Source: Reno Sub-Systems, Inc.
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`August 16, 2016 08:01 ET
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`Reno Sub-Systems Secures First EVC(TM) Matching Network Design Win
`and Large Production Order From Leading Semiconductor Equipment Maker
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`SPARKS, NV--(Marketwired - Aug 16, 2016) -
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`OEM order validates Reno technology and high-volume manufacturing viability
`Reno's system improves on traditional VVC performance to enable semiconductor manufacturing at or
`below 14nm
`Instantaneous Match™ capability of sub-500 µsec pulse-to-pulse matching demonstrates significant tune
`time and plasma stability improvements
`
`Reno Sub-Systems, a developer of high-performance radio frequency (RF) matching networks, RF power
`generators and gas flow management systems for semiconductor manufacturing, today announced that it has
`secured its first platform design win for its Electronically Variable Capacitor (EVC™) matching network. The order
`comes from a tier-one equipment manufacturer and will be installed as the default standard on its etch systems in
`a leading global semiconductor manufacturer's high-volume production facility. Reno secured the design win
`following successful beta testing with the end customer.
`
`Leading semiconductor manufacturers are driving semiconductor OEMs to improve film characteristics and
`process consistency between chambers and systems. These challenges are becoming greater as technology
`nodes shrink and move to multiple patterning, finFET logic gates, 3D NAND and through silicon via (TSV)
`devices.
`
`"Our EVC™ matching network was specifically designed to address the most challenging plasma-related
`deposition and etch processes," said Bob MacKnight, CEO of Reno Sub-Systems. "Microsecond RF tuning is
`essential for 14nm and below high volume manufacturing."
`
`The new, disruptive EVC™ technology enables unprecedented RF matching speeds not possible with vacuum
`variable capacitors (VVCs), which is the current industry standard. Reno's patented EVC technology facilitates
`the speed, accuracy and plasma stability unachievable by RF matches being used for etch and deposition
`processes today. This run-to-run repeatable and accurate Instantaneous Match™ technology enables the
`precise, high-aspect ratio, selectively anisotropic sharp-edge plasma processing required for next-generation
`devices, including 3D structures.
`
`"We recently completed our Series B round of funding to ramp to high-volume manufacturing," said MacKnight.
`"Having received our first major production order validates our technology and we are proud to be shipping in
`volume."
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`About Reno Sub-Systems
` Reno Sub-Systems Inc. has developed new and disruptive technologies for the semiconductor and advanced
`microelectronic industries. Leveraging its patented technologies, Reno has demonstrated the highest-
`performance radio frequency (RF) matching networks, RF power generators and gas delivery systems for
`leading-edge nanoscale manufacturing processes. Reno has generated strong customer demand based on on-
`tool performance data, which has allowed the company to transition from technology and product development to
`high-volume adoption within two years. For more information, please visit http://www.renosubsystems.com.
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`Contact Information:
`
`Media Contact:
`Amy Smith
`401-369-9266
`amy@impresslabs.com
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`ADVANCED ENERGY INDUSTRIES INC.
`Exhibit 1030
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