(1)
`
`JP 2011-210937 A 2011.10.20
`
`(19) Japan Patent Office (JP)
`
`(12) Publication of Unexamined Patent Application
`(11) Japanese Patent Application Publication Number
`Unexamined Patent Application Publication 2011-210937
`(P2011-210937A)
`(43) Pub. Date October 20, 2011 (2011.10.20)
`Theme code (Reference)
`
`FI
`B
`H01F 23/00
`(2006.01)
`B
`H02J 17/00
`(2006.01)
`Request for examination Not requested No. of claims 10 OL (Total 13 Pages)
`
`(51) Int. Cl.
`H01F 38/14
`H02J 17/00
`
`(21) App.
`Number:
`(22) Filing Date:
`
`Pat. App. 2010-76958 (P2010-76958)
`
`(71) Applicant
`
`000006231
`
`March 30, 2010 (2010.3.30)
`
`(74) Rep.
`
`(72) Inventor
`
`(72) Inventor
`
`(72) Inventor
`
`Murata Manufacturing Co., Ltd.
`1-10-1 Higashikotari, Nagaokakyo,
`Kyoto Prefecture
`100117260
`Attorney Masaya FUKUNAGA
`Shinji GOMA
`1-10-1 Higashikotari, Nagaokakyo,
`Kyoto Prefecture
`In Murata Manufacturing Co., Ltd.
`Kazuya KATO
`1-10-1 Higashikotari, Nagaokakyo,
`Kyoto Prefecture
`In Murata Manufacturing Co., Ltd.
`Yutaka NONOGAKI
`1-10-1 Higashikotari, Nagaokakyo,
`Kyoto Prefecture
`In Murata Manufacturing Co., Ltd.
`(54) [Title of the Invention] Coil Module, and Electronic Device Equipped With the Coil Module
`
`(57) [Abstract]
`[Problem]
`The present invention provides a coil module that
`can be made thin and compact, and an electronic
`device equipped with the coil module.
`[Means for Solving the Problem]
`The coil module 1 according to the present
`invention comprises a flat, plate-shaped coil 2, a
`circuit board 4 that is electrically connected to the
`coil 2 and is equipped with a plurality of electronic
`components that control power transmitted by the
`coil 2, and a flat, plate-shaped resin structure 3
`containing a magnetic material. The coil 2 is built in,
`biased to one side of the resin structure 3, the circuit
`board 4 is arranged horizontally with respect to the
`coil 2, and at least a portion of the circuit board 4 is
`built into the resin structure 3.
`[Chosen Drawing] Fig. 1
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`Ex.1023 / IPR2022-00350 / Page 1 of 27
`APPLE INC. v. SCRAMOGE TECHNOLOGY LTD.
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`(2)
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`JP 2011-210937 A 2011.10.20
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`[Scope of Claims for Patent]
`[Claim 1]
`A coil module comprising:
`a flat plate-shaped coil;
`a circuit board electrically connected to the coil and equipped with a plurality of electronic components that
`control power transmitted by the coil; and
`a flat plate-shaped resin structure containing a magnetic material;
`wherein
`the coil is built in biased to one side of the resin structure; and
`the circuit board is arranged horizontally with respect to the coil, and at least a portion of the circuit board is built
`into the resin structure.
`[Claim 2]
`The coil module according to claim 1, wherein a portion of the coil is exposed to an exterior on the one side of
`the resin structure.
`[Claim 3]
`The coil module according to claim 1 or claim 2, wherein a portion of the circuit board is exposed to an exterior
`on one side of the resin structure.
`[Claim 4]
`The coil module according to any one of claims 1 to 3, wherein the resin structure is equipped with an opening
`in a region of the circuit board that is equipped with a plurality of the electronic components.
`[Claim 5]
`The coil module according to claim 4, wherein the resin structure comprises a seal material that covers the
`opening.
`[Claim 6]
`The coil module according to any one of claims 1 to 5, wherein the circuit board is equipped with a connector for
`connecting with an exterior.
`[Claim 7]
`The coil module according to any one of claims 1 to 6, wherein the plurality of the electronic components is
`electrically connected to a terminal formed on the circuit board and is mounted on the circuit board.
`[Claim 8]
`The coil module according to any one of claims 1 to 7, further comprising a sub-circuit board electrically
`connected to the terminal formed on the circuit board, wherein a plurality of the electronic components is
`electrically connected to the terminal formed on the sub-circuit board and is mounted to the circuit board via the
`sub-circuit board.
`[Claim 9]
`The coil module according to any one of claims 1 to 8, wherein the circuit board has a recess in a horizontal
`direction, and
`the coil and the circuit board are arranged so that the recess in the circuit board and a portion of the coil overlap
`with each other.
`[Claim 10]
`An electronic device comprising the coil module according to any one of claims 1 to 9.
`[Detailed Description of the Invention]
`[Technical Field]
`[0001]
`The present invention relates to coil modules and electronic devices equipped with the coil module, and
`particularly to a coil module for contactless power transmission, and electronic devices equipped with the coil
`module.
`[Background Art]
`[0002]
`
`
`
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`(3)
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`JP 2011-210937 A 2011.10.20
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`In recent years, electronic devices such as communication devices that transmit and charge power in a non-
`contact manner have been developed. In order to transmit power contactless in an electronic device, it is
`necessary to dispose a coil module for contactless power transmission in each of the electronic devices on the
`power transmitting side and the electronic device on the power receiving side. For example, Patent Document 1
`discloses a coil module that is equipped with a coil and a plurality of electronic components that control the power
`to be transmitted, on a circuit board. Also, Patent Document 2 discloses a coil module in which a circuit board
`that is equipped with a plurality of electronic components that control the power to be transmitted is overlapping
`the coil.
`[Prior Art Publications]
`[Patent Publications]
`[0003]
`Patent Document 1: Japanese unexamined patent application publication Hei 07-335443
`Patent Document 2: Japanese unexamined patent application publication No. 2005-260122
`[Summary of the Invention]
`[Problem to be Solved by the Invention]
`[0004]
`Also, in recent years, electronic devices have become smaller and lighter so it is necessary to reduce the size
`and weight of the coil modules disposed in the electronic devices as well. However, the coil module was limited
`in reducing the coil diameter because of the reduced ability to transmit power when the coil diameter was reduced.
`For this reason, it is important to reduce the thickness of the coil module while maintaining the ability to transmit
`power in order to reduce the size of the coil module.
`[0005]
`For example, in the coil module disclosed in Patent Document 1, a coil is mounted on a circuit board; it cannot
`be made thinner than the combined thickness of the coil and the circuit board. Also, in the coil module disclosed
`in Patent Document 2, a circuit board that is equipped with a plurality of electronic components is overlapping
`the coil; the coil and the circuit board that is equipped with the plurality of electronic components cannot be made
`thinner than the combined thickness.
`[0006]
`The present invention was attained in consideration of the circumstances described above. It is an object of the
`present invention to provide a coil module that can be made thin and compact while maintaining the ability to
`transmit power, and an electronic device equipped with the coil module.
`[Means for Solving the Problems]
`[0007]
`To attain the object described above, the coil module according to a first invention comprises a flat, plate-shaped
`coil, a circuit board that is electrically connected to the coil and is equipped with a plurality of electronic
`components that control power transmitted by the coil, and a flat, plate-shaped resin structure that contains a
`magnetic material; the coil is built in, biased to one side of the resin structure, the circuit board is arranged
`horizontally with respect to the coil, and at least a part of the circuit board is built into the resin structure.
`[0008]
`Also, in the coil module according to a second invention, a part of the coil is exposed to an exterior on the side
`of the resin structure, in the first invention.
`[0009]
`Also, in the coil module according to a third invention, the circuit board is partially exposed to an exterior on the
`side of the resin structure, in the first or second invention.
`[0010]
`Also, in the coil module according to a fourth invention, the resin structure is equipped with an opening in a region
`of the circuit board that is equipped with a plurality of the electronic components, in any one of the first to the
`third invention.
`[0011]
`Also, in the coil module according to a fifth invention, the resin structure comprises a seal material covering the
`opening, in the fourth invention.
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`JP 2011-210937 A 2011.10.20
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`[0012]
`Also, in the coil module according to a sixth invention, the circuit board is equipped with a connector for
`connection with an exterior, in any one of the first to the fifth inventions.
`[0013]
`Also, in the coil module according to a seventh invention, a plurality of the electronic components is electrically
`connected to a terminal formed on the circuit board and mounted on the circuit board, in any one of the first to
`the sixth inventions.
`[0014]
`Also, in the coil module according to an eighth invention further comprises a sub-circuit board that is electrically
`connected to the terminal formed on the circuit board, in any one of the first through the seventh invention, and
`a plurality of the electronic components is electrically connected to the terminal formed on the sub-circuit board
`and is mounted to the circuit board via the sub-circuit board.
`[0015]
`Also, in a coil module according to a ninth invention, the circuit board has a recess in a horizontal direction, and
`the coil and the circuit board are arranged so that the recess in the circuit board and a portion of the coil overlap,
`in any one of the first to the eighth inventions.
`[0016]
`Also, the electronic device according to a tenth invention comprises a coil module according to any one of the
`first to the ninth inventions.
`[0017]
`In the first invention, in a coil module comprising a flat, plate-shaped coil, a circuit board that is equipped with a
`plurality of electronic components, and a flat, plate-shaped resin structure that contains a magnetic material, the
`coil is built-in biased to one side of the resin structure, the circuit board is arranged horizontally with respect to
`the coil, and at least a portion of the circuit board is built into the resin structure, and for that reason the coil
`module can be made thinner and more compact while maintaining an ability to ensure a necessary diameter of
`the coil to transmit power without overlapping the coil and the circuit board.
`[0018]
`In the second invention, a portion of the coil is exposed to an exterior on one side where the coil is built in biased
`to the resin structure, so power is efficiently transmitted by transmitting power from the one side of the resin
`structure where the coil is exposed.
`[0019]
`In the third invention, a portion of the circuit board is exposed to the exterior on a side where the coil of the resin
`structure is built in biased, and for that reason one side of the coil and one side of the circuit board can be
`arranged on the same side to make the coil module thinner and more compact.
`[0020]
`In the fourth invention, the resin structure is disposed with an opening in a region of the circuit board that is
`equipped with a plurality of electronic components so it is possible to prevent a phenomenon where solder that
`connects the electronic components to the circuit board is re-melted by heat thereby creating a fine gap that
`causes a short circuit in the electronic components (a solder flash). Also, because the plurality of electronic
`components are surrounded by a wall formed by an opening in the resin structure that contains the magnetic
`material, stable operations are possible by reducing the effects of electromagnetic waves applied to the plurality
`of electronic components from the coil.
`[0021]
`In the fifth invention, the resin structure is equipped with a seal material that covers the opening, so stable
`operation of the electronic components is possible by reducing the effects of electromagnetic waves from the
`coil applied from the opening of the resin structure onto the plurality of electronic components.
`[0022]
`In the sixth invention, the circuit board is equipped with a connector for connecting with an exterior, so it is easy
`to attach a coil module to the electronic device using the connector.
`[0023]
`In the seventh invention, a plurality of electronic components is electrically connected to a terminal formed on
`the circuit board and mounted on the circuit board, so the height of the circuit board equipped with a plurality of
`electronic components can be suppressed, and the coil module can be made thinner and more compact.
`
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`JP 2011-210937 A 2011.10.20
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`[0024]
`The eighth invention further comprises a sub-circuit board that is electrically connected to a terminal formed on
`the circuit board, and because the plurality of electronic components is electrically connected to a terminal formed
`on a sub-circuit board and is mounted to the circuit board via the sub-circuit board, it is possible to change the
`constitution of the plurality of electronic components mounted to the circuit board by simply changing the sub-
`circuit board.
`[0025]
`In the ninth invention, the circuit board has a recess in the horizontal direction, and the coil and the circuit board
`are arranged so that the recess in the circuit board and a portion of the coil overlap, so a length of the coil and
`the circuit board arranged in the horizontal direction can be shortened, and the coil module can be made more
`compact.
`[0026]
`In the tenth invention, the coil module according to any one of the first to the ninth invention is equipped, so the
`coil module can be made thinner and more compact, the electronic device can be made thinner and more
`compact.
`[Effect of the Invention]
`[0027]
`The coil module according to the present invention comprises a flat plate-shaped coil, a circuit board that is
`equipped with a plurality of electronic components, and a flat plate-shaped resin structure that contains a
`magnetic material, the coil is built-in biased to one side of the resin structure, the circuit board is arranged
`horizontally with respect to the coil, and at least a portion of the circuit board is built into the resin structure, and
`for that reason the coil module can be made thinner and more compact while maintaining an ability to ensure a
`necessary diameter of the coil to transmit power without overlapping the coil and the circuit board.
`[Brief Description of the Drawings]
`[0028]
`Fig. 1 is a plan view of a coil module according to a first embodiment of the present invention;
`Fig. 2 is a sectional view at A-A of the coil module depicted in Fig. 1;
`Fig. 3 is a schematic view to explain a manufacturing method of the coil module pursuant to the first embodiment
`of the present invention;
`Fig. 4 is a plan view of a constitution of a coil module according to a second embodiment of the present invention;
`Fig. 5 is a sectional view at B-B of the coil module depicted in Fig. 4;
`Fig. 6 is a plan view of a constitution of a coil module according to a third embodiment of the present invention;
`Fig. 7 is a plan view of a constitution of a coil module according to a fourth embodiment of the present invention;
`Fig. 8 is a plan view of an different constitution of a coil module according to the fourth embodiment of the present
`invention;
`Fig. 9 is a plan view of a constitution of a coil module according to a fifth embodiment of the present invention;
`and
`Fig. 10 is a schematic view of a constitution of an electronic device according to a sixth embodiment of the
`present invention.
`[Mode for Carrying Out the Invention]
`[0029]
`The coil module according to embodiments of the present invention and an electronic device equipped with the
`coil module will now be described in detail with reference to the drawings. It can go without saying that the
`following embodiments do not limit the invention described in the patent claims, and that not all combinations of
`the characteristic matters described in the embodiments are requirements of a solution.
`[0030]
`Also, the coil module according to the embodiments of the present invention have the coil module used in an
`electronic device on the power-transmitting side and the coil module used in an electronic device on the power-
`receiving side, but it does not matter whether the following descriptions indicate either coil module unless
`otherwise specified.
`[0031]
`
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`(6)
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`JP 2011-210937 A 2011.10.20
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`(First Embodiment)
`Fig. 1 is a plan view of a coil module according to embodiment 1 of the present invention. Fig. 1(a) is a plan view
`of a side where the coil 2 is not exposed from the resin structure 3; and Fig. 1(b) is a plan view of a side where
`the coil 2 is exposed from the resin structure 3. Fig. 2 is a sectional view at A-A of the coil module depicted in
`Fig. 1. As shown in Figs. 1 and 2, the coil module 1 is equipped with a flat, plate-shaped coil 2, a flat, plate-
`shaped resin structure 3 containing a magnetic material, and a circuit board 4 electrically connected to the coil
`2 and a is mounted with a plurality of electronic components 41, • • •, that controls power transmitted by the coil
`2.
`[0032]
`The coil 2 is formed into a coil shape at a same plane to form a conductor such as a copper wire. Note that the
`outer shape of the coil 2 is formed substantially into a circular shape, but it may be formed substantially into an
`elliptical shape, or it may be formed substantially into a rectangular shape.
`[0033]
`In the resin structure 3, a curable resin in which a magnetic material such as ferrite or the like is mixed into a
`powder is molded into a flat plate. Furthermore, the coil 2 is built in biased on one side (a surface to be
`electromagnetically coupled) 31 side, which is one side of the resin structure 3. In other words, the thickness
`from the coil 2 to one face 31 of the resin structure 3 is made thinner than the thickness from the coil 2 to the
`other face opposite to the face 31 of the resin structure 3.
`[0034]
`Particularly, in the coil module 1 according to the first embodiment of the present embodiment, as shown in Fig.
`1(b) and Fig. 2, a portion of the coil 2 is exposed to an exterior at one face 31 of the resin structure 3 by thinning
`a thickness from the coil 2 to one face 31 of the resin structure 3. When a portion of the coil 2 is exposed to the
`exterior at one face 31, the coil 2 is covered by the curable resin containing the magnetic material on all faces
`other than one face 31 of the resin structure 3, so the magnetic flux of the coil 2 generated on all faces other
`than one face 31 can be trapped in the resin structure 3, and the properties of the inductance of the coil 2 in the
`direction of one face 31 of the resin structure 3 can be increased, and the magnetic shielding function of all faces
`other than one face 31 can be increased.
`[0035]
`The circuit board 4 is arranged horizontally with respect to the coil 2, and at least a portion of the circuit board 4
`is built into the resin structure 3. Particularly, in the coil module 1 according to the first embodiment of the present
`invention, as shown in Fig. 1(b) and Fig. 2, a portion of the circuit board 4 is exposed to an exterior at one face
`31 of the resin structure 3, and at one face 31 of the resin structure 3, one face of the coil 2 and one face of the
`circuit board 4 are arranged at the same face (horizontal direction), and for that reason, the coil module 1 can
`be made thinner and more compact.
`[0036]
`The circuit board 4 is mounted with a plurality of electronic components 41 that control the power transmitted by
`the coil 2. For example, in the coil module 1 used for the electronic device on the power receiving side, an
`electronic component 41 that constitutes at least a rectifier circuit, a regulator circuit, and a charge-control circuit
`is mounted, and in the coil module 1 used for the electronic device on the power transmitting side, at least an
`electronic component 41 that constitutes a power-control circuit and an inverter circuit is mounted. The plurality
`of electronic components 41, • • •, on the circuit board 4 according to the first embodiment are not electrically
`connected to the terminal formed on the circuit board 4 but to a terminal formed on a sub-circuit board 42 that is
`electrically connected to a terminal formed on a circuit board 4 and is mounted to the circuit board 4 via a sub-
`circuit board 42. For that reason, it is possible to change the constitution of the plurality of electronic components
`41 • • • (for example, the constitution used for the electronic device on the power-receiving side and the
`constitution used for the electronic device on the power-transmitting side) mounted on the circuit board 4 by
`simply changing the sub-circuit board 42 without changing the pattern of the terminal formed on the circuit board
`4. The circuit module (power supply circuit) 43 is composed of the sub-circuit board 42 and a plurality of electronic
`components 41 that is mounted on the sub-circuit board 42.
`[0037]
`The circuit board 4 is equipped with a connector 44 for connection with the exterior. It is easy to mount the coil
`module 1 to the electronic device using the connector 44.
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`JP 2011-210937 A 2011.10.20
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`The resin structure 3 is equipped with an opening 32 in a region of the circuit board 4 that is equipped with a
`circuit module 43 and the connector 44 (that is equipped with a plurality of electronic components). By disposing
`the opening 32 in the resin structure 3, it is possible to prevent a phenomenon where solder that connects the
`electronic components 41 to the sub-circuit board 42 is re-melted by heat thereby creating a fine gap that causes
`a short circuit in the electronic component 41 (a solder flash). Also, because the plurality of electronic
`components 41, • • • are surrounded by a wall formed by the opening 32 in the resin structure 3 that contains the
`magnetic material, stable operations are possible by reducing the effects of electromagnetic waves applied to
`the plurality of electronic components from the coil. Note that on the coil 2, the wiring 21 exposed to the exterior
`from the opening 32 of the resin structure 3 is electrically connected to the circuit board 4.
`[0038]
`Fig. 3 is a schematic view to explain a manufacturing method of the coil module pursuant to embodiment 1 of
`the present invention. In Fig. 3(a), the coil 2 is prepared that is formed into a coil shape to form a conductor such
`as a copper wire. The wire 21 is pulled out from one direction on the prepared coil 2. In Fig. 3(b), the wire material
`21 drawn from the coil 2 is connected to the coil connection terminal 45 formed on the circuit board 4 using
`solder or the like. In addition to the coil connection terminal 45, a circuit module connection terminal 46, a
`connector connection terminal 47, and wiring 48 connecting between the respective terminals are formed on the
`circuit board 4. In Fig. 3(c), the circuit module 43 is connected to the circuit module connection terminal 46 formed
`on the circuit board 4, and the connector 44 is connected to the connector connection terminal 47 formed on the
`circuit board 4, respectively, using solder or the like.
`[0039]
`In Fig. 3 (d), the circuit board 4 that is connected to the coil 2, the circuit module 43, and the connector 44 is set
`in a mold, and the mold is filled with a curable resin that contains a magnetic material that is heated to a
`temperature whereat it is softened to form a flat plate-shaped resin structure 3. Then, the coil 2 and the circuit
`board 4 are integrated and fixed by the resin structure 3. Note that the mold used in Fig. 3(d) is a mold in which
`the coil 2 and a portion of the circuit board 4 are exposed to the exterior at one face 31 of the resin structure 3,
`and an opening 32 can be disposed in the resin structure 3. Note that the circuit module 43 and the connector
`44 are not limited to when disposed on the circuit board 4 before forming the flat, plate-shaped resin structure 3,
`and it is acceptable to dispose on the circuit board 4 after forming the flat, plate-shaped resin structure 3. When
`the circuit module 43 and the connector 44 are disposed on the circuit board 4 after the flat, plate-shaped resin
`structure 3 is formed, the circuit module 43 and the connector 44 are unaffected by heat when the flat, plate-
`shaped resin structure 3 is formed, and for that reason, it is possible to utilize electronic components 41 and the
`connector 44 that are weak to heat.
`[0040]
`As described above, the coil module 1 according to the present invention comprises a flat plate-shaped coil 2, a
`circuit board 4 that is equipped with a plurality of electronic components 41, and • • • , and a flat, plate-shaped
`resin structure 3 that contains a magnetic material, the coil is built-in biased to one side 31 of the resin structure
`3, the circuit board 4 is arranged horizontally with respect to the coil 2, and at least a portion of the circuit board
`4 is built into the resin structure 3, and for that reason, the coil module 1 can be made thinner and more compact
`while maintaining an ability to ensure a diameter of the coil required to transmit power without overlapping the
`coil 2 and the circuit board 4.
`[0041]
`(Second Embodiment)
`Fig. 4 is a plan view of a constitution of a coil module according to the second embodiment of the present
`invention. Fig. 5 is a sectional view at B-B of the coil module depicted in Fig. 4. As shown in Figs. 4 and 5, the
`coil module 1 according to the second embodiment of the present invention comprises a flat, plate-shaped coil
`2, a flat, plate-shaped resin structure 3 containing a magnetic material, and a circuit board 4 mounted with a
`plurality of electronic components 41, • • • that is electrically connected to the coil 2 and controls power
`transmitted by the coil 2, in the same way as the coil module according to the first embodiment of the present
`invention. Note that in the coil module 1 shown in Figs. 4 and 5, the same components as those shown in Figs.
`1 and 2 of the first embodiment will be given the same reference numerals; a detailed description thereof will be
`omitted.
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`JP 2011-210937 A 2011.10.20
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`[0042]
`The coil module 1 according to the second embodiment of the present invention comprises a seal material 5 that
`covers an opening 32a of the resin structure 3 disposed in a region of the circuit board 4 equipped with a circuit
`module 43. The sealing material 5 may be a material that does not transmit electromagnetic waves, and is, for
`example, a metal foil or the like. The effects of electromagnetic waves from the coil 2 on the plurality of electronic
`components 41 mounted on the circuit board 4 from the opening 32a of the resin structure 3 can be reduced by
`covering the opening 32a of the resin structure 3 disposed in the region of the circuit board 4 that is equipped
`with the circuit module 43 using the seal material 5.
`[0043]
`In the coil module 1 according to the second embodiment of the present invention, in order to cover the opening
`32a of the resin structure 3 disposed in the region of the circuit board 4 that is equipped with the circuit module
`43 using the seal material 5 without a gap, the opening 32a of the resin structure 3 disposed in the region of the
`circuit board 4 that is equipped with a circuit module 43, and the opening 32b of the resin structure 3 that is
`disposed in a region of the circuit board 4 that is equipped with a connector 44 are disposed separately, but this
`is not limited thereto. As shown in Fig. 1(a), it is acceptable to dispose the opening 32 of the resin structure 3 in
`the region of the circuit board 4 equipped with the circuit module 43 and the connector 4 and to cover only the
`region of the circuit board 4 that is equipped with the circuit module 43 using the seal material 5.
`[0044]
`As described above, the coil module 1 according to the second embodiment of the present invention comprises
`a seal material 5 that covers the opening 32a of the resin structure 3, so stable operation of the plurality of
`electronic components 41 mounted on the circuit board 4 is possible by reducing the effects of electromagnetic
`waves from the coil 2 applied to the plurality of electronic components 41 mounted on the circuit board 4 from
`the opening 32a of the resin structure 3.
`[0045]
`(Third Embodiment)
`Fig. 6 is a plan view of a constitution of a coil module according to the third embodiment of the present invention.
`Fig. 6(a) is a plan view of a constitution of the coil module 1 before forming a flat, plate-shaped resin structure 3;
`and Fig. 6(b) is a plan view of a constitution of the coil module 1 after forming a flat, plate-shaped resin structure
`3. As shown in Fig. 6, the coil module 1 according to the third embodiment of the present invention comprises a
`flat, plate-shaped coil 2, a flat, plate-shaped resin structure 3 containing a magnetic material, and a circuit board
`4 mounted with a plurality of electronic components 41, • • • that is electrically connected to the coil 2 and
`controls power transmitted by the coil 2, in the same way as the coil module according to the first embodiment
`of the present invention. Note that in the coil module 1 shown in Fig. 6, the same components as those shown
`in Figs. 1 and 2 of the first embodiment will be given the same reference numerals; a detailed description thereof
`will be omitted.
`[0046]
`The plurality of electronic components 41 according to the third embodiment of the present invention is
`electrically connected to the terminal formed on the circuit board 4 and is mounted to the circuit board 4, unlike
`the plurality of electronic components 41 according to the first embodiment of the present invention. That is, in
`the coil module 1 according to the third embodiment of the present invention, the plurality of electronic
`components 41 is not mounted to the circuit board 4 via the sub-circuit board 42, but is mounted directly to the
`circuit board 4 without disposing the sub-circuit board 42. For that reason, the height of the circuit board 4 that
`is equipped with a plurality of electronic components can be suppressed for the height of the sub-circuit board
`42. Note that the plurality of electronic components 41 is connected to the terminal formed on the circuit board
`4 using solder or the like.
`[0047]
`As described above, in the coil module 1 according to the third embodiment of the present invention, the plurality
`of electronic components 41 is electrically connected to a terminal formed on the circuit board 4 and mounted to
`the circuit board 4, so the height of the circuit board 4 equipped with the plurality of electronic components can
`be suppressed, and the coil module 1 can be made thinner and more compact.
`[0048]
`(Third Embodiment)
`Fig. 7 is a plan view of a constitution of a coil module according to the fourth embodiment of the present invention.
`Fig. 7(a) is a plan view of a constitution of the coil module 1 before forming a flat, plate-shaped resin structure 3;
`and Fig. 7(b) is a plan view of a constitution of the coil module 1 after forming a flat, plate-shaped resin structure
`3.
`
`
`
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`Ex.1023 / IPR2022-00350 / Page 8 of 27
`APPLE INC. v. SCRAMOGE TECHNOLOGY LTD.
`
`

`

`
`
`(9)
`
`JP 2011-210937 A 2011.10.20
`
`As shown in Fig. 7, the coil module 1 according to the third embodiment of the present invention comprises a
`flat, plate-shaped coil 2, a flat, plate-shaped resin structure 4 containing a magnetic material, and a circuit board
`4 mounted with a plurality of electronic components 41, • • • that is electrically connected to the coil 2 and
`controls power transmitted by the coil 2, in the same way as the coil module according to the second embodiment
`of the present invention. Note that in the coil module 1 shown in Fig. 7,