USOO9360456B2
`
`(12) United States Patent
`Miyamoto
`
`(10) Patent No.:
`(45) Date of Patent:
`
`US 9,360,456 B2
`Jun. 7, 2016
`
`(54) DETECTINGAPPARATUS, POWER
`RECEIVINGAPPARATUS, POWER
`TRANSMITTINGAPPARATUS, AND
`CONTACTLESS POWER SUPPLY SYSTEM
`
`(71) Applicant: Sony Corporation, Tokyo (JP)
`
`(72) Inventor: Takashi Miyamoto, Chiba (JP)
`
`(73) Assignee: Sony Corporation, Tokyo (JP)
`
`(*) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 553 days.
`
`(21) Appl. No.: 13/789,108
`
`(22) Filed:
`
`Mar. 7, 2013
`
`(65)
`
`Prior Publication Data
`US 2013/02413OO A1
`Sep. 19, 2013
`
`(30)
`
`Foreign Application Priority Data
`
`Mar. 14, 2012 (JP) ................................. 2012-057538
`
`(2006.01)
`(2006.01)
`(2006.01)
`
`(51) Int. Cl.
`GOIN 27/72
`HOIF 38/14
`HOIF 5/00
`(52) U.S. Cl.
`CPC ................ G0IN 27/72 (2013.01); H0IF5/003
`(2013.01); H0IF38/14 (2013.01)
`(58) Field of Classification Search
`CPC ........... H02J 5/005; H02J 7/025; H02J 17/00;
`H01F 38/14: B60L 11/182: G01N 27/00;
`G01N 27/72; H04B5/0037; H04B5/0087
`USPC .......................................................... 307/104
`See application file for complete search history.
`
`(56)
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`2008.0024255 A1
`
`8,957,549 B2 * 2/2015 Kesler ........................... 307/104
`9,106,203 B2 * 8/2015 Kesler ...................... HO3H 7/40
`2006/0049928 A1* 3/2006 Ening ................ GO6K 7/10336
`340/448
`2007/O12063.6 A1* 5/2007 Chen ......................... HO1F 3/14
`336,178
`2007/014583.0 A1* 6/2007 Lee ......................... HO2J 5,005
`307 135
`1/2008 Sano ..................... HO1F 27/255
`335/.297
`2012fO256494 A1* 10/2012 Kesler ...................... HO3H 7/40
`307/104
`2013/0069441 A1* 3/2013 Verghese ............... GOR 33/10
`307/104
`2013/0093257 A1* 4/2013 Goto ....................... HO2J 5,005
`307/104
`2013/0207763 A1* 8/2013 Wagoner ................. HO1F 27/22
`336/60
`
`FOREIGN PATENT DOCUMENTS
`
`10, 2001
`9, 2008
`
`JP
`2001-275280
`JP
`2008-206231
`* cited by examiner
`Primary Examiner — Thienvu Tran
`Assistant Examiner — Brian K Baxter
`(74) Attorney, Agent, or Firm — Chip Law Group
`(57)
`ABSTRACT
`There is provided a detecting apparatus including one or a
`plurality of magnetic coupling elements that include a plural
`ity of coils, a positioning unit disposed near at least one coil
`from among the plurality of coils included in the one or
`plurality of magnetic coupling elements, and a detector that
`measures an electrical parameter related to the one or plural
`ity of magnetic coupling elements or to a circuit that at least
`includes the one or plurality of magnetic coupling elements,
`and determines from a change in the electrical parameter
`whether a foreign matter capable of generating heat due to
`magnetic flux is present.
`15 Claims, 19 Drawing Sheets
`
`A
`FIRST EXAMPLE
`
`4. MAGNETIC SHIELDING MATERIAL
`
`DETECTOR COIL
`L3
`
`
`
`3 2- 3 1
`
`2
`
`4 1
`
`B
`FIRST EXAMPLE
`(INSIDE DIAMETER
`OF2>
`INSIDEDIAMETER
`OFL3)
`
`DETECTOR COIL
`
`3
`
`Ex.1013
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`

`

`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 1 of 19
`
`US 9,360,456 B2
`
`FIG. 1
`
`
`
`V2
`
`FIG. 2
`
`100 CONTACTLESS POWER
`SUPPLY SYSTEM
`
`ELECTRONIC DEVICE
`20A
`
`
`
`2OBELECTRONIC DEVICE
`
`10 POWER SUPPLY
`APPARATUS
`
`Ex.1013
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`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 2 of 19
`
`US 9,360,456 B2
`
`FIG. 3
`1 O CONTACTLESS POWER SUPPLY SYSTEM
`
`227, 2 powerRECEIVING 3 FOREIGNATER
`DETECTING
`S APPARATUS
`
`RECTIFIERCIRCUIT-2 4
`
`MPEDANCE
`MATCHING CIRCUIT
`
`2 3
`
`RESONANT
`CAPACTOR
`
`C 2
`
`g
`
`2 2
`
`CIRCUIT Eye 3
`
`CONTROLLER
`
`3 2
`
`FOREIGN MATTER
`DETECTOR
`CIRCUIT
`
`RESONANT
`CAPACTOR
`
`C 3
`
`L 3
`
`RECEIVER
`DETECTOR COIL
`|- TTTT-i- TT --
`P 1CONTACTLESS.
`UNIDIRECTIONAL
`(POWERSUPPLY
`POWERSUPPLY
`COMMUNICATION
`SAPPARATUS
`-----------------
`1 2
`
`:
`
`
`
`TRANSMITTER
`
`RESONANT
`CAPACTOR
`IMPEDANCE
`MATCHING CIRCUIT
`
`:
`:
`
`CONSOLFR
`CIRCUIT
`
`DETECTOR CIRCUIT
`
`HIGH-FREQUENCY
`POWER GENERATORh 1 3
`CIRCUIT
`-------------------------------------- S
`1 POWERTRANSMITTINGAPPARATUS
`
`POWER SOURCE
`
`9
`
`Ex.1013
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`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 3 of 19
`
`US 9,360,456 B2
`
`FIG. 4
`
`
`
`A
`
`B
`
`g
`
`O
`
`C
`
`L 3-
`
`v.
`
`|
`
`-- C 3 - 2
`
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`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 4 of 19
`
`US 9,360,456 B2
`
`FIG. 5
`
`
`
`2 2RECEIVER
`
`L 2RECEIVER COIL
`
`MAGNETIC FIELDLINES PRODUCED
`FROM TRANSMITTER COILL1
`
`Ex.1013
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`

`

`U.S. Patent
`U.S. Patent
`
`US 9,360,456 B2
`US9,360,456 B2
`
`FIG. 6
`FIG. 6
`
`DETECTOR COIL
`L 3
`
`L323
`
`-H+
`
`<
`
`E.
`
`oO
`
`
`
`
`
`
`
`
`
`
`
`MsoSL
`
`—!
`
` < [=
`
`K
`
`
`
`Ex.1013
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`

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`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 6 of 19
`
`US 9,360,456 B2
`
`
`
`4
`
`FIG. 8
`
`- a
`
`w
`
`f
`
`(XX) Y OOOO)
`'
`'
`',
`
`a st
`
`x
`
`\ Y n
`
`s
`
`- r
`
`
`
`A
`SPIRAL SHAPE
`
`B
`FIGURE 8 SHAPE '
`
`
`
`-
`
`(XXX
`-
`
`rar
`
`Ex.1013
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`

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`U.S. Patent
`
`Jun.7, 2016
`
`Sheet 7 of 19
`
`US 9,360,456 B2
`
`FIG. 9
`
`a K
`
`K21
`
`22
`
`pee IT,
`K22
`y
`K21
`
`
`
`L3
`
`K22
`
`y
`
`K21
`
`DETECTOR COIL
`
`Q FACTOR OF
`
`ABSENT
`
`PRESENT
`
`PRESENCE OR ABSENCE OF POSITIONING UNIT K21
`AND POSITIONING UNIT K22
`
`Ex.1013
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`

`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 8 of 19
`
`US 9,360,456 B2
`
`FIG. 11
`
`32 31
`
`
`
`: 2
`
`:: 2
`41
`
`FIG. 12
`
`
`
`y
`
`L32 31
`
`K3b
`
`
`
`
`
`NY
`
`41
`
`FIG. 13
`
`32
`
`52
`
`51
`
`53
`
`Ex.1013
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`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 9 Of 19
`
`US 9,360,456 B2
`
`A
`
`B
`
`FIG. 14
`
`L32
`
`L3A
`r
`
`L3
`
`o
`
`L33
`
`L32
`
`L34
`
`L3B
`y
`
`L3
`
`so
`
`Ex.1013
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`

`

`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 10 of 19
`
`US 9,360,456 B2
`
`FIG. 15
`
`
`
`Ex.1013
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`

`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 11 of 19
`
`US 9,360,456 B2
`
`FIG. 16
`
`53
`
`51
`
`52
`
`L32
`
`(x)
`
`52
`
`51
`
`53
`
`53
`
`51
`
`52
`
`L32
`
`52
`
`51
`
`53
`
`61
`
`3-2
`
`11
`
`L3
`
`11
`L3
`
`62
`
`L3-2
`11
`
`L3-1
`11
`L31
`
`Ex.1013
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`

`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 12 of 19
`
`US 9,360,456 B2
`
`FIG. 17
`
`
`
`Ex.1013
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`

`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 13 Of 19
`
`US 9,360,456 B2
`
`
`
`a- Z3
`%
`%
`
`
`
`
`
`2
`
`70 FOREIGN METAL
`
`L3-9-2
`
`L3-10-2
`
`Ex.1013
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`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 14 of 19
`
`US 9,360,456 B2
`
`FIG. 19
`
`L3-3-1
`
`22C RECEIVER
`
`A
`
`L3-4-1 L3-7-1
`
`
`
`L3-4-2 L3-2-2
`
`22C RECEIVER
`
`L3-7-2
`B L3-5-2
`
`L3-9-2
`
`L3-6-1
`
`L3-1-2
`
`L3-3-2
`
`L3-6-2
`
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`U.S. Patent
`
`Jun. 7, 2016
`Sheet 15 Of 19
`FIG. 20
`L3 y
`
`L31
`
`32
`
`US 9,360,456 B2
`
`(X)
`
`O
`
`FIG. 21
`
`L3
`y
`
`31
`
`L32
`
`K22
`
`K21
`
`FIG. 22
`
`L3
`y
`
`31
`
`L32
`
`K22
`
`K21a
`
`Ex.1013
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`U.S. Patent
`
`Jun. 7, 2016
`
`Sheet 16 of 19
`
`US 9,360,456 B2
`
`FIG. 23
`
`L32
`
`y L31
`
`K22
`
`FIG. 24
`
`L3
`y L3
`
`L32
`
`K22
`
`Ex.1013
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`

`U.S. Patent
`U.S. Patent
`
`
`
`FIG. 25
`
`FIG. 25
`
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`U.S. Patent
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`Jun. 7, 2016
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`Sheet 18 of 19
`
`US 9,360,456 B2
`
`FIG. 27
`
`
`
`FOREIGN MATTER
`DETECTION ACCURACY
`
`--->e -- WITHOUT POSITIONING
`UNITSK2
`-- WITH POSITIONING
`UNITSK2
`
`POSITION OF FOREIGN MATTER WITH
`RESPECT TO DETECTOR COILL3
`
`FIG. 28
`
`
`
`VOLTAGE mV. hihihihih-hihihihih
`t
`:
`:
`:
`TIME us
`
`- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
`
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`U.S. Patent
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`Jun. 7, 2016
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`Sheet 19 Of 19
`
`US 9,360,456 B2
`
`VOLTAGE mV.
`
`
`
`
`
`TIME us
`
`FIG. 30
`
`VOLTAGE mV.
`
`i
`---. +------------------------
`--
`
`i
`
`- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
`
`TIME us
`
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`

`US 9,360,456 B2
`
`1.
`DETECTINGAPPARATUS, POWER
`RECEIVINGAPPARATUS, POWER
`TRANSMITTINGAPPARATUS, AND
`CONTACTLESS POWER SUPPLY SYSTEM
`
`CROSS REFERENCES TO RELATED
`APPLICATIONS
`
`The present application claims priority to Japanese Priority
`Patent Application.JP 2012-057538 filed in the Japan Patent
`Office on Mar. 14, 2012, the entire content of which is hereby
`incorporated by reference.
`
`10
`
`BACKGROUND
`
`2
`This risk is not limited to electromagnetic induction-based or
`magnetic resonance-based systems. Such heat generation in
`foreign matter may lead to currents being produced in a
`foreign metal due to the magnetic flux passing through the
`foreign metal (eddy currents, current loops, circular cur
`rents), or to hysteresis loss being produced in a foreign mag
`netized body or foreign magnet due to the magnetic flux
`passing through the foreign magnetized body or foreign mag
`net.
`A large number of techniques that detect foreign metal by
`adding a foreign matter detection system to a contactless
`power Supply system have been proposed for Such thermal
`regulation. For example, techniques using an optical sensor or
`a temperature sensor have been proposed. However, detection
`methods that use sensors may be costly in the case of a broad
`power Supply range, as with magnetic resonance-based sys
`tems. Moreover, use of a temperature sensor, for example,
`may impose additional design constraints on the transmitting
`and receiving devices, since the output results from the tem
`perature sensor will depend on its Surrounding thermal con
`ductivity.
`Thus, there have been proposed techniques that determine
`the presence of foreign metal by looking at changes in param
`eters (such as current and Voltage) when a foreign metal
`comes between the transmitter and receiver. With such tech
`niques, it is possible to curtail costs without imposing design
`or other constraints.
`For example, JP 2008-206231 A proposes a method of
`detecting foreign metal according to the modulation rate (in
`formation on amplitude and phase changes) during commu
`nication between the transmitter and receiver, while JP 2001
`275280A proposes a method of detecting foreign metal
`according to eddy current loss (foreign matter detection
`according to DC-DC efficiency).
`
`SUMMARY
`
`However, the techniques proposed in JP 2008-206231A
`and JP 2001-275280A do not take into account the effects of
`a metal housing at the receiver. Consider the case of charging
`a typical portable device. It is highly probably that some kind
`of metal (Such as a metal housing or metal components) is
`used in the portable device, and thus it is difficult to clearly
`determine whether a change of parameters is due to the effects
`of the metal housing or components, or due to the presence of
`foreign metal. To take JP 2001-275280A as an example, it is
`indeterminate whether eddy current loss occurs because of
`the metal housing of the portable device, or because foreign
`metal is present between the transmitter and receiver. In this
`way, it can hardly be said that the techniques proposed in JP
`2008-206231A and JP 2001-275280A are able to accurately
`detect foreign metal.
`Being devised in light of the above circumstances, an
`embodiment according to the embodiment of the present
`disclosure detects foreign matter in close proximity to a
`detector coil (in other words, a magnetic coupling element)
`without providing an additional sensor, and furthermore
`improves detection accuracy.
`According to an embodiment of the present disclosure,
`there is provided a detecting apparatus including one or a
`plurality of magnetic coupling elements that include a plural
`ity of coils, a positioning unit disposed near at least one coil
`from among the plurality of coils included in the one or
`plurality of magnetic coupling elements, and a detector that
`measures an electrical parameter related to the one or plural
`ity of magnetic coupling elements or to a circuit that at least
`includes the one or plurality of magnetic coupling elements,
`
`15
`
`25
`
`30
`
`35
`
`40
`
`The present disclosure relates to a magnetic coupling ele
`ment that magnetically couples with another magnetic cou
`pling element or foreign matter, and to an apparatus (mag
`netic coupling apparatus) and System (magnetic coupling
`system) utilizing Such a magnetic coupling element.
`More particularly, the present disclosure relates to a detect
`ing apparatus, a power receiving apparatus, a power transmit
`ting apparatus, and a contactless power Supply system con
`figured to detect the presence of foreign matter (Such as metal,
`a magnetized body, or magnet) which may generate heat due
`to magnetic flux between a contactless power Supplying appa
`ratus and an electronic device constituting a contactless
`power Supply system.
`Recently, increasing attention is being given to power Sup
`ply systems that Supply power (transfer power) to a consumer
`electronics (CE) device, such as a mobile phone or portable
`music player, for example, in a contactless manner (referred
`to as contactless power Supply systems or contactless power
`transfer systems, for example). With Such systems, charging
`is initiated not by inserting (connecting) the connector of an
`AC adapter or other power Supply apparatus into a CE device,
`but rather by simply placing an electronic device (the second
`ary device) onto a charging tray (the primary device). In other
`words, a terminal connection between the electronic device
`and the charging tray is unnecessary.
`Electromagnetic induction is established as a technique for
`Supplying power in a contactless manner as above. Mean
`while, contactless power Supply systems using a technique
`called magnetic resonance which utilizes the resonance phe
`nomenon have been gaining attention recently.
`45
`Contactless power Supply systems using magnetic reso
`nance are advantageous in that the principle of the resonance
`phenomenon may be utilized to transfer power between
`devices separated by greater distances than those of electro
`magnetic induction. Additionally, there is an advantage in that
`the transfer efficiency (power supply efficiency) does not fall
`significantly even if the axis alignment between the power
`Source (transmitter coil) and power recipient (receiver coil) is
`Somewhat poor. However, magnetic resonance-based sys
`tems and electromagnetic induction-based systems are alike
`in that both are contactless power Supply systems (magnetic
`coupling systems) utilizing a power source (transmitter coil;
`a magnetic coupling element) and a power recipient (receiver
`coil; a magnetic coupling element).
`Meanwhile, one important element in contactless power
`Supply systems is the thermal regulation of foreign matter,
`Such as metals, magnetized bodies, and magnets, which may
`generate heat due to magnetic flux. If foreign matter becomes
`interposed in the gap between the transmitter coil and the
`receiver coil when Supplying power in a contactless manner,
`there is a risk of causing the foreign matter to generate heat
`due to the magnetic flux passing through that foreign matter.
`
`50
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`55
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`60
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`65
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`US 9,360,456 B2
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`3
`and determines from a change in the electrical parameter
`whether a foreign matter that generates heat due to magnetic
`flux is present.
`According to an aspect of the present disclosure, it is pos
`sible to reliably affix a magnetic coupling elementata desired
`position with respect to a contactless power Supply coil by
`disposing positioning units in the vicinity of at least one coil
`from among multiple coils constituting the magnetic cou
`pling element. Thus, detection accuracy variations among
`individual foreign matter detecting apparatus is mitigated.
`According to at least one aspect of the present disclosure, it
`is possible, without providing an additional sensor, to detect
`foreign matter which is in close proximity to a magnetic
`coupling element and which may generate heat due to mag
`netic flux, and furthermore greatly improve detection accu
`15
`racy.
`Additional features and advantages are described herein,
`and will be apparent from the following Detailed Description
`and the figures.
`
`10
`
`BRIEF DESCRIPTION OF THE FIGURES
`
`4
`FIG. 13 is a plan view illustrating an exemplary configu
`ration of a figure 8-shaped detector coil according to a first
`modification of the first through third embodiments of the
`present disclosure;
`FIG. 14 is an explanatory diagram illustrating an exem
`plary configuration of a square grid-shaped detector coil
`according to a second modification of the first through third
`embodiments of the present disclosure, where FIG. 14A is a
`plan view illustrating a first example, and FIG. 14B is a plan
`view illustrating a second example:
`FIG. 15 is a plan view illustrating an exemplary configu
`ration of a lattice-shaped detector coil according to a third
`modification of the first through third embodiments of the
`present disclosure;
`FIG.16 is an explanatory diagram for a detector coil unit in
`which two figure 8-shaped detector coils are disposed accord
`ing to a fourth modification of the first through third embodi
`ments of the present disclosure, where FIG. 16A is a plan
`view illustrating a first example, and FIG.16B is a plan view
`illustrating a second example;
`FIG. 17 is an explanatory diagram for exemplary detector
`coil arrangements according to a fifth modification of the first
`through third embodiments of the present disclosure, where
`FIGS. 17A, 17B, and 17C are plan views illustrating an
`example of a receiver coil, an example in which multiple
`detector coils are disposed on top of the receiver coil, and an
`example in which some detector coils are disposed in the
`center of the receiver coil, respectively;
`FIG. 18 is an explanatory diagram for exemplary detector
`coil arrangements according to a sixth modification of the
`first through third embodiments of the present disclosure,
`where FIGS. 18A, 18B, and 18C are plan views illustrating an
`example of a receiver coil and foreign metal, an example in
`which multiple detector coils are disposed on top of the
`receiver coil, and an example in which multiple detector coils
`are additionally disposed on top of the multiple detector coils
`in FIG. 18B, respectively:
`FIG. 19 is an explanatory diagram for exemplary detector
`coil arrangements according to a seventh modification of the
`first through third embodiments of the present disclosure,
`where FIGS. 19A and 19B are plan views illustrating an
`example in which multiple detector coils are disposed on top
`of the receiver coil, and an example in which multiple detec
`tor coils are additionally disposed on top of the multiple
`detector coils in FIG. 19A, respectively;
`FIG. 20 is a plan view illustrating a detector coil in a state
`where positioning units are not disposed;
`FIG.21 is an explanatory diagram according to an example
`of the fourth embodiment of the present disclosure, and is a
`plan view illustrating an example of the case of disposing two
`positioning units;
`FIG. 22 is an explanatory diagram according to another
`example of the fourth embodiment of the present disclosure,
`and is a plan view illustrating an example of the case of
`modifying the size of either one of two positioning units;
`FIG. 23 is an explanatory diagram according to another
`example of the fourth embodiment of the present disclosure,
`and is a plan view illustrating an example of the case of
`modifying the position of either one of two positioning units:
`FIG. 24 is an explanatory diagram according to another
`example of the fourth embodiment of the present disclosure,
`and is a plan view illustrating an example of the case of not
`disposing one of two positioning units;
`FIG.25 is a graph illustrating an example of the difference
`in the L value of a detector coil according to whether or not
`positioning units are present;
`
`FIG. 1 is a schematic circuit diagram accompanying an
`explanation of Q factor measurement used as an example of
`foreign metal detection according to an embodiment of the
`present disclosure;
`FIG. 2 is a diagrammatic exterior illustration of a contact
`less power Supply system according to the first embodiment
`of the present disclosure;
`FIG. 3 is a block diagram illustrating an exemplary con
`figuration of a contactless power Supply system according to
`the first embodiment of the present disclosure:
`FIGS. 4A to 4C are circuit diagrams illustrating exemplary
`configurations of a resonant circuit;
`FIG. 5 is a schematic diagram of an exemplary diagram
`matic configuration of a transmitter coil and a receiver coil in
`a contactless power Supply system according to the first
`embodiment of the present disclosure;
`FIG. 6 is an explanatory diagram illustrating an exemplary
`detailed configuration of a detector coil and receiver coil
`according to the first embodiment of the present disclosure,
`where FIG. 6A illustrates an exemplary perspective view
`configuration and FIG. 6B illustrates an exemplary plan view
`configuration including positioning units;
`FIG. 7 is a plan view illustrating an exemplary configura
`tion (exemplary X-Y plan view configuration) of a detector
`coil and a receiver coil according to a comparative example:
`FIG. 8A is a diagrammatic cross-section view regarding a
`spiral-shaped coil and the distribution of magnetic field lines
`produced from that coil, while FIG. 8B is a diagrammatic
`cross-section view regarding a figure 8-shaped coil according
`to an embodiment of the present disclosure and the distribu
`tion of magnetic field lines from that coil;
`FIGS. 9A to 9D are explanatory diagrams illustrating
`manufacturing stages for a detector coil and a receiver coil
`according to the first embodiment of the present disclosure;
`FIG. 10 is a graph illustrating an example of the difference
`in the Q factor of a detector coil according to whether or not
`two positioning units are present;
`FIG. 11 is a diagrammatic cross-section view illustrating
`an exemplary configuration of a detector coil and a receiver
`coil according to the second embodiment of the present dis
`closure;
`FIG. 12 is a diagrammatic cross-section view illustrating
`an exemplary configuration of a detector coil and a receiver
`coil according to the third embodiment of the present disclo
`Sure;
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`US 9,360,456 B2
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`FIG. 26 is a graph illustrating an example of the difference
`in the Q factor of a detector coil according to whether or not
`positioning units are present;
`FIG. 27 is a graph illustrating an exemplary relationship
`between the position of foreign matter with respect to a detec
`tor coil, and the foreign matter detection accuracy;
`FIG. 28 is a waveform diagram illustrating an example of a
`waveform of Voltage (voltage waveform) produced in an LC
`resonator including a detector coil and a resonant capacitor, in
`the case where there is a small difference in the electrical
`properties between the two coils constituting the detector
`coil;
`FIG. 29 is a waveform diagram illustrating an example of a
`waveform of Voltage (voltage waveform) produced in an LC
`resonator including a detector coil and a resonant capacitor, in
`the case where there is a large difference in the electrical
`properties between the two coils constituting the detector
`coil; and
`FIG.30 is a waveform diagram illustrating an example of a
`waveform of Voltage (voltage waveform) produced in an LC
`resonator including a detector coil and a resonant capacitor, in
`the case where there is a very large difference in the electrical
`properties between the two coils constituting the detector
`coil.
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`DETAILED DESCRIPTION
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`Hereinafter, preferred embodiments of the present disclo
`sure will be described in detail with reference to the appended
`drawings. Note that, in this specification and the appended
`drawings, structural elements that have Substantially the same
`function and structure are denoted with the same reference
`numerals, and repeated explanation of these structural ele
`ments is omitted.
`Hereinafter, the description will proceed in the following
`order.
`1. Introductory explanation
`2. First embodiment (positioning units: example of detec
`tor coil and receiver coil disposed in same plane)
`3. Second embodiment (positioning units: example of
`40
`detector coil and receiver coil not disposed in same plane)
`4. Third embodiment (positioning units: example of posi
`tioning receiver coil before detector coil)
`5. Fourth embodiment (positioning units: example of
`adjusting electrical properties)
`45
`6. Other
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`1. Introductory Explanation
`
`6
`(Q factor). The Q factor is an indeX expressing the relation
`ship between energy storage and loss, and is typically used as
`a factor expressing the sharpness of the resonance peak (in
`other words, the resonance strength) in a resonant circuit.
`Note that although the descriptions of the respective
`embodiments of the present disclosure in this specification
`cite the detection of foreign metal as an example, the detec
`tion of other foreign matter (Such as foreign magnetized bod
`ies and foreign magnets) is also similar.
`IQ Factor Measurement Principle
`Hereinafter, the principle of Q factor measurement will be
`described with reference to the drawings.
`FIG. 1 is a schematic circuit diagram accompanying an
`explanation of Q factor measurement used for foreign metal
`detection according to an embodiment of the present disclo
`SUC.
`The circuit illustrated in FIG. 1 is an example of a basic
`circuit layout (for the case of magnetic coupling) illustrating
`the principle of Q factor measurement. The circuit is provided
`with a signal source 1, which includes an alternating current
`(AC) power source 2 that produces an AC signal (sine wave)
`and a resistive element 3, as well as a capacitor 4 and a coil 5.
`The resistive element 3 is an illustration of the internal resis
`tance (output impedance) of the AC power source 2. The
`capacitor 4 and the coil 5 are connected to the signal source 1
`So as to form a series resonant circuit (one example of a
`resonant circuit). The resonant circuit resonates at a given
`frequency (the resonant frequency) according to the capaci
`tance value (C value) of the capacitor 4 and the inductance
`value (L value) of the coil 5.
`Although FIG. 1 illustrates a circuit provided with a series
`resonant circuit realized with a coil 5 and a capacitor 4.
`various layouts are conceivable for the detailed configuration,
`insofar as resonant circuit functionality is provided.
`If foreign metal, such as a metal fragment, for example, is
`present near the coil 5, the magnetic field lines will pass
`through the metal fragment, and eddy currents will be pro
`duced in the metal fragment. From the perspective of the coil
`5, the metal fragment and the coil 5 are magnetically coupled
`and it appears as though a resistive load has been attached to
`the coil 5, changing the Q factor of the coil (resonant circuit).
`Measuring the Q factor thus leads to detection of foreign
`metal near the coil 5 (in other words, a magnetically coupled
`state).
`At this point, take V1 to be the voltage across the ends of the
`coil 5 and the capacitor 4 constituting the series resonant
`circuit (an example of Voltage applied to a resonant circuit),
`and take V2 to be the voltage across the ends of the coil 5. In
`this case, the Q factor of the series resonant circuit is
`expressed as in Eq. 1, where R is the effective resistance value
`(series resistance value) for the frequency fof the circuit, L is
`the inductance value, and C is the capacitance value. When
`V2>V1, the equation may be approximated as follows.
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`In the present disclosure, there is proposed a magnetic
`coupling system that detects foreign matter on the basis of an
`electrical parameter for a circuit at a transmitter or a receiver
`when charging a component such as a battery in the receiver
`(secondary device) with power supplied from the transmitter
`(primary device). In a magnetic coupling system according to
`an embodiment of the present disclosure, an electrical param
`eter is measured for a circuit in a transmitter or a receiver, the
`circuit at least including one or multiple magnetic coupling
`elements which magnetically couple with an external element
`and which are realized with multiple coils. The presence of
`foreign matter in close proximity to the magnetic coupling
`element is then determined on the basis of the electrical
`parameter measurement results.
`Hereinafter, a description will be given using, as an
`example, the case where the above circuit at least including a
`magnetic coupling element is a resonant circuit, while in
`addition, the above electrical parameter is the quality factor
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`V2 - V1 V2
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`(1)
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`In the circuit illustrated in FIG. 1, the voltage V2 is
`obtained by multiplying the voltage V1 by a factor of approxi
`mately Q. It is established that the series resistance value R
`and the inductance value L indicated in Eq. 1 change as metal
`approaches or due to the effects of eddy currents produced in
`the metal. For example, if a metal fragment approaches the
`coil 5, the effective resistance value R increases, and the Q
`factor drops. In other words, since the Q factor of the resonant
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`circuit and the resonant frequency change greatly due to the
`effects of metal present in the vicinity of the coil 5, by detect
`ing such change it is possible to detect a metal fragment
`present near the coil 5. Additionally, such Q factor measure
`ment may be applied to the detection of foreign metal inter
`posed between a transmitter (primary device) and a receiver
`(secondary device).
`By conducting a foreign metal detection process using
`changes in the Q factor discussed above, it is possible to
`detect foreign metal with high accuracy for both electromag
`netic induction-based systems and magnetic resonance-based
`systems, and have the user remove the detected foreign metal.
`Overview of Technology According to the
`Embodiment of the Present Disclosure
`
`Meanwhile, another conceivable technique involves using
`a detector connected to a circuit including a coil (detector
`coil) that electromagnetically or magnetically couples with
`an external element to measure the Q factor of the circuit
`using an AC signal at a different frequency than the frequency
`of the AC signal flowing through the transmitter coil and the
`receiver coil.
`Also, as another example, a configuration in which the
`above detector coil used to measure the Q factor is separate
`from the transmitter coil and the receiver coil is also conceiv
`able.
`By using an AC signal at a different frequency than the
`frequency of the AC signal flowing through the transmitter
`coil and the receiver coil, AC signals for contactless power
`Supply are separable from AC signals for Q factor measure
`ment, and thus it becomes possible to measure the Q factor
`while contactless power Supply is in operation. In addition,
`accurate detection of foreign metal or other matter may be
`conducted even while contactless power Supply is in opera
`tion.
`However, the detector coil may be greatly affected by the
`magnetic flux (lines of magnetic force; a magnetic field) for
`contactless power Supply in the case of using a typical spiral
`shaped coil 5 as the detector coil that electromagnetically or
`magnetically couples with an external element. As a result,
`AC signals for Q factor measurement utilized in foreign mat
`ter detection may overlap AC signals for contactless power
`Supply, producing unwanted noise due to the contactless
`power Supply. As a result, foreign metal detection accuracy
`may decrease greatly.
`Also, the above detector coil is readily affected by the
`transmitter coil and receiver coil used for contactless power
`Supply, as well as by elements such as magnetic materials and
`metal inside the electronic device housing. Given this issue, if
`a typical spiral-shaped detector coil is packaged in a device
`Such as a contactless power Supply apparatus (hereinafter
`simply designated “power Supply apparatus) or electronic
`device, the Q factor of the detector coil, which is used as the
`basis value for determining the presence of foreign metal,
`may decrease greatly.
`Furthermore, foreign metal detection accuracy may
`change greatly depending on the configuration of the power
`Source (transmitter) and power recipient (receiver) in the
`contactless power Supply system.
`In this way, it has been difficult to obtain exact information
`for foreign matter detec