US007161650B2
`
`(12) United States Patent
`Hirano
`
`(10) Patent No.:
`(45) Date of Patent:
`
`US 7,161,650 B2
`Jan. 9, 2007
`
`(54) ELECTRO-OPTIC DEVICE WITH FOLDED
`INTERFACE SUBSTRATE HAVING FOLDED
`PROJECTIONS WITH ELECTRONIC PARTS
`
`(75) Inventor: Yoshihisa Hirano, Matsumoto (JP)
`(73) Assignee: Seiko Epson Corporation (JP)
`
`(*) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 155 days.
`(21) Appl. No.: 10/875,084
`
`(22) Filed:
`
`Jun. 23, 2004
`
`(65)
`
`Prior Publication Data
`US 2005/OO181O2 A1
`Jan. 27, 2005
`
`Foreign Application Priority Data
`(30)
`Jun. 24, 2003
`(JP)
`............................. 2003-179591
`
`(51) Int. Cl.
`(2006.01)
`GO2F L/15
`(52) U.S. Cl. ......................... 34.9/150; 439/239; 349/58
`(58) Field of Classification Search ................ 34.9/150,
`349/110,58; 34.5/102; 248/916
`See application file for complete search history.
`References Cited
`
`(56)
`
`U.S. PATENT DOCUMENTS
`6,806.920 B1 * 10/2004 Hayashi et al. ............... 349/58
`
`2003/0067577 A1* 4/2003 Yamada ...................... 349,150
`2003/0117543 A1* 6/2003 Chang ......................... 349.58
`
`FOREIGN PATENT DOCUMENTS
`
`JP
`
`2000-276068
`
`10, 2000
`
`* cited by examiner
`Primary Examiner Andrew Schechter
`Assistant Examiner Phu Vu
`(74) Attorney, Agent, or Firm Harness, Dickey & Pierce,
`P.L.C.
`
`(57)
`
`ABSTRACT
`
`An electrooptic device is provided that comprises an elec
`trooptic panel having an image display region for displaying
`an image and an interface Substrate connected to the elec
`trooptic panel via a connection part. The interface Substrate
`has a folding part folded at the connection part toward a
`lower-Surface side of the electrooptic panel and projections
`extending from the folding part positioned at the lower
`Surface side of the electrooptic panel. The projections are
`folded toward a top-surface side of the electrooptic panel so
`that electronic parts of the projections are opposed to driver
`ICs that are mounted on an overhanging part of the elec
`trooptic panel.
`
`16 Claims, 15 Drawing Sheets
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`U.S. Patent
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`Jan. 9, 2007
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`Sheet 1 of 15
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`US 7,161,650 B2
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`Fig. 1
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`U.S. Patent
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`Jan. 9, 2007
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`Sheet 2 of 15
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`US 7,161,650 B2
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`Fig. 2a
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`Sheet 3 of 15
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`U.S. Patent
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`Jan. 9, 2007
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`Sheet 4 of 15
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`US 7,161,650 B2
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`U.S. Patent
`Fig. 4
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`START
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`CONNECT DISPLAY SUBSTRATE
`1) TO INTERFACE SUBSTRATE
`20
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`HOUSE LIGHT GUIDE PLATE 31
`IN CASE 32
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`INSER PROJECTIONS 23 AND 24
`BETWEEN CTOUT PARTS 32e AND
`PROJECTIONS 3 lb AND 3 c.
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`FX INTERFACE SUBSTRATE 20
`TO LIGHT GUIDE PLATE 31
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`O
`HOUSE DISPLAY SUBSTRATE 10
`IN HOUSING 32a
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`FOLD PROJECTIONS 23 AND 24 TOWARD
`TOP-SURFACE SIDE OF DISPLAY
`SUBSTRATE 1)
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`ST1
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`ST3
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`ST4
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`ST5
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`ST6
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`ST7
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`PROVIDE ELECTRONIC PARTS 28 SO
`AS TO FACE DRIVER CS 15, 6, AND
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`U.S. Patent
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`Jan. 9, 2007
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`Sheet 5 Of 15
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`US 7,161,650 B2
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`Fig. 5a
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`Sheet 6 of 15
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`Jan. 9, 2007
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`Sheet 7 Of 15
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`US 7,161,650 B2
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`Fig. 7
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`Sheet 8 of 15
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`U.S. Patent
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`Jan. 9, 2007
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`Sheet 9 Of 15
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`US 7,161,650 B2
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`Fig. 9a
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`Fig. 9b
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`Sheet 10 of 15
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`Sheet 13 of 15
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`US 7,161,650 B2
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`Fig. 13
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`CONNECT DISPLAY SUBSTRATE
`10 TO INTERFACE SUBSTRATE
`2O
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`HOUSE LIGHT GUIDE PLATE 31
`IN CASE 32"
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`HOUSE DISPLAY SUBSTRATE O.
`IN HOUSING 32a
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`FIX INTERFACE SUBSTRATE 20
`TO LIGHT GUIDE PLATE 31
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`FOLD PROJECTIONS 23 AND 24 TOWARD
`OP-SURFACESIDE OF DISPLAY
`SUBSTRATE 10
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`PROVIDE ELECTRONIC PARTS 28 SO
`AS TO FACE DRIVER ICS 15, 16, AND
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`Jan. 9, 2007
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`Fig. 15a
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`US 7,161,650 B2
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`1.
`ELECTRO-OPTIC DEVICE WITH FOLDED
`INTERFACE SUBSTRATE HAVING FOLDED
`PROJECTIONS WITH ELECTRONIC PARTS
`
`RELATED APPLICATIONS
`
`This application claims priority to Japanese Patent Appli
`cation No. 2003-179591 filed Jun. 24, 2003 which is hereby
`expressly incorporated by reference herein in its entirety.
`
`BACKGROUND
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`1. Technical Field of the Invention
`The present invention relates to an electrooptic device, a
`method for manufacturing the same, and an electronic
`apparatus. More specifically, the present invention relates to
`an electrooptic device having electronic parts mounted on an
`interface Substrate, the electronic parts being provided so as
`to face the top surface or lower surface of an electrooptic
`panel, a manufacturing method, and an electronic apparatus.
`2. Related Art
`A conventional electrooptic device such as a liquid-crystal
`display device comprises an electrooptic panel having an
`image display region including a plurality of pixels formed
`by a liquid crystal or the like, a driver circuit including a
`plurality of electronic parts required for driving the image
`display region, an interface Substrate for connecting the
`electrooptic panel to an electronic apparatus Such as a
`mobile phone, a light source for applying light to a light
`guide plate, and the light guide plate for emitting the light
`30
`applied from the light source to the image display region. A
`backlight functioning as the light source is mounted on the
`interface substrate and provided in a case in which the
`electrooptic device is housed. The backlight applies light
`onto the light guide plate housed in the case, and the light
`guide plate emits light to the image display region of the
`electrooptic panel. Hitherto, hard Substrates Such as glass
`substrates have been used, as the interface substrate.
`Recently, however, flexible substrates that can be easily
`deformed and that have high versatility of design, such as
`FPCs (Flexible Printed Circuits), heat seals, and so forth,
`have been used.
`The plurality of electronic parts forming the driver circuit
`includes a driver IC for Supplying a driving Voltage, a
`power-supply IC for Supplying a Voltage to the driver IC or
`the like, a control IC for controlling the driver IC and the
`power-supply IC. Of these electronic parts, the driver IC is
`mounted on the electrooptic panel and the other electronic
`parts (the power-supply IC, the control IC, and so forth) are
`mounted on the interface substrate. The other electronic
`parts are mounted near the light source mounted on the
`interface substrate.
`However, the part on which the light source of the
`interface substrate is to be mounted is a limited space formed
`by the case and the light guide plate. Therefore, it is difficult
`to mount the above-described and the other electronic parts
`on this space. Conventionally, therefore, other electronic
`parts are mounted on a part of the interface Substrate, where
`the part extends outside the electrooptic device. Therefore,
`the electrooptic device cannot be downsized. In the past,
`therefore, a technique for mounting the electronic parts Such
`as the power IC and the control IC on the driver IC was
`proposed, where the driver IC is directly mounted on an
`overhanging part provided on the electrooptic panel includ
`ing a pair of Substrates that are opposed to each other.
`According to this technique, a control-circuit Substrate
`with the power-supply IC, the control IC, and so forth, that
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`are mounted thereon is placed on the driver IC. Further, the
`control-circuit substrate and the driver IC are electrically
`connected to each other. However, according to the above
`described known technique, the control-circuit Substrate
`needs to be manufactured for each electrooptic panel with a
`different number of pixels or driver ICs mounted on over
`hanging parts at different positions. As a result, the number
`of procedures and the cost for manufacturing the electroop
`tic device increase. Further, the control-circuit substrate and
`the driver IC, or the electrooptic panel are connected by a
`number of wirings. In particular, where a plurality of the
`driver ICs are provided and electrically connected to the
`control-circuit Substrate at one position, the area of the
`overhanging part with the driver ICs mounted thereon may
`increase, allowing for spaces among the wiring. As a result,
`the area of the control-circuit Substrate may increase. Since
`the dimensions of the electrooptic device may increase, it
`may be difficult to downsize the entire electrooptic device.
`Further, since the control-circuit substrate is electrically
`connected only to the driver ICs, electronic parts other than
`those forming the driver circuit cannot be mounted on the
`control-circuit Substrate.
`Accordingly, an object of the present invention is to
`provide an electrooptic device that can be downsized and
`manufactured by reduced procedures and cost, a method for
`manufacturing the same, and an electronic apparatus.
`
`SUMMARY
`
`For achieving the above-described object, an electrooptic
`device according to one aspect comprises an electrooptic
`panel having an image display region for displaying an
`image and an interface Substrate connected to the electroop
`tic panel via a connection part. The interface Substrate has a
`folding part folded at the connection part toward a lower
`Surface side of the electrooptic panel and projections extend
`ing from the folding part positioned at the lower-surface side
`of the electrooptic panel. The projections are folded toward
`a top-surface side of the electrooptic panel so that electronic
`parts of the projections are opposed to the top surface of the
`electrooptic panel.
`An electrooptic device according to another aspect com
`prises an electrooptic panel having an image display region
`for displaying an image and an interface Substrate connected
`to the electrooptic panel via a connection part. The interface
`Substrate has a folding part folded at the connection part
`toward a lower-surface side of the electrooptic panel and
`projections extending from the folding part positioned at the
`lower-surface side of the electrooptic panel. The projections
`are folded toward the lower-surface side of the electrooptic
`panel so that electronic parts of the projections are opposed
`to the lower surface of the electrooptic panel.
`According to the above-described aspects, connection
`between the interface substrate and the electrooptic panel is
`achieved by using the connection part of the interface
`Substrate, and the electronic parts are provided on the
`projections that are folded toward the top-surface side or
`lower-surface side of the electrooptic panel, whereby the
`electronic parts are opposed to the top surface or lower
`Surface of the electrooptic panel. As a result, since the
`interface substrate does not need to be connected to the
`electrooptic panel, the projections may have any dimensions
`So long as the electronic parts can be mounted thereon.
`Therefore, the dimensions of the electrooptic device includ
`ing the electrooptic panel and the interface Substrate do not
`increase. Further, where the electronic parts of the projec
`tions are opposed to the top surface or lower surface of the
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`electrooptic panel, or particularly where the electrooptic
`panel includes a pair of Substrates and the electronic parts
`are opposed to an overhanging part provided between the
`substrates, the plurality of electronic parts can be provided
`on the top surface or lower surface of the electrooptic panel
`without increasing the thickness of the electrooptic device.
`Accordingly, the electrooptic device can be downsized.
`Further, where the connection part of the interface substrate
`can be connected to the electrooptic panel, the use of the
`single interface Substrate is adequate, even though the pixel
`number and the positions of the mounted driver ICs are
`changed. As a result, it becomes unnecessary to manufacture
`the interface substrate for each electrooptic panel with
`different shapes (the pixel number and the position of the
`mounted driver ICs). As a result, the number of procedures
`and cost for manufacturing the electrooptic device are
`prevented from being increased.
`Here, the electronic parts include not only electronic parts
`forming the driver circuit for driving the image display
`region of the electrooptic panel, that is, a driver IC for
`Supplying a driving Voltage to the image display region, a
`power-supply IC for Supplying a Voltage to the driver IC or
`the like, a control IC for controlling the driver IC and the
`power-supply IC, and so forth, but also other electronic
`parts. For example, where an LED functioning as a light
`source is mounted on the interface substrate, the other
`electronic parts include an electronic part for driving this
`LED and an electronic part required for an electronic appa
`ratus having an electrooptic device including the interface
`substrate. Further, the electrooptic panel is formed as a hard
`Substrate Such as a glass Substrate, or a flexible Substrate
`such as an FPC (Flexible Printed Circuit) or a heat seal. The
`interface substrate is formed as the flexible substrate such as
`the FPC or the heat seal. Further, any light source can be
`used as the light source so long as it can be mounted on the
`interface substrate. Therefore, the light source includes the
`LED or an electro-luminescence device.
`In an electrooptic device according to another aspect, the
`electrooptic panel has a driver IC mounted thereon for
`controlling image display of the image display region, and
`the projections are provided so as to face the driver IC.
`According to this aspect, the electronic parts of the
`projections are opposed to the driver IC mounted on the
`electrooptic panel, whereby the electronic parts can be
`provided on the driver IC mounted on the electrooptic panel
`without increasing the thickness of the electrooptic device.
`In an electrooptic device according to another aspect, the
`projections are provided on both sides of the interface
`Substrate. According to this aspect, the plurality of projec
`tions is formed on the interface substrate so that the elec
`tronic parts are opposed to the top Surface of the electrooptic
`panel. Therefore, compared to the case where the plurality of
`electronic parts is mounted on one projection, the number of
`wirings of the electronic parts formed on one of the projec
`tions becomes smaller, whereby the widths and dimensions
`of the projections can be reduced. As a result, it becomes
`possible to prevent the dimensions of the projections from
`being increased so as to become larger than those of the
`surface of the electrooptic panel. Particularly where the
`electrooptic panel is formed by the pair of substrates, the
`dimensions of the projections are prevented from being
`increased so as to become longer than those of the over
`hanging part provided between the pair of Substrates. There
`fore, the electrooptic device can further be downsized.
`In an electrooptic device according to another aspect, the
`electronic parts include a power-supply IC for applying
`power at least to the image display region of the electrooptic
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`panel. According to this aspect, the power-supply IC is
`mounted on the projection parts other than heat generation
`part of the interface Substrate, such as a part on which the
`LED functioning as the light source is mounted. Therefore,
`it becomes possible to reduce malfunctions caused by heat
`in the power-supply IC including a temperature compensa
`tion circuit and irregular display of the image display region.
`In an electrooptic device according to another aspect, the
`electronic parts are covered by an insulator layer. According
`to this aspect, the insulator layer is provided between the
`electronic parts of the projections and wiring formed on the
`top surface of the electrooptic panel, or the driver IC
`mounted thereon. As a result, it becomes possible to prevent
`the electronic parts of the projections from being electrically
`contacted with the wiring formed on the top surface of the
`electrooptic panel or the driver IC.
`As a result, it becomes possible to further prevent irregu
`lar display of the image display region caused by shorting of
`the electronic parts of the projections, the wiring on the top
`surface of the electrooptic panel, and the driver IC.
`In an electrooptic device according to another aspect, the
`electrooptic panel includes a pair of substrates with different
`dimensions and has an overhanging part formed by the pair
`of Substrates, and the projections are provided so as to face
`the overhanging part. According to this aspect, the electronic
`parts of the projections are opposed to the overhanging part
`of the electrooptic panel, whereby the plurality of electronic
`parts can be provided on the top surface of the electrooptic
`panel without increasing the thickness of the electrooptic
`device.
`As a result, the electrooptic device can be downsized.
`In an electrooptic device according to another aspect, the
`driver IC is mounted on the overhanging part of the elec
`trooptic panel, and the projections are fixed by fixing means
`so that a gap is provided between the electronic parts and the
`driver IC. According to this aspect, it becomes possible to
`prevent the electronic parts from being directly contacted
`with the driver IC by the gap formed between the electronic
`parts and the driver IC. As a result, irregular display of the
`image display region caused by shorting of the electronic
`parts or the driver IC can be reduced.
`In an electrooptic device according to another aspect, the
`fixing means is a double-sided tape having an insulation
`characteristic and provided between opposing Surfaces of
`the projections and the overhanging part. According to this
`aspect, the projections and the overhanging part are fixed to
`each other by using a double-sided tape with a predeter
`mined height (thickness). Therefore, it becomes possible to
`form a gap with a predetermined height between the elec
`tronic parts and the driver IC by adjusting the height of the
`double-sided tape. As a result, the gap can be easily formed
`between the electronic parts and the driver IC, and position
`ing of the projections with reference to the overhanging part
`can be easily performed. Further, since the double-sided tape
`has the insulation characteristic, the wiring of the electronic
`parts or the like formed on the projections and that of the
`driver IC formed on the top surface of the electrooptic panel
`are not electrically contacted with each other. As a result, it
`becomes possible to reduce irregular display of the image
`display region caused by shorting of the wiring formed on
`the projections and the wiring formed on the top Surface of
`the electrooptic panel.
`In an electrooptic device according to another aspect, the
`fixing means is an adhesive having an insulation character
`istic for fixing the electronic parts to the driver IC. Accord
`ing to this aspect, a gap is provided between the electronic
`parts and the driver IC by the adhesive having the insulation
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`characteristic. Since the adhesive having the insulation char
`acteristic exists between the electronic parts and the driver
`IC, the electronic parts are prevented from being directly
`contacted with the driver IC. As a result, it becomes possible
`to reduce irregular display of the image display region
`caused by shorting of the electronic parts, or the driver IC.
`An electrooptic device according to another aspect further
`comprises a case having a housing for housing the elec
`trooptic panel. A cutout part, where part of the projection
`folded toward the top-surface side of the electrooptic panel
`is placed, is provided on an inner-peripheral Surface of the
`case. According to this aspect, each of the projections is
`inserted into the cutout part provided in the inner-peripheral
`surface of the case and folded toward the top-surface side of
`the electrooptic panel. As a result, the protrusions do not
`protrude outside the outer-peripheral surface of the case,
`whereby the electrooptic device can further be downsized.
`Further, it becomes possible to prevent the projections from
`being damaged and prevent the wiring thereof from being
`shorted out when the electrooptic panel is housed in the case,
`for example. As a result, irregular display of the image
`display region caused by shorting of the wiring of the
`projections can further be reduced.
`An electrooptic device according to another aspect further
`comprises a light source provided on one of Surfaces of the
`interface Substrate and a light guide plate that is housed in
`the case and that receives light applied from the light Source
`and emits the applied light onto the image display region.
`One end of a side face of the light guide plate has a curved
`face, where the one end is opposed to the cutout part.
`According to this aspect, the end of a side of the light guide
`plate, where the end is opposed to the cutout part where a
`folding part used for folding the protrusions toward the
`top-surface side of the electrooptic panel is placed, has the
`curved face. Therefore, since the folding part of the projec
`tion is folded along the curved face, the folding part of the
`projection is prevented from being bulged outward from the
`lower Surface of the case. As a result, since the projections
`do not protrude outward from the lower surface of the case,
`the electrooptic device can further be downsized.
`An electrooptic device according to another aspect further
`comprises a case having a housing for housing the elec
`trooptic panel. A cutout part, where part of the projection
`folded toward the top-surface side of the electrooptic panel
`is placed, is provided on an outer-peripheral Surface of the
`case. According to this aspect, the projection is inserted into
`the cutout part provided in the outer-peripheral surface of the
`case and folded toward the top-surface side of the electroop
`tic panel. As a result, the protrusions do not protrude from
`the outer-peripheral surface of the case, whereby the elec
`trooptic device can further be downsized. Further, both ends
`of the cutout part of the case, where the folding part used for
`folding the projection toward the top-surface side of the
`electrooptic panel is placed at the cutout part, may prefer
`ably have a curved face. Since the folding part of the
`projection is folded along the curved face, the folding part
`of the projection is prevented from being bulged outward
`from the top surface or lower surface of the case.
`Further, an electronic apparatus according to another
`aspect has the electrooptic device according to the present
`aspect, whereby the electrooptic device can be downsized.
`Therefore, the electronic apparatus can be downsized.
`A method for manufacturing an electrooptic device
`according to another aspect comprises the steps of connect
`ing an electrooptic panel having an image display region for
`displaying an image to a connection part of an interface
`Substrate, folding a folding part of the interface Substrate at
`
`40
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`45
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`6
`the connection part toward a lower-surface side of the
`electrooptic panel, and folding projections extending from
`the folding part of the interface substrate toward a top
`Surface side of the electrooptic panel, so that electronic parts
`of the projections are opposed to the top Surface of the
`electrooptic panel.
`According to this aspect, connection between the inter
`face Substrate and the electrooptic panel is achieved by using
`the connection part of the interface substrate, and the elec
`tronic parts are provided on the projections that are folded
`toward the top-surface side of the electrooptic panel,
`whereby the electronic parts are opposed to the top surface
`of the electrooptic panel. As a result, since there is no need
`to use the projections for connecting the interface Substrate
`to the electrooptic panel, the projections may have any
`dimensions so long as the electronic parts can be mounted
`thereon. Therefore, the dimensions of the electrooptic device
`do not increase. Further, where the electronic parts of the
`projections are opposed to the top Surface of the electrooptic
`panel, or particularly where the electrooptic panel includes
`a pair of substrates and the electronic parts are opposed to an
`overhanging part provided between the Substrates, the plu
`rality of electronic parts can be provided on the top surface
`of the electrooptic panel without increasing the thickness of
`the electrooptic device.
`Accordingly, the electrooptic device can be downsized.
`Further, where the connection part of the interface substrate
`can be connected to the electrooptic panel, the use of the
`single interface Substrate is adequate, even though the pixel
`number and the positions of the driver ICs mounted on the
`overhanging part are changed. As a result, it becomes
`unnecessary to manufacture the interface Substrate for each
`of electrooptic panels with different shapes (the pixel num
`ber and the position of the mounted driver ICs). As a result,
`the number of procedures and cost for manufacturing the
`electrooptic device are prevented from being increased.
`A method for manufacturing an electrooptic device
`according to another aspect comprises the steps of connect
`ing an electrooptic panel having an image display region for
`displaying an image to a connection part of an interface
`Substrate having a light source mounted thereon, housing a
`light guide plate in a case, inserting a projection extending
`from a folding part of the interface substrate between a
`cutout part provided on an inner-peripheral Surface of the
`case and the light guide plate, fixing the interface Substrate
`to the light guide plate so that light emitted from the light
`Source is incident on the light guide plate, housing the
`electrooptic panel in a housing formed in the case by folding
`the electrooptic panel at the folding part, folding the pro
`jection toward a top-surface side of the electrooptic panel,
`and providing electronic parts of the projection, so as to be
`opposed to the top surface of the electrooptic panel.
`According to this aspect, connection between the inter
`face Substrate and the electrooptic panel is achieved by using
`the connection part of the interface substrate and the plu
`rality of electronic parts are provided on the projections that
`are folded toward the top-surface side of the electrooptic
`panel, whereby the electronic parts are opposed to the top
`Surface of the electrooptic panel. As a result, since the
`interface substrate does not need to be connected to the
`electrooptic panel, the projections may have any dimensions
`So long as the electronic parts can be mounted thereon.
`Therefore, the dimensions of the electrooptic device do not
`increase. Further, where the electronic parts of the projec
`tions are opposed to the overhanging part of the top surface
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`5
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`10
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`15
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`25
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`30
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`35
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`50
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`55
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`60
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`65
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`Ex.1012
`APPLE INC. / Page 19 of 25
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`7
`of the electrooptic panel, the thickness of the electrooptic
`device can be decreased. Accordingly, the electrooptic
`device can be downsized.
`Further, since the electrooptic device is assembled (manu
`factured) by inserting the projection of the interface sub
`strate into the cutout part, it becomes possible to prevent the
`projection from being damaged and the wiring of the pro
`jection from being shorted out when the electrooptic panel
`is housed in the case. As a result, irregular display of the
`image display region caused by shorting of the wiring of the
`projection can be reduced.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`FIG. 1 illustrates an example electrooptic panel and an
`example interface Substrate.
`FIGS. 2(a)-(b) also illustrate the example electrooptic
`panel and the example interface Substrate.
`FIGS. 3(a)-(c) illustrate an example light guide unit
`according to the present invention.
`FIG. 4 shows the assembly flow of an electrooptic device
`according to a first embodiment.
`FIGS. 5(a)-(b) illustrate assembly of the electrooptic
`device.
`FIGS. 6(a)-(b) further illustrate the assembly of the
`electrooptic device.
`FIG. 7 further illustrates the assembly of the electrooptic
`device.
`FIG. 8 further illustrates the assembly of the electrooptic
`device.
`FIGS. 9(a)-(b) further illustrate the assembly of the
`electrooptic device.
`FIGS. 10(a)-(c) include sectional views of the electroop
`tic device according to the first embodiment.
`FIGS. 11(a)-(c) show another example case according to
`the present invention.
`FIGS. 12(a)-(b) illustrate an example electrooptic device
`according to a second embodiment.
`FIG. 13 shows the assembly flow of the electrooptic
`device according to the second embodiment.
`FIGS. 14(a)-(b) show another example interface sub
`Strate.
`FIGS. 15(a)-(b) show another example interface sub
`Strate.
`
`DETAILED DESCRIPTION
`
`Embodiments of the present invention will now be
`described in detail with reference to the attached drawings.
`It should be noted that the present invention is not limited to
`these embodiments. An electrooptic device according to the
`present invention may be, for example, a liquid-crystal
`display, but is not limited thereto.
`First Embodiment
`FIGS. 1 and 2 illustrate an exemplary electrooptic panel
`and an exemplary interface Substrate. As shown in these
`drawings, an electrooptic panel 10 and an interface Substrate
`20 are mounted on an electronic apparatus Such as a mobile
`phone. The electrooptic panel 10 is a hard substrate such as
`a glass Substrate and has an image display region 11. This
`image display region 11 includes a plurality of pixels. Where
`the electrooptic device is a liquid-crystal display, for
`example, the electrooptic panel 10 has two substrates includ
`ing a first electrooptic panel 10a and a second electrooptic
`panel 10b. A liquid crystal is filled between these two
`Substrates by using a sealing material (not shown). Further,
`polarization plates 12 and 13 are provided on and under the
`
`US 7,161,650 B2
`
`8
`image display region 11, so as to polarize light of LEDs 27
`of a light source 26 that will be described later.
`The first electrooptic panel 10a is longer than the second
`electrooptic panel 10b in the longitudinal direction, whereby
`an overhanging part 14 is formed. This overhanging part 14
`has driver ICS 15 to 17 mounted thereon. The driver ICS 15
`to 17 form a driver circuit for driving the image display
`region 11. Input terminals (not shown) of the driver ICs 15
`to 17 are electrically connected to wiring of the driver ICs
`15 to 17 formed on the overhanging section 14 of the
`electrooptic panel 10 via an AFC (Anisotropic Conductive
`Film). That is to say, this electrooptic device has a COG
`(Chip