`
`
`
`CERTIFICATE OF TRANSLATION ACCURACY
`
`
`
`I, Benjamin Barrett, declare:
`
`I am a professional translator specializing in translating Japanese to English.
`
`I have more than 25 years of experience translating thousands of technical, legal, and business documents
`from Japanese to English.
`
`I certify that the following Japanese to English translation of the corresponding source text is a true,
`
`correct, and complete translation to the best of my knowledge and ability.
`
`I hereby certify under penalty of perjury that the foregoing is true and correct. Executed this 6th day of
`November 2021 in Skagit County of the State of Washington.
`
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0001
`
`

`

`JP 2013-53029 A Mar. 21, 2013
`
`
`(12) Patent Application Gazette (A)
`
`
`(11) Published Application No.
` 2013-53029
` (P2013-53029A)
`(43) Published: Mar. 21, 2013
`
`Theme codes (reference)
`F1
`Z
`4G018
`C04B
`A
`C04B
`B
`C04B
`
`
`
`
`Request for examination: Not yet requested; Number of claims: 6 OL (Total of 10 pages)
`2011-191374 (P2011-191374)
`(71) Applicant:
`000237721
`Sep. 2, 2011
`
`FDK CORP
`
`
`5-36-11 Shinbashi, Minato-ku, Tokyo
`
`(74) Agent, attorney, or
`100096862
`firm:
`Chiharu Shimizu, patent attorney
`(72) Inventor:
`Yuji Goto
`℅ FDK CORP
`5-36-11 Shinbashi, Minato-ku, Tokyo
`Da Ro
`℅ FDK CORP
`5-36-11 Shinbashi, Minato-ku, Tokyo
`Toshitaka Hashimoto
`℅ FDK CORP
`5-36-11 Shinbashi, Minato-ku, Tokyo
`
`
`
`Continued to last page
`
`
`
`(19) Japan Patent Office (JP)
`
`
`
`(51) Int. Cl.
`C04B
`C04B
`C04B
`
`
`
`41/91
`41/83
`35/26
`
`(21) Filed Application No.:
`(22) Filed:
`
`
`
`
`
`
`
`
`
`
`
`
`(Jan. 2006)
`(Jan. 2006)
`(Jan. 2006)
`
`
`
`
`
`
`
`
`
`
`
`
`
`41/91
`41/83
`35/26
`
`(72) Inventor:
`
`(72) Inventor:
`
`
`
`
`(54) (TITLE) FERRITE PLATE AND MANUFACTURING METHOD THEREOF
`
`(57) (ABSTRACT)
`
`(PROBLEM) To provide a ferrite plate with a desired flexibility and
`which maximally utilizes the surface area of a sintered ferrite
`sheet to obtain excellent characteristics. ]
`
`(MEANS TO SOLVE THE PROBLEM) A coating layer 3 comprising a
`flexible synthetic resin is formed on the front and back surfaces
`2a, 2b and the side faces 2c of a thin plate-like sintered ferrite
`sheet 2, and the sintered ferrite sheet 2 is divided into small pieces
`along a plurality of cutting lines 11, 12 penetrating the front and
`back surfaces of the sintered ferrite sheet 2.
`
`(SELECTED DRAWING) FIG. 1
`
`
`
`
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0002
`
`

`

`
`
`(2)
`
`JP 2013-53029 A Mar. 21, 2013
`
`
`(CLAIMS)
`(CLAIM 1)
` A ferrite plate characterized in that a coating layer comprising a flexible synthetic resin is formed on the front, back, and
`side surfaces of a thin board-like sintered ferrite sheet, and the aforementioned sintered ferrite sheet is divided into small
`pieces along a plurality of cutting lines penetrating the front and back surfaces of the aforementioned sintered ferrite sheet.
`(CLAIM 2)
` The ferrite plate set forth in claim 1 characterized in that the aforementioned coating layer is formed with an ultraviolet
`curing resin or a thermosetting resin having a hardness (Shore A) of 45 to 90.
`(CLAIM 3)
` A method for manufacturing a ferrite plate characterized in that discontinuous cutting lines are formed on a thin board-
`like ferrite green sheet, penetrating the front and back surfaces thereof, then said ferrite green sheet is sintered to form a
`sintered ferrite sheet, a flexible synthetic resin is applied to the front, back, and side surfaces of said sintered ferrite sheet,
`next said synthetic resin is cured, and then a weight is applied to the aforementioned sintered ferrite sheet in an out-of-
`plane direction, dividing said sintered ferrite sheet along the aforementioned cutting lines.
`(CLAIM 4)
` The method for manufacturing a ferrite plate set forth in claim 3 characterized in that an ultraviolet curing resin or a
`thermosetting resin with a hardness (Shore A) of 45 to 90 is applied as the aforementioned synthetic resin and then cured
`with ultraviolet ray irradiation or heat.
`(CLAIM 5)
` The method for manufacturing a ferrite plate set forth in claim 3 or 4 characterized in that, as the aforementioned cutting
`lines, a plurality of discontinuous perforation-like first cutting lines are formed in a first direction of the aforementioned
`ferrite green sheet with intervals in the direction orthogonal to the aforementioned first direction, and a plurality of
`discontinuous perforation-like second cutting lines are formed in a second direction orthogonal to the aforementioned first
`direction with intervals in the direction orthogonal to the aforementioned second direction.
`(CLAIM 6)
` The method for manufacturing a ferrite plate set forth in claim 5 characterized in that the aforementioned first and second
`cutting lines are formed intersecting each other at the aforementioned penetration portions.
`(DETAILED DESCRIPTION OF THE INVENTION)
`(TECHNICAL FIELD)
`(0001)
` The present invention relates to a ferrite plate affixed to an electronic device or the like as an EMI measure, a heat
`dissipation measure or the like for said electronic device.
`(BACKGROUND ART)
`(0002)
`
`In recent years, plates using a sintered ferrite sheet with high magnetic permeability have been adopted in structures
`affixed to an RF-ID or electronic device to suppress RF-ID metal interference, and as EMI measures and heat dissipation
`measures for electronic devices.
`(0003)
` However, while the sintered ferrite sheets used in this type of plate function to counter high noise due to the increased
`magnetic permeability, there is a drawback in that the sintered ferrite sheets are brittle against mechanical stress and shock
`due to the low elastic modulus. Therefore, when a thin plate-like sintered ferrite sheet is affixed as is to the aforementioned
`electronic device with an irregular surface, irregular fragmentation and cracking occur, inviting degradation of the magnetic
`characteristics (magnetic permeability) and resulting in the danger of not obtaining the desired noise measure functionality
`and the like.
`(0004)
` A method has been conventionally used for affixing the aforementioned sintered ferrite sheet to the aforementioned
`electronic device or the like in which the sintered ferrite sheet is divided into regular small pieces in advance with overall
`enhanced flexibility. As seen in the below-mentioned Patent Document 1, for example, during the manufacture of the
`sintered ferrite sheet with this method, a groove with a prescribed depth is made (half-cut) in the surface, a protection film
`or an adhesive layer is formed on the surface of said sintered ferrite sheet so that the small pieces thereof do not separate
`or fall after division, and then the division is carried out along the aforementioned groove to form the aforementioned
`flexible ferrite plate.
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0003
`
`

`

`
`
`(3)
`
`JP 2013-53029 A Mar. 21, 2013
`
`(0005) Methods adopted for cutting the groove in the aforementioned sintered ferrite sheet include cutting the ferrite sheet
`with a dicing saw or the like after sintering and cutting a recessed groove with a cutting machine or the like in a ferrite green
`sheet before sintering and then sintering.
`(0006) FIG. 5 shows a conventional ferrite plate obtained in this manner. In a ferrite plate 50, a sintered ferrite sheet 52
`formed with grooves 51 is covered on the front and back surfaces with protection films 53 and 54, outer peripheral parts
`53a and 54a are joined by heat sealing, bonding, or the like, and then a weight is applied on the sintered ferrite sheet 52 in
`an out-of-plane direction to divide, along the grooves 51, the aforementioned sintered sheet 52 into small pieces.
`(PRIOR ART DOCUMENTS)
`(PATENT DOCUMENTS)
`(0007)
`(PATENT DOCUMENT 1) JP 4277596
`(SUMMARY OF THE INVENTION)
`(PROBLEM THE INVENTION IS TO SOLVE)
`(0008)
` However, when affixing the aforementioned conventional ferrite plate 50 to an electronic device or the like, the outer
`periphery parts 53a and 54a must be joined securely to the protection films 53 and 54 so that said small pieces do not fall or
`the like.
`(0009)
` Therefore, the surface area of the sintered ferrite sheet 52 to the total surface area of the ferrite plate 50 is necessarily
`smaller by the area corresponding to a width L of the outer periphery parts 53a and 54a of the protection films 53 and 54,
`and therefore, even if a plate with a high magnetic permeability is used as the sintered ferrite sheet 52, there is the problem
`that the characteristics degrade with the reduction in the aforementioned surface area.
`(0010)
` The present invention was devised taking these circumstances into account and has the problem of providing a ferrite
`plate with a desired flexibility and which maximally utilizes the surface area of a sintered ferrite sheet to obtain excellent
`characteristics.
`(MEANS TO SOLVE THE PROBLEM)
`(0011)
`
`In order to solve the aforementioned problem, the ferrite plate according to the invention set forth in claim 1 is
`characterized in that a coating layer comprising a flexible synthetic resin is formed on the front, back, and side surfaces of a
`thin board-like sintered ferrite sheet, and the aforementioned sintered ferrite sheet is divided into small pieces along a
`plurality of cutting lines penetrating the front and back surfaces of the aforementioned sintered ferrite sheet.
`(0012)
` The invention set forth in claim 2 is characterized in that in the invention set forth in claim 1, the aforementioned coating
`layer is formed with an ultraviolet curing resin or a thermosetting resin having a hardness (Shore A) of 45 to 90.
`(0013)
` The method for manufacturing a ferrite plate according to the invention set forth in claim 3 is characterized in that
`discontinuous cutting lines are formed on a thin board-like ferrite green sheet, penetrating the front and back surfaces
`thereof, then said ferrite green sheet is sintered to form a sintered ferrite sheet, a flexible synthetic resin is applied to the
`front, back, and side surfaces of said sintered ferrite sheet, next said synthetic resin is cured, and then a weight is applied to
`the aforementioned sintered ferrite sheet in an out-of-plane direction, dividing said sintered ferrite sheet along the
`aforementioned cutting lines.
`(0014)
` The invention set forth in claim 4 is characterized in that in the invention set forth in claim 3, an ultraviolet curing resin or
`a thermosetting resin with a hardness (Shore A) of 45 to 90 is applied as the aforementioned synthetic resin and then cured
`with ultraviolet ray irradiation or heat.
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0004
`
`

`

`
`
`(4)
`
`JP 2013-53029 A Mar. 21, 2013
`
`
`(0015)
` The invention set forth in claim 5 is characterized in that in the invention set forth in claim 3 or 4, as the aforementioned
`cutting lines, a plurality of discontinuous perforation-like first cutting lines are formed in a first direction of the
`aforementioned ferrite green sheet with intervals in the direction orthogonal to the aforementioned first direction, and a
`plurality of discontinuous perforation-like second cutting lines are formed in a second direction orthogonal to the
`aforementioned first direction with intervals in the direction orthogonal to the aforementioned second direction.
`(0016)
` The invention set forth in claim 6 is characterized in that in the invention set forth in claim 5, the aforementioned first and
`second cutting lines are formed intersecting each other at the aforementioned penetration portions.
`(EFFECT OF THE INVENTION)
`(0017)
` According to the ferrite plate set forth in claims 1 and 2 and the ferrite plate obtained by the method for manufacturing a
`ferrite plate set forth in claims 3 to 6, the front, back, and sides of a sintered ferrite sheet are covered with a coating layer
`comprising a flexible synthetic resin, and therefore no synthetic resin portion fails to contribute to the performance in the
`outer peripheral portion as conventionally occurred. Therefore the surface area of the sintered ferrite sheet is maximally
`used to obtain excellent characteristics.
`(0018)
` Because the aforementioned coating layer covers the entirety of the aforementioned sintered ferrite sheet from the top
`and bottom surfaces to the side surfaces, even if the aforementioned ferrite plate is affixed to an electronic device or the
`like, the small pieces of the sintered ferrite sheet after division are reliably prevented from separating and falling.
`(0019)
` The aforementioned coating layer is suitable for formation with a ultraviolet curing resin or a thermosetting resin with a
`hardness of 45–90 (Shore A) as in the invention set forth in claim 2 or 4. The thickness of a general protection film is
`conventional around 50 μm. Accordingly, the thickness of the coating layer in the present invention is equivalent or no
`greater than 50 μm. When using this, if the hardness exceeds 90 and the layer after curing is thin, there is the danger of
`cracking appearing due to the inability to withstand the stress when the sintered ferrite sheet is divided and split into pieces,
`and if the aforementioned hardness is less than 45, then while there is no problem when the sintered ferrite sheet is divided
`and split into pieces, there is a danger that the operability will degrade when setting said ferrite plate to an electronic device
`or the like due to excessive flexibility, which is not desirable.
`(0020)
` When conventionally forming a cut line for dividing the aforementioned sintered ferrite sheet into small pieces, a method
`is generally adopted such as in which a groove is cut (half-cut) to a prescribed depth with a cutting machine or the like in the
`surface of the ferrite green sheet before sintering, but if the ferrite green sheet becomes thin, there is the problem that
`cutting the groove to high precision is difficult, and when cutting a ferrite green sheet with a different thickness, there is the
`problem that the settings of the cutting machine must be changed according to said thickness, which takes extra time.
`(0021)
` As in the invention set forth in claim 5, by forming the discontinuous perforation-like first cutting lines in a first direction
`of the aforementioned ferrite green sheet at intervals in the direction orthogonal to the aforementioned first direction and
`forming the discontinuous perforation-like second cutting lines in a second direction orthogonal to the aforementioned first
`direction with intervals in the direction orthogonal to the second direction, processing is easy even if the aforementioned
`sintered ferrite sheet has some partial thickness differences or is no greater than 100 μm in thickness, and after the
`aforementioned coating layer is formed, a weight can be applied in an out-of-plane direction to divide the sintered ferrite
`sheet into small pieces along the aforementioned first and second cutting lines.
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0005
`
`

`

`
`
`(5)
`
`JP 2013-53029 A Mar. 21, 2013
`
`
`(0022)
` When forming the first and second cutting lines, dividing along the aforementioned first and second cutting lines can be
`done more reliably if the aforementioned first and second cutting lines mutually intersect at the portion penetrating in the
`thickness direction as in the invention set forth in claim 5.
`(BRIEF DESCRIPTION OF THE DRAWINGS)
`(0023)
`(FIG. 1) Shows an embodiment of the ferrite plate according to the present invention. FIG. 1(a) is a plan view that is a cross-
`section of the A-A line, and FIG. 1(b) is a cross-section view of the line B-B in (a).
`(FIG. 2) A plan view showing the ferrite green sheet processed with a cutting machine in the method for manufacturing a
`ferrite plate according to the present invention.
`(FIG. 3) A front view showing the state when the cutting line of the ferrite green sheet in FIG. 2 is processed.
`(FIG. 4) A front view showing a green sheet processed with a cutting line in another embodiment of the method for
`manufacturing a ferrite plate according to the present invention.
`(FIG. 5) Shows a conventional ferrite plate. FIG. (a) is a plan view that is a cross-section of the D-D line in (b) and (b) is a cross-
`section view of the C-C line in (a).
`(MODES FOR WORKING THE INVENTION)
`(0024)
` FIG. 1 and FIG. 2 show an embodiment of the ferrite plate according to the present invention. A ferrite plate 1 is such that
`a coating layer 3 comprising a flexible synthetic resin is formed on top and bottom surfaces 2a and 2b and side surfaces 2c
`of a rectangular thin plate-like (sheet-like) sintered ferrite sheet 50 μm to 1.0 mm in thickness, and the sintered ferrite sheet
`2 is divided into small pieces on a plurality of mutually orthogonal cutting lines 4 penetrating the top and bottom surfaces.
`(0025)
` The aforementioned plurality of cutting lines 4 are formed such that the sintered ferrite sheet 2 is divided along
`perforation-like X-direction cutting lines 11 and Y-direction cutting lines 12 described below, the X-direction cutting lines 11
`and the Y-direction cutting lines 12 being continuous.
` The coating layer 3 has a hardness (Shore A) of 45–90, and is formed with an ultraviolet curing resin or a thermosetting
`resin having a coefficient of extension of at least 60%.
`(0026)
` Next, an embodiment of the method for manufacturing a ferrite plate comprising the aforementioned constitution is
`described.
` First, a ferrite powder and an organic binder are kneaded to make a ferrite paste, from which a sheet formation device
`such as an extrusion molding machine makes a green sheet 10 with a prescribed thickness with the doctor blade technique,
`and then cutting lines 11 and 12 such as shown in FIG. 3 are formed in the green sheet 10.
`(0027)
`
`In the ferrite green sheet 10, when in the drawings the horizontal direction is the X direction (a first direction) and the
`vertical direction is the Y direction (a second direction), a plurality of (for convenience, seven in the drawing) X-direction
`cutting lines (first cutting lines) 11 are formed extending in the X direction equidistant in the Y direction, and a plurality of
`(for convenience, six in the drawing) Y direction cutting lines (second cutting lines) 12 are formed extending in the Y direction
`equidistant in the X direction.
`(0028)
` The X-direction cutting lines 11 are perforations formed penetrating in the thickness direction and discontinuous in the X
`direction, and the Y direction cutting lines 12, similarly, are perforations penetrating in the thickness direction and
`discontinuous in the Y direction. These plurality of X direction cutting lines 11 and Y direction cutting lines 112 are formed
`overall as a lattice so as to be mutually orthogonal at the center of the penetration portion.
`(0029)
` For forming such X direction cutting lines 11 and Y direction cutting lines 12 in the green sheet 10, first a cutting blade 13
`is used to form the plurality of X direction cutting lines 11. The cutting blade 7 [sic] has a plurality of (eight in the drawing)
`blade parts 13a with a width a and separated at equal distances b, and said blade part 13a is formed with a greater depth t
`than the thickness of the green sheet 10.
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0006
`
`

`

`
`
`(6)
`
`JP 2013-53029 A Mar. 21, 2013
`
`
`(0030)
` When moving the aforementioned blade part 13a of the cutting blade 13 in the downward direction as is to a desired
`location on the green sheet 10, the plurality of (eight in the drawing) discontinuous cutting lines 11 with a length a are
`formed with intervals b by the plurality of blade parts 13a.
` When the aforementioned cutting blade 13 is moved a prescribed amount in the Y direction, the X direction cutting lines
`11 are successively formed, and then when the direction of said cutting lade 13 is changed to the perpendicular direction,
`the Y direction cutting lines 12 are formed in a similar manner. During this process, the cutting blade 13 is arranged so that
`the Y direction cutting lines 12 formed by the blade part 13a intersect, in the center, the X direction cutting lines 11 formed
`previously.
`(0031) In this manner, all of the X direction cutting lines 11 and the Y direction cutting lines 12 are formed, and then said
`green sheet 10 is sintered, and the aforementioned sintered ferrite sheet 2 is thereby obtained.
` Next, a synthetic resin that is flexible even after curing is applied to the entirety of the front and back surfaces 2a and 2b
`and the side surfaces 2c of the aforementioned sintered ferrite sheet 2 and allowed to cure, forming the coating layer 3.
`(0032)
` An acrylic, silicone, epoxy of other such ultraviolet curing resin or a rubber, urethane, acrylic, silicone, or epoxy
`thermosetting resin with a hardness (Shore A) in the range of 45 to 90 and coefficient of extension of at least 60% is suitable
`as such a synthetic resin. If the aforementioned ultraviolet curing resin is used, after application, curing is carried out with
`the irradiation of ultraviolet rays, and if the aforementioned thermosetting resin is used, after application, curing is carried
`out by heating to a prescribed temperature, thereby forming the aforementioned coating 3.
`(0033)
` Next, after the aforementioned synthetic resin is cured to form the coating layer 3, a load is applied in an out-of-plane
`direction of the sintered ferrite sheet 2 form the front and back sides of said coating layer 3 to divide the sintered ferrite
`sheet 2 along the aforementioned cutting lines 11 and 12, obtaining the ferrite plate 1 shown in FIG. 1. The ferrite plate 1
`configured as described above is suitable for suppressing RF-ID metal interference and as an EMI measure for electronic
`devices.
`(0034)
`
`In this manner, according to the ferrite plate 1 configured as described above and the manufacturing method therefor,
`the entirety of the front and back surfaces 2a and 2b and the sides surfaces 2c of the sintered ferrite sheet 2 are covered
`with the coating layer 3 comprising the flexible synthetic resin, and therefore there is not portion of the synthetic resin that
`does not contribute to the performance of the outer periphery portion such as in conventional designs. Therefore, the
`surface area of the sintered ferrite sheet 2 can be utilized maximally to obtain superior characteristics as shown in FIG. 1.
`(0035)
` Because the sintered ferrite sheet 2 is covered with the coating over the entirety including the front and back surfaces 2a
`and 2b and the sides 2c, even if the ferrite plate 1 is affixed to an electronic device or the like, the sintered ferrite sheet 2 is
`divided along the X direction cutting lines 11 and the Y direction cutting lines 12 and subsequent separation into small pieces
`or dropping is reliably prevented.
`(0036)
`
`In addition, the aforementioned coating layer 3 is formed with an ultraviolet curing resin or a thermosetting resin with a
`hardness (Shore A) of 45 to 90 and a coefficient of extension of at least 60%, so if the thickness of the coating layer 3 after
`curing is relatively thin, there is no danger of cracks occurring due to an inability to withstand the stress when the sintered
`ferrite sheet 2 is divided into small pieces or of degradation of operability due to excess softness when installing said ferrite
`plate 1 in an electronic device or the like.
`(0037)
`
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0007
`
`

`

`
`
`(7)
`
`JP 2013-53029 A Mar. 21, 2013
`
` Because the plurality of perforation-like X direction cutting lines 11 formed penetrating in the thickness direction and
`discontinuously in the X direction and the plurality of perforation-like Y direction cutting lines 12 formed discontinuously in
`the Y direction are formed at intervals so as to make a lattice overall in the ferrite green sheet 10 for obtaining the sintered
`ferrite sheet 2 without conventional forming half-cut cutting lines, working of the sintered ferrite sheet 2 is easy even if the
`thickness differs in some portions or if the thickness is 100 μm or less, and after forming the coating layer 3, a weight may
`be applied in an out-of-plane direction for dividing into small pieces along the aforementioned X direction cutting lines 11
`and the Y direction cutting lines 12.
`(0038)
` Moreover, because the X direction cutting lines 11 and the Y direction cutting lines 12 mutually interest, reliable division
`of one layer is possible along the X direction cutting lines 11 and the Y direction cutting lines 12.
`(0039)
`
`In the embodiment described above, the X direction cutting lines 11 and the Y direction cutting lines 12 were described
`with formation using the cutting blade 13, but the present invention is not limited thereto. For example, a roller cutter or
`the like provided with corresponding blade parts can be used to form the X direction cutting lines 11 and the Y direction
`cutting lines 12 in the surface of the roller.
`(0040)
` Further, in the embodiment described above, the X direction cutting lines 11 and the Y direction cutting lines 12 are shown
`orthogonal to each other at the penetration portions, but the present invention is not limited thereto. For example, an
`overall lattice may be formed as shown in FIG. 4 without the perforation-like cutting lines 11 and 12 intersecting.
` The X direction cutting lines 11 and the Y direction cutting lines 12 are not limited to a mutually orthogonal lattice shape
`but may intersect in a diamond-shape lattice.
`(INDUSTRIAL APPLICABILITY)
`(0041)
` Use of the present invention is possible as a ferrite plate affixed to an electronic device or the like as an EMI, heat
`dissipation measure, or the like of said electronic device.
`(EXPLANATION OF THE REFERENCE SYMBOLS)
`1
`Ferrite plate
`2
`Sintered ferrite sheet
`2a
`Front surface
`2b
`Back surface
`2c
`Side surface
`3
`Coating layer
`4
`Cutting line
`10
`Ferrite green sheet
`11
`X direction cutting line (first cutting line)
`12
`Y direction cutting line (second cutting line)
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0008
`
`

`

`
`
`
`
`
`
`
`(FIG. 1)
`
`(8)
`
`(FIG. 2)
`
`JP 2013-53029 A Mar. 21, 2013
`
`
`
`
`
`
`(FIG. 4)
`
`
`
`
`
`(FIG. 3)
`
`
`
`
`
`
`
`
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0009
`
`

`

`JP 2013-53029 A Mar. 21, 2013
`
`
`
`
`
`
`
`
`
`
`(FIG. 5)
`
`(9)
`
`
`
`
`
`
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0010
`
`

`

`
`
`Continuation of front page
`
`
`(72) Inventor:
`
`Manabu Teranishi
`℅ FDK CORP
`5-36-11 Shinbashi, Minato-ku,
`Tokyo
`F terms (reference) 4G018 AC06 AC23 AC26
`
`
`(10)
`
`
`
`JP 2013-53029 A Mar. 21, 2013
`
`
`
`
`
`
`Petitioner Samsung and Google
`Ex-1013, 0011
`
`