TOMMAND DUE
`
`A
`
`US010078355B2
`
`UN CANTI
`
`( 12 ) United States Patent
`Eriksen
`
`( 10 ) Patent No . : US 10 , 078 , 355 B2
`( 45 ) Date of Patent :
`* Sep . 18 , 2018
`
`( * ) Notice :
`
`( 54 ) COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`( 71 ) Applicant : Asetek Danmark A / S , Aalborg East
`( DK )
`( 72 ) Inventor : André Sloth Eriksen , Nibe ( DK )
`( 73 ) Assignee : Asetek Danmark A / S , Aalborg East
`( DK )
`Subject to any disclaimer , the term of this
`patent is extended or adjusted under 35
`U . S . C . 154 ( b ) by 0 days .
`This patent is subject to a terminal dis
`claimer .
`( 21 ) Appl . No . : 15 / 626 , 706
`( 22 ) Filed :
`Jun . 19 , 2017
`( 65 )
`Prior Publication Data
`US 2017 / 0329376 A1 Nov . 16 , 2017
`Related U . S . Application Data
`( 63 ) Continuation of application No . 13 / 861 , 593 , filed on
`Apr . 12 , 2013 , now Pat . No . 9 , 733 , 681 , which is a
`( Continued )
`
`( 51 ) Int . Ci .
`F28F 7700
`G06F 1 / 20
`
`( 52 )
`
`alle
`
`( 58 )
`
`( 2006 . 01 )
`( 2006 . 01 )
`( Continued )
`U . S . CI .
`CPC . . . . . GO6F 1 / 206 ( 2013 . 01 ) ; F04D 15 / 0066
`( 2013 . 01 ) ; G06F 1 / 20 ( 2013 . 01 ) ;
`( Continued )
`Field of Classification Search
`CPC . . . . . . GO6F 1 / 206 ; G06F 1 / 20 ; G06F 2200 / 201 ;
`F04D 15 / 0066 ; HO1L 23 / 473 ; HOIL
`2924 / 0002 ; HO5K 7 / 20263 ; HO5K
`7 / 20272
`( Continued )
`
`( 56 )
`
`CN
`CN
`
`References Cited
`U . S . PATENT DOCUMENTS
`3 , 810 , 509 A
`5 / 1974 Kun
`4 , 109 , 707 A
`8 / 1978 Wilson et al .
`( Continued )
`FOREIGN PATENT DOCUMENTS
`2514544 Y
`10 / 2002
`1387311 A
`12 / 2002
`( Continued )
`
`OTHER PUBLICATIONS
`Notice of Allowability with Examiner ' s Reason for Allowance
`dated May 17 , 2012 in U . S . Appl . No . 12 / 826 , 768 ( 4 pages ) .
`( Continued )
`Primary Examiner — Davis Hwu
`( 74 ) Attorney , Agent , or Firm — Finnegan , Henderson ,
`Farabow , Garrett & Dunner LLP
`
`ABSTRACT
`( 57 )
`The invention relates to a cooling system for a computer
`system , said computer system comprising at least one unit
`such as a central processing unit ( CPU ) generating thermal
`energy and said cooling system intended for cooling the at
`least one processing unit and comprising a reservoir having
`an amount of cooling liquid , said cooling liquid intended for
`accumulating and transferring of thermal energy dissipated
`from the processing unit to the cooling liquid . The cooling
`system has a heat exchanging interface for providing ther
`mal contact between the processing unit and the cooling
`liquid for dissipating heat from the processing unit to the
`cooling liquid . Different embodiments of the heat exchang
`ing system as well as means for establishing and controlling
`a flow of cooling liquid and a cooling strategy constitutes the
`invention of the cooling system .
`
`16 Claims , 17 Drawing Sheets
`
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`muslim te
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`ANVAS
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`CoolIT Systems, Inc. Ex. 1026, Page 1 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`US 10 , 078 , 355 B2
`Page 2
`
`( 52 )
`
`( 56 )
`
`( 2006 . 01 )
`( 2006 . 01 )
`( 2006 . 01 )
`
`Related U . S . Application Data
`continuation of application No . 11 / 919 , 974 , filed as
`application No . PCT / DK2005 / 000310 on May 6 ,
`2005 .
`( 51 ) Int . CI .
`HOIL 23 / 473
`F040 15 / 00
`H05K 7 / 20
`U . S . CI .
`HOIL 23 / 473 ( 2013 . 01 ) ; H05K 7 / 20263
`( 2013 . 01 ) ; H05K 7 / 20272 ( 2013 . 01 ) ; G06F
`2200 / 201 ( 2013 . 01 ) ; HOLL 2924 / 0002
`( 2013 . 01 )
`( 58 ) Field of Classification Search
`. . . . . . . . . 165 / 80 . 4
`USPC . . . . . . . . . . . . . . .
`See application file for complete search history .
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`
`CoolIT Systems, Inc. Ex. 1026, Page 2 of 35
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`US 10 , 078 , 355 B2
`Page 3
`
`( 56 )
`
`References Cited
`OTHER PUBLICATIONS
`Office Action dated Aug . 22 , 2007 in U . S . Appl . No . 10 / 578 , 578 ( 9
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`
`IHNATHHNHNHI
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`( 16 pages ) .
`* cited by examiner
`
`CoolIT Systems, Inc. Ex. 1026, Page 3 of 35
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`IPR2021-01196
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`

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`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 1 of 17
`
`US 10 , 078 , 355 B2
`
`W
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`CoolIT Systems, Inc. Ex. 1026, Page 4 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`U . S . Patent
`
`Sep . 18 , 2018
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`US 10 , 078 , 355 B2
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`CoolIT Systems, Inc. Ex. 1026, Page 5 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 3 of 17
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`US 10 , 078 , 355 B2
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`CoolIT Systems, Inc. Ex. 1026, Page 6 of 35
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`IPR2021-01196
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`U . S . Patent
`
`Sep . 18 , 2018
`
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`US 10 , 078 , 355 B2
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`CoolIT Systems, Inc. Ex. 1026, Page 7 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

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`
`Sep . 18 , 2018
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`CoolIT Systems, Inc. Ex. 1026, Page 8 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 6 of 17
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`US 10 , 078 , 355 B2
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`CoolIT Systems, Inc. Ex. 1026, Page 9 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`atent
`
`Sep . 18 , 2018
`
`Sheet 7 of 17
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`US 10 , 078 , 355 B2
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`CoolIT Systems, Inc. Ex. 1026, Page 10 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`U . S . Patent
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`Sep . 18 , 2018
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`Sheet 8 of 17
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`US 10 , 078 , 355 B2
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`
`CoolIT Systems, Inc. Ex. 1026, Page 11 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 9 of 17
`
`US 10 , 078 , 355 B2
`
`H
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`mmelmansumasinattningen als
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`CoolIT Systems, Inc. Ex. 1026, Page 12 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 10 of 17
`
`US 10 , 078 , 355 B2
`
`*
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`FIG . 12
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`CoolIT Systems, Inc. Ex. 1026, Page 13 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`atent
`
`Sep . 18 , 2018
`
`Sheet 11 of 17
`
`US 10 , 078 , 355 B2
`
`er yan s?n
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`FIG . 13
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`CoolIT Systems, Inc. Ex. 1026, Page 14 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 12 of 17
`
`US 10 , 078 , 355 B2
`
`tants
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`www indyw idth
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`CoolIT Systems, Inc. Ex. 1026, Page 15 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 13 of 17
`
`US 10 , 078 , 355 B2
`
`4 4A
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`FIG . 15
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`CoolIT Systems, Inc. Ex. 1026, Page 16 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`atent
`
`Sep . 18 , 2018
`
`Sheet 14 of 17
`
`US 10 , 078 , 355 B2
`
`* * * * * *
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`CoolIT Systems, Inc. Ex. 1026, Page 17 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 15 of 17
`
`US 10 , 078 , 355 B2
`
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`CoolIT Systems, Inc. Ex. 1026, Page 18 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 16 of 17
`
`US 10 , 078 , 355 B2
`
`56 a
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`FIG . 19
`
`CoolIT Systems, Inc. Ex. 1026, Page 19 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`U . S . Patent
`
`Sep . 18 , 2018
`
`Sheet 17 of 17
`
`US 10 , 078 , 355 B2
`
`* * * * *
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`Wana , 111111th
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`CoolIT Systems, Inc. Ex. 1026, Page 20 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`US 10 , 078 , 355 B2
`
`thermal energy and said cooling system intended for cooling
`COOLING SYSTEM FOR A COMPUTER
`SYSTEM
`the at least one processing unit , a reservoir having an amount
`of cooling liquid , said cooling liquid intended for accumu
`lating and transferring of thermal energy dissipated from the
`This application is a continuation of U . S . application Ser .
`No . 13 / 861 , 593 , filed Apr . 12 , 2013 , which is a continuation 5 processing unit to the cooling liquid , a heat exchanging
`of U . S . application Ser . No . 11 / 919 / 974 , filed Jan . 6 , 2009 ,
`interface for providing thermal contact between the process
`which is a U . S . National Stage Application of PCT / DK2005 )
`ing unit and the cooling liquid for dissipating heat from the
`processing unit to the cooling liquid , a pump being provided
`000310 , filed May 6 , 2005 , which are incorporated herein by
`as part of an integrate element , said integrate element
`reference in their entirety .
`10 comprising the heat exchanging interface , the reservoir and
`the pump , said pump intended for pumping the cooling
`BACKGROUND
`liquid into the reservoir , through the reservoir and from the
`The present invention relates to a cooling system for a
`reservoir to a heat radiating means , said heat radiating means
`central processing unit ( CPU ) or other processing unit of a
`intended for radiating thermal energy from the cooling
`computer system . More specifically , the invention relates to 15 liquid , dissipated to the cooling liquid , to surroundings of
`a liquid - cooling system for a mainstream computer system
`the heat radiating means .
`By providing an integrate element , it is possible to limit
`such as a PC .
`During operation of a computer , the heat created inside
`the number of separate elements of the system . However ,
`the CPU or other processing unit must be carried away fast
`there is actually no need for limiting the number of elements ,
`and efficiently , keeping the temperature within the design 20 because often there is enough space within a cabinet of a
`range specified by the manufacturer . As an example of
`computer system to encompass the different individual ele
`cooling systems , various CPU cooling methods exist and the
`ments of the cooling system . Thus , it is surprisingly that , at
`most used CPU cooling method to date has been an air -
`all , any attempt is conducted of integrating some of the
`cooling arrangement , wherein a heat sink in thermal contact
`elements .
`with the CPU transports the heat away from the CPU and as 25
`In possible embodiments according to this aspect of the
`an option a fan mounted on top of the heat sink functions as
`invention , the entire pump is placed inside the reservoir with
`an air fan for removing the heat from the heat sink by
`at least an inlet or an outlet leading to the liquid in the
`blowing air through segments of the heat sink . This air
`reservoir . In an alternative embodiment the pump is placed
`cooling arrangement is sufficient as long as the heat pro -
`outside the reservoir in the immediate vicinity of the reser
`duced by the CPU is kept at today ' s level , however it 30 voir and wherein at least an inlet or an outlet is leading
`becomes less useful in future cooling arrangements when
`directly to the liquid in the reservoir . By placing the pump
`considering the development of CPUs since the speed of a
`inside the reservoir or in the immediate vicinity outside the
`CPU is said to double perhaps every 18 months , thus
`reservoir , the integrity of the combined reservoir , heat
`exchanger and pump is obtained , so that the element is easy
`increasing the heat production accordingly .
`Another design used today is a CPU cooling arrangement 35 to employ in new and existing computer systems , especially
`where cooling liquid is used to cool the CPU by circulating
`mainstream computer systems .
`a cooling liquid inside a closed system by means of a
`In a preferred embodiment , the pumping member of the
`pumping unit , and where the closed system also comprises
`pump and a driven part of the motor of the pump , such as a
`a heat exchanger past which the cooling liquid is circulated .
`rotor of en electrical motor , is placed inside the reservoir
`A liquid - cooling arrangement is more efficient than an 40 embedded in the cooling liquid , and wherein a stationary
`air - cooling arrangement and tends to lower the noise level of
`part of the motor of the pump , such as a stator of an electrical
`the cooling arrangement in general . However , the liquid
`motor , is placed outside the reservoir . By having the driven
`cooling design consists of many components , which
`part of the motor placed inside the reservoir submerged in
`increases the total installation time , thus making it less
`the cooling liquid and the stationary part of the motor
`desirable as a mainstream solution . With a trend of produc - 45 outside the reservoir , there is no need for encapsulating the
`ing smaller and more compact PCs for the end - users , the
`stationary part in a liquid - proof insulation . However , prob
`greater amount of components in a typical liquid - cooling
`lems may occur having then stationary part driving the
`arrangement is also undesirable . Furthermore , the many
`driven part . However , the present invention provide means
`components having to be coupled together incurs a risk of
`for obtaining such action , although not at all evident how to
`leakage of cooling liquid from the system .
`50 solve this problem .
`The object may also be obtained by a cooling system for
`SUMMARY
`a computer system , said computer system comprising : at
`least one unit such as a central processing unit ( CPU )
`It may be one object of the invention to provide a small
`generating thermal energy and said cooling system intended
`and compact liquid - cooling solution , which is more efficient 55 for cooling the at least one processing unit , a reservoir
`than existing air - cooling arrangements and which can be
`having an amount of cooling liquid , said cooling liquid
`produced at a low cost enabling high production volumes . It
`intended for accumulating and transferring of thermal
`may be another object to create a liquid - cooling arrange -
`energy dissipated from the processing unit to the cooling
`ment , which is easy - to - use and implement , and which
`liquid , a heat exchanging interface for providing thermal
`requires a low level of maintenance or no maintenance at all . 60 contact between the processing unit and the cooling liquid
`It may be still another object of the present invention to
`for dissipating heat from the processing unit to the cooling
`create a liquid - cooling arrangement , which can be used with
`liquid , a pump intended for pumping the cooling liquid into
`existing CPU types , and which can be used in existing
`the reservoir , through the reservoir and from the reservoir to
`a heat radiating means , said cooling system being intended
`computer systems .
`This object may be obtained by a cooling system for a 65 for thermal contact with the processing unit by means of
`existing fastening means associated with the processing unit ,
`computer system , said computer system comprising : at least
`one unit such as a central processing unit ( CPU ) generating
`and said heat radiating means intended for radiating from the
`
`CoolIT Systems, Inc. Ex. 1026, Page 21 of 35
`CoolIT Systems, Inc. v. Asestek Danmark A/S
`IPR2021-01196
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`

`

`US 10 , 078 , 355 B2
`
`voltage such as 220V or 110V is readily accessible as this is
`cooling liquid thermal energy , dissipated to the cooling
`liquid , to surroundings of the heat radiating means .
`the electrical voltage used to power the voltage supply of the
`computer system itself Although choosing to use a 12V
`The use of existing fastening means has the advantage
`motor for the pump , it has never been and will never be the
`that fitting of the cooling system is fast and easy . However ,
`once again there is no problem for the person skilled in the 5 choice of the person skilled in the art to use an AC motor .
`art to adopt specially adapted mounting means for any
`The voltage supplied by the voltage supply of the computer
`element of the cooling system , because there are numerous
`system itself is DC , thus this will be the type of voltage
`possibilities in existing cabinets of computer systems for
`chosen by the skilled person .
`mounting any kind of any number of elements , also elements
`In preferred embodiments according to any aspect of the
`10 invention , an electrical motor is intended both for driving the
`of a cooling system .
`In preferred embodiments according to this aspect of the
`pump for pumping the liquid and for driving the a fan for
`establishing a flow of air in the vicinity of the reservoir , or
`invention , the existing fastening means are means intended
`for attaching a heat sink to the processing unit , or the
`an electrical motor is intended both for driving the pump for
`existing fastening means are means intended for attaching a
`pumping the liquid and for driving the a fan for establishing
`cooling fan to the processing unit , or the existing fastening 15
`a flow of air in the vicinity of the heat radiating means , or
`means are means intended for attaching a heat sink together
`an electrical motor is intended both for driving the pump for
`with a cooling fan to the processing unit . Existing fastening
`pumping the liquid , and for driving the a fan for establishing
`means of the kind mentioned is commonly used for air
`a flow of air in the vicinity of the reservoir , and for driving
`cooling of CPUs of computer systems , however , air cooling
`the a fan for establishing a flow of air in the vicinity of the
`arrangements being much less complex than liquid cooling 20 heat radiating means .
`systems . Nevertheless , it has ingeniously been possible to
`By utilising a single electrical motor for driving more than
`develop a complex and effective liquid cooling system
`one element of the cooling system according to any of the
`capable of utilising such existing fastening means for simple
`aspects of the invention , the lesser complexity and the
`and less effective air cooling arrangements .
`reliability of the cooling system will be further enhanced .
`According to an aspect of the invention , the pump is 25
`The heat exchanging interface may be an element being
`selected from the following types : Bellows pump , centrifu -
`separate from the reservoir , and where the heat exchanging
`gal pump , diaphragm pump , drum pump , flexible liner
`interface is secured to the reservoir in a manner so that the
`pump , flexible impeller pump , gear pump , peristaltic tubing
`heat exchanging interface constitutes part of the reservoir
`pump , piston pump , processing cavity pump , pressure
`when being secured to the reservoir . Alternatively , the heat
`washer pump , rotary lobe pump , rotary vane pump and 30 exchanging interface constitutes an integrate surface of the
`electro - kinetic pump . By adopting one or more of the
`reservoir , and where the heat exchanging surface extends
`solution of the present invention , a wide variety of pumps
`along an area of the surface of the reservoir , said area of
`may be used without departing from the scope of the
`surface being intended for facing the processing unit and
`invention .
`said area of surface being intended for the close thermal
`According to another aspect of the invention , driving 35 contact with the processing unit . Even alternatively , the heat
`means for driving the pump is selected among the following
`exchanging interface is constitutes by a free surface of the
`driving means : electrically operated rotary motor , piezo -
`processing unit , and where the free surface is capable of
`electrically operated motor , permanent magnet operated
`establishing heat dissipation between the processing unit and
`motor , fluid - operated motor , capacitor - operated motor . As is
`the cooling liquid through an aperture provided in the
`the case when selecting the pump to pump the liquid , by 40 reservoir , and where the aperture extends along an area of
`adopting one or more of the solution of the present inven
`the surface of the reservoir , said surface being intended for
`tion , a wide variety of pumps may be used without departing
`facing the processing unit .
`Possibly , an uneven surface such as pins or fins extending
`from the scope of the invention .
`The object may also be obtained by a cooling system for
`from the copper plate provide a network of channels across
`a computer system , said computer system comprising : at 45 the inner surface of the heat exchanging interface . A network
`least one unit such as a central processing unit ( CPU )
`of channels ensure the cooling liquid being passed along the
`generating thermal energy and said cooling system intended
`inner surface of the interface such as a copper plate in a way
`for cooling the at least one processing unit , a reservoir
`that maximises the retention time of the cooling liquid along
`having an amount of coo