`Suzuki et al.
`
`(10) Patent No.:
`(45) Date of Patent:
`
`US 8.421,574 B2
`Apr. 16, 2013
`
`USOO8421574B2
`
`(54) CONTACTLESS POWER TRANSMISSION
`APPARATUS AND AMETHOD OF
`MANUFACTURING ASECONDARY SOE
`THEREOF
`
`(75) Inventors: Masayuki Suzuki, Otsu (JP); Hiroyasu
`Kitamura, Hirakata (JP); Satoru
`Inakagata, Nara (JP); Atsushi Isaka,
`Hikone (JP); Tatsuhiko Keishu, Hikone
`(JP)
`(73) Assignee: Panasonic Corporation, Osaka (JP)
`(*) Notice:
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`12/665,025
`Jun. 12, 2008
`PCT/UP2008/060779
`
`(21) Appl. No.:
`(22) PCT Filed:
`(86). PCT No.:
`S371 (c)(1),
`Dec. 16, 2009
`(2), (4) Date:
`(87) PCT Pub. No.: WO2008/156025
`PCT Pub. Date: Dec. 24, 2008
`
`(65)
`
`(30)
`
`Prior Publication Data
`US 2010/O181842 A1
`Jul. 22, 2010
`Foreign Application Priority Data
`
`Jun. 20, 2007 (JP) ................................. 2007-163051
`Jun. 20, 2007 (JP) ................................. 2007-163058
`(51) Int. Cl.
`HOIF 5/00
`HOIF 27/28
`HOIF 27/24
`(52) U.S. Cl.
`USPC ............................ 336/200; 336/232; 336/233
`(58) Field of Classification Search .................. 336/200,
`336/232, 233
`See application file for complete search history.
`
`(2006.01)
`(2006.01)
`(2006.01)
`
`
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`3,594,672 A * 7/1971 Frenkel ......................... 336,132
`3,676,814 A * 7/1972 Trunzo et al. ................. 336,205
`(Continued)
`
`JP
`JP
`
`FOREIGN PATENT DOCUMENTS
`62-36512 U
`3, 1987
`3-232207 A 10, 1991
`(Continued)
`
`OTHER PUBLICATIONS
`International Search Report for the Application No. PCT/JP2008/
`060779 mailed Jul. 15, 2008.
`(Continued)
`
`Primary Examiner — Mohamad Musleh
`Assistant Examiner — TSZ Chan
`(74) Attorney, Agent, or Firm — McDermott Will & Emery
`LLP
`
`(57)
`ABSTRACT
`According to a first aspect, a secondary side of contactless
`power transmission apparatus includes: a holding member
`which is physically separated from a primary side; a magnetic
`layer; a shield layer for shielding electromagnetic noise; and
`aheat insulation layer. The secondary coil is a planar coil and
`Supported by the holding member, and at least the magnetic
`layer is laminated on one side of the planar coil and unified
`with the planar coil. According to a second aspect, the sec
`ondary side of the apparatus includes a plurality of magnetic
`layers. Each permeability of the magnetic layers is different
`from each other, and each of the magnetic layers forms a
`magnetic path with the primary side.
`
`20 Claims, 12 Drawing Sheets
`
`110
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`
`U.S. PATENT DOCUMENTS
`4496,896 A *
`1/1985 Melocik et al. ............... 320, 108
`4,543,553 A * 9/1985 Mandai et al. .
`... 336,83
`5,062,197 A * 1 1/1991 Charles ........................... 29/606
`5, 198,647 A
`3, 1993 Mizuta
`336,200
`5.430,424. A * 7/1995 Sato et al. ...
`336/180
`5,500,632 A * 3/1996 Halser, III ...
`320, 108
`6,008,622 A * 12/1999 Nakawatase
`... 307/33
`6,265,789 B1* 7/2001 Honda et al.
`336,200
`6,603,382 B1* 8/2003 Komai et al.
`336,200
`7,042,325 B2 * 5/2006 Giandalia et al.
`336,200
`2003/0020583 A1* 1/2003 Hui et al. .......
`343,895
`2005, 0007296 A1* 1/2005 Endo et al. ..
`2006/0266435 A1 * 1 1/2006 Yang et al. .................... 148,105
`OTHER PUBLICATIONS
`2007/0001921 A1
`1/2007 Takahashi et al. ............ 343,788
`38783 A. 358, Suki et al. ..
`3.R. Notification of Reasons for Refusal for Application No. 2007-163058
`from Japan Patent Office mailed Mar. 29, 2011.
`2007/0103952
`A1* 5, 2007 Sakai et al. .............
`363,171
`
`3, 2000
`2000-90221 A
`JP
`E. SA ck 3.399
`JP
`2000-340440 A 12/2000
`JP
`2003-68544. A
`3, 2003
`JP
`2003-173921. A
`6, 2003
`f
`JP
`2003-244.855 A
`8, 2003
`9, 2003
`JP
`2003-272938 A
`JP
`2004-47701 A
`2, 2004
`JP
`2006-311712. A 11, 2006
`JP
`2006-314181 A 11, 2006
`JP
`2006-353094. A 12/2006
`
`JP
`
`FOREIGN PATENT DOCUMENTS
`8-79976 A
`3, 1996
`
`* cited by examiner
`
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`Sheet 1 of 12
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`FIG 1A
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`Sheet 2 of 12
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`US 8.421,574 B2
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`FIG 2
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`112 113
`
`11
`l
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`120
`
`170
`
`
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`111
`
`FIG 3
`
`resease-a lease /
`152
`170
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`Sheet 3 of 12
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`FIG. 4A
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`FIG. 4B
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`FIG 4C
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`170
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`170
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`Sheet 4 of 12
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`Sheet 6 of 12
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`17
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`FIG
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`Sheet 8 of 12
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`F.G. 13
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`Sheet 9 of 12
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`FIG. 14A
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`171
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`FIG. 14B
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`Sheet 10 of 12
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`Ex.1023 / IPR2022-00118 / Page 12 of 21
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`Sheet 11 of 12
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`FIG. 20
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`Sheet 12 of 12
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`FIG 21
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`
`
`1.
`CONTACTLESS POWER TRANSMISSION
`APPARATUS AND AMETHOD OF
`MANUFACTURING ASECONDARY SOE
`THEREOF
`
`TECHNICAL FIELD
`
`The invention relates to contactless power transmission
`apparatus capable of transmitting electric power without any
`direct electric connection, and a method of manufacturing a
`secondary side of the apparatus.
`
`10
`
`BACKGROUND ART
`
`That kind of contactless power transmission apparatus is
`broadly divided into a powertransmitter in a primary side and
`a power receiver in a secondary side. The power transmitter
`includes a primary coil and is used for a device such as a
`charger or the like (hereinafter referred to as a “primary
`device'). The power receiver includes a secondary coil and is
`used for a device Such as a cordless phone, a shaver, an
`electric toothbrush, a personal digital assistance or the like
`(hereinafter referred to as a “secondary device'). The primary
`and secondary coils constitute a transformer, and electric
`power is transmitted from the primary side to the secondary
`side by electromagnetic induction between the coils. Thus,
`the contactless power transmission apparatus does not have
`any electric contact for transmitting power from the primary
`side to the secondary side. Accordingly, the issue of contact
`degradation is not raised, and it is possible to easily pair the
`primary and secondary devices to transmit power from the
`primary side to the secondary side. In addition, each water
`proof structure of the primary and secondary devices can be
`easily realized.
`Each of the power transmitter and the power receiver fur
`ther has a core or a bobbin (molding) in general, and each coil
`of them is wound around its core or bobbin.
`In recent years, such a secondary device has been espe
`cially required to be miniaturized, thinned and provided with
`high performance. In order to comply with the requirement,
`the secondary coil needs to be thinned. Because of this, a
`planar coil has been proposed for the secondary coil (e.g.,
`Japanese Patent Application Publication Number 2006
`31 1712 published on Nov. 9, 2006). However, the planar coil
`is inferior in magnetic properties to the coil wound around a
`core, and accordingly power in the secondary side is reduced.
`If a magnetic layer is added to the planar coil, the power
`transmission efficiency between the primary and secondary
`sides can be enhanced, but a thin magnetic layer must be
`formed, which becomes a problem.
`Also in order to miniaturize the secondary device, some
`parts in the secondary device are arranged to approach the
`planar coil and the distance among them is shortened.
`Accordingly, if the parts include a weak part in heat and noise,
`e.g., a lithium ion secondary battery or the like, the weak part
`is put under the influence of heat and noise, increased by
`proximity to the planar coil.
`
`DISCLOSURE OF THE INVENTION
`
`It is an object of the present invention to enhance the power
`transmission efficiency between primary and secondary sides
`and also to reduce the influence of noise from a planar coil. It
`is another object of the present invention to reduce the influ
`ence of heat and noise from the planar coil.
`In a first aspect of the present invention, contactless power
`transmission apparatus comprises a secondary coil located in
`
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`2
`a secondary side, and is configured to transmit electric power
`from a primary side to the secondary side by electromagnetic
`induction between a primary coil and the secondary coil
`(hereinafter referred to as a “first configuration'). The pri
`mary coil is located in the primary side. The secondary side
`further comprises: a holding member which is physically
`separated from the primary side; a magnetic layer; a shield
`layer for shielding electromagnetic noise; and a heat insula
`tion layer. The secondary coil is a planarcoil and Supported by
`the holding member. At least the magnetic layer is laminated
`on one side of the planar coil and unified with the planar coil.
`In the structure, since the magnetic layer is laminated to the
`planar coil, the power transmission efficiency between the
`primary and secondary sides can be enhanced. Since the
`secondary side includes the shield layer, the influence of noise
`from the planar coil can be reduced. Since the secondary side
`includes the heat insulation layer, the influence of heat and
`noise from the planar coil can be reduced.
`Preferably, the contactless power transmission apparatus
`further comprises a radiation layer located between the hold
`ing member and the planar coil.
`In an embodiment, the magnetic layer is formed to spread
`over a spiral depression on said one side of the planar coil. In
`the structure, magnetic flux density and the power transmis
`sion efficiency can be enhanced.
`Preferably, the magnetic layer is laminated on said one side
`of the planar coil; the shield layer is laminated on the mag
`netic layer, and the heat insulation layer is laminated on the
`shield layer (hereinafter referred to as a “second configura
`tion').
`Preferably, the contactless power transmission apparatus
`further comprises a secondary device which includes the
`secondary side and has a housing. The holding member is a
`part of the housing.
`Preferably, the contactless power transmission apparatus
`further comprises a functional member located in the second
`ary side. The holding member is the functional member.
`In an embodiment, the contactless power transmission
`apparatus further comprises a secondary device including the
`secondary side and the holding member. The combination of
`the planar coil and at least the magnetic layer is in the form of
`a card, and can be attached to and detached from the holding
`member. Or the combination of the planar coil, the magnetic
`layer, the shield layer and the heat insulation layer is in the
`form of a card, and can be attached to and detached from the
`holding member. In these constructions, the simplicity of
`treatment can be improved.
`A method of manufacturing the second side in the first
`configuration comprises forming the magnetic layer by press
`ing magnetic material made of crystalline metal material or
`non-crystalline metal material. In the method, magnetic flux
`density can be improved.
`A method of manufacturing the second side in the second
`configuration comprises: applying the heat insulation layer to
`one side of the shield layer; fixing the heat insulation layer
`and the shield layer by drying; sticking the other side of the
`shield layer and one side of the magnetic layer together; and
`Sticking the other side of the magnetic layer and said one side
`of the planar coil together. In the method, the secondary side
`can be easily manufactured.
`In a second aspect of the present invention, contactless
`power transmission apparatus comprises a primary coil
`located in a primary side and a secondary coil located in a
`secondary side, and is configured to transmit electric power
`from the primary side to the secondary side by electromag
`netic induction between the primary and the secondary coils.
`The primary side further comprises a first holding member
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`3
`which supports the first coil. The secondary side further com
`prises: a second holding member which is physically sepa
`rated from the first holding member and Supports the second
`ary coil; and a plurality of magnetic layers. The secondary
`coil is a planar coil. Each permeability of the magnetic layers
`is different from each other, and each of the magnetic layers
`forms a magnetic path with the primary side. In the structure,
`the secondary side includes a magnetic layer having high
`permeability and a magnetic layer having low permeability.
`The magnetic layer having high permeability increases the
`10
`coupling between the primary and secondary coils. The mag
`netic layer having low permeability enhances the transmis
`sion efficiency of high frequency components from the pri
`mary side to the secondary side, and Suppresses noise. The
`high frequency components include higher frequencies than
`high Switching frequency of power transmission.
`In the second aspect, preferably, the primary side further
`comprises a plurality of magnetic layers. The primary coil is
`a planar coil. Each permeability of the magnetic layers in the
`primary side is different from each other, and each of the
`magnetic layers in the primary side forms a magnetic path
`with the secondary side. In the structure, noise to the primary
`side and noise from the primary side to the secondary side can
`be suppressed.
`In an embodiment, the magnetic layers in the secondary
`side are a first magnetic layer located on one side of the
`secondary coil, and a second magnetic layer located on this
`first magnetic layer. The other side of the secondary coil faces
`the primary coil, and the permeability of the first magnetic
`layer is higher than that of the second magnetic layer. The
`magnetic layers in the primary side may be also formed in the
`same way as those in the secondary side. The embodiment is
`Suitable for the transmission efficiency enhancement and
`noise reduction.
`In an embodiment, the area of the second magnetic layer in
`the secondary side is larger than that of the first magnetic
`layer in the secondary side. In the structure, noise can be
`further reduced.
`In an embodiment, the second magnetic layer is located in
`the vicinity of a functional device in the secondary side. In the
`structure, the noise to the functional device can be reduced.
`In the second aspect, preferably, the contactless power
`transmission apparatus further comprises a coil for data trans
`mission, and a magnetic layer located in the vicinity of the
`coil for data transmission. In the structure, the reliability of
`45
`information communication can be enhanced.
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`4
`FIGS. 6A-6E are sectional views of different magnetic
`layers for the secondary device;
`FIGS. 7A-7Care sectional views of different shield layers
`for the secondary device;
`FIG. 8 is a sectional view of the essential parts of a sec
`ondary device in another example:
`FIG. 9 is a sectional view of the essential parts of a power
`receiver in contactless power transmission apparatus in
`accordance with a second embodiment of the present inven
`tion;
`FIG. 10 is a schematic diagram of contactless power trans
`mission apparatus in accordance with a third embodiment of
`the present invention;
`FIG. 11 is a sectional view of the essential parts of a power
`receiver in the apparatus;
`FIG. 12 is a schematic diagram of contactless power trans
`mission apparatus in accordance with a fourth embodiment of
`the present invention;
`FIG. 13 is a sectional view of the essential parts of a power
`receiver in the apparatus;
`FIGS. 14A and 14B illustrate the essential parts of a power
`receiver in contactless power transmission apparatus in
`accordance with a fifth embodiment of the present invention;
`FIGS. 15A and 15B illustrate the essential parts of a power
`receiver in an example:
`FIG.16 illustrates the essential parts of a power receiver in
`an example:
`FIGS. 17A and 17B illustrate the essential parts of contact
`less power transmission apparatus in accordance with a sixth
`embodiment of the present invention;
`FIG. 18 is a circuit diagram of the apparatus;
`FIG. 19 illustrates magnetic flux in the apparatus;
`FIG. 20 illustrates the essential parts of contactless power
`transmission apparatus in an embodiment;
`FIG. 21 illustrates the essential parts of contactless power
`transmission apparatus in an embodiment; and
`FIGS. 22A and 22B illustrate the essential parts of contact
`less power transmission apparatus in an embodiment.
`
`BEST MODE FOR CARRYING OUT THE
`INVENTION
`
`First Embodiment
`
`FIGS. 1A, 1B and 2 show contactless power transmission
`apparatus 1 in accordance with a first embodiment of the
`present invention. The apparatus 1 is broadly divided into a
`power transmitter 11 in a primary side and a power receiver 16
`in a secondary side. The transmitter 11 and the receiver 16
`include primary and secondary coils 120 and 170 capable of
`electromagnetic coupling, respectively, and are configured to
`transmit electric power from the primary side to the second
`ary side by electromagnetic induction between the primary
`and secondary coils 120 and 170. Accordingly, the transmitter
`11 and the receiver 16 can be separated from each other. The
`transmitter 11 and the receiver 16 are, but not limited to, a
`charger 10 (a primary device) and a cellphone 15 (secondary
`device), respectively.
`As shown in FIG. 2, the power transmitter 11 further
`includes a controller 111, a rectifier 112, a ripple filter 113, an
`indicator 114 and an oscillator 115, while the power receiver
`16 further includes a rectifier 161 and a load 162. However,
`not limited to this, the power transmitter 11 may beformed of
`at least a primary coil, a controller and an oscillator when a
`direct current source is employed in the place of an alternating
`Current SOurce.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`Preferred embodiments of the invention will now be
`described in further details. Other features and advantages of
`the present invention will become better understood with
`regard to the following detailed description and accompany
`ing drawings where:
`FIG. 1A is a schematic diagram of contactless power trans
`mission apparatus in accordance with a first embodiment of
`the present invention, and FIG. 1B is a perspective view of a
`battery cover of a secondary device in the apparatus;
`FIG. 2 is a block diagram of the contactless power trans
`mission apparatus;
`FIG. 3 is a sectional view of the essential parts of the
`secondary device;
`FIGS. 4A-4C are schematic diagrams of different second
`ary coils for the secondary device;
`FIG. 5 illustrates characteristic curves of coupling coeffi
`cients decided by relative permeability and thickness of a
`magnetic layer in the secondary device;
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`Specifically, in the power transmitter 11, the controller 111
`is configured to control the indicator 114 and the oscillator
`115 when it is activated to transmit electric power to the
`power receiver 16. The rectifier 112 is, for example, a full
`wave rectifier and is configured to convert AC (alternating
`current) Voltage from an input (i.e., an alternating current
`Source) into pulsating DC (direct current) Voltage to Supply
`the pulsating DC voltage to the ripple filter 113. The ripple
`filter 113 is configured to smooth the pulsating DC voltage to
`produce Smoothed DC voltage and then to apply the
`smoothed DC voltage across the primary coil 120 via the
`oscillator 115. For example, the filter 113 can beformed of an
`inductor and a capacitor (not shown) in the same way as the
`charger of the apparatus described in Japanese Patent Appli
`cation Publication Number 2003-244855 (hereinafter
`referred to as "conventional apparatus). That is, the capacitor
`is connected in series with the inductor, while the combina
`tion of the capacitor and the inductor is connected between
`the output terminals of the rectifier 112. The indicator 114
`includes, for example, at least one LED (a light emitting
`diode), and is configured to drive the LED in accordance with
`control of the controller 111 in order to show charging con
`dition of the power receiver 16. The oscillator 115 is config
`ured to periodically apply the Smoothed DC voltage across
`the primary coil 120 in accordance with control of the con
`troller 111. For example, the oscillator 115 can be formed of
`at least one Switching device and a diver (not shown) in the
`same way as the charger of the conventional apparatus. The
`Switching device is connected in series with the primary coil
`120, while the combination of the primary coil 120 and the
`switching device is connected in parallel with the capacitor of
`the ripple filter 113. Specifically, a first end of the primary coil
`120 is connected to the positive terminal of the capacitor of
`the filter 113, and a second terminal of the primary coil 120 is
`connected to the negative terminal of the capacitor via the
`switching device. The diver is configured to periodically turn
`the switching device on and offin accordance with control of
`the controller 111. In an example, preferably a snubber circuit
`formed of a capacitor and a resistor is connected in parallel
`with the primary coil 120. In an example, the power transmit
`ter 11 may further include a voltage converter that converts
`the smoothed DC voltage into predetermined DC voltage to
`apply the converted DC voltage across the primary coil 120
`via the oscillator 115.
`In the power receiver 16, for example, the rectifier 161
`includes at least one diode as a half or full wave rectifier, and
`is configured to convert the electric current obtained from the
`secondary coil 170 into a DC current to supply the DC current
`to the load 162. The load 162 is, but not limited to, a secondary
`battery (a battery pack). In an example, the rectifier 161 is
`formed of first and second diodes in the same way as the main
`body of the conventional apparatus. The cathode and anode of
`the first diode are connected to a first end of the secondary coil
`170 and the negative terminal of the secondary battery,
`respectively. The cathode and anode of the second diode are
`connected to the positive terminal of the secondary battery
`and a second end of the secondary coil 170, respectively.
`Polarities of the first and second ends of the secondary coil
`170 correspond to those of the primary coil 120, respectively.
`In this example, whenever the switching device of the trans
`mitter 11 is turned off, a current is supplied from the second
`ary coil 170 to the load 162. In another example, the receiver
`16 may further include a controller configured to connect the
`secondary battery to a power Supply, a load and so on of a
`secondary device. The controller can be formed of a switch
`device connected in parallel with the second diode, and a
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`US 8,421,574 B2
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`driver for turning the switch device on and off, like the main
`body of the conventional apparatus.
`The controller 111, rectifier 112, ripple filter 113, indicator
`114 and oscillator 115 are mounted on a printed circuit board,
`which together constitute a printed circuit assembly 110 as
`shown in FIG. 1A. The primary coil 120 is included in a
`primary coil block 12 together with a magnetic layer (or
`magnetic material) 121. On the other hand, the secondary
`battery (battery pack) is put in a battery compartment 151
`inside a housing 150 of the cell phone 15 to be covered with
`a battery cover 152, while the rectifier 161 is mounted on a
`printed circuit board (not shown) put in the housing 150. The
`secondary coil 170 is also included in a secondary coil block
`17 fixed on the inner face of the battery cover 152 (a holding
`member) which is physically separated from the primary side
`as shown in FIGS. 1A and 1B. The printed circuit board, on
`which the rectifier 161 is mounted, has two input terminals
`(not shown) electrically connected to both input terminals of
`the rectifier 161, respectively, and also has two output termi
`nals (not shown) electrically connected to both output termi
`nals of the rectifier 161, respectively. The input terminals of
`the printed circuit board are electrically connected with both
`ends of the secondary coil 170, respectively when the battery
`cover 152 supporting the secondary coil block 17 is attached
`to the housing 150. The output terminals of the printed circuit
`board are electrically connected with both terminals of the
`secondary battery when the secondary battery is put in the
`battery compartment 151.
`As shown in FIG. 3, the secondary coil block 17 in the
`secondary side further includes a magnetic layer 171, a shield
`layer 172 for shielding electromagnetic noise, and a heat
`insulation layer 173, which together are unified with the
`secondary coil 170. That is, the secondary coil 170 is a planar
`coil and the magnetic layer 171 is laminated on at least one
`side (an upper surface) of the secondary coil 170. The shield
`layer 172 is also laminated on at least the upper surface of the
`magnetic layer 171, and the heat insulation layer 173 is lami
`nated on the upper surface of the shield layer 172. Thereby,
`the secondary coil block 17 is formed, and the other side (an
`lower surface) of the secondary coil 170 in the block 17 is
`stuck on the inner face of the battery cover 152 through
`adhesive. However, not limited to this, in the present inven
`tion, at least the magnetic layer may be laminated on one side
`of the secondary coil and unified with the secondary coil, and
`also the secondary coil block may be located at other part of
`the secondary device.
`The secondary coil 170 is a single wire, a stranded wire,
`bundled wires, a self-bonding copper wire, parallel-laid
`multi-wires or the like. The single wire (hereinafter referred
`to as a “magnet wire') is a polyurethane enameled copper
`wire, a polyester enameled copper wire, an enameled copper
`wire or the like. The stranded wire is composed of a plurality
`of the magnet wires twisted together. The bundled wires area
`bundle of a plurality of the magnet wires. The self-bonding
`copper wire is the magnet wire, which is further covered with
`a self-bonding film Such as thermoplastic resin, thermosetting
`resin or the like. The parallel-laid multi-wires are made of a
`plurality of the magnet wires, and are arranged in parallel and
`fixed with adhesive. Preferably, the conductor of the magnet
`wire is in the shape of a square in section. The secondary coil
`170 may be a conductive pattern formed on a printed circuit
`board (not shown), or made though patterning, plating and
`etching, onto the battery cover 152 or a molding. A pattern of
`the coil 170 may be in the shape of a circle, a square, an ellipse
`or the like as shown in FIGS. 4A-4C.
`The magnetic layer 171 can be made of a nickel ferrite
`sheet (magnetic material) having a thickness in the range of
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`Ex.1023 / IPR2022-00118 / Page 17 of 21
`APPLE INC. v. SCRAMOGE TECHNOLOGY, LTD.
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`0.1-0.15 mm and 1000 or more of relative permeability, in
`view of thin style and easy handling as well as a coupling
`coefficient decided by relative permeability and thickness of
`the magnetic layer 171. However, not limited to this, the
`magnetic material of the magnetic layer 171 may be a sheet
`made from manganese ferrite, amorphous magnetic alloy,
`Fe—Nialloy (Permalloy), nanocrystalline magnetic material
`or the like. Or the magnetic material may be magnetic coat
`ing, or a magnetic mixture of resin and magnetic filler or
`magnetic powder, each of which contains nickel ferrite, man
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`ganese ferrite, amorphous magnetic alloy, Fe—Ni alloy,
`nanocrystalline magnetic material or the like.
`In order to form the magnetic layer 171 having a thickness
`in the range of 0.05-0.1 mm to further thin the secondary coil
`block 17, it is desirable to use magnetic material having 2000
`or more of relative permeability.
`FIG. 5 is a graph of coupling coefficients decided by rela
`tive permeability and thickness of the magnetic layer 171. In
`FIGS. 5, “A”, “B” and “C” are a thickness of the magnetic
`layer 171 each, and are 0.15 mm, 0.10 mm and 0.05 mm.
`respectively. Accordingly, if the relative permeability and
`thickness of the magnetic layer 171 are set as stated above, it
`is possible to enhance the power transmission efficiency from
`the primary side to the secondary side.
`As shown in FIG. 6A, the magnetic layer 171 can be
`laminated at a center cavity 171a and the circumference 171b
`of the secondary coil 170, as well as a surface layer 171c over
`the cavity 171a and circumference 171b. However, not lim
`ited to this, the magnetic layer 171 may be laminated as
`shown in FIGS. 6B-6E. In FIG. 6B, the magnetic layer 171 is
`laminated at the circumference 171b and the surface layer
`171c. In FIG. 6C, the magnetic layer 171 is laminated at the
`center cavity 171a, as well as a surface layer 171d over the
`cavity 171a and the surface of the secondary coil 170. In FIG.
`6D, the magnetic layer 171 is laminated at the surface layer
`171c. In FIG. 6E, the magnetic layer 171 is laminated at the
`center cavity 171a, and also laminated over the entire surface
`171e of the secondary coil 170, and thereby can enhance the
`efficiency of magnetic flux passes in the center of the coil 170.
`The shield layer 172 is, for example, copper foil or alumi
`num foil. As shown in FIG. 7A, when the magnetic layer 171
`is laminated at the center cavity 171a, circumference 171b
`and surface layer 171c, the shield layer 172 can be laminated
`at the circumference 172a of the magnetic layer 171, as well
`as a surface layer 172b over the magnetic layer 171 and the
`circumference 172a. However, not limited to this, the shield
`layer 172 may be laminated as shown in FIGS. 7B and 7C. In
`FIG. 7B, the magnetic layer 171 is laminated at the center
`cavity 171a and surface layer 171d, while the shield layer 172
`is laminated at the circumference 172c of the secondary coil
`170 and magnetic layer 171, as well as a surface layer 172d
`over the magnetic layer 171 and circumference 172c. In FIG.
`7C, the magnetic layer 171 is laminated at the center cavity
`171a and surface layer 171c, while the shield layer 172 is
`laminated over the entire surface