( 12 ) United States Patent
`An et al .
`
`US 10,804,740 B2
`( 10 ) Patent No .:
`( 45 ) Date of Patent :
`Oct. 13 , 2020
`
`US010804740B2
`
`( 54 ) WIRELESS POWER RECEIVER AND
`METHOD OF MANUFACTURING THE SAME
`( 71 ) Applicant : LG INNOTEK CO . , LTD . , Seoul ( KR )
`( 72 ) Inventors : Jeong Wook An , Seoul ( KR ) ; Jung Oh
`Lee , Seoul ( KR ) ; Sung Hyun Leem ,
`Seoul ( KR ) ; Yang Hyun Kim , Seoul
`( KR )
`( 73 ) Assignee : LG INNOTEK CO . , LTD . , Seoul ( KR )
`Subject to any disclaimer , the term of this
`( * ) Notice :
`patent is extended or adjusted under 35
`U.S.C. 154 ( b ) by 85 days .
`( 21 ) Appl . No .: 16 / 264,360
`( 22 ) Filed :
`Jan. 31 , 2019
`( 65 )
`Prior Publication Data
`US 2019/0165609 A1
`May 30 , 2019
`Related U.S. Application Data
`( 63 ) Continuation of application No. 15 / 430,173 , filed on
`Feb. 10 , 2017 , now Pat . No. 10,277,071 , which is a
`( Continued )
`Foreign Application Priority Data
`( 30 )
`( KR )
`Mar. 23 , 2012
`10-2012-0029987
`( KR )
`Jul . 19 , 2012
`10-2012-0079004
`( 51 ) Int . Cl .
`HO2J 50/10
`G06K 19/07
`
`( 2016.01 )
`( 2006.01 )
`( Continued )
`H02J 50/10 ( 2016.02 ) ; B60L 53/12
`( 2019.02 ) ; GO6K 19/0723 ( 2013.01 ) ;
`( Continued )
`
`( 52 ) U.S. Ci .
`CPC
`
`( 58 ) Field of Classification Search
`CPC HO2J 50/10 ; HO2J 50/12 ; HO2J 50/70 ; HO2J
`5/005 ; H02J 7/025 ; HO2J 5/00 ; HO2J
`7/02 ;
`
`( Continued )
`
`( 56 )
`
`CN
`CN
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`4,947,180 A
`5,574,470 A
`
`8/1990 Scholz
`11/1996 de Vall
`( Continued )
`FOREIGN PATENT DOCUMENTS
`
`1462413 A 12/2003
`1592986 A
`3/2005
`( Continued )
`
`OTHER PUBLICATIONS
`Office Action dated Feb. 2 , 2019 in Chinese Application No.
`201710325326.5 .
`
`( Continued )
`
`Primary Examiner Robert L Deberadinis
`( 74 ) Attorney , Agent , or Firm - Saliwanchik , Lloyd &
`Eisenschenk
`
`( 57 )
`ABSTRACT
`A wireless power receiver can include a magnetic substrate
`and a coil configured to wirelessly receive power . The coil
`can be formed as a conductive layer on the magnetic
`substrate . A connecting unit can be disposed in a receiving
`space of the magnetic substrate and can be connected to the
`coil unit .
`
`20 Claims , 21 Drawing Sheets
`
`100
`
`330 310 320
`300
`
`210 220 230
`200
`
`Ex.1001
`APPLE INC. / Page 1 of 36
`
`

`

`US 10,804,740 B2
`Page 2
`
`( 2016.01 )
`( 2016.01 )
`( 2006.01 )
`( 2016.01 )
`( 2019.01 )
`( 2006.01 )
`( 2016.01 )
`( 2006.01 )
`( 2018.01 )
`
`Related U.S. Application Data
`continuation of application No. 15 / 360,425 , filed on
`Nov. 23 , 2016 , now Pat . No. 10,270,291 , which is a
`continuation of application No. 13 / 663,012 , filed on
`Oct. 29 , 2012 , now Pat . No. 9,806,565 .
`( 51 ) Int . Cl .
`HO2J 5/00
`HO2J 7/02
`H04B 5/00
`HO2J 50/70
`BOOL 53/12
`HOIF 41/14
`HO2J 50/12
`HOIF 38/14
`H04W 4/80
`( 52 ) U.S. Ci .
`HOIF 38/14 ( 2013.01 ) ; HOIF 41/14
`CPC
`( 2013.01 ) ; H02J 5/005 ( 2013.01 ) ; HO2J 77025
`( 2013.01 ) ; H02J 50/12 ( 2016.02 ) ; HO2J 50/70
`( 2016.02 ) ; H04B 5/0037 ( 2013.01 ) ; H04B
`5/0081 ( 2013.01 ) ; H04W 4/80 ( 2018.02 ) ; YO2T
`10/7005 ( 2013.01 ) ; YO2T 10/7072 ( 2013.01 ) ;
`YO2T 90/122 ( 2013.01 ) ; YO2T 90/14 ( 2013.01 ) ;
`YO2T 90/16 ( 2013.01 ) ; Y10T 29/4902
`( 2015.01 )
`( 58 ) Field of Classification Search
`CPC
`B6OL 53/12 ; G06K 19/0723 ; G06K 19/07 ;
`HO1F 38/14 ; HO1F 41/14 ; H04B 5/0081 ;
`HO4B 5/0037 ; H04B 5/00 ; Y10T
`29/4902 ; H04W 4/80 ; YO2T 10/7005 ;
`YO2T 10/7072 ; YO2T 90/122 ; YO2T
`90/14 ; YO2T 90/16
`See application file for complete search history .
`References Cited
`U.S. PATENT DOCUMENTS
`12/1999 Nakawatase
`6,008,622 A
`6/2003 Boyadjian et al .
`6,575,374 B1
`6,950,023 B1
`9/2005 Martin
`9/2006 Bisig
`7,113,137 B2
`7,259,672 B2
`8/2007 Takei
`7,712,672 B2
`5/2010 Takahashi et al .
`7,971,339 B2
`7/2011 Finn
`8,159,182 B2
`4/2012 Kato et al .
`8,177,137 B2
`5/2012 Arai
`8/2013 Jang et al .
`8,514,135 B2
`7/2014 Deguchi et al .
`8,792,837 B2
`2/2015 Maruyama et al .
`8,947,189 B2
`6/2015 Higashiyama
`9,053,406 B2
`9,105,967 B2
`8/2015 Park
`10/2015 Lim et al .
`9,165,708 B2
`3/2016 Shostak
`9,276,642 B2
`9,450,303 B2
`9/2016 Su et al .
`9,460,847 B2
`10/2016 Lee et al .
`9,484,768 B2
`11/2016 Park et al .
`9,515,513 B2
`12/2016 Suzuki et al .
`9,543,653 B2
`1/2017 Han et al .
`9,553,476 B2
`1/2017 An et al .
`9,607,757 B2
`3/2017 Hirobe et al .
`9,673,509 B2
`6/2017 Park et al .
`6/2017 Jang et al .
`9,674,646 B2
`9,761,928 B2
`9/2017 Han et al .
`11/2017 Van Bosch et al .
`9,825,484 B2
`9,843,215 B2
`12/2017 Yeom et al .
`9,941,576 B2
`4/2018 Ito et al .
`9,941,729 B2
`4/2018 Peralta et al .
`9,941,743 B2
`4/2018 Peralta et al .
`4/2018 Singh et al .
`9,948,129 B2
`
`( 56 )
`
`9,960,629 B2
`9,991,735 B1
`9,991,744 B2
`10,003,120 B2
`10,014,577 B2
`10,063,100 B2
`10,110,052 B2
`2003/0141590 A1
`2005/0046573 A1
`2005/0072595 A1
`2005/0079820 Al
`2005/0116874 Al
`2005/0275497 A1
`2006/0166506 A1
`2007/0001921 A1
`2007/0007661 Al
`2007/0020932 Al
`2007/0069961 A1
`2007/0095913 Al
`2007/0254432 A1
`2007/0279002 A1
`2008/0055046 Al
`2008/0122570 A1
`2008/0129439 Al
`2008/0154178 Al
`2008/0164840 A1
`2008/0197957 Al
`2008/0200210 A1
`2008/0246664 A1
`2008/0266748 A1
`2008/0303735 Al
`2009/0029185 A1
`2009/0058358 Al
`2009/0058737 Al
`2009/0108974 Al
`2009/0115681 A1
`2009/0314842 A1
`2009/0315680 A1
`2010/0156735 A1
`2010/0265041 A1
`2010/0277004 Al
`2010/0289341 A1
`2010/0295682 Al
`2010/0308187 Al
`2011/0032685 Al
`2011/0050164 A1
`2011/0127070 A1
`2011/0267248 Al
`2011/0285494 A1
`2011/0302770 A1
`2011/0312382 Al
`2012/0001701 Al
`2012/0019075 Al
`2012/0044114 Al
`2012/0049986 A1
`2012/0057322 Al
`2012/0058722 A1
`2012/0092222 Al
`2012/0187767 A1
`2012/0218068 A1
`2012/0248981 Al
`2012/0249276 Al
`2012/0274148 A1
`2013/0038278 A1
`2013/0038497 A1
`2013/0069444 A1
`2013/0106198 A1
`2013/0113422 Al
`2013/0169398 Al
`2013/0176179 A1
`2013/0200716 A1
`2013/0249302 Al
`2013/0267170 A1
`2013/0271328 Al
`2013/0285783 A1
`2013/0308256 A1
`2014/0062827 Al
`2014/0091640 A1
`2014/0091758 Al
`
`5/2018 Rajagopalan et al .
`6/2018 Yamaguchi et al .
`6/2018 Lee et al .
`6/2018 Kang et al .
`7/2018 Cao
`8/2018 Singh et al .
`10/2018 Yeom et al .
`7/2003 Kamiya et al .
`3/2005 De Velasco et al .
`4/2005 Cho
`4/2005 Yamashita
`6/2005 El - Mahdawy et al .
`12/2005 Ramadan et al .
`7/2006 Okawa et al .
`1/2007 Takahashi et al .
`1/2007 Burgess et al .
`1/2007 Maruyama et al .
`3/2007 Akiho et al .
`5/2007 Takahashi et al .
`11/2007 Yamazaki et al .
`12/2007 Partovi
`3/2008 Shimizu
`5/2008 Takaishi
`6/2008 Nishikawa et al .
`6/2008 Carter et al .
`7/2008 Kato et al .
`8/2008 Kondo et al .
`8/2008 Lim et al .
`10/2008 Ikemoto et al .
`10/2008 Lee
`12/2008 Fujimoto et al .
`1/2009 Lee et al .
`3/2009 Inoue et al .
`3/2009 Tsujimura et al .
`4/2009 Raggam et al .
`5/2009 Lai et al .
`12/2009 Charrin
`12/2009 Arimura
`6/2010 Nakamura et al .
`10/2010 Almog et al .
`11/2010 Suzuki et al .
`11/2010 Ozaki et al .
`11/2010 August et al .
`12/2010 Lin
`2/2011 Akiba et al .
`3/2011 Partovi et al .
`6/2011 Ahn et al .
`11/2011 Remski et al .
`11/2011 Jeong et al .
`12/2011 Radenne et al .
`12/2011 Itay et al .
`1/2012 Taniguchi et al .
`1/2012 Cho et al .
`2/2012 Eom et al .
`3/2012 Cho et al .
`3/2012 Waffenschmidt
`3/2012 Lo et al .
`4/2012 Kato et al .
`7/2012 Kanno et al .
`8/2012 Yamakawa et al .
`10/2012 Karalis et al .
`10/2012 Fontana et al .
`11/2012 Sung et al .
`2/2013 Park et al .
`2/2013 Chae et al .
`3/2013 Waffenschmidt et al .
`5/2013 Kuk et al .
`5/2013 Lee et al .
`7/2013 Sugita et al .
`7/2013 Park
`8/2013 Kesler et al .
`9/2013 An et al .
`10/2013 Chong et al .
`10/2013 Nickel et al .
`10/2013 Yussof et al .
`11/2013 Lehr et al .
`3/2014 Kato
`4/2014 Scholz et al .
`4/2014 Hidaka et al .
`
`Ex.1001
`APPLE INC. / Page 2 of 36
`
`

`

`US 10,804,740 B2
`Page 3
`
`( 56 )
`
`References Cited
`U.S. PATENT DOCUMENTS
`
`2014/0145906 Al
`2014/0168019 Al
`2014/0168026 A1
`2014/0176384 Al
`2014/0184462 A1
`2014/0210406 A1
`2014/0226293 A1
`2014/0266030 Al
`2015/0054455 Al
`2015/0054457 A1
`2015/0061400 A1
`2015/0077296 A1
`2015/0116178 A1
`2015/0123604 A1
`2015/0145635 A1
`2015/0171519 Al
`2015/0207207 A1
`2015/0222017 A1
`2015/0281873 A1
`2016/0064814 A1
`2016/0118711 A1
`2016/0126002 A1
`2016/0188926 A1
`2016/0204836 A1
`2016/0224975 A1
`2016/0315497 A1
`2016/0345125 A1
`2017/0040696 Al
`2017/0054213 Al
`2017/0213644 A1
`2017/0317519 Al
`2017/0338562 A1
`2017/0345535 A1
`2018/0076650 A1
`2018/0189627 A1
`2018/0248255 Al
`2018/0287243 A1
`
`5/2014 Kato et al .
`6/2014 Hirobe et al .
`6/2014 Nakamura et al .
`7/2014 Yosui et al .
`7/2014 Yosui
`7/2014 Na et al .
`8/2014 Sato
`9/2014 Park et al .
`2/2015 Kim et al .
`2/2015 Kim
`3/2015 Park et al .
`3/2015 An et al .
`4/2015 Kim et al .
`5/2015 Lee et al .
`5/2015 Kurz et al .
`6/2015 Han et al .
`7/2015 Park et al .
`8/2015 Kumura et al .
`10/2015 Ojala
`3/2016 Jang et al .
`4/2016 Finn et al .
`5/2016 Chien et al .
`6/2016 Pachler et al .
`7/2016 Lee et al .
`8/2016 Na et al .
`10/2016 Kim et al .
`11/2016 Kim et al .
`2/2017 Peralta et al .
`2/2017 Singh et al .
`7/2017 Lee et al .
`11/2017 Yeom et al .
`11/2017 Ozenne et al .
`11/2017 Kim et al .
`3/2018 Yamaguchi et al .
`7/2018 Kwon et al .
`8/2018 Noh et al .
`10/2018 Ko et al .
`
`FOREIGN PATENT DOCUMENTS
`1784510 A
`6/2006
`8/2006
`1816945 A
`2888666 Y
`4/2007
`101140635 A
`3/2008
`101256876 A
`9/2008
`101573716 A
`11/2009
`101924398 A
`12/2010
`6/2011
`102083280 A
`1/2012
`202120299 U
`2/2012
`102360718 A
`8/2012
`102651499 A
`102971908 A
`3/2013
`02642632 A2
`9/2013
`7/2014
`02752943 A1
`6/1981
`S56-78415 U
`S61-69811 U
`5/1986
`4/1992
`H04-51115 U
`H06-267746 A
`9/1994
`H07-074038 A
`3/1995
`3/1996
`HO8-79976 A
`10/1998
`H10282232 A
`7/1999
`H11-175676 A
`1/2001
`2001-027687 A
`10/2002
`2002-299138 A
`2004110854 A
`4/2004
`5/2004
`2004-153463 A
`12/2004
`2004364199 A
`2/2006
`2006-042519 A
`2007-311407 A
`11/2007
`2/2008
`2008-027015 A
`2008-172872 A
`7/2008
`9/2008
`2008-205215 A
`9/2008
`2008-210861 A
`2/2009
`2009033106 A
`2011-66627 A
`3/2011
`
`CN
`CN
`
`CN
`CN
`
`CN
`CN
`CN
`CN
`EP
`EP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`
`JP
`JP
`JP
`JP
`JP
`JP
`KR
`KR
`KR
`KR
`KR
`KR
`KR
`KR
`KR
`KR
`KR
`KR
`TW
`WO
`WO
`
`2011-097534 A
`2012-008857 A
`2012-010533 A
`2012019302 A
`2012-178959 A
`2012-0191134 A
`1020040063286 A
`10-2005-0120481 A
`10-2006-0008332 A
`10-2008-0074640 A
`10-2010-0130480 A
`10-2012-0016778 A
`10-1177302 B1
`10-2012-0123375 A
`1020130015618 A
`10-2013-0028301 A
`10-2013-0028302 A
`10-2014-0113205 A
`M424550 U1
`WO - 2012008693 A2
`WO - 2012150293 A1
`
`5/2011
`1/2012
`1/2012
`1/2012
`9/2012
`10/2012
`7/2004
`12/2005
`1/2006
`8/2008
`12/2010
`2/2012
`8/2012
`11/2012
`2/2013
`3/2013
`3/2013
`9/2014
`3/2012
`1/2012
`11/2012
`
`OTHER PUBLICATIONS
`Office Action dated Feb. 25 , 2019 in Japanese Application No.
`2018-012053 .
`Dainippon Printing ( JP 2008-027015 ) Translation F5 ; Feb. 2008 .
`European Patent Communication dated Oct. 19 , 2017 , in European
`Application No. 13763524.9-1806 .
`European Search Report dated Aug. 29 , 2017 in European Appli
`cation No. 17157643.2 .
`European Search Report dated Aug. 8 , 2017 in European Applica
`tion No. 16206292.1 .
`European Search Report dated Feb. 4 , 2016 in European Applica
`tion No. 13763524.9 .
`European Search Report dated Jul . 1 , 2014 in European Application
`No. 12190583.0 .
`International Search Report dated Jul . 25 , 2013 in International
`Application No. PCT / KR2013 / 002406 .
`International Search Report dated Jul . 26 , 2013 in International
`Application No. PCT / KR2013 / 002412 .
`International Search Report in International Application No. PCT /
`KR2013 / 002412 , filed Mar. 22 , 2013 .
`Murata ( JP 2012-191134 )
`Translated patent ; Oct. 2012 .
`Office Action dated Aug. 10 , 2016 in Japanese Application No.
`2015-172306 .
`Office Action dated Aug. 24 , 2015 in U.S. Appl . No. 13 / 663,012 .
`Office Action dated Aug. 24 , 2016 in Taiwanese Application No.
`103130766 .
`Office Action dated Dec. 21 , 2015 in Chinese Application No.
`201380026460.5 .
`Office Action dated Feb. 13 , 2015 in U.S. Appl . No. 13 / 663,012 .
`Office Action dated Feb. 14 , 2017 in Japanese Application No.
`2015501586 .
`Office Action dated Feb. 24 , 2014 in Korean Application No.
`10-2013-0028301 .
`Office Action dated Feb. 24 , 2014 in Korean Application No.
`10-2013-0028302 .
`Office Action dated Jul . 1 , 2014 in European Application No.
`12190583.0 .
`Office Action dated Jun . 2 , 2016 in U.S. Appl . No. 14 / 387,521 .
`Office Action dated Jun . 29 , 2016 in Chinese Application No.
`201510084340.1 .
`Office Action dated Nov. 11 , 2013 in Korean Application No.
`10-2012-0123375 .
`Office Action dated Nov. 12 , 2013 in Japanese Application No.
`2012-238615 .
`Office Action dated Oct. 7 , 2014 in Japanese Application No.
`2012-238615 .
`Office Action dated Sep. 28 , 2016 in Korean Application No.
`1020130028300 .
`Office Action dated Nov. 27 , 2017 in U.S. Appl . No. 15 / 362,367 .
`Office Action dated May 2 , 2018 in Chinese Application No.
`201610391052.5 .
`
`Ex.1001
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`US 10,804,740 B2
`Page 4
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`( 56 )
`
`References Cited
`OTHER PUBLICATIONS
`Office Action dated Apr. 30 , 2018 in U.S. Appl . No. 15 / 362,367 .
`Office Action dated Jun . 15 , 2018 in U.S. Appl . No. 15 / 360,425 .
`Office Action dated Jul . 10 , 2018 in U.S. Appl . No. 15 / 430,173 .
`Office Action dated Sep. 29 , 2019 in Chinese Application No.
`201710325326.5 .
`
`Ex.1001
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`U.S. Patent
`
`Oct. 13 , 2020
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`Sheet 1 of 21
`
`US 10,804,740 B2
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`100
`
`330 310 320
`300
`
`210 220 230
`200
`FIG.1
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`Ex.1001
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`U.S. Patent
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`Oct. 13 , 2020
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`Sheet 2 of 21
`
`US 10,804,740 B2
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`200
`
`100
`
`300
`FIG.2
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`Ex.1001
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`U.S. Patent
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`Oct. 13 , 2020
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`Sheet 3 of 21
`
`US 10,804,740 B2
`
`330
`
`230
`
`20
`
`120
`
`320
`
`T
`
`330
`
`110
`
`310
`
`220
`
`230
`
`??
`
`FIG.3
`
`110 120
`100
`
`210
`
`6
`
`110 120
`100
`
`FIG.4
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`Ex.1001
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`U.S. Patent
`
`Oct. 13 , 2020
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`Sheet 4 of 21
`
`US 10,804,740 B2
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`?
`
`D
`
`201
`
`110 120
`
`FIG.5
`
`Q
`
`201
`
`110 120
`100
`
`FIG.6
`
`230
`
`110 120
`
`210
`
`FIG.7
`
`500
`
`500
`
`Q
`
`220
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`Ex.1001
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`U.S. Patent
`
`Oct. 13 , 2020
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`Sheet 5 of 21
`
`US 10,804,740 B2
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`20
`
`320
`
`10
`
`330
`
`310
`
`220
`
`230
`
`110 120
`
`210
`
`FIG.8
`
`20
`
`700
`
`320
`
`yo
`
`220
`
`230
`
`330
`
`-310
`
`???
`
`210
`
`110 120
`100
`
`FIG.9
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`Ex.1001
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`U.S. Patent
`
`Oct. 13 , 2020
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`Sheet 6 of 21
`
`US 10,804,740 B2
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`1000
`
`200
`
`630 610 620
`600
`
`300
`
`FIG.10
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`Ex.1001
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`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 7 of 21
`
`US 10,804,740 B2
`
`200
`
`300
`
`130
`
`330 310
`300
`
`320
`
`210
`
`220 230
`200
`
`FIG.11
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`Ex.1001
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`U.S. Patent
`
`Oct. 13 , 2020
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`Sheet 8 of 21
`
`US 10,804,740 B2
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`B
`
`B !
`
`300
`FIG.12
`
`200
`
`100
`
`Ex.1001
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`U.S. Patent
`
`Oct. 13 , 2020
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`Sheet 9 of 21
`
`US 10,804,740 B2
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`220
`
`230
`
`210
`
`100
`110 120
`
`320
`
`20
`
`22
`
`310
`
`330
`
`FIG.13
`
`100
`
`330 310 320
`300
`
`210 220 230
`200
`
`FIG.14
`
`Ex.1001
`APPLE INC. / Page 13 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 10 of 21
`
`US 10,804,740 B2
`
`1000
`
`200
`
`300
`
`C
`
`FIG.15
`
`Ex.1001
`APPLE INC. / Page 14 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 11 of 21
`
`US 10,804,740 B2
`
`330
`
`230
`
`20
`
`120
`
`320
`
`T
`
`110
`
`330
`
`200
`
`o
`
`220
`
`230 140
`
`110 120
`100
`
`210
`
`FIG.16
`
`OÖ
`
`110 120
`
`FIG.17
`
`310
`
`T
`
`Ex.1001
`APPLE INC. / Page 15 of 36
`
`

`

`U.S. Patent
`
`Oct 13 , 2020
`
`Sheet 12 of 21
`
`US 10,804,740 B2
`
`? 3:40 ,
`
`FIG.18
`
`{ { 0 120
`
`40
`
`1 1? 12
`100
`
`FIG.19
`
`9 .
`
`?? 0
`
`33 14
`
`Q
`
`1 10 11 210
`10
`
`FIG.20
`
`Ex.1001
`APPLE INC. / Page 16 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 13 of 21
`
`US 10,804,740 B2
`
`1000
`
`320
`
`20
`
`10
`
`330
`
`310
`
`000
`
`T
`
`220
`
`230 140
`
`110 120
`100
`
`210
`
`FIG.21
`
`Ex.1001
`APPLE INC. / Page 17 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`9
`
`Sheet 14 of 21
`
`US 10,804,740 B2
`
`Freg [ kHz )
`130.000000
`131.000000
`132.000000
`133.000000
`134.000000
`135.000000
`136.000000
`137.000000
`138.000000
`139.000000
`140.000000
`141.000000
`142.000000
`143.000000
`144.000000
`145.000000
`146.000000
`147.000000
`148.000000
`149.000000
`150.000000
`151.000000
`152.000000
`153.000000
`154.000000
`155.000000
`156.000000
`157.000000
`158.000000
`159.000000
`160.000000
`
`Q
`Resistance
`Inductance
`: Sweep
`Setup 1
`: Sweep Setup1 : Sweep . Setup 1
`10023.448082
`0.809633
`10.012480
`10.028048
`10021.543951
`0.814464
`10019.649417
`0.819320
`10.043115
`10017.764376
`0.824199
`10.057691
`10.071784
`10015.888496
`0.829101
`10014.021426
`0.834027
`10.085405
`10012. 163025
`0.838976
`10.098561
`10010.312867
`0.843948
`10.111262
`10008.470902
`0.848942
`10.123517
`10.135333
`10006.636764
`0.853960
`10004.810399
`0.859000
`10.146721
`10002.991358
`0.864062
`10.157687
`10001. 179585
`0.869147
`10. 168241
`9999.374809
`0.874254
`10.178391
`9997.577015
`0.879383
`10.188142
`10. 197506
`9995.785687
`0.884534
`10.206488
`9994.000944
`0.889706
`9992.222542
`0.894900
`10.215097
`9990.450319
`0.900116
`10.223339
`9988.684063
`0.905352
`10.231223
`9986.923648
`0.910610
`10.238756
`10.245944
`9985. 169040
`0.915889
`10.252794
`9983.419964
`0.921189
`9981.676290
`0.926509
`10.259313
`9979.937950
`0.931850
`10.265510
`9978. 204783
`0.937212
`10,271388
`9976.476722
`0.942594
`10.276956
`9974.753596
`0.947996
`10.282220
`9973.035485
`0.953418
`10.287185
`9971.32 1833
`0.958860
`10.291859
`9969.613051
`0.964321
`10.296247
`FIG.22
`
`Ex.1001
`APPLE INC. / Page 18 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`9
`
`Sheet 15 of 21
`
`US 10,804,740 B2
`
`Freq [ kHz ]
`130.000000
`131.000000
`132.000000
`133.000000
`134.000000
`135.000000
`136.000000
`137.000000
`138.000000
`139.000000
`140.000000
`141.000000
`142.000000
`143.000000
`144.000000
`145.000000
`146.000000
`147.000000
`148.000000
`149.000000
`150.000000
`151.000000
`152.000000
`153.000000
`154.000000
`155.000000
`156.000000
`157.000000
`158.000000
`159.000000
`160.000000
`
`Resistance
`Inductance
`: Sweep
`Setup1 : Sweep Setup 1
`: Sweep Setup 1
`11.053420
`10375.469101
`0.760491
`10373.611592
`0.764922
`11.072242
`10371.760893
`0.769376
`11.090493
`10369.916781
`0.773853
`11.108182
`11. 125322
`10368.078898
`0.778351
`10366.247102
`0.782872
`11.141920
`10364.421100
`0.787415
`11. 157989
`10362.600644
`0.791979
`11.173537
`10360.785303
`0.796565
`11.188574
`10358.975165
`0.801173
`11.203109
`10357. 169752
`0.805802
`11.217153
`11.230713
`10355.369156
`0.810452
`10353.572957
`0.815124
`11.243801
`10351.780892
`0.819816
`11.256422
`10349.993078
`0.824529
`11.268591
`10348.209063
`0.829263
`11.280309
`10346.428853
`0.834018
`11.291589
`10344.652133
`0.838792
`11.302441
`10342.878918
`0.843587
`11.312871
`10341. 108850
`0.848402
`11.322886
`10339.342085
`0.853237
`11.332499
`10337.578231
`0.858092
`11.341712
`10335.817245
`0.862967
`11.350536
`10334.058946
`0.867867
`11.358980
`10332.303299
`0.872774
`11.367050
`10330.550019
`0.877706
`11.374754
`10328.799305
`0.882658
`11.382099
`10327,050748
`0.887629
`11.389091
`10325.304351
`0.892618
`11.395741
`11.402053
`10323.560143
`0.897626
`10321.817935
`0.902653
`11.408035
`FIG.23
`
`Ex.1001
`APPLE INC. / Page 19 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 16 of 21
`
`US 10,804,740 B2
`
`600
`
`200
`
`FIG.24
`200
`
`600
`
`100
`
`U
`
`100
`
`FIG.25
`
`Ex.1001
`APPLE INC. / Page 20 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 17 of 21
`
`US 10,804,740 B2
`
`1000
`
`800
`
`220
`
`200
`
`610
`
`230
`
`620
`
`210
`
`710
`
`300
`
`130
`
`FIG.26
`
`Ex.1001
`APPLE INC. / Page 21 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 18 of 21
`
`US 10,804,740 B2
`
`200
`
`340
`
`300
`
`120
`
`o
`
`350
`
`310
`
`320 230
`
`FIG.27
`
`320
`
`310
`
`350
`
`340
`
`300
`
`+
`
`700
`-800
`720
`730
`
`600 600 710 230 30 220 230 30 210
`30
`620
`FIG.28
`
`30
`610
`
`Ex.1001
`APPLE INC. / Page 22 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 19 of 21
`
`US 10,804,740 B2
`
`201
`
`+
`
`+ +
`
`*
`
`FIG.29
`
`FIG.30
`
`FIG.31
`
`+
`
`+
`+ +
`
`+
`
`f
`
`f
`
`FIG.32
`
`J -700
`
`-800
`
`+
`+
`
`201
`-700
`800
`
`900
`201
`-700
`800
`
`201
`-700
`800
`
`910
`
`Ex.1001
`APPLE INC. / Page 23 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 20 of 21
`
`US 10,804,740 B2
`
`600
`
`600
`
`230
`
`220
`
`230
`
`210
`
`620
`
`910
`610
`
`3
`
`+
`
`}
`
`+
`
`FIG.33
`
`600
`
`600
`
`230
`
`610 ?a 700
`
`220
`
`230
`
`210
`
`620
`
`+
`
`800
`
`FIG.34
`
`320
`
`310
`
`350
`
`340
`
`300
`
`600
`
`230
`
`700
`800
`
`30 220 230
`210 30 620
`FIG.35
`
`30
`610
`
`Ex.1001
`APPLE INC. / Page 24 of 36
`
`

`

`U.S. Patent
`
`Oct. 13 , 2020
`
`Sheet 21 of 21
`
`US 10,804,740 B2
`
`O
`
`*
`
`RE
`
`600 710 230
`
`600
`
`320
`
`310
`
`350
`
`340
`
`300
`
`+
`
`700
`-800
`
`220
`
`30
`610
`
`30 210
`30
`230
`620
`FIG.36
`
`320
`
`310
`
`350
`
`340
`
`300
`
`700
`800
`720
`730
`
`600 600 710 230 30 220 230
`30
`210 30
`620
`FIG.37
`
`30
`610
`
`Ex.1001
`APPLE INC. / Page 25 of 36
`
`

`

`5
`
`10
`
`15
`
`BACKGROUND
`
`1
`WIRELESS POWER RECEIVER AND
`METHOD OF MANUFACTURING THE SAME
`
`US 10,804,740 B2
`
`CROSS - REFERENCE TO RELATED
`APPLICATIONS
`This application is a continuation of U.S. application Ser .
`No. 15 / 430,173 , filed Feb. 10 , 2017 ; which is a continuation
`of U.S. application Ser . No. 15 / 360,425 , filed Nov. 23 , 2016 ;
`which is a continuation of U.S. application Ser . No. 13/663 ,
`012 , filed Oct. 29 , 2012 , now U.S. Pat . No. 9,806,565 , issued
`Oct. 31 , 2017 ; which claims the benefit under 35 U.S.C $
`119 of Korean Patent Application Nos . 10-2012-0029987 ,
`filed Mar. 23 , 2012 , and 10-2012-0079004 , filed Jul . 19 ,
`2012 ; which are hereby incorporated by reference in their
`entirety .
`
`2
`An embodiment provides a method capable of ensuring
`high power transmission efficiency and enabling communi
`cation with external devices by disposing a coil unit inside
`a magnetic substrate and a near field communication antenna
`on a magnetic substrate .
`An embodiment provides a method capable of simplifying
`the manufacturing process for a wireless power receiver by
`disposing a coil unit inside a magnetic substrate .
`A wireless power receiver according to one embodiment
`includes a magnetic substrate and a coil configured to
`wirelessly receive power , wherein the coil is formed as a
`conductive layer on the magnetic substrate .
`A wireless power receiver according to one embodiment
`includes a magnetic substrate and a coil a coil configured to
`wirelessly receive power , wherein the coil is formed as a
`conductive layer at the magnetic substrate , wherein a part of
`the coil is disposed inside the magnetic substrate .
`A method of manufacturing a wireless power receiver for
`20 wirelessly receiving power according to one embodiment
`includes forming a conductor on a protective film , forming
`The embodiment relates to a wireless power receiver and
`a conductive pattern by etching the conductor , connecting a
`a method of manufacturing the same . In more particular , the
`connecting unit to be connected to an external circuit to a
`embodiment relates to a wireless power receiver used for
`connection terminal of the conductive pattern , obtaining a
`wireless power transmission or an antenna to reduce a
`thickness of the wireless power receiver and to simplify the 25 magnetic substrate having a receiving space of a predeter
`manufacturing process thereof and a method of manufac
`mined shape corresponding to the connecting unit and
`disposing the magnetic substrate on the conductive pattern
`turing the same .
`A wireless power transmission or a wireless energy trans
`while positioning the connecting unit in the receiving space .
`fer refers to a technology of wirelessly transferring electric
`According to one embodiment , the thickness of the wire
`energy to desired devices . In the 1800's , an electric motor or 30 less power receiver can be remarkably reduced by directly
`a transformer employing the principle of electromagnetic
`disposing the coil unit on a top surface of the magnetic
`induction has been extensively used and then a method of
`substrate . According to one embodiment , the high power
`transmitting electrical energy by irradiating electromagnetic
`transmission efficiency can be ensured and communication
`with external devices can be enabled by directly disposing
`waves , such as radio waves or lasers , has been suggested .
`Actually , electrical toothbrushes or electrical razors , which 35 the coil unit and the near field communication antenna on the
`are frequently used in daily life , are charged based on the
`top surface of the magnetic substrate .
`principle of electromagnetic induction . The electromagnetic
`According to one embodiment , the manufacturing process
`induction refers to the generation of an electric current
`for the wireless power receiver can be simplified by directly
`through induction of a voltage when a magnetic field is
`disposing the coil unit on the magnetic substrate only
`changed around a conductor . The electromagnetic induction 40 through laminating and etching processes .
`scheme has been successfully commercialized for electronic
`According to one embodiment , the thickness of the wire
`appliances having small sizes , but represents a problem in
`less power receiver can be remarkably reduced by forming
`the conductive pattern inside the magnetic substrate .
`that the transmission distance of power is too short .
`Besides the electromagnetic induction scheme , the long
`According to one embodiment , the high power transmis
`distance transmission using the resonance and the short- 45 sion efficiency can be ensured by forming the conductive
`wavelength radio frequency has been suggested as the
`pattern inside the magnetic substrate and the communication
`with external devices can be enabled by using the near field
`wireless energy transfer scheme .
`However , in general , a wireless power receiver disposed
`communication antenna .
`in a terminal has a thick thickness and the manufacturing
`According to one embodiment , the connecting unit is
`50 disposed in the receiving space of the magnetic substrate so
`process thereof is complicated .
`that the thickness of the wireless power receiver can be
`remarkably reduced as much as the thickness of the con
`BRIEF SUMMARY
`necting unit .
`According to one embodiment , a tape substrate is used as
`An embodiment provides a method capable of remarkably
`reducing a thickness of a wireless power receiver by directly 55 the connecting unit so that the overall size of the wireless
`disposing a coil unit on a top surface of a magnetic substrate .
`power receiver can be reduced .
`An embodiment provides a method capable of ensuring
`According to one embodiment , a lead frame is used as the
`high power transmission efficiency and enabling communi
`connecting unit , so the wiring layer included in the connect
`cation with external devices by directly disposing a coil unit
`ing unit can be protected from the heat , external moisture or
`and a near field communication antenna on a top surface of 60 impact and the mass production can be realized .
`a magnetic substrate .
`According to one embodiment , the magnetic field directed
`An embodiment provides a method capable of simplifying
`to the outside can be changed into the coil unit due to the
`the manufacturing process for a wireless power receiver by
`conductive pattern formed in the magnetic substrate , so the
`directly disposing a coil unit on a magnetic substrate .
`power transmission efficiency can be improved , at the same
`An embodiment provides a method capable of remarkably 65 time , the amount of the magnetic field leaked to the outside
`reducing a thickness of a wireless power receiver by dis
`can be reduced so that the bad influence of the magnetic field
`posing a coil unit inside a magnetic substrate .
`exerted to the human body can be diminished .
`
`Ex.1001
`APPLE INC. / Page 26 of 36
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`

`

`US 10,804,740 B2
`
`3
`4
`FIGS . 29 to 37 are views for explaining a method of
`According to one embodiment , the wireless power
`manufacturing a wireless power receiver according to still
`receiver can be manufactured only through the processes of
`another embodiment .
`forming the pattern groove and inserting the coil unit , so that
`the manufacturing process can be simplified .
`DETAILED DESCRIPTION
`Other various effects of the embodiments will be dis- 5
`closed directly or indirectly in the detailed description of the
`Hereinafter , exemplary embodiments will be described in
`embodiments .
`detail with reference to accompanying drawings so that
`those skilled in the art can easily work with the embodi
`BRIEF DESCRIPTION OF THE DRAWINGS
`10 ments .
`Hereinafter , " conductive pattern ” refers to the shape of a
`FIG . 1 is a perspective view illustrating a wireless power
`conductive layer and may be used to refer to a structure
`receiver 1000 according to the first embodiment ;
`formed by a patterning process . “ conductive layer ” may be
`FIG . 2 is a plan view illustrating a wireless power receiver
`used interchangeably with “ conductive pattern ” and refers to
`1000 according to the first embodiment ;
`15 a structure formed by methods including patterning , etching ,
`FIG . 3 is a sectional view taken along line A - A ' of a
`deposing , selective plating , and the like .
`connecting unit 300 of a wireless power receiver 1000
`FIG . 1 is a perspective view illustrating a wireless power
`shown in FIG . 2 ;
`receiver 1000 according to the first embodiment , FIG . 2 is a
`FIGS . 4 to 8 are views for explaining a method of
`plan view illustrating the wireless power receiver 1000
`manufacturing a wireless power receiver 1000 according to 20 according to the first embodiment and FIG . 3 is a sectional
`one embodiment ;
`view taken along line A - A ' of a connecting unit 300 of the
`FIG . 9 is a sectional view taken along line A - A ' of a
`wireless power receiver 1000 shown in FIG . 2 .
`connecting unit 300 of a wireless power receiver 1000
`Referring to FIGS . 1 to 3 , the wireless power receiver
`shown in FIG . 2 according to the second embodiment ;
`1000 may include a magnetic substrate 100 , a coil unit 200
`FIG . 10 is a plan view illustrating a wireless power 25 and a connecting unit 300 .
`The wireless power receiver 1000 may wirelessly receive
`receiver 1000 according to the third embodiment ;
`FIG . 11 is a perspective view illustrating a wireless power
`power from a transmission side . According to one embodi
`ment , the wireless power receiver 1000 may wirelessly
`receiver 1000 according to the fourth embodiment ;
`receive the power using electromagnetic induction . Accord
`FIG . 12 is a plan view illustrating a wireless power
`30 ing to one embodiment , the wireless power receiver 1000
`receiver 1000 according to the fourth embodiment ;
`may wirelessly receive the power using resonance .
`FIG . 13 is a sectional view taken along line B - B ' of a
`The electromagnetic induction and resonance may be
`connecting unit 300 of a wireless power receiver 1000
`used when transmitting the power using the magnetic field .
`shown in FIG . 12 according to the fourth embodiment ;
`The magnetic substrate 100 may change the direction of
`FIG . 14 is a perspective view illustrating a wireless power 35 the magnetic field received from the transmission side .
`receiver 1000 according to the fifth embodiment ;
`The magnetic substrate 100 can reduce the amount of the
`FIG . 15 is a plan view illustrating a wireless power
`magnetic field to be leaked to the outside by changing the
`receiver 1000 according to the fifth embodiment ;
`direction of the magnetic field received from the transmis
`FIG . 16 is a sectional view taken along line C - C ' of a
`sion side .
`wireless power receiver 1000 according to the fifth embodi
`In detail , the magnetic substrate 100 changes the direction
`40
`of the magnetic field transferred from the transmission side
`ment ;
`FIGS . 17 to 21 are views for explaining a method of
`in the lateral direction such that the magnetic field can be
`more concentrated onto the coil unit 200 .
`manufacturing a wireless power receiver 1000 according to
`the fifth embodiment ;
`The magnetic substrate 100 can absorb some of the
`FIG . 22 is a view for explaining variation of inductance , 45 magnetic field received from the transmission side and
`leaked to the outside to dissipate the magnetic field as heat .
`resistance and Q values of a coil unit 200 as a function of a
`usable frequency when the coil unit 200 is disposed on a top
`If the amount of the magnetic field leaked to the outside is
`surface of a magnetic substrate according to the first
`reduced , the bad influence of the magnetic field exerted on
`the huma