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`c19) United States
`
`
`c12) Patent Application Publication
`c10) Pub. No.: US 2009/0021212 Al
`
`(43) Pub. Date: Jan. 22, 2009
`HASEGAWA et al.
`
`US 20090021212Al
`
`(54)COIL UNIT AND ELECTRONIC
`
`INSTRUMENT
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`(30)
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`Foreign Application P riority Data
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`
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`Jul. 20, 2007 (JP) ................................. 2007-189812
`
`(75)Inventors:Minoru HASEGAWA, Suwa-shi
`
`
`(JP); Hirofumi OKADA, Suwa-shi
`(51)Int. Cl.
`
`(JP); Yoichiro KONDO, Chino-shi
`H02J 7100 (2006.01)
`(JP)
`
`(52)U.S. Cl. ........................................................ 320/108
`
`P ublication Classification
`
`Correspondence Address:
`
`
`OLIFF & BERRIDGE, P LC
`P.O. BOX 320850
`
`
`ALEXANDRIA, VA 22320-4850 (US)
`
`(73) Assignee:SEIKO EPSON
`
`CORPORATION, Tokyo (JP)
`
`(21)Appl. No.:
`
`12/176,072
`
`(22)Filed:
`
`
`
`Jul. 18, 2008
`
`(57)
`
`ABSTRACT
`
`A coil unit includes a planar coil that has a transmission side
`
`
`
`
`
`
`and a non-transmission side, a magnetic sheet provided over
`
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`the non-transmission side of the planar coil, and a heat sink/
`
`
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`magnetic shield plate stacked on a side of the magnetic sheet
`
`
`opposite to a side that faces the planar coil, the heat sink/
`
`
`
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`magnetic shield plate dissipating heat generated by the planar
`
`
`
`
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`coil and shielding magnetism by absorbing a magnetic flux
`
`
`
`that has not been absorbed by the magnetic sheet. T he heat
`
`
`
`
`sink/magnetic shield plate has a thickness larger than that of
`
`the magnetic sheet.
`
`101
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`103
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`Ex.1007
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`Jan. 22, 2009 Sheet 1 of 6 US 2009/0021212 Al
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`FIG.1
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`10
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`Jan. 22, 2009 Sheet 2 of 6
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`Patent Application Publication
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`US 2009/0021212 Al
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`FIG.2
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`33
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`101
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`103
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`Jan. 22, 2009 Sheet 3 of 6
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`Patent Application Publication
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`US 2009/0021212 Al
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`0
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`Jan. 22, 2009 Sheet 4 of 6
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`Patent Application Publication
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`FIG.4
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`115 114
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`101
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`Jan. 22, 2009 Sheet 5 of 6
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`Patent Application Publication
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`US 2009/0021212 Al
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`FIG.5
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`114 116A 1168 115
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`0
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`100
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`: ] .
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`0
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`Jan. 22, 2009 Sheet 6 of 6
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`Patent Application Publication
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`US 2009/0021212 Al
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`FIG.6
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`Ex.1007
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`US 2009/0021212 Al
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`Jan. 22, 2009
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`1
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`COIL UNIT AND ELECTRONIC
`
`INSTRUMENT
`
`
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`
`
`[0017] FIG. 2 is an exploded oblique view showing a coil
`
`
`unit.
`
`the front side, and
`
`
`
`
`[0001] Japanese Patent Application No. 2007-189812 filed
`
`
`
`on Jul. 20, 2007, is hereby incorporated by reference in its
`
`the back side.
`entirety.
`
`the front side.
`
`
`the back side.
`[0002] The present invention relates to a coil unit utilized
`
`
`
`
`[0022] FIG. 6 is a view showing a modification in which a
`
`
`
`
`
`for non-contact power transmission using a coil, an electronic
`
`
`
`temperature detection element is provided on the front side of
`
`instrument, and the like.
`a substrate.
`
`
`
`[0003] Non-contact power transmission that utilizes elec­
`
`
`
`
`tromagnetic induction to enable power transmission without
`DETAILED DESCRIPTION OF THE
`
`
`
`metal-to-metal contact has been known. As application
`EMBODIMENT
`
`
`
`
`examples of non-contact power transmission, charging a por­
`
`
`
`
`
`table telephone, charging a household appliance ( e.g., tele­
`[0023] Several aspects of the invention may provide a coil
`
`
`
`
`phone handset), and the like have been proposed.
`
`
`
`unit that exhibits excellent heat dissipation capability and can
`
`
`
`[0004] Non-contact power transmission has a problem in
`
`
`
`
`be reduced in thickness, and an electronic instrument using
`
`
`
`
`that a transmission coil generates heat. Technologies for sup­
`
`the coil unit.
`
`
`
`pressing such heat generation have been proposed. JP-A-8-
`[0024] According to one embodiment of the invention,
`
`
`
`
`
`
`103028 discloses a design method that suppresses heat gen­
`
`
`
`there is provided a coil unit comprising:
`
`
`
`eration during non-contact charging. JP-A-8-148360
`
`
`
`[0025] a planar coil that has a transmission side and a non­
`
`
`
`
`discloses technology that suppresses heat generation by
`transmission side;
`
`
`
`adapting a suitable configuration of a coil and a magnetic
`
`
`[0026] a magnetic sheet provided over the non-transmis­
`
`
`
`
`material. JP-A-11-98705 discloses a non-contact charging
`
`
`sion side of the planar coil; and
`
`
`
`
`device provided with an air-cooling mechanism. JP-A-2003-
`[0027] a heat sink/magnetic shield plate stacked on a side of
`
`
`
`
`
`
`272938 discloses a structure in which a ceramic is disposed
`
`
`
`
`the magnetic sheet opposite to a side that faces the planar coil,
`
`
`
`heat. between a primary coil and a secondary coil to dissipate
`
`
`
`the heat sink/magnetic shield plate dissipating heat generated
`
`
`
`
`JP-A-2005-110357 discloses the structure of a housing with
`
`
`
`by the planar coil and shielding magnetism by absorbing a
`
`
`an improved heat dissipation capability.
`
`
`
`magnetic flux that has not been absorbed by the magnetic
`sheet,
`[0028] the heat sink/magnetic shield plate having a thick­
`
`
`
`
`
`
`ness larger than that of the magnetic sheet.
`
`
`
`
`[0005] According to one aspect of the invention, there is
`
`[0029] Heat generated by the planar coil is dissipated
`
`
`provided a coil unit comprising:
`
`
`
`through solid heat conduction of the magnetic sheet and the
`
`
`[0006] a planar coil that has a transmission side and a non­
`
`
`
`
`
`heat sink/magnetic shield plate stacked on the planar coil. The
`
`transmission side;
`
`
`
`heat sink/magnetic shield plate has a function of a heat sink
`
`
`
`[0007] a magnetic sheet provided over the non-transmis­
`
`
`
`
`and a function of a magnetic shield that absorbs a magnetic
`
`
`sion side of the planar coil; and
`
`
`
`
`flux which has not been absorbed by the magnetic sheet. As
`[0008] a heat sink/magnetic shield plate stacked on a side of
`
`
`
`
`
`
`the material for the heat sink/magnetic shield plate, a non­
`
`
`
`the magnetic sheet opposite to a side that faces the planar coil,
`
`
`
`
`magnetic material (i.e., a generic name for a diamagnetic
`
`
`
`the heat sink/magnetic shield plate dissipating heat generated
`
`
`
`material, a paramagnetic material, and an antiferromagnetic
`
`
`
`
`
`by the planar coil and shielding magnetism by absorbing a
`
`
`
`material) may be used. Aluminum or copper may be suitably
`
`
`magnetic flux that has not been absorbed by the magnetic
`
`
`
`used as the material for the heat sink/magnetic shield plate.
`sheet,
`
`
`[0030] The heat sink/magnetic shield plate is formed to
`[0009] the heat sink/magnetic shield plate having a thick­
`
`
`
`
`
`
`
`
`have a thickness larger than that of the magnetic sheet. A
`
`
`
`ness larger than that of the magnetic sheet.
`
`
`magnetic flux which has not been absorbed by the magnetic
`
`
`
`
`
`[0010] According to another aspect of the invention, there
`
`
`
`
`
`sheet is absorbed by the heat sink/magnetic shield plate. In
`
`
`is provided a coil unit comprising:
`
`
`
`this case, the heat sink/magnetic shield plate is inductively
`[0011] a coil;
`
`
`
`heated by a magnetic flux which has not been absorbed by the
`[0012] a magnetic material disposed near the coil; and
`
`
`
`
`
`
`
`
`magnetic sheet. However, since the heat sink/magnetic shield
`
`
`
`
`[0013] a member disposed so that the magnetic material is
`
`
`
`plate has a given thickness, the heat sink/magnetic shield
`
`
`
`placed between the coil and the member,
`
`
`plate has a relatively large heat capacity and a low heat gen­
`
`
`
`[0014] the member having a thickness larger than that of the
`
`
`
`eration temperature. Moreover, the heat sink/magnetic shield
`
`magnetic material.
`
`
`
`
`plate easily dissipates heat due to its dissipation characteris­
`
`
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`
`
`[0015] According to another aspect of the invention, there
`
`
`
`
`tics. Therefore, heat generated by the planar coil can be dis­
`
`
`is provided an electronic instrument comprising one of the
`
`
`
`
`sipated efficiently. Moreover, the coil unit can be formed to
`above coil units.
`
`
`
`have a thickness as thin as about 1.65 mm, for example.
`
`[0031] The coil unit may further include:
`
`
`
`[0032] a substrate, the heat sink/magnetic shield plate
`
`
`
`being secured on the substrate; and
`[0016] FIG. 1 is a view schematically showing a charger
`[0033] a temperature detection element provided on the
`
`
`
`
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`
`
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`substrate, the temperature detection element detecting the
`
`
`
`[0018] FIG. 3A is an oblique view showing a coil unit from
`
`
`
`
`
`[0019] FIG. 3B is an oblique view showing a coil unit from
`
`BACKGROUND OF THE INVENTION
`
`
`
`[0021] FIG. 5 is an oblique view showing a substrate from
`
`
`
`[0020] FIG. 4 is an oblique view showing a substrate from
`
`SUMMARY
`
`BRIEF DESCRIPTION OF THE SEVERAL
`
`VIEWS OF THE DRAWING
`
`
`
`
`
`and a charging target.
`
`Ex.1007
`APPLE INC. / Page 8 of 12
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`US 2009/0021212 Al
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`Jan. 22, 2009
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`2
`
`[0035] In the coil unit,
`
`
`
`sheet with the protective sheet. The covering member may be
`
`
`
`
`
`
`temperature of the planar coil due to heat generation that is
`
`
`formed using an insulating sheet or a sealing member (e.g.,
`
`
`
`
`
`transferred through solid heat conduction of the magnetic
`silicone).
`
`
`sheet and the heat sink/magnetic shield plate.
`[0044] In the coil unit, the covering member may be a
`
`
`
`
`
`[0034] This enables detection of an abnormality when the
`
`
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`
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`protective sheet having a hole that receives the planar coil, the
`
`
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`temperature of the heat sink/magnetic shield plate increases
`
`
`
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`protective sheet covering edges of the magnetic sheet and the
`
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`
`
`to a large extent due to an increase in temperature of the coil
`
`
`
`heat sink/magnetic shield plate and securing the magnetic
`
`
`
`caused by insertion of a foreign object, for example.
`
`
`sheet and the heat sink/magnetic shield plate on a front side of
`
`
`
`the substrate. According to this configuration, the covering
`[0036] heat transfer conductive patterns may be formed on
`
`
`
`
`
`member can also be used as a member for securing the mag­
`
`
`a front side and a back side of the substrate, the front side
`
`
`netic sheet and the heat sink/magnetic shield plate.
`
`
`
`
`facing the heat sink/magnetic shield plate; and
`
`
`
`[0045] In one embodiment of the invention, a plurality of
`
`
`
`
`the magnetic sheets may be provided. When magnetic satu­
`
`
`[0037] the temperature detection element may be provided
`
`
`ration occurs using only one magnetic sheet when a large
`
`on the back side of the substrate.
`
`
`
`
`current flows through the planar coil ( e.g., when power is
`
`
`
`[0038] According to this configuration, heat generated by
`
`
`
`
`turned ON), a leakage flux can be reduced by providing a
`
`
`
`the planar coil is transferred to the temperature detection
`
`
`
`
`plurality of magnetic sheets. The heat sink/magnetic shield
`
`
`
`
`
`element through solid heat conduction of the magnetic sheet,
`
`
`
`plate has a thickness larger than the total thickness of the
`
`
`
`
`the heat sink/magnetic shield plate, the heat transfer conduc­
`
`
`plurality of magnetic sheets.
`
`
`tive pattern on the front side, the substrate, and the heat
`
`[0046] In the coil unit,
`
`
`
`
`transfer conductive pattern on the back side. Moreover, since
`
`[0047] the planar coil may have an inner end lead line and
`
`
`
`
`the temperature detection element is provided on the back
`
`an outer end lead line, the inner end lead line being provided
`
`
`
`
`
`side of the substrate, the temperature detection element does
`
`
`
`over the non-transmission side of the planar coil; and
`
`
`
`not interfere with the heat sink/magnetic shield plate.
`
`
`
`[0048] a spacer member may be disposed between the pla­
`
`
`
`
`[0039] In the coil unit, the heat transfer conductive patterns
`
`
`
`
`nar coil and the magnetic sheet, the spacer member having a
`
`
`formed on the front side and the back side of the substrate may
`
`
`
`
`thickness substantially equal to the thickness of the inner end
`
`
`
`be connected via a through-hole formed through the sub­
`lead line.
`
`
`
`strate. The substrate is an insulator and has low heat transfer
`[0049] This allows the transmission side of the planar coil
`
`
`
`
`
`
`
`properties. However, the heat transfer properties can be
`
`to be made flat so that the primary coil and the secondary coil
`
`
`improved by providing the through-hole.
`
`
`
`
`are easily disposed adjacently when performing non-contact
`
`
`
`[0040] In the coil unit, a depression maybe formed in a side
`
`
`power transmission. Although the non-transmission side of
`
`
`
`of the heat sink/magnetic shield plate that faces the substrate;
`
`
`the planar coil protrudes due to the inner end lead line, the
`
`
`
`
`and the temperature detection element may be provided on a
`
`
`non-transmission side of the planar coil can be made flat and
`
`
`
`front side of the substrate and disposed inside the depression
`
`
`
`
`caused to adhere to the magnetic sheet by utilizing the spacer
`
`
`
`formed in the heat sink/magnetic shield plate, the front side of
`
`
`
`member. The heat transfer properties can thus be maintained.
`
`
`
`the substrate facing the heat sink/magnetic shield plate.
`
`[0050] In the coil unit,
`
`
`even if the temperature According to this configu ration,
`[0051] the substrate may have a mounting surface provided
`
`
`
`
`
`
`detection element is provided on the front side of the sub­
`
`
`
`with a mounted component in an area that extends from an
`
`
`
`
`strate, the temperature detection element does not interfere
`
`
`
`
`area that faces the heat sink/magnetic shield plate, and the
`
`
`
`
`
`with the heat sink/magnetic shield plate. When the planar coil
`
`
`
`
`mounting surface may be provided on the back side of the
`
`
`
`
`
`
`has an air-core section at the center of the planar coil, a hole
`substrate.
`
`
`
`may be formed in the heat sink/magnetic shield plate as a
`[0052] According to this configuration, since only the pla­
`
`
`
`depression at a position corresponding to the air-core section.
`
`
`
`
`nar coil, the magnetic sheet, and the heat sink/magnetic shield
`
`
`
`According to one embodiment of the invention, since the heat
`
`
`
`
`plate protrude from the front side of the substrate, the primary
`
`
`
`sink/magnetic shield plate has a given thickness, the heat
`
`
`coil and the secondary coil are easily disposed adjacently
`
`
`
`
`sink/magnetic shield plate can have a thickness sufficient to
`
`
`when performing non-contact power transmission.
`
`
`
`receive the temperature detection element. When employing
`
`
`
`
`the above structure, a heat transfer conductive pattern may be
`
`
`
`
`[0053] According to another embodiment of the invention,
`formed on the front side of the substrate.
`
`
`there is provided a coil unit comprising:
`[0054] a coil;
`
`[0041] In the coil unit,
`near the coil; and [0055] a magnetic material disposed
`
`
`
`[0042] the temperature detection element may be an ele­
`
`
`
`
`
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`[0056] a member disposed so that the magnetic material is
`
`
`
`ment that breaks or suppresses power supplied to the planar
`
`
`
`placed between the coil and the member,
`
`
`coil based on the temperature of the planar coil due to heat
`
`
`generation. This makes it possible to stop or suppress power
`
`
`
`[0057] the member having a thickness larger than that of the
`
`
`
`
`supplied to the planar coil when an abnormality has occurred.
`
`magnetic material.
`
`
`
`
`
`Examples of the temperature detection element include a
`[0058] According to another embodiment of the invention,
`
`
`
`
`
`
`thermistor of which the resistance increases at a high tem­
`
`
`
`the magnetic sheet according to one embodiment of the
`
`
`
`
`perature to suppress or break current, and an element ( e.g.,
`
`
`
`invention may be the magnetic material, and the heat sink/
`
`
`fuse) that is melted at a high temperature to break current.
`
`
`
`magnetic shield plate may be the member disposed so that the
`
`
`
`
`[0043] The coil unit may further include a covering mem­
`
`
`magnetic material is placed between the coil and the member.
`
`
`
`ber that covers an edge of the magnetic sheet. The edge of the
`
`
`In this case the member is inductively heated by a magnetic
`
`
`
`
`
`magnetic sheet is fragile and is easily removed. However, the
`
`
`flux which has not been absorbed by the magnetic material.
`
`
`material of the edge of the magnetic sheet can be prevented
`
`
`
`However, since the member thicker than the magnetic mate­
`
`
`
`from being scattered by covering the edge of the magnetic
`
`
`rial has a given thickness, the member has a relatively large
`
`Ex.1007
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`US 2009/0021212 Al
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`Jan. 22, 2009
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`3
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`heat capacity and a low heat generation temperature. There­
`
`
`
`magnetic sheet 40. A soft magnetic ferrite material or a soft
`
`
`
`
`
`
`
`fore, the member can dissipate heat generated by the planar
`
`
`
`
`magnetic metal material may be used as the material for the
`coil without overheating.
`
`magnetic sheet 40.
`
`
`
`
`[0059] According to another embodiment of the invention,
`[0070] The heat sink/magnetic shield plate 50 is disposed
`
`
`
`
`
`
`
`there is provided an electronic instrument comprising one of
`
`
`
`
`
`on the side of the magnetic sheet 40 opposite to the side that
`
`the above coil units.
`
`
`
`faces the planar coil 30. The thickness of the heat sink/mag­
`
`
`
`[0060] Preferred embodiments of the invention are
`
`
`
`
`netic shield plate 50 is larger than that of the magnetic sheet
`
`
`
`
`described in detail below. Note that the following embodi­
`
`
`
`40.The heat sink/magnetic shield plate 50 has a function of a
`ments do not in any way limit the scope of the invention
`
`
`
`
`heat sink and a function of a magnetic shield that absorbs a
`
`
`
`
`defined by the claims laid out herein. Note that all elements of
`
`
`magnetic flux which has not been absorbed by the magnetic
`
`
`
`
`the following embodiments should not necessarily be taken as
`
`
`
`sheet 40. As the material for the heat sink/magnetic shield
`
`
`essential requirements for the invention.
`
`
`
`
`plate 50, a non-magnetic material (i.e., a generic name for a
`
`
`
`
`diamagnetic material, a paramagnetic material, and an anti­
`
`[0061] 1. Charging System
`
`
`
`ferromagnetic material) may be used. Aluminum or copper
`
`
`
`[0062] FIG.1 is a view schematically showing a charger 10
`
`
`
`may be suitably used as the material for the heat sink/mag­
`
`
`instru­and a charging target 20. A secondary -side electronic
`
`
`netic shield plate 50.
`
`
`
`
`ment ( e.g., portable telephone 20) is charged using a primary ­
`
`
`
`
`side electronic instrument (e.g., charger 10) by non-contact
`[0071] Heat generated by the planar coil 30 when a current
`
`
`
`
`
`
`
`power transmission utilizing electromagnetic induction that
`
`
`is caused to flow through the planar coil 30 is dissipated
`
`
`
`occurs between a coil of a coil unit 12 of the charger 10 and a
`
`
`
`
`utilizing solid heat conduction of the magnetic sheet 40 and
`
`
`coil of a coil unit 22 of the portable telephone 20.
`
`
`
`
`the heat sink/magnetic shield plate 50 stacked on the planar
`
`
`coil 30. A magnetic flux which has not been absorbed by the
`
`[0063] Opposite sides of the coil units 12 and 22 when
`
`
`
`magnetic sheet 40 is absorbed by the heat sink/magnetic
`
`
`
`performing non-contact power transmission as shown in FIG.
`
`
`shield plate 50. In this case, the heat sink/magnetic shield
`
`
`
`
`1 are referred to as transmission sides. In FIG. 1, the upper
`
`
`
`plate 50 is inductively heated by a magnetic flux which has
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`
`
`
`side of the coil unit 12 is the transmission side, and the lower
`
`
`
`not been absorbed by the magnetic sheet 40. However, since
`
`
`side of the coil unit 22 is the transmission side. The side
`
`
`the heat sink/magnetic shield plate 50 has a given thickness,
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`
`
`
`opposite to the transmission side is referred to as a non­
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`
`
`the heat sink/magnetic shield plate 50 has a relatively large
`
`transmission side.
`
`
`
`heat capacity and a low heat generation temperature. More­
`
`[0064] 2. Structure of Coil Unit
`
`
`
`over, the heat sink/magnetic shield plate 50 easily dissipates
`
`[0065] The configurations of the coil units 12 and 22 are
`
`
`
`
`heat due to its dissipation characteristics. Therefore, heat
`
`
`
`
`described below with reference to FIGS. 2, 3A, and 3B taking
`
`
`
`
`
`generated by the planar coil 30 can be dissipated efficiently. In
`
`
`the coil unit 12 as an example. Note that the structure shown
`
`
`
`this embodiment, the total thickness of the planar coil 30, the
`
`
`in FIG. 2 may also be applied to the coil unit 22.
`
`
`
`magnetic sheet 40, and the heat sink/magnetic shield plate 50
`
`
`
`[0066] FIG. 2 is an exploded oblique view showing the coil
`
`can be reduced to about 1.65 mm, for example.
`
`
`unit 12, FIG. 3A is an oblique view showing the coil unit 12
`[0072] In this embodiment, a spacer member 60 having a
`
`
`
`
`
`
`from the front side, and FIG. 3B is an oblique view showing
`
`
`
`
`
`thickness substantially equal to the thickness of the inner end
`
`the coil unit 12 from the back side.
`
`
`
`lead line 34 is provided between the planar coil 30 and the
`
`
`[0067] In FIG. 2, the coil unit 12 is basically configured to
`
`
`magnetic sheet 40. The spacer member 60 is formed in the
`
`
`
`
`
`include a planar coil (coil) 30 that has a transmission side 31
`
`
`
`shape of a circle having almost the same diameter as that of
`
`
`and a non-transmission side 32, a magnetic sheet 40 provided
`
`
`the planar coil 30, and has a slit 62 so as to avoid at least the
`
`
`over the non-transmission side 32 of the planar coil 30, and a
`
`inner end lead line 34. The spacer member 60 is a double­
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`
`
`
`heat sink/magnetic shield plate 50 stacked on the side of the
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`
`
`
`sided adhesive sheet, for example. The spacer member 60
`
`
`
`magnetic sheet opposite to the side that faces the planar coil
`
`
`
`bonds the planar coil 30 to the magnetic sheet 40.
`30.
`
`
`[0073] In this embodiment, although the non-transmission
`
`
`
`[0068] The planar coil 30 is not particularly limited insofar
`
`
`
`
`side 3 2 of the planar coil 3 0 protrudes due to the inner end lead
`
`
`
`
`
`
`as the planar coil 30 is a flat (planar) coil. For example, an
`
`
`line 34, the non-transmission side 32 of the planar coil 30 can
`
`
`
`air-core coil formed by winding a single-core or multi-core
`
`
`
`
`be made flat and caused to adhere to the magnetic sheet 40 by
`
`
`
`coated coil wire in a plane may be used as the planar coil 30.
`
`
`
`utilizing the spacer member 60. The heat transfer properties
`
`
`
`
`In this embodiment, the planar coil 30 has an air-core section
`
`can thus be maintained.
`
`
`
`
`
`33 at the center of the planar coil 30. The planar coil 30
`
`
`
`includes an inner end lead line 34 connected to the inner end
`[0074] In this embodiment, the coil unit 12 includes a sub­
`
`
`
`
`
`
`of the spiral, and an outer end lead line 35 connected to the
`
`
`
`strate 100 on which the heat sink/magnetic shield plate 50 is
`
`
`outer end of the spiral. In this embodiment, the inner end lead
`
`
`
`
`secured. In this case, the heat sink/magnetic shield plate 50
`
`
`
`
`line 34 is provided toward the outside in the radial direction
`
`
`
`
`dissipates heat to the substrate 100. The substrate 100 has coil
`
`
`
`
`through the non-transmission side 32 of the planar coil 30.
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`
`
`connection pads 103 connected to the inner end lead line 34
`
`
`
`
`This allows the transmission side 31 of the planar coil 30 to be
`
`
`
`and the outer end lead line 35 of the planar coil 30.
`
`
`made flat so that the primary coil and the secondary coil are
`
`
`[0075] The coil unit 12 includes a protective sheet 70 that
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`
`
`
`easily disposed adjacently when performing non-contact
`
`
`covers the edge of the magnetic sheet 40 and the heat sink/
`power transmission.
`
`
`
`
`magnetic shield plate 50 and secures (bonds) the magnetic
`
`
`
`[0069] The magnetic sheet (magnetic material) 40 disposed
`
`
`sheet 40 and the heat sink/magnetic shield plate 50 to a
`
`
`
`over the non-transmission side 32 of the planar coil 30 is
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`
`
`
`surface 101 of the substrate 100. In this case, the inner end
`
`
`
`formed to have a size sufficient to cover the planar coil 3 0. The
`
`
`
`
`lead line 34 and the outer end lead line 35 of the planar coil 30
`
`
`
`magnetic sheet 40 receives a magnetic flux from the planar
`
`
`
`
`are connected to the coil connection pads 103 of the substrate
`
`
`
`
`coil 30 to increase the inductance of the planar coil 30. A soft
`
`
`100 to pass over the protective sheet 70 (see FIG. 3A). The
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`
`
`magnetic material is preferably used as the material for the
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`
`
`protective sheet 70 has a hole 71 that receives the planar coil
`
`Ex.1007
`APPLE INC. / Page 10 of 12
`
`

`

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`
`US 2009/0021212 Al
`
`Jan. 22, 2009
`
`4
`
`
`
`tive patterns 110 and 111 on the front side 101 and the back
`30. The protective sheet 70 also functions as a covering mem­
`
`
`
`
`
`side 102 of the substrate 100 are connected via a plurality of
`
`
`ber that covers the edge of the magnetic sheet 40. The edge of
`
`through-holes 112.
`
`
`
`the magnetic sheet 40 is fragile and is easily removed. How­
`[0080] Thermistor wiring patterns 113A and 113B insu­
`
`
`
`
`
`ever, the material of the edge of the magnetic sheet 40 can be
`
`
`
`
`lated from the heat sink/magnetic shield plate 50 and the heat
`
`
`
`prevented from being scattered by covering the edge of the
`
`
`transfer conductive pattern 110 are formed on the front side
`
`
`magnetic sheet 40 with the protective sheet 70 (i.e., covering
`
`101 of the substrate 100 shown in FIG. 4. The thermistor
`
`
`member). The covering member may be formed of a sealing
`
`
`
`
`wiring patterns 113 are connected to thermistor connection
`
`
`
`
`member (e.g., silicone) instead of the protective sheet 70.
`
`
`patterns 116A and 116B formed on the back side 102 of the
`[0076] The coil unit 12 is produced as follows. The mag­
`
`
`
`substrate 100 shown in FIG. 5 via two through-holes 114 and
`
`
`
`netic sheet 40 and the heat sink/magnetic shield plate 50 are
`
`
`115.The thermistor connection patterns 116A and 116B are
`
`
`
`stacked on the substrate 100. In this case, the substrate 100 is
`
`
`
`
`insulated from the heat transfer conductive pattern 111.
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`
`
`positioned on a jig (not shown) by utilizing holes 104 formed
`
`
`
`[0081] According to this configuration, heat generated by
`
`
`at the four corners of the substrate 100. Positioning pins that
`
`
`
`the planar coil 30 is transferred to the temperature detection
`
`
`
`protrude from the jig are fitted into the holes 104 (e.g., four
`
`
`
`element 80 ( omitted in FIG. 5) through solid heat conduction
`
`
`
`holes) formed in the substrate 100, holes 51 ( e.g., four holes)
`
`
`
`of the magnetic sheet 40, the heat sink/magnetic shield plate
`
`formed in the heat sink/magnetic shield plate 50, and holes
`
`
`50, the heat transfer conductive pattern on the front side 101
`
`
`
`107 formed in the substrate 100 corresponding to the holes
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`
`
`of the substrate 100, the through-hole 112, and the heat trans­
`
`
`51.The heat sink/magnetic shield plate 50 is thus positioned
`
`
`fer conductive pattern 111 on the back side 102 of the sub­
`
`
`
`with respect to the substrate 100 placed on the jig. The mag­
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`
`
`strate 100. Moreover, since the temperature detection element
`
`
`netic sheet 40 is then placed on the heat sink/magnetic shield
`
`
`
`80 is provided on the back side 102 of the substrate 100, the
`
`
`plate 50, and the magnetic sheet 40 is covered with the pro­
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`
`
`
`temperature detection element 80 does not interfere with the
`
`
`
`tective sheet 70 so that the magnetic sheet 40 and the heat
`
`
`heat sink/magnetic shield plate 50. Note that the thermistor
`
`
`
`
`sink/magnetic shield plate 50 are secured on the substrate 100
`
`
`
`wiring patterns 113A and 113 B may be provided on the back
`
`using the protective sheet 70.
`
`side 102 of the substrate 100, and the heat transfer conductive
`
`pattern 110 may be formed all over the front side 111 of the
`
`
`
`[0077] The planar coil 30 is then secured (bonded) on the
`
`substrate 100.
`
`
`
`magnetic sheet 40 through the spacer member 60 inside the
`[0082] Note that the heat transfer conductive patterns 110
`
`
`
`
`
`
`hole 71 formed in the protective sheet 70. The inner end lead
`
`and 111 formed on the front side 101 and the back side 102 of
`
`
`
`line 34 and the outer end lead line 35 of the planar coil 30 are
`
`
`the substrate 100 may not be connected via the through-holes
`
`
`
`
`then connected to the coil connection terminals 103 of the
`
`
`
`112 formed through the substrate 100. For example, when the
`
`
`
`substrate 100 to obtain the coil unit 12.
`
`
`
`
`thickness of the substrate 100 is sufficiently small, heat may
`
`
`[0078] As shown in FIG. 3B, the coil unit 12 according to
`
`
`
`
`be transferred through an insulating material of the substrate
`
`
`
`
`
`this embodiment includes a temperature detection element 80
`100.
`
`
`
`
`that is provided on a back side 102 of the substrate 100 and
`[0083] In this embodiment, as shown in FIG. 3B, the sub­
`
`
`
`
`detects the temperature of the planar coil 30 due to heat
`
`
`
`
`strate 100 has a mounting surface provided with a mounted
`
`
`
`generation that is transferred through solid heat conduction of
`
`
`component 106 in an area that extends from the area that faces
`
`
`
`the magnetic sheet 40 and the heat sink/magnetic shield plate
`
`
`the heat sink/magnetic shield plate 50. The mounting surface
`
`
`
`50, for example. Even if a foreign object or the like has been
`
`
`
`
`is provided on the back side 102 opposite to the front side 101
`
`
`
`inserted between the primary coil and the secondary coil so
`
`
`
`that faces the heat sink/magnetic shield plate 50.
`
`
`that the temperature of the coil 30 has primary -side planar
`
`
`[0084] Therefore, since only the planar coil 30, the mag­
`
`
`
`increased abnormally, the abnormality can be detected by the
`
`
`netic sheet 40, and the heat sink/magnetic shield plate 50
`
`
`
`
`temperature detection element 80. Power transmission may
`
`
`
`protrude from the front side 101 of the substrate 100, the
`
`
`
`
`be stopped when the temperature detection element 80 has
`
`
`
`adja­primary coil and the secondary coil are easily disposed
`
`
`detected that the temperature of the planar coil 30 has
`
`
`cently when performing non-contact power transmission.
`
`
`
`
`
`increased abnormally. The temperature detection element 80
`
`
`
`
`is not particularly limited insofar as the temperature detection
`[0085] 3. Modification
`
`
`
`element 80 has a temperature detecting function. In this
`[0086] Although only some embodiments of the invention
`
`
`
`
`
`
`embodiment, the temperature detection element 80 is formed
`
`
`
`have been described in detail above, those skilled in the art
`
`
`using a thermistor of which the resistance increases at a high
`
`
`
`would readily appreciate that many modifications are pos­
`
`
`
`
`temperature to suppress or break current, for example. An
`
`
`
`sible in the embodiments without materially departing from
`
`
`
`element (e.g., fuse) that is melted at a high temperature to
`
`
`
`
`the novel teachings and advantages of the invention. Accord­
`
`
`break current may be used instead of a thermistor. This makes
`
`
`
`
`ingly, such modifications are intended to be included within
`
`
`
`
`it possible to break or suppress a current that flows through
`
`
`
`the scope of the invention. Any term cited with a different
`
`
`
`the planar coil 30 when the temperature of the heat sink/
`
`
`
`term having a broader meaning or the same meaning at least
`
`
`
`
`magnetic shield plate has abnormally increased due to an
`
`
`
`once in the specification and the drawings can be replaced by
`
`
`
`
`increase in temperature of the planar coil 30 caused by inser­
`
`
`
`the different term in any place in the specification and the
`
`
`tion of a foreign object or the like.
`drawings.
`
`
`
`[0079] FIG. 4 is a wiring pattern diagram showing the front
`[0087] The above embodiments have been described taking
`
`
`
`
`
`
`side 101 of the substrate 100, and FIG. 5 is a wiring pattern
`
`
`
`an example relating to non-contact power transmission. Note
`
`
`
`
`diagram showing the back side 102 of the substrate 100. As
`
`
`
`
`that the invention may be similarly applied to non-contact
`
`
`
`shown in FIGS. 4 and 5, heat transfer conductive patterns 110
`
`
`
`
`signal transmission utilizing an electromagnetic induction
`
`and 111 are formed on the front side 101 and the back side 102
`
`
`principle. As shown in FIG. 6, the temperature detection
`
`
`
`
`
`of the substrate 100 over almost the entire area that faces the
`
`
`
`element 80 may be provided on a front side 201 of a substrate
`
`
`heat sink/magnetic shield plate 50. The heat transfer conduc-
`
`
`200. In this case, a heat sink/magnetic shield plate 210 having
`
`Ex.1007
`APPLE INC. / Page 11 of 12
`
`

`

`
`
`US 2009/0021212 Al
`
`Jan. 22, 2009
`
`5
`
`the temperature detection element being provided on the
`
`_s
`
`
`
`
`
`a hole 211 (see FIG. 6) may be used instead of the heat
`
`
`
`
`
`
`
`back side of the substrate.
`
`
`sink/magnetic shield plate 50 shown in FIG. 2. Since the hole
`
`4.The coil unit as defined in claim 3,
`
`
`
`
`211 is formed corresponding to the air-core section 33 of the
`
`
`
`the heat transfer conductive patterns formed on the front
`
`
`
`planar coil 30, the heat sink effect does not deteriorate. Since
`
`
`side and the back side of the substrate being connected
`
`the hole 211 is formed in the heat sink/magn