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`George J. Oehling* u
`_
`Shelley P.M. Fussey, Ph.D.* "
`Mark D. Moore, Ph.D.*
`Louis H. Iselin, Ph.D.*
`Raymund F. Eich, Ph.D.*
`Daren C. Davis*
`Stephanie A. Wardwell, Ph.D.*
`
`Danny L. Williams
`Terry D. Morgan
`J. Mike Amerson
`Kenneth D. Goodman
`Jeffrey A. Pyle
`Jaison C. John
`Ruben S. Bains
`Steven K Wong
`
`!!!!!!!!!!!!!!!
`
`*Patent Agent
`
`EXPRESS MAIL MAILING LABEL
`NUMBER EL 522 495 908 US
`DATE OF DEPOSIT April 30, 2002
`- - - - - - - -~
`I hereby certify that this paper or fee is being deposited with the United States
`Postal Service with sufficient postage "EXPRESS MAIL POST OFFICE TO
`ADDRESSEE" service under 37 C.F.R. 1.10 on the date indicated above and is
`addressed to· BOX PATENT APPLICATION, Assistant Commissioner for
`
`atent , W hington D.C-;;~ /1.. c:J-I"
`
`WRITER'S DIRECT DIAL:
`(713) 934-4053
`
`FILE
`
`2000.079600
`
`APRIL 30, 2002
`
`BOX PATENT APPLICATION
`Assistant Commissioner for Patents
`Washington, DC 20231
`
`RE:
`
`US. Patent Application Entitled "AGENT REACTIVE SCHEDULING IN AN
`AUTOMATED MANUFACTURING ENVIRONMENT"
`Inventors: Gustavo Mata, Steven C. Nettles, Larry D. Barto and Yiwei Li
`Client Reference: TT4739
`
`Sir:
`
`Transmitted herewith for filing are:
`
`J
`
`(1) 55-page patent specification with 53 claims and an abstract (also Figures 1-7B on 6
`sheets);
`(2) Declaration;
`(3) Assignment and Assignment Cover Sheet;
`(4) Power of Attorney; and
`(5) Request for Certification under 35 U.S.C. 122(b)(2)(B)(i).
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 1 of 274
`
`
`
`JC885 U.S. PTO
`
`I IIIIII IIIII IIIII IIIII IIIII IIIII IIII IIII
`04/30/02
`Assistant Commissioner for Patents
`April 30, 2002
`Page2
`
`All correspondence, notices, official letters and other communications should be directed
`to Jeffrey A. Pyle, Williams, Morgan & Amerson, P.C., 7676 Hillmont, Suite 250, Houston, TX
`77040, and all telephone calls should be directed to Jeffrey A. Pyle at (713) 934-4053.
`
`The Assistant Commissioner is authorized to deduct the amount of the total filing fee
`(listed below) from Advanced Micro Devices, Inc. Deposit Account No. 01-0365ffT4739.
`
`FILING FEE CALCULATION
`
`FOR
`Total Claims
`Independent Claims
`Multiple Dependent Claim(s)
`Basic Fee:
`Assignment Recording Fee:
`TOTAL FILING FEES
`
`53 -20
`6-3
`
`= 33
`= 3
`
`($40 per assignee)
`
`Small Entity
`x$9
`$
`=
`x$42 =
`$
`+ $140 =
`$
`+ $370 = $
`+
`$
`=
`$
`
`0.00
`
`Large Entity
`Orx$18 = $ 594.00
`Orx $84 =
`$ 252.00
`Or+ $280= $
`0.00
`Or+ $740=
`$ 740.00
`+
`=
`$
`40.00
`$1 r.,-,£ nn
`
`Pursuant to 37 C.F.R. § 1.10 the Applicant requests that the Patent and Trademark Office
`accept this application and accord a serial number and filing date as of the date this application is
`deposited with the U.S. Postal Service for Express Mail.
`
`Please date stamp and return the enclosed postcard to evidence receipt of these materials.
`
`e ey A. Pyle
`Reg. No. 34,904
`
`JAP:ym
`Enclosures
`cc:
`Mr. Paul Drake, Esq. (w/o enc.)
`Ms. Samantha Cardona (w/enc.)
`
`11
`
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`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 2 of 274
`
`
`
`PTO/SB/35 (11-00)
`Approved for use through 10/31/2002. 0MB 0651-0031
`U.S. Patent and Trademark Office; U.S DEPARTMENT OF COMMERCE
`Under the Papeiwork Reduction Act of 1995, no persons are required to respond to a collection ofmfonnation unless it displays a valid 0MB control number.
`
`REQUEST AND CERTIFICATION
`UNDER
`35 U.S.C. 122(b)(2)(B)(i)
`
`First Named Inventor: GUSTA VO MAT A
`
`Title: AGENT REACTIVE SCHEDULING IN AN
`AUTOMATED MANUFACTURING
`ENVIRONMENT
`
`Attorney Docket Number: 2000.079600/TT4739
`
`I hereby certify that the invention disclosed in the attached application has not and will not be
`the subject of an application filed in another country, or under a multilateral agreement, that
`requires publication at eighteen months after filing.
`I hereby request that the attached
`application not be published under 35 U.S.C. 122(b).
`
`Date: April 30, 2002
`
`Jeffrey A. Pyle
`Typed or printed name
`
`This request must be signed in compliance with 37 CFR 1.33(b) and submitted with the
`application upon filing.
`
`Applicant may rescind this nonpublication request at any time. If applicant rescinds a request
`that an application not be published under 35 U.S.C. 122(b), the application will be scheduled
`for publication at eighteen months from the earliest claimed filing date for which a benefit is
`claimed.
`
`If applicant subsequently files an application directed to the invention disclosed in the attached
`application in another country, or under a multilateral international agreement, that requires
`publication of applications eighteen months after filing, the applicant must notify the United
`States Patent and Trademark Office of such filing within forty-five (45) days after the date of
`the filing of such foreign or international application. Failure to do so will result in
`abandonment of this application (35 U.S.C. 122(b )(2)(B)(iii).
`
`Burden Hour Statement: This collection of information is required by 37 CFR l.213(a). The information is used by the public to request that an
`application not be published under 35 U.S.C. 122(b) (and the PTO to process that request). Confidentiality is governed by 35 U.S C. 122 and 37
`CFR 1.14. This form is estimated to take 6 minutes to complete. This time will vary depending upon the needs of the individual case. Any
`comments on the amount of time you are required to complete this form should be sent to the Chief Information Officer, U.S. Patent and
`Trademark Office, Washington, DC 20231. DO NOT SEND FEES OR COMPLETED FORMS TO THlS ADDRESS. SEND TO: Assistant
`Commissioner for Patents, Washington, DC 20231.
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 3 of 274
`
`
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`Application for United States Letters Patent
`
`for
`
`AGENT REACTIVE SCHEDULING IN AN AUTOMATED
`MANUFACTURING ENVmONMENT
`by
`
`Gustavo Mata
`Steven C. Nettles
`Larry D. Barto
`Yiwei Li
`
`""'
`
`,
`
`.j/iXPRESS J>W~ MAILiN,G tA,JJEL
`,
`NU~ER EL ,522..· ,LI 9S-&Jl??:il~
`J!ATE OF·P~POSITO§ lao/p.-:i._ ..
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`I heniby iernfy t~at :ilii~' !}~per. o; f& 'js ~ei~g'deposi~~;;~tii':tne''tli1i!~.~ S~tes
`Postal'~~ with stdlicient P,OStage "EXPRE§S. MAIL:: f(J)~'L OFFIC~! ;f~
`ADDRESSJijli" sernc~\,W~et 37 C.~~~ 1.10 on tJie :d:tie iiidicate;d,j!c~v'e and ~s
`.rAT,ENF· AfJ:'LIClA(IlON, Assisfaiit CQJ!lipissioner' for
`a'.diliiessetf to~ :
`· · > ;· "
`Pate~tWas ·
`:~.-20231.> · :' " '
`.,. "
`
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`' "
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 4 of 274
`
`
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`AGENT REACTIVE SCHEDULING IN AN AUTOMATED
`MANUFACTURING ENVIRONMENT
`
`BACKGROUND OF THE INVENTION
`
`5
`
`IO
`
`The United States Government has a paid-up license in this invention and the right in
`
`limited circumstances to require the patent owner to license others on reasonable terms as
`
`provided for by the terms of Award No. 70NANB7H304 l awarded by the United States
`
`Department of Commerce, National Institute of Standards and Technology ("NIST").
`
`1.
`
`FIELD OF THE INVENTION
`
`This invention pertains to automated manufacturing environments, and, more
`
`particularly, to scheduling in an automated manufacturing environment.
`
`2.
`
`DESCRIPTION OF THE RELATED ART
`
`Growing technological requirements and the worldwide acceptance of sophisticated
`
`electronic devices have created an unprecedented demand for large-scale, complex, integrated
`
`circuits. Competition in the semiconductor industry requires that products be designed,
`
`manufactured, and marketed in the most efficient manner possible.
`
`This requires
`
`2fi'l!
`
`improvements in fabrication technology to keep pace with the rapid improvements in the
`
`electronics industry. Meeting these demands spawns many technological advances in
`
`materials and processing equipment and significantly increases the number of integrated
`
`circuit designs. These improvements also require effective utilization of computing resources
`
`and other highly sophisticated equipment to aid, not only design and fabrication, but also the
`
`25
`
`scheduling, control, and automation of the manufacturing process.
`
`Turning first to fabrication, integrated circuits, or microchips, are manufactured from
`
`modem semiconductor devices containing numerous structures or features, typically the size
`
`of a few micrometers. The fabrication process generally involves processing a number of
`
`30
`
`wafers through a series of fabrication tools. Layers of materials are added to, removed from,
`
`and/or treated on a semiconducting substrate during fabrication to create the integrated
`
`circuits. The fabrication essentially comprises the following four basic operations:
`
`Page2 of55
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 5 of 274
`
`
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`•
`
`•
`•
`
`•
`
`layering, or adding thin layers of various materials to a wafer from which a
`
`semiconductor is produced;
`
`patterning, or removing selected portions of added layers;
`
`doping, or placing specific amounts of dopants in selected portions of the
`
`wafer through openings in the added layers; and
`
`heat treating, or heating and cooling the materials to produce desired effects in
`
`the processed wafer.
`
`5
`
`Although there are only four basic operations, they can be combined in hundreds of different
`
`ways, depending upon the particular fabrication process.
`
`See, e.g., Peter Van Zant,
`
`10
`
`Microchip Fabrication A Practical Guide to Semiconductor Processing (3d Ed.
`
`1997
`
`McGraw-Hill Companies, Inc.) (ISBN 0-07-067250-4). Each fabrication tool performs one
`
`or more of four basic operations. The four basic operations are performed in accordance with
`
`an overall process to finally produce the finished semiconductor devices.
`
`Controlling a semiconductor factory fabricating such integrated circuits, however, is a
`
`challenging task. A semiconductor factory ("fab") is a complex environment where
`
`numerous parts, typically 40,000 wafers or more, and numerous part types, typically 100 part
`
`types or more, are simultaneously being manufactured. As each wafer moves through the
`
`semiconductor factory ( or, "fab"), it may undergo more than 300 processing steps, many of
`
`20
`
`which use the same machines. A large factory may contain approximately 500 computer(cid:173)
`
`controlled machines to perform this wafer processing. Routing, scheduling, and tracking
`
`material through the fab is a difficult and complicated task, even with the assistance of a
`
`computerized factory control system.
`
`25
`
`Efficient management of a facility for manufacturing products such as semiconductor
`
`chips requires monitoring various aspects of the manufacturing process. For example, it is
`
`typically desirable to track the amount of raw materials on hand, the status of work-in(cid:173)
`
`process and the status and availability of machines and tools at every step in the process. One
`
`of the most important decisions is selecting which lot should run on each machine at any
`
`30
`
`given time. Additionally, most machines used in the manufacturing process require
`
`scheduling of routine preventative maintenance ("PM") and equipment qualification ("Qual")
`
`procedures, as well as other diagnostic and reconditioning procedures that must be performed
`
`Page 3 of55
`
`jiff
`
`liim liHll!!ilUiHii-lil, Mllt!KD:mll
`
`• II
`
`I
`
`....
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 6 of 274
`
`
`
`on a regular basis. These procedures should be performed such that they do not impede the
`
`manufacturing process itself
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`One approach to this issue implements an automated "Manufacturing Execution
`
`s
`
`System" ("MES"). An automated MES enables a user to view and manipulate, to a limited
`
`extent, the status of machines and tools, or "entities," in a manufacturing environment. In
`
`addition, an MES permits dispatching and tracking of lots or work-in-process through the
`
`manufacturing process to enable resources to be managed in the most efficient manner.
`
`Specifically, in response to MES prompts, a user inputs requested information regarding
`
`10
`
`work-in-process and entity status. For example, when a user performs a PM on a particular
`
`entity, the operator logs the performance of the PM (an "event") into an MES screen to
`
`update the information stored in the MES database with respect to the status of that entity.
`
`Alternatively, if an entity is to be put down for repair or maintenance, the operator will log
`
`this information into the MES database, which then prevents use of the entity until it is
`
`subsequently logged back up.
`
`1z.,
`
`1s];
`
`Although MES systems are sufficient for tracking lots and machines, such systems
`
`suffer several deficiencies, the most obvious of which are their passive nature, lack of
`
`advance scheduling and inability to support highly automated factory operations. Current
`
`20
`
`MES systems largely depend on manufacturing personnel for monitoring factory state and
`
`initiating activities at the correct time. For example, a lot does not begin processing until a
`
`wafer fab technician ("WFT") issues the appropriate MES command. And, prior to
`
`processing, a WFT must issue an MES command to retrieve the lot from the automated
`
`material handling system ("AMHS") with sufficient advance planning that the lot is available
`
`2s
`
`at the machine when the machine becomes available. If the WFT does not retrieve the lot
`
`soon enough, or neglects to initiate processing at the earliest available time, the machine
`
`becomes idle and production is adversely impacted.
`
`These types of deficiencies in the typical automated MES emphasize the importance
`
`30
`
`of the WFT in the efficient operation of the manufacturing process. WFTs perform many
`
`vital functions. For instance, WFTs initiate dispatching, transport, and processing as their
`
`attention and time permits. They make scheduling decisions such as whether to run an
`
`incomplete batch, as opposed to waiting for additional approaching lots, or performing PM or
`
`Page4 of55
`
`\l,iitl
`
`Hl
`
`, O,,
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 7 of 274
`
`
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`qualification procedures instead of processing lots. WFTs perform non-value added MES
`
`transactions and utilize conventional factory control systems that are passive. In this context,
`
`the term "passive" means activities in the control system must be initiated by the WFT, as
`
`opposed to being self-starting or self-initiating.
`
`5
`
`However, the presence ofWFTs also inevitably introduces some inefficiencies. There
`
`typically is a large difference between the performance of the best WFT and the performance
`
`of the worst WFT. A WFT typically simultaneously monitors the processing of multiple
`
`tools and lots, making it difficult to focus on an individual lot or tool. Furthermore, the size
`
`10
`
`and complexity of the modem fabrication process flows makes it exceedingly difficult for a
`
`WFT to foresee and prevent downstream bottlenecks or shortages arising from upstream
`
`activities. Shift changes, rest breaks, and days off for the WFT also create inefficiencies or
`
`machine idle time that adversely impact the manufacturing process flow.
`
`Just as the
`
`importance of the WFT is magnified by the deficiencies of the automated MES, so are the
`
`inefficiencies of the WFT magnified by his importance.
`
`Thus, factory control systems utilized in today's wafer fabs are passive and do not
`
`enable a high degree of automation. These systems are very dependent on WFTs and other
`
`factory staff to monitor the state of the factory, to continuously react to change, to make rapid
`
`20
`
`logistical decisions, and to initiate and coordinate factory control activity in a timely manner.
`
`These WFTs are agents, providing the active element that is lacking in factory control
`
`systems. As a result, factory effectiveness in the highly competitive semiconductor industry
`
`is quite dependent on the availability, productivity, skill level, and consistency of these
`
`human agents. WFTs must monitor and operate a number of tools located in various bays in
`
`2s
`
`a fab. They are forced to multiplex across tools, bays, material handling systems and a
`
`variety of factory control systems. As a fab's production ramps and more complex processes
`
`are introduced, it becomes more difficult to meet the increased complexity and volume
`
`without increasing staff or system capabilities. WFTs visibility of upstream and downstream
`
`operations, tool state, work-in-process and resource availability is limited.
`
`30
`
`However, key logistical decisions are frequently based on this limited and dated
`
`information, which is only partially provided by factory control systems. WFTs spend a
`
`significant amount of time interacting with systems, monitoring factory events and state
`
`Page 5 of55
`
`4illi:
`
`ll~H11
`
`I
`
`f!ilsillJll!.¼:11HIIIAl~II
`
`'l!llllll •n•
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 8 of 274
`
`
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`changes, and performing other non-value added functions, such as MES logging. Shift
`
`changes disrupt the operation of the fab as the technicians are temporarily unable to provide
`
`required monitoring and coordination. Despite the best efforts of the technicians, utilization
`
`of tools suffer, adversely impacting other key factory metrics including cycle time, inventory
`
`s
`
`levels, factory output and mix. With the need for intrabay material handling to transport 12-
`
`inch wafers in new 300 mm wafer fabs, significant additional complexity is introduced.
`
`Conventional factory control systems are not capable of providing this level of detailed
`
`scheduling and execution control.
`
`IO
`
`The present invention is directed to resolving, or at least reducing, one or all of the
`
`problems mentioned above.
`
`SUMMARY OF THE INVENTION
`
`The invention, in its various aspects and embodiments, is a method and apparatus for
`
`15,
`
`scheduling in an automated manufacturing environment.
`
`In one embodiment, a method
`
`comprises detecting an occurrence of a predetermined event in a process flow; notifying a
`
`software scheduling agent of the occurrence; and reactively scheduling an action from the
`
`software scheduling agent responsive to the detection of the predetermined event.
`
`Alternative embodiments include a computing system programmed to perform this method
`
`20
`
`and a computer-readable program storage medium encoded with instructions to implement
`
`this method. In still another embodiment, the invention includes automated manufacturing
`
`environment, comprising a process flow and a computing system. The computing system
`
`further includes a plurality of software scheduling agents residing thereon, the software
`
`scheduling agents being capable of reactively scheduling appointments for activities in the
`
`2s
`
`process flow responsive to a plurality of predetermined events.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`The invention may be understood by reference to the following description taken in
`
`conjunction with the accompanying drawings, in which like reference numerals identify like
`
`elements, and in which:
`
`30
`
`Page 6 of55
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 9 of 274
`
`
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`FIG. 1 conceptually depicts a portion of one particular embodiment of a process flow
`
`constructed and operated in accordance ,vith the present invention;
`FIG. 2 conceptually depicts, in a partial block diagram, selected portions of the
`
`hardware and software architectures, respectively, of the computing devices in FIG. 1;
`FIG. 3 conceptually depicts one particular implementation of the apparatus of FIG. 1,
`
`i.e., in a portion of a process flow from a semiconductor fabrication facility, and the manner
`
`in which it schedules appointments for the consumption of resources;
`FIG. 4 conceptually depicts a calendar of booked appointments;
`FIG. 5 conceptually illustrates three related calendars of booked appointments;
`FIG. 6A and FIG. 6B conceptually illustrates the changing of booked appointments
`
`to take advantage of early start times; and
`FIG. 7A and FIG. 7B conceptually illustrate two circumstances in which booked
`
`appointments are changed to accommodate unexpectedly long durations for preceding
`
`booked appointments.
`
`s
`
`10
`
`1:;::
`:+;:
`
`1sir:
`
`While the invention is susceptible to various modifications and alternative forms,
`
`specific embodiments thereof have been shown bi way of example in the drawings and are
`
`herein described in detail. It should be understood, however, that the description herein of
`
`specific embodiments is not intended to limit the invention to the particular forms disclosed,
`
`20
`
`but on the contrary, the intention is to cover all modifications, equivalents, and alternatives
`
`falling within the spirit and scope of the invention as defined by the appended claims.
`
`DETAILED DESCRIPTION OF THE INVENTION
`
`Illustrative embodiments of the invention are described below.
`
`In the interest of
`
`2s
`
`clarity, not all features of an actual implementation are described in this specification. It will
`
`of course be appreciated that in the development of any such actual embodiment, numerous
`
`implementation-specific decisions must be made to achieve the developers' specific goals,
`
`such as compliance with system-related and business-related constraints, which will vary
`
`from one implementation to another. Moreover, it will be appreciated that such a
`
`30
`
`development effort, even if complex and time-consuming, would be a routine undertaking for
`
`those of ordinary skill in the art having the benefit of this disclosure.
`
`Page 7 of55
`
`El&at.dliiiiiii!l,i&itiili itii,ft.ilili&iii4i2&
`
`WI
`
`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 10 of 274
`
`
`
`WMA Docket No. 2000.079600
`Client Docket No. TT4739
`
`FIG. 1 conceptually illustrates a portion of one particular embodiment of a process
`
`flow 100 constructed and operated in accordance with the present invention. The process
`
`flow 100 fabricates semiconductor devices. However, the invention may be applied to other
`
`types of manufacturing processes. Thus, in the process flow 100 discussed above, the lots
`
`s
`
`130 of wafers 135 may be more generically referred to as "work pieces." The process tools
`
`115 and any process operations performed thereon need not necessarily be related to the
`
`manufacture of semiconductor devices in all embodiments. However, for the sake of clarity
`
`and to further an understanding of the invention, the terminology pertaining to semiconductor
`
`fabrication is retained in disclosing the invention in the context of the illustrated
`
`10
`
`embodiments.
`
`The illustrated portion of the process flow 100 includes two stations 105, each station
`
`,\!
`1$//:
`
`105 including a computing device 110 communicating with a process tool 115. The stations
`
`105 communicate with one another over communications links 120.
`
`In the illustrated
`
`embodiment, the computing devices 110 and the communications links 120 comprise a
`portion of a larger computing system, e.g., a network 125. The process tools 115 in FIG. 1
`
`are processing lots 130 of wafers 135 that will eventually become integrated circuit devices.
`
`The process flow 100 also includes portions of a MES and an automated materials handling
`
`system ("AMHS"), neither of which is shown for the sake of clarity, and other integrated
`
`20
`
`factory controls. The AMHS "handles" the lots 130 and facilitates their transport from one
`
`station 105 to another, as well as other locations in the process flow 100.
`
`As mentioned above, the computing devices 110 may be part of a larger computing
`
`system 125 by a connection over the communications links 120. Exemplary computing
`
`2s
`
`systems in such an implementation would include local area networks ("LANs"), wide area
`
`networks ("W ANs"), system area networks ("SANs"), intranets, or even the Internet. The
`
`computing system 125 employs a networked client/server architecture, but alternative
`
`embodiments may employ a peer-to-peer architecture.
`
`Thus,
`
`in some alternative
`
`embodiments, the computing devices 110 may communicate directly with one another. The
`
`30
`
`communications links 120 may be wireless, coaxial cable, optical fiber, or twisted wire pair
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`links, for example. The computing system 125, in embodiments employing one, and the
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`communications links 120 will be implementation specific and may be implemented in any
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`suitable manner known to the art. The computing system 125 may employ any suitable
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`Page 8 of55
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`111 Limlll11
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`Wt.Iii *'
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`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 11 of 274
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`communications protocol known to the art, e.g., Transmission Control Protocol/Internet
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`Protocol ('"TCP/IP").
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`WMA Docket No. 2000.079600
`Client Docket No. TT4739
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`FIG. 2 depicts selected portions of the hardware and software architectures of the
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`5
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`computing devices 110. Some aspects of the hardware and software architecture (e.g., the
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`individual cards, the basic input/output system ("BIOS"), input/output drivers, etc.) are not
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`shown. These aspects are omitted for the sake of clarity, and so as not to obscure the present
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`invention. As will be appreciated by those of ordinary skill in the art having the benefit of
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`this disclosure, however, the software and hardware architectures of the computing devices
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`10
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`110 will include many such routine features.
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`In the illustrated embodiment, the computing device 110 is a workstation, employing
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`a UNIX-based operating system 200, but the invention is not so limited. The computing
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`device 110 may be implemented in virtually any type of electronic computing device such as
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`a notebook computer, a desktop computer, a mini-computer, a mainframe computer, or a
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`supercomputer. The computing device 110 may even be, in some alternative embodiments, a
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`processor or controller embedded in the process tool 115. The invention also is not limited to
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`UNIX-based operating systems. Alternative operating systems (e.g., Windows™-, Linux™-,
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`or disk operating system ("DOS") -based) may also be employed. The invention is not
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`20
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`limited by the particular implementation of such features in the computing device 110.
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`The computing device 110 also includes a processor 205 communicating with storage
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`210 over a bus system 215. The storage 210 typically includes at least a hard disk (not
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`shown) and random access memory ("RAM") (also not shown). The computing device 110
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`25
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`may also, in some embodiments, include removable storage such as an optical disk 230, or a
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`floppy electromagnetic disk 235, or some other form, such as a magnetic tape (not shown) or
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`a zip disk (not shown). The computing device 110 includes a monitor 240, keyboard 245,
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`and a mouse 250, which together, along with their associated user interface software 255
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`comprise a user interface 260. The user interface 260 in the illustrated embodiment is a
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`30
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`graphical user interface ("GUI"), although this is not necessary to the practice of the
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`invention.
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`Page 9 of55
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`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 12 of 274
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`WMA Docket No. 2000.079600
`Client Docket No. TT4739
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`Each computing device 110 includes, in the illustrated embodiment, a software agent
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`265 residing in the storage 210. Note that the software agents 265 may reside in the process
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`flow 100 in places other than the computing devices 110. The situs of the software agent 265
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`is not material to the practice of the invention. Note also that, since the situs of the software
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`s
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`agents 265 is not material, some computing devices 110 may have multiple software agents
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`265 residing thereon while other computing devices 110 may not have any. Thus, there need
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`not be a one-to-one correspondence between the computing devices 100 and the process tools
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`115. Software component(s) 270, 280 of an automated MES, such as WORK.STREAM™,
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`and of an AMHS, respectively, also reside on at least one computing device 110. As with the
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`10
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`software agent(s) 265, the software components 270, 280 may reside anywhere within the
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`process flow 100.
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`Referring now to FIG. 1 and FIG. 2, the sofuvare agents 265 each represent some
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`"manufacturing domain entity," e.g., a lot 130, a process tool 115, a resource, a PM, or a
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`Qual. A process tool 115 may be a fabrication tool used to fabricate some portion of the
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`wafers 135, i.e., layer, pattern, dope, or heat treat the wafers 135. Or, the process tool 115
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`may be a metrology tool used to evaluate the performance of various parts of the process flow
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`100. The software agents 265, collectively, are responsible for efficiently scheduling and
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`controlling the lots 130 of wafers 135 through the fabrication process. In furtherance of these
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`20
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`objectives, the software agents 265 interface with the software components 270, 280 of the
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`MES and AMHS, respectively, and are integrated with other existing factory control systems
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`(not shown). The software agents 265, where appropriate, also interface with the process
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`tools 115 and other equipment through a software implemented "equipment interface" ("EI'')
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`(not shown). As will be apparent to those skilled in the art having the benefit of this
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`2s
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`disclosure, the manner in which this interface and integration occurs is implementation
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`specific, depending upon the makeup and configuration of the MES, the AMHS, and the
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`other factory control systems.
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`Of particular interest to the present invention, the software agents 265 reactively
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`30
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`schedule, initiate, and execute activities on behalf of their respective manufacturing domain
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`entities.
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`In the illustrated embodiment, the software agents 265 also proactively schedule
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`activities. Collectively, the software agents 265, among other things, schedule ahead for each
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`lot 130 one or more operations on a specific qualified process tool 115, including transports
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`Page 10 of55
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`Applied Materials, Inc. Ex. 1006
`Applied v. Ocean, IPR Patent No. 6,968,248
`Page 13 of 274
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`WMA Docket No. 2000.079600
`Client Docket No. TT4739
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`and required resources, as discussed further below. This includes making optimizing
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`decisions such as running an incomplete batch, as opposed to waiting for an approaching lot
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`130, and scheduling opportunistic preventive maintenance
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`("PM") procedures or
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`qualification tests ("Quals") to meet specifications. The software agents 265 schedule and
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`s
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`initiate activities such as lot transport and processing; perform MES transactions; monitor
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`processing and transport; and react to unscheduled activities or deviations from scheduled
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`activities.
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`Furthermore, in the illustrated embodiment, the software agents 265 are
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`configurable in a manner that allows a user to influence their behavior in order to tune the
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`performance of the process flow 100.
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`10
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`)!
`1511
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`20
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`In the illustrated embodiment, the scheduling agents 265 are typed by the
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`manufacturing domain entities they represent. There may be many different types of
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`scheduling agents 265, depending on the implementations. The principle types of scheduling
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`agents 265 in the illustrated embodiment, shown in FIG. 3, include:
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`•
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`•
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`•
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`•
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`a Lot Scheduling Agent ("LSA") 305 that schedules activities on behalf of lots
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`130 of wafers 135;
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`a Machine Scheduling Agent ("MSA") 310 that schedules activities on behalf
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`of process tools 115;
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`a PM Scheduling Agent ("PMSA") 315 that schedules activities on behalf of
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`PMs and Quals (not shown); and
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`a Resource Scheduling Agent ("RSA") 320 that schedules activities on behalf
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`of resources (not shown).
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`However, other types may be employed in addition to, or in lieu of, those shown. The roles
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`and functions of each of these of scheduling agents 265 in the illustrated embodiment will be
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`2s
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`more fully discussed below.
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`Some of these activities are scheduled reactively, i.e., in res