SFF specifications are available at http://www.snia.org/sff/specifications
` or ftp://ftp.seagate.com/sff
`
`
`
`
`
`
`
`
`This specification was developed by the SFF Committee prior to it
`becoming the SFF TA (Technology Affiliate) TWG (Technical Working
`Group) of SNIA (Storage Networking Industry Association).
`
`
`
`
`
`
`
`Chairman SFF TA TWG
`Email: SFF-Chair@snia.org
`
`
`
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`The information below should be used instead of the equivalent herein.
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`POINTS OF CONTACT:
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`If you are interested in participating in the activities of the SFF TWG, the
`membership application can be found at:
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`The complete list of SFF Specifications which have been completed or are currently
`being worked on can be found at:
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`http://www.snia.org/sff/specifications/SFF-8000.TXT
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`The operations which complement the SNIA's TWG Policies & Procedures to guide the SFF
`TWG can be found at:
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`http://www.snia.org/sff/specifications/SFF-8032.PDF
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`
`LUXSHARE EXHIBIT 1007
`Page 1 of 39
`
`

`

`** Information Specification ** INF-8074i Rev 1.0
`
` SFF Committee documentation may be purchased in hard copy or electronic form
` SFF specifications are available at ftp://ftp.seagate.com/sff
`
` SFF Committee
`
` INF-8074i Specification for
`
` SFP (Small Formfactor Pluggable) Transceiver
`
` Rev 1.0 May 12, 2001
`
`Secretariat: SFF Committee
`
`Abstract: This specification describes the SFP (Small Formfactor Pluggable)
`Transceivers developed by the MSA (Multiple Source Agreement) group. The
`following companies participated in the MSA.
`
` Agilent Technologies IBM
` Blaze Network Products Lucent Technologies
` E2O Communications Molex
` ExceLight Communications Optical Communication Products
` Finisar Picolight
` Fujikura Technology America Stratos Lightwave
` Hitachi Cable Tyco Electronics
` Infineon Technologies
`
`This Information Specification was not developed or endorsed by the SFF Committee
`and was submitted for distribution on the basis that it is of interest to
`industry.
`
`The copyright on the contents remains with the contributor.
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`Contributors are not required to abide by the SFF patent policy. Readers are
`advised of the possibility that there may be patent issues associated with an
`implementation which relies upon the contents of an 'i' specification.
`
`SFF accepts no responsibility for the validity of the contents.
`
`POINTS OF CONTACT:
`
` Schelto van Doorn I. Dal Allan
` Technical Editor Chairman SFF Committee
` Intel/nSerial 14426 Black Walnut Court
` 3101 Jay St #110 Saratoga
` Santa Clara CA 95054 CA 95070
`
` 408-496-3426 408-867-6630
` 408-486-9783Fx 408-867-2115Fx
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`
`SFP (Small Formfactor Pluggable) Transceiver Page 1
`
`LUXSHARE EXHIBIT 1007
`Page 2 of 39
`
`

`

`** Information Specification ** INF-8074i Rev 1.0
`
` EXPRESSION OF SUPPORT BY MANUFACTURERS
`
`The following member companies of the SFF Committee voted in favor of
`this industry specification.
`
` EMC
` ENDL
` FCI/Berg
` Hitachi Cable
` Picolight
` Toshiba America
` Unisys
`
`The following member companies of the SFF Committee voted to abstain on
`this industry specification.
`
` Fujitsu CPA
` IBM
` Seagate
` Tyco AMP
`
`SFP (Small Formfactor Pluggable) Transceiver Page 2
`
`LUXSHARE EXHIBIT 1007
`Page 3 of 39
`
`

`

`** Information Specification ** INF-8074i Rev 1.0
`
`If you are not a member of the SFF Committee, but you are interested in
`participating, the following principles have been reprinted here for your
`information.
`
` PRINCIPLES OF THE SFF COMMITTEE
`
`The SFF Committee is an ad hoc group formed to address storage industry needs in
`a prompt manner. When formed in 1990, the original goals were limited to defining
`de facto mechanical envelopes within which disk drives can be developed to fit
`compact computer and other small products.
`
`Adopting a common industry size simplifies the integration of small drives (2
`1/2" or less) into such systems. Board-board connectors carrying power and
`signals, and their position relative to the envelope are critical parameters in a
`product that has no cables to provide packaging leeway for the integrator.
`
`In November 1992, the SFF Committee objectives were broadened to encompass other
`areas which needed similar attention, such as pinouts for interface applications,
`and form factor issues on larger disk drives. SFF is a forum for resolving
`industry issues that are either not addressed by the standards process or need an
`immediate solution.
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`Documents created by the SFF Committee are expected to be submitted to bodies
`such as EIA (Electronic Industries Association) or an ASC (Accredited Standards
`Committee). They may be accepted for separate standards, or incorporated into
`other standards activities.
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`The principles of operation for the SFF Committee are not unlike those of an
`accredited standards committee. There are 3 levels of participation:
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` - Attending the meetings is open to all, but taking part in discussions is
` limited to member companies, or those invited by member companies
` - The minutes and copies of material which are discussed during meetings
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` receive documentation and vote on issues that arise. Votes are not taken
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` ballot, which ensures all members an equal opportunity to be heard.
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`Material presented at SFF Committee meetings becomes public domain. There are no
`restrictions on the open mailing of material presented at committee meetings. In
`order to reduce disagreements and misunderstandings, copies must be provided for
`all agenda items that are discussed. Copies of the material presented, or
`revisions if completed in time, are included in the documentation mailings.
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`The sites for SFF Committee meetings rotate based on which member companies
`volunteer to host the meetings. Meetings have typically been held during the ASC
`T10 weeks.
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`The funds received from the annual membership fees are placed in escrow, and are
`used to reimburse ENDL for the services to manage the SFF Committee.
`
`SFP (Small Formfactor Pluggable) Transceiver Page 3
`
`LUXSHARE EXHIBIT 1007
`Page 4 of 39
`
`

`

`** Information Specification ** INF-8074i Rev 1.0
`
`If you are not receiving the documentation of SFF Committee activities or are
`interested in becoming a member, the following signup information is reprinted
`here for your information.
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`Membership includes voting privileges on SFF Specs under development.
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` CD_Access Electronic documentation contains:
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`SFP (Small Formfactor Pluggable) Transceiver Page 4
`
`LUXSHARE EXHIBIT 1007
`Page 5 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
` Appendix A. Mechanical Interface
`
`A1. SFP Transceiver Package Dimensions
`A2. Mating of SFP Transceiver PCB to SFP Electrical Connector
`A3. Host Board Layout
`A4. Insertion, Extraction and Retention Forces for SFP Transceivers
`A5. Labeling of SFP Transceivers
`A6. Bezel Design for Systems Using SFP Transceivers
`A7. SFP Electrical Connector Mechanical Specifications
`A8. SFP Cage Assembly Dimensions
`
`Appendix B. Electrical Interface
`
`B1. Introduction
`B2. Pin Definitions
`B3. Timing Requirements of Control and Status I/O
`B4. Module Definition Interface and Data Field Description
`
`Appendix C. Agreement Signatures
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 5
`
`LUXSHARE EXHIBIT 1007
`Page 6 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`Appendix A. Mechanical Interface
`A1. SFP Transceiver Package Dimensions
`A common mechanical outline is used for all SFP transceivers. The package dimensions for
`the SFP transceiver are described in Table 1 and Figures 1A and 1B.
`
`Table 1. Dimension Table for Drawing of SFP Transceiver
`
`Designator
`
`A
`B
`C
`D
`E
`F
`G
`H
`J
`
`K
`L
`M
`N
`P
`Q
`R
`S
`T
`U
`V
`
`W
`X
`
`Y
`
`Z
`AA
`AB
`AC
`AD
`AE
`AF
`AG
`
`Dimension
`(mm)
`13.7
`8.6
`8.5
`13.4
`1.0
`2.3
`4.2
`2.0
`28.5
`
`56.5
`1.1x45°
`2.0
`2.25
`1.0
`9.2
`0.7
`45.0
`34.6
`41.8
`2.5
`
`1.7
`9.0
`
`2.0
`
`0.45
`8.6
`2.6
`45°
`0.3
`6.3
`2.6
`0.40
`
`Comments
`
`Tolerance
`(mm)
`± 0.1
`Transceiver width, nosepiece or front that extends inside cage
`± 0.1
`Transceiver height, front, that extends inside cage
`± 0.1
`Transceiver height, rear
`± 0.1
`Transceiver width, rear
`Extension of front sides outside of cage, see Note 2 Figure 1B
`Maximum
`Location of cage grounding springs from centerline, top
`Reference
`Location of side cage grounding springs from top
`Reference
`Maximum Width of cage grounding springs
`Minimum
`Location of transition between nose piece and rear of
`transceiver
`Transceiver overall length
`Reference
`Chamfer on bottom of housing
`Minimum
`± 0.25
`Height of rear shoulder from transceiver printed circuit board
`± 0.1
`Location of printed circuit board to bottom of transceiver
`± 0.1
`Thickness of printed circuit board
`± 0.1
`Width of printed circuit board
`Maximum Width of skirt in rear of transceiver
`± 0.2
`Length from latch shoulder to rear of transceiver
`± 0.3
`Length from latch shoulder to bottom opening of transceiver
`± 0.15
`Length from latch shoulder to end of printed circuit board
`± 0.05
`Length from latch shoulder to shoulder of transceiver outside
`of cage (location of positive stop).
`Clearance for actuator tines
`Transceiver length extending outside of cage, see Note 2
`Figure 1B
`Maximum length of top and bottom of transceiver extending
`outside of cage, see Note 2 Figure 1B
`± 0.05
`Height of latch boss
`Transceiver height, front, that extends inside cage
`Reference
`Length of latch boss (design optional)
`Maximum
`± 3°
`Entry angle of actuator
`Radius on entry angle of actuator
`Maximum
`Reference Width of cavity that contains the actuator
`± 0.05
`Width of latch boss (design optional)
`Minimum
`Maximum radius of front of latch boss, 2 places (design
`optional)
`
`± 0.1
`Reference
`
`Maximum
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 6
`
`LUXSHARE EXHIBIT 1007
`Page 7 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Figure 1A. Drawing of SFP Transceiver
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 7
`
`LUXSHARE EXHIBIT 1007
`Page 8 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Notes:
`
`1. Cage grounding springs permitted in this
`area and may extend full length of
`transceiver, 4 places. Grounding springs
`may contribute a maximum force of 3.5N
`(Newtons) to the withdrawal force of the
`transceiver from the cage.
`
`2. A representative MT-RJ configuration is
`illustrated. Indicated outline defines the
`preferred maximum envelope outside of
`the cage.
`
`3. Design of actuation method and shape is
`optional.
`
`4. Color code: An exposed colored feature of
`the transceiver (a feature or surface
`extending outside the cage assembly) shall
`be color coded as follows:
`• Black or beige for multi-mode
`• Blue for single mode
`
`Figure 1B. Drawing of SFP Transceiver (Cont.)
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 8
`
`LUXSHARE EXHIBIT 1007
`Page 9 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`A2. Mating of SFP Transceiver PCB to SFP Electrical Connector
`The SFP transceiver contains a printed circuit board that mates with the SFP electrical
`connector. The pads are designed for a sequenced mating:
`• First mate – ground contacts
`• Second mate – power contacts
`• Third mate – signal contacts
`
`The design of the mating portion of the transceiver printed circuit board is illustrated in Figure 2
`and the electrical pad layout is illustrated in Figure 3. A typical contact pad plating for the
`printed circuit board is 0.38 micrometers minimum hard gold over 1.27 micrometers minimum
`thick nickel. Other plating options that meet the performance requirements are acceptable.
`
`Figure 2. Recommended Pattern Layout for SFP Printed Circuit Board
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 9
`
`LUXSHARE EXHIBIT 1007
`Page 10 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`VeeT
`
`TxFault
`
`Tx Disable
`
`MOD-DEF(2)
`
`MOD-DEF(1)
`
`MOD-DEF(0)
`
`Rate Select
`
`LOS
`
`VeeR
`
`VeeR
`
`1 2 3 4 5 6 7 8 9 1
`
`0
`
`20
`
`19
`
`18
`
`17
`
`16
`
`15
`
`14
`
`13
`
`12
`
`11
`
`VeeT
`
`TD-
`
`TD+
`
`VeeT
`
`VccT
`
`VccR
`
`VeeR
`
`RD+
`
`RD-
`
`VeeR
`
`Top of Board
`
`Bottom of Board (as viewed
`thru top of board)
`
`Figure 3. SFP Transceiver Electrical Pad Layout
`
`A3. Host Board Layout
`A typical host board mechanical layout for attaching the SFP Connector and Cage System is
`shown in Figures 4A and 4B.
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 10
`
`LUXSHARE EXHIBIT 1007
`Page 11 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Figure 4A. SFP Host Board Mechanical Layout
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 11
`
`LUXSHARE EXHIBIT 1007
`Page 12 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Figure 4B. SFP Host Board Mechanical Layout (Cont.)
`
`A4. Insertion, Extraction and Retention Forces for SFP Transceivers
`The requirement for the various functional forces and the durability cycles are specified in
`Table 2.
`
`Table 2. Insertion, Extraction, and Retention Forces
`
`Measurement
`SFP transceiver insertion
`SFP transceiver extraction
`SFP transceiver retention
`
`Minimum Maximum Units
`0
`40
`Newtons
`0
`11.5
`Newtons
`90
`170
`Newtons
`
`Cage retention (Latch strength)
`
`Cage kickout spring force
`Insertion / removal cycles,
`connector/cage
`Insertion / removal cycles, SFP
`transceiver
`
`180
`
`11.5
`100
`
`50
`
`N/A
`
`22
`N/A
`
`N/A
`
`Newtons
`
`Newtons
`cycles
`
`cycles
`
`Comments
`
`No damage to transceiver
`below 90N
`No damage to latch below
`180N
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 12
`
`LUXSHARE EXHIBIT 1007
`Page 13 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`A5. Labeling of SFP Transceivers
`Color coding requirements for optical SFP transceivers are specified in Figure 1B.
`Each SFP transceiver should be clearly labeled. The complete labeling need not be visible
`when the SFP transceiver is installed. Labeling should include appropriate manufacturing and
`part number identification, appropriate regulatory compliance labeling, and a clear specification
`of the external port characteristics. The external port characteristic label may include such
`information as optical wavelength, required fiber characteristics, operating data rate, interface
`standards supported, and link length supported.
`
`A6. Bezel Design for Systems Using SFP Transceivers
`
`Host enclosures that use SFP devices should provide appropriate clearances between the
`SFP transceivers to allow insertion and extraction without the use of special tools and a bezel
`enclosure with sufficient mechanical strength. For most systems a nominal centerline to
`centerline spacing of 16.25mm (0.640”) is sufficient. See Figure 5 for the recommended bezel
`design. For double-sided board mounting, a printed circuit board thickness of 3.0mm (0.118”)
`is required.
`The SFP transceiver insertion slot should be clear of nearby moldings and covers that might
`block convenient access to the latching mechanisms, the SFP transceiver, or the cables
`connected to the SFP transceiver.
`
`Figure 5. Recommended Bezel Design
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 13
`
`LUXSHARE EXHIBIT 1007
`Page 14 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`A7. SFP Electrical Connector Mechanical Specifications
`The SFP Connector is a 20-contact, right angle surface mount connector. It is described in
`Table 3 and Figure 6. The plating on the contacts is specified as follows:
`• Contact area: 0.38 micrometers minimum hard gold over 2.54 micrometers minimum
`thick nickel
`• Solder terminal area: gold flash or 2.54 micrometers tin lead plating over 2.54
`minimum thick nickel.
`
`Table 3. SFP Transceiver Connector Dimensions
`
`Designator
`
`A
`B
`C
`D
`E
`
`F
`
`G
`H
`
`J
`K
`L
`M
`N
`
`P
`
`Q
`
`R
`
`S
`
`T
`
`U
`
`Dimension
`(mm)
`9.4
`1.4
`11.2
`9.2
`3.5
`
`3.9
`
`1.35
`2.6
`
`9.6
`0.9
`1.4
`5.4
`0.8
`
`6.0
`
`3.0
`
`0.7
`
`0.3
`
`1.0
`
`4.5
`
`Tolerance
`(mm)
`± 0.08
`± 0.05
`Maximum
`Maximum
`Reference
`
`Reference
`
`Maximum
`Minimum
`
`TP
`Reference
`± 0.05
`Maximum
`Reference
`
`Minimum
`
`Maximum
`
`± 0.1
`
`Reference
`
`Minimum
`
`Reference
`
`Comments
`
`Connector card slot width
`Guide pin diameter
`Connector width
`Connector length
`Distance from centerline of connector
`to outer contact
`Distance from centerline of connector
`to outer contact
`Connector card slot height
`Height from bottom of connector to
`bottom of card slot
`Distance between guide pins
`Diamond guide pin width
`Diamond guide pin length
`Connector height
`Length of solder leads past housing,
`front & rear
`Depth of card slot from front face of
`housing
`Depth of contact point from front face
`of connector
`Size of chamfer on top face of
`connector
`Distance boss extends past front face
`of connector
`Size of chamfer at entry of card slot,
`all around
`Length from centerline of guide posts
`to end of solder lead
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 14
`
`LUXSHARE EXHIBIT 1007
`Page 15 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Figure 6. SFP Transceiver Connector Illustration
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 15
`
`LUXSHARE EXHIBIT 1007
`Page 16 of 39
`
`

`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`A8. SFP Cage Assembly Dimensions
`The SFP Cage Assembly consists of two components: a lower cage that is soldered to the
`host board and a top cage that is assembled to the lower cage after soldering. A reference
`drawing describing the SFP Cage Assembly is provided in Table 4 and Figures 7A and 7B.
`The cage material is copper alloy and plating options are:
`•
`Tin-lead plate 2.54 micrometers minimum over copper flash
`•
`Tin plate 2.54 micrometers minimum over 0.76 micrometers minimum nickel
`Table 4. Dimension Table for Drawing of SFP Cage Assembly
`Designator
`Dimension
`Tolerance
`Comments
`(mm)
`(mm)
`48.8
`Maximum
`8.3
`Maximum
`± 0.1
`14.0
`14.25
`Basic
`± 0.025
`0.249
`9.0
`Basic
`11.8
`Basic
`
`A
`B
`C
`D
`E
`F
`G
`
`Overall length
`Length from inside top of cage to latch
`Inside width of cage
`Distance between solderleg centerlines on side of cage
`Thickness of solderleg
`Distance between vent holes along length
`Distance from front of cage to beginning of center vent
`hole row
`Distance between vent holes across the width of the
`cage
`Diameter of vent holes
`Distance from front of cage to solderleg
`Distance between chassis ground solderlegs along side
`Width of EMI pins
`Width of all chassis ground solderlegs
`Width of solderleg shoulder
`Length of solderleg
`Distance from centerline of cage to centerline of
`chassis ground solderleg
`Distance from centerline of cage to centerline of
`chassis ground solderleg
`Distance from centerline of cage to centerline of
`chassis ground solderleg
`Distance from centerline of cage to centerline of EMI
`pins
`Width of EMI pins on top cage
`Distance from inside top of cage to inside bottom
`surface of front section of cage assembly
`Maximum height of cage assembly from host board
`Distance between chassis ground solderlegs along side
`Distance from front of cage to solderleg
`Length of 9.2 (W) dimension from front of cage
`Maximum width of cage assembly
`Minimum width of inside of cage
`Height of inside of cage assembly
`Height of clearance slots
`Distance of clearance slots from cage centerline
`
`H
`
`J
`K
`L
`M
`N
`P
`Q
`R
`
`S
`
`T
`
`U
`
`V
`W
`
`X
`Z
`AA
`AB
`AC
`AD
`AE
`AF
`AG
`
`7.9
`
`2.0
`16.5
`10.0
`0.6
`0.7
`2.0
`1.25
`3.95
`
`1.45
`
`1.45
`
`4.8
`
`0.5
`9.2
`
`9.8
`10.0
`11.5
`7.5
`15.0
`13.9
`8.95
`1.0
`2.4
`
`Basic
`
`± 0.1
`Basic
`Basic
`± 0.1
`± 0.1
`Maximum
`Maximum
`Basic
`
`Basic
`
`Basic
`
`Basic
`
`± 0.05
`± 0.15
`
`Maximum
`Basic
`Basic
`Minimum
`Maximum
`Minimum
`± 0.15
`Minimum
`Basic
`
`____________________________________________________________________________________________________
`September 14, 2000
` Page 16
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`LUXSHARE EXHIBIT 1007
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`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`Table 4. Dimension Table for Drawing of SFP Cage Assembly (Cont.)
`
`Designator
`
`AH
`AJ
`AK
`AL
`AM
`AN
`AP
`AQ
`AR
`AS
`AT
`AU
`AV
`
`AW
`AX
`
`Dimension
`(mm)
`3.0
`2.35
`2.8
`0.5
`45.6
`35.0
`0.7
`5.1
`3.0
`16.3
`0.65
`5.8
`12.7
`
`15.75
`10.9
`
`Tolerance
`(mm)
`± 0.1
`± 0.1
`± 0.1
`Minimum
`Maximum
`Maximum
`± 0.1
`Maximum
`± 0.05
`Basic
`Maximum
`Minimum
`Maximum
`recommended
`Maximum
`Maximum
`
`Comments
`
`Width of clearance slots
`Distance from front of cage to latch opening
`Length of latch opening
`Height of latch lead-in
`Distance from front of cage to kickout spring
`Distance from front of cage to end of cage floor
`Width of solderlegs that extend from floor of cage
`Width of latch
`Width of latch opening
`Front of cage to beginning of outer vent hole rows
`Inside radius of cage, four places
`Distance between panel ground spring supports
`Length of plug extending outside of the cage
`
`Width of plug extending outside of the cage
`Height of plug extending outside of the cage
`
`A9. Dust / EMI Cover
`The order to prevent contamination of the internal components and to optimize EMI
`performance, it is recommended that a Dust/EMI Plug be inserted into cage assemblies when
`no transceiver is present. The maximum dimensions of the Dust/EMI Cover are listed in Table
`4 and the maximum size is illustrated in Figure 7A. The Dust/EMI Cover shall exert a
`maximum force of 4.0 Newtons per side to the inside surfaces of the cage. This force shall be
`measured as the force/side required to compress the Dust/EMI Cover’s compliant feature(s) to
`the maximum dimensions listed in Table 4 (Illustrated in Figure 7A).
`
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`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Figure 7A. SFP Cage Assembly
`
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`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Figure 7B. SFP Cage Assembly (Cont.)
`
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`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Appendix B. Electrical Interface
`
`Introduction
`B1.
`This annex contains pin definition data for the small form-factor pluggable (SFP) transceiver.
`The pin definition data is specific to gigabit rate datacom applications such as Fibre Channel
`and Gigabit Ethernet. It is expected that different pin definitions will be developed for
`SONET/ATM and lower data rate datacom applications.
`
`B2. Pin Definitions
`Figure 1 below shows the pin names and numbering for the connector block on the host board.
`The diagram is in the same relative orientation as the host board layout (see Appendix A,
`Figure 4.). As mentioned, this pinout only applies to gigabit rate datacom applications. The
`pin functions are defined in Table 1 and the accompanying notes. Figure 2A shows the
`recommended power supply filtering network. Figure 2B shows an example of a complete
`SFP host board schematic with connections to SerDes and protocol ICs. For EMI protection
`the signals to the 20-pin connector should be shut off when the transceiver is removed.
`Standard board layout practices such as connections to Vcc and GND with Vias, use of short-
`and equal-length differential signal lines, use of microstrip-lines and 50Ω terminations are
`recommended. Chassis grounds and external electromagnetic interference shields should not
`be attached to circuit ground.
`
`Towards
`ASIC
`
`20
`
`19
`
`18
`
`17
`
`16
`
`15
`
`14
`
`13
`
`12
`
`11
`
`VeeT
`
`TD-
`
`TD+
`
`VeeT
`
`VccT
`
`VccR
`
`VeeR
`
`RD+
`
`RD-
`
`VeeR
`
`VeeT
`
`TXFault
`
`TX Disable
`
`MOD-DEF(2)
`
`MOD-DEF(1)
`
`MOD-DEF(0)
`
`Rate Select
`
`LOS
`
`VeeR
`
`VeeR
`
`1 2 3 4 5 6 7 8 9
`
`10
`
`Towards
`Bezel
`
`Figure 1. Diagram of Host Board Connector Block Pin Numbers and Names
`
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`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`
`Pin
`Num.
`1
`2
`
`3
`
`4
`5
`6
`7
`
`8
`9
`10
`11
`12
`13
`14
`15
`16
`17
`18
`19
`20
`
`Name
`VeeT
`TX Fault
`
`TX Disable
`
`MOD-DEF2
`MOD-DEF1
`MOD-DEF0
`Rate Select
`
`LOS
`VeeR
`VeeR
`VeeR
`RD-
`RD+
`VeeR
`VccR
`VccT
`VeeT
`TD+
`TD-
`VeeT
`
`Function
`Transmitter Ground
`Transmitter Fault
`Indication
`Transmitter Disable
`
`Module Definition 2
`Module Definition 1
`Module Definition 0
`Select between full or
`reduced
`receiver bandwidth
`Loss of Signal
`Receiver Ground
`Receiver Ground
`Receiver Ground
`Inv. Received Data Out
`Received Data Out
`Receiver Ground
`Receiver Power
`Transmitter Power
`Transmitter Ground
`Transmit Data In
`Inv. Transmit Data In
`Transmitter Ground
`
`Table 1. Pin Function Definitions
`Plug
`Seq.
`1
`3
`
`Note 1
`
`Notes
`
`3
`
`3
`3
`3
`3
`
`3
`1
`1
`1
`3
`3
`1
`2
`2
`1
`3
`3
`1
`
`Note 2
`Module disables on high or open
`Note 3, 2 wire serial ID interface
`Note 3, 2 wire serial ID interface
`Note 3, Grounded in Module
`Note 4
`Low or Open – reduced bandwidth,
`High– full bandwidth
`Note 5
`Note 6
`Note 6
`Note 6
`Note 7
`Note 7
`Note 6
`3.3 ± 5%, Note 8
`3.3 ± 5%, Note 8
`Note 6
`Note 9
`Note 9
`Note 6
`
`Plug Seq.: Pin engagement sequence during hot plugging.
`1) TX Fault is an open collector/drain output, which should be pulled up with a 4.7K – 10KΩ
`resistor on the host board. Pull up voltage between 2.0V and VccT, R+0.3V. When high,
`output indicates a laser fault of some kind. Low indicates normal operation. In the low
`state, the output will be pulled to < 0.8V.
`
`2) TX disable is an input that is used to shut down the transmitter optical output. It is pulled
`up within the module with a 4.7 – 10 KΩ resistor. Its states are:
`Low (0 – 0.8V):
`Transmitter on
`(>0.8, < 2.0V):
`
`Undefined
`High (2.0 – 3.465V):
`Transmitter Disabled
`Open:
`
`Transmitter Disabled
`
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`September 14, 2000
` Page 21
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`LUXSHARE EXHIBIT 1007
`Page 22 of 39
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`

`Small Form-factor Pluggable (SFP) Transceiver MultiSource Agreement (MSA)
`Table 1 Notes (Cont.)
`3) Mod-Def 0,1,2. These are the module definition pins. They should be pulled up with a
`4.7K – 10KΩ resistor on the host board. The pull-up voltage shall be VccT or VccR (see
`Section IV for further details).
`
`Mod-Def 0 is grounded by the module to indicate that the module is present
`Mod-Def 1 is the clock line of two wire serial interface for serial ID
`Mod-Def 2 is the data line of two wire serial interface for serial ID
`
`4) This is an optional input used to control the receiver bandwidth for compatibility with
`multiple data rates (most likely Fibre Channel 1x and 2x Rates). If implemented, the input
`will be internally pulled down with > 30kΩ resistor. The input states are:
`
`Reduced Bandwidth
`Low (0 – 0.8V):
`Undefined
`(>0.8 , < 2.0V):
`Full Bandwidth
`High (2.0 – 3.465V):
`Reduced Bandwidth
`Open:
`5) LOS (Loss of Signal) is an open collector/drain output, which should be pulled up with a
`4.7K – 10KΩ resistor. Pull up voltage between 2.0V and VccT, R+0.3V. When high, this
`output indicates the received optical power is below the worst-case receiver sensitivity (as
`defined by the standard in use). Low indicates normal operation. In the low state, the
`output will be pulled to < 0.8V.
`6) VeeR and VeeT may be internally connected within the SFP module.
`
`7) RD-/+: These are the differential