200 and the connecting unit 300 interconnected with each
`
`15
`
`The coil unit 200 can be connected to the connecting unit 300 by a solder.
`
`Referring to FIG. 16, the first connection terminal 210 of the coil unit 200 may be
`
`connected to the first connection terminal 310 of the connecting unit 300 through a first solder 10
`
`and the second connection terminal 220 of the coil unit 200 may be connected to the second
`
`connection terminal 320 of the connecting unit 300 through a second solder 20. In detail, the first
`
`20
`
`connection terminal 210 of the coil unit 200 may be connected to the first connection terminal
`
`310 of the connecting unit 300 through a via hole of the first solder 10 and the second connection
`
`terminal 220 of the coil unit 200 may be connected to the second connection terminal 320 of the
`
`connecting unit 300 througha via hole of the second solder 20.
`
`According to one embodiment, the via hole can be formed by using a laser. The laser may
`
`25
`
`include a UV laser or a CO2laser.
`
`FIG. 16 is a sectional view of the wireless power receiver 1000 in which the magnetic
`
`substrate 100 and the coil unit 200 are connected to the connecting unit 300.
`
`Thatis, the first connection terminal 210, the second connection terminal 220 andthe coil
`
`230 constituting the coil unit 200 may be disposed in a pattern groove 140 of the magnetic
`
`30
`
`substrate 100.
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1252 of 1385
`
`Page 1252 of 1385
`
`

`

`17
`
`SUN.LGI.420
`
`In addition,
`
`the magnetic substrate 100 and the coil unit 200 are connected to the
`
`connecting unit 300.
`
`The coil 230 may be designed to have a predetermined width W and a predetermined
`
`thickness T and the magnetic substrate 100 may be designed to have a predetermined thickness
`
`T1. According to one embodiment, the coil 230 has a thickness of 0.1mm and the magnetic
`
`substrate 100 has a thickness of 0.43 mm, but these numerical values are illustrative purposes
`
`only. According to one embodiment, the thickness T of the coil 230 may be smaller than the
`
`thickness T1 of the magnetic substrate 100.
`
`In the wircless power recciver 1000 according to the fifth embodiment, the coil unit 200
`
`10
`
`is directly disposed in the pattern groove 140 of the magnetic substrate 100, so the overall
`
`thickness of an electronic appliance equipped with the wireless power receiver 1000 can be
`
`reduced as muchasthe thickness of the coil unit 200. Thus, if the wireless power receiver 1000
`
`according to the fifth embodiment is applied to the electronic device, such as the portable
`
`terminal, the overall thickness of the portable terminal can be reduced suitably for the current
`
`15
`
`trend of slimness
`
`In addition, in the wireless power receiver 1000 according to the fifth embodiment, the
`
`coil unit 200 is disposed in the pattern groove 140 of the magnetic substrate 100. Thus, different
`
`from the electronic appliance in which a coil pattern is formed on an FPCB, the overall size of
`
`the electronic device equipped with the wireless power receiver 1000 can be reduced.
`
`20
`
`FIGS. 17 to 21 are views for explaining a method of manufacturing the wireless powcr
`
`receiver 1000 accordingto the fifth embodiment.
`
`Hereinafter, the method of manufacturing the wireless power receiver 1000 according to
`
`the fifth embodiment will be described with reference to FIGS. 17 to 21 as well as FIGS. 14 to
`
`16.
`
`25
`
`First, referring to FIG. 17, the magnetic substrate 100 is prepared. According to one
`
`embodiment, the magnetic substrate 100 may be produced by coating metal powder of sendust
`
`alloys, such as Al, Fe and SiO2, on polyethylene rubber and then forming an oxide layer on a
`
`surface of the polyethylene rubber.
`
`Then, referring to FIG. 18, heat and pressure are applied using a mold 1 to form the
`
`30
`
`pattern groove in the magnetic substrate 100 for receiving the coil unit 200. The mold 1 may
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1253 of 1385
`
`Page 1253 of 1385
`
`

`

`18
`
`SUN.LGI.420
`
`have the shape corresponding to the shape of the coil unit 200. According to one embodiment,
`
`the mold 1 can be manufactured by using an aluminum alloy, a copperalloy or a cast iron.
`
`The mold 1 may be provided with a protrusion at a region corresponding to the coil unit
`
`200 for wirelessly receiving the power.
`
`Whenthe heat is applied by using the mold 1, the heat having the specific temperature is
`
`applied by taking the property of the metal powderofthe sendust alloy constituting the magnetic
`
`substrate 100 into consideration. According to one embodiment, if the magnetic substrate 100 is
`
`produced by coating the metal powder of sendust alloy on the polyethylene rubber, when the heat
`
`and pressure are applied by using the mold 1, high-pressure is applicd at the temperature in the
`
`10
`
`range of 100°C to 180°C, and then the mold 100 is cooled to the temperature of 100°C or below.
`
`After that, the mold 1 is separated from the magnetic substrate 100. If the mold 1 is separated
`
`just after the pressure has been applied to the magnetic substrate 100, the desired pattern groove
`
`140 maynot be formed dueto residual heat in the pattern groove 140. For this reason, the mold 1
`
`is separated from the magnetic substrate 100 after cooling the mold 100 to the temperature of
`
`15
`
`100°C or below.
`
`If the magnetic substrate 100 is prepared by using the metal powder of sendustalloy, the
`
`heat temperature and pressure may vary depending on the distribution and concentration of the
`
`metal powder. That is, if the distribution of the metal powder is not uniform,
`
`the higher
`
`temperature and pressure may be applied. In contrast, if the distribution of the metal powderis
`
`20
`
`uniform, the lower tempcrature and pressure may be applied. In addition, if the concentration of
`
`the metal powderis low, the lower temperature and pressure may be applied as compared with
`
`the case in which the concentration of the metal powder is high. Further, the heat temperature
`
`and pressure may vary depending on the composition of the metal powder, that is, depending on
`
`the alloy constituting the metal powder.
`
`25
`
`In this manner, the temperature applied to the mold 1 may vary depending on the
`
`distribution, concentration and composition of the powder.
`
`According to one embodiment, laser may be irradiated, instead of applying heat and
`
`pressure using the mold 1, to form the pattern groove in the magnetic substrate 100 to receive the
`
`coil unit 200. In this case, the pattern groove can be formed by using an excimerlaser that
`
`30
`
`irradiates the laser beam having a wavelength band ofultraviolet ray. The excimer laser may
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1254 of 1385
`
`Page 1254 of 1385
`
`

`

`19
`
`SUN.LGI.420
`
`include a KrF excimer laser (central wavelength 248 nm) or an ArF excimer laser (central
`
`wavelength 193 nm).
`
`Next, referring to FIG. 19, the mold 1 is separated from the magnetic substrate 100 so
`
`that the magnetic substrate 100 is formed with the pattern groove 140.
`
`Then, referring to FIG. 20, the coil unit 200 is inserted into the pattern groove 140
`
`formed in the magnetic substrate 100. As the coil unit 200 is inserted into the pattern groove 140,
`
`a predetermined conductive pattern is formed in the pattern groove 140 of the magnetic substrate
`
`100.
`
`According to onc cmbodiment, a process for forming the coil unit 200 in the pattern
`
`10
`
`groove 140 of the magnetic substrate 100 may include a plating process or a process for inserting
`
`a metal which has been etched to have the conductive pattern formed by the coil unit 200.
`
`In detail, according to the plating process, the metallic material is filled in the pattern
`
`groove 140 to form the coil unit 200. At this time, the metallic material may include one selected
`
`from Cu, Ag, Sn, Au, Ni and Pd and thefilling of the metallic metal can be performed through
`
`15
`
`oneofelectroless plating, screen printing, sputtering, evaporation, ink-jetting and dispensing or a
`
`combination thereof.
`
`Then, referring to FIG. 21, the soldering process is performed to connect the coil unit 200
`
`with the connecting unit 300.
`
`That is, the first connection terminal 210 of the coil unit 200 is connected to the first
`
`20
`
`connection terminal 310 of the connecting unit 300 through the soldcr 10 and the sccond
`
`connection terminal 220 of the coil unit 200 is connected to the second connection terminal 320
`
`of the connecting unit 300 through the solder 20.
`
`As described above, according to the method of manufacturing the wireless power
`
`receiver 1000 of the fifth embodiment, the pattern groove is formed in the magnetic substrate
`
`25
`
`100 and the coil unit 200 is disposed in the pattern groove, so that the overall thickness of the
`
`wireless power receiver 1000 can be reduced. In addition, the wireless power receiver 1000 can
`
`be manufactured by simply forming the pattern groove and then inserting the coil unit into the
`
`pattern groove, so that the manufacturing process can be simplified.
`
`FIG, 22 is a view for explaining variation of inductance, resistance and Q values of the
`
`30
`
`coil unit 200 as a function of a usable frequency when the coil unit 200 is disposed on a top
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1255 of 1385
`
`Page 1255 of 1385
`
`

`

`20
`
`SUN.LGI.420
`
`surface of the magnetic substrate according to the first embodiment, and FIG. 23 is a view for
`
`explaining variation of inductance, resistance and Q values of the coil unit 200 as a function of a
`
`usable frequency when the coil unit 200 is disposed in the pattern groove formed in the magnetic
`
`substrate according to the fifth embodiment.
`
`The inductance, resistance and Q values of the coil unit 200 can be expressed as
`
`following equation |.
`
`[Equation 1]
`
`Q=W*L/R
`
`10
`unit 200 andRis resistance of the coil unit 200.
`
`In cquation 1, wis a frequency used when transmitting powcr, L is inductance ofthe coil
`
`Ascan be understood from equation 1, the Q value becomeshigh as the inductance ofthe
`
`coil unit 200 is increased. If the Q value is increased, the power transmission efficiency can be
`
`improved. The resistance of the coil unit 200 is a numerical value of powerloss occurring in the
`
`coil unit 200 and the Q value becomeshigh asthe resistance value is decreased.
`
`15
`
`Referring to FIGS. 22 and 23, when comparing the fifth embodiment, in which the coil
`
`unit 200 is disposed in the pattern groove 140 of the magnetic substrate 100, with the first
`
`embodiment, in which the coil unit 200 is disposed on the top surface of the magnetic substrate
`
`100, when the usable frequency is 150 kHz, the inductance of the coil unit 200 is increased by
`
`352.42 um from about 9986.92 um to about 10339.34 um andthe resistance of the coil unit 200
`
`20
`
`is reduced by 0.057 Q from 0.910 Q to 0.853 Q. That is, the Q valuc is increased corresponding
`
`to the increment of the inductance and the reduction ofthe resistance.
`
`Therefore,
`
`the wireless power receiver 1000 according to the fifth embodiment can
`
`increase the Q value by disposing the coil unit 200 in the pattern groove of the magnetic
`
`substrate 100.
`
`25
`
`FIG, 24 is an H-field for illustrating a radiation pattern of a magnetic field when the coil
`
`unit is disposed on a top surface of the magnetic substrate accordingto the first embodiment, and
`
`FIG. 25 is an H-field for illustrating a radiation pattern of a magnetic field when the coil unit is
`
`disposed in the pattern groove formed in the magnetic substrate according to the fifth
`
`embodiment.
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1256 of 1385
`
`Page 1256 of 1385
`
`

`

`21
`
`SUN.LGI.420
`
`Referring to FIGS. 24 and 25, a greater amount of magnetic fields is radiated from the
`
`outer peripheral portion of the coil unit 200 when the coil unit 200 is disposed in the pattern
`
`groove formed in the magnetic substrate 100 as compared with the case in which the coil unit
`
`200 is disposed on the top surface of the magnetic substrate 100. This is because the magnetic
`
`field directed to the outside is changed in the lateral direction of the coil unit 200 due to the coil
`
`unit 200 buried in the magnetic substrate 100.
`
`In addition, a greater amount of magnetic fields is radiated at the inner portion of the coil
`
`unit 200 when the coil unit 200 is disposed in the pattern groove formed in the magnetic
`
`substrate 100 as compared with the case in which the coil unit 200 is disposed on the top surface
`
`10
`
`of the magnetic substrate 100. This is also because the magnetic field directed to the outside is
`
`changedin the lateral direction of the coil unit 200 dueto the coil unit 200 buried in the magnetic
`
`substrate 100.
`
`Referring to FIGS. 24 and 25, the wireless power receiver 1000 may further include a
`
`short-range communication antenna 600.
`
`15
`
`The short-range communication antenna 600 can make near field communication with a
`
`reader. The short-range communication antenna 600 may serve as an antenna that transceives
`
`information in cooperation with the reader.
`
`According to one embodiment,
`
`the short-range communication antenna 600 may be
`
`arranged at an outer peripheral portion of the coil unit 200. According to one embodiment, when
`
`20
`
`the coil unit 200 is disposed at the center of thc magnetic substrate 100,
`
`the short-range
`
`communication antenna 600 may be arranged along the outer peripheral portion of the magnetic
`
`substrate 100 to surround the coil unit 200. The short-range communication antenna 600 may
`
`have a rectangular configuration by winding one conductive line several
`
`times, but
`
`the
`
`embodimentis not limited thereto.
`
`25
`
`Similar to the coil unit 200, the short-range communication antenna 600 may be formed
`
`as a conductive pattern or a conductive layer.
`
`Various short-range communication technologies can be applied to the short-range
`
`communication antenna 600 and the NFC technologyis preferable.
`
`Hereinafter, a wireless power receiver according to another embodiment will be
`
`30
`
`described with reference to FIGS. 26 to 3236.
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1257 of 1385
`
`Page 1257 of 1385
`
`

`

`22
`
`SUN.LGI.420
`
`FIG. 26 is an exploded perspective view of the wireless power receiver 1000 according to
`
`still another embodiment, FIG. 27 is a perspective view of the wireless power receiver 1000
`
`according to still another embodiment, and FIG. 28 is a sectional viewof the wireless power
`
`receiver 1000 according tostill another embodiment.
`
`Meanwhile, FIG. 27 is a perspective view showing the assembledstate of the elements of
`
`the wireless powerreceiver 1000 shown in FIG. 26, in which some elements are omitted.
`
`The wireless power receiver 1000 according to still another embodiment may be disposed
`
`in an electronic device, such as a portable terminal.
`
`Referring to FIGS. 26 to 28, the wircless power recciver 1000 may include a magnetic
`
`10
`
`substrate 100, a coil unit 200, a connecting unit 300, a short-range communication antenna 600,
`
`an adhesive layer 700, a first dual-side adhesive layer 710, a second dual-side adhesive layer
`
`720, a protective film 800 and a release paper layer 730.
`
`Referring to FIG. 26, the magnetic substrate 100 can change the direction of the magnetic
`
`field transferred from the transmissionside.
`
`15
`
`The magnetic substrate 100 changes the direction of the magnetic field transferred to the
`
`coil unit 200 from the transmission side to reduce the amount of the magnetic field leaked to the
`
`outside. Thus, the magnetic substrate 100 may have the electromagnetic waveshielding effect.
`
`In detail,
`
`the magnetic substrate 100 changes the direction of the magnetic field
`
`transferred from the transmission side in the lateral direction such that the magnetic field can be
`
`20
`
`more concentrated onto the coil unit 200.
`
`The magnetic substrate 100 can absorb some of the magnetic field transferred to the coil
`
`unit 200 from the transmission side and leaked to the outside to dissipate the magnetic field as
`
`heat. If the amount of the magnetic field leaked to the outside is reduced, the bad influence of the
`
`magnetic field exerted on the human body can be reduced.
`
`25
`
`Referring to FIG. 28, the magnetic substrate 100 may include a magnet 110 and a support
`
`120.
`
`According to one embodiment, the magnet 110 may be one ofa spinel type magnet, a
`
`hexa type magnet, a sendust type magnet and a permalloy type magnet.
`
`The support 120 may include thermosetting resin or thermoplastic resin and support the
`
`30
`
`magnetic substrate 100.
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1258 of 1385
`
`Page 1258 of 1385
`
`

`

`23
`
`SUN.LGI.420
`
`Referring again to FIG. 26, the magnetic substrate 100 may be prepared in the form of a
`
`sheet and may havea flexible property.
`
`A receiving space 130 is formed at a predetermined area of the magnet substrate 100. The
`
`receiving space 130 has a structure the same as that of the connecting unit 300. The connecting
`
`unit 300 is disposed in the receiving space 130 and connected to the coil unit 200.
`
`The coil unit 200 can receive the power
`
`from the transmission side using the
`
`electromagnetic induction or resonance. Similar to the coil unit 200 illustrated in FIG. 1, the coil
`
`unit 200 may include a first connection terminal 210, a second connection terminal 220 and a
`
`coil 230. The coil 230 may be formed as a conductive layer or a conductive pattern.
`
`10
`
`The connecting unit 300 connects a receiver circuit (not shown) with the coil unit 200 to
`
`transfer the power received from the coil unit 200 to a load (not shown) through the receiver
`
`circuit.
`
`The connecting unit 300 may include a wiring layer and the wiring layer may include the
`
`wireless power receiving circuit. The wireless power receiving circuit may include a rectifier
`
`15
`
`circuit for rectifying the powerreceived from the coil unit 200, a smoothing circuit for removing
`
`noise signals, and a main IC chip for performing the operation to wirelessly receive the power.
`
`In addition, the receiver circuit can transfer the signal received from the short-range
`
`communication antenna 600 to a short-range communication signal processing unit (not shown).
`
`The connecting unit 300 is disposed in the receiving space 130 of the magnetic substrate
`
`20
`
`100 and connccted to the coil unit 200. FIG. 27 shows the connccting unit 300 disposed in the
`
`receiving space 130 of the magnetic substrate 100.
`
`The connecting unit 300 may include a first connection terminal 310, a second
`
`connection terminal 320, a third connection terminal 340 and a fourth connection terminal 350.
`
`The first connection terminal 310 of the connecting unit 300 is connected to the first connection
`
`25
`
`terminal 210 of the coil unit 200, the second connection terminal 320 of the connecting unit 300
`
`is connected to the second connection terminal 220 of the coil unit 200, the third connection
`
`terminal 340 of the connecting unit 300 is connected to a first connection terminal 610 of the
`
`short-range communication antenna 600 and the fourth connection terminal 350 of the
`
`connecting unit 300 is connected to a second connection terminal 620 of the short-range
`
`30
`
`communication antenna 600.
`
`JASUN\LGI\420\Application\as-filed-marked-up.doc/whs/mhl
`
`Page 1259 of 1385
`
`Page 1259 of 1385
`
`

`

`24
`
`SUN.LGI.420
`
`The connecting unit 300 may have the shape corresponding to the shape of the receiving
`
`space 130 and may be disposed in the receiving space 130. Since the connecting unit 300 is
`
`disposed in the receiving space 130 of the magnetic substrate 100, the thickness of the wireless
`
`powerreceiver 1000 can be remarkably reduced as much as the thickness of the connecting unit
`
`300. Thus, the thickness of the electronic device, such as a portable terminal, equipped with the
`
`wireless powerreceiver 1000 can be remarkably reduced.
`
`According to one embodiment, the connecting umt 300 may include a flexible printed
`
`circuit board (FPCB), a tape substrate (TS) or a lead frame (LF). If the tape substrate is used as
`
`the connecting unit 300, the thickness of the connecting unit 300 can be reduced, so that the
`
`10
`
`overall size of the wireless power receiver 1000 can be reduced.
`
`If the lead frame is used as the connecting unit 300, the wiring layer included in the
`
`connecting unit 300 can be protected from the heat, external moisture or impact and the mass
`
`production can berealized.
`
`Referring again to FIG. 26, the short-range communication antenna 600 can make near
`
`15
`
`field communication with a reader. The short-range communication antenna 600 may serve as an
`
`antenna that transceives information in cooperation with the reader.
`
`According to one embodiment, the NFC signal processing unit (not shown) can process
`
`the signal transferred to the short-range communication antenna 600 through the connecting unit
`
`300.
`
`20
`
`Various short-range communication technologics can be applicd to the short-range
`
`communication antenna 600 and the NFC technologyis preferable.
`
`According to one embodiment,
`
`the short-range communication antenna 600 may be
`
`arranged at an outer peripheral portion of the coil unit 200. Referring to FIG. 27, when the coil
`
`unit 200 is disposed at the magnetic substrate 100, the short-range communication antenna 600
`
`25
`
`may be arranged along the outer peripheral portion of the magnetic substrate 100 to surround the
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`coil unit 200. The short-range communication antenna 600 may have a rectangular configuration
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`by winding one conductive line several times, but the embodimentis not limited thereto.
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`Referring again to FIG. 26, the adhesive layer (not shown) may be disposed under the
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`protective film 800 to form the protective film 800 on the coil unit 200 and the short-range
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`30
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`communication antenna 600, which will be described later in detail.
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`The first dual-side adhesive layer 710 is interposed between the magnetic substrate 100
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`and the coil unit 200/short-range communication antenna 600 to adhere the coil unit 200 to the
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`magnetic substrate 100, which will be described later in detail. Similar to the magnetic substrate
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`100, a receiving space having the shape identical to the shape of the connecting unit 300 may be
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`formed in the first dual-side adhesive layer 710.
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`Referring again to FIG. 28,
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`the second dual-side adhesive layer 720 adheres the
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`protective film 800 to the release paper layer 730, which will be described later in detail.
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`The coil unit 200 may be disposed on the magnetic substrate 100 and may havea spiral
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`structure, but the embodimentis not limited thercto.
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`10
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`Hereinafter, the method of manufacturing the wireless powerreceiver 1000 according to
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`still another embodiment will be described with reference to FIGS. 29 to 3436.
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`When the manufacturing process starts, as shown in FIG. 29, the conductor 201, the
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`adhesive layer 700 and the protective film 800 are prepared.
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`According to one embodiment, the conductor 201 may be formed by using an alloy
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`15
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`including copper. The copper is in the form ofroll annealed copper or electrodeposited copper.
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`The conductor 201 may have various thicknesses depending on the specification of a product.
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`According to one embodiment, the conductor 201 may have the thickness of 100,um, but the
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`embodimentis not limited thereto.
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`The adhesive layer 700 is used to reinforce the adhesive strength between the conductor
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`20
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`201 and the protective film 800. The adhesive laycr 700 may include thermosctting resin, but the
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`embodimentis not limited thereto. The adhesive layer may have the thickness of 17um, but the
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`embodimentis not limited thereto.
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`The protective film 800 protects the conductor 201 when a predetermined conductive
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`pattern is formed in the conductor 201. In detail, the protective film 800 supports the conductor
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`25
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`201 in the etching process, which will be described later, to protect the conductor 201 such that
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`the predetermined conductive pattern can be formed in the conductor 201.
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`According to one embodiment, the protective film 800 may include polyimide film (PI
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`film), but the embodimentis not limited thereto.
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`Then, as shown in FIG. 30, the conductor 201 is formed on the protective film 800 by the
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`30
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`adhesive layer 700. The laminating process can be used to form the conductor 201 on the
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`protective film 800. The laminating processrefers to the process to bond heterogeneous materials
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`with each other by applying predetermined heat and pressure.
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`Then, as shownin FIG. 31, a photoresist film 900 is attached onto the top surface of the
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`conductor 201. The photoresist film 900 is used for etching the conductor 201 to form a
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`predetermined conductive pattern in the conductor 201. A UV exposure type film or an LDI
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`exposure type film may be used as the photoresist film 900. According to another embodiment, a
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`photoresist coating solution can be coated on the top surface of the conductor 201 without using
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`the photoresist film 900.
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`Aftcr that, as shown in FIG. 32, the photoresist film 900 is subject to the exposure and
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`10
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`development processes to form a mask pattern 910.
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`The mask pattern 910 may be formed on the top surface of the conductor 201
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`corresponding to the position of the conductive pattern.
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`The exposure process refers to the process for selectively irradiating light onto the
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`photoresist film 900 corresponding to the conductive pattern. In detail, in the exposure process,
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`15
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`the light is irradiated onto regions of the conductor 201 where the conductive pattern is not
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`formed. The development process refers to the process for removing the regions to which the
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`light is irradiated through the exposure process.
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`Dueto the exposure and development processes, the mask pattern 910 may be formed in
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`the regions corresponding to the coil unit 200 and the short-range communication antenna 600.
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`20
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`The conductor 201 exposed through the mask pattcrn 910 may be ctched.
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`Then, as shown in FIG. 33, a predetermined portion of the conductor 201 where the mask
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`pattern 910 is not formed may be removed through the etching process. The etching process
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`refers to the process of removing the predetermined portion of the conductor 201 where the mask
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`pattern 910 is not formed by using a chemical reacting with the predetermined portion of the
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`25
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`conductor 201. According to one embodiment, the conductor 201 may be patterned through the
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`wet etching or dry etching.
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`After that, as shown in FIG. 34, the mask pattern 910 is removed so that the first and
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`second connection terminals 210 and 220 of the coil unit 200, the first and second connection
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`terminals 610 and 620 of the short-range communication antenna 600, the coil 230 having a
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`predetermined conductive pattern and the short-range communication antenna 600 having a
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`predetermined conductive pattern may be formed.
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`Then, as shown in FIG. 35, the soldering process is performed to connect the coil unit
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`200 and the short-range communication antenna 600 to the connecting unit 300. According to
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`one embod