(19) United States
`(12) Patent Application Publication (η» Pub. No.: US 2014/0320369 Al
`Oct. 30,2014
`Azenui et al.
`(43) Pub. Date:
`
`US 20140320369A1
`
`(54) SHIELDING LAYER FOR A DEVICE HAVING
`A PLURALITY OF ANTENNAS
`
`(71) Applicant: BROADCOM CORPORATION,
`Irvine, CA (US)
`
`(72)
`
`Inventors: Ntsanderh (Christian) Azenui, Irvine,
`CA (US); John Walley, Ladera Ranch,
`CA (US)
`
`(21)
`
`.: 13/911,174
`Appl.No
`
`(22) Filed:
`
`Jun. 6, 2013
`
`Related U.S. Application Data
`(60) Provisional application No. 61/815,602, filed on Apr.
`24, 2013.
`
`Publication Classification
`
`(51) Int.Cl.
`H01Q1/52
`
`(2006.01)
`
`(52) U.S. Cl.
`CPC ....................................... H01Q 7/526 (2013.01)
`USPC ............................................... 343/841; 29/600
`
`(57)
`ABSTRACT
`A shielding layer is provided that reduces the coupling
`between magnetic field lines emanating from a plurality of
`antennas in an electronic device. In one embodiment, the
`shielding layer is a heterogeneous shielding layer that has
`different regions. Each region is configured to be positioned
`adjacent to a respective antenna. Each region is a different
`type of material, has a different thickness, and/or has other
`non-uniformities (e.g., different permeabilities) to concen­
`trate magnetic field lines in accordance to the properties of the
`respective antenna. In another embodiment, a heterogeneous
`shielding layer is provided that has different regions that are
`formed of a same material that is configured to concentrate
`magnetic field lines. Each region is configured to be posi­
`tioned adjacent to a respective antenna. The different regions
`are separated by gap to isolate the magnetic field lines ema­
`nating from the respective antenna, which reduces the cou­
`pling between the magnetic field lines.
`
`200B
`
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`Patent Application Publication Oct. 30, 2014 Sheet 1 of 9
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`Patent Application Publication Oct. 30, 2014 Sheet 3 of 9
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`US 2014/0320369 Al
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`FIG. 2C
`
`200E
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`Patent Application Publication Oct. 30, 2014 Sheet 4 of 9
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`US 2014/0320369 Al
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`300
`
`Form a first region of a shielding layer that covers a first
`portion of a substrate
`
`______________________ I______________________
`
`Form a second region of the shielding layer that covers a
`second portion of the substrate
`
`FIG. 3
`
`Form a gap that separates the first region from the second
`region
`
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`Patent Application Publication Oct. 30, 2014 Sheet 5 of 9
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`FIG. 5
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`Patent Application Publication Oct. 30, 2014 Sheet 6 of 9
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`009
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`Patent Application Publication Oct. 30, 2014 Sheet 7 of 9
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`US 2014/0320369 Al
`
`A
`
`708/\
`
`704 -
`
`708B
`
`706
`
`710
`
`210 x
`
`710
`
`212
`
`706
`
`708B <
`
`210 \ A 208
`A Π Z 2- 708A
`
`704
`
`A
`
`710
`
`4
`
`A F
`
`4
`
`700A...
`
`212
`
`208 -s.
`708A -
`
`ψ
`
`700B
`
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`Patent Application Publication Oct. 30, 2014 Sheet 8 of 9
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`US 2014/0320369 Al
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`800 ,.
`
`Λ
`
`Form a shielding layer that covers at least a portion of a
`substrate
`
`.......................................i.........................................,
`Form a gap in the shielding layer that separates the shielding |
`layer into at least a first region and a second region |
`
`FIG. 8
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`Patent Application Publication Oct. 30, 2014 Sheet 9 of 9
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`FIG. 9
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`US 2014/0320369 Al
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`1
`
`Oct. 30, 2014
`
`SHIELDING LAYER FORA DEVICE HAVING
`A PLURALITY OF ANTENNAS
`
`CROSS REFERENCE TO RELATED
`APPLICATION
`[0001] This application claims priority to U.S. Provisional
`Application Ser. No. 61/815,602, filed Apr. 24, 2013, the
`entirety of which is incorporated by reference herein.
`
`BACKGROUND
`[0002] 1. Technical Field
`[0003] The present invention relates to magnetic shielding
`technology.
`[0004] 2. Background Art
`[0005] The ownership and use of mobile devices, such as
`smart phones, are becoming increasingly widespread around
`the world. A current trend is the addition of more and more
`functions to these mobile devices to provide a wider variety of
`services. Such new functions include NFC (near field com­
`munication) and wireless power transfer (WPT) technolo­
`gies. NFC enables wireless communications between devices
`located in close proximity. WPT enables the charging of
`batteries of a device without a physical connection between a
`charger and the device. NFC and WPT each require an
`antenna. Accordingly, mobile device technology is moving
`towards including a plurality of antennas (e.g., a first antenna
`for NFC and a second antenna for WPT).
`[0006] During use, magnetic field lines emanate from each
`antenna included in a mobile device. Without proper shield­
`ing, the magnetic field lines from each antenna may cross
`each other, thereby resulting in a coupling effect that reduces
`the performance of the antennas. Additionally, these mag­
`netic field lines may interfere with other circuitry and/or
`components of the mobile device. For example, a battery may
`be in close proximity with a WPT antenna. Without proper
`shielding, the magnetic field lines produced by the WPT
`antenna and/or any other antenna included in the electronic
`device may induce eddy currents that flow through the bat­
`tery. This may result in a reduced charging efficiency of the
`battery and/or an undesirable heating of the battery.
`
`BRIEF SUMMARY
`[0007] Methods, systems, and apparatuses are described
`for shielding magnetic field lines emanating from a plurality
`of antennas of a device, substantially as shown in and/or
`described herein in connection with at least one of the figures,
`as set forth more completely in the claims.
`
`BRIEF DESCRIPTION OF THE
`DRAWINGS/FIGURES
`[0008] The accompanying drawings, which are incorpo­
`rated herein and form a part of the specification, illustrate
`embodiments and, together with the description, further serve
`to explain the principles of the embodiments and to enable a
`person skilled in the pertinent art to make and use the embodi­
`ments.
`[0009] FIG. 1 depicts a block diagram of an electronic
`device, according to an example embodiment.
`[0010] FIG. 2A shows an overhead view of a heterogeneous
`shielding layer, according to an embodiment.
`[0011] FIG. 2B shows a cross-sectional view of a hetero­
`geneous shielding layer, according to an embodiment.
`
`[0012] FIG. 2C shows a cross-sectional view of a hetero­
`geneous shielding layer, according to another embodiment.
`[0013] FIG. 2D shows a cross-sectional view of a hetero­
`geneous shielding layer, according to another embodiment.
`[0014] FIG. 2E shows a cross-sectional view of a hetero­
`geneous shielding layer, according to another embodiment.
`[0015] FIG. 3 shows a flowchart providing example steps
`for forming a heterogeneous shielding layer, according to an
`example embodiment.
`[0016] FIG. 4 shows an example step for forming a gap in a
`heterogeneous shielding layer, according to an example
`embodiment.
`[0017] FIG. 5 shows an example assembly including a het­
`erogeneous shielding layer and a plurality of antennas,
`according to an example embodiment.
`[0018] FIG. 6 depicts a block diagram of an electronic
`device, according to another example embodiment.
`[0019] FIG. 7A shows an overhead view of a heterogeneous
`shielding layer, according to another embodiment.
`[0020] FIG. 7B shows a cross-sectional view of a hetero­
`geneous shielding layer, according to an embodiment.
`[0021] FIG. 7C shows a cross-sectional view of a hetero­
`geneous shielding layer, according to another embodiment.
`[0022] FIG. 7D shows a cross-sectional view of a hetero­
`geneous shielding layer, according to another embodiment.
`[0023] FIG. 8 shows a flowchart providing example steps
`for forming a heterogeneous shielding layer, according to
`another example embodiment.
`[0024] FIG. 9 shows an example assembly including a het­
`erogeneous shielding layer and a plurality of antennas,
`according to another example embodiment.
`[0025] Embodiments will now be described with reference
`to the accompanying drawings. In the drawings, like refer­
`ence numbers indicate identical or functionally similar ele­
`ments. Additionally, the left-most digit(s) of a reference num­
`ber identifies the drawing in which the reference number first
`appears.
`
`DETAILED DESCRIPTION
`
`Introduction
`[0026] The present specification discloses numerous
`example embodiments. The scope of the present patent appli­
`cation is not limited to the disclosed embodiments, but also
`encompasses combinations of the disclosed embodiments, as
`well as modifications to the disclosed embodiments.
`[0027] References in the specification to “one embodi­
`ment,” “an embodiment,” “an example embodiment,” etc.,
`indicate that the embodiment described may include a par­
`ticular feature, structure, or characteristic, but every embodi­
`ment may not necessarily include the particular feature, struc­
`ture, or characteristic. Moreover, such phrases are not
`necessarily referring to the same embodiment. Further, when
`a particular feature, structure, or characteristic is described in
`connection with an embodiment, it is submitted that it is
`within the knowledge of one skilled in the art to affect such
`feature, structure, or characteristic in connection with other
`embodiments whether or not explicitly described.
`[0028] Furthermore, it should be understood that spatial
`descriptions (e.g, “above,” “below,” “up,” “left,” “right,”
`“down,” “top,” “bottom,” “vertical,” “horizontal,” etc.) used
`herein are for purposes of illustration only, and that practical
`implementations of the structures described herein can be
`spatially arranged in any orientation or manner.
`
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`Oct. 30, 2014
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`[0029] Numerous exemplary embodiments are described
`as follows. It is noted that any section/subsection headings
`provided herein are not intended to be limiting. Embodiments
`are described throughout this document, and any type of
`embodiment may be included under any section/subsection.
`Furthermore, disclosed embodiments may be combined with
`each other in any manner.
`[0030] In embodiments, a shielding layer is provided that
`reduces the coupling between magnetic field lines emanating
`from a plurality of antennas in an electronic device. In one
`embodiment, the shielding layer is a heterogeneous shielding
`layer that has different regions. Each region is configured to
`be positioned adjacent to a respective antenna. Each region is
`a different type of material, has a different thickness, and/or
`has other non-uniformities (e.g., different permeabilities) to
`concentrate magnetic field lines in accordance to the proper­
`ties of the respective antenna. In another embodiment, a het­
`erogeneous shielding layer is provided that has different
`regions that are formed of a same material that is configured
`to concentrate magnetic field lines. Each region is configured
`to be positioned adjacent to a respective antenna. The differ­
`ent regions are separated by gap to isolate the magnetic field
`lines emanating from the respective antenna, which reduces
`the coupling between the magnetic field lines.
`[0031] For example, apparatuses are described herein. In
`accordance with an embodiment, an apparatus includes a
`shielding layer that is formed of at least one material. The
`material is configured to concentrate magnetic field lines. The
`shielding layer includes a first region that has a first charac­
`teristic and a second region that has a second characteristic
`that is different from the first characteristic. The first region is
`configured to be positioned adjacent to at least a first antenna,
`and the second region is configured to be positioned adjacent
`to at least a second antenna.
`[0032] In accordance with another embodiment, the appa­
`ratus includes a shielding layer that has at least two regions
`separated by a gap. The at least two regions may or may not be
`formed of a same material and are configured to concentrate
`magnetic field lines. The shielding layer is configured to be
`positioned adjacent to a plurality of antennas.
`[0033] Furthermore, methods for forming a shielding layer
`are described herein. In accordance with an example method,
`a first region of the shielding layer that covers a first portion of
`a substrate is formed. The first region has a first characteristic.
`A second region of the shielding layer having a second char­
`acteristic that covers a second portion of the substrate is
`formed. The first portion covered by the first region is differ­
`ent from the second portion covered by the second region.
`[0034] Examples of these embodiments and further
`embodiments are described in the following sub-sections.
`[0035] Some electronic devices may include a magnetic
`shielding layer that is configured to concentrate magnetic
`field lines emanating from an adjacently positioned antenna
`to shield other circuitry and/or components of such electronic
`devices from the magnetic field lines. For example, an
`antenna included in an electronic device may be a wireless
`charging coil configured to wirelessly charge a battery
`included in the electronic device. The battery may be in close
`proximity of the wireless charging coil. As such, without
`proper shielding, the magnetic field lines produced by the
`wireless charging coil and/or the other antenna(s) included in
`the electronic device may induce eddy currents that flow
`through the battery. This may result in a reduced charging
`efficiency of the battery and/or an undesirable heating of the
`
`battery. Additionally, the magnetic field lines emanating from
`each antenna may cause a coupling effect, which reduces the
`performance of the antennas. To prevent such drawbacks, in
`various embodiments disclosed herein, a shielding layer is
`provided that is configured to reduce the coupling between
`magnetic field lines emanating from one or more antennas
`included in an electronic device and to prevent such magnetic
`field lines from interfering with circuitry and other compo­
`nents of such electronic device.
`[0036] For example, in embodiments, heterogeneous pat­
`terns may be implemented in a magnetic shield to increase
`isolation for the antennas. Such heterogeneous patterns may
`be implemented to create uniformities along the x-y dimen­
`sions or axes in the magnetic shield (in the plane of the
`magnetic shield), while the magnetic shield is uniform or not
`uniform along the z-axis (the thickness of the magnetic
`shield, which is the shortest dimension of the magnetic
`shield). Examples of such patterns include patterns of regions
`of different materials in the magnetic shield, patterns of
`regions of different permeabilities in the magnetic shield,
`patterns of regions of different thickness in the magnetic
`shield, patterns of grooves, slits, or gaps in the magnetic
`shield, and/or further types of patterns in the magnetic shield.
`In this manner a heterogeneous shielding layer is created,
`which is different from conventional homogeneous magnetic
`shields that tend to be planar, featureless, and uniformly made
`of a same material.
`Example Heterogeneous Shielding Layer Having Regions
`with Different Characteristics
`[0037] FIG. 1 depicts a block diagram 100 of an electronic
`device 102, according to an example embodiment. Electronic
`device 102 may be a device such as, but not limited to, a
`mobile device including a cell phone (e.g., a smart phone), a
`tablet, a netbook, a personal data assistant (PDA), a laptop
`computer, a handheld computer, or other mobile device, or
`may be a stationary device such as a desktop computer, and/or
`the like. Electronic device 102 may include further features
`that are not shown in FIG. 1 for ease of illustration.
`[0038] As shown in FIG. 1, electronic device 102 includes
`a heterogeneous shielding layer 106, a first antenna 112, a
`second antenna 114, and one or more optional additional
`antennas 116 contained in and/or mounted to a housing of
`electronic device 102. Heterogeneous shielding layer 106 is a
`magnetic shield configured to have one or more regions, such
`as a first region 108 and a second region 110, which have
`different characteristics from each other. Heterogeneous
`shielding layer 106 may be formed of at least one material
`(e.g., a ferrite material) that is configured to concentrate mag­
`netic field lines emanating from one or more of antennas 112,
`114, and 116 positioned adjacently to (e.g., situated on top of,
`onbottomof, next to, etc.) heterogeneous shielding layer 106
`to reduce the coupling between such magnetic field lines and
`to prevent such magnetic field lines from interfering with
`other components of electronic device 102. For example, one
`of the antennas included in electronic device 102, such as
`second antenna 114, may be a wireless charging coil (e.g., a
`wireless power transfer (WPT) antenna) configured to wire­
`lessly charge a rechargeable battery 118 included in elec­
`tronic device 102. As such, without proper shielding, the
`magnetic field lines produced by the wireless charging coil
`and/or the additional antennas included in electronic device
`102 may induce eddy currents that flow through the battery,
`which may result in a reduced charging efficiency of the
`battery and/or an undesirable heating of the battery. Thus, in
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`Oct. 30, 2014
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`an embodiment, heterogeneous shielding layer 106 may be
`configured to concentrate magnetic field lines emanating
`from one or more antennas included in electronic device away
`from the battery included in electronic device 102.
`[0039] Because antennas may have different properties, for
`example, operating at different frequencies, having different
`physical dimensions, etc., each antenna may emanate mag­
`netic field lines at varying strengths and/or directions. As
`such, a uniform shielding layer may not effectively shield
`magnetic field lines emanating from each antenna. That is,
`such a shielding layer may shield magnetic field lines ema­
`nating from one antenna more effectively than magnetic field
`lines emanating from another antenna. To prevent such a
`deficiency, each of the one or more regions of heterogeneous
`shielding layer 106 may be configured to have one or more
`different characteristics such that each region concentrates
`magnetic field lines emanating from a respective antenna
`situated thereon in accordance to the properties of the respec­
`tive antenna.
`[0040] Accordingly, as shown in FIG. 1, heterogeneous
`shielding layer 106 includes first region 108 and second
`region 110. First region 108 may be configured to concentrate
`magnetic field lines emanating from first antenna 112 posi­
`tioned adjacently thereto. Second region 110 may be config­
`ured to concentrate magnetic field lines emanating from sec­
`ond antenna 114 positioned adjacently thereto. First region
`108 and second region 110 may have one or more different
`characteristics from each other. For example first region 108
`and second region 110 may be made out of different materi­
`als, have different thicknesses and/or different permeabilities.
`“Permeability” refers a degree of magnetization that a mate­
`rial obtains in response to an applied magnetic field, and is
`typically expressed as “μ” (in units of henries per meter). The
`higher the value of permeability, the higher amount of mag­
`netization that the material obtains in response to an applied
`magnetic field.
`[0041] The characteristics for each region may be depen­
`dent on the properties of the respective antenna positioned
`adjacently thereto. For example, if the strength of the mag­
`netic field lines that emanate from first antenna 112 posi­
`tioned adjacently to first region 108 is greater than the
`strength of the magnetic field lines that are emanated from
`second antenna 114 positioned adjacently to second region
`110, first region 108 may be made out of a first material that
`is more effective at concentrating magnetic field lines (e.g.,
`higher permeability, greater thickness, etc.) than a second
`material from which second region 110 is made. In addition to
`or in lieu of being made out of different materials, first region
`108 may also be thicker and/or have a permeability greater
`than second region 110 to be configured to handle a greater
`strength magnetic field than second region 110.
`[0042] The variation in permeability among first region 108
`and second region 110 may also be based on the radio fre­
`quency (RF) field of the respective antennas positioned adja­
`cently thereto. Shielding layers may be configured such that
`they are more effective at concentrating magnetic field lines
`emanating from an antenna operating at certain frequencies.
`Thus, first region 108 may have a permeability that is effec­
`tive at concentrating magnetic field lines emanating from first
`antenna 112 operating at a first frequency, and second region
`110 may have a permeability that is effective at concentrating
`magnetic field lines emanating from second antenna 114
`operating at a second frequency that is different that the first
`frequency.
`
`[0043] In the example shown above in FIG. 1, heteroge­
`neous shielding layer 106 includes two rectangular regions
`(i.e., first region 108 and second region 110) that are situated
`adjacent to each other. In alternative embodiments, heteroge­
`neous shielding layer 106 may include any number of regions
`having their own respective characteristics (e.g., having one
`or more additional regions corresponding to optional antenna
`(s) 116). In addition, each of these regions may have other
`shapes, such as being, round, triangular, polygonal, irregu­
`larly shaped, etc. Moreover, each of these regions may be
`positioned in any manner.
`[0044] For instance, FIGS. 2A-2E show views of heteroge­
`neous shielding layers according to various example embodi­
`ments. In one example, FIG. 2A shows an overhead view
`200A of heterogeneous shielding layer 204, where a first
`region 206A of heterogeneous shielding layer 204 rings (e.g.,
`surrounds) a second region 206B of heterogeneous shielding
`layer 206. FIG. 2B-2E show cross-sectional views 200B-
`200E of heterogeneous shielding layer 204 along the line A-A
`of overhead view 200A of FIG. 2A in accordance to various
`embodiments.
`[0045] As shown in FIGS. 2A-2E, heterogeneous shielding
`layer 204 may be formed over or attached to a substrate 202.
`Substrate 202 is a physical material upon which a device, such
`as a semiconductor device (e.g., an integrated circuit), one or
`more antennas, and/or or one or layers of material (e.g., one or
`more magnetic shield layers, etc.) are applied. Examples of
`substrate 202 include a printed circuit board (PCB), or any
`other support structure known in the art used to support semi­
`conductor devices and hereinafter developed for performing
`functions of a printed circuit board. The term “printed circuit
`board” is defined as a board used to mechanically support and
`electrically connect electronic components using conductive
`pathways, tracks or signal traces etched from sheets of con­
`ductive material (e.g., one or more metals such as copper,
`aluminum, etc.) laminated onto a non-conductive substrate
`(e.g., plastic, fiberglass, or any other dielectric suitable to
`serve as a non-conductive substrate for a printed circuit
`board). It is noted that substrate 202 is optional and not
`required in all embodiments. It is further noted that additional
`materials and/or layers (e.g., adhesive layers) may be present
`in between and/or affixed adjacently to substrate 202 and/or
`heterogeneous shielding layer 204 that are not shown in
`FIGS. 2A-2E for ease of illustration. For instance, an adhe­
`sive layer (e.g., an epoxy, a laminate material, a glue, or other
`adhesive material) may be between heterogeneous shielding
`layer 204 and substrate 202 to adhere them together.
`[0046] Heterogeneous shielding layer 204 may be formed
`of at least one material that is configured to concentrate mag­
`netic field lines. In one embodiment, the at least one material
`may be a ferrite material. To reduce the coupling between a
`first antenna and a second antenna positioned adjacently
`thereto (e.g., first and second antennas 112 and 114 of FIG. 1),
`first region 206A may be configured to concentrate magnetic
`field lines emanating from the first antenna into second region
`206B, and second region 206B may be configured to concen­
`trate magnetic field lines emanating from the second antenna
`into first region 206A.
`[0047] For example, FIG. 2B shows a cross-sectional view
`of one loop (or coil) of a first antenna 208 positioned adjacent
`to first region 206A and of one loop of a second antenna 210
`positioned adjacent to second region 206B. Additional loops/
`coils of antennas 208 and 210, which may be present, are not
`shown in FIG. 2B for ease of illustration. Furthermore, for
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`ease of illustration, antennas 208 and 210 are not shown in
`FIGS. 2A, 2C, 2D, and 2E. As shown in FIG. 2B, first mag­
`netic field lines 212 generated by first antenna 208 are con­
`centrated in first region 206A, and second magnetic field lines
`214 generated by second antenna 210 are concentrated in
`second region 206B.
`[0048] First region 206A and second region 206B may have
`different characteristics. Forexample, in an embodiment, first
`region 206A may have a first permeability, and second region
`206B may have a second permeability that is different from
`the first permeability. In another embodiment, first region
`206A may be formed of a first material and second region
`206B may be formed of a second material that is different
`from the first material. For example, the first material may
`comprise a first ferrite material, and the second material may
`comprise a second ferrite material that is different from the
`second ferrite material. In another example, the first material
`may comprise a first iron-metal alloy (e.g., iron-nickel), and
`the second material may comprise a second iron-metal alloy
`that is different from the second ferrite material (e.g., has a
`different metal, is comprised by a different concentration of
`the same metal, etc.)
`[0049] In yet another embodiment, first region 206A may
`have a first thickness and second region 206B may have a
`second thickness that is different than the first thickness. For
`example, as shown in FIG. 2B, first region 206A has a first
`thickness of hl and second region 206B has a second thick­
`ness of h2, which is greater than hl. In this embodiment,
`second region 206B is configured to be positioned adjacently
`to an antenna that emanates magnetic field lines that are
`stronger than the magnetic field lines that emanate from an
`antenna that is positioned adjacently to first region 206A.
`[0050] In contrast, as shown in FIG. 2C, first region 206A
`has a first thickness of h2 and second region 206B has a
`second thickness of hl, which is less than h2. In this embodi­
`ment, first region 206A is configured to be positioned adja­
`cently to an antenna that emanates magnetic field lines that
`are stronger than the magnetic field lines that emanate from an
`antenna that is positioned adjacently to second region 206B.
`[0051] In another example, as shown in FIG. 2D, first
`region 206A and second region 206B may have the same
`thickness h. In accordance with this embodiment, first region
`206A and second region 206B may be characteristically dif­
`ferent in that first region 206A and second region 206 com­
`prise different materials and/or have different permeabilities.
`[0052] In a further embodiment, portions of first region
`206A and/or second region 206B may have varying thick­
`nesses. For example, as shown in FIG. 2E, first region 206A
`has a first portion 208A that has a thickness of hl and a second
`portion 208B that has a thickness of h2 that is greater than hl.
`Similarly, second region 206B has a first portion 210A that
`has a thickness of hl and a second portion 210B that has a
`thickness of h2 that is greater than hl. In this embodiment, an
`antenna that is positioned adjacently to first region 206A
`and/or second region 206B may emanate magnetic field lines
`in a non-uniform manner (e.g., the strength of the magnetic
`field lines may vary). Thus, first region 206A and/or second
`region 206B may be patterned to have varying thicknesses to
`effectively concentrate such magnetic field lines.
`[0053] In yet another embodiment, in addition to having
`different characteristics for first region 206A and second
`region 206B, a gap that separates first region 206A and sec­
`ond region 206B may be formed to further reduce the cou­
`pling between an antenna positioned adjacently to first region
`
`206A and an antenna positioned adjacently to second region
`206B. The gap may be formed using any suitable method,
`including by etching, etc.
`[0054] Such heterogeneous shield layers may be formed in
`any suitable manner. For instance, FIG. 3 shows a flowchart
`300 providing example steps for forming a heterogeneous
`shield layer, according to an example embodiment. For
`instance, heterogeneous shield layers 106 (FIG. 1) and 204
`(FIGS. 2A-2E) may be formed according to flowchart 300.
`Flowchart 300 is described as follows.
`[0055] As shown in FIG. 3, flowchart 300 begins with step
`302. In step 302, a first region of a shielding layer that covers
`a first portion of a substrate is formed. The first region has a
`first characteristic and is configured to be positioned adjacent
`to a first antenna. For example, with reference to FIG. 2A, first
`region 206A of heterogeneous shielding layer 204 is formed
`over an outer portion of substrate 202.
`[0056] In step 304, a second region of a shielding layer that
`covers a second portion of the substrate is formed. The first
`portion of the substrate is different than the second portion of
`the substrate. The second region is configured to be posi­
`tioned adjacent to a second antenna. For example, with ref­
`erence to FIG. 2A, first region 206B of heterogeneous shield­
`ing layer 204 is formed over an inner portion of substrate 202.
`[0057] Note that in embodiments, steps 302 and 304 may be
`performed separately or simultaneously. First and second
`regions 206A and 206B may be formed in any manner,
`including by flowing the corresponding base materials into a
`mold and allowing the materials to harden to form first and
`second regions 206A and 206B, by cutting, milling, or oth­
`erwise shaping each of first and second regions 206A and
`206B from a respective base solid material, and/or by forming
`first and second regions 206A and 206B in another manner,
`and by combining first and second regions 206A and 206B
`together. First and second regions 206A and 206B may be
`held together with or without an adhesive, by being mounted
`to substrate 202, and/or by being combined in another man­
`ner.
`[0058] In an embodiment, the first characteristic of the first
`region of the shielding layer is a first permeability and the
`second characteristic of the second region of the shielding
`layer is a second permeability that is different from the first
`permeability.
`[0059] In accordance with another embodiment, the first
`characteristic of the first region of the shielding layer is a first
`thickness and the second characteristic of the second region
`of the shielding layer is a second thickness that is different
`from the first thickness. For example, with reference to FIG.
`2B, first region 206A has a first thickness of hl and second
`region 206B has a second thickness of h2 that is greater than
`hl. With reference to FIG. 2C, first region 206A has a first
`thickness of h2 and second region 206B has a second thick­
`ness of hl that is less than h2.
`[0060] In accordance with yet another embodiment, the
`shielding layer comprises at least one material, such as, for
`example, a ferrite material that is configured to concentrate
`magnetic field lines.
`[0061] In accordance with a further embodiment, the
`shielding layer comprises at least two materials that are each
`configured to concentrate magnetic field lines. The first
`region comprises a first material of the at least two materials,
`and the second region comprises a second material of the at
`least two materials that is different than the first material. In
`accordance