(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT)
`
`(19) World Intellectual Property
`Organization
`International Bureau
`
`1111111111111111 IIIIII IIIII 11111111111111111111111111111111111 IIIII IIIII IIII IIIIIII IIII 11111111
`
`( 43) International Publication Date
`15 April 2004 (15.04.2004)
`
`PCT
`
`(10) International Publication Number
`WO 2004/031875 Al
`
`(51) International Patent Classification 7:
`
`GOSB 19/418
`
`(21) International Application Number:
`PCT/US2003/029980
`
`(22) International Filing Date:
`25 September 2003 (25.09.2003)
`
`(25) Filing Language:
`
`(26) Publication Language:
`
`English
`
`English
`
`(30) Priority Data:
`60/414,425
`
`30 September 2002 (30.09.2002) US
`
`(71) Applicant (for all designated States except US): TOKYO
`ELECTRON LIMITED [JP/JP]; TBS Broadcast Center,
`3-6 Akasaka 5-chome, Minato-ku,, Tokyo 107 (JP).
`
`(72) Inventors; and
`(75) Inventors/Applicants (for US only): FUNK, Merritt
`
`[US/US]; P.O. Box 29718, Austin, TX 78755-6718 (US).
`PETERSON, Raymond [US/US]; 18212 Lockwood
`Road, Manor, TX 78653 (US).
`
`(74) Agents: LAZAR, Dale, S. et al.; Pillsbury Winthrop LLP,
`P.O. Box 10500, McLean, VA 22102 (US).
`
`(81) Designated States (national): AE, AG, AL, AM, AT, AU,
`AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU,
`CZ, DE, DK, DM, DZ, EC, EE, EG, ES, Fl, GB, GD, GE,
`GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR,
`KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK,
`MN, MW, MX, MZ, NI, NO, NZ, OM, PG, PH, PL, PT,
`RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR,
`TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
`
`(84) Designated States (regional): ARIPO patent (GH, GM,
`KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZM, ZW),
`Eurasian patent (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM),
`European patent (AT, BE, BG, CH, CY, CZ, DE, DK, EE,
`ES, Fl, FR, GB, GR, HU, IE, IT, LU, MC, NL, PT, RO,
`
`[Continued on next page]
`
`iiiiiiii
`
`iiiiiiii - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
`(54) Title: METHOD AND APPARATUS FOR THE MONITORING AND CONTROL OF A SEMICONDUCTOR MANUFAC(cid:173)
`TURING PROCESS
`
`£-Diagnostics
`System
`ill
`
`Factory System
`105
`
`1
`
`I
`
`I
`
`r--------- --------------1
`I
`I
`
`(57) Abstract:
`An Advanced Process Control
`(APC) system including Graphical User Interfaces
`(Gills) is presented for monitoring and controlling
`a
`semiconductor manufacturing process
`that
`is
`performed by a semiconductor processing system. The
`semiconductor processing system includes a number
`of processing tools, a number of processing modules
`(chambers), and a number of sensors, and the APC
`system comprises an APC server, database, interface
`server, client workstation, and GUI component. The
`GUI is webbased and is viewable by a user using a web
`browser.
`
`---iiiiiiii
`---
`--
`---
`--iiiiiiii
`
`iiiiiiii
`
`Tool
`llQ
`
`PM!
`120
`
`Sensor
`130
`
`PM4
`120
`
`Sensor
`130
`
`100
`
`Database
`- - - 190
`
`n
`t
`
`APC
`Server
`160
`
`I
`I
`I
`I
`I
`I
`I
`I
`I
`
`/
`I
`
`1
`
`Sensor
`Interface
`140
`
`V
`
`(JS)
`150
`
`Sensor
`Interface
`140
`
`I
`I
`I
`I
`
`I
`I
`I
`I
`I
`I
`I
`I
`~-~~1
`I
`I
`
`I
`
`Client
`Workstation
`110
`' - - -~ - - - ' I
`
`1
`
`I
`
`I
`
`GUI
`180
`
`I
`
`I
`
`I
`I
`I
`
`I
`
`[ _____ ,----------------1
`
`145
`
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`WO 2004/031875 Al
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`1111111111111111 IIIIII IIIII 11111111111111111111111111111111111 IIIII IIIII 11111111111111111111111
`
`SE, SI, SK, TR), OAPI patent (BF, BJ, CF, CG, CI, CM,
`GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
`
`Published:
`with international search report
`before the expiration of the time limit for amending the
`claims and to be republished in the event of receipt of
`amendments
`
`For two-letter codes and other abbreviations, refer to the "Guid(cid:173)
`ance Notes on Codes and Abbreviations" appearing at the begin(cid:173)
`ning of each regular issue of the PCT Gazette.
`
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`WO 2004/031875
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`PCT /0S2003/029980
`
`Method and Apparatus for the Monitoring and Control of a
`Semiconductor Manufacturing Process
`Cross-reference to Related Applications
`
`[0001]
`
`The present application is based on and derives benefit from US
`
`Provisional Application No. 60/414,425, filed September 30, 2002, the entire
`
`contents of which are incorporated herein by reference.
`
`[0002] The present application is related to co-pending applications US
`
`Provisional Application No. 60/368, 162, entitled "Method For Interaction With
`
`Status and Control Apparatus", filed on March 29, 2002; US Provisional
`
`Application No. 60/374,486, entitled "Method and Apparatus for Simplified
`
`System Configuration", filed on April 23, 2002; US Provisional Application No.
`
`60/383,619, entitled "Method and Apparatus For Monitoring Tool
`
`Performance", filed on May 29, 2002; US Provisional Application No.
`
`60/393,091, entitled "Method for Dynamic Sensor Configuration and Runtime
`
`Execution", filed on July 3, 2002; and US Provisional Application No.
`
`60/393, 104, entitled "Method and Apparatus for Automatic Sensor
`
`Installation", filed on July 3, 2002. Each of these applications is herein
`
`incorporated by reference in its entirety.
`
`Field of the Invention
`
`[0003] The presen\ invention is related to semiconductor processing
`
`systems, particularly,.to semiconductor processing systems, which use
`
`Advanced Process Control (APC).
`
`Background of the Invention
`
`[0004] Computers are generally used to control, monitor, and initialize
`
`manufacturing processes. A computer is ideal for these operations given the
`
`complexities in a semiconductor manufacturing plant from the reentrant wafer
`
`flows, critical processing steps, and maintainability of the processes. Various
`
`input/output (1/0) devices are used to control and monitor process flows,
`
`wafer states, and maintenance schedules. A variety of tools exist in a
`
`semiconductor manufacturing plant to complete these complicated steps from
`
`critical operations such as etching, to batch processing, and inspections. Most
`
`tool installations are accomplished using a display screen that is part of the
`
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`
`graphical user interface (GUI) of a control computer containing the installation
`
`software. Installation of a semiconductor-processing tool is a time consuming
`
`procedure.
`
`[0005] Semiconductor processing facilities require constant monitoring.
`
`Processing conditions change over time with the slightest changes in critical
`
`process parameters creating undesirable results. Small changes can easily
`
`occur in the composition or pressure of an etch gas, process chamber, or
`
`wafer temperature. In many cases, changes of process data reflecting
`
`deterioration of processing characteristics cannot be detected by simply
`
`referring to the process data displayed. It is difficult to detect early stage
`
`abnormalities and characteristic deterioration of a process. Oftentimes
`
`prediction and pattern recognition offered by advanced process control (APC)
`
`is necessary.
`[0006] Facility control is often performed by a number of different control
`
`systems having a variety of controllers. Some of the control systems may
`
`have man-machine interfaces such as touch screens, while others may only
`
`collect and display one variable such as temperature. The monitoring system
`
`must be able to collect data tabulated for the process control system. The
`
`data collection of the monitoring system must handle univariate and
`
`multivariate data, the analysis and display of the data, and have the ability to
`
`select the process variables to collect. Various conditions in a process are
`
`monitored by different sensors provided in each of the process chambers, and
`
`data of the monitored conditions is transferred and accumulated in a control
`
`computer. If the process data is displayed and detected automatically, the
`
`optimum process conditions of a mass-production line can be set and
`
`controlled through statistical process control (SPC) charts. Inefficient
`
`monitoring of a facility can result in facility downtimes that add to the overall
`
`operational cost.
`
`Summary of the Invention
`
`[0007] Accordingly, it is an object of the present invention to provide an
`
`Advanced Process Control (APC) system for controlling a processing tool in a
`
`semiconductor processing environment, where the APC system comprises an
`
`APC server providing a plurality of APC related applications; an Interface
`
`- 2 -
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`Server (IS) coupled to the APC server; a database coupled to the IS and APC
`
`server; and a GUI component coupled to the APC server, wherein the IS
`
`comprises means for coupling to a processing tool, and means for coupling to
`
`a plurality of process modules coupled to the processing tool.
`
`[0008]
`
`In addition, it is an object of the present invention to provide a method
`
`for using an Advanced Process Control (APC) system for controlling a
`
`processing tool in a semiconductor processing environment, the method
`
`comprising: providing an APC server providing a plurality of APC related
`
`applications; providing an Interface Server (IS) coupled to the APC server;
`
`providing a database coupled to the IS and APC server; and providing a GUI
`
`component coupled to the APC server, wherein the IS comprises means for
`
`coupling to a processing tool, and means for coupling to a plurality of process
`
`modules coupled to the processing tool.
`
`Brief Description of the Drawings
`
`[0009] The accompanying drawings, which are incorporated in and
`
`constitute a part of the specification, illustrate presently preferred
`
`embodiments of the invention, and together with the general description given
`
`above and the detailed description of the preferred embodiments given below,
`
`serve to explain the principles of the invention. A more complete appreciation
`
`of the invention and many of the attendant advantages thereof will become
`
`readily apparent with reference to the following detailed description,
`
`particularly when considered in conjunction with the accompanying drawings,
`
`in which:
`[0010] FIG. 1 shows an exemplary block diagram of an advanced process
`
`controlled (APC) system in a semiconductor manufacturing environment in
`
`accordance with one embodiment of the present invention;
`
`[0011]
`
`. FIG. 2 shows an exemplary block diagram of a system from Tokyo
`
`Electron Inc;
`[0012] FIG. 3 is a simplified data flow diagram for the APC system in
`
`accordance with one embodiment of the present invention;
`
`[0013] FIG. 4 illustrates a simplified interface diagram in accordance with an
`
`embodiment of the present invention;
`
`- 3 -
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`[0014] FIG. 5 shows an exemplary relationship diagram for event contexts,
`
`strategies, control jobs, and plans in accordance with an embodiment of the
`
`present invention;
`[0015] FIG. 6 illustrates a simplified data flow diagram in accordance with an
`
`embodiment of the present invention;
`
`[0016] FIG. 7 shows an exemplary block diagram of an interface server in
`
`accordance with an embodiment of the present invention;
`
`[0017] FIG. 8 shows a simplified view of a flow diagram for a monitoring
`
`process for processing tools in a semiconductor processing system in
`
`accordance with one embodiment of the present invention;
`
`[0018] FIG. 9 shows an exemplary relationship diagram for strategies and
`
`plans;
`
`[0019] FIG. 10 shows another exemplary relationship diagram for strategies
`
`and plans;
`[0020] FIG. 11 shows an exemplary relationship diagram for judgment plans
`
`and intervention plan in accordance with one embodiment of the present
`
`invention; and
`
`[0021] FIG. 12 shows an exemplary view of a Tool Status screen in
`
`accordance with one embodiment of the present invention.
`
`Detailed Description of an Embodiment
`
`[0022] FIG. 1 shows an exemplary block diagram of an APC system in a
`
`semiconductor manufacturing environment in accordance with one
`
`embodiment of the present invention. In the illustrated embodiment,
`
`semiconductor manufacturing environment 100 comprises at least one
`
`semiconductor processing tool 110, multiple process modules 120, PM1
`
`through PM4, multiple sensors 130 for monitoring the tool, the modules, and
`
`processes, sensor interface 140, and APC system 145. APC system 145 can
`
`comprise interface server (IS) 150, APC server 160, client workstation 170,
`
`GUI component 180, and database 190. In one embodiment, IS 150 can
`
`comprise a real-time memory database that can be viewed as a "Hub".
`
`[0023] APC system 145 can comprise a tool level (TL) controller (not shown)
`
`for controlling at least one of a processing tool, a process module, and a
`
`sensor.
`
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`[0024]
`
`In the illustrated embodiment, a single tool 110 is shown along with
`
`four process modules 120, but this is not required for the invention. The APC
`
`system 145 can interface with a number of processing tools including cluster
`
`tools having one or more process modules, and the APC system 145 can be
`
`used fo configure and monitor a number of processing tools including cluster
`
`tools having one or more process modules. For example, the tools and their
`
`associated process modules can be used to perform etching, feature
`
`trimming, deposition, diffusion, cleaning, measurement, polishing, developing,
`
`transfer, storage, loading, unloading, aligning, temperature control,
`
`lithography, integrated metrology (IM), optical data profiling (ODP), particle
`
`detection, arc suppression, and other semiconductor manufacturing
`
`processes.
`[0025] An IM element can be arranged as a module (integrated metrology
`
`module; IMM) coupled to the processing tool. For example, IMM can be an
`
`ODP system (from Timbre Inc.) that measures and analyzes the shape of the
`
`features of the wafer.
`
`[0026]
`
`In one embodiment, processing tool 110 can comprise a tool agent
`
`(not shown), which can be a software process that runs on a tool 110 and
`
`which can provide event information, context information, and start-stop timing
`
`commands used to synchronize data acquisition with the tool process. Also,
`
`APC system 145 can comprise an agent client (not shown) that can be a
`
`software process that can be used to provide a connection to the tool agent.
`
`For example, APC system 145 can be connected to processing tool 110 via
`
`an Internet or intranet connection.
`[0027] For example, an agent client can be used to receive events and their
`
`associated messages from a tool agent and propagate those messages on
`
`through the APC system. The client software can comprise a
`
`communications class, and a driver. The agent client communications class
`
`can be designed as a reusable class that is implemented as a dynamically
`
`loadable module (DLL). There can also be a message class that is used to
`
`parse messages from the tool agent and break those messages out into
`
`elements. An agent message class can instantiated with a string received
`
`from the tool agent as a parameter. At the time of instantiation, the string is
`
`parsed and all class attributes are filled with the data from that string. The
`
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`agent client communication class communicates with the tool agent via BSD
`
`sockets, and it can comprise the following methods:
`
`[0028] a. Start Agent: A method that establishes communications with the
`
`tool agent and sends the agent the start message. When the start
`
`acknowledged message is received from the agent, the connection is closed
`
`and the event receive thread is spawned. When the initial connection is
`
`established with the agent, the local interface that found the tool is stored.
`[0029] b. Event Receive Thread: This establishes the "event listen"
`
`connection with the agent. Once the connection is established, the thread
`
`waits indefinitely for a message from the agent. When a message is received,
`
`a new agent message object is instantiated and is placed in the message
`
`queue. The thread then goes back into the "waiting for message" state.
`[0030] c. Get Next Message: A method that gets the next object off of the
`
`message queue and passes it back to the caller.
`[0031] d. Stop Agent: A method that sends a stop signal to the tool agent.
`
`When it receives the stop signal, the tool can close its connection with the
`
`event receive thread. When the event receive thread senses the connection
`
`is closed, it is eliminated.
`[0032]
`
`In one embodiment, processing tool 110 communicates with the IS
`
`150 using sockets. For example, the interface can be implemented using
`
`TCP/IP socket communication. Before every communication, a socket is
`
`established. Then a message is sent as a string. After the message is sent,
`
`the socket is cancelled.
`[0033] Alternately, an interface can be structured as a TCL process
`
`extended with C/C++ code, or a C/C++ process that uses a special class,
`
`such as a Distributed Message Hub (DMH) client class. In this case, the
`
`logic, which collects the process/tool events through the socket connection,
`
`can be revised to insert the events and their context data into a table in IS
`
`150.
`[0034] The tool agent can send messages to provide event and context
`
`information to APC system. For example, the tool agent can sent lot
`
`start/stop messages, batch start/stop messages, wafer start/stop messages,
`
`recipe start/stop messages, and process start/stop messag,~s. In addition, the
`
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`tool agent can be used to send and/or receive set point data and to send
`
`and/or receive maintenance counter data.
`
`[0035]
`
`In one embodiment, a common tool agent can be installed on a
`
`plurality of processing tools. A common tool agent can allow the interface
`
`message format to be common. For example, a communication message
`
`format can comprise three parts: a message length, which is the length of
`
`message from message ID to terminator; a message ID, which is used for
`
`command and event identification; a message body, which contains the
`
`contents of the command or event. In addition, the message can use ASCII
`
`code, and the length can be changeable. Also, each message can be
`
`separated by a control code, and a terminator can be used.
`
`In an alternate
`
`embodiment, a dual agent can be established on the tool.
`
`[0036] When a processing tool comprises internal sensors, the processing
`
`tool can be considered a sensor, and this data can be sent to the APC system
`
`145. Data files can be used to transfer this data. For example, some
`
`processing tools can create trace files that are compressed in the tool when
`
`they are created. Compressed and/or uncompressed files can be transferred.
`
`When trace files are created in the processing tool, the trace data may or may
`
`not include end point detection (EPD) data. The trace data provides important
`
`information about the process. The trace data can be updated and
`
`transferred after the processing of a wafer is completed. Trace files are be
`
`transferred to the proper directory for each process. In one embodiment, tool
`
`trace data, maintenance data, and EPD data can be obtained from a
`
`processing tool 110.
`
`[0037]
`
`In FIG 1, four process modules are shown, but this is not required for
`
`the invention. The semiconductor processing system can comprise any
`
`number of processing tools having any number of process modules
`
`associated with them and independent process modules. The APC system
`
`145 (including one or more TL controllers) can be used to configure, control,
`
`and monitor any number of processing tools having any number of process
`
`modules associated with them and independent process modules. The APC
`
`system can collect, provide, process, store, and display data from processes
`
`involving processing tools, process modules, and sensors.
`
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`[0038] Process modules can be identified using data such as ID, module
`
`type, gas parameters, and maintenance counters, and this data can be saved
`
`into a database. When a new process module is configured, this type of data
`
`can be provided using a module configuration panel/screen in GUI component
`
`180. For example, the APC system can support the following tool types from
`
`Tokyo Electron Limited: Unity-related process modules, Trias-related process
`
`modules, Telius-related process modules, OES -related modules, and ODP(cid:173)
`
`related modules. FIG. 2 shows an exemplary block diagram of a system from
`
`Tokyo Electron Inc. Alternately, the APC system can support other tools and
`
`their related process modules. For example, APC system 145 can be
`
`connected to process modules 120 via an Internet or intranet connection.
`
`[0039]
`
`The process module ID can be an integer; the number of gas
`
`parameters can depend on the module type, and the maintenance counter
`
`information can also depend on the module. For example, a user can assign
`
`a new name to a specific maintenance counter, assign it a special scale rate,
`
`and assign the tool pause function to this maintenance counter. General
`
`counters are provided as a part of maintenance counters, and can be
`
`configured by the user.
`
`[0040]
`
`In the illustrated embodiment, a single sensor 130 is shown along
`
`with an associated process module, but this is not required for the invention.
`
`Any number of sensors can be coupled to a process module. Sensor 130 can
`
`comprise an ODP sensor, an OES sensor, a VIP sensor, an analog sensor,
`
`and other types of semiconductor processing sensors including digital probes.
`
`The APC data management applications can be used to collect, process,
`
`store, display, and output data from a variety of sensors.
`
`[0041]
`
`In the APC system, sensor data can be provided by both external and
`
`internal sources. External sources can be defined using an external data
`
`recorder type; a data recorder object can be assigned to each external
`
`source; and a state variable representation can be used.
`
`[0042] Sensor configuration information combines sensor type and sensor
`
`instance parameters. A sensor type is a generic term that corresponds to the
`
`function of the sensor. A sensor instance pairs the sensor type to a specific
`
`sensor on a specific process module and tool. At least one sensor instance is
`
`configured for each physical sensor that is attached to a tool.
`
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`
`[0043] For example, an OES sensor can be one type of sensor; a VI probe
`
`can be another type of sensor, and an analog sensor can be a different type
`
`of sensor. In addition, there can be additional generic types of sensors and
`
`additional specific types of sensors. A sensor type includes all of the
`
`variables that are needed to set up a particular kind of sensor at run time.
`
`These variables can be static (all sensors of this type have the same value),
`
`configurable by instance (each instance of the sensor type can have a unique
`
`value), or dynamically configurable by a data collection plan (each time the
`
`sensor is activated at run time, it can be given a different value).
`
`[0044] A "configurable by instance" variable can be the sensor/probe IP
`
`address. This address varies by instance (for each process chamber) but
`
`does not vary from run to run. A "configurable by data collection plan"
`
`variable can be a list of harmonic frequencies. These can be configured
`
`differently for each wafer based on the context information. For example,
`
`wafer context information can include tool ID, module ID, slot ID, recipe ID,
`
`cassette ID, start time and end time. There can be many instances of the
`
`same sensor type. A sensor instance corresponds to a specific piece of
`
`hardware and connects a sensor type to the tool and/or process module
`
`(chamber). In other words, a sensor type is generic and a sensor instance is
`
`specific.
`
`[0045] As shown is FIG. 1, sensor interface 140 can be used to provide an
`
`interface between sensor 130 and the APC system 145. For example, APC
`
`system 145 can be connected to sensor interface 140 via an Internet or
`
`intranet connection, and sensor interface 140 can be connected to sensor 130
`
`via an Internet or intranet connection. Also, sensor interface 140 can act as a
`
`protocol converter, media converter, and data buffer. In addition, sensor
`
`interface 140 can provide real-time functions, such as data acquisition, peer(cid:173)
`to-peer communications, and 1/0 scanning. Alternately, sensor interface ,140
`
`can be eliminated, and the sensor 130 can be directly coupled to APC system
`
`145.
`
`[0046] Sensor 130 can be a static or dynamic sensor. For example, a
`
`dynamic VI sensor can have its frequency range, sampling period, scaling,
`
`triggering, and offset information established at run-time using parameters
`
`provided by a data collection plan. Sensor 130 can be an analog sensor that
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`can be static and/or dynamic. For example, analog sensors can be used to
`
`provide data for ESC voltage, matcher parameters, gas parameters, flow
`
`rates, pressures, temperatures, RF parameters, and other process related
`
`data. Sensor 130 can comprise at least one of a: VIP probe, OES sensor,
`
`analog sensor, digital sensor, ODP sensor, and other semiconductor
`
`processing sensors.
`
`[0047]
`
`In one embodiment, a sensor interface can write the data points to a
`
`raw data file. For example, IS 150 can send a start command to the sensor
`
`interface to initiate data acquisition and can send a stop command to cause
`
`the file to be closed. IS 150 can then read and parse the sensor data file,
`
`process the data and post the data values into the in-memory data tables.
`
`Alternately, the sensor interface could stream the data in real time to the IS
`
`150. A switch could be provided to allow the sensor interface to write the file
`
`to disk. The sensor interface can also provide a method to read the file and
`
`stream the data points to the IS 150 for off-line processing and analysis.
`[0048] As shown in FIG. 1, APC system 145 can comprise a database 190.
`
`Tool maintenance data can be stored in database 190. In addition, raw data
`
`and trace data from the tool can be stored as files in the database 190. The
`
`amount of data depends on the data collection plans configured by the user,
`
`as well as the frequency with which processes are performed and processing
`
`tools are run. For example, data collection plans can be established for
`
`determining how and when to collect tool status and process-related data.
`
`The data obtained from the processing tools, the processing chambers, the
`
`sensors, and the APC system is stored in tables.
`
`[0049]
`
`In one embodiment, the tables can be implemented in the IS 150 as
`
`in-memory tables and in database 190 as persistent storage. The IS 150 can
`
`use Structured Query Language (SQL) for column and row creation as well as
`
`posting data to the tables. The tables can be duplicated in the persistent
`tables in database 190 (i.e., 0B2 can be used) and can be populated using
`
`the same SQL statements.
`[0050]
`
`In the illustrated embodiment, IS 150 can be both an in-memory real(cid:173)
`
`time database and a subscription server. For example, client processes are
`
`able to perform database functions using SQL with the familiar programming
`
`model of relational data tables. In addition, the IS 150 can provide a data
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`subscription service where the client software receives asynchronous
`
`notification whenever data that meets their selection criteria is inserted,
`
`updated, or deleted. A subscription uses the full power of an SQL select
`
`statement to specify which table columns are of interest and what row
`
`selection criteria is used to filter future data change notifications.
`
`[0051] Because the IS 150 is both a database and a subscription server,
`
`clients can open "synchronized" subscriptions to existing table data when they
`
`are initialized. The IS 150 provides data synchronization through a
`
`publish/subscribe mechanism, in-memory data tables, and supervisory logic
`
`for marshalling events and alarms through the system. The IS 150 provides
`
`several messaging TCP/IP based technologies including sockets, UDP, and
`
`publish/subscribe.
`
`[0052] For example, the IS 150 architecture can use multiple data hubs (i.e.,
`
`SQL databases) that can provide real-time data management and
`
`subscription functions. Application modules and user interfaces use SQL
`
`messages to access and update information in the data hub(s). Due to
`
`performance limitations associated with posting run time data to the relational
`
`database, run time data is posted to in-memory data tables managed by the
`
`IS 150. The contents of these tables can be posted to the relational database
`
`at the end of wafer processing.
`
`[0053]
`
`In the illustrated embodiment shown in FIG. 1, a single client
`
`workstation 170 is shown but this is not required for the invention. The APC
`
`system 145 can support a plurality of client workstations 170. In one
`
`embodiment, the client workstation 170 allows a user to configure sensors; to
`
`view status including tool, chamber, and sensor status; to view process
`
`status; to view historical data; to view fault data, and to perform modeling and
`
`charting functions.
`
`[0054]
`
`In the illustrated embodiment shown in FIG. 1, APC system 145 can
`
`comprise an APC server 160 that can coupled to IS 150, client workstation
`
`170, GUI component 180, and database 190, but this is not required for the
`
`invention. The APC server 160 can comprise a number of applications
`
`including at least one tool-related application, at least one module-related
`
`application, at least one sensor-related application, at least one IS-related
`
`application, at least one database-related application, and at least one GUI-
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`related application. In addition, APC server can comprise a number of
`
`process-related applications.
`
`[0055] The APC server 160 comprises at least one computer and software
`
`that supports multiple process tools; collects and synchronizes data from
`
`tools, process modules, sensors, and probes; stores data in a database,
`
`enables the user to view existing charts; and/or provides fault detection. For
`
`example, APC server 160 can comprise operational software, such as the
`
`lngenio software, from Tokyo Electron. The APC server allows online system
`
`configuration, on line lot-to-lot fault detection, on line wafer-to-wafer fault
`
`detection, online database management, and performs multivariate analysis
`
`of summary data using models based upon historical data. In addition, the
`
`APC allows real-time monitoring of processes and processing tools.
`[0056] For example, APC server 160 can comprise a minimum of 3 GB
`
`available disk space; at least 600 MHz CPU (Dual processors); a minimum
`
`512 Mb RAM (physical memory); a 9 GB SCSI hard drives in a RAID 5
`
`configuration; a minimum disk cache that is twice the RAM size; Windows
`
`2000 server software installed; Microsoft Internet Explorer; TCP/IP Network
`
`protocol; and at least two network cards.
`[0057] The software interface to the tables is provided by a combination of
`TCL and SQL. For example, a loader process, operating in the background,
`
`can provide the posting of data to the database that sends SQL commands
`
`from a file to database. The transfer of data from the in-memory tables to the
`
`persistent tables can be accomplished by writing SQL