I 1111111111111111 11111 1111111111 lllll 111111111111111 111111111111111 IIII IIII
`US008643219B2
`
`c12) United States Patent
`Yabe et al.
`
`(IO) Patent No.:
`(45) Date of Patent:
`
`US 8,643,219 B2
`Feb.4,2014
`
`(54) ELECTRONIC EQUIPMENT AND METHOD
`FOR CONNECTING ELECTRONIC CIRCUIT
`SUBSTRATE
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`(75)
`
`Inventors: Masaaki Yabe, Tokyo (JP); Yoshiaki
`Koizumi, Tokyo (JP); Toshiyasu
`Higuma, Tokyo (JP); Noriyuki Kushiro,
`Tokyo (JP)
`
`(73) Assignee: Mitsubishi Electric Corporation,
`Chiyoda-Ku, Tokyo (JP)
`
`( *) Notice:
`
`Subject to any disclaimer, the term ofthis
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 602 days.
`
`JP
`JP
`
`(21) Appl. No.:
`
`12/989,583
`
`(22) PCT Filed:
`
`Mar. 12, 2009
`
`(86) PCT No.:
`
`PCT I JP2009/054711
`
`§ 371 (c)(l),
`(2), ( 4) Date: Oct. 25, 2010
`
`(87) PCT Pub. No.: WO2009/142053
`
`PCT Pub. Date: Nov. 26, 2009
`
`(65)
`
`Prior Publication Data
`
`US 2011/0043050 Al
`
`Feb. 24, 2011
`
`(30)
`
`Foreign Application Priority Data
`
`May 22, 2008
`
`(JP) ................................. 2008-134266
`
`(51)
`
`(2006.01)
`
`Int. Cl.
`HOJF 27142
`(52) U.S. Cl.
`USPC .......................................................... 307/104
`( 58) Field of Classification Search
`USPC . ... ... ... .. ... ... ... ... ... .. ... ... ... ... ... .. ... ... ... ... 307 /104
`See application file for complete search history.
`
`5,329,274 A *
`5,412,253 A
`5,909,099 A
`6,210,771 Bl
`6,239,879 Bl *
`6,847,284 B2
`
`................. 340/5.61
`
`7/1994 Donig et al.
`5/1995 Hough
`6/1999 Watanabe et al.
`4/2001 Post et al.
`5/2001 Hay ............................. 358/1.15
`1/2005 Gamou et al.
`(Continued)
`
`FOREIGN PATENT DOCUMENTS
`
`3/1995
`7-066060 A
`9/1996
`8-241386 A
`(Continued)
`
`OTHER PUBLICATIONS
`
`Office Action dated May 9, 2012, issued in corresponding Chinese
`Patent Application No.200980118609.6, and an English Translation
`thereof. (4 pages).
`
`(Continued)
`
`Primary Examiner - Robert L. Deberadinis
`(74) Attorney, Agent, or Firm - Buchanan Ingersoll &
`Rooney PC
`
`ABSTRACT
`(57)
`Wireless power supply and information communication are
`achieved between electronic circuit substrates in the elec(cid:173)
`tronic equipment, and the size of the circuitry for achieving
`the above is reduced. There are provided a first electronic
`circuit substrate, a second electronic circuit substrate, a first
`coil connected to the first electronic circuit substrate, and a
`second coil connected to the second electronic circuit sub(cid:173)
`strate. Power is transmitted from the first coil to the second
`coil by electromagnetic induction so that the first electronic
`circuit substrate and the second electronic circuit substrate
`are electrically connected.
`
`15 Claims, 8 Drawing Sheets
`
`Ex.1017
`APPLE INC. / Page 1 of 28
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`

`

`US 8,643,219 B2
`Page 2
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`7,768,790 B2 *
`7,863,859 B2 *
`2006/0012497 Al
`
`................ 361/760
`8/2010 Kuroda et al.
`1/2011 Soar .............................. 320/108
`1/2006 Tokuhiro
`
`FOREIGN PATENT DOCUMENTS
`
`JP
`JP
`JP
`JP
`JP
`JP
`
`10-106867
`11-168268 A
`2000-276562 A
`2001-033136 A
`2002-280230 A
`WO 2004/088851
`
`4/1998
`6/1999
`10/2000
`2/2001
`9/2002
`10/2004
`
`JP
`JP
`WO
`
`2005-260122 A
`2006-340394 A
`2008/050917 Al
`
`9/2005
`12/2006
`5/2008
`
`OTHER PUBLICATIONS
`
`International Search Report (PCT/ISA/210) issued on Apr. 14, 2009,
`by Japanese Patent Office as the International Searching Authority
`for International Application No. PCT/JP2009/0547 l l.
`Office Action from Japanese Patent Office issued in corresponding
`Japanese Patent Application No. 2008-134266 dated on Nov. 16,
`2010, with an English translation.
`Office Action (Patent Examination Report No. 1) dated Jul. 30, 2012,
`issued by the Australian Patent Office in corresponding Australian
`Application No. 2009250645. (3 pages).
`
`* cited by examiner
`
`Ex.1017
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`

`

`U.S. Patent
`
`Feb.4,2014
`
`Sheet 1 of 8
`
`US 8,643,219 B2
`
`FIG. 1
`
`FIG. 2
`
`26
`
`22b
`
`Ex.1017
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`

`

`U.S. Patent
`
`Feb.4,2014
`
`Sheet 2 of 8
`
`US 8,643,219 B2
`
`FIG. 3
`
`Zl ~ ·
`
`FIG. 4
`
`25a
`
`3a
`
`30
`
`3 1
`
`25b
`
`3b
`
`25b
`
`Ex.1017
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`

`

`U.S. Patent
`
`Feb.4,2014
`
`Sheet 3 of 8
`
`US 8,643,219 B2
`
`FIG. 5
`
`FIG. 6
`
`3Ca 3Cb
`
`)
`: : ~: ~ : · ,
`
`2 5Ca·
`
`30
`
`3 1 a
`
`<?,--"'25Ca
`25Cb
`'' -e----2 5Pb
`__ _.,z5Pa
`
`25Pa-
`
`Fl G. 7
`
`3Pb 3Pa
`
`31b 31c
`
`3Ca 3Cb
`
`30
`
`31a
`
`3 1 d
`
`3Ph 3Pa
`
`32
`
`3 1 e
`
`3 1 b
`
`Ex.1017
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`

`

`U.S. Patent
`
`FIG. 8
`
`Feb.4,2014
`
`Sheet 4 of 8
`
`US 8,643,219 B2
`
`-~ 2 3
`
`FIG. 9
`
`25a-1~
`25a-2~
`25b·--l
`2 5 'b-2_,,...--
`
`3 a-2
`3 a -1
`
`30
`
`3 1 a
`
`(
`
`31h
`
`25b-1
`25b-·2
`
`Ex.1017
`APPLE INC. / Page 6 of 28
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`

`

`U.S. Patent
`
`Feb.4,2014
`
`Sheet 5 of 8
`
`US 8,643,219 B2
`
`33a 25f1-l
`;;25a····2
`
`}---- 3 a
`
`}----- 3 b
`
`2 5- b-1
`2 Sb-2
`
`FIG. 1 0
`
`aa~2
`3 a-.t
`
`:3 :3 a
`
`80
`
`3 1 a
`
`25a-l
`
`?.5b-2
`
`3 3 b
`
`3b-l
`3b-2
`
`FIG. 1 1
`
`3lb
`
`33b
`
`34a
`
`34b
`
`2
`
`FIG. 1 2
`
`34a
`
`3 1 a
`
`35a
`
`24a
`
`24h
`
`35b
`
`30
`
`3 1 b
`
`34b
`
`1
`
`Ex.1017
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`

`

`U.S. Patent
`
`Feb.4,2014
`
`Sheet 6 of 8
`
`US 8,643,219 B2
`
`FIG. 1 3
`
`34-a
`
`36
`35Ca
`24Ca
`
`3Ca
`
`24.Cb
`35Cb
`
`34b
`
`1
`
`FIG. 1 4
`
`8
`
`42a 42b 43
`
`.oi,wi. ................. _ - , • I
`
`I
`!
`l
`
`I
`
`45
`47a
`47h
`4 6 a
`4 4
`41c
`46b
`r-- - --~- -~ ~~--~- ---- -· ---1
`
`I
`I
`
`3Pa 3Pb
`
`46
`
`47
`
`Ex.1017
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`

`U.S. Patent
`
`Feb.4,2014
`
`Sheet 7 of 8
`
`US 8,643,219 B2
`
`FIG. 1 5
`
`FIG. l 6
`
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`

`U.S. Patent
`
`Feb.4,2014
`
`Sheet 8 of 8
`
`US 8,643,219 B2
`
`FIG. l 7
`
`10
`
`MAIN
`FUNCTIONAL
`PAR'r
`
`NONCONTACT
`F'EEDING/
`COMMUNICATION
`SECTION
`
`NONCONTACT
`FEEDING/
`COMMUNICATION
`SECTION
`
`AUXILIARY
`FUNCTIONAL
`PART
`
`PERIODIC
`PROCESSING
`
`PERIODIC
`PROCESSING
`
`Pl':n
`
`PERIODIC
`PROCESSING PPH-t:ID1
`
`.....,._,,.,N,MAs~__,-.,,·, .,._. - f l ,
`
`PERIODIC
`PROCESSING
`
`m1
`
`PERIODIC
`PROCESSING
`
`PERIODIC
`PROCESSING POI
`
`~
`
`_
`
`100
`
`Ex.1017
`APPLE INC. / Page 10 of 28
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`

`

`US 8,643,219 B2
`
`1
`ELECTRONIC EQUIPMENT AND METHOD
`FOR CONNECTING ELECTRONIC CIRCUIT
`SUBSTRATE
`
`TECHNICAL FIELD
`
`2
`Patent Document 3 Translation of PCT Application No.
`2004/088851, Abstract Disclosure of Invention
`
`PROBLEMS TO BE SOLVED BY THE
`INVENTION
`
`The present invention relates to electronic equipment such
`as consumer electrical appliances and a method for connect(cid:173)
`ing electronic circuit substrate included in electronic equip(cid:173)
`ment.
`
`BACKGROUND ART
`
`In the past, relating to a refrigerator, there has been pro(cid:173)
`posed a technology for solving the problem, "in a conven(cid:173)
`tional structure of a refrigerator having an information dis(cid:173)
`play apparatus on a door thereof, the power supply to the door
`and information communication are achieved in a wired man(cid:173)
`ner. However, the structure requires many components and
`complicated assembly in the manufacturing process and thus
`increases the manufacturing cost". According to the technol(cid:173)
`ogy, "the refrigerator body 1 is provided with a high fre(cid:173)
`quency generating circuit 9 and a power supply circuit 10
`comprising a first coil connected therewith, and the door 2 is 25
`provided with a power receiving circuit 11 comprising a
`second coil 5 coupled with the first coil 4 through electro(cid:173)
`magnetic induction wherein the second coil 5 is connected
`with an information display 3. The refrigerator body 1 has
`means for carrying information on the output from the fre- 30
`quency generating circuit 9 and the door 2 has means for
`detecting the information from a voltage induced in the sec(cid:173)
`ond coil 5. The door 2 also has means for rectifying the AC
`voltage induced in the second coil 5 to provide a DC power
`supply for the information I/0 section 3." (Patent Document 35
`1)
`Relating to a mobile communication terminal, there has
`been proposed a technology for providing a mobile commu(cid:173)
`nication terminal that can manage both improvement of com(cid:173)
`munication performance of a non-contact coil antenna for IC
`card interface and a non-contact coil antenna for reader/
`writer, and down-sizing and thinning of the entire terminal.
`According to the technology, "a mobile communication ter(cid:173)
`minal 1 such as a cellular phone comprises an upper case 3
`internally having an electronic equipment 10, wherein a
`sheet-shaped flexible substrate 17 having a non-contact coil
`antenna for IC card interface and a non-contact coil antenna
`for reader/writer is pasted over the inner surface of the upper
`case 3 ( or inner surface Sa of a cover 8) and a sheet-shaped
`soft magnetic radio wave absorbent 2 covering the non-con- 50
`tact coil antenna for IC card interface and non-contact coil
`antenna for reader/writer is pasted over the flexible substrate
`1 7 ." (Patent Document 2)
`Relating to a signal transmission method, there has been
`proposed a signal transmission method and a signal transmis(cid:173)
`sion device capable of easily transmitting a signal with a
`small number of signal lines. A data signal of time slot count
`N+a with bit count N is longitudinal-lateral converted into a
`data signal of time slot count N with bit count N+a, so as to
`create an empty time a and a control signal is inserted into the 60
`empty time+a, thereby converting the parallel signal contain(cid:173)
`ing the data signal and the control signal into a serial signal for
`transmission." (Patent Document 3)
`Patent Document 1 Japanese Unexamined Patent Applica(cid:173)
`tion Publication No. 2001-33136, Abstract
`Patent Document 2 Japanese Unexamined Patent Applica(cid:173)
`tion Publication No. 2006-340394, Abstract
`
`15
`
`In general, electronic circuit substrates connected in a
`wired manner have problems such as decreases in power
`supply and/or communication quality owing to aged deterio-
`lO ration or the like of the contact parts and the difficulty in
`reduction of the size and thickness because of the contact
`parts. Accordingly, electronic circuit substrates connected in
`a wireless manner has been demanded.
`Regarding the point, according to the technology disclosed
`in Patent Document 1, the power supply and information
`communication to a door of the refrigerator is implemented
`by radio waves.
`However, the coil structure according to Patent Document
`20 1 has 1 to 3 cm square coils having a thickness of 5 to 10 mm,
`and further reduction of the size and thickness of the coils is
`required for the application to smaller electronic equipment,
`which is a problem.
`The technology according to Patent Document 2 allows the
`reduction in size and thickness of the coil antennas by the
`integration of a non-contact coil antenna for IC card interface
`and a non-contact coil antenna for reader/writer.
`However, according to the technology disclosed in Patent
`Document 2, the two kinds of coil antennas are provided on
`the flexible substrate 17, and the electronic circuit substrates
`are not connected in a wireless marmer.
`The technology disclosed in Patent Document 3 easily
`allows signal transmission with a lower number of signal
`lines, and the size of the applied electronic equipment can be
`reduced.
`However, though the technology can be easily applied to
`parallel signals with the signal lines that synchronously
`change, it has been difficult to transmit parallel signals with
`the signal lines that asynchronously change or parallel signals
`40 with the signal lines that asynchronously change and a serial
`signal or an analog signal together.
`The present invention was made in order to solve the prob(cid:173)
`lems, and it is an object of the present invention to allow
`wireless power supply and information communication
`45 between electronic circuit substrates in electronic equipment
`and reduction of the size of the means of implementation.
`
`MEANS FOR SOLVING THE PROBLEMS
`
`Electronic equipment according to the present invention
`includes a first electronic circuit substrate, a second electronic
`circuit substrate, a first coil connected to the first electronic
`circuit substrate, and a second coil connected to the second
`electronic circuit substrate. In this case, power is transmitted
`55 from the first coil to the second coil by electromagnetic induc(cid:173)
`tion so that the first electronic circuit substrate and the second
`electronic circuit substrate are electrically connected.
`
`ADVANTAGES
`
`With the electronic equipment according to the present
`invention, power is transmitted from the first coil to the sec(cid:173)
`ond coil by electromagnetic induction. Thus, the first elec(cid:173)
`tronic circuit substrate and the second electronic circuit sub-
`65 strate can be connected in a wireless marmer.
`No contacts between the first electronic circuit substrate
`and the second electronic circuit substrate can improve the
`
`Ex.1017
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`

`

`US 8,643,219 B2
`
`3
`reliability, the yield strength against aged deterioration and
`environmental deterioration and ease in handling of the con(cid:173)
`nection part.
`The size and thickness of the connection part of the first
`electronic circuit substrate and the second electronic circuit 5
`substrate can be reduced, and the electronic equipment
`including them can thus have a reduced size.
`
`BRIEF DESCRIPTION OF DRAWINGS
`
`FIG. 1 is a configuration diagram of electronic equipment
`1 according to Embodiment 1.
`FIG. 2 is a configuration diagram of the coil 3.
`FIG. 3 illustrates another configuration example of the coil
`
`3.
`
`10
`
`15
`
`4
`7a primary-side modulating circuit
`7b primary-side demodulating circuit
`7c primary-side signal synthesizing/dividing means
`8 primary-side power supply circuit
`10 secondary-side noncontact feeding/communication
`section
`11 secondary-side communication circuit
`lla secondary-side modulating circuit
`llb secondary-side demodulating circuit
`llc secondary-side signal synthesizing/dividing means
`12 secondary-side power supply circuit
`13 main-functional-part output signal line
`13s main-functional-part serial signal output line
`13p main-functional-part parallel signal output line
`14 main-functional-part input signal line
`14s main-functional-part serial input signal line
`14p main-functional-part parallel input signal line
`15 main-functional-part power output
`16 auxiliary-functional-part input signal line
`16s auxiliary-functional-part serial input signal line
`l6p auxiliary-functional-part parallel input signal line
`17 auxiliary-functional-part output signal line
`17s auxiliary-functional-part serial output signal line
`17p auxiliary-functional-part parallel output signal line
`18 auxiliary-functional-part power supply input
`21 flexible substrate
`22 circuit pattern
`23 coil part
`24 connection part
`25 connection terminal part
`26 through-hole
`27 center tap
`30 coil gap
`31 magnetic substance
`32 magnetic shielding material
`33 coil connection terminal
`34 circuit part
`35 coil connection part
`36 coil fixing means
`40 power supply section
`41 primary-side smoothing means
`42 AC converting means
`43 primary-side resonant capacitor
`44 secondary-side resonant capacitor
`45 rectifying means
`46 secondary-side smoothing means
`47 voltage converting means
`48 secondary-side voltage output section
`50 primary-side communication resonant capacitor
`51 primary-side transmit-signal input
`52 primary-side carrier-wave generating means
`53 primary-side modulating means
`54 primary-side current control means
`55 primary-side demodulating means
`56 primary-side signal amplifying means
`57 primary-side buffer means
`58 primary-side receive-signal output
`59 primary-side power supply
`60 secondary-side communication resonant capacitor
`61 secondary-side transmit-signal input
`62 secondary-side carrier wave generating means
`63 secondary-side modulating means
`64 secondary-bide current control means
`65 secondary-side demodulating means
`66 secondary-side signal amplifying means
`67 secondary-side buffer means
`68 secondary-side receive-signal output
`
`20
`
`30
`
`FIG. 4 is a diagram illustrating an example of the arrange(cid:173)
`ment of the first electronic circuit substrate 2 and second
`electronic circuit substrate 4.
`FIG. 5 is a configuration diagram of electronic equipment
`1 according to Embodiment.
`FIG. 6 illustrates an example of the arrangement of the first
`communication coil 3Ca and the second communication coil
`3Cb and the first power coil 3Pa and the second power coil
`3Pb.
`FIG. 7 illustrates another arrangement example of the first 25
`communication coil 3Ca and the second communication coil
`3Cb and the first power coil 3Pa and the second power coil
`3Pb.
`FIG. 8 illustrates a configuration example for separating
`the coils 3 into communication coils and power coils.
`FIG. 9 illustrates a coil configuration of electronic equip(cid:173)
`ment 1 according to Embodiment 3.
`FIG. 10 illustrates a coil configuration of electronic equip(cid:173)
`ment 1 according to Embodiment 4.
`FIG. 11 is a configuration diagram of electronic equipment 35
`1 according to Embodiment 5.
`FIG. 12 is a configuration diagram of electronic equipment
`1 according to Embodiment 6.
`FIG. 13 is a configuration diagram of electronic equipment
`1 according to Embodiment 7.
`FIG. 14 illustrates a configuration example including a
`primary-side power supply circuit 8 and a secondary-side
`power supply circuit 12 according to Embodiment 8.
`FIG. 15 illustrates a configuration example of a primary(cid:173)
`side communication circuit 7 and a secondary-side commu- 45
`nication circuit 11 according to Embodiment 8.
`FIG. 16 illustrates a configuration example of the primary(cid:173)
`side signal synthesizing/dividing means 7c.
`FIG. 17 is a sequence diagram illustrating communication
`operations between the first electronic circuit substrate 2 and 50
`the second electronic circuit substrate 4.
`
`40
`
`REFERENCE NUMERALS
`
`1 electronic equipment
`2 first electronic circuit substrate
`3 coil
`3a first coil
`3b second coil
`3Ca first communication coil
`3Cb second communication coil
`3Pa first power coil
`3Pb second power coil
`4 second electronic circuit substrate
`5 main functional part
`6 primary-side noncontact feeding/communication section
`7 primary-side communication circuit
`
`55
`
`60
`
`65
`
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`US 8,643,219 B2
`
`5
`69 secondary-side power supply
`71 data synthesizing section
`72 data dividing section
`73 timer
`74 serial data receiving means
`75 data encoder section
`76 coil transmit-data buffer
`77 coil transmitting section
`78 coil receiving section
`79 coil receive-data buffer
`80 serial data transmitting means
`81 data decoder section.
`
`BEST MODES FOR CARRYING OUT THE
`INVENTION
`
`Embodiment 1
`
`FIG. 1 is a configuration diagram of electronic equipment
`1 according to Embodiment 1 of the present invention.
`In FIG. 1, the electronic equipment 1 includes a plurality of
`electronic circuit substrates and, in FIG. 1, includes a first
`electronic circuit substrate 2 and a second electronic circuit
`substrate 4.
`The first electronic circuit substrate 2 is an electronic cir(cid:173)
`cuit substrate for implementing a main function of the elec(cid:173)
`tronic equipment 1, and the second electronic circuit substrate
`4 is an electronic circuit substrate for implementing an aux(cid:173)
`iliary function of the electronic equipment 1.
`A first coil 3a and a second coil 3b are connected to the first 30
`electronic circuit substrate 2 and the second electronic circuit
`substrate 4, respectively. The first coil 3a and second coil 3b
`will be collectively called coil 3 hereinafter.
`The first electronic circuit substrate 2 and second elec(cid:173)
`tronic circuit substrate 4 connected in a wired marmer and are
`electrically connected by the electromagnetic induction, cou(cid:173)
`pling between the first coil 3a and the second coil 3b.
`Thus, the power supply from the first electronic circuit
`substrate 2 to the second electronic circuit substrate 4 and the
`signal transmission and reception between the first electronic
`circuit substrate 2 and the second electronic circuit substrate
`4 are performed through the first coil 3a and second coil 3b
`with the electromagnetic induction.
`The first electronic circuit substrate 2 is an electronic cir(cid:173)
`cuit substrate for implementing a main function of the elec- 45
`tronic equipment 1 and includes a main functional part 5 and
`a primary-side noncontact feeding/communication section 6.
`The main functional part 5 implements a main function of
`the electronic equipment 1.
`The primary-side noncontact feeding/communication sec(cid:173)
`tion 6 is connected to the main functional part 5 and first coil
`3a and has functions for power supply to the second elec(cid:173)
`tronic circuit substrate 4 and transmission and reception of
`communication signals to and from the second electronic
`circuit substrate 4.
`The main functional part 5 and the primary-side noncon(cid:173)
`tact feeding/communication section 6 are connected via a
`main-functional-part output signal line 13, a main-func(cid:173)
`tional-part input signal line 14 and a main-functional-part
`power output 15.
`The primary-side noncontact feeding/communication sec(cid:173)
`tion 6 includes a primary-side communication circuit 7 and a
`primary-side power supply circuit 8.
`The primary-side communication circuit 7 transmits and
`receives through the first coil 3a and second coil 3b the 65
`communication signals that are to be transmitted and received
`between the main functional part 5 and the auxiliary func-
`
`55
`
`10
`
`15
`
`6
`tional part 9. For that, the primary-side communication cir(cid:173)
`cuit 7 performs modulation/demodulation processing on the
`current in the first coil 3a in accordance with the signals to be
`transmitted via the main-functional-part output signal line 13
`5 and main-functional-part input signal line 14.
`The primary-side power supply circuit 8 performs power
`supply processing for power supply from the first electronic
`circuit substrate 2 to the second electronic circuit substrate 4
`and controls the current in the first coil 3a.
`Examples of the main function output signal line 13 may
`include a main-function serial output signal line 13s that
`outputs serial signals and a main-function parallel output
`signal line 13p that outputs parallel signals.
`Examples of the main-function input line 14 include a
`main-function serial input signal line 14s that inputs serial
`signals and a main-function parallel input signal line 14p that
`inputs parallel signals.
`The main-function output signal line 13 and main-function
`20 input signal line 14 may be analog signal lines instead of
`digital signal lines for serial signals and parallel signals or the
`like.
`The second electronic circuit substrate 4 is an electronic
`circuit substrate for implementing an auxiliary function of the
`25 electronic equipment 1 and includes an auxiliary functional
`part 9 and a secondary-side noncontact feeding/communica(cid:173)
`tion section 10.
`The auxiliary functional part 9 implements an auxiliary
`function of the electronic equipment 1.
`The secondary-side noncontact feeding/communication
`section 10 is connected to the auxiliary functional part 9 and
`second coil 3b and has a function of supplying power supplied
`from the first electronic circuit substrate 2 to the second
`electronic circuit substrate 4 as the power source and a func-
`35 tion for transmission and reception of communication signals
`to and from the first electronic circuit substrate 2.
`The auxiliary functional part 9 and the secondary-side
`noncontact feeding/communication section 10 are connected
`via an auxiliary-functional-part input signal line 16, an aux-
`40 iliary-functional-part output signal line 17 and an auxiliary(cid:173)
`functional-part power supply input 18.
`The secondary-side noncontact feeding/communication
`section 10 includes a secondary-side communication circuit
`11 and a secondary-side power supply circuit 12.
`The secondary-side communication circuit 11 transmits
`and receives through the first coil 3a and second coil 3b the
`communication signals to be transmitted and received
`between the main functional part 5 and the auxiliary func(cid:173)
`tional part 9. For that, the secondary-side communication
`50 circuit 11 performs modulation/demodulation processing on
`the current in the second coil 3b in accordance with the
`signals to be transmitted via the auxiliary-functional-part
`input signal line 16 and auxiliary-functional-part output sig(cid:173)
`nal line 17.
`The secondary-side power supply circuit 12 receives the
`power fed from the first electronic circuit substrate 2 and
`supplies the power to the second electronic circuit substrate 4
`as the power source.
`Here, the auxiliary-function input signal line 16 and aux-
`60 iliary-function output signal line 17 may be analog signal
`lines instead of digital signal lines for serial signals and par(cid:173)
`allel signals.
`FIG. 2 is a configuration diagram of the coil 3. Here, an
`example of the configuration of a flexible substrate coil by a
`multilayer substrate of two layers is shown. The coil has 20
`turns of 10 turns on the front face of the two layers and 10
`turns on the back face.
`
`Ex.1017
`APPLE INC. / Page 13 of 28
`
`

`

`US 8,643,219 B2
`
`7
`The coil 3 is a coil having a flexible base material 21 and a
`flexible substrate composed of a circuit pattern 22 by copper
`foil or the like fixed on the flexible base material 21. As a
`whole, the coil 3 includes a coil part 23, a connection part 24
`and a connection terminal part 25.
`The circuit pattern 22 includes a circuit pattern 22a on the
`front side and a circuit pattern 22b on the back side. The
`circuit pattern 22a and the circuit pattern 22b are connected
`via a through-hole 26.
`FIG. 3 illustrates another configuration example of the coil 10
`3. FIG. 3 illustrates here the example of the coil having ten
`turns of five on the front layer of the two layers and five turns
`on the back layer.
`In the flexible substrate coils illustrated in FIG. 2 and FIG. 15
`3, if the numbers of turns of the coils are equal, the induc(cid:173)
`tance, of the coil can be increased as the size of the region with
`no coil patterns at the center of the coil side increases.
`As the size of the region with no coil patterns at the center
`of the coil side increases, the decrease in performance can be
`minimized against the displacement of the center positions of
`the faced coils.
`As the area where the parts with no coil patterns at the
`centers of the coil sides of the faced coils overlap with each
`other increases, the connectivity between the coils increases.
`FIG. 4 is a diagram illustrating an example of the arrange(cid:173)
`ment of the first electronic circuit substrate 2 and second
`electronic circuit substrate 4.
`As illustrated in FIG. 4, the first coil 3a and the second coil
`3b are arranged so as to face each other. In this case, the coils
`are arranged with an interval of a gap 30 between coils.
`The gap 30 between coils varies in accordance with the
`attachment conditions of the first electronic circuit substrate 2
`and the second electronic circuit substrate 4.
`For example, when the first electronic circuit substrate 2
`and the second electronic circuit substrate 4 are covered by a
`resin case or the like, a gap equal to the thickness of the resin
`case occurs. When such as a resin case is not necessary, the
`first coil 3a and the second coil 3b are arranged almost in tight
`contact.
`In FIG. 4, the coil 3 is provided between magnetic sub(cid:173)
`stances 31. The magnetic substances 31 are attached to the
`opposite surfaces of the facing surfaces of the first coil 3a and
`second coil 3b.
`Providing the magnetic substances 31 can improve the 45
`connectivity between the first coil 3a and the second coil 3b
`and can minimize the adverse effect of the inhibition ofleaks
`of magnetic fluxes from the coil 3 to neighboring circuits.
`However, the magnetic substances 31 are not necessary if
`those measures are not necessary.
`The magnetic substances 31 may be plate-like ones con(cid:173)
`taining a material such as iron oxide, chrome oxide, cobalt
`and ferrite, sheet-like ones containing a mix of the material
`and a resin or the like.
`The sheet-like ones are desirable for effectively using the 55
`characteristics of the flexible-substrate coil.
`The size of each of the magnetic substances 31 may be
`larger than that of the coil wiring pattern part extending the
`outermost circumference of the flexible-substrate coil in
`order to stimulate the concentration of the magnetic fluxes
`generated from the coils by the magnetic substances 31 and
`reduce the leakage flux.
`Each of the magnetic substances 31 desirably has a thick(cid:173)
`ness leaving a margin for magnetic flux saturation of the
`magnetic fluxes generated from the coils. The thickness may
`be equal to or smaller than 0.5 min order to take advantage of
`the thin flexible substrate coil.
`
`8
`Up to this point, there has been described the configuration
`of the electronic equipment 1 according to Embodiment 1.
`Next, the operations by the electronic equipment 1 accord(cid:173)
`ing to Embodiment 1 will be described by following steps 1 to
`5 11 below.
`Step 1: On the first electronic circuit substrate 2, the pri(cid:173)
`mary-side power supply circuit 8 in the primary-side noncon(cid:173)
`tact feeding/communication section 6 receives power supply
`from the connected main functional part 5 and controls the
`current to feed to the first coil 3a so as to supply power to the
`second electronic circuit substrate 4.
`Step 2: The current fed to the first coil 3a causes the current
`owing to the electromagnetic induction in the second coil 3b.
`Step 3: In the secondary-side power supply circuit 2 in the
`secondary-side noncontact feeding/communication section
`10 on the second electronic circuit substrate 4, the current
`generated in the second coil 3b is rectified, is converted to DC
`power and is converted to a predetermined voltage which is
`then supplied to the second electronic circuit substrate 4 as the
`20 power source for the second electronic circuit substrate 4.
`Thus, the auxiliary functional part 9 and secondary-side
`noncontact feeding/communication section 10 on the second
`electronic circuit substrate 4 operate.
`Step 4: In order for the main functional part 5 of the first
`25 electronic circuit substrate 2 to transmit information to the
`auxiliary functional part 9 on the second electronic circuit
`substrate 4, the primary-side communication circuit 7 in the
`primary-side noncontact feeding/communication section 6
`modulates the transmit information received from the main
`30 functional part 5 by handling it as a communication signal and
`thus controls the current to be fed to the first coil 3a.
`Step 5: The current fed to the first coil 3a causes current
`owing to the electromagnetic induction in the second coil 3b.
`Step 6: Since the first coil 3a has the current for power
`35 supply here, the current of the communication signal is super(cid:173)
`posed on the current for power supply.
`For the superposition, means using a frequency that is
`different from the power supply current or means for chang(cid:173)
`ing the amplitude of the current for power supply can be used.
`Step 7: In the secondary-side communication circuit 11 in
`the secondary-side noncontact feeding/communication sec(cid:173)
`tion 10 of the second electronic circuit substrate 4, a commu(cid:173)
`nication-signal component is extracted from the current flow(cid:173)
`ing in the second coil 3b to be demodulated and is passed as
`the receive information from the main functional part 5 on the
`first electronic circuit substrate 2 to the auxiliary functional
`part 9.
`Step 8: Similarly, in order for the auxiliary functional part
`9 on the second electronic circuit substrate 4 to transmit
`50 information to the main functional part 5 of the first electronic
`circuit substrate 2, the secondary-side communication circuit
`11 of the secondary-side noncontact feeding/communication
`section 10 modulates transmission information received from
`the auxiliary functional part 9 by handling it as a communi(cid:173)
`cation signal and thus controls the current to be fed to the
`second coil 3b.
`Step 9: The current fed to the first coil 3b causes a current
`awing to the electromagnetic induction in the second coil 3a.
`Step 10: Since the first coil 3b has the current for power
`60 reception here, the current of the communication signa