2
`
`SUM. LGE420D2
`
`BRIEF SUMMARY
`
`An embodiment provides a method capable of remarkably reducing a thickness of a
`
`wireless power receiver by directly disposing a coil unit on a top surface of a magnetic substrate.
`
`§
`
`An embodiment provides a method capable of ensuring high power transmission
`
`efficiency and enabling cornamunication with external devices by directly disposing a coil unit
`
`and a near field communication antenna on a top surface of a magnetic substrate.
`
`An embodiment provides a method capable of simplifying the manufacturing process for
`
`a wireless power receiver by directly disposing a coil unit on a magnetic substrate.
`
`10
`
`An embodiment provides a method capable of remarkably reducing a thickness of a
`
`wireless power receiver by disposing a coil unit inside a magnetic substrate.
`
`Ao embodiment provides a method capable of ensuring high power transmission
`
`efficiency and enabling communication with external devices by disposing a coil unit inside a
`
`raagnetic substrate and a near field communication antenna on a magnetic substrate.
`
`13
`
`An embodiment provides a method capable of simplifying the manufacturing process for
`
`a wireless power receiver by disposing a coil unit inside a magnetic substrate.
`
`A wireless power receiver according to one embodiment includes a magnetic substrate
`
`and a coil configured to wirelessly receive power, wherein the coil is formed as a conductive
`
`layer on the magnetic substrate.
`
`20
`
`A wireless power receiver according to one embodiment includes a magnetic substrate
`
`and a coil a coil contigured to wirelessly receive power, wherein the coil
`
`is formed a3 a
`
`conductive layer at the magnetic substrate, wherein a part of the coil is disposed inside the
`
`magnetic substrate.
`
`A method of manufacturing a wireless power receiver for wirelessly receiving power
`
`25
`
`according to one embodiment includes forming a conductor on a protective film, forming a
`
`conductive pattern by etching the conductor, connecting a connecting unit to be connected to an
`
`external circuit to a connection terminal of the conductive pattern, obtaining a magnetic substrate
`
`having a receiving space of a predetermined shape corresponding to the connecting unit and
`
`disposing the magnetic substrate on the conductive pattern while positioning the connecting unit
`
`30
`
`in the receiving space.
`
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`Page 916 of 952
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`GOOGLE EXHIBIT 1010 (part 3 of 3)
`
`Page 916 of 952
`
`GOOGLE EXHIBIT 1010 (part 3 of 3)
`
`

`

`<d
`
`SUM. LGE420D2
`
`According to one embodiment,
`
`the thickness of the wireless power receiver can be
`
`remarkably reduced by directly disposing the coil unit on a top surface of the magnetic substrate.
`
`According to one embodiment,
`
`the high power transmission efficiency can be ensured and
`
`communication with external devices can be enabled by directly disposing the coi! unit and the
`
`near field comrnunication antenna on the top surface of the magnetic substrate.
`
`According to one embodiment, the manufacturing process for the wireless power receiver
`
`can be simplified by directly disposing the coil unit on the magnetic substrate only through
`
`laminating and etching processes.
`
`According to one embodiment,
`
`the thickness of the wireless power receiver can be
`
`19
`
`remarkably reduced by forming the conductive pattern inside the magnetic substrate.
`
`According to one embodiment, the hizh power transmission efficiency can be ensured by
`
`forming the conductive pattern inside the magnetic substrate and the communication with
`
`external devices can be enabled by using the near field communication antenna.
`
`According to one embodiment, the connecting unit is disposed in the receiving space of
`
`the magnetic substrate so that the thickness of the wireless power receiver can be remarkably
`
`reduced as much as the thickness of the connecting unit.
`
`According to one embodiment, a tape substrate is used as the connecting unit so that the
`
`overall size of the wireless power receiver can be reduced.
`
`According to one embodiment, a lead frame is used as the connecting unit, so the wiring
`
`20
`
`layer included in the connecting unit can be protected from the heat, external moisture or impact
`
`and the mass production can berealized.
`
`According to one embodiment, the magnetic field directed to the outside can be changed
`
`into the coil unit due to the conductive pattern formed in the magnetic substrate, so the power
`
`transmission efficiency can be improved, at the same time, the amount of the magnetic field
`
`leaked to the outside can be reduced so that the bad influence of the magnetic field exerted to the
`
`human body can be diminished.
`
`According to one embodiment, the wireless power receiver can be manufactured only
`
`through the processes of forming the pattern groove and inserting the coil unit, so that the
`
`manufacturme process can be simplified.
`
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`

`

`4
`
`SUM. LGE420D2
`
`Other various effects of the embodiments will be disclosed directly or indirectly in the
`
`detailed description of the embodiments.
`
`BRIEF DESCRIPTIONOF THE DRAWINGS
`
`FIG.
`
`1 is a perspective viewillustrating a wireless powerreceiver 1000 according to the
`
`first embodiment,
`
`FIG. 2 is a plan viewillustrating a wireless power receiver 1080 according to the first
`
`embodiment;
`
`FIG. 3 is a sectional view taken along line A-A’ of a connecting unit 300 of a wireless
`
`19
`
`power receiver 1086 shown in FIG. 2;
`
`FIGS. 4 to 8 are views for explaining a method of manufacturing a wireless power
`
`receiver 1000 according to one embodiment;
`
`FIG. 9 is a sectional view taken along line A-A’ of a connecting unit 300 of a wireless
`
`powerreceiver 1060 shownin FIG. 2 according to the second embodiment;
`
`FIG. 10 is a plan view illustrating a wireless power receiver 1000 according to the third
`
`embodiment;
`
`FIG. 11 is a perspective viewillustrating a wireless power receiver 1000 according to the
`
`fourth embodiment;
`
`FIG. 12 is a plan viewillustrating a wireless power receiver £000 according to the fourth
`
`20
`
`embodiment;
`
`FIG, 13 is a sectional view taken along me B-B’ of a connecting unit 300 of a wireless
`
`power receiver 1660 shown in FIG. 12 according to the fourth embodiment;
`
`FIG, 141s a perspective view illustrating a wireless powerreceiver 1000 according to the
`
`fifth embodiment;
`
`FIG. 15 is a plan viewillustrating a wireless power receiver 1000 according to the fifth
`
`embodiment:
`
`FIG. 16 is a sectional view taken along line C-C’ of a wireless power receiver 1000
`
`according to the fifth embodiment;
`
`FIGS. 17 to 21 are views for explaining a method of manufacturing a wireless power
`
`30
`
`receiver 1000 according to the fifth embodiment:
`
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`

`

`5
`
`SUM. LGE420D2
`
`FiG. 22 is a view for explaining variation of inductance, resistance and @ values ofacoil
`
`unit 200 as a function of a usable frequency when the coil unit 200 is disposed on a top surface
`
`ofa magnetic substrate according to thefirst embodiment:
`
`FIG. 23 is a view for explaining variation of inductance, resistance and Q values of a coil
`
`unit 200 as a function of a usable frequency when the coil unit 200 is disposed in a pattern
`
`groove formed in a magnetic substrate according to the fifth embodiment;
`
`FiG. 24 is an H-field for Ulustrating a radiation pattern of a magnetic field when a coil
`
`unit is disposed on a top surface of a magnetic substrate according to the first embodiment;
`
`FIG. 25 is an H-field for Wlustrating a radiation pattern of a magnetic field when a coil
`
`19
`
`unit is disposed in a pattern groove formed in a magnetic substrate according to the fifth
`
`embodiment,
`
`FIG. 26 is an exploded perspective view of a wireless powerreceiver 1068 according to
`
`still another embodiment;
`
`FIG. 27 is a perspective view of a wireless powerrecetver 1000 according to still another
`
`embodiment:
`
`FIG. 28 is a sectional view of a wireless power receiver 1000 according to still another
`
`embodiment, and
`
`FIGS. 29 to 37 are views for explaining a method of manufacturing a wireless power
`
`receiver according to still another embodiment.
`
`20
`
`DETAILED DESCRIPTION
`
`Hereinafter, exemplary embodiments will be described in detail with reference to
`
`accompanying drawings so that those skilled in the art can easily work with the embodiments.
`
`Hereinafter, “conductive pattern” refers to the shape of a conductive layer and may be
`
`used to refer to a structure formed by a patterning process. “conductive layer? may be used
`
`interchangeably with “conductive pattern” and refers to a structure formed by methods including
`
`patterning, etching, deposing, selective plating, and the like.
`
`FIG.
`
`1 is a perspective viewillustrating a wireless power receiver 1000 according to the
`
`first embodiment, FIG. Z is a plan viewillustrating the wireless power receiver 1600 according
`
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`
`Page 919 of 952
`
`Page 919 of 952
`
`

`

`6
`
`SUM. LGE420D2
`
`to the first embodiment and FIG. 3 is a sectional view taken along line A-A’ of a connecting unit
`
`308 of the wireless power receiver 1000 shown in FIG. 2.
`
`Referring to FIGS.
`
`1
`
`to 3, the wireless power receiver 1000 may include a magnetic
`
`substrate 106, a coil unit 200 and a connecting unit 300.
`
`The wireless power receiver 1000 may wirelessly receive power from a transmission
`
`side. According to one embodiment, the wireless power receiver 1600 may wirelessly receive
`
`the power using electromagnetic induction. According to one embodiment, the wireless power
`
`receiver 1000 may wirelessly receive the power using resonance.
`
`The electromagnetic induction and resonance may be used when transmitting the nower
`
`19
`
`using the magnetic field.
`
`The magnetic substrate 100 may change the direction of the magnetic field received from
`
`the transmissionside.
`
`The magnetic substrate 100 can reduce the amount of the magnetic field to be leaked to
`
`the outside by changing the direction of the magnetic field received fromthe transmission side.
`
`in detail,
`
`the magnetic substrate 100 changes the direction of the magnetic field
`
`transferred from the transmission side in the lateral direction such that the magnetic field can be
`
`more concentrated onto the coil unit 200.
`
`The magnetic substrate 100 can absorb some of the magnetic field received from the
`
`transmission side and leaked to the outside to dissipate the magnetic field as heat. If the amount
`
`20
`
`of the magnetic field leaked to the outside is reduced, the bad influence of the magnetic field
`
`exerted on the human bodycan be reduced.
`
`Referring to FIG. 3, the magnetic substrate 100 may include a magnet 110 and a support
`
`120.
`
`The magnet £10 may include a particle or a ceramic.
`
`The support 120 may include thermosetting resin or thermoplastic resin.
`
`The magnetic substrate 100 may be prepared in the form of a sheet and may have a
`
`flexible property.
`
`Referring again to FIG. 1, the coil unit 200 may include a first connection terminal 218, a
`
`second connection terminal 220 and a coil 236. The coil 230 may be formed as a conductive
`
`30
`
`layer or a conductive pattern.
`
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`
`

`

`7
`
`SUM. LGE420D2
`
`The first connection terminal 210 is located at one end of the coil 230 and the second
`
`connection terminal 226 is provided at the other end of the coil 230.
`
`The first and second connection terminals 210 and 220 are necessary for connection with
`
`the connecting unit 306.
`
`§
`
`The coil 230 may be formed as a conductive pattern which is obtained by winding a
`
`conductive line several times. According to one embodiment, when viewed from the top, the coil
`
`pattern may have a spiral shape. However, the embodiment is not limited thereto, and various
`
`patterns maybe formed.
`
`The coil unit 200 can be directly disposed on the top surface of the magnetic substrate
`
`10
`
`106, According to one embodiment, an adhesive layer (not shown} maybe disposed betweenthe
`
`cou unit 206 and the magnetic substrate 1606.
`
`The coil unit 200 may include a conductor. The conductor mayinclude a metal or an
`
`alloy. According to one embodiment,
`
`the metal may include silver or copper, but
`
`the
`
`embodiment is not limited thereto.
`
`18
`
`The coil unit 200 may transfer the power, which is wirelessly received from the
`
`transmission side, to the connecting unit 300. The coil unit 200 can receive the power from the
`
`transmission side using the electromagnetic induction or resonance.
`
`The connecting unit 300 may include a first connection terminal 316, a second
`
`connection terminal 326 and a printed circuit board 330.
`
`20
`
`The first connection terminal 310 of the connecting unit 306 may be connected to the first
`
`connection terminal 210 of the coil unit 200 and the second connection terminal 320 of the
`
`connecting unit 300 may be connected to the second connection terminal 22@ of the coil unit
`
`200.
`
`The printed circuit board 330 may include a wiring layer and a receiver circuit, which
`
`25
`
`will be described later, may be disposed on the wiring layer.
`
`The connecting unit 360 connects the wireless power receiving circuit (aot shown) with
`
`the coil unit 200 to transfer the power received from the coil unit 200 to a load (not shown)
`
`through the wireless power receiving circuit. The wireless power receiving circuit may include a
`
`rectifier circuit for converting AC power into DC power and a smoothing circuit for transferring
`
`30
`
`the DC powerto the load after removing ripple components from the DC power.
`
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`
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`
`Page 921 of 952
`
`

`

`8
`
`SUM. LGE420D2
`
`FIGS. 2 and 3 are views for explaining the structure of the wireless powerreceiver 1006
`
`according to the first embodiment in detail when the coil unit 200 is connected with the
`
`connecting unit 300.
`
`FIG, 2 is a plan view illustrating the wireless power receiver 1000 according to thefirst
`
`embodiment.
`
`FIG. 2 showsthe coil unit 206 connected with the connecting unit 306.
`
`According to one embodiment,
`
`the connection between the coil unit 260 and the
`
`connecting unit 30 may be achieved by a solder. In detail, the first connection terminal 210 of
`
`the coil unit 200 may be connected to the first connection terminal 318 of the connecting unit
`
`19
`
`308 through a first solder 10 and the second connection terminal 226 of the coil unit 200 may be
`
`connected to the second connection terminal 328 of the connecting unit 300 through a second
`
`solder 20. In more detail, the first connection terminal 210 ofthe coil unit 200 may be connected
`
`to the first connection terminal 310 of the connecting unit 300 through a via hole of the first
`
`solder 10 and the second connection terminal 220 of the coil umt 200 may be connected to the
`
`13
`
`second connection terminal 32@ of the connecting unit 300 through a via hole of the second
`
`solder 20.
`
`The wireless power receiver 10060 shown in FIG. 2 may be equipped in an electronic
`
`appliance, such as a terminal.
`
`The terminal may include a typical mobile phone, such as a cellular phone, a PCS
`
`20
`
`(personal communication service) phone, a GSMphone, a CDMA-2000 phone, or a WCDMA
`
`phone, a PMP (portable multimedia player), a PDA(personal digital assistant}, a smart phone, or
`
`an MBS (mobile broadcast system) phone, but the embodiment is not limited thereto. Various
`
`devices can be used as the terminal if they can wirelessly receive the power.
`
`A section taken along line A-A’ of the connecting unit 300 shown in FIG. 2 will be
`
`explained with reference to FIG.3.
`
`FIG. 3 is a sectional view taken along line A-A’ of the connecting unit 300 of the
`
`wireless power receiver 1000 shownin FIG. 2.
`
`Referring to FIG. 3, the first connection terminal 216, the second connection terminal 220
`
`and the coil 230 constituting the coil unit 26@ are disposed on the top surface of the magnetic
`
`30
`
`subsirate 10@.
`
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`
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`
`

`

`9
`
`SUM. LGE420D2
`
`in the wireless power receiver 1600 according to the first embodiment, the coil unit 200
`
`is directly disposed on the top surface of the magnetic substrate 100, so the overall thickness can
`
`be remarkably reduced when comparing with the case in which the coil pattern is formed on an
`
`FPCB.
`
`Preferably, the magnetic substrate 100 has a thickness of 0.43 mm and the coil unit 200
`
`has a thickness of 0.1 mm, so the overall thickness is 0.53 mm. However, this numerical value is
`
`illustrative purpose only.
`
`That is, the thickness of the wireless power receiver 1060 can be reduced by preparing
`
`the coil unit 200 in the form of a conductor, a conductive pattern or a thin film. Since the current
`
`19
`
`trend has tended toward the slimness, if the wireless power receiver 1000 is applied to the
`
`electronic device, such as the portable terminal, the overall thickness of the portable terminal can
`
`be reduced and the power can be effectively received fromthe transmissionside.
`
`The connecting unit 300 is directly disposed on the coil unit 200. Since the connecting
`
`unit 300 is directly disposed on the coil unit 200, the coil unit 200 can be readily connected with
`
`the connecting unit 368.
`
`The first connection terminal 210 of the coil unit 200 is connected to the first connection
`
`terminal 318 of the connecting unit 300 through the solder 19.
`
`The second connection terminal 220 of the coil unit 200 is connected to the second
`
`connection terminal 326 of the connecting unit 300 through the solder 28.
`
`20
`
`The coil 230 may be designed to have a predetermined width Wand a predetermined
`
`thickness T. In addition, the coil 230 can be designed to have a predetermined winding interval.
`
`FIGS. 4 to 8 are views for explaining a method of manufacturing the wireless power
`
`receiver 1000 according to one embodiment.
`
`The structure of the wireless power receiver 1000 may be essentially identical to the
`
`structure of the wireless power receiver 1000 described with reference to FIGS.
`
`| to 3.
`
`First, referring to FIG. 4, the magnetic substrate 100 is prepared.
`
`Then, referring to FIG. 5, a conductor 201 is directly laminated on the top surface of the
`
`riagnetic substrate 100. According to one embodiment, the conductor 201 may be laminated
`
`after the adhesive layer has been laminated on the top surface of the magnetic substrate 100.
`
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`
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`
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`
`

`

`10
`
`SUM. LGE420D2
`
`According to one embodiment, a laminating process can be used to form the conductor
`
`201 on the top surface of the magnetic substrate 100. According to the laminating process, the
`
`conductor 201 is heated at the predetermined temperature and then predetermined pressure is
`
`applied to the conductor 201. The laminating process refers to a process of forming
`
`heterogeneous materials, such as a metal foil and a paper, by using heat and pressure.
`
`Then, referring to FIG. 6, a mask 500 is laminated on the top surface of the conductor
`
`201. The mask 500 may be selectively formed on the top surface of the conductor 201
`
`corresponding to positions of the first connection terminal 219, the second connection terminal
`
`226 and the coil 236 of the coil unit 260.
`
`19
`
`After that, referring to FIG. 7, the structure shown in FIG. 6 is immersed in an etchant so
`
`that portions of the conductor 201 where the mask 306 is not positioned may be etched. Thus, the
`
`conductor 201 mayhave a predetermined conductive pattern.
`
`Then, the coil unit 200 of the wireless power receiver 1008 is formed by removing the
`
`mask 506.
`
`Thereafter, referring to FIG. 8, the soldering work is performed to connect the coil unit
`
`208 with the connecting unit 300.
`
`That is, the first connection terminal 210 ofthe coil unit 260 may be connectedto the first
`
`connection terminal 316 of the connecting unit 300 through the first solder 10 and the second
`
`connection terminal 220 of the coil unit 200 maybe connected to the second connection termina!
`
`20
`
`328 of the connecting unit 306 through the second solder26.
`
`As described above, since the coil unit 200 is directly disposed on the top surface ofthe
`
`magnetic substrate 100,
`
`the overall
`
`thickness of the wireless power receiver 1600 can be
`
`remarkably reduced. In addition, since the wireless power receiver 1000 can be manufactured
`
`only through the laminating and etching processes, the manufacturing process may be simplified.
`
`FIG. is a sectional view taken along line A-A’ of the connecting unit 300 ofthe wireless power
`
`receiver 1060 shown in FIG. 2 according to the second embodiment.
`
`Referring to FIG. 9, the wireless power receiver 1000 may include a magnetic substrate
`
`168, a coil unit 260, a connecting unit 300 and an adhesive layer 760.
`
`The magnetic substrate 100, the coil unit 200, and the connecting unit 300 are identical to
`
`30
`
`those deseribed withreference to FIG. 1.
`
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`

`

`ii
`
`SUM. LGE420D2
`
`The adhesive layer 700 is interposed between the magnetic substrate 100 and the coil unit
`
`208 to bond the magnetic substrate £00 to the coil unit 200.
`
`FIG. 10 is a plan view illustrating a wireless power receiver 1000 according to the third
`
`embodiment.
`
`Referring to FIG. 10, the wireless power recetver 1000 may include 4 magnetic substrate
`
`106, a coil unit 200, a connecting unit 306 and a short-range communication antenna 606.
`
`The magnetic substrate 100, the coil unit 206 and the connecting unit 380 are identical to
`
`those described with reference to FIGS. 1 to 3.
`
`The short-range communication antenna 600 includes a first connection terminal 616, a
`
`19
`
`second connection terminal 626 and an outer peripheral coil 6340.
`
`The first connection terminal 610 and the second connection terminal 620 of the short-
`
`range communication antenna 606 are connected to the connecting unit 300.
`
`The short-range communication antenna 600 can make near field communication with a
`
`reader. The short-range communication antenna 600 may serve as an antenna that transceives
`
`information in cooperation with the reader.
`
`According to one embodiment,
`
`the short-range communication antenna 600 may be
`
`arranged at an outer peripheral portion of the coil unit 260. According to one embodiment, when
`
`the coil unit 200 is disposed at
`
`the center of the magnetic substrate 100,
`
`the short-range
`
`communication antenna 600 may be arranged along the outer peripheral portion of the magnetic
`
`20
`
`substrate 100) to surround the coil unit 200. The short-range communication antenna 600 may
`
`have a rectangular configuration by winding one conductive line several
`
`times, but
`
`the
`
`embodimentis not limited thereto.
`
`Similar to the coil unit 266, the short-range communication antenna 600 may be formed
`
`as a conductive pattern or a conductive layer.
`
`Various short-range communication technologies can be applied to the short-range
`
`communication antenna 606, and the NFCtechnology is preferable. The NFC technology has the
`
`band of 12.56 MHz andis used for wireless communication in a short distance.
`
`The short-range communication antenna 600 can be directly disposed on the top surface
`
`of the magnetic substrate 106.
`
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`

`

`12
`
`SUM. LGE420D2
`
`The method of forming the short-range communication antenna 600 on the magnetic
`
`substrate 100 maybe identical to the methad described with reference to FIG. 4.
`
`Hereinafter, a wireless power receiver 1000 according to the fourth embodiment will be
`
`described with reference to FIGS. 11 to 13.
`
`FIG.
`
`IL is a perspective view illustrating the wireless power receiver 1000 according to
`
`the fourth embodiment.
`
`Referring to FG. 11, the wireless power receiver 1000 includes a magnetic substrate 100,
`
`a coil unit 200 and a connecting unit 308.
`
`The magnetic substrate 100 and the coil unit 200 are identical to those described with
`
`19
`
`reference to FIG. 1. However, the magnetic substrate 100 is shehily different from the magnetic
`
`substrate 100 described with reference to FIG. 1, so the following description will be made while
`
`focusing the difference of the magnetic substrate 100.
`
`Referring to FIG. 11, the magnet substrate 100 is formed with a receiving space 130
`
`having a structure the same as that of the connecting unit 300. That is, referring to FIG. 1, the
`
`13
`
`coil unit 206 is disposed on the top surface of the magnetic substrate 160 and the connecting unit
`
`308 is disposed on the coil unit 200. However, referring to FIG. 11, the receiving space 130
`
`having the structure the same as that of the connecting unit 300 is formed in the magnetic
`
`substrate 100, so that the connecting unit 300 may be disposed underthe coil unit 200.
`
`FIG. 12 is a plan viewillustrating a wireless power receiver £000 according to the fourth
`
`20
`
`embodiment.
`
`FIG. 12 shows the state in which the coil unit 200 and the connecting unit 30 are
`
`interconnected with each other.
`
`The connecting unit 300 has a thickness equal
`
`to or smaller than a thickness of the
`
`magnetic substrate 166. The connecting unit 300 may be implemented as a flexible printed
`
`circuit board (FPCB).
`
`The connecting unit 300 may be disposed in the receiving space 130 of the magnetic
`
`substrate 189.
`
`If the thickness of the connecting unit 300 is equal to or smaller than the thickness of the
`
`magnetic subsirate 100, different from the embodiment shown in FIG. 3, the overall thickness of
`
`30
`
`the wireless power receiver 1008 can be reduced as much asthe thickness of the connecting unit
`
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`

`

`13
`
`SUM. LGE420D2
`
`306. In addition, since the usage of the magnet 110 and the support 120 can be reduced due to
`
`the receiving space 130, it is advantageous in terms of cost effectiveness.
`
`FIG. 13 is a sectional view taken along line B-B’ ofthe connecting unit 300 of the
`
`wireless power receiver 1000 shown in FIG. 12 according to the fourth embodiment.
`
`The following description will be made on the assumption that the connecting unit 300
`
`has a thickness smailer than that of the magnetic substrate 100.
`
`Referring to FIG. 13, the first connection terminal 218, the second connection terminal
`
`22@ and the coil 230 constituting the coil unit 200 are disposed on
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`the top surface of the
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`connecting unit 300.
`
`19
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`The connecting unit 300 is disposed under the coil unit 200.
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`The first connection terminal 210 of the coil unit 266 is connected to the first connection
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`terminal 316 of the connecting unit 300 bythe solder10.
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`The second connection terminal 220 of the coil unit 260 is connected to the second
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`connection terminal 320 of the connecting unit 308 bythe solder 260.
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`The coil 230 may be designed to have a predetermined width W and a predetermined
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`thickness T. In addition, the coil 230 can be designed to have a predetermined winding interval.
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`Referring to FIG.
`
`12, different from the embodiment shown in FIG. 3, the thickness of
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`the connecting unit 366 is smaller than the thickness of the magnetic substrate 100, so the overall
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`thickness of the wireless power receiver 1006 can be reduced as much as the thickness of the
`
`20
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`connecting unit 306. In addition, since the usage of the magnet 110 and the support 120 can be
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`reduced due to the receiving space 130, it is advantageous in terms of cost effectiveness.
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`Hereinafter, a wireless power receiver 1660 according to the fifth embodiment will be
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`described in detail with reference to FIGS. 14 to 20.
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`FIG. 14 is a perspective viewillustrating the wireless power receiver 1000 according to
`
`the fifth embodiment, FIG. 15 is a plan viewillustrating the wireless power receiver 1006
`
`according to the fourth embodiment, FIG. 16 is a sectional view taken along line C-C’ ofthe
`
`wireless power receiver 1000 according to the fifth embodiment, and FIGS. 17 to 21 are views
`
`for explaining a method of manufacturing the wireless power receiver 1000 according to the fifth
`
`embodiment.
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`14
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`SUM. LGE420D2
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`First, referring to FIG. 14,
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`the wireless power receiver 1000 according to the fifth
`
`embodiment may include a magnetic substrate 100, a coil unit 200 and a connecting unit 300.
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`According to one embodiment, the wireless power receiver 1000 can wirelessly receive
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`power from the transmission side using electromagnetic induction. In this case, the coil 230 of
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`the coil unit 206 can wirelessly receive power through the electromagnetic induction with a coil
`
`of the transmission side.
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`According to one embodiment, the wireless power receiver 1000 can wirelessly receive
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`power from the transmission side using resonance.
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`The magnetic substrate 100 may change the direction of the magnetic field received from
`
`19
`
`the transmission side.
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`The magnetic substrate 100 can reduce the amount of the magnetic field leaked to the
`
`outside by changing the direction of the magnetic field received from the transmission side.
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`The magnetic substrate 100 can change the direction of the magnetic field received from
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`the transmission side in the lateral direction such that
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`the magnetic field can be more
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`concentrated onto the coil unit 200.
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`The magnetic substrate 100 can absorb some of the magnetic field received from the
`
`transmission side and leaked to the outside to dissipate the magnetic field as heat. If the amount
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`of the magnetic field leaked to the outside is reduced, the bad influence ofthe magnetic field
`
`exerted on the human body can be reduced.
`
`20
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`Referring to FIG. 16, the magnetic substrate 100 mayinclude a magnet 110 and a support
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`128.
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`The magnet 116 may include a particle or a ceramic. According to one embodiment, the
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`magnet 110 may be one of a spinel type magnet, a hexa type magnet, a sendust type magnet and
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`a permalloy type magnet.
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`The support 126 may include thermosetting resin or thermoplastic resin and support the
`
`magnetic substrate 100.
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`The magnetic substrate 100 may be prepared in the form of a sheet and may have a
`
`flexible property.
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`13
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`SUM. LGE420D2
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`Referring again to FIG. 14, the coil unit 200 may include a first connection terminal 219,
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`a second connection terminal 226 and a coil 236. The coil 230 may formed as a conductive layer
`
`or a conductive pattern.
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`The coil unit 200 may be disposed inside the magnetic substrate 160. In detail, the coil
`
`unit 260 may be buried inside the magnetic substrate 108. In more detail, the magnetic substrate
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`106 mayinclude a pattern groove and the coil unit 200 may be disposed in ihe pattern groove.
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`The pattern groove may be formed as a conductive pattern or a conductive layer simular to the
`
`col unit 200.
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`The coil unit 200 has a thickness smaller than that of the magnetic substrate 100 and an
`
`19
`
`upper portion of the coil unit 200 may be exposed out of the magnetic substrate 180.
`
`A process for manufacturing the wireless power receiver 1000 by disposing the coil unit
`
`266 and the connecting unit 300 in the magnetic substrate 100 will be described later with
`
`reference to FIGS. 17 to 21.
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`The first connection terminal 210 of the coll unit 200 is located at one end of the coil 230
`
`and the second connection terminal 220 of the coil unit 200 is located at the other end ofthe coil
`
`238.
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`The first and second connection terminals 210 and 220 of the coil unit 200 are necessary
`
`for connection with the connecting unit 360.
`
`The coil 230 may be formedas acoil pattern which is obtained by winding a conductive
`
`20
`
`line several times. According to one embodiment, when viewed from the top, the coil pattern
`
`may have a spiral shape. However, the embodiment is not limited thereto, and various patterns
`
`may be formed.
`
`The coil unit 206 may transfer the power wirelessly received from the transmission side
`
`to the connecting unit 300. The coil unit 200 maytransfer the power wirelessly received from the
`
`transmission side using the electromagnetic induction or resonance to the connecting unit 300.
`
`The connecting unit 300 may include a first connection terminal 310, a second
`
`connection terminal 328 and a printed circuit board 330.
`
`The first connection terminal 310 of the connecting unit 300 may be connectedto thefirst
`
`connection terminal 210 of the coil unit 200 and the second connection terminal 326 of the
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`16
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`SUM. LGE42