Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 1 of 79
`
`UNITED STATES DISTRICT COURT
`FOR THE WESTERN DISTRICT OF TEXAS
`WACO DIVISION
`
`Ocean Semiconductor LLC,
`
`Plaintiff
`
`v.
`
`NXP Semiconductors N.V., NXP B.V. and
`NXP USA, Inc.,
`
`Defendant.
`
`Civil Action No.: 6:20-cv-1212
`
`JURY TRIAL DEMANDED
`
`PATENT CASE
`
`COMPLAINT FOR PATENT INFRINGEMENT
`
`Plaintiff Ocean Semiconductor LLC (“Ocean Semiconductor” or “Plaintiff”) files this
`
`Complaint against NXP Semiconductors N.V. (“NXP Semiconductors”), NXP B.V. (“NXP B.V.”)
`
`and NXP USA, Inc. (“NXP USA”) (collectively “NXP” or “Defendant”), seeking damages and
`
`other relief for patent infringement, and alleges with knowledge to its own acts, and on information
`
`and belief as to other matters, as follows:
`
`NATURE OF THE ACTION
`
`1.
`
`This is an action for patent infringement arising under the Patent Laws of the
`
`United States, 35 U.S.C. § 1 et seq.
`
`THE PARTIES
`
`2.
`
`Plaintiff Ocean Semiconductor is a limited liability company organized and
`
`existing under the laws of the State of Delaware, and its registered agent for service of process in
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`

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`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 2 of 79
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`Delaware is Rita Carnevale, 717 N. Union Street, Wilmington, DE 19805.
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`3.
`
`On information and belief, NXP Semiconductors is a is a public limited liability
`
`company organized and existing under the laws of The Netherlands, and that NXP
`
`Semiconductors has a place of business at High Tech Campus 60, 5656 AG Eindhoven, The
`
`Netherlands.
`
`4.
`
`On information and belief, NXP B.V. is a private company with limited liability
`
`organized and existing under the laws of The Netherlands, and that NXP B.V. has a place of
`
`business at High Tech Campus 60, 5656 AG Eindhoven, The Netherlands.
`
`5.
`
`On information and belief, NXP USA is a corporation organized and existing
`
`under the laws of the state of Delaware, that NXP USA has its principal place of business at
`
`6501 William Cannon Drive West, Austin, TX 78735, and that Corporation Service Company
`
`d/b/a CSC-Lawyers Inc., located at 211 E. 7th Street, Suite 620, Austin, Texas 78701, is a
`
`registered agent for service.
`
`6.
`
`On information and belief, Defendant NXP sells, offers to sell, and/or uses
`
`products and services throughout the United States, including in this judicial District, and
`
`introduces infringing products and services into the stream of commerce knowing that they
`
`would be sold and/or used in this judicial District and elsewhere in the United States.
`
`7.
`
`Plaintiff Ocean Semiconductor is the assignee and owner of the patents at issue in
`
`this action: U.S. Patents Nos. 6,660,651, 6,907,305, 6,725,402, 6,968,248, 6,420,097, 7,080,330,
`
`6,836,691, and 8,676,538 (collectively, the “Asserted Patents”). Ocean Semiconductor holds all
`
`substantial rights, title, and interest in the Asserted Patents, including the exclusive right to sue
`
`NXP for infringement and recover damages, including damages for past infringement.
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`

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`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 3 of 79
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`8.
`
`Plaintiff Ocean Semiconductor seeks monetary damages and prejudgment interest
`
`for Defendant’s past and ongoing direct and indirect infringement of the Asserted Patents.
`
`9.
`
`Defendant NXP is a semiconductor company that designs, develops, sells, offers
`
`to sell, and imports into the United States semiconductor products in the communications,
`
`internet of things, automotive, computer, and consumer electronics industry (“Accused
`
`Products”).
`
`10.
`
`Defendant NXP, which has its own regular and established place of business in
`
`the United States (including two facilities in Austin, Texas), produces or contracts with third-
`
`party semiconductor fabricators or foundries (“NXP Foundry Partners”) that own, operate, or
`
`control semiconductor fabrication plants (“fabs”) within and/or outside of the United States
`
`(“International Facilities”) to produce the Accused Products. One such NXP Foundry Partner is
`
`United Microelectronics Corp. (“UMC”). Another such NXP Foundry Partner is Taiwan
`
`Semiconductor Manufacturing Company Ltd. (“TSMC”). Both UMC and/or TSMC have a
`
`contractual partnership with NXP to design, develop, or manufacture semiconductor products
`
`including integrated circuits for NXP. See, e.g., 2018 NXP Supplier List,
`
`https://www.nxp.com/docs/en/supporting-information/2018-SUPPLIER-LIST.pdf (last accessed
`
`October 27, 2020). Both UMC and/or TSMC have a contractual partnership with NXP to design,
`
`develop, or manufacture semiconductor products including integrated circuits for NXP.
`
`11.
`
`On information and belief, Defendant NXP (directly or through one or more of its
`
`Foundry Partners such as UMC and/or TSMC) has a contractual relationship with Applied
`
`Materials, Inc. (“Applied Materials”) (see, e.g., “NXP AND APPLIED MATERIALS SIGN
`
`COMPREHENSIVE SERVICE CONTRACT,” available at
`
`https://www.appliedmaterials.com/en-sg/company/news/press-releases/2010/07/nxp-and-
`
`

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`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 4 of 79
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`applied-materials-sign-comprehensive-service-contract (last visited Oct. 12, 2020); see also
`
`UMC’s YY Chen video, https://www.appliedmaterials.com/automation-software (last accessed
`
`October 12, 2020); see also Applied Materials’ job posting for “TSMC F15 E3 project,”
`
`available at
`
`http://www.mse.ntu.edu.tw/attachments/article/154/AMT_Summer%20Student%20Program_Job
`
`%20Post_2013.pdf (last accessed October 12, 2020) and PDF Solutions Inc. (“PDF Solutions”)
`
`(e.g., “Taiwan Semiconductor Manufacturing Company adopts PDF Solutions yield
`
`improvement technology,” available at https://www.edn.com/taiwan-semiconductor-
`
`manufacturing-company-adopts-pdf-solutions-yield-improvement-technology/ (last accessed
`
`Oct. 12, 2020); see also “Exensio: Big Data in the Fab,” available at
`
`https://semiwiki.com/eda/4351-exensio-big-data-in-the-fab/ (last accessed Oct. 12, 2020); see
`
`also NXP’s job posting requiring Exensio knowledge, “Analog Test Development Engineer,
`
`Entry Level,” available at
`
`https://webcache.googleusercontent.com/search?q=cache:A3A2EGiaq4gJ:https://careers.unl.edu/
`
`jobs/nxp-semiconductors-analog-test-development-engineer-entry-
`
`level/+&cd=3&hl=en&ct=clnk&gl=us (last visited Oct. 12, 2020)), and one or more of the NXP
`
`Foundry Partners (e.g., UMC and/or TSMC) employ Applied Materials’ semiconductor
`
`fabrication or manufacturing equipment, platforms, and/or framework, including Applied
`
`Materials’ E3 system, including the E3 factory advanced/automation process control (“APC”)
`
`hardware and/or software (collectively, “E3 system”), PDF Solutions’ Exensio hardware and/or
`
`software (collectively, “Exensio system”), and/or other in-house or third-party
`
`advanced/automation process control system and platform hardware and/or software (e.g., with
`
`similar technical and functional features) to design, develop, and/or manufacture Defendant
`
`

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`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 5 of 79
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`NXP’s semiconductor devices, including integrated circuits. See also “NXP and Applied
`
`Materials Sign Comprehensive Service Contract,” available at
`
`https://www.appliedmaterials.com/company/news/press-releases/2010/07/nxp-and-applied-
`
`materials-sign-comprehensive-service-contract (last accessed October 12, 2020); see also
`
`LinkedIn Profile for Kibeom Kim, Sr. Product Engineer at NXP Semiconductors, available at
`
`https://www.linkedin.com/in/kibeom-kim-3a77894b/ (last accessed October 12, 2020).
`
`12.
`
`Upon information and belief, UMC and/or TSMC employ(s) Applied Materials’
`
`and PDF Solutions’ semiconductor fabrication or manufacturing equipment, platforms, and/or
`
`framework (e.g., Applied Materials’ E3 system and/or PDF Solutions’ Exensio system) at their
`
`manufacturing facilities. Applied Materials has received supplier awards and recognition from
`
`UMC. See, e.g., https://www.appliedmaterials.com/files/nanochip-
`
`journals/nanochip_v7_iss2_112912.pdf (last accessed October 12, 2020); see also
`
`https://www.appliedmaterials.com/nanochip/nanochip-technology-journal/july-2014 (last visited
`
`October 12, 2020); see also https://www.appliedmaterials.com/files/nanochip-journals/nanochip-
`
`fab-solutions-12-2014-revised.pdf (last accessed October 12, 2020). Applied Materials also has
`
`received supplier awards and recognition from TSMC. See, e.g., “TSMC Recognizes
`
`Outstanding Suppliers at Supply Chain Management Forum,” available at
`
`https://pr.tsmc.com/english/news/1873 (last accessed October 12, 2020). On information and
`
`belief, TSMC also employs PDF Solutions’ Exensio system at TSMC’s manufacturing facilities.
`
`13.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners such as UMC and/or TSMC) employs Applied Materials’ E3 system and/or PDF
`
`Solutions’ Exensio system to design, develop or manufacture one or more systems, products,
`
`and/or devices for importation into the United States for use, sale, and/or offer for sale in this
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 6 of 79
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`District and throughout the United States, including, but not limited to, semiconductor products
`
`and devices, including ARM MCUs, power architecture processors, audio products, interfaces
`
`(e.g., translators, I/Os, repeaters/hubs/extenders, transceivers, and PMICs and system basis
`
`chips), peripherals and logic (switches, drivers, comparators, multiplexers, bridges, and clocks),
`
`power management products, sensors, RF products, security and authentication products,
`
`wireless connectivity products, and application-specific products, such as processors and
`
`microcontrollers (e.g., HC S12, HC S12X, S08, digital signal controllers, S12 MAGNIV mixed-
`
`signal controllers, digital signal processors, PowerQuicc communications processors, Coldfire
`
`MCUs/MPUs, legacy MPUs, MPC55XX MCUs, 5XX controllers, legacy MCUs, VFXXX
`
`controller solutions, MAC7100, MOBILEGT, crypto processors, media processors, S32K
`
`automotive MCUs, I/MX crossover MCUs, MAC57DXXX automotive MCUs, KEA MCUs,
`
`I.MX 6 processors, I.MX mature processors, I.MX 8 processors, I.MX28 processors, I.MX 7
`
`processors, Layerscape communication processors, S32V2 Vision MPUs, host and integrated
`
`host processors (including 8XXX, 7XXX, 7XX, and 6XX), QORIQ communication processors,
`
`MPC5XXX ultra-reliable MCUs, and S32R radar microcontrollers), audio products (e.g.,
`
`TEF66XXHN, TDF85XXXX, SAF35XXXX, SAF36XXXX, and TDA18XXXXHN), interfaces,
`
`(e.g., CBTL0XXXXXX, CBTU02044HE, GTL200XPW, MC33XXXBXXX, MC34XXX,
`
`MCZ339XXDXXXX, NTV200XXX, P82BXXTD, PCA3409AXX, PCA3416AXX,
`
`PCA85XXXX, PCA93XXXX, PCA95XXXX, PCA96XXXX, PCA97XXXX, PCA98XXXX,
`
`PCAL64XXXXX, PCAL65XXXXX, PCAL95XXXXX, PCF85XXXX, MCZ33XXXCXXEK,
`
`UJA116XATK, TJA1128XTK, ), peripherals and logic products (e.g., CBTXXXXXXXX,
`
`GTL200XPW, NCX2202GX, NCX2220GX, NCX2222GX, NTB0101GXX, NTB0102GXX,
`
`NTB0104GXX, NTS0101XX, NTS0102XX, NTS0104XX, NTV4XXXXUK, NX3DV221XX,
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 7 of 79
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`NX371G3157GM, ), power management products (e.g., ASL50XSHN, ASL250XSHN,
`
`ASL34XXSHN, ASL45XXSHN, MC32PFXXXX, MC33XXXXXX, MC3377XXXXXXX,
`
`MC3388XXXXXXX, ), RF devices (e.g., control circuits, low power TX/RX ICs, microwave
`
`LO generators, mixers, RF amplifiers, RF discrete components, RF power, Radar transceivers,
`
`and WLAN front-end modules), RFID devices (e.g., HITAG, MIFARE, NFC, and UCODE
`
`devices), security and authentications devices (e.g., A1006XX, A710XXXXX, SE050XXXXX,
`
`TDA80XXXX, OM67100), sensors (e.g., FXLNXXXXX, FXLSXXXXX, MP3VXXXXXXXX,
`
`MPXXXXXX, MPAXXXXXXXX, X3T-OHXXX, and KMXXX), and wireless connectivity
`
`devices (e.g., audio streaming devices, Bluetooth devices, DSRC modems, MCUSs, NFMI radio
`
`devices, thread, Wi-Fi and Bluetooth devices, wireless microcontrollers, and ZIGBEE), and
`
`similar systems, products, devices, and integrated circuits (“NXP APC Products”).
`
`14.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners such as UMC and/or TSMC) uses Applied Materials’ E3 system and/or PDF Solutions’
`
`Exensio system to design, develop, or manufacture the NXP APC Products for importation into
`
`the United States for use, sale, and/or offer for sale in this district and throughout the United
`
`States.
`
`15.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners such as UMC) also employs Applied Materials’ SmartFactory system or platform,
`
`including Advanced Productivity Family solutions and Smart Scheduling/Sched (collectively,
`
`“SmartFactory”) and/or other similar NXP proprietary or third-party scheduling and dispatching
`
`platform hardware and/or software (e.g., with similar technical and functional features) to design,
`
`develop, and/or manufacture Defendant NXP’s semiconductor devices, including integrated
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 8 of 79
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`circuits. See, e.g., “UMC Shares Success With The Applied SmartFactory®,” available at
`
`https://www.appliedmaterials.com/files/umc-china_0.mp4 (last accessed Oct. 12, 2020).
`
`16.
`
`Upon information and belief, Defendant NXP (directly or through its NXP
`
`Foundry Partners such as UMC) employs Applied Materials’ scheduling and dispatching
`
`platform (e.g., Applied Materials’ SmartFactory including SmartSched) at NXP’s or UMC’s
`
`manufacturing facilities.
`
`17.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners such as UMC) employs Applied Materials’ SmartFactory and/or other similar NXP
`
`proprietary or third-party scheduling and dispatching platform hardware and/or software (e.g.,
`
`with similar technical and functional features) to design, develop or manufacture one or more
`
`systems, products, and/or devices for importation into the United States for use, sale, and/or offer
`
`for sale in this District and throughout the United States, including, but not limited to,
`
`semiconductor products and devices, including ARM MCUs, power architecture processors,
`
`audio products, interfaces (e.g., translators, I/Os, repeaters/hubs/extenders, transceivers, and
`
`PMICs and system basis chips), peripherals and logic (switches, drivers, comparators,
`
`multiplexers, bridges, and clocks), power management products, sensors, RF products, security
`
`and authentication products, wireless connectivity products, and application-specific products,
`
`such as processors and microcontrollers (e.g., HC S12, HC S12X, S08, digital signal controllers,
`
`S12 MAGNIV mixed-signal controllers, digital signal processors, PowerQuicc communications
`
`processors, Coldfire MCUs/MPUs, legacy MPUs, MPC55XX MCUs, 5XX controllers, legacy
`
`MCUs, VFXXX controller solutions, MAC7100, MOBILEGT, crypto processors, media
`
`processors, S32K automotive MCUs, I/MX crossover MCUs, MAC57DXXX automotive MCUs,
`
`KEA MCUs, I.MX 6 processors, I.MX mature processors, I.MX 8 processors, I.MX28
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 9 of 79
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`processors, I.MX 7 processors, Layerscape communication processors, S32V2 Vision MPUs,
`
`host and integrated host processors (including 8XXX, 7XXX, 7XX, and 6XX), QORIQ
`
`communication processors, MPC5XXX ultra-reliable MCUs, and S32R radar microcontrollers),
`
`audio products (e.g., TEF66XXHN, TDF85XXXX, SAF35XXXX, SAF36XXXX, and
`
`TDA18XXXXHN), interfaces, (e.g., CBTL0XXXXXX, CBTU02044HE, GTL200XPW,
`
`MC33XXXBXXX, MC34XXX, MCZ339XXDXXXX, NTV200XXX, P82BXXTD,
`
`PCA3409AXX, PCA3416AXX, PCA85XXXX, PCA93XXXX, PCA95XXXX, PCA96XXXX,
`
`PCA97XXXX, PCA98XXXX, PCAL64XXXXX, PCAL65XXXXX, PCAL95XXXXX,
`
`PCF85XXXX, MCZ33XXXCXXEK, UJA116XATK, TJA1128XTK, ), peripherals and logic
`
`products (e.g., CBTXXXXXXXX, GTL200XPW, NCX2202GX, NCX2220GX, NCX2222GX,
`
`NTB0101GXX, NTB0102GXX, NTB0104GXX, NTS0101XX, NTS0102XX, NTS0104XX,
`
`NTV4XXXXUK, NX3DV221XX, NX371G3157GM, ), power management products (e.g.,
`
`ASL50XSHN, ASL250XSHN, ASL34XXSHN, ASL45XXSHN, MC32PFXXXX,
`
`MC33XXXXXX, MC3377XXXXXXX, MC3388XXXXXXX, ), RF devices (e.g., control
`
`circuits, low power TX/RX ICs, microwave LO generators, mixers, RF amplifiers, RF discrete
`
`components, RF power, Radar transceivers, and WLAN front-end modules), RFID devices (e.g.,
`
`HITAG, MIFARE, NFC, and UCODE devices), security and authentications devices (e.g.,
`
`A1006XX, A710XXXXX, SE050XXXXX, TDA80XXXX, OM67100), sensors (e.g.,
`
`FXLNXXXXX, FXLSXXXXX, MP3VXXXXXXXX, MPXXXXXX, MPAXXXXXXXX,
`
`X3T-OHXXX, and KMXXX), and wireless connectivity devices (e.g., audio streaming devices,
`
`Bluetooth devices, DSRC modems, MCUSs, NFMI radio devices, thread, Wi-Fi and Bluetooth
`
`devices, wireless microcontrollers, and ZIGBEE), and similar systems, products, devices, and
`
`integrated circuits (“NXP Scheduling Products”).
`
`

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`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 10 of 79
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`18.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners such as UMC) uses Applied Materials’ SmartFactory and/or other similar NXP
`
`proprietary or third-party scheduling and dispatching platform hardware and/or software (e.g.,
`
`with similar technical and functional features) to design, develop, or manufacture the NXP
`
`Scheduling Products for importation into the United States for use, sale, and/or offer for sale in
`
`this district and throughout the United States.
`
`19.
`
`On information and belief, Defendant NXP (directly and/or through its NXP
`
`Foundry Partners such as TSMC and/or UMC) has a contractual relationship with ASML
`
`Holding N.V. and/or its subsidiaries (“ASML”) (see, e.g., “ASML shares gain after reports of
`
`large TSMC order,” available at https://seekingalpha.com/news/3636158-asml-shares-gain-after-
`
`reports-of-large-tsmc-order (last visited Oct. 12, 2020); see also “ASML apparently beats Nikon
`
`for UMC’s huge 300-mm scanner order,” available at https://www.eetimes.com/asml-
`
`apparently-beats-nikon-for-umcs-huge-300-mm-scanner-order/ (last accessed October 12, 2020);
`
`see also “ASML’s NXE Platform Performance,” available at
`
`http://euvlsymposium.lbl.gov/pdf/2013/pres/RudyPeeters.pdf (last visited Oct. 12, 2020); see
`
`also “UMC buys equipment from ASML,” available at
`
`https://www.digitimes.com/news/a20160621PM200.html (last visited Oct. 12, 2020); see also
`
`“BRIEF-Taiwan’s UMC orders equipment from ASML for T$657 mln,” available at
`
`https://www.reuters.com/article/umc-corp-asml-holding-brief/brief-taiwans-umc-orders-
`
`equipment-from-asml-for-t657-mln-idUSS7N0P700I20140728 (last accessed October 12, 2020);
`
`see also LinkedIn Profile for Spencer Lin, Operation Manager at ASML, available at
`
`https://www.linkedin.com/in/spencer-lin-a48a0082/ (last visited Oct. 12, 2020); LinkedIn Profile
`
`for Leo Li, Product Engineer at ASML, available at https://www.linkedin.com/in/leo-li-
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 11 of 79
`
`74222754/ (last visited Oct. 12, 2020); LinkedIn Profile for Tsung Ming C., Applicant Engineer
`
`at ASML, available at https://www.linkedin.com/in/tsung-ming-c-49b4b77/ (last visited Oct. 12,
`
`2020); LinkedIn Profile for Vince Liu, Product Manager at ASML, available at
`
`https://www.linkedin.com/in/vince-liu-4820b149/ (last visited Oct. 12, 2020); and LinkedIn
`
`Profile for Henry Yeh, Applicant Engineer at ASML, available at
`
`https://www.linkedin.com/in/heavyyeh/ (last visited Oct. 12, 2020)), and that NXP, and/or one or
`
`more of the NXP Foundry Partners, employs ASML’s semiconductor fabrication or
`
`manufacturing equipment and/or platforms (e.g., ASML’s TWINSCAN system hardware and
`
`software or “TWINSCAN”) to design, develop, and/or manufacture Defendant NXP’s
`
`semiconductor products and devices, including ARM MCUs, power architecture processors,
`
`audio products, interfaces (e.g., translators, I/Os, repeaters/hubs/extenders, transceivers, and
`
`PMICs and system basis chips), peripherals and logic (switches, drivers, comparators,
`
`multiplexers, bridges, and clocks), power management products, sensors, RF products, security
`
`and authentication products, wireless connectivity products, and application-specific products,
`
`such as processors and microcontrollers (e.g., HC S12, HC S12X, S08, digital signal controllers,
`
`S12 MAGNIV mixed-signal controllers, digital signal processors, PowerQuicc communications
`
`processors, Coldfire MCUs/MPUs, legacy MPUs, MPC55XX MCUs, 5XX controllers, legacy
`
`MCUs, VFXXX controller solutions, MAC7100, MOBILEGT, crypto processors, media
`
`processors, S32K automotive MCUs, I/MX crossover MCUs, MAC57DXXX automotive MCUs,
`
`KEA MCUs, I.MX 6 processors, I.MX mature processors, I.MX 8 processors, I.MX28
`
`processors, I.MX 7 processors, Layerscape communication processors, S32V2 Vision MPUs,
`
`host and integrated host processors (including 8XXX, 7XXX, 7XX, and 6XX), QORIQ
`
`communication processors, MPC5XXX ultra-reliable MCUs, and S32R radar microcontrollers),
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 12 of 79
`
`audio products (e.g., TEF66XXHN, TDF85XXXX, SAF35XXXX, SAF36XXXX, and
`
`TDA18XXXXHN), interfaces, (e.g., CBTL0XXXXXX, CBTU02044HE, GTL200XPW,
`
`MC33XXXBXXX, MC34XXX, MCZ339XXDXXXX, NTV200XXX, P82BXXTD,
`
`PCA3409AXX, PCA3416AXX, PCA85XXXX, PCA93XXXX, PCA95XXXX, PCA96XXXX,
`
`PCA97XXXX, PCA98XXXX, PCAL64XXXXX, PCAL65XXXXX, PCAL95XXXXX,
`
`PCF85XXXX, MCZ33XXXCXXEK, UJA116XATK, TJA1128XTK, ), peripherals and logic
`
`products (e.g., CBTXXXXXXXX, GTL200XPW, NCX2202GX, NCX2220GX, NCX2222GX,
`
`NTB0101GXX, NTB0102GXX, NTB0104GXX, NTS0101XX, NTS0102XX, NTS0104XX,
`
`NTV4XXXXUK, NX3DV221XX, NX371G3157GM, ), power management products (e.g.,
`
`ASL50XSHN, ASL250XSHN, ASL34XXSHN, ASL45XXSHN, MC32PFXXXX,
`
`MC33XXXXXX, MC3377XXXXXXX, MC3388XXXXXXX, ), RF devices (e.g., control
`
`circuits, low power TX/RX ICs, microwave LO generators, mixers, RF amplifiers, RF discrete
`
`components, RF power, Radar transceivers, and WLAN front-end modules), RFID devices (e.g.,
`
`HITAG, MIFARE, NFC, and UCODE devices), security and authentications devices (e.g.,
`
`A1006XX, A710XXXXX, SE050XXXXX, TDA80XXXX, OM67100), sensors (e.g.,
`
`FXLNXXXXX, FXLSXXXXX, MP3VXXXXXXXX, MPXXXXXX, MPAXXXXXXXX,
`
`X3T-OHXXX, and KMXXX), and wireless connectivity devices (e.g., audio streaming devices,
`
`Bluetooth devices, DSRC modems, MCUSs, NFMI radio devices, thread, Wi-Fi and Bluetooth
`
`devices, wireless microcontrollers, and ZIGBEE), and similar systems, products, devices, and
`
`integrated circuits (“NXP TWINSCAN Products”).
`
`20.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners such as TSMC and/or UMC) uses ASML’s TWINSCAN platform and/or its software to
`
`

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`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 13 of 79
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`design, develop, or manufacture the NXP TWINSCAN Products for importation into the United
`
`States for use, sale, and/or offer for sale in this district and throughout the United States.
`
`21.
`
`On information and belief, Defendant NXP (directly and/or through its NXP
`
`Foundry Partners such as TSMC and/or UMC) has a contractual relationship with ASML and/or
`
`its subsidiaries (see, e.g., “ASML shares gain after reports of large TSMC order,” available at
`
`https://seekingalpha.com/news/3636158-asml-shares-gain-after-reports-of-large-tsmc-order (last
`
`visited Oct. 12, 2020); see also “ASML apparently beats Nikon for UMC’s huge 300-mm
`
`scanner order,” available at https://www.eetimes.com/asml-apparently-beats-nikon-for-umcs-
`
`huge-300-mm-scanner-order/ (last accessed October 12, 2020); see also “ASML’s NXE
`
`Platform Performance,” available at
`
`http://euvlsymposium.lbl.gov/pdf/2013/pres/RudyPeeters.pdf (last visited Oct. 12, 2020); see
`
`also “UMC buys equipment from ASML,” available at
`
`https://www.digitimes.com/news/a20160621PM200.html (last visited Oct. 12, 2020); see also
`
`“BRIEF-Taiwan’s UMC orders equipment from ASML for T$657 mln,” available at
`
`https://www.reuters.com/article/umc-corp-asml-holding-brief/brief-taiwans-umc-orders-
`
`equipment-from-asml-for-t657-mln-idUSS7N0P700I20140728 (last accessed October 12, 2020);
`
`see also LinkedIn Profile for Spencer Lin, Operation Manager at ASML, available at
`
`https://www.linkedin.com/in/spencer-lin-a48a0082/ (last visited Oct. 12, 2020); LinkedIn Profile
`
`for Leo Li, Product Engineer at ASML, available at https://www.linkedin.com/in/leo-li-
`
`74222754/ (last visited Oct. 12, 2020); LinkedIn Profile for Tsung Ming C., Applicant Engineer
`
`at ASML, available at https://www.linkedin.com/in/tsung-ming-c-49b4b77/ (last visited Oct. 12,
`
`2020); LinkedIn Profile for Vince Liu, Product Manager at ASML, available at
`
`https://www.linkedin.com/in/vince-liu-4820b149/ (last visited Oct. 12, 2020); and LinkedIn
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`

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`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 14 of 79
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`Profile for Henry Yeh, Applicant Engineer at ASML, available at
`
`https://www.linkedin.com/in/heavyyeh/ (last visited Oct. 12, 2020)), and that NXP, and/or one or
`
`more of the NXP Foundry Partners, employs ASML’s semiconductor fabrication or
`
`manufacturing equipment and/or platforms (e.g., ASML’s YieldStar metrology and inspection
`
`system hardware and software or “YieldStar”) to design, develop, and/or manufacture Defendant
`
`NXP’s semiconductor products and devices, including ARM MCUs, power architecture
`
`processors, audio products, interfaces (e.g., translators, I/Os, repeaters/hubs/extenders,
`
`transceivers, and PMICs and system basis chips), peripherals and logic (switches, drivers,
`
`comparators, multiplexers, bridges, and clocks), power management products, sensors, RF
`
`products, security and authentication products, wireless connectivity products, and application-
`
`specific products, such as processors and microcontrollers (e.g., HC S12, HC S12X, S08, digital
`
`signal controllers, S12 MAGNIV mixed-signal controllers, digital signal processors, PowerQuicc
`
`communications processors, Coldfire MCUs/MPUs, legacy MPUs, MPC55XX MCUs, 5XX
`
`controllers, legacy MCUs, VFXXX controller solutions, MAC7100, MOBILEGT, crypto
`
`processors, media processors, S32K automotive MCUs, I/MX crossover MCUs, MAC57DXXX
`
`automotive MCUs, KEA MCUs, I.MX 6 processors, I.MX mature processors, I.MX 8
`
`processors, I.MX28 processors, I.MX 7 processors, Layerscape communication processors,
`
`S32V2 Vision MPUs, host and integrated host processors (including 8XXX, 7XXX, 7XX, and
`
`6XX), QORIQ communication processors, MPC5XXX ultra-reliable MCUs, and S32R radar
`
`microcontrollers), audio products (e.g., TEF66XXHN, TDF85XXXX, SAF35XXXX,
`
`SAF36XXXX, and TDA18XXXXHN), interfaces, (e.g., CBTL0XXXXXX, CBTU02044HE,
`
`GTL200XPW, MC33XXXBXXX, MC34XXX, MCZ339XXDXXXX, NTV200XXX,
`
`P82BXXTD, PCA3409AXX, PCA3416AXX, PCA85XXXX, PCA93XXXX, PCA95XXXX,
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 15 of 79
`
`PCA96XXXX, PCA97XXXX, PCA98XXXX, PCAL64XXXXX, PCAL65XXXXX,
`
`PCAL95XXXXX, PCF85XXXX, MCZ33XXXCXXEK, UJA116XATK, TJA1128XTK, ),
`
`peripherals and logic products (e.g., CBTXXXXXXXX, GTL200XPW, NCX2202GX,
`
`NCX2220GX, NCX2222GX, NTB0101GXX, NTB0102GXX, NTB0104GXX, NTS0101XX,
`
`NTS0102XX, NTS0104XX, NTV4XXXXUK, NX3DV221XX, NX371G3157GM, ), power
`
`management products (e.g., ASL50XSHN, ASL250XSHN, ASL34XXSHN, ASL45XXSHN,
`
`MC32PFXXXX, MC33XXXXXX, MC3377XXXXXXX, MC3388XXXXXXX, ), RF devices
`
`(e.g., control circuits, low power TX/RX ICs, microwave LO generators, mixers, RF amplifiers,
`
`RF discrete components, RF power, Radar transceivers, and WLAN front-end modules), RFID
`
`devices (e.g., HITAG, MIFARE, NFC, and UCODE devices), security and authentications
`
`devices (e.g., A1006XX, A710XXXXX, SE050XXXXX, TDA80XXXX, OM67100), sensors
`
`(e.g., FXLNXXXXX, FXLSXXXXX, MP3VXXXXXXXX, MPXXXXXX, MPAXXXXXXXX,
`
`X3T-OHXXX, and KMXXX), and wireless connectivity devices (e.g., audio streaming devices,
`
`Bluetooth devices, DSRC modems, MCUSs, NFMI radio devices, thread, Wi-Fi and Bluetooth
`
`devices, wireless microcontrollers, and ZIGBEE), and similar systems, products, devices, and
`
`integrated circuits (“NXP YieldStar Products”).
`
`22.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners such as TSMC and/or UMC) uses ASML’s YieldStar platform and/or its software to
`
`design, develop, or manufacture the NXP YieldStar Products for importation into the United
`
`States for use, sale, and/or offer for sale in this district and throughout the United States.
`
`23.
`
`On information and belief, Defendant NXP (directly and/or through its NXP
`
`Foundry Partners) employs the infringing method of forming circuit structures to design,
`
`develop, and/or manufacture Defendant NXP’s semiconductor products and devices, including
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 16 of 79
`
`ARM MCUs, power architecture processors, audio products, interfaces (e.g., translators, I/Os,
`
`repeaters/hubs/extenders, transceivers, and PMICs and system basis chips), peripherals and logic
`
`(switches, drivers, comparators, multiplexers, bridges, and clocks), power management products,
`
`sensors, RF products, security and authentication products, wireless connectivity products, and
`
`application-specific products, such as processors and microcontrollers (e.g., HC S12, HC S12X,
`
`S08, digital signal controllers, S12 MAGNIV mixed-signal controllers, digital signal processors,
`
`PowerQuicc communications processors, Coldfire MCUs/MPUs, legacy MPUs, MPC55XX
`
`MCUs, 5XX controllers, legacy MCUs, VFXXX controller solutions, MAC7100, MOBILEGT,
`
`crypto processors, media processors, S32K automotive MCUs, I/MX crossover MCUs,
`
`MAC57DXXX automotive MCUs, KEA MCUs, I.MX 6 processors, I.MX mature processors,
`
`I.MX 8 processors, I.MX28 processors, I.MX 7 processors, Layerscape communication
`
`processors, S32V2 Vision MPUs, host and integrated host processors (including 8XXX, 7XXX,
`
`7XX, and 6XX), QORIQ communication processors, MPC5XXX ultra-reliable MCUs, and
`
`S32R radar microcontrollers), audio products (e.g., TEF66XXHN, TDF85XXXX,
`
`SAF35XXXX, SAF36XXXX, and TDA18XXXXHN), interfaces, (e.g., CBTL0XXXXXX,
`
`CBTU02044HE, GTL200XPW, MC33XXXBXXX, MC34XXX, MCZ339XXDXXXX,
`
`NTV200XXX, P82BXXTD, PCA3409AXX, PCA3416AXX, PCA85XXXX, PCA93XXXX,
`
`PCA95XXXX, PCA96XXXX, PCA97XXXX, PCA98XXXX, PCAL64XXXXX,
`
`PCAL65XXXXX, PCAL95XXXXX, PCF85XXXX, MCZ33XXXCXXEK, UJA116XATK,
`
`TJA1128XTK, ), peripherals and logic products (e.g., CBTXXXXXXXX, GTL200XPW,
`
`NCX2202GX, NCX2220GX, NCX2222GX, NTB0101GXX, NTB0102GXX, NTB0104GXX,
`
`NTS0101XX, NTS0102XX, NTS0104XX, NTV4XXXXUK, NX3DV221XX,
`
`NX371G3157GM, ), power management products (e.g., ASL50XSHN, ASL250XSHN,
`
`

`

`Case 6:20-cv-01212-ADA Document 1 Filed 12/31/20 Page 17 of 79
`
`ASL34XXSHN, ASL45XXSHN, MC32PFXXXX, MC33XXXXXX, MC3377XXXXXXX,
`
`MC3388XXXXXXX, ), RF devices (e.g., control circuits, low power TX/RX ICs, microwave
`
`LO generators, mixers, RF amplifiers, RF discrete components, RF power, Radar transceivers,
`
`and WLAN front-end modules), RFID devices (e.g., HITAG, MIFARE, NFC, and UCODE
`
`devices), security and authentications devices (e.g., A1006XX, A710XXXXX, SE050XXXXX,
`
`TDA80XXXX, OM67100), sensors (e.g., FXLNXXXXX, FXLSXXXXX, MP3VXXXXXXXX,
`
`MPXXXXXX, MPAXXXXXXXX, X3T-OHXXX, and KMXXX), and wireless connectivity
`
`devices (e.g., audio streaming devices, Bluetooth devices, DSRC modems, MCUSs, NFMI radio
`
`devices, thread, Wi-Fi and Bluetooth devices, wireless microcontrollers, and ZIGBEE), and
`
`similar systems, products, devices, and integrated circuits (“NXP Sub-30nm Products”).
`
`24.
`
`On information and belief, Defendant NXP (directly or through its NXP Foundry
`
`Partners) uses this infringing method to fabricate or manufacture the NXP Sub-30nm Products
`
`for importation into the United States for use, sale, and/or offer for sale in this district and
`
`throughout the United States.
`
`25.
`
`Defendant NXP works with third parties to design and/or develop third party
`
`products, such as processors and microcontrollers, audio products, interfaces, peripherals and
`
`logic products, power management products, RF devices, RFID devices, security and
`
`authentications devices, sensors, and wireless connectivity devices that include one or more NXP
`
`APC Products, NXP Scheduling Products, NXP TWINSCAN Products, NXP YieldStar Products
`
`and/or NXP Sub 30-nm Products (“Third Party Products”). NXP assists third parties from the
`
`automotive industry, directly or through others, to import the Third Party Products into the
`
`United States and offer to sell, and sell, such Third Party Products in the United States.
`
`J