( 12 ) United States Patent
`Lee et al .
`
`( 10 ) Patent No .: US 10,674,610 B1
`Jun . 2 , 2020
`( 45 ) Date of Patent :
`
`US010674610B1
`
`( 71 )
`
`( * ) Notice :
`
`( 54 ) MULTILAYER RIGID FLEXIBLE PRINTED
`CIRCUIT BOARD AND METHOD FOR
`MANUFACTURING THE SAME
`Applicant : SAMSUNG
`ELECTRO - MECHANICS CO . , LTD . ,
`Suwon - si ( KR )
`( 72 ) Inventors : Yang Je Lee , Suwon - si ( KR ) ; Dek Gin
`Yang , Suwon - si ( KR ) ; Dong Gi An ,
`Suwon - si ( KR ) ; Jae Ho Shin , Suwon - si
`( KR )
`( 73 ) Assignee : Samsung Electro - Mechanics Co. , Ltd. ,
`Suwon - si ( KR )
`Subject to any disclaimer , the term of this
`patent is extended or adjusted under 35
`U.S.C. 154 ( b ) by 0 days .
`( 21 ) Appl . No .: 16 / 794,602
`( 22 ) Filed :
`Feb. 19 , 2020
`Related U.S. Application Data
`( 63 ) Continuation of application No. 16 / 438,755 , filed on
`Jun . 12 , 2019 , now Pat . No. 10,602,616 , which is a
`( Continued )
`Foreign Application Priority Data
`( 30 )
`Oct. 28 , 2009 ( KR )
`10-2009-0102783
`( 51 )
`Int . Ci .
`H05K 1/02
`H05K 3/06
`
`( 52 ) U.S. Ci .
`CPC
`
`( 2006.01 )
`( 2006.01 )
`( Continued )
`H05K 3/06 ( 2013.01 ) ; H05K 1/028
`( 2013.01 ) ; H05K 1/0218 ( 2013.01 ) ;
`( Continued )
`
`( 58 ) Field of Classification Search
`???
`HO5K 17028 ; HO5K 1/0218 ; HO5K 1/09 ;
`HO5K 3/4691 ; HO5K 3/4644 ; HO5K
`3/386 ; HO5K 2201/0154 ; H05K
`2201/0707
`See application file for complete search history .
`References Cited
`U.S. PATENT DOCUMENTS
`
`( 56 )
`
`3,471,348 A
`4,099,038 A
`
`10/1969 Shaheen
`7/1978 Purdy
`( Continued )
`FOREIGN PATENT DOCUMENTS
`
`JP
`JP
`
`12/1996
`8-335758 A
`7/2004
`2004-207490 A
`( Continued )
`
`OTHER PUBLICATIONS
`Korean Office Action dated Jul . 1 , 2011 in counterpart Korean
`Patent Application No. 10-2009-0102783 .
`( Continued )
`Primary Examiner — Hoa C Nguyen
`( 74 ) Attorney , Agent , or Firm
`- NSIP Law
`( 57 )
`ABSTRACT
`The present invention provides a multilayer rigid flexible
`printed circuit board including : a flexible region including a
`flexible film having a circuit pattern formed on one or both
`surfaces thereof and a laser blocking layer formed on the
`circuit pattern ; and a rigid region formed adjacent to the
`flexible region and including a plurality of pattern layers on
`one or both surfaces of extended portions extended to both
`sides of the flexible film of the flexible region , and a method
`for manufacturing the same .
`10 Claims , 8 Drawing Sheets
`
`43
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`A
`
`A
`
`B
`
`40
`
`50
`
`> 30
`
`51 52 53 . 15 20
`
`> 10
`
`20
`
`-30
`40
`
`EN
`
`R
`
`R
`
`F
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 1
`
`

`

`US 10,674,610 B1
`Page 2
`
`Related U.S. Application Data
`continuation of application No. 15 / 398,803 , filed on
`Jan. 5 , 2017 , now Pat . No. 10,368,445 , which is a
`continuation of application No. 14 / 024,115 , filed on
`Sep. 11 , 2013 , now Pat . No. 9,743,529 , which is a
`continuation of application No. 12 / 923,994 , filed on
`Oct. 19 , 2010 , now Pat . No. 8,558,116 .
`Int . Ci .
`H05K 346
`H05K 1/09
`H05K 3/38
`HO5K 3/00
`HO5K 3/28
`( 52 ) U.S. Cl .
`CPC
`
`( 2006.01 )
`( 2006.01 )
`( 2006.01 )
`( 2006.01 )
`( 2006.01 )
`
`H05K 170278 ( 2013.01 ) ; H05K 1/09
`( 2013.01 ) ; H05K 3/386 ( 2013.01 ) ; H05K
`3/4644 ( 2013.01 ) ; H05K 3/4691 ( 2013.01 ) ;
`HO5K 3/0035 ( 2013.01 ) ; HO5K 3/281
`( 2013.01 ) ; HO5K 3/4652 ( 2013.01 ) ; HO5K
`2201/0154 ( 2013.01 ) ; H05K 2201/0187
`( 2013.01 ) ; HO5K 2201/0707 ( 2013.01 ) ; H05K
`2203/0554 ( 2013.01 ) ; H05K 2203/1152
`( 2013.01 ) ; YIOT 29/49128 ( 2015.01 ) ; YIOT
`29/49165 ( 2015.01 )
`
`( 51 )
`
`( 56 )
`
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`
`*
`
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`7,759,582 B2
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`
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`
`2006/0156542 Al
`2006/0169485 Al
`
`7/2006 Matsuda
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`HOSK 3/4691
`174/254
`
`HOSK 3/4617
`174/255
`
`HOSK 3/429
`439/77
`
`HO5K 3/28
`174/254
`
`HO5K 1/141
`174/254
`
`2006/0180344 A1
`2006/0193970 A1
`2006/0281343 A1
`2007/0012475 Al
`2007/0126123 Al
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`
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`
`2008/0047135 A1
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`
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`
`2009/0255111 Al
`2010/0051325 Al
`2010/0051326 A1 *
`
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`2016/0183363 A1
`
`10/2009 Takahashi et al .
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`
`FOREIGN PATENT DOCUMENTS
`2006-59962 A
`3/2006
`2006-173188 A
`6/2006
`2008-34433 A
`2/2008
`2/2009
`10-2009-0017705 A
`10-0907353 B1
`7/2009
`10-0942626 B1
`2/2010
`5/2008
`WO 2008/050399 Al
`
`JP
`JP
`JP
`KR
`KR
`KR
`WO
`
`OTHER PUBLICATIONS
`Japanese Office Action dated May 15 , 2012 in counterpart Japanese
`Patent Application No. 2010-236240 .
`United States Office Action dated Jul . 3 , 2012 in related U.S. Appl .
`No. 12 / 923,994 .
`United States Office Action dated Sep. 19 , 2012 in related U.S.
`Appl . No. 12 / 923,994 .
`United States Office Action dated Feb. 4 , 2013 in related U.S. Appl .
`No. 12 / 923,994 .
`Advisory Action dated Apr. 12 , 2013 in related U.S. Appl . No.
`12 / 923,994 .
`Notice of Allowance dated May 24 , 2013 in related U.S. Appl . No.
`12 / 923,994 .
`Japanese Office Action dated Aug. 13 , 2013 in counterpart Japanese
`Patent Application No. 2012-250926 .
`* cited by examiner
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 2
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 1 of 8
`
`US 10,674,610 B1
`
`[ FIG . 1 ]
`
`42
`41
`33
`32
`31
`23
`22
`21 .
`12
`11
`
`A
`
`[ FIG . 2 ]
`
`43
`42
`41
`33
`32
`31 .
`23
`22
`21
`12
`11
`
`A
`
`?.
`
`C
`
`D
`
`B
`
`50
`51 52 53
`
`2
`
`BE
`
`NE
`
`R
`
`B
`
`F
`
`R
`
`A
`
`50
`51 52 53
`
`D
`
`?
`
`R
`
`F
`
`R.
`
`30
`
`20
`
`10
`
`20
`
`30
`
`-40
`
`> 30
`
`> 20
`
`10
`
`20
`
`30
`
`40
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 3
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 2 of 8
`
`US 10,674,610 B1
`
`( FIG . 3 ]
`
`43
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`A
`
`[ FIG . 4A ]
`
`[ FIG . 4B ]
`
`[ FIG . 5 )
`
`A
`
`D
`
`?
`
`B
`
`50
`51 52 53
`
`R
`
`F
`
`R
`
`-40
`
`30
`
`20
`
`10
`
`20
`
`30
`
`-40
`
`-53
`-52 50
`-51
`
`-53
`51b
`-52
`-51a
`
`50
`
`53
`-52 % 50
`-51
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 4
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 3 of 8
`
`US 10,674,610 B1
`
`( FIG . 6A )
`
`[ FIG . 6B ]
`
`[ FIG . 7A ]
`
`[ FIG . 7B ]
`
`53
`52 450
`-51
`63
`62 % 60
`61
`
`50
`
`53
`51b
`52
`51a
`-63
`61b > 60
`62
`61a
`
`53
`52 % 50
`51 ,
`63
`62 60
`61
`
`50
`
`53
`51b
`52
`51a
`63
`61b 60
`62
`61a )
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 5
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 4 of 8
`
`US 10,674,610 B1
`
`[ FIG . 8A ]
`12
`11
`[ FIG . 8B ]
`12
`11
`[ FIG . 8C ]
`
`12
`11
`
`[ FIG . 8D ]
`
`22
`21
`12
`11
`
`[ FIG . 8E ]
`
`23
`22
`21 .
`12
`11
`
`50
`51 52 53
`
`50
`51 52 53
`
`A
`
`50
`51 52 53
`
`?
`
`10
`
`> 10
`
`10
`
`10
`
`20
`
`10
`-20
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 6
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 5 of 8
`
`US 10,674,610 B1
`
`?.
`
`50
`51 52 53
`
`?
`
`B
`
`50
`51 52 53
`
`C
`
`D
`
`[ FIG . 8F ]
`
`23
`22
`21
`12
`11
`
`[ FIG . 8G ]
`
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`A
`
`> 20
`
`10
`
`20
`
`30
`
`20
`
`10
`
`20
`
`30
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 7
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 6 of 8
`
`US 10,674,610 B1
`
`( FIG . 8H ]
`
`A
`
`C
`
`D
`
`B.
`50
`51 52 53
`
`?.
`
`B
`
`50
`51 52 53
`
`D
`
`?
`
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`A
`
`[ FIG . 81 ]
`
`43
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`A
`
`30
`
`20
`
`10
`20
`
`30
`
`40
`
`30
`
`20
`
`10
`
`20
`
`30
`
`40
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 8
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 7 of 8
`
`US 10,674,610 B1
`
`D
`
`?
`
`B
`
`50
`51 52 53
`
`[ FIG . 8J ]
`
`A
`
`43
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`?
`
`[ FIG . 9 ]
`
`B
`
`A
`
`?
`
`D
`
`43
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`EN
`
`50
`51 52 53
`
`HUNDE UNUI
`
`61 62 63
`60
`
`40
`
`30
`
`20
`
`10
`
`20
`
`30
`
`40
`
`> 40
`
`30
`
`20
`
`10
`
`20
`
`30
`
`-40
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 9
`
`

`

`U.S. Patent
`
`Jun . 2 , 2020
`
`Sheet 8 of 8
`
`US 10,674,610 B1
`
`[ FIG . 10 ]
`
`B
`
`A
`
`?
`
`C
`
`D
`
`43
`42
`41
`33
`32
`31
`23
`22
`21
`12
`11
`
`A
`
`Z. z
`
`50
`51 52 53 )
`
`61 62 63
`200
`60
`
`> 40
`
`30
`
`20
`
`10
`
`20
`
`30
`
`-40
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 10
`
`

`

`5
`
`same .
`
`US 10,674,610 B1
`
`1
`MULTILAYER RIGID FLEXIBLE PRINTED
`CIRCUIT BOARD AND METHOD FOR
`MANUFACTURING THE SAME
`
`2
`printed circuit board capable of manufacturing both a flex
`ible region and a rigid region by a rigid build - up manufac
`turing process after forming a laser stopper in the flexible
`region , and a method of manufacturing the same .
`In accordance with an aspect of the present invention to
`CROSS - REFERENCE TO RELATED
`achieve the object , there is provided a multilayer rigid
`APPLICATIONS
`flexible printed circuit board including : a flexible region
`including a flexible film having a circuit pattern formed on
`This application is a continuation of application Ser . No.
`one or both surfaces thereof and a laser blocking layer
`16 / 438,755 filed on Jun . 12 , 2019 which is a continuation of
`application Ser . No. 15 / 398,803 filed on Jan. 5 , 2017 , now 10 formed on the circuit pattern ; and a rigid region formed
`adjacent to the flexible region and including a plurality of
`U.S. Pat . No. 10,368,445 , which is a continuation of appli
`pattern layers on one or both surfaces of extended portions
`cation Ser . No. 14 / 024,115 filed on Sep. 11 , 2013 , now U.S.
`extended to both sides of the flexible film of the flexible
`Pat . No. 9,743,529 , which is a continuation of application
`region .
`Ser . No. 12 / 923,994 filed on Oct. 19 , 2010 , now U.S. Pat .
`No. 8,558,116 , which claims the benefit under 35 USC 15
`Further , the laser blocking layer of the multilayer rigid
`flexible printed circuit board in accordance with the present
`119 ( a ) of Korean Patent Application No. 10-2009-0102783
`invention may include an adhesive coated on the circuit
`filed on Oct. 28 , 2009 , in the Korean Intellectual Property
`pattern formed on the flexible film , a polyimide layer formed
`Office , the entire disclosures of which are incorporated
`on the adhesive to protect the circuit pattern , and a copper
`herein by reference for all purposes .
`20 foil layer formed on the polyimide layer .
`Further , the laser blocking layer of the multilayer rigid
`BACKGROUND OF THE INVENTION
`flexible printed circuit board in accordance with the present
`invention may include an adhesive coated on the circuit
`1. Field of the Invention
`pattern formed on the flexible film , a polyimide layer formed
`The present invention relates to a multilayer rigid flexible 25 on the adhesive to protect the circuit pattern , an adhesive
`disposed on the polyimide layer , and a copper foil layer
`printed circuit board and a method for manufacturing the
`formed on the adhesive .
`same , and more particularly , to a multilayer rigid flexible
`Further , the multilayer rigid flexible printed circuit board
`printed circuit board manufactured by a rigid build - up
`in accordance with the present invention may further include
`substrate manufacturing method after forming a laser stop
`per in a flexible region , and a method for manufacturing the 30 an electromagnetic shielding layer which is formed between
`the laser blocking layer and the flexible film having the
`circuit pattern formed thereon .
`Further , the electromagnetic shielding layer of the multi
`2. Description of the Related Art
`layer rigid flexible printed circuit board in accordance with
`A printed circuit board ( PCB ) is a circuit board which 35 the present invention may include an adhesive coated on the
`circuit pattern formed on the flexible film , a polyimide layer
`plays a role of electrically connecting or mechanically fixing
`predetermined electronic components and consists of an
`formed on the adhesive to protect the circuit pattern , and a
`insulating layer made of a phenol resin or an epoxy resin and
`copper foil layer formed on the polyimide layer .
`a copper foil layer attached to the insulating layer and having
`Further , the electromagnetic shielding layer of the multi
`40 layer rigid flexible printed circuit board in accordance with
`a predetermined wiring pattern formed thereon .
`At this time , the PCBs are classified into a single - sided
`the present invention may include an adhesive coated on the
`PCB in which wiring is formed only on one surface of an
`circuit pattern formed on the flexible film , a polyimide layer
`insulating layer , a double - sided PCB in which wirings are
`formed on the adhesive to protect the circuit pattern , an
`formed on both surfaces of an insulating layer , and a
`adhesive disposed on the polyimide layer , and a copper foil
`multilayer PCB in which wirings are formed in a plurality of 45 layer formed on the adhesive .
`Further , the rigid region of the multilayer rigid flexible
`layers , according to the number of stacked layers .
`Recently , a multilayer printed circuit board , particularly , a
`printed circuit board in accordance with the present inven
`tion may further include at least one inner circuit pattern
`rigid flexible printed circuit board ( RFPCB ) having flexibil
`ity has been at the center of a printed circuit board market
`which is formed between the plurality of pattern layers to be
`due to miniaturization , thickness reduction , and high density 50 electrically connected to the circuit pattern .
`of electronic products , and market interest in this has been
`Further , the rigid region of the multilayer rigid flexible
`printed circuit board in accordance with the present inven
`increased .
`The RFPCB includes a flexible region in which a circuit
`tion may further include an outer circuit pattern which is
`formed on the outermost upper surface of the plurality of
`pattern is formed on a polyester or polyimide ( PI ) flexible
`film having flexibility and a rigid region in which an 55 pattern layers to be electrically connected to the circuit
`insulating layer is stacked on the flexible film
`to increase
`pattern .
`Further , the laser blocking layer or the electromagnetic
`physical hardness .
`This RFPCB has been used in devices requiring a high
`shielding layer of the multilayer rigid flexible printed circuit
`density circuit design such as notebooks , digital cameras ,
`board in accordance with the present invention may be
`camcorders , and mobile communication terminals since it 60 extended to a region where at least one of a via hole and a
`enables three dimensional wiring and is easily assembled .
`through hole of the plurality of pattern layers is formed .
`In accordance with another aspect of the present invention
`to achieve the object , there is provided a method for manu
`SUMMARY OF THE INVENTION
`facturing a multilayer rigid flexible printed circuit board
`The present invention has been proposed in order to solve 65 including the steps of : providing a base substrate including
`a flexible film having a circuit pattern formed on one or both
`the above - described problems , and it is , therefore , an object
`of the present invention to provide a multilayer rigid flexible
`surfaces thereof ; forming a laser blocking layer to protect
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 11
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`

`

`US 10,674,610 B1
`
`3
`4
`film having the circuit pattern formed thereon to protect the
`the circuit pattern of a flexible region of the base substrate ;
`circuit pattern and shield electromagnetic waves ; forming a
`stacking a plurality of pattern layers on at least one surface
`laser blocking layer on the electromagnetic shielding layer
`of the base substrate having the laser blocking layer formed
`thereon ; forming copper foil layers on upper surfaces of the
`or on the flexible film on which the electromagnetic shield
`plurality of pattern layers while interposing insulators ther- 5 ing layer is not formed ; stacking a plurality of pattern layers
`ebetween and stacking an outer pattern layer having a via
`on one or both surfaces of the base substrate having the laser
`hole or a through hole formed therein ; performing laser
`blocking layer formed thereon ; forming copper foil layers on
`processing by forming windows in the via hole or the
`upper surfaces of the plurality of pattern layers while
`through hole of the outer pattern layer and the flexible
`interposing insulators therebetween and stacking an outer
`region ; and forming an outer circuit pattern by performing 10 pattern layer having a via hole or a through hole formed
`copper plating on the laser - processed outer pattern layer and
`therein ; performing laser processing by forming windows in
`etching portions of the copper plating layer .
`the via hole or the through hole of the outer pattern layer and
`Further , the step of providing the base substrate including
`a flexible region ; and forming an outer circuit pattern by
`the flexible film having the circuit pattern formed on the one
`or both surfaces thereof of the method for manufacturing the 15 performing copper plating on the laser - processed outer
`pattern layer and etching portions of the copper plating layer .
`multilayer rigid flexible printed circuit board in accordance
`Further , in the step of forming the laser blocking layer on
`with the present invention may include the steps of provid
`the electromagnetic shielding layer or on the flexible film on
`ing the flexible film having a copper foil layer stacked on
`one or both surfaces thereof and forming the circuit pattern
`which the electromagnetic shielding layer is not formed of
`20 the method for manufacturing the multilayer rigid flexible
`by etching the copper foil layer .
`Further , the step of forming the laser blocking layer to
`printed circuit board in accordance with the present inven
`protect the circuit pattern of the flexible region of the base
`tion , the laser blocking layer may be formed on one or both
`substrate of the method for manufacturing the multilayer
`surfaces of the base substrate .
`rigid flexible printed circuit board in accordance with the
`Further , in the step of forming the electromagnetic shield
`present invention may include the steps of coating an 25 ing layer on the one or both surfaces of the flexible film
`adhesive in the flexible region of the base substrate , forming
`having the circuit pattern formed thereon to protect the
`a polyimide layer on the adhesive , and forming a copper foil
`circuit pattern and shield the electromagnetic waves of the
`layer on the polyimide layer .
`method for manufacturing the multilayer rigid flexible
`Further , the step of forming the laser blocking layer to
`printed circuit board in accordance with the present inven
`protect the circuit pattern of the flexible region of the base 30 tion , the electromagnetic shielding layer may be formed on
`substrate of the method for manufacturing the multilayer
`one or both surfaces with respect to the base substrate .
`rigid flexible printed circuit board in accordance with the
`Further , the step of providing the base substrate including
`present invention may include the steps of coating an
`the flexible film having the circuit pattern formed on the one
`adhesive in the flexible region of the base substrate , forming
`a polyimide layer on the adhesive , disposing an adhesive on 35 or both surfaces thereof of the method for manufacturing the
`multilayer rigid flexible printed circuit board in accordance
`the polyimide layer , and forming a copper foil layer on the
`with the present invention may include the steps of provid
`adhesive .
`ing the flexible film having a copper foil layer stacked on
`Further , in the step of stacking the plurality of pattern
`one or both surfaces thereof and forming the circuit pattern
`layers on the at least one surface of the base substrate having
`the laser blocking layer formed thereon of the method for 40 by etching portions of the copper foil layer .
`manufacturing the multilayer rigid flexible printed circuit
`Further , the step of forming the laser blocking layer or the
`board in accordance with the present invention , the plurality
`electromagnetic shielding layer of the method for manufac
`of pattern layers may be formed by repeating the step of
`turing the multilayer rigid flexible printed circuit board in
`forming one pattern layer including the steps of forming a
`accordance with the present invention may include the steps
`copper foil layer while interposing at least one insulator and 45 of disposing an adhesive in the flexible region of the base
`forming a via hole or a through hole in the insulator having
`substrate , forming a polyimide layer on the adhesive layer ,
`the copper foil layer formed thereon and forming a circuit
`and forming a copper foil layer on the polyimide layer .
`pattern by forming a copper plating layer on an upper
`Further , the step of forming the laser blocking layer or the
`surface of the insulator having the via hole or the through
`electromagnetic shielding layer of the method for manufac
`hole formed therein and etching portions of the copper 50 turing the multilayer rigid flexible printed circuit board in
`plating layer .
`accordance with the present invention may include the steps
`Further , the step of performing the laser processing by
`of disposing an adhesive in the flexible region of the base
`forming the windows in the via hole or the through hole of
`substrate , forming a polyimide layer on the adhesive , dis
`the outer pattern layer and the flexible region of the method
`posing an adhesive on the polyimide layer , and forming a
`for manufacturing the multilayer rigid flexible printed circuit 55 copper foil layer on the adhesive .
`board may include the steps of forming copper foil openings
`Further , the step of performing the laser processing by
`in the via hole or the through hole of the outer pattern layer
`forming the windows in the via hole or the through hole of
`and the flexible region by window etching and removing the
`the outer pattern layer and the flexible region of the method
`insulator by irradiating laser through the copper foil open
`for manufacturing the multilayer rigid flexible printed circuit
`ings .
`60 board in accordance with the present invention may include
`In accordance with still another aspect of the present
`the steps of forming copper foil openings in the via hole or
`invention to achieve the object , there is provided a method
`the through hole of the outer pattern layer and the flexible
`for manufacturing a multilayer rigid flexible printed circuit
`region by window etching and removing the insulator by
`board including the steps of : providing a base substrate
`irradiating laser through the copper foil openings .
`including a flexible film having a circuit pattern formed on 65
`Further , the laser blocking layer or the electromagnetic
`one or both surfaces thereof ; forming an electromagnetic
`shielding layer of the method for manufacturing the multi
`shielding layer on the one or both surfaces of the flexible
`layer rigid flexible printed circuit board in accordance with
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 12
`
`

`

`US 10,674,610 B1
`
`15
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`5
`6
`Multilayer Rigid Flexible Printed Circuit Board
`the present invention may be extended to a region where at
`A multilayer rigid flexible printed circuit board in accor
`least one of a via hole and a through hole of the pattern layer
`dance with the present invention includes a flexible region F
`is formed .
`and a rigid region R. The flexible region F is a region which
`Further , a via hole formed in the electromagnetic shield
`ing layer of the method for manufacturing the multilayer 5 is made of a flexible material and where a bending portion
`rigid flexible printed circuit board in accordance with the
`is formed . The rigid region is a region which is made of a
`rigid material .
`present invention may be formed to an upper portion of the
`The flexible region F includes at least one flexible film
`copper foil layer of the electromagnetic shielding layer , and
`having a first circuit pattern formed on at least one surface
`a through hole formed in the laser blocking layer and the
`electromagnetic shielding layer may be formed through the 10 thereof , and a laser blocking layer may be formed on at least
`one surface of the first circuit pattern .
`electromagnetic shielding layer , the laser blocking layer , and
`Further , an electromagnetic shielding layer may be further
`the base substrate .
`formed on the laser blocking layer of the flexible region F to
`shield electromagnetic waves .
`The rigid region R is formed adjacent to the flexible
`region F and may include a plurality of pattern layers on at
`These and / or other aspects and advantages of the present
`least one surface of an extended portion of the at least one
`general inventive concept will become apparent and more
`flexible film .
`readily appreciated from the following description of the
`Hereafter , various embodiments of the multilayer rigid
`embodiments , taken in conjunction with the accompanying 20 flexible printed circuit board in accordance with the present
`drawings of which :
`invention will be specifically described .
`FIGS . 1 to 3 are views showing a cross section of a
`< Multilayer Rigid Flexible Printed Circuit Board >
`multilayer rigid flexible printed circuit board in accordance
`with a first embodiment of the present invention ;
`First Embodiment
`FIGS . 4a and 4b are views showing a cross section of a 25
`laser blocking layer in accordance with an embodiment of
`FIGS . 1 to 3 are views showing a cross section of a
`multilayer rigid flexible printed circuit board in accordance
`the present invention ;
`FIG . 5 is a view showing a cross section of a laser
`with a first embodiment of the present invention .
`blocking layer in accordance with another embodiment of
`As shown in FIGS . 1 to 3 , a multilayer rigid flexible
`30 printed circuit board in accordance with a first embodiment
`the present invention ;
`FIGS . 6a and 6b are views showing various embodiments
`of the present invention includes a flexible region F and a
`of a stacked structure of a laser blocking layer and an
`rigid region R , and a laser blocking layer 50 is formed in the
`electromagnetic shielding layer in accordance with an
`flexible region F.
`The laser blocking layer 50 is formed on a base substrate
`embodiment of the present invention ;
`FIGS . Ta and 7b are views showing various embodiments 35 10 in the flexible region F , and a plurality of pattern layers
`of a stacked structure of a laser blocking layer and an
`20 , 30 , and 40 are formed on the base substrate 10 in the
`electromagnetic shielding layer in accordance with another
`rigid region R.
`First , when describing a structure of the flexible region F ,
`embodiment of the present invention ;
`FIGS . 8a to 8j are views showing a method for manu
`the flexible region F has the structure in which the laser
`facturing a multilayer rigid flexible printed circuit board in
`40 blocking layer 50 is formed on the base substrate 10 .
`accordance with an embodiment of the present invention ;
`The base substrate 10 includes at least one flexible film 11
`FIG . 9 is a view showing a cross section of a multilayer
`having a first circuit pattern 12 formed on at least one
`rigid flexible printed circuit board in accordance with a
`surface thereof , and the laser blocking layer 50 is formed on
`at least one surface of the first circuit pattern 12 .
`second embodiment of the present invention ; and
`FIG . 10 is a view showing a cross section of a multilayer 45
`The laser blocking layer 50 includes an adhesive 51 , a
`rigid flexible printed circuit board in accordance with a third
`polyimide layer 52 , and a copper foil layer 53 , and the
`adhesive 51 is disposed on the first circuit pattern 12 .
`embodiment of the present invention .
`The polyimide layer 52 is formed to protect the first
`circuit pattern 12 , the polyimide layer 52 and the first circuit
`DETAILED DESCRIPTION OF THE
`50 pattern 12 are formed while interposing the adhesive 51
`PREFERRED EMBODIMENTS
`therebetween , and the copper foil layer 53 is formed on the
`As the invention allows for various changes and numer
`polyimide layer 52 .
`After copper plating 43 is performed on the copper foil
`ous embodiments , particular embodiments will be illustrated
`in the drawings and described in detail in the written
`layer 53 of the laser blocking layer 50 to form an outer layer
`description . However , this is not intended to limit the present 55 circuit pattern , the outer layer circuit pattern is formed by
`invention to particular modes of practice , and it is to be
`etching portions of the copper plating 43 in correspondence
`appreciated that all changes , equivalents , and substitutes that
`to the circuit pattern ( referring to FIGS . 2 and 3 ) .
`do not depart from the spirit and technical scope of the
`The laser blocking layer 50 may be formed in various
`present invention are encompassed in the present invention .
`embodiments and will be described in detail in FIGS . 4a , 46 ,
`A multilayer rigid flexible printed circuit board and a 60 and 5b .
`method for manufacturing the same in accordance with
`Further , the layer blocking layer 50 may be extended to
`certain embodiments of the present invention will be
`the rigid region R.
`described below in detail with reference to the accompany
`For example , each side surface of the copper foil layer 53
`ing drawings . Those components that are the same or are in
`of the laser blocking layer 50 may be formed smaller than
`correspondence are rendered the same reference numeral 65 that of the polyimide layer 52 formed on a lower surface of
`regardless of the figure number , and redundant explanations
`the copper coil layer 53 by more than 10 um or the laser
`blocking layer 50 may be extended to the rigid region R
`are omitted .
`
`Scramoge Technology Ltd.
`Ex. 2018 - Page 13
`
`

`

`US 10,674,610 B1
`
`10
`
`15
`
`7
`8
`laser blocking layers 50 and the flexible film 11 of the
`from a boundary surface between the flexible region F and
`double - sided printed circuit board ( referring to FIG . 9 ) .
`the rigid region R by 0.05 to 5 mm .
`Specifically , the flexible region F has a structure in which
`Next , the rigid region R is formed adjacent to the flexible
`the electromagnetic shielding layer 60 is formed on the base
`region F and includes a plurality of pattern layers 20 , 30 , and
`40 on at least one surface of an extended portion of the at 5 substrate 10 , and the base substrate 10 includes the at least
`one flexible film 11 having a first circuit pattern 12 formed
`least one flexible film 11 .
`Generally , one pattern layer is formed by sequentially
`on at least one surface thereof .
`The electromagnetic shielding layer 60 is formed o