Vivek Subramanian
`@ EPFL
`Rue de la Maladière 71
`CH-2000 Neuchâtel, Switzerland
`Ph: +41 21 695 42 65
`Email: vivek.subramanian@epfl.ch
`
`@ Berkeley:
`513 Sutardja Dai Hall
`University of California
`Berkeley, CA 94720-1770, USA
`Ph: +1 (510) 643-4535
`Email: viveks@eecs.berkeley.edu
`Education
`Ph.D. in Electrical Engineering, Stanford University
`Stanford, California
`Honors earned: Graduate Fellowship, Eastman Kodak Company
`
`@ Virtual Mailbox
`13809 Research Blvd Suite 500
`PMB 91298
`Austin, TX 78750, USA
`
`MS in Electrical Engineering, Stanford University
`Stanford, California
`BS in Electrical Engineering, Louisiana State University
`Baton Rouge, Louisiana
`Honors earned:
`Summa cum laude, College Honors, Outstanding Senior, Junior and Sophomore, Honors College
`Professional Experience
`École polytechnique fédérale de Lausanne
`Switzerland
`8/18 – present: Professor of Microengineering
`
`Department of Electrical Engineering & Computer Sciences, University of California
`Berkeley, CA
`7/20 to date: Adjunct Professor
`7/18 – 6/20: Chancellor’s Professor
`7/11 – 6/20: Professor
`7/05 – 7/11: Associate Professor
`7/00-7/05: Assistant Professor
`Research, teaching and service in EECS Department
`Honors Earned:
`2015 IEEE Kiyo Tomiyasu Award
`Best in session and best in track awards, 2013 IMAPS Microelectronics Conference
`Outstanding paper award, 2012 IMAPS Microelectronics Conference
`2008 Printed Electronics Champion, Printed Electronics USA Conference, November 2008
`Outstanding Teaching Award, EECS Department, UC Berkeley, 2005
`Best paper award, 2004 IEEE Device Research Conference
`Nominated to MIT’s Technology Review top 100 young innovators list (TR100), 2002
`National Science Foundation Young Investigator (CAREER) Award, FY2002,
`Nominated to National Academy of Engineering’s Frontiers of Engineering, 2002
`Winner of 2002 Paul Rappaport Award for best paper in an IEEE EDS Journal
`Adjunct Professor, Sunchon National University
`Sunchon, Korea
`2013 to date: Adjunct Professor, BK21 Program
`2009-2013: Adjunct Professor and Principal Investigator, WCU Program
`Initiated, managed, and contributed to large multinational research program focused on printed
`electronics, including displays, energy devices, and RFID
`Independent Consultant
`Orinda, CA
`Consultant to the semiconductor industry and its associated fields in the following areas:
`Memory technology and design, Silicon Process Technology
`Display / Imager and Flexible Electronics Technology, RFID Technology
`Intellectual Property Consulting
`Technology Evaluation / Venture Capital due diligence
`
`3 / 96 - 6 / 98
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`9 / 94 - 3 / 96
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`8 / 90 - 5 / 94
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`2018 - present
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`2000 - present
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`2009 - present
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`2000 - present
`
` 2014- present
`
`Samsung Electronics Co., Ltd. v. Demaray LLC
`Samsung Electronic's Exhibit 1003
`Exhibit 1003, Page 1
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`

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`2004 – 2013
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`2008 - 2011
`
` 1998 - 2000
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`1998-2000
`
`1998 - 2000
`
`1998
`
`1997
`
`1996
`
`1994-1998
`
`
`
`
`
`Founder and CTO, Locix Inc.
`San Bruno, CA
`Senior leadership role in venture-funded startup company working on wireless networking
`
`Founding Scientific Advisor, Kovio, Inc.
`Sunnyvale, CA
`Scientific advising to printed electronics startup company
`Chief Technical Advisor, QuSwami, Inc.
`San Francisco, CA
`Scientific advising to energy conversion device startup company
`Served as CTO from July 2010-June 2011
`Consulting Assistant Professor, Electrical Engineering Department, Stanford University.
`Stanford, CA
`Advisory role for research group of Prof. Krishna C. Saraswat
`Visiting Research Engineer, Electrical Engineering Department, University of California.
`Berkeley, CA
`Research into 25nm MOSFET technologies for giga-scale integration
`Founder, Matrix Semiconductor, Inc.
`Santa Clara, CA
`Co-founder and technical advisor of startup company working on high-density memory technology
`Honors Earned:
`
`Nominated to Scientific American’s SA50 List for Visionary Technology
`
`Finalist for 2003 World Technology Award for Information Technology Hardware
`
`Winner, 2005 EDN Innovation Award
`Co-instructor, Electrical Engineering Department, Stanford University.
`Stanford, CA
`Co-teaching of EE311, Advanced Integrated Circuit Fabrication Processes
`Intern, Advanced Product Research and Development Laboratory, Motorola Inc.
`Austin, TX
`Research into process development issues affecting SiGe SEMFET devices
`Head Teaching Assistant EE410: IC Fabrication Laboratory, Stanford University
`Stanford, CA
`Coordination and instruction of EE410, graduate level laboratory course.
`Research Assistant, Electrical Engineering, Stanford University
`Stanford, CA
`Research into crystallization of amorphous Si and SiGe films using low thermal budget processes.
`Professional Affiliations and Activities
`Technical Program Committee, IEEE Electronic Components and Technology Conference, 2014 to 2016
`Chair, Scientific Advisory Board, iPACK, Royal Institute of Technology (KTH), Sweden, 2011 to 2016
`Tampere Institute of Technology Faculty Search Committee, Finland, 2013
`University of Oulu Faculty Search Committee, Finland, 2013
`Served as external thesis committee member for several universities world-wide, including University of
`Cape Town (South Africa), Tampere Institute of Technology (Finland), Technical University of Eindhoven
`(Netherlands), Indian Institute of Science (India), Indian Institute of Technology (India), 2009 to date
`Associate Editor, IEEE Journal of Display Technology, 2008 to date
`Technical Program Chair, Large Area, Organic, and Printed Electronics Conference, 2012-2013
`Scientific Committee, Large Area, Organic, and Printed Electronics Conference, 2009-2011
`Scientific Committee, International Conference on Printed and Flexible Elecronics, 2009-2013
`IEEE Electron Devices Society Organic Electronics Committee, 2003 - 2005
`Executive Committee, International Electron Device Meeting, 2003 to 2009
`Technical Program Committee, International Electron Device Meeting, 2001-2002
`Technical Program Committee member, Device Research Conference, 2000-2002
`Technical Program Committee member, VLSI-TSA Conference, 2005
`Member, Institute of Electrical and Electronic Engineers
`
`Ex. 1003, Page 2
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`

`

`List of Patents, Publications and Presentations
`
`9.
`
`8.
`
`
`Patents
`1. “Systems and methods for using ranging to determine locations of wireless sensor nodes based on radio frequency
`communications between the nodes and various RF-enabled devices”, T. Ylamurto, M. Seth, L. Kong, V. Subramanian,
`US Patent 10,551,479
`2. “Systems and methods for providing communications within wireless sensor networks based on a periodic beacon signal”,
`T. Ylamurto, V, Pavate, E. Alon, V. Subramanian, US Patent 10,536,901
`3. “Systems and methods for using radio frequency signals and sensors to monitor environments”, T. Bakhishev, V.
`Subramanian, V. Pavate T. Ylamurto, US Patent 10,514,704.
`4. “Systems and methods for using radio frequency signals and sensors to monitor environments”, T. Bakhishev, V.
`Subramanian, V. Pavate T. Ylamurto, US Patent 10,504,364
`5. “Systems and methods for coarse and fine time of flight estimates for precise radio frequency localization in the presence
`of multiple communication paths”, M. Seth, L. Kong, T. Ylamurto, V. Subramanian, US Patent 10,470,156
`6. “Methods and apparatus for monitoring wound healing using impedance spectroscopy”, M. Maharbiz, V. Subramanian,
`A. C. Arias, S. Swisher, A. Liao, M. Lin, F. Pavinatto, Y. Khan, D. Cohen, E. Leeflang, S. Roy, M. Harrison, D. Young,
`US Patent 10,463,293
`7. “Systems and methods for using radio frequency signals and sensors to monitor environments”, T. Bakhishev, V.
`Subramanian, V. Pavate T. Ylamurto, US Patent 10,156,852.
` “Systems and methods for determining locations of wireless sensor nodes in a tree network architecture having mesh-
`based features”, L. Kong, T. Bakhishev, T. Ylamurto, V. Subramanian, M. Seth, US Patent 10,104,508.
` “Systems and methods for providing wireless asymmetric network architectures of wireless devices with power
`management features”, V. Subramanian, E. Alon, V. Pavate, US Patent 10,028,220.
`10. “Random delay generation for thin-film transistor based circuits”, V Subramanian, M Mao, Z Wang, US Patent 9,985,664
`11. “Systems and methods for determining locations of wireless sensor nodes in a network architecture having mesh-based
`features for localization”, L. Kong, T. Bakhishev, T. Ylamurto, V. Subramanian, M. Seth, US Patent 9,846,220
`12. “Systems and methods for determining locations of wireless sensor nodes in a tree network architecture having mesh-
`based features”, L. Kong, T. Bakhishev, T. Ylamurto, V. Subramanian, M. Seth, US Patent 9,763,054
`13. “Through silicon vias and thermocompression bonding using inkjet-printed nanoparticles”, V. Subramanian and J. Sadie,
`US Patent 9,717,145
`14. “Systems and methods for providing wireless asymmetric network architectures of wireless devices with anti-collision
`features”, V. Subramanian, E. Alon, V. Pavate, US Patent 9,706,489
`15. “Systems and methods for determining locations of wireless sensor nodes in an asymmetric network architecture”, V.
`Subramanian, E. Alon, V. Pavate, US Patent 9,529,076
`16. “Systems and methods for providing wireless sensor networks with an asymmetric network architecture”, V. Subramanian,
`E. Alon, V. Pavate, US Patent 9,380,531
`17. “Transparent metal oxide nanoparticle compositions, methods of manufacture thereof and articles comprising the same”,
`V. Subramanian, S. K. Volkman, US Patent 9,343,202
`18. “Three-dimensional nonvolatile memory and method of fabrication”, M. G. Johnson, T. H. Lee, V. Subramanian, P. M.
`Farmwald, J. M. Cleeves, US Patent 9,214,243
`19. “Dense arrays and charge storage devices”, T. H. Lee, V. Subramanian, J. M. Cleeves, I. G. Kouznetsov, M. G. Johnson,
`P. M. Farmwald, US Patent 9,171,857
`20. “Print compatible designs and layout schemes for printed electronics”, Z. Wang, V. Subramanian, L. Cleveland, US Patent
`9,155,202
`21. “Wireless devices including printed integrated circuitry and methods for manufacturing and using the same”, P. Smith, C.
`Choi, V. Pavate, J. M. Cleeves, V. Subramanian, R. Young, V. Biviano, US Patent 9,004,366.
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`Ex. 1003, Page 3
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`

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`22. “Dense arrays and charge storage devices “, T. H. Lee, V. Subramanian, J. M. Cleeves, M. G. Johnson, P. M. Farmwald,
`I. Kouznetzov, US Patent, 8,981,457.
`23. “High reliability surveillance and/or identification tag/devices and methods of making and using the same”, V.
`Subramanian, P. Smith, V. Pavate, A. Kamath, C. Choi, A. Chandra, J. M. Cleeves, US Patent, 8,933,806.
`24. “Surveillance devices with multiple capacitors”, P. Smith, C. Choi, J. M. Cleeves, V. Subramanian, A. Kamath, S. Molesa,
`US Patent, 8,912,890.
`25. “Pillar-shaped nonvolatile memory and method of fabrication”, M. G. Johnson, T. H. Lee, V. Subramanian, P. M.
`Farmwald, J. M. Cleeeves, US Patent 8,897,056
`26. “Dense arrays and charge storage devices”, T. H. Lee, V. Subramanian, J. M. Cleeves, I. G. Kouznetsov, M. G. Johnson,
`P. M. Farmwald, US Patent 8,853,765
`27. “Dense arrays and charge storage devices”, T. H. Lee, V. Subramanian, J. M. Cleeves, I. G. Kouznetsov, M. G. Johnson,
`P. M. Farmwald, US Patent 8,823,076
`28. “Random delay generation for thin-film transistor based circuits”, V. Subramanian, M. Mao, Z. Wang, US Patent 8,810,298
`29. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, M. Johnson, T. Lee, V.
`Subramanian, M. Farmwald, and J. M. Cleeves, US Patent 8,503,215
`30. “Process-variation tolerant series-connected NMOS and PMOS diodes, and standard cells, tags, and sensors containing
`the same”, V. Subramanian, P. Smith, US Patent 8,471,308
`31. “Printed compatible designs and layout schemes for printed electronics”, Z. Wang, V. Subramanian, L. Cleveland, US
`Patent 8,383,952
`32. “Method for making surveillance devices with multiple capacitors”, P. Smith, C. Choi, J. M. Cleeves, V. Subramanian, A.
`Kamath, S. Molesa, US Patent 8,296,943
`33. “High reliability surveillance and/or identification tag/devices and methods of making and using the same”, V.
`Subramanian, P. Smith, V. Pavate, A. Kamath, C. Choi, A. Chandra, and J. M. Cleeves, US Patent 8,264,359
`34. “High reliability surveillance and/or identification tag/devices and methods of making and using the same”, V.
`Subramanian, P. Smith, V. Pavate, A. Kamath, C. Choi, A. Chandra, and J. M. Cleeves, US Patent 8,227,320
`35. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, M. Johnson, T. Lee, V.
`Subramanian, M. Farmwald, and J. M. Cleeves, US Patent 8208282
`36. “Reliable tag deactivation”,J. M. Cleeves, V. Subramanian, US Patent 8138921
`37. “Combined static and dynamic frequency divider chains using thin film transistors”, V. Subramanian, US Patent 8085068
`38. “Process-variation tolerant diode, standard cells including the same, tags and sensors containing the same, and methods
`for manufacturing the same”, V. Subramanian, P. Smith, US Patent 7932537
`39. “Three terminal nonvolatile memory Device with vertical gated diode”, T. H. Lee, V. Subramanian, J. M. Cleeves, M. G.
`Johnson, P. M. Farmwald, I. G. Kouznetsov, US Patent 7825455
`40. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, V. Subramanian, J. M. Cleeves,
`US Patent 7816189
`41. “Multi-mode tags and methods of making and using the same”, P. Smith, J. M. Cleeves, V. Pavate, V. Subramanian, US
`Patent 7750792
`42. “Method of manufacturing complementary diodes”, V. Subramanian, P. Smith, US Patent 7528017
`43. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, V. Subramanian, J. M. Cleeves,
`US Patent 7319053
`44. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, V. Subramanian, J. M. Cleeves,
`US Patent 7265000
`45. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, V. Subramanian, J. M. Cleeves,
`US Patent 7160761
`46. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, V. Subramanian, J. M. Cleeves,
`US Patent 7157314
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`Ex. 1003, Page 4
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`47. “Dense arrays and charge storage devices”, T. H. Lee, V. Subramanian, J. M. Cleeves, A. J. Walker, C. Petti, I.
`Kouznetzov, M. G. Johnson, P. M. Farmwald. B. Herner, US Patent 7129538
`48. “Patterning three dimensional structures”, C. K. Li, J. N. Knall, M. A. Vyvoda, J. M. Cleeves, V. Subramanian, US Patent
`7071565
`49. “Monolithic three dimensional array of charge storage devices containing a planarized layer”, T. H. Lee, V. Subramanian,
`J. M. Cleeves, A. J. Walker, C. J. Petti, I. G. Kouznetzov, M. G. Johnson, P. M. Farmwald, and B. Herner, US Patent
`6881994
`50. “Thermal processing for three dimensional circuits”, V. Subramanian, J. M. Cleeves, J. N. Knall, C. K. Li, and M. A.
`Vyvoda, US Patent 6,770,939
`51. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, M. G. Johnson, T. H. Lee, V.
`Subramanian, and P. M. Farmwald, US Patent 6780711
`52. “Multigate semiconductor device with vertical channel current and method of fabrication”, J. M. Cleeves and V.
`Subramanian, US Patent 6677204
`53. “Thermal processing for three dimensional circuits”, V. Subramanian, J. M. Cleeves, J. N. Knall, C. K. Li, and M. A.
`Vyvoda, US Patent 6624011
`54. “Multigate semiconductor device with vertical channel current and method of fabrication”, J. M. Cleeves and V.
`Subramanian, US Patent 6580124
`55. “Patterning three dimensional structures”, C. K. Li, J. N. Knall, M. A. Vyvoda, J. M. Cleeves, and V. Subramanian, US
`Patent 6627530
`56. “Low cost three-dimensional memory array”, M. Johnson, T. Lee, V. Subramanian, P. Farmwald, J. Knall, US Patent
`6515888
`57. “Integrated circuit structure including three-dimensional memory array”, M. Johnson, T. Lee, V. Subramanian, P. M.
`Farmwald, J. M. Cleeves, US Patent 6385074.
`58. “FINFET transistor structures having double gate channel extending vertically from a substrate and methods of
`manufacture”, C. Hu, T-J. King, V. Subramanian, L. Chang, X. Huang, Y-K. Choi, J. T. Kedzierski, N. Lindert, J. Bokor,
`W-C. Lee, US Patent 6413802
`59. “Vertically stacked field programmable nonvolatile memory and method of fabrication”, M. Johnson, T. Lee, V.
`Subramanian, M. Farmwald, and J. M. Cleeves, US Patent 6185122.
`60. “Vertically Stacked Field Programmable Nonvolatile Memory and Method of Fabrication”, M. Johnson, T. Lee, V.
`Subramanian, M. Farmwald, and J. M. Cleeves, US Patent 6034882.
`61. “Vertically Stacked Field Programmable Nonvolatile Memory and Method of Fabrication”, M. Johnson, T. Lee, V.
`Subramanian, M. Farmwald, and J. M. Cleeves, US Patent 6351406.
`62. “Vertically Stacked Field Programmable Nonvolatile Memory and Method of Fabrication”, M. Johnson, T. Lee, V.
`Subramanian, M. Farmwald, and J. M. Cleeves, US Patent 6483736.
`Invited Magazine Articles, Books, Chapters, and Monographs
`1. Chapter in “Inkjet Technology for Digital Fabrication”, Editors: Ian M. Hutchings, Graham D. Martin, Wiley, ISBN: 978-
`0470681985
`2. Chapter in “Applications of Organic and Printed Electronics: A Technology-Enabled Revolution (Integrated Circuits and
`Systems), Editor: E. Cantatore, ISB: 978-1-461-43159-6
`3. Chapter in “Inkjet-based Micromanufacturing”, Editors: Korvink, Smith, Shin, Wiley, ISBN: 978-3-527-31904-6
`4. Chapter in “Organic Electronics II. More Materials and Applications", Editor: H. Klauk, Wiley, ISBN: 978-3-527-32647-
`1
`5. Chapter in “Transparent Electronics: From Synthesis to Applications”, Editors: A. Facchetti and T. Marks, Wiley, ISBN:
`978-0-470-99077-3, 2010.
`6. Chapter in “The chemistry of inkjet inks”, Editor: S. Magdassi, World Scientific Publishing Company, ISBN: 978-
`9812818218, 2009
`7. Chapter in “Organic Field-Effect Transistors”, Editors: Z. Bao, and J. Locklin, CRC Press, ISBN: 978-0849380808, 2007
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`Ex. 1003, Page 5
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`8. “Developments in printed RFID”, V. Subramanian, Pira Publishing, UK, 2006.
`9. “3D Chips: Future Possibilities”, V. Subramanian, Silicon India, Feb 2003, pp. 24-25
`Invited Conference Presentations
`1. Invited, “Materials, Process, and Device Innovations for High-Performance Printed Electronics”, PRINSE’18 – The 5th
`Printed Intelligence Industry Seminar on Manufacturing Solutions for Customer Needs and Vision to the Future, Oulu,
`Finland, Jan 31-Feb 1, 2018.
`2. Invited¸ “Highly scaled gravure printed organic transistors for high-performance printed organic electronics”, High-
`frequency printed and direct-written organic-hybrid integrated circuits (HEROIC) Workshop, Milan, Italy, Nov 8-10,
`2017.
`3. Keynote, “Printed Electronics: Innovations in Materials, Processes, and Devices”, Association of International Metallizers,
`Coaters, and Laminators (AIMCAL) R2R Conference USA 2017, Tampa, FL, Oct-15-18, 2017.
`4. Invited, “High-performance gravure printed organic transistors”, 2017 European Materials Research Society Meeting,
`Strasbourg, France, May 22-26, 2017
`5. Invited, “Printed Electronics: Innovations in Materials, Processes, and Devices”, 2017 International Thin Film Transistor
`Conference (ITC 2017), Austin, TX, February 23-24, 2017.
`6. Invited, “High-speed Printing of Transistors: From Inks to Devices”, 2016 International Society of Coating Science and
`Technology Symposium (ISCST), Pittsburgh, PA, September 18-21, 2016.
`7. Keynote, “Printed Electronics: Innovations in Materials, Processes, and Devices”, 2016 Canadian Printable Flexible
`Wearable electronics Symposium (CPES2016), April 19-20, Oakville, Canada
`8. Keynote, “Printed Electronics: Innovations in Materials, Processes, and Device”, 2016 Society of Vacuum Coaters
`Techcon, Indianapolis, IN, May 10-13, 2016.
`9. Invited, Subramanian, Vivek, Chung, Seungjun, Grau, Gerd and Scheideler, William J., “71-2: Invited Paper: Printed
`Transistors and MEMS for Large-Area Electronics”, 2016 Society for Information Display Symposium, San Francisco,
`May 20-27, 2016.
`10. Keynote, “Printed Electronics: Innovations in Materials, Processes, and Devices”, 31st Philippine Chemistry Congress,
`Iloilo, Philippines, April 13-15, 2016.
`11. Keynote, “Advanced Processes, Materials, and Devices for Emerging Printed Electronics Applications”, 3rd Swiss
`Conference on Printed Electronics and Functional Materials, Neuchatel, Switzerland, Oct 1-2, 2015.
`12. Invited, “High-performance printed organic transistors: Materials, processes, and devices”, V. Subramanian, G. Grau, H.
`Kang, and R. Kitsomboonloha, 2015 American Chemical Society National Meeting and Exposition, Boston, MA, Aug
`17th, 2015.
`13. Invited, Subramanian, Vivek, Jaewon Jang, William Scheideler, and Sarah Swisher. “39.1: Invited Paper: Printed Inorganic
`Transistors Based on Transparent Oxides.” In SID Symposium Digest of Technical Papers, vol. 46, no. 1, pp. 587-590.
`2015.
`14. Plenary, “Printed Electronics: Advanced Technologies Enabling New Applications”, 2015 Flexible and Printed
`Electronics Conference, Monterey, CA, February 23-26, 2015.
`15. Invited, “High-resolution gravure printing of organic thin film transistors for high-performance printed electronic
`systems”, V. Subramanian, R. Kitsomboonloha, J. Cen, H. Kang, G. Grau, and W. J. Scheideler, Materials Research
`Society Fall Meeting, Boston, MA, Dec 3, 2014.
`16. Invited, “Advanced printed electronics technologies for novel ubiquitous human interactive systems”, 2014 CMOS
`Emerging Technologies Research Symposium, Grenoble, France, July 6-8, 2014.
`17. Invited, “Printed Electronics: A pathway to functionally-rich systems”, 64th annual IEEE Electronic Components and
`Technology Conference, Orland, FL, May 27, 2014.
`18. Invited, “Printed Electronics: The Confluence of Printing and Semiconductors”, Canadian Printed Electronics Symposium,
`Montreal, Canada, April 9, 2013.
`19. Invited “Modeling, scaling, and integration of gravure printing for fast switching Organic FETs”, V. Subramanian, S. J.
`S. Morris, H. Kang, Materials Research Society Fall 2012 Meeting, Boston, MA, Nov 25-30, 2012
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`Ex. 1003, Page 6
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`20. Invited, “Printed Nanoparticles as routes to high-performance printed conductors: Synthesis, Printing Processes, and
`Device Applications”, V. Subramanian, H. Kang, R. Kitsomboonloha, and S. K. Volkman, The 2012 International
`Conference on Flexible and Printed Electronics ICFPE2012, Tokyo, Japan, September 6th - 8th, 2012
`21. Invited “Advanced Printing Processes for High-Performance Printed Transistors”, V. Subramanian, Flextech Workshop
`on Printing Electronics - Ink and Substrate Interactions, Kalamazoo, MI, August 1-2, 2012
`22. Invited “High-performance Printed Transistors: Materials, Processes, and Devices”, V. Subramanian, 2nd CPEM
`International Symposium “Organic Semiconductors and Printed Electronics”, Gyeonggi, South Korea, May 10th, 2012.
`23. Invited “Highly-Scaled Gravure and Inkjet Printed Organic Transistors: Tools, Processes, and Devices”, Hongki Kang &
`Vivek Subramanian, 2012 Flextech Flexible Electronics and Display Conference, Phoenix, AZ, Feb 5-9, 2012.
`24. Plenary “Nanomaterials for printed electronics: synthesis, design, and applications”, V. Subramanian, International
`Conference on Nano Science and Nano Technology, Sunchon, Korea, November 11th, 2011.
`25. Invited “Advances in scaling of printed transistors”, V. Subramanian, International Seminar on Printed Electronics, Seoul,
`Korea, June 8th, 2011.
`26. Invited “High-Performance Fully Printed Transistors: Materials, Processes, and Device Characteristics”, V. Subramanian,
`H. Tseng, R. Kitsomboonloha, and A. de la Fuente Vornbrock, 2011 Electrochemical Society Meeting, Montreal, Canada,
`May 2011
`27. Invited “From Droplets to Devices: Printed Transistor Processes, Integration, and Characteristics”, Vivek Subramanian,
`Daniel Soltman, Huai-Yuan Tseng, Rungrot Kitsomboonloha and Alejandro de la Fuente Vornbrock, Materials Research
`Society Spring Meeting, San Francisco, CA, April 2011
`28. Keynote “Printed electronics: Innovations in tools, materials, devices, and applications”, V. Subramanian, 2011 Korea
`Printed Electronics Association (KoPeA) meeting, Seoul, Korea, March 2011
`29. Keynote “Printed RF tags and sensors: the confluence of printing and semiconductors”, V. Subramanian, F. Liao, and H-
`Y. Tseng, The European Microwave Integrated Circuits Conference 2010, Paris, France, September 2010.
`30. Invited “Droplet-on-demand direct patterning of active materials: materials, modeling, and integration”, V. Subramanian,
`The 2010 IEEE Lithography Workshop, Kuai, Hawaii, November 2010
`31. Plenary “Printed electronics: where are we, and where are we going”, V. Subramanian, 2010 Large Area Organic, and
`Printed Electronics Convention (LOPE-C), Frankfurt, Germany, June 2010.
`32. Keynote “Printed RFID: Technology Trends and Outlook”, V. Subramanian, IEEE International Conference on RFID
`2010, Orlando, Florida, April 2010.
`33. Invited “Mechanistic studies on sintering of nanoparticles for formation of solution-processed thin films”, 2010 Spring
`meeting of the Materials Research Society, San Francisco, CA, April 2010.
`34. Invited “Printed Electronics: the confluence of printing and semiconductors”, Vivek Subramanian, 2009 International
`Conference on Flexible and Printing Electronics, Jeju Island, Korea, Nov 2009.
`35. Invited “Organic Transistor Vapor and Biosensors – Technology Status and Implementation Issues”, Vivek Subramanian,
`Frank Liao, Lakshmi Jagannathan, Electrochemical Society Meeting, Vienna, Austria, October 2009.
`36. Invited “Printed transistors for low-cost electronics: the confluence of printing and printable electronic materials”, Vivek
`Subramanian, Alejandro de la Fuente Vornbrock, Steven Molesa, Daniel Soltman, Huai-Yuan Tseng, and Steven K.
`Volkman, SPIE Optics + Photonics, August 2-6, 2009, San Diego, CA
`37. Invited “Printed Zinc Oxide Based Electronics: Materials, Devices, and Outlook”, V. Subramanian, S. K. Volkman, and
`D. R. Redinger, LOPE-C, June 23-25, 2009, Frankfurt, Germany
`38. Invited “Printed Devices for Low-Cost Electronics: Technology Status and Outlook”, V. Subramanian, PETEC Inaugural
`Event, March 17, 2009, Durham, United Kingdom
`39. invited “Printed Electronic Tags and Sensors for Smart Packaging Applications”, Vivek Subramanian, Josephine Chang,
`Lakshmi Jagannathan, Frank Liao, Steve Molesa, David Redinger, Daniel Soltman, Huai-Yuan Tseng, Steve Volkman,
`Shong Yin, 2009 Flexible Electronics and Display Conference, Phoenix, AZ, Feb 2-5, 2009.
`40. invited “Electronic Nose Sensors for Consumer Packaging”, V. Subramanian, IDTechEx Printed Electronics USA, San
`Jose, CA, Dec 2-5, 2008.
`
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`41. invited “Solution-Processed Transparent Transistors for Low-Cost, Flexible Displays”, V. Subramanian, S. K. Volkman,
`and D. R. Redinger, LEOS 2008: The 21st Annual Meeting of the IEEE Lasers and Electro-Optics Society, Newport Beach,
`CA, 9-13 November, 2008.
`42. invited “Organic chemical and biosensors for smart packages”, V. Subramanian, IDTechEx Printed Electronics Asia,
`Tokyo, Japan, Oct 8-9, 2008.
`43. invited “Printed Electronics for Low-Cost Tags, Displays, and Sensors”, V. Subramanian, 1st International Conference on
`R2R Printed Electronics, Seoul, Korea, April 30-May 2, 2008.
`44. invited “Printed organic RFID tags: technology, roadmaps, and challenges”, V. Subramanian, 1st Plastic Electronics Asia
`Conference and Showcase, Seoul, Korea, June 24-26, 2008
`45. invited “Power supply considerations and solutions for printed electronic tags and sensors”, V. Subramanian, IDTechEx
`Printed Electronics Europe, Dresden, Germany, April 8-9, 2008
`46. invited “Printed Chemical and Biosensors: Technology, Design and Challenges”, GOSPEL Workshop on Plastic Chemical
`Sensors, Dresden, Germany, April 9, 2008
`47. Plenary “Printed Electronics For Low-Cost Electronic Systems: Technology Status and Application Development”, Vivek
`Subramanian, Josephine B. Chang, Alejandro de la Fuente Vornbrock, Daniel C. Huang, Lakshmi Jagannathan, Frank
`Liao, Brian Mattis, Steven Molesa, David R. Redinger, Daniel Soltman, Steven K. Volkman, Qintao Zhang, 38th European
`Solid State Device Research Conference, Edinburgh, Scotland, September 15-19, 2008
`48. invited “Printed Organic Transistors for Low-cost Tags, Displays, and Sensors: Technology, Modeling and Challenges”,
`Vivek Subramanian, Alejandro de la Fuente Vornbrock, Huai-Yuan Tseng and Shong Yin, Materials Research Society
`Fall Meeting, Boston, MA, Dec 1-4, 2008.
`49. invited “Printed Electronics for Low-Cost Tags and Sensors”, Vivek Subramanian, Sixth Annual Workshop on
`Microelectronics and Electron Devices, April 18, 2008.
`50. invited “Printed organic RF tags, chemical sensors and biosensors”, Vivek Subramanian, International Symposium for
`Flexible Electronics and Display, Hsinchu, Taiwan, Nov 18, 2007.
`51. invited “Printed Tags and Sensors for RFID: Opportunities and Challenges”, Vivek Subramanian, Printed Electronics USA
`2007, San Francisco, CA, Nov 14, 2007.
`52. invited “Printed RFID Tags: Materials, Processes, and Devices”, Vivek Subramanian, Daniel Soltman, Daniel Huang,
`Steven Molesa, 2007 AiChE Annual Meeting, Salt Lake City, UT, Nov. 8, 2007.
`53. invited “Printed organic RFID tags: technology, roadmaps, and challenges”, Vivek Subramanian, 3rd Global Plastic
`Electronics Conference and Showcase, Frankfurt, Germany, Oct 30, 2007.
`54. invited “Printed organic transistors: technology, characteristics, and modeling”, Vivek Subramanian, Alejandro de la
`Fuente Vornbrock, Daniel Soltman, Huai-Yuan Tseng, and Steve Molesa, 212th meeting of the Electrochemical Society,
`Washington, DC, Oct 8, 2007.
`55. invited “Printed electronic tags and sensors - device, materials, and circuit issues”, Vivek Subramanian, 2007 Organic
`Electronics Conference and Exhibition, Frankfurt, Germany, Sept 25, 2007.
`56. invited “Inkjet printing of transistors, diodes, and passive components for smart tags”, Vivek Subramanian, Innovations
`in Inkjet: 3rd DPI Inkjet Workshop, Eindhoven Institute of Technology, Netherlands, June 28-29, 2007.
`57. invited “Printed organic transistors”, A. de la Fuente and V. Subramanian, Industry Forum on Printed Electronics, Chicago,
`IL, April 23-24, 2007
`58. invited “From Materials to Circuits: Implications of printed materials on printed RFID”, V. Subramanian, 2007 Pira printed
`RFID conference, Frankfurt, Germany, June 4-6, 2007.
`59. keynote “Droplet on demand lithography: An enabling technology for low-cost electronics”, V. Subramanian, A. de la
`Fuente Vornbrock, S. Molesa, D. Redinger, Q. Zhang, and S. K. Volkman, SPIE Advanced lithography, 27th February,
`2007
`60. invited “Printed RFID tags: performance needs and technology trends”, V. Subramanian, 2007 IDTechEx Smart labels
`USA , Boston, MA, Febraury 20-23, 2007.
`61. keynote “Printed Organic Transistors for low-cost tagging and sensing applications”, V. Subramanian, J. Chang, A. de la
`Fuente Vornbrock, S. Molesa, D. Soltman, and Q. Zhang. 6th International IEEE Conference on Polymers and Adhesives
`in Microelectronics and Photonics, Tokyo, January 15th-18th, 2007.
`
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`

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`62. invited “Nano Inks for Printed RFID”, V. Subramanian, Pira Nanoscale Inks and Pigment Technologies Conference,
`Chicago, IL, Sept 27-28, 2006.
`63. invited “Toward Printed RFID: Materials, Processes, and Devices”, V. Subramanian, 5th Annual Printed Electronics and
`Displays Conference and Trade Fair, Las Vegas, Oct 11-13, 2006.
`64. invited “Inkjetted Organic Transistors for Smart Tagging Applications”, Vivek Subramanian, Jean M. J. Frechet, Steven
`Molesa, Josephine Chang, Amanda R. Murphy, Alejandro de la Fuente Vornbrock, Steven Volkman, 2006 AiChE Annual
`Meeting, Nov 17th, 2006
`65. invited focal paper “All-printed electronics: Materials, Devices, and Circuit Implications”, V.Subramanian, J. Chang, S.
`Molesa, D. Redinger, and S. Volkman, Digital Fabrication 2006, Denver, CO, Sept 17-22, 2006.
`66. invited “Printed transistors and passive components for low-cost electronics applications”, V. Subramanian, J. B. Chang,
`S. E. Molesa, S. K. Volkman, and D. R. Redinger, International Symposium on VLSI Technology, Systems and
`Applications (VLSI-TSA) April, 2006, pp. 68-9.
`67. invited “Advanced printed materials and devices for RFID applications”, V. Subramanian, IDTechEx Printed Electronics
`Europe, April 19-21, 2006.
`68. invited “Printed Electronic Nose Vapor Sensors for Consumer Product Monitoring”, V. Subramanian, J. Lee, V. Liu, S.
`Molesa, IEEE International Solid State Circuits Conference