IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`REQUEST FOR FILING PROVISIONAL PATENT APPLICATION
`Under 35 USC 111 (bl
`(Not for DESIGN cases)
`
`Hon. Commissioner of Patents
`Washington, D.C. 20231
`
`PROVISIONAL APPLICATION
`Under Rule 53(c)
`
`Sir:
`
`Herewith is a PROVISIONAL APPLICATION
`Title: METHOD AND APPARATUS FOR THE MONITORING
`AND CONTROL OF A SEMICONDUCTOR
`MANUFACTURING PROCESS
`
`APPLICATION
`
`I llllll lllll lllll lllll lllll llll llll
`00909
`
`including:
`
`Atty. Dkt. PW 292638
`M#
`Date: September 30, 2002
`
`PC8001A
`Client Ref
`
`3. 181 Drawings:
`2. D Specification in non-English language
`11
`pages
`1. Specification: 58
`4. The invention D was 181 was not made by, or under a contract with, an agency of the U.S. Government.
`If yes, Government agency/contact# =
`5. D Attached is an assignment and cover sheet. Please return the recorded assignment to the undersigned.
`181 is Not claimed
`D is claimed (pre-filing confirmation required)
`6.
`Small Entity Status •
`NOTE: Do NOT File IDS!
`7. D Attached:
`
`sheet(s)
`
`8.
`
`This application is made by the following named inventor(s) (Double check instructions for accuracy.):
`
`First
`
`c·
`
`First
`
`FUNK
`
`Middle Initial
`Texas
`
`Fami Name.
`USA
`
`-Coon of Citizenshi
`
`·
`
`· , ' ·<eoun of Citizenshi
`
`30321221_1
`
`PAT-102AICN 5/02
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,836,691
`Page 1 of 74
`
`

`

`9. NOTE: FOR ADDITIONAL INVENTORS, check box O and attach sheet (PAT102A) with same information
`regarding additional inventors.
`
`$160/$80
`10. Filinq Fee ................................................
`11. If "assiqnment'' box 5 is X'd, add recordinq fee ..................... $40
`
`+160
`+0
`
`Large/Small
`Entity
`
`Fee
`Code
`114/214
`
`581
`
`12.
`
`Our Order No.
`
`Our Deposit Account No. 03-3975
`
`71469 I 292638
`
`C#
`
`M#
`
`TOTAL FEE=
`
`$160
`
`PLEASE CHARGE
`OUR DEP. ACCT.
`
`I IIIIII IIIII IIIII IIIII IIIII IIII IIII
`00909
`
`CHARGE STATEMENT: The Commissioner is hereby authorized to charge any fee specifically authorized hereafter, or any missing or insufficient fee(s) filed, or asserted to be
`filed, or which should have been filed herewith or concerning any paper filed hereafter, and which may be required under Rules 16-17 (missing or insufficient fee only) now or
`hereafter relative to this application or credit any overpayment, to our Account/Order Nos. shown in the heading hereof for which purpose a duplicate copy of this sheet is attached.
`
`Pillsbury Winthrop LLP
`Intellectual Property Gr
`By Atty:
`
`Sig:
`
`Atty/Sec: DSL/JRH
`
`Fax:
`Tel:
`
`(703) 905-2500
`(703) 905-2126
`
`NOTE: File in duplicate with 2 post card receipts (PAT-103) & attachments
`
`30321221_1
`
`PAT-102NCN 5/02
`
`Applied Materials, Inc. Ex. 1006
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`

`

`APPLICATION UNDER UNITED STATES PATENT LAWS
`
`Atty. Dkt. No. _P_W_2_9_26_3_8 ______ _
`(M#)
`
`Invention:
`
`METHOD AND APPARATUS FOR THE MONITORING AND CONTROL OF A
`SEMICONDUCTOR MANUFACTURING PROCESS
`
`Inventor (s): Merritt FUNK
`
`1iWll1ii[J[W[1ll1llrce Address
`00909
`Pillsbury Winthrop LLP
`
`This is a:
`
`[8J Provisional Application
`D Regular Utility Application
`D Continuing Application
`O The contents of the parent are incorporated
`by reference
`D PCT National Phase Application
`D Design Application
`D Reissue Application
`D Plant Application
`D Substitute Specification
`Sub. Spec Filed - - - - - - - -
`in App. No.
`/
`- - - - - - -
`D Marked up Specification re
`Sub. Spec. filed
`In App. No ___ / ___ _
`
`SPECIFICATION
`
`30321210_1
`
`PAT-100CN 6/02
`
`Applied Materials, Inc. Ex. 1006
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`

`Method and Apparatus for the Monitoring and Control of a
`Semiconductor Manufacturing Process
`Cross-reference to Related Applications
`
`[0001] The present application is related to co-pending applications
`
`US Provisional Application No. 60/368, 162, entitled "Method For Interaction
`
`With Status and Control Apparatus", filed on March 29, 2002; US Provisional
`
`Application No. 60/37 4,486, entitled "Method and Apparatus for Simplified
`
`System Configuration", filed on April 23, 2002; US Provisional Application No.
`
`60/383,619, entitled "Method and Apparatus For Monitoring Tool
`
`Performance", filed on May 29, 2002; US Provisional Application No.
`
`60/393,091, entitled "Method for Dynamic Sensor Configuration and Runtime
`
`Execution", filed on July 3, 2002; and US Provisional Application No.
`
`60/393, 104, entitled "Method and Apparatus for Automatic Sensor
`
`Installation", filed on July 3, 2002. Each of these applications is herein
`
`incorporated by reference in its entirety.
`
`Field of the Invention
`
`[0002] The present invention is related to semiconductor processing
`
`systems, particularly to semiconductor processing systems, which use
`
`Advanced Process Control (APC).
`
`Background of the Invention
`
`[0003] Computers are generally used to control, monitor, and initialize
`
`manufacturing processes. A computer is ideal for these operations given the
`
`complexities in a semiconductor manufacturing plant from the reentrant wafer
`
`flows, critical processing steps, and maintainability of the processes. Various
`
`input/output (1/0) devices are used to control and monitor process flows,
`
`wafer states, and maintenance schedules. A variety of tools exist in a
`
`semiconductor manufacturing plant to complete these complicated steps from
`
`critical operations such as etching, to batch processing, and inspections. Most
`
`tool installations are accomplished using a display screen that is part of the
`
`graphical user interface (GUI} of a control computer containing the installation
`
`software. Installation of a semiconductor-processing tool is a time consuming
`
`procedure.
`
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`U.S. Pr~vision~l Application of FUNK, atty. dkt. 292638
`
`[0004] Semiconductor processing facilities require constant
`monitoring. Processing conditions change over time with the slightest
`changes in critical process parameters creating undesirable results. Small
`
`changes can easily occur in the composition or pressure of an etch gas,
`
`process chamber, or wafer temperature. In many cases, changes of process
`data reflecting deterioration of processing characteristics cannot be detected
`
`by simply referring to the process data displayed. It is difficult to detect early
`
`stage abnormalities and characteristic deterioration of a process. Oftentimes
`prediction and pattern recognition offered by advanced process control (APC)
`is necessary.
`[0005] Facility control is often performed by a number of different
`
`control systems having a variety of controllers. Some of the control systems
`
`may have man-machine interfaces such as touch screens, while others may
`only collect and display one variable such as temperature. The monitoring
`
`system must be able to collect data tabulated for the process control system.
`The data collection of the monitoring system must handle univariate and
`
`multivariate data, the analysis and display of the data, and have the ability to
`select the process variables to collect. Various conditions in a process are
`monitored by different sensors provided in each of the process chambers, and
`data of the monitored conditions is transferred and accumulated in a control
`computer. If the process data is displayed and detected automatically, the
`
`optimum process conditions of a mass-production line can be set and
`
`controlled through statistical process control (SPC) charts. Inefficient
`monitoring of a facility can result in facility downtimes that add to the overall
`
`operational cost.
`
`Summary of the Invention
`
`[0006] Accordingly, it is an object of the present invention to provide
`an Advanced Process Control (APC) system for controlling a processing tool
`
`in a semiconductor processing environment, where the APC system
`comprises an APC server providing a plurality of APC related applications; an
`
`Interface Server (IS) coupled to the APC server; a database coupled to the IS
`
`and APC server; and a GUI component coupled to the APC server, wherein
`
`-2-
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`U.S. Provision~! Application of FUNK, atty. dkt. 292638
`
`the IS comprises means for coupling to a processing tool, and means for
`coupling to a plurality of process modules coupled to the processing tool.
`[0007] In addition, it is an object of the present invention to provide a
`method for using an Advanced Process Control (APC) system for controlling a
`
`processing tool in a semiconductor processing environment, the method
`comprising: providing an APC server providing a plurality of APC related
`
`applications; providing an Interface Server (IS) coupled to the APC server;
`
`providing a database coupled to the IS and APC server; and providing a GUI
`
`component coupled to the APC server, wherein the IS comprises means for
`coupling to a processing tool, and means for coupling to a plurality of process
`modules coupled to the processing tool.
`
`Brief Description of the Drawings
`
`[0008] The accompanying drawings, which are incorporated in and
`'
`constitute a part of the specification, illustrate presently preferred
`embodiments of the invention, and together with the general description given
`above and the detailed description of the preferred embodiments given below,
`serve to explain the principles of the invention. A more complete appreciation
`of the invention and many of the attendant advantages thereof will become
`readily apparent with reference to the following detailed description,
`
`particularly when considered in conjunction with the accompanying drawings,
`in which:
`[0009] FIG. 1 shows an exemplary block diagram of an advanced
`
`process controlled (APC} system in a semiconductor manufacturing
`environment in accordance with one embodiment of the present invention;
`[001 0] FIG. 2 is a simplified data flow diagram for the APC system in
`accordance with one embodiment of the present invention;
`[0011] FIG. 3 illustrates a simplified interface diagram in accordance
`with an embodiment of the present invention;
`[0012] FIG. 4 shows an exemplary relationship diagram for event
`contexts, strategies, control jobs, and plans in accordance with an
`
`embodiment of the present invention;
`
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`U.S. Pr~vision~l Application of FUNK, atty. dkt. 292638
`
`[0013] FIG. 5 illustrates a simplified data flow diagram in accordance
`with an embodiment of the present invention;
`[0014] FIG. 6 shows an exemplary block diagram of an interface
`
`server in accordance with an embodiment of the present invention;
`[0015] FIG. 7 shows a simplified view of a flow diagram for a
`
`monitoring process for processing tools in a semiconductor processing
`
`system in accordance with one embodiment of the present invention;
`[0016] FIG. 8 shows an exemplary relationship diagram for strategies
`and plans;
`[0017] FIG. 9 shows another exemplary relationship diagram for
`
`strategies and plans;
`[0018] FIG. 10 shows an exemplary relationship diagram for judgment
`plans and intervention plan shows an exemplary summary data creation
`process in accordance with one embodiment of the present invention; and
`[0019] FIG. 11 shows an exemplary view of a Tool Status screen in
`accordance with one embodiment of the present invention.
`
`Detailed Description of an Embodiment
`
`[0020] In semiconductor manufacturing processes computers are
`generally used to control, monitor, and setup manufacturing processes. It is
`
`an objective of this invention to provide an Advanced Process Control (APC)
`system for controlling the process related elements in a semiconductor(cid:173)
`
`processing environment. The invention provides for the treating processing
`tools, chambers, and sensors as process related elements. GUI screens are
`
`provided that are comprehensible, standardized in format, and simplify the
`management of the process related elements.
`(0021] FIG. 1 shows an exemplary block diagram of an APC system in
`
`a semiconductor-manufacturing environment in accordance with one
`
`embodiment of the present invention. In the illustrated embodiment,
`semiconductor manufacturing environment 100 comprises semiconductor
`
`processing tool 110, multiple process modules 120, PM1 through PM4,
`
`Optical Emissions Sensors (OES) 125 for monitoring the plasma conditions,
`voltage/current probes (VIP) 130 for monitoring the RF signals, analog
`
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`U.S. Pr~vision~l Application of FUNK, atty. dkt. 292638
`
`sensors 135, M1 E 140 protocol converters, and APC system 145. APC
`system 145 can comprise interface server (IS) 150, APC server 160, client
`workstation 170, GUI 180, and database 190. In one embodiment, IS 150 can
`comprise a real-time memory database that is sometimes referred to as a
`"Hub".
`
`[0022) In the illustrated embodiment, a single tool 110 is shown along
`with four process modules 120, but this is not required for the invention. The
`APC system 145 can interface with a number of processing tools including
`cluster tools having one or more process modules. For example, the tools
`can be used to perform etching, deposition, diffusion, cleaning, measurement,
`transfer, loading, and unloading processes.
`[0023) In one embodiment, processing tool 110 can comprise a tool
`agent (not shown), which can be a software process that runs on a tool 110
`and which can provide event information, context information, and start-stop
`timing commands used to synchronize data acquisition with the tool process.
`Also, APC system 145 can comprise an agent client (not shown) that can be a
`software process that can be used to provide a connection to the tool agent.
`[0024) For example, an agent client can be used to receive events and
`their associated messages from a tool agent and propagate those messages
`on through the APC system. The client software can comprise a
`
`communications class, and a driver. The agent client communications class
`
`can be designed as a reusable class that is implemented as a dynamically
`loadable module (DLL). There can also be a message class that is used to
`parse messages from the tool agent and break those messages out into
`
`elements. An agent message class can instantiated with a string received
`
`from the tool agent as a parameter. At the time of instantiation, the string is
`parsed and all class attributes are filled with the data from that string. The
`
`agent client communication class communicates with the tool agent via BSD
`
`sockets, and it can comprise the following methods:
`[0025) a. Start Agent: A method that establishes communications
`with the tool agent and sends the agent the start message. When the
`
`start acknowledged message is received from the agent, the
`
`connection is closed and the event receive thread is spawned. When
`
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`
`the initial connection is established with the agent, the local interface
`
`that found the tool is stored.
`[0026] b. Event Receive Thread: This establishes the "event listen"
`
`connection with the agent. Once the connection is established, the
`
`thread waits indefinitely for a message from the agent. When a
`message is received, a new agent message object is instantiated and
`
`is placed in the message queue. The thread then goes back into the
`
`"waiting for message" state.
`[0027] c. Get Next Message: A method that gets the next object off of
`the message queue and passes it back to the caller.
`[0028] d. Stop Agent: A method that sends a stop signal to the tool
`agent. When it receives the stop signal, the toot can close its
`
`connection with the event receive thread. When the event receive
`thread senses the connection is closed, it is eliminated.
`[0029] In one embodiment, processing tool 110 communicates with
`the IS 150 using sockets. For example, the interface can be implemented
`using TCP/IP socket communication. Before every communication, a socket
`is established. Then a message is sent as a string. After the message is
`
`sent, the socket is cancelled.
`[0030] Alternately, the tool interface can be structured as a TCL
`
`process extended with CIC++ code, or a CIC++ process that uses a special
`
`class, such as a Distributed Message Hub (DMH) client class. In this case,
`the logic, which collects the process tool events through the socket
`connection to the tool agent is revised to insert the events and their context
`
`data into a table in IS 150.
`[0031] The tool agent can send messages to provide event and
`
`context information to the APC system. For example, the tool agent can sent
`lot start/stop messages, batch start/stop messages, wafer start/stop
`
`messages, recipe start/stop messages, and process start/stop messages. In
`
`addition, the tool agent can be used to send and/or receive set point data and
`
`to send and/or receive maintenance counter data.
`[0032] In one embodiment, a common tool agent can be installed on a
`
`plurality of processing tools. A common tool agent can allow the interface
`message format to be common. For example, a communication message
`
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`U.S. Pr~vision~l Application of FUNK, atty. dkt. 292638
`
`format can comprise three parts: a message length, which is the length of
`message from message ID to terminator; a message ID, which is used for
`command and event identification; a message body, which contains the
`
`contents of the command or event. In addition, the message can use ASCII
`code, and the length can be changeable. Also, each message can be
`
`separated by a control code [NUL](0x00), and the terminator can be
`
`[CRLF]{0x0D0A).
`[0033] When a processing tool comprises internal sensors, this data
`
`can be sent to the IS 150 and APC server 160. Data files can be used to
`transfer this data. For example, some processing tools can create trace files
`
`that are compressed in the tool when they are created. Compressed and/or
`
`uncompressed files can be transferred. When trace files are created in the
`processing tool, the trace data may or may not include EPD. The trace data
`provides important information about the process. The trace data can be
`updated and transferred after the processing of a wafer is completed. Trace
`files are be transferred to the proper directory for each process. In one
`
`embodiment, tool trace data and End Point Detection {EPD) data can be
`obtained from a processing tool 110.
`[0034] In FIG 1, four process modules are shown, but this is not
`required for the invention. The semiconductor processing system can
`comprise any number of processing tools having any number of process
`
`modules associated with them and independent process modules. The APC
`
`system 145 can collect, process, store, display, input, and output data from
`these processing tools, process modules, and sensors.
`[0035] Process modules can be identified using data such as ID,
`module type, gas parameters, and maintenance counters, and this data can
`
`be saved into a database. When a new process module is configured, this
`
`type of data can be provided using a module configuration screen in GUI 180.
`
`For example, the APC system can support the following module types from
`
`Tokyo Electron Limited: a Unity SCCM chamber, a Unity ORM oxide
`
`chamber, a Telius ORM oxide chamber, a Telius SCCM oxide chamber, and a
`
`T elius SCCM Poly chamber. Alternately, the APC system can support other
`chambers.
`
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`U.S. Pr~vision~l Application of FUNK, atty. dkt. 292638
`
`[0036] The process module ID can be an integer; the number of gas
`parameters can depend on the module type, and the maintenance counter
`
`information can also depend on the module. For example, a user can assign
`a new name to a specific maintenance counter, assign it a special scale rate,
`
`and assign the tool pause function to this maintenance counter. General
`
`counters are provided as a part of maintenance counters, and can be
`
`configured by the user.
`[0037] In the illustrated embodiment, OES sensors 125, VIP sensors
`
`130, and analog sensors 135 are shown along with associated process
`modules, but this is not required for the invention. The semiconductor
`
`processing system can comprise different types of semiconductor processing
`
`sensors including digital probes. The APC data management applications
`can be used to collect, process, store, display, and output data from a variety
`
`of sensors.
`[0038] In the APC system, sensor data can be provided by both
`external and internal sources. External sources can be defined using an
`
`external data recorder type; a data recorder object can be assigned to each
`external source; and a state variable representation can be used.
`[0039] Sensor configuration information combines sensor type and
`sensor instance parameters. A sensor type is a generic term that
`corresponds to the function of the sensor. A sensor instance pairs the sensor
`
`type to a specific sensor on a specific process module and tool. At least one
`
`sensor instance is configured for each physical sensor that is attached to a
`
`tool.
`
`[0040] For example, an OES sensor can be one type of sensor; a VI
`probe can be another type of sensor, and an analog sensor can be a different
`
`type of sensor. In addition, there can be additional generic types of sensors
`
`and additional specific types of sensors. A sensor type includes all of the
`
`variables that are needed to set up a particular kind of sensor at run time.
`
`These variables can be static (all sensors of this type have the same value),
`
`configurable by instance (each instance of the sensor type can have a unique
`
`value), or dynamically configurable by a data collection plan (each time the
`sensor is activated at run time, it can be given a different value).
`
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`[0041] A "configurable by instance" variable can be the probe IP
`address. This address varies by instance (for each process chamber) but
`
`does not vary from run to run. A "configurable by data collection plan"
`variable can be a list of harmonic frequencies. These can be configured
`
`differently for each wafer based on the context information. For example,
`
`wafer context information can include tool ID, module ID, slot ID, recipe ID,
`
`cassette ID, start time and end time. There can be many instances of the
`same sensor type. A sensor instance corresponds to a specific piece of
`
`hardware and connects a sensor type to the tool and/or process module
`(chamber). In other words, a sensor type is generic and a sensor instance is
`specific.
`
`[0042] As shown in FIG.1, at least one VIP 130 can be associated with
`a process module (PM) 120. For example, VIP 130 can be a V/1
`(voltage/current) probe that can be used to measure the RMS current (I), a
`RMS voltage (V), or a phase angle of the RF power signal sent to or sent from
`a processing module. Also, VIP 130 can compute the impedance (Z) as an
`additional parameter. In addition, other RF calculations can be performed
`using parameters output by the VIP 130.
`[0043] The APC system 145 can comprise a VI probe recorder
`application that can include a plurality of methods created for starting up,
`setting up, shutting down, and collecting data from VIP 130. In one case,
`
`there can be two recorders used for a probe: one for single frequency mode,
`
`and one for a multi frequency mode. A global state variable can be used to
`keep track of the current state of the recorder, and the states can be idle,
`
`ready, and recording.
`' [0044] For example, the recorder methods can include a start device
`
`method that starts the M 1 ENI probe connection and a stop device method
`
`that stops the connection. The VIP recorder application can comprise a start
`
`recorder method that can be triggered by a recipe start event. It sends a
`
`message to the M1E, which, in turn, sends the proper command to the VI
`
`probe. If the transmission is successful, the state is changed from ready to
`
`recording. The VI probe can then send unsolicited data to automation
`
`connection. Also, the recorder application can comprise a stop recorder
`
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`U.S. Pr~vision~l Application of FUNK, atty. dkt. 292638
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`method that is used to stops recording of VIP data. The state of the recorder
`can change from recording to ready.
`(0045] Furthermore, the recorder application can comprise an end
`recording method that is used to end a recording session. To do this, it
`
`changes the recorder state to idle and closes the output file. It can also let the
`
`\
`
`APC system know that the file is ready for processing. This method can be
`
`called as a result of a wafer-out event.
`(0046] Also, the recorder application can comprise a VI probe setup
`
`method that can be triggered by a start event such as a wafer-in event. It can
`send a list of frequencies and a sample time to the M1 E 140, which then sets
`
`up VIP 130. For example, the method can use a run ID to look up the
`
`filename to assign to the output file. The method can then open the file for
`output using a global file descriptor and print the file header. The run ID can
`be stored in a global variable for later use. If all is successful, the state can
`be changed from idle to ready.
`(0047] The APC system 145 can also comprise a data management
`application for processing the data from VIP 130. For example, a Dynamic
`Loadable Library (DLL) function, written in C, can be used to parse data from
`
`VIP 130 and format it suitable for printing to the output file. The DLL function
`can take a string from the VI probe as a parameter, and return the printable
`(tab-delimited) string as a second argument.
`(0048] As shown is FIG. 1, M1 E 140 can be used to provide an
`
`interface between the VIP 130 and the APC system 145. For example, APC
`system 145 can be connected to M1E 140 via 10baseT Ethernet, and M1E
`
`140 can be connected to VIP 130 via an RS-232 protocol connection. M1E
`140 can act as a protocol converter, media converter, and data buffer. For
`
`example, M1E 140 can comprise a PLC that is used to convert RS-232
`
`signals from the sensor into Ethernet protocol signals for communication with
`
`the APC system 145, and vice-versa. The logic used in the M 1 E can be
`
`written using ladder logic. M1 E 140 can provide real-time digital functions
`
`over the Ethernet, such as data acquisition, peer-to-peer communications,
`and 1/0 scanning. In one embodiment, M1 E 140 can comprise 512KB RAM
`with Ethernet, 1/0 bus port and can service up to 4,000 messages per second,
`can handle messages up to 125 words, can solve logic in 0.25 msec per K of
`
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`logic using traditional ladder logic, and can include analog input and output
`and digital input and output.
`[0049] The PLC program in the M1 E 140 can translate VIP 130
`commands and data to a TCP/IP protocol, such as Modbus.
`[0050] In one embodiment, the communication protocols between a
`
`VIP 130 and M1E 140 can comprise a proprietary text-based protocol over an
`
`RS-232 protocol connection. The communication protocol between the M1 E
`140 and APC system 145 can be TCP/IP. Alternately, M1 E 140 can be
`
`eliminated, and the VIP 130 can be directly coupled to APC system 145 using
`an Ethernet interface and could also use the TCP/IP protocol.
`[0051] VIP 130 can be static or dynamic. A dynamic VI sensor can
`
`have its frequency range, sampling period, scaling, triggering, and offset
`information established at run-time using parameters provided by a data
`collection plan.
`[0052] In one embodiment, analog sensor 135 can be connected
`using M1 E 140 that can comprise a PLC controller that provides an Ethernet
`connection to APC system 145. For example, M1 E 140 can communicate
`using an Ethernet protocol such as ModBus.
`[0053] For example, analog sensors can be used to provide data for
`ESC voltage, matcher parameters, gas parameters, flow rates, pressures,
`temperatures, RF parameters, and other process related data.
`[0054] The APC system 145 can comprise an analog recorder that
`
`can comprise a plurality of methods. For example, a setup analog method
`can write memory variables to the analog device to start; process the setup;
`
`and acknowledge setup is successful or execute a failure method. A start
`analog method is used to receive data from the device and write to disk file. A
`
`sensor record analog method can be used to enable data to be recorded in
`
`real-time from the analog sensor and written to a file for data loading into a
`
`data hub. The actual recording of the data could be through a lower level
`
`driver and not at the method level. An analog state variable can be used and
`
`could be set to (ON, OFF, or Offline). A stop sensors method can be used to
`
`send a stop message to a sensor needing a stop message. For sensors not
`needing a stop message, data can stop being recorded.
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`[0055] Analog data can be collected and plotted on a screen to help a
`process engineer investigate problems. For example, up to 16 measurement
`
`channels are provided for each process chamber. The sampling rate has a
`minimum sampling time of 50msec. The input voltage range varies from -1 0V
`
`to +10V. Start/stop/set/reset commands are supported for M1E. The analog
`input portion of the M 1 E usage can be implemented by having a table of low
`
`and high engineering units. The range for each channel is settable for either
`
`0-1 0V 0-5V or 4-20mA.
`[0056] The M 1 E process adapter can provide real-time analog
`
`functions over the Ethernet, such as data acquisition, peer-to-peer
`communications, and 1/0 scanning. For example, the analog input portion of
`the M1 E usage can be implemented by having a table of low and high
`
`engineering units. The range for each channel is settable for either 0-1 0V 0-
`SV or 4-20mA. The low engineering unit is the value the code can return at
`
`the low signal range (0V or 4mA). The high engineering unit is the value that
`can be returned for the high signal range (1 0V, 5V or 20mA). Measurements
`
`are calculated as a linear interpolation.
`[0057] Analog sensors can be static or dynamic. A dynamic analog
`sensor can have its sampling period, scaling, triggering, and offset information
`established at run-time using parameters provided by a data collection plan.
`[0058] In one embodiment, an OES data recorder can be used to
`
`record data from the optical emissions sensor 125. There can be a separate
`OES device interface for each OES sensor. For example, a separate
`application can be created to contain each device interface. Each of these
`
`applications can comprise a device name (name can come from model
`number of device). The OES data recorder can output data as a text file. For
`
`example, OES sensor interface can comprise a TCP/IP co~nection.
`[0059] In one embodiment, the data recorder interface can write the
`
`data points to a raw data file. For example, IS 150 can send a start command
`
`to the data recorder to initiate data acquisition and can send a stop command
`
`to cause the file to be closed. IS 150 can then read and parse the OES data
`
`file, process the data and post the data values into the in-memory data tables.
`[0060] Alternately, the data recorder interface could stream the data
`in real time to the IS 150. A switch could be provided to allow the data
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`recorder to write the file to disk. The data recorder could also provide a
`method to read the file and stream the data points to the IS 150 for off-line
`processing and analysis.
`[0061] In another embodiment, a common sensor interface co