as) United States
`a2) Patent Application Publication 10) Pub. No.: US 2008/0166005 Al
`
`(43) Pub. Date: Jul. 10, 2008
`Terlizzi et al.
`
`US 20080166005A1
`
`(54) HEADSET ELECTRONICS
`
`(75)
`
`Inventors:
`
`Jeffrey J. Terlizzi, San Francisco,
`CA (US); Emery A. Sanford, San
`Francisco, CA (US); M. Evans
`Hankey, San Francisco, CA (US);
`Terry Tikalsky, Sunnyvale, CA
`(US); John Tang, San Carlos, CA
`(US); Daniele De Iuliis, San
`Francisco, CA (US); Peter
`Russell-Clark, San Francisco, CA
`(US)
`
`Correspondence Address:
`ROPES & GRAY LLP
`PATENT DOCKETING39/361, 1211 AVENUE OF
`THE AMERICAS
`NEW YORK,NY 10036-8704
`
`(73) Assignee:
`
`Apple Inc, Cupertino, CA (US)
`
`(21) Appl. No.:
`
`11/824,443
`
`(22)
`
`Filed:
`
`Jun. 28, 2007
`
`Related U.S. Application Data
`
`(60) Provisional application No. 60/878,852, filed on Jan.
`5, 2007, provisional application No. 60/879,177, filed
`
`on Jan. 6, 2007, provisional application No. 60/879,
`193, filed on Jan. 6, 2007, provisional application No.
`60/879,195, filed on Jan. 6, 2007, provisional applica-
`tion No. 60/936,965, filed on Jun. 22, 2007.
`
`Publication Classification
`
`(51)
`
`Int. Cl.
`HOAR 25/00
`
`(2006.01)
`
`(52) US. CMe coeccccccecsssssssssssssssnseeeseeseees 381/375; 381/380
`
`(57)
`
`ABSTRACT
`
`A wireless headset device that includes an earbud assembly
`and a primary housing assembly,fixed to the earbud assem-
`bly, is provided. The earbud assembly can include an earbud
`flexible circuit board having mounted thereon a receiver and
`processing circuitry. The primary housing assembly can
`include a microphone and a primary housing flexible circuit
`boardelectrically coupled to the earbud circuit board and the
`microphone. In some embodiments, the headset device can
`include at least one flexible circuit board and the primary
`housing can include a connector assembly. The at least one
`flexible circuit board can be electrically coupled to the con-
`nector assembly and can include Universal Serial Bus (USB)
`circuitry operative to process USB protocol communications
`and serial circuitry operative to process serial protocol com-
`munications.
`
`1021
`
`APPLE 1046
`
`APPLE 1046
`
`1
`
`

`

`Patent Application Publication
`
`Jul. 10, 2008 Sheet 1 of 60
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`US 2008/0166005 Al
`
`MICROPHONE 7
`
`CONNECTOR 16
`
`2
`
`

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`Patent Application Publication
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`Jul. 10, 2008 Sheet 2 of 60
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`US 2008/0166005 Al
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 3 of 60
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`US 2008/0166005 A1
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`Jul. 10, 2008 Sheet 4 of 60
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`Patent Application Publication
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`5
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 5 of 60
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`US 2008/0166005 Al
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 6 of 60
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`US 2008/0166005 Al
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`Patent Application Publication
`
`Jul. 10, 2008 Sheet 7 of 60
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`US 2008/0166005 A1
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`Jul. 10, 2008 Sheet 17 of 60
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`Jul. 10, 2008 Sheet 18 of 60
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`Patent Application Publication
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 19 of 60
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`US 2008/0166005 Al
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 20 of 60
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`US 2008/0166005 Al
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 21 of 60
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`US 2008/0166005 Al
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`Jul. 10, 2008
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`Sheet 22 of 60
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 23 of 60
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`US 2008/0166005 A1
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`Patent Application Publication
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`Jul. 1 0, 2008 Sheet 24 of 60
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`US 2008/0166005 Al
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 25 of 60
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`Jul. 10, 2008
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`Patent Application Publication
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`Jul. 10, 2008
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`Sheet 27 of 60
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 28 of 60
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`US 2008/0166005 A1
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 29 of 60
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`US 2008/0166005 Al
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`PLACING BOTTOM INSERT INTO TUBE;~2901
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`TO THE BOTTOM INSERT THREADS
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`TO A PREDETERMINED LEVEL
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`
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`APREDETERMINED TORQUE
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 30 of 60
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`Sheet 31 of 60
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`US 2008/0166005 A1
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`Patent Application Publication
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`Jul. 10, 2008
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`Patent Application Publication
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`Jul. 10, 2008
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`US 2008/0166005 A1
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`Patent Application Publication
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`Jul. 10, 2008
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`Sheet 33 of 60
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`US 2008/0166005 A1
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`US 2008/0166005 A1
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`Patent Application Publication
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`Jul. 10, 2008
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`Jul. 10, 2008 Sheet 35 of 60
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`Jul. 10, 2008 Sheet 52 of 60
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`Jul. 10, 2008 Sheet 53 of 60
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`US 2008/0166005 Al
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`Jul. 10, 2008 Sheet 55 of 60
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`Sheet 59 of 60
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`US 2008/0166005 Al
`
`Jul. 10, 2008
`
`HEADSET ELECTRONICS
`
`CROSS REFERENCE TO RELATED
`APPLICATIONS
`
`[0001] This application claims the benefit of certain
`copending, commonly assigned U.S. Provisional Patent
`Applications, namely, Ser. No. 60/878,852 filed on Jan. 5,
`2007; Ser. No. 60/879,177 filed on Jan. 6, 2007; Ser. No.
`60/879,193 filed on Jan. 6, 2007; Ser. No. 60/879,195 filed on
`
`Jan. 6, 2007; and Ser. No.
`filed on Jun. 22, 2007
`(Attorney Docket No. 104677-0102-001 (P5389USP1)),
`entitled “Single User Input Mechanism for Controlling Elec-
`tronic Device Operations”; all of which are incorporated
`herein by reference.
`[0002] Commonly assigned DiFonzo et al. U.S. patent
`application Ser. No. 11/235,873, filed Sep. 26, 2005 (Attor-
`ney Docket No. P3794US1/119-0060US.1), entitled “Elec-
`tromagnetic Connector for Electronic Device” is hereby
`incorporated by referencein its entirety.
`[0003] Commonly assigned Rohrbach et al. U.S. patent
`application Ser. No. 11/235,875, filed Sep. 26, 2005 (Attor-
`ney Docket No. P3593US1/119-0060US), entitled “Mag-
`netic Connector for Electronic Device” is hereby incorpo-
`rated by reference in its entirety.
`[0004] Commonly assigned Andreet al. U.S. patent appli-
`cation Ser. No. 11/456,833, filed Jul. 11, 2006 (Attorney
`Docket No. P3981US1),entitled “Invisible, Light-Transmis-
`sive Display System”is hereby incorporated by reference in
`its entirety.
`[0005] Commonly assigned Andreet al. U.S. patent appli-
`cation Ser. No. 11/551,988, filed Oct. 23, 2006 (Attorney
`Docket No. P4246USX1), entitled “Invisible, Light-Trans-
`missive Display System”is hereby incorporated by reference
`in its entirety.
`[0006] Commonly assigned Sanford et al. U.S. patent
`application Ser. No. 11/651,094,filed Jan. 6, 2007 (Attorney
`Docket No. P4983US2), entitled “Antenna and Button
`Assembly for Wireless Devices” is hereby incorporated by
`reference in its entirety.
`[0007] Commonly assignedTerlizziet al. U.S. patent appli-
`cation Ser. No. 11/650,130, filed Jan. 5, 2007 (Attorney
`Docket No. 104677-0015-101 (P4630US1)), entitled “Sys-
`tems and Methodsfor Determining the Configuration ofElec-
`tronic Connections”is hereby incorporated by referencein its
`entirety.
`[0008] Commonly assigned Rabuet al. U.S. patent appli-
`cation Ser. No. 11/620,669, filed Jan. 6, 2007 (Attorney
`Docket No. 104677-0011-102 (P4628US2)), entitled “Appa-
`ratuses and Methodsthat Facilitate the Transfer of Power and
`Information Among Electrical Devices” is hereby incorpo-
`rated by reference in its entirety.
`
`FIELD OF INVENTION
`
`[0009] The present invention can relate to headsets. More
`particularly, the present invention can relate to headsets for
`communicating with an electronic device.
`
`BACKGROUND OF THE INVENTION
`
`[0010] Headsets for providing hands-free communications
`are knownin the art. Such headsets typically can be used in
`conjunction with a cellular telephone or a computer (e.g.,
`Voice over IP). Someexisting headsets include a microphone,
`a speaker(also referred to as a receiver), electronics for con-
`
`trolling the headset and communicating with another device
`(e.g., a cellular telephone), a battery and a connector for
`re-charging the battery.
`[0011] There are many aspects involved in the design of
`headsets. For example, the size and weight ofheadsets can be
`key issues because ofhowtheytypically mountto a user’s ear.
`A heavyorlarge headset can pull on a user’s ear, creating an
`uncomfortable fit. The shape of headset earpieces (e.g., ear-
`buds) may also be an important design consideration to take
`into accountasit is desirable for earpieces to fit comfortably
`in, on, or over a wide range of different sizes and shapes of
`ears.
`
`[0012] Additionally, the acoustic performanceof headsets,
`such as receiver sound generation quality and microphone
`sound reception quality (e.g., ability to pick up a user’s voice
`without undue backgroundnoise), can be important design
`considerations. Achieving desired receiver and microphone
`acoustic performance can becomeincreasingly difficult as the
`size of a headset decreases.
`
`[0013] Another example of an important design consider-
`ation can be the userinterface ofa headset. It may be desirable
`for a user interface to be intuitive for a first-time user, yet
`convenient for an experienceduser.
`[0014] Aesthetics may be yet another important design
`consideration for headsets.
`
`Furtherstill, ease of manufacturing headsets can be
`[0015]
`another design consideration. For example, it can be desirable
`to design a headsetthat can be mass producedin an affordable
`fashion.
`In view of the foregoing, there is a need for an
`[0016]
`improved headset that addresses one or more of the above-
`identified considerations.
`
`SUMMARY OF THE INVENTION
`
`In accordance with one embodimentof the present
`[0017]
`invention, a wireless headset device that includes an earbud
`assembly anda primary housing assembly,fixed to the earbud
`assembly, is provided. The earbud assembly can include an
`earbud flexible circuit board having mounted thereon a
`receiver and processing circuitry. The primary housing
`assembly can include a microphone and a primary housing
`flexible circuit board electrically coupled to the earbudcircuit
`board and the microphone.
`[0018]
`In accordance with another embodiment of the
`present invention, a wireless headset device that includes an
`earbud assembly and a primary housing assembly,fixed to the
`earbud assembly,
`is provided. The earbud assembly can
`include an earbudflexible circuit board. The primary housing
`assembly can include a battery retaining region and a primary
`housing flexible circuit board. The circuit board components
`and circuitry can be selectively mounted on the earbudflex-
`ible circuit board and the primary housing flexible circuit
`board to maximizea size ofthe battery retaining region.
`[0019]
`In accordance with yet another embodimentof the
`present invention, a wireless device that includes an earbud
`assembly anda primary housing assembly,fixed to the earbud
`assembly, is provided. The primary housing assembly can
`have predetermined dimensions. The earbud assembly and
`the primary housing assembly can each have mounted therein
`a flexible circuit board comprising circuitry.
`[0020]
`In accordance with yet another embodimentof the
`present invention, a headset device that includes an earbud
`assembly, a primary housing assembly,andat least one flex-
`ible circuit board is provided. The primary housing assembly
`
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`

`US 2008/0166005 Al
`
`Jul. 10, 2008
`
`can be fixed to the earbud assembly and can include a con-
`nector assembly.Theat least one flexible circuit board can be
`electrically coupled to the connector assembly and can
`include Universal Serial Bus (USB) circuitry operative to
`process USB protocol communications andserial circuitry
`operative to process serial protocol communications.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0021] The present invention will be apparent upon consid-
`eration of the following detailed description, taken in con-
`junction with accompanying drawings, in which:
`[0022]
`FIG. 11s a simplified block diagram of a headset in
`accordance with an embodimentof the present invention;
`[0023]
`FIG. 2 is a simplified block diagram of a headset
`connector system in accordance with an embodimentof the
`present invention;
`[0024] FIG.3 isa simplified cross-sectional illustration of a
`connector assembly in accordance with an embodimentofthe
`present invention;
`[0025]
`FIG. 4 is a simplified cross-sectional illustration of
`another connector assembly in accordance with an embodi-
`mentof the present invention;
`[0026]
`FIG. 5 is a simplified block diagram of a headset in
`accordance with an embodimentof the present invention;
`[0027]
`FIG. 6A is a simplified cross-sectional illustration
`ofa portion of a headsetin accordance with an embodiment of
`the present invention;
`[0028]
`FIG. 6B isa simplified cross-sectionalillustration of
`a screw in accordance with an embodiment of the present
`invention;
`[0029]
`FIG. 7 is a simplified block diagram of a display
`system in accordance with an embodiment of the present
`invention;
`[0030]
`FIG. 8 is a simplified block diagram of a power
`distribution system in accordance with an embodimentofthe
`present invention;
`[0031]
`FIG. 9 is a simplified block diagram of another
`powerdistribution system in accordance with an embodiment
`of the present invention;
`[0032]
`FIGS. 10A and 10Bareillustrations of a headset in
`accordance with an embodimentof the present invention;
`[0033]
`FIG. 11 is an exploded view of a headset in accor-
`dance with an embodimentof the present invention;
`[0034]
`FIG. 12 is an exploded view of a headset in accor-
`dance with another embodimentof the present invention;
`[0035]
`FIG. 13 is a simplified diagram showing how soft-
`ware in a Bluetooth device is organized in accordance with an
`embodimentof the present invention;
`[0036]
`FIG. 14 is a simplified block diagram ofthe electri-
`cal system of a headset in accordance with an embodiment of
`the present invention;
`[0037]
`FIG. 15 is a simplified block diagram of the core
`processorof a headset in accordance with an embodimentof
`the present invention;
`[0038]
`FIG. 16 is a simplified schematic diagram of a
`powerdistribution system in accordance with an embodiment
`of the present invention;
`[0039]
`FIGS. 17A-17Care illustrations of a traditionalcir-
`cuit board anddistribution ofelectrical components in a head-
`set;
`FIG. 18 is a simplified block diagram of a circuit
`[0040]
`board with an improveddistribution of electrical components
`in a headset in accordance with an embodimentofthe present
`invention;
`
`FIGS. 19A and 19Bare illustrations comparing the
`[0041]
`traditional circuit board of FIGS. 7A-7C to a circuit board
`
`with an improveddistribution of electrical components in a
`headset in accordance with an embodiment of the present
`invention;
`[0042]
`FIG. 20A-20C are illustrations of an improveddis-
`tribution of electrical components in a headset in accordance
`with an embodimentof the present invention;
`[0043]
`FIG. 21Ais anillustration of a headset earbud in
`accordance with an embodimentof the present invention;
`[0044]
`FIG. 21B is a simplified exploded view of a headset
`earbud in accordance with an embodiment of the present
`invention;
`[0045]
`FIGS. 22-25 and FIG. 26A are simplified illustra-
`tions of a headset earbud in various states of assembly in
`accordance with some embodiments ofthe present invention;
`[0046]
`FIG. 26B is a simplified cross-sectional view of an
`audio receiver in accordance with an embodiment of the
`
`present invention;
`[0047]
`FIG. 27A is a simplified cross-sectional view of a
`partially assembled headset earbud in accordance with an
`embodimentof the present invention;
`[0048]
`FIG. 27B is a simplified cross-sectional view of a
`fully assembled headset earbud in accordance with an
`embodimentof the present invention;
`[0049]
`FIG. 28 is an exploded view ofan attachment system
`in accordance with an embodimentofthe present invention;
`[0050]
`FIG. 29 is a flowchart of an illustrative process for
`assembling a portion of a headset in accordance with an
`embodimentof the present invention.
`[0051]
`FIGS. 30A and 30Bare illustrations of a tool that
`can be usedto assist in assembly of a portion of a headset in
`accordance with an embodimentof the present invention;
`[0052]
`FIG. 30C is an illustration of the tool of FIGS. 30A
`and 30B being used in accordance with an embodimentofthe
`present invention;
`[0053]
`FIG. 31 isacross-sectional view ofa “finished” tube
`in accordance with an embodimentofthe present invention;
`[0054]
`FIG. 32 is a cross-sectional view of an initially
`manufactured tube in accordance with an embodimentof the
`
`present invention;
`[0055]
`FIG. 33 is aperspective view ofa cross section ofthe
`tube of FIG. 31 in accordance with an embodimentof the
`
`present invention;
`[0056]
`FIG. 34 is an illustrative die and stamper for modi-
`fying the initially manufactured tube ofFIG. 32 in accordance
`with an embodimentof the present invention;
`[0057]
`FIG. 35 is across-sectional view of the tube of FIG.
`34 once the stamper and die are removed from the tube in
`accordance with an embodimentof the present invention;
`[0058]
`FIG. 36 is a perspective view ofthe tube of FIG. 35
`once the tube is machinedto create an internal wall in accor-
`
`dance with an embodimentofthe present invention;
`[0059]
`FIG. 37 is a cross-sectional view of an illustrative
`tube formed using a single impact extrusion in accordance
`with an embodimentof the present invention;
`[0060]
`FIG. 38 is a perspective view of the tube of FIG. 37
`once the tube is machinedto create an internal wall in accor-
`
`dance with an embodimentofthe present invention;
`[0061]
`FIG. 39 is a cross-sectional view of an illustrative
`tube formed using a double impact extrusion in accordance
`with an embodimentof the present invention;
`
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`US 2008/0166005 Al
`
`Jul. 10, 2008
`
`FIG. 40 is a perspective view of the tube of FIG. 39
`[0062]
`once the tube is machinedto create an internal wall in accor-
`
`dance with an embodimentof the present invention;
`[0063]
`FIG. 41 is a cross-sectional view of an illustrative
`tube formedusing a progressive deep draw process in accor-
`dance with an embodimentof the present invention;
`[0064]
`FIG. 42 1s aperspective view of across section ofthe
`tube of FIG. 41 in accordance with an embodiment of the
`present invention;
`[0065]
`FIG. 43 isa perspective view ofthe tube of FIGS. 41
`and 42 once the tube is machinedto create an internal wall in
`
`accordance with an embodimentof the present invention;
`[0066]
`FIG.44 is a flow chart of an illustrative process for
`forming an extruded tube with a feature on the internal sur-
`face of the tube with using a die and stamperin accordance
`with an embodimentof the present invention;
`[0067]
`FIG.45 is a flow chart ofan illustrative process for
`forming a tube with a feature on the internal surface of the
`tube using a single impact extrusion in accordance with an
`embodimentof the present invention;
`[0068]
`FIG.46 is a flow chart ofan illustrative process for
`forming a tube with a feature on the internal surface of the
`tube using a impact extrusion on both ends of the tube in
`accordance with an embodimentof the present invention;
`[0069]
`FIG.47 is a flow chart ofan illustrative process for
`forming a tube with a feature on the internal surface of the
`tube using a progressive deep draw process in accordance
`with an embodimentof the present invention;
`[0070]
`FIG.48 is a cross-sectional view of a visual indica-
`tor system in accordance with an embodimentofthe present
`invention;
`[0071]
`FIG. 49 is an illustration of a visual indicator system
`of a headset in accordance with an embodimentofthe present
`invention;
`[0072]
`FIGS. 50A and 50Bareillustrations of a headset in
`accordance with an embodimentof the present invention;
`[0073]
`FIG. 51 is an illustration of a connector in accor-
`dance with an embodimentof the present invention;
`[0074]
`FIG. 52 is an exploded view of a connectorin accor-
`dance with an embodimentof the present invention;
`[0075]
`FIG. 53 is an illustration of a microphone boot in
`accordance with an embodimentof the present invention;
`[0076]
`FIG. 54 is a cross-sectional view of a connector in
`accordance with an embodimentof the present invention;
`[0077]
`FIGS. 55A-55D areillustrations of a headset in
`accordance with an embodimentof the present invention;
`[0078]
`FIG. 56 is a cross-sectional view of an electrical
`contact assembly coupled to a circuit board in accordance
`with an embodimentof the present invention;
`[0079]
`FIGS. 57A and 57Bareillustrations of an electrical
`contact assembly in accordance with an embodimentof the
`present invention;
`[0080]
`FIGS. 58A-58C are illustrations of an electrical
`contact assembly in accordance with an embodimentof the
`present invention;
`[0081]
`FIGS. 59A and 59Bare illustrations of electrical
`contacts in accordance with an embodimentofthe present
`invention;
`[0082]
`FIGS. 60A and 60Bareillustrations of a connector
`plate in accordance with an embodimentofthe present inven-
`tion;
`FIGS. 61A and 61B are illustrations of magnetic
`[0083]
`components of a connector in accordance with an embodi-
`mentof the present invention;
`
`FIGS. 62A and 62Bareillustrations of a connector
`[0084]
`in accordance with an embodimentofthe present invention;
`[0085]
`FIGS. 63A and 63Bareillustrations of a connector
`in accordance with an embodimentofthe present invention;
`[0086]
`FIG. 64 is an illustration of a headset coupling with
`a complementary connector in accordance with an embodi-
`mentof the present invention;
`[0087]
`FIG. 65 is a simplified graph of magnetic and spring
`forces involved in the coupling of a headset with a comple-
`mentary connector in accordance with an embodimentof the
`present invention;
`[0088]
`FIG. 66 is an illustration of a docking device that can
`receive a headset in accordance with an embodiment of the
`
`present invention;
`[0089]
`FIG. 67A is anillustration of a connector in accor-
`dance with an embodimentofthe present invention;
`[0090]
`FIG. 67B is an illustration of a headset coupling
`with a complementary connector in accordance with an
`embodimentof the present invention; and
`[0091]
`FIG. 681s achart listing exemplary modes and func-
`tions of a communications system in accordance with an
`embodimentof the present invention.
`
`DETAILED DESCRIPTION OF THE INVENTION
`
`[0092] The present invention relates to headsets and meth-
`ods for manufacturing the same. Headsets are communication
`devices that are worn on a user’s headin order to allow hands
`free data and/or voice communication with a host device such
`as a computer, phone handset, cellular phone, an automobile
`and/orthe like. Headsets can include one or more speakers (in
`proximity to one or both ears) for audio output and/or one or
`more microphonesfor audio input.
`[0093] Headsets can comein a variety of form factors or
`shapes. In some cases, headsets can be embodiedas an ear-
`piece that serves as the primary support mechanism for wear-
`ing the headset. For example the headset may be supported on
`the head by an earpiece worn overor in the ear. Alternatively,
`the headset may be supported by a frame or band thatfits on
`or over the user’s head. The headset may include a fixed or
`movable boomthat places the microphonecloserto the user’s
`mouth (wraps around the face). Alternatively, the headset
`maybe boomless such that the microphoneis integrated with
`the earpiece thereby forming a more compact device (e.g.,
`smaller, lighter, more aesthetically pleasing,etc.).
`[0094] According to one aspect of the invention, the head-
`set can be embodied as a small compact unit including a
`primary housing and an earbud memberextending therefrom.
`The earbud member maybeattachedto or integrally formed
`with the primary housing. Various components can be placed
`at the surface of or within the confines of the earbud member
`and the primary housing. In fact, both ofthem can include one
`or more components depending on the needs of the device.
`The components contained within each ofthese can be widely
`varied. Examples of operational components can include
`speakers, microphones, antennas, connectors, buttons, dis-
`plays, indicators, battery, and associated processors, control-
`lers and circuitry. Generally, the earbud memberincludesat
`least a speaker while the primary housing includesat least a
`microphone(although this is not a requirement). Depending
`on their size, each of these members can include additional
`components of the headset. In one embodiment, the primary
`housing includes an antenna, user interface button, indicator
`or display (e.g., LEDs), battery, microphone, and/or a con-
`nector along with any accompanying circuitry while a
`
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`US 2008/0166005 Al
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`Jul. 10, 2008
`
`speaker, a processor, and its accompanying circuitry can be
`located in the earbud. The button can be located on one end of
`
`and/or discrete circuit boards together. In other words, a first
`portion of the electronics may be separated from a second
`the main housing. A user can interface with this button to
`portion of the electronics, and furtherthefirst portion may be
`perform various functions (e.g., terminating calls).
`positioned at a first location within the headset while the
`[0095] The shape andsize andorientation of the earbud
`second portion maybe positionedat a second location within
`memberand primary housing can be widely varied. In one
`the headset. Note that, two portions is not a limitation and the
`embodiment, the earbud memberis configured for insertion
`electronics can be divided into any numberof smaller discrete
`into the ear such thatit supports the remaining portions of the
`portions.
`headset (e.g., primary housing) proximate the user’s head. In
`[0100] Alongasimilar vein, anotheraspect ofthe invention
`one embodiment, the primary housing can be configuredas a
`relates to electronic assemblies that are partially flexible or
`longitudinal member(e.g., a tube). In one example, an earbud
`bendable such that the assemblies can be folded into a small
`member, which contains a speaker, perpendicularly protrudes
`away from one end of a longitudinally extending primary
`housing, which includes a microphoneat an opposite end of
`the longitudinally extending primary housing. Furthermore,
`the earbud membercan expand outwardly and then inwardly
`from a