as) United States
`a2) Patent Application Publication 10) Pub. No.: US 2007/0092098 A1
`
` Kaderavek (43) Pub. Date: Apr. 26, 2007
`
`
`US 20070092098A1
`
`(54) HEADPHONES WITH ELASTIC EARPIECE
`INTERFACE
`
`Publication Classification
`
`(76)
`
`Inventor:
`
`Johann Kaderavek, Vienna (AT)
`
`Correspondence Address:
`BRINKS HOFER GILSON & LIONE
`P.O. BOX 10395
`CHICAGO,IL 60610 (US)
`
`(21) Appl. No.:
`(22)
`Filed:
`(30)
`
`11/583,992
`Oct. 19, 2006
`Foreign Application Priority Data
`
`Oct. 21, 2005
`
`(EP) ceeceessssssssssssssssseenseesssssesee 05450176.2
`
`100
`
`(51)
`
`Int. Cl.
`(2006.01)
`HOAR 25/00
`(52) US. Ce eeeesscsecseneenensenseseeensenee 381/370; 381/371
`
`6)
`
`ABSTRACT
`
`An improved headphone design delivers an improvedlis-
`tening experience. The headphones provide comfortable and
`uniform earpiece pressure against the listener’s ear. The
`headphones help eliminate environmental noise and reduce
`audible interference, masking, and other undesirable intru-
`‘sions into the listening experience.
`
`1
`
`APPLE 1049
`
`APPLE 1049
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`1
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`

`

`US 2007/0092098 A1
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`Patent Application Publication Apr. 26,2007 Sheet 1 of 9
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`Figure 1
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`Patent Application Publication Apr. 26, 2007 Sheet 2 of 9
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`US 2007/0092098 A1
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`106
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`Patent Application Publication Apr. 26, 2007 Sheet 3 of 9
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`US 2007/0092098 A1
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`Patent Application Publication Apr. 26,2007 Sheet 4 of 9
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`US 2007/0092098 Al
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`Figure 8
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`Figure 9
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`Patent Application Publication Apr. 26,2007 Sheet 5 of 9
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`US 2007/0092098 Al
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`Patent Application Publication Apr. 26,2007 Sheet 6 of 9
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`US 2007/0092098 Al
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`Patent Application Publication Apr. 26,2007 Sheet 7 of 9
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`US 2007/0092098 Al
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`1500
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`Figure 17
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`8
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`Patent Application Publication Apr. 26, 2007 Sheet 8 of 9
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`US 2007/0092098 A1
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`1800
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`Figure 18
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`9
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`
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`

`

` Connect earpiece attachmentstructure to headband. 1902
`
`
`Add conductive flat spring layer. 1908
`
`
`
`
`
`€sY
`
`Layered
`interface?
`
`
`
`Add conductive flat spring layer. 1904
`
`Addinsulating separation layer.
`
`1906
`
`
`
`Connectinterface to earpiece attachmentstructure.
`
`1910
`
`Assemble earpiece unit.
`
`Connect earpiece unit to interface.
`
`
`1912
`
`1914
`
`Patent Application Publication Apr. 26,2007 Sheet 9 of 9
`
`US 2007/0092098 Al
`
`1900
`
`
`
`
`
`
`
`
`Conductive
`interf
`Make ground connection to a conductive flat spring layer
`nterface?
`and a converter.
`1916
`
`
`
`Addleft audio signal connection to a conductive flat
`
`
`spring layer and a converter. 1918
`
`
`
`
`Addright audio signal connection to a conductive flat
`
`
`spring layer and a converter. 1920
`
`
`
`Add additional signal connections to headphonecircuitry
`
`
`and conductive flat spring layers. 1922
`
`Figure 19
`
`10
`
`10
`
`

`

`US 2007/0092098 Al
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`Apr. 26, 2007
`
`HEADPHONES WITH ELASTIC EARPIECE
`INTERFACE
`
`BACKGROUND OF THE INVENTION
`
`[0001]
`
`1. Priority Claim
`
`[0002] This application claims the benefit of priority from
`European Patent Application No. 05450176.2, filed Oct. 21,
`2005, which is incorporated by reference.
`[0003]
`2. Technical Field
`[0004] The application relates to headphones, and in par-
`ticular,
`to the interface between the headband and the
`earpiece.
`
`3. Related Art
`[0005]
`[0006] The proliferation of portable music devices and
`similar products has led to an increased use of headphones
`for private listening purposes. Headphones and their ear-
`pieces may be configured in a variety of ways to adapt to
`different head shapesandsizes as wellas different ear shapes
`and sizes. Some headphone earpiece types include circu-
`maural, an earpiece type that completely surroundsthe ear;
`supra-aural, an earpiece type that rests on top of the ear;
`earbuds, an earpiece type that sits in the ear canal opening;
`and canalphones, an earpiece type that sits inside the ear
`canal.
`
`and uniform earpiece seal on the listener’s ear. Thus, the
`headphonesassist in eliminating environmental noise and
`reducing unwanted interference in a listener’s audio pro-
`gram.
`
`[0011] The headphones include a headband and one or
`more earpieces. Each earpiece may include an electroacous-
`tic converter to translate an audio input signal to sound. An
`elastic interface may connect the earpiece to the headband.
`Theelastic interface biases the earpiece againstthe listener’s
`ear. In particular, the elastic interface provides a force on the
`earpiece to seal the earpiece against the ear. The elastic
`interface maybe selected to provide a uniform, comfortable,
`and/or constant pressure on the ear to create the seal. The
`elastic interface may be made from an electrically conduc-
`tive material. The electrically conductive elastic interface
`may couple audio input signals through the elastic interface
`to the electroacoustic converters.
`
`[0012] Other systems, methods, features and advantages
`will be, or will become, apparent to one with skill in the art
`upon examination of the following figures and detailed
`description. It is intended that all such additional systems,
`methods, features and advantages be included within this
`description, be within the scope of the invention, and be
`protected by the following claims.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0013] The system may be better understood with refer-
`ence to the following drawings and description. The com-
`ponents in the figures are not necessarily to scale, emphasis
`instead being placed uponillustrating the principles of the
`invention. Moreover,in the figures, like referenced numerals
`designate corresponding parts throughout
`the different
`views.
`
`FIG. 1 shows headphones with a headband and
`[0014]
`earpleces.
`
`[0016]
`
`FIG. 3 showsa flat spring.
`
`FIG. 4 shows an earpiece attached to an earpiece
`[0017]
`attachmentstructure through a flat spring.
`
`[0018] FIG.5 showsa headset with a headband, earpieces,
`and a microphone.
`
`Soundclarity is important regardless of headphone
`[0007]
`design. One way in which headphonesprovideclarity is to
`isolate listeners from the environmentso that the audiois not
`overwhelmed, masked, or corrupted by noise. In addition,
`the headphones mayincorporate noise suppression circuitry
`and other signal processing techniques to enhanceclarity.
`However, the processing circuitry can be expensive, cum-
`bersome, and prone to malfunction.
`[0008] Another wayto isolate a listener from environmen-
`tal noises is to improve the interface between the listener’s
`ear and the earpiece. Some headphones use elastic head-
`bands to form the headphonesto a listener’s head, but the
`FIG. 2 showsan electroacoustic converter attached
`[0015]
`elastic headbands do not consistently create a uniform seal
`to an earpiece attachment structure throughaflat spring.
`of the earpiece against the listener’s ear. Other headphones
`have adjustable earpieces that move in one dimension, but
`such headphones typically use non-durable materials that
`apply uneven pressure to the earpiece. In other designs, the
`headphonesallow the earpiece to slide longitudinally along
`the headband, but only allow for adjustmentfor the listener’s
`ear position rather than improving environmentalisolation.
`In other words, prior headphone designs were often
`mechanically complicated and therefore subject to jamming
`and mechanical failure, and also permitted significant envi-
`ronmental noise to interfere with the audio program. Other
`technologies try to address mechanical effects on sound
`quality. In some loudspeaker designs, for example, a laby-
`rinth-like pattern of bars acts as a set of leaf springs and
`connect the loudspeaker cover with the housing. The bars
`are intended to uncouple oscillations and vibrations between
`the cover and the housing, but are not designed to form any
`kind of seal against a listener’s ear.
`[0009] Therefore, there exists a need for headphonesthat
`improve the interface between the listener’s ear and the
`earpiece.
`
`[0019]
`
`FIG. 6 shows a square flat spring.
`
`[0020]
`
`FIG. 7 showsa circular flat spring.
`
`[0021]
`
`FIG. 8 shows an ovalflat spring.
`
`[0022]
`
`FIG. 9 shows an octagonal flat spring.
`
`[0023]
`
`FIG. 10 showsa rectangularflat spring.
`
`[0024]
`
`FIG. 11 showsa circular flat spring.
`
`[0025]
`
`FIG. 12 showsa triangular flat spring.
`
`[0026]
`
`FIG. 13 shows a multiple piece circular flat spring.
`
`FIG. 14 showsa cross section of an electroacoustic
`[0027]
`converter and a multiple layer flat spring.
`
`SUMMARY
`
`[0010] A headphone earpiece design gives an improved
`listening experience. The headphonesprovide a comfortable
`
`[0028]
`
`FIG. 15 showsa flat spring.
`
`[0029]
`
`FIG. 16 showsa flat spring.
`
`11
`
`11
`
`

`

`US 2007/0092098 Al
`
`Apr. 26, 2007
`
`converter
`an electroacoustic
`shows
`17
`[0030] FIG.
`102. The headset 100 may include other structures with
`
`attached to an earpiece attachmentstructure throughaflat other shapes that connect to the elastic interface. The flat
`spring.
`spring 106 mayserve as an attachment point for the elec-
`troacoustic converter 112 or earpiece 110. As shownin FIG.
`1, the earpiece 110 attaches to and substantially surrounds
`the electroacoustic converter 112,
`though other earpiece
`shapes and designs may be implemented.
`
`converter
`an electroacoustic
`shows
`18
`[0031] FIG.
`attached to an earpiece attachment structure through an
`elastic layer.
`
`[0032] FIG. 19 shows a process to manufacture head-
`phones.
`
`DETAILED DESCRIPTION OF THE
`PREFERRED EMBODIMENTS
`
`[0033] Headphones may reduce outside noise by applying
`a constant, uniform, and comfortable pressure on the ear-
`pieces against the listener’s ears. The headphonesprovide a
`better seal for the earpiece against the outside environment
`and provide an improved listening experience. An elastic
`interface may apply the pressure. The elastic interface may
`be conductive, and may assist with connecting an audio
`input signal to electroacoustic converters. When multiple
`earpieces are present, each may be independently adjustable
`on the headband.
`
`[0034] FIG. 1 shows headphones 100. The headphones
`100 include a headband 102, one or more earpiece units
`(e.g., the earpiece unit 104), elastic interfaces (e.g., the flat
`spring 106), and earpiece attachment structures (e.g., the
`earpiece attachment structure 108). The earpiece unit 104
`may include earpieces (e.g., the earpiece 110), electroacous-
`tic converters (e.g., the electroacoustic converter 112), and/
`or other structure or electronics. The headband 102 helps
`keep the headphones 100 in place on the head. FIG. 1 shows
`the headband 102 in an over the head position. The head-
`phones 100 may alternatively employ a behind-the-neck
`band, a behind-the-head band, an under-the-chin band, or
`some other earpiece unit retention structure.
`
`[0035] The flat spring 106 may be a substantially planar
`resilient object. The flat spring 106 may store energy when
`deflected by an external load and return a force in a direction
`substantially perpendicular to the spring surface. The force
`that
`the flat spring 106 applies helps the earpiece 110
`establish a comfortable, uniform, and/or consistent pressure
`against the ear.
`
`[0036] The flat spring 106, although substantially planar,
`may be arched or curved and thus may be formedin a planar
`shape (e.g., a disk), curved shape, arched shape, or other
`shape that extends beyond the major plane oftheflat spring
`106. The flat spring 106 may also be implemented with, or
`include, band springs, spiral springs, plate springs, lamellar
`springs, or other springs. The resilient and elastic properties
`of the flat spring 106 may be chosen and tailored by
`designing recesses and cutouts in the spring, and/or by
`adapting the number and types of spring elements, spring
`and element shapes, and/or spring and element sizes. The
`shape ofthe flat spring 106 maybecircular, oval, elliptical,
`rectangular, or any other shape. The flat spring 106 may be
`manufactured from resilient steel, elastic plastic, spring
`bronze, rubber, resilient flexprint, or other elastic materials.
`
`[0037] The flat spring 106 may sit inside the earpiece
`attachment structure 108. Each earpiece attachment struc-
`ture 108 may be attached to a portion (e.g., an end) of the
`headband 102. FIG. 1 shows a dish-shaped example of an
`earpiece attachmentstructure 108 at the end of the headband
`
`[0038] The flat spring 106 and the earpiece 110 may be
`positioned substantially parallel to one another. The flat
`spring 106 may apply a constant and uniform pressure on the
`electroacoustic converter 112 and the attached earpiece 110.
`The pressure is exerted along an axis 114 perpendicular to
`and away from theflat spring 106. The inner surface 116 of
`the earpiece 110 mayrest on or arounda listener’s ear so that
`the listener can hear the sound produced by the electroa-
`coustic converter 112. The inner surface 116 of the earpiece
`110 thus applies a constant and uniform pressure on the
`listener’s ear, creating a seal against the outside environ-
`ment.
`
`[0039] The earpiece 110 may be a circumaural earpiece
`that completely surroundsthe ear. Alternatively, the earpiece
`110 may be a supra-aural earpiece that rests on top of theear.
`The earpiece 110 may be an open-back earpiece, in which
`the back of the earpiece 110 is open to the air and acousti-
`cally transparent. The earpiece 110 mayalso be a closed-
`back earpiece, in which the back of the earpiece 110 is sealed
`against the outside environment.
`
`[0040] The electroacoustic converter 112 maytranslate the
`signal from an audio input source into sound waves. The
`converter 112 may be a dynamic converter,
`isodynamic
`converter, electrostatic converter, electret converter, or other
`type of converter.
`
`FIG. 2 showsa crosssection of the electroacoustic
`[0041]
`converter 112 attached to the earpiece attachment structure
`108 through the flat spring 106, omitting the earpiece 110.
`The flat spring 106 may exert a pressure along the axis 114
`perpendicular to and away from the flat spring 106. FIG. 2
`showsthat the outer edge ofthe flat spring 106 sits in a notch
`200 and that the flat spring 106 sits in a recess 202 in the
`earpiece attachmentstructure 108.
`
`FIG. 3 shows a view ofthe flat spring 106 taken
`[0042]
`along line A—A of FIG. 2. The flat spring 106 is depicted
`along the axis 114 perpendicular to the flat spring 106. The
`recess 202 permits movementoftheflat spring 106 along the
`axis 114. The flat spring may include an inner connector
`(e.g., an inner ring) and an outer boundary (e.g., an outer
`ring). In the example shown in FIG.3, three spiral-shaped
`arms 302, 304, and 306 radially extend from the center ring
`308 to the outer circumferential boundary 310. The con-
`verter 112 mayattach to the center ring 308ofthe flat spring
`106.
`
`FIG. 3 showsthree arms 302, 304, and 306, but the
`[0043]
`flat spring 106 may include any numberof arms. The outer
`connection points 312, 314, and 316 of the arms 302, 304,
`and 306 on the outer circumferential boundary 310 may be
`arranged at regular or irregular intervals. The inner connec-
`tion points 318, 320, and 322 of the arms 302, 304, and 306
`on the center ring 308 may also be arranged at regular or
`irregular intervals. For example, the regular intervals may be
`the apexes of an equilateral polygon. In FIG. 3, the outer
`connection points 312, 314, and 316 form an equilateral
`
`12
`
`12
`
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`

`US 2007/0092098 Al
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`Apr. 26, 2007
`
`triangle 324 and the inner connection points 318, 320, and
`322 form an equilateral triangle 326. One benefit of choos-
`ing connection points as equilateral polygon apexesis that a
`particularly homogeneous application pressure results. In
`other words, the connection points give rise to a uniform
`and/or constant pressure of the earpiece 110 against the ear
`when the headphones are worn.
`
`Theflat spring 106 need not have an outer circum-
`[0044]
`ferential boundary 310 for the arms 302, 304, and 306 to
`attach to. Instead, the outer connection points 312, 314, and
`316 may be directly attached to the earpiece attachment
`structure 108 or other structure. Similarly, the flat spring 106
`need not have a center ring 308 for the arms 302, 304, and
`306 to attach to. The inner connection points 318, 320, and
`322 maybedirectly attached to the earpiece unit 104 of FIG.
`1.
`
`[0045] The arms 302, 304, and 306 may include multiple
`pieces. For example, each arm 302, 304, and 306 may
`include smaller springs. Similarly, the center ring 308 and
`outer circumferential boundary 310 mayalso include mul-
`tiple pieces.
`
`[0046] FIG. 4 showsa portion of headphones 400 with an
`alternate configuration of the earpiece unit 404, and focuses
`on one end of the headband 402. In this configuration, the
`earpiece 406 attachesto the flat spring 410, and substantially
`surroundsthe converter 408. The earpiece 406, the converter
`408, and/or other structures or circuitry may be included in
`the earpiece unit 404.
`
`[0047] The flat spring 410 and the earpiece 406 may be
`positioned substantially parallel to one another. The flat
`spring 410 mayapply a constant, uniform, and/or comfort-
`able pressure on the earpiece 406 andthe attached converter
`408. The pressure is exerted on an axis 414 perpendicular to
`and away from theflat spring 410. The inner surface 416 of
`the earpiece 406 may rest on or around a listener’s ear. The
`inner surface 416 of the earpiece 406 thus applies a constant
`and uniform pressure on the listener’s ear, creating a seal
`against the outside environment.
`
`FIG. 6 shows a square flat spring 600 with four
`[0050]
`arms 602, 604, 606, and 608. Theflat spring 600 has an inner
`ring 610 and square outer boundary 612. The inner connec-
`tion points 614, 616, 618, and 620 are located approximately
`every 90 degrees along the inner ring 610. The outer
`connection points 622, 624, 626, and 628 are located
`approximately at the center of each side of the square outer
`boundary 612.
`
`FIG. 7 shows a circular flat spring 700 with five
`[0051]
`spiral-shaped arms 702, 704, 706, 708, and 710. The flat
`spring 700 has an inner ring 712 and outer circumferential
`boundary 714. The inner connection points 716, 718, 720,
`722, and 724 are located approximately every 72 degrees
`along the inner ring 712. The outer connection points 726,
`728, 730, 732, and 734 are located approximately every 72
`degrees along the outer circumferential boundary 714.
`
`FIG. 8 showsan ovalflat spring 800 with four arms
`[0052]
`802, 804, 806, and 808. The flat spring 800 has an innerring
`810 and outer oval boundary 812. The inner connection
`points 814, 816, 818, and 820 are located approximately
`every 90 degrees along the inner ring 810. The outer
`connection points 822, 824, 826, and 828 are located at
`approximately regular
`intervals around the outer oval
`boundary 812.
`
`FIG. 9 shows an octagonalflat spring 900 with four
`[0053]
`spiral-shaped arms 902, 904, 906, and 908. The flat spring
`900 has an innerring 910 and outer octagonal boundary 912.
`The inner connection points 914, 916, 918, and 920 are
`located approximately every 90 degrees along the inner ring
`910. The outer connection points 922, 924, 926, and 928 are
`located approximately at the center of fourof the sides of the
`outer octagonal boundary 912.
`
`FIG. 10 showsa rectangular flat spring 1000 with
`[0054]
`four arms 1002, 1004, 1006, and 1008. Theflat spring 1000
`has an inner ring 1010 and outer rectangular boundary 1012.
`The inner connection points 1014, 1016, 1018, and 1020 are
`located at approximately every 90 degrees along the inner
`ring 1010. The outer connection points 1022, 1024, 1026,
`and 1028 are located approximately at the center of each side
`of the outer rectangular boundary 1012.
`
`[0048] FIG. 5 showsa headset 500 that includes a micro-
`phone 502. The microphone 502 may add two-way com-
`[0055] FIG. 11 showsacircular flat spring 1100 with three
`
`munication capability to the headset 500. The headset 500
`straight arms 1102, 1104, and 1106. Theflat spring 1100 has
`may include a headband 504, earpiece unit 506, flat spring
`an inner ring 1108 and outer circumferential boundary 1110.
`508, and earpiece attachment structure 510. The earpiece
`The inner connection points 1112, 1114, and 1116 are located
`unit 506 may include an earpiece 512 and electroacoustic
`approximately every 120 degrees along the inner ring 1108.
`converter 514. As shown in FIG.5, the earpiece 512 attaches
`The outer connection points 1118, 1120, and 1122 are
`to and substantially surrounds the electroacoustic converter
`located approximately every 120 degrees along the outer
`514, though other shapes and designs may be implemented.
`circumferential boundary 1110.
`The microphone 502 may be an acoustic-to-electric con-
`verter that translates sound wavesinto a signal. The micro-
`phone 502 may be a condenser microphone, an electret
`condenser microphone, dynamic microphone, ribbon micro-
`phone, carbon microphone, piezo microphone,or other type
`of microphone.
`
`[0049] FIGS. 6 through 12 show examples of alternative
`flat springs that vary in shape, size, and arm configuration.
`The shape, size, and arm configuration of a flat spring may
`be adapted to any particular headphone design, earpiece
`design, or converter design. In the examples shown below,
`the inner and outer connections points are arranged on the
`apexes of equilateral polygons, though other designs may
`also be implemented.
`
`FIG. 12 showsa triangular flat spring 1200 with
`[0056]
`three spiral-shaped arms 1202, 1204, and 1206. The fiat
`spring 1200 has an inner ring 1208 and outer triangular
`boundary 1210. The inner connection points 1212, 1214, and
`1216 are located approximately every 120 degrees along the
`inner ring 1208. The outer connection points 1218, 1220,
`and 1222 are located approximately at the center of each side
`of the outer triangular boundary 1210.
`
`FIG. 13 showsa circular flat spring 1300 including
`[0057]
`twoseparate electrically conductive parts 1302 and 1304. In
`this configuration, the parts 1302 and 1304 are electrically
`isolated from one another. The parts 1302 and 1304 may
`electrically connect the audio input signal to the electroa-
`
`13
`
`13
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`

`US 2007/0092098 Al
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`Apr. 26, 2007
`
`coustic converter. For example, the audio signal may be
`connected to part 1302 while ground may be connected to
`part 1304. Additional corresponding connections may
`extendto the electroacoustic converter. The flat spring 1300
`may sit inside the earpiece attachment structure 1306. In
`FIG. 13, the flat spring 1300 includes four spiral-shaped
`arms 1308, 1310, 1312, and 1314. Part 1302 includes two
`arms 1308 and 1314 that extend radially from the inner
`portion 1316 of part 1302 to the outer portion 1318 of part
`1302. Part 1304 includes two arms 1310 and 1312 that
`extend radially from the inner portion 1320 of part 1304 to
`the outer portion 1322 of part 1304.
`
`In this configuration, the flat spring 1300 may be
`[0058]
`manufactured from an electrically conductive material such
`as resilient flexprint, resilient steel, or other elastic and
`conductive materials. Using an electrically conductive flat
`spring 1300 may beneficially reduce or eliminate cabling to
`the electroacoustic converter, may reduce the number of
`assembly steps, and may reduce the chance of mechanical
`failure.
`
`[0059] FIG. 14 showsa cross section of an electroacoustic
`converter 1400 and a multiple layer flat spring 1402. Theflat
`spring 1402 includes three layers: a first electrically con-
`ductive flat spring layer 1404, a secondelectrically conduc-
`tive flat spring layer 1406, and an insulating layer 1408. The
`twoelectrically conductive flat spring layers 1404 and 1406
`may be arranged to sandwich the insulating layer 1408. The
`three layers 1404, 1406, and 1408 maybe positioned sub-
`stantially parallel to one another. The electrically conductive
`flat spring layers 1404 and 1406 may be manufactured from
`resilient flexprint, resilient steel, or other elastic and con-
`ductive materials. The insulating layer 1408 may be con-
`figured to have elastic properties similar to the electrically
`conductive flat spring layers 1404 and 1406. The insulating
`layer 1408 may be manufactured from polyurethane foam,
`rubber, silicone, or other elastic insulating materials. As a
`result, the three layers together may act together to create a
`constant and uniform pressure on the converter 1400 and an
`attached earpiece.
`
`[0060] The twoelectrically conductive flat spring layers
`1404 and 1406 may electrically connect the audio input
`signal to the electroacoustic converter 1400. For example,
`the audio signal may be connected to layer 1404 and ground
`may be connectedto layer 1406. In FIG. 14, an audio signal
`wire 1410 (e.g., a left or right channel signal wire) and a
`ground wire 1412 are shown connected from the audio
`source to layers 1404 and 1406, respectively. An audio
`signal wire 1414 and a ground wire 1416 connect from
`layers 1404 and 1406, respectively, to the converter 1400.
`Other wiring configurations between the audio source, flat
`spring layers, and converter may be implementedinstead of
`wires as shown in FIG. 14. Instead of audio signals, the flat
`spring may carry microphone signals, noise cancellation
`signals, data signals, or other signals.
`
`[0061] FIG. 15 showsanalternative flat spring 1500. The
`arms of the flat spring 1500 are the three tension springs
`1502, 1504, and 1506. The flat spring may include an inner
`ring 1508 and outer circumferential boundary 1510, but
`need not be circular. The tension springs 1502, 1504, and
`1506 may be tightly clamped rubber bands,
`threaded
`springs, or may have other constructions. The flat spring
`1500 maysit inside the earpiece attachmentstructure 1512.
`
`The three tension springs 1502, 1504, and 1506 may be
`attached to the inner ring 1508 at inner connection points
`1514, 1516, and 1518 at regular intervals. The tension
`springs 1502, 1504, and 1506 may beattachedto the outer
`circumferential boundary 1510 at outer connection points
`1520, 1522, and 1524 at
`regular
`intervals. The angle
`between each of the tension springs 1502, 1504, and 1506
`may be approximately 120° or another angle. In FIG. 8, at
`120°, the tension springs 1502, 1504, and 1506 produce a
`well-distributed pressure on the earpiece against the ear.
`
`FIG. 16 shows an alternative flat spring 1600
`[0062]
`formed as an elastic membrane layer 1602. The elastic
`membrane layer 1602 may be manufactured from rubber or
`some other material capable of forming a thin elastic layer.
`A center zone 1604 may be defined in the membrane to
`provide an attachmentpointfor an electroacoustic converter.
`As examples, the center zone 1604 mayberelatively flat,
`stiff,
`and/or appropriately dimensioned to provide a
`mechanically sound connection point for the converter. The
`membrane layer 1602 may also include a boundary 1606,
`such as a circumferential boundary when the membrane
`1602 is circular.
`
`FIG. 17 showsa cross section of an electroacoustic
`[0063]
`converter 1700, elastic membrane layer 1602, and earpiece
`attachment structure 1702. The converter 1700 may be
`attached to the center zone 1604 of the elastic membrane
`layer 1602. The membrane boundary 1606 mayattach to the
`outer circumferential area of the earpiece attachmentstruc-
`ture 1702 in a two-dimensional connection. In this configu-
`ration, the membranelayer 1602 may produce a constant and
`uniform pressure on the converter 1700 and attached ear-
`piece to create a seal against the listener’s ear.
`
`FIG. 18 showsa portion of an alternative head-
`[0064]
`phones 1800, focusing on one end of the headband 1802. In
`this configuration, the earpiece unit 1804 may include an
`earpiece 1806 and an electroacoustic converter 1808. A plate
`1812 and resilient pad 1814 may sit inside the earpiece
`attachmentstructure 1810. In FIG. 18, the earpiece attach-
`ment structure 1810 is dish-shaped, but other shapes and
`sizes may be implemented. The converter 1808 may be
`attachedto the plate 1812, which may be manufactured of a
`rigid material to give the converter 1808 a firm attachment
`point. The plate 1812 may beattachedto the resilient pad
`1814, which may be made from foam or other adaptable
`and/or elastic material.
`
`[0065] The plate 1812, resilient pad 1814, and earpiece
`1806 maybepositioned substantially parallel to one another.
`The resilient pad 1814 may apply a constant and uniform
`pressure on the converter 1808 and attached earpiece 1806.
`The pressure may be exerted on an axis 1818 perpendicular
`to and away from the plate 1812 andresilient pad 1814. The
`inner surface 1816 of the earpiece 1806 may rest on or
`aroundthe listener’s ear. The inner surface 1816 thus applies
`a constant and uniform pressure on the listener’s ear, creat-
`ing a seal from the outside environment.
`
`FIG. 19 shows a process 1900 for manufacturing
`[0066]
`headphones with an elastic interface between the headband
`and earpieces. The earpiece attachment structure mayfirst be
`connected to the headband (Act 1902). The earpiece attach-
`ment structure may be dish-shaped or may be other shapes
`and sizes. When the headphones will include a multiple
`layer interface, the manufacturing process may build the
`
`14
`
`14
`
`

`

`US 2007/0092098 Al
`
`Apr. 26, 2007
`
`interface by establishing a first layer (Act 1904), adding an
`insulating layer (Act 1906), and adding a second layer (Act
`1908). The process may add additional layers. The layered
`elastic interface may include multiple electrically conduct-
`ing flat spring layers sandwiching one or more insulating
`layers.
`
`[0067] The process connects the interface to the earpiece
`attachmentstructure (Act 1910) and assembles the earpiece
`unit (Act 1912). The earpiece unit may include the electroa-
`coustic converter, earpiece, and/or other structures and cir-
`cuitry. The process also connects the earpiece unit to the
`interface (Act 1914). As examples, the process may connect
`the electroacoustic converter or the earpiece to the interface.
`When the interface is an electrically conductive interface,
`the process may form electrical connectionsto the interface.
`As examples, the process may make a ground connection to
`a conductive flat spring layer and a converter (Act 1916),
`add a left audio signal connection to a conductive flat spring
`layer and a converter (Act 1918), add a right audio signal
`connection to a conductive flat spring layer and a converter
`(Act 1920), and add additional signal connections to the
`headphonecircuitry and conductive flat spring layers (Act
`1922). The additional
`signal connections may include
`microphonesignal connections, noisefiltering circuitry con-
`nections, or other electrical connections. Other wiring con-
`figurations may be used to connect the audio source and the
`electroacoustic converter.
`
`[0068] While various embodiments of the invention have
`been described, it will be apparent to those of ordinary skill
`in the art that many more embodiments and implementations
`are possible within the scope of the invention. Accordingly,
`the invention is not to be restricted except in light of the
`attached claims and their equivalents.
`
`I claim:
`
`1. Headphones, comprising:
`
`an earpiece unit retention structure; and
`
`an earpiece unit comprising:
`
`an earpiece; and
`
`an electroacoustic converter; and
`
`a flat spring connecting the earpiece unit to the earpiece
`unit retention structure, the flat spring comprising:
`
`an inner connector;
`
`an outer boundary; and
`
`multiple arms extending outward from the inner con-
`nector to the outer boundary, where the flat spring
`provides an approximately uniform pressure along
`an axis perpendicular to the flat spring.
`2. The headphones of claim 1, where:
`the electroacoustic converter is connected to the flat
`
`spring.
`3. The headphones of claim 1, where:
`
`the earpiece is connected to the flat spring.
`4. The headphones of claim 1, where:
`
`the arms extend in a non-linear pattern from the inner
`connector to the outer boundary.
`
`5. The headphonesof claim 1, where:
`
`the multiple arms comprise outer connection points posi-
`tioned at apexes of an equilateral polygon.
`6. The headphones of claim 1, further comprising:
`
`an earpiece attachmentstructure connectedto the earpiece
`unit retention structure andto the earpiece unit through
`the flat spring.
`7. Headphones, comprising:
`
`an earpiece unit retention structure; and
`
`an earpiece unit comprising:
`
`an earpiece; and
`
`an elect