Bruce W. Smith, Ph.D.
`
`SUMMARY
`
`
`
`
`Microsystems Engineering
`College of Engineering
`Rochester Institute of Technology
` (585) 475-2058 bwsemc@rit.edu
`
`Bruce Smith has over 35 years of research, academic, industry, and consulting engineering experience in semiconductor
`device materials, IC (integrated circuit) processing, microelectronics, microlithography, and LCD-TFT technology. He is a
`Distinguished Professor of Microelectronic Engineering and the Director of the Ph.D. program in Microsystems Engineering
`at the Rochester Institute of Technology. His industry experience includes manufacturing and R&D and he has worked with
`companies in the US, Europe, and Asia. Professor Smith is a Fellow of the IEEE, a Fellow of the OSA, a Fellow of SPIE,
`and a member of AVS, ASEE, and SID. He is the recipient of the IEEE Technical Excellence Award, the RIT Trustees
`Scholarship Award, the SPIE Research Mentoring Award, the AVS Excellence in Leadership Award, the Rush Henrietta
`Outstanding Alumni Award, among others, and has been inducted into RIT’s Innovator Hall of Fame. Professor Smith has
`over 200 publications including technical papers, articles, textbooks, and textbook chapters. He holds 27 patents and has
`licensed his technology both nationally and internationally. Prof. Smith has expertise and is able to serve as an expert
`witness in semiconductor device processes and fabrication, thin films and patterning processes, optic/photonic systems
`technology, and flat panel display technology.
`
`PROFESSIONAL EXPERIENCE
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`EDUCATION
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`Rochester Institute of Technology, Professor, Kate Gleason College of Engineering, 1988-present
`Distinguished Professor, 2019-present
`Director and Professor of Microsystems Engineering Ph.D. Program, 2008-present
`Intel Professor of Research and Technology, Microelectronic Engineering, 2000-2007
`
`Associate Dean of Graduate Programs, Kate Gleason College of Engineering, 2001-2004
`
`Director, Center for Nanolithography Research, 2004-present
`
`Professor, Microelectronic Engineering Department, 1988-present
`
`IMEC Microelectronics Center, Leuven, Belgium, Visiting Researcher, 2008
`Lithographic Technology Corp / Amphibian Systems, President, 1998-2012
`IMEC Microelectronics Center, Leuven, Belgium, Visiting Researcher, 2001
`International SEMATECH, Austin Texas, Visiting Researcher, 1997
`Rutherford Appleton Laboratories, Oxford, U.K., Visiting Scientist, 1995
`Digital Equipment Corp., Hudson, Mass., Advanced Development Center, 1986-1988
`Gould AMI Semiconductor, Santa Clara, Calif., Process Development Group, 1983-1986
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`B.S., M.S. Rochester Institute of Technology, College of Science, Imaging Science, Thesis: “Optically Transparent
`Heat Mirror Thin-Films of ZnS-Ag-ZnS,” 1988.
`Ph.D., Rochester Institute of Technology, Center for Imaging Science, Thesis: “Excimer Laser Semiconductor
`Microlithography at 193nm,” 1994.
`
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`LITIGATION SUPPORT EXPERIENCE
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`Date:
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`Date:
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`2020-
`Case:
`Project:
`Field:
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`2020-
`Case:
`Project:
`Field:
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`Bartlit Beck LLP, Paul Hastings LLP
`3Shape vs. Align Technologies Inc.
`Patent infringement, USDC District of Delaware – Testifying Expert
`Intraoral optical scanner technology
`
`Sidley Austin LLP
`Solaria Corp. vs. Canadian Solar Inc.
`ITC patent infringement case – Testifying Expert
`Solar cell substrate laser processing
`
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`Page 1 of 15
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`Tianma Exhibit 1003
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`2019-
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`2019
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`2019-
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`2018-2019
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`2017-2018
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`2017-
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`2016-2017
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`2016-2018
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`2013-2019
`Case:
`Project:
`Field:
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`2013-2017
`Case:
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`Project:
`Field:
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`2014-2015
`Case:
`Project:
`Field:
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`Fish & Richardson, P.C.
`Samsung Electronics v. Greenthread, LLC
`Inter Partes Review (IPR)
`Semiconductor devices with graded dopant
`
`Fish & Richardson, P.C.
`Hanwha Q CELLS. v. Jinko Solar
`ITC patent infringement case – Testifying Expert
`Photovoltaic solar cell passivation layers
`
`Covington & Burling LLP
`Solas OLED Ltd. v. Samsung Display Co. Ltd. et al
`Patent Infringement (USDC, E. Texas)
`Flat panel display technology
`
`Hoyng ROKH Monegier (and Wilmer Cutler Pickering Hale and Dorr LLP, see below)
`Nikon v. ASML
`Patent dispute (Netherlands, District Court of The Hague)
`Optical-exposure machines for computer chips
`
`O’Melveny & Meyers LLP
`Tessera Entities v. Samsung Electronics Co., Ltd. et al
`ITC patent infringement case – Testifying Expert
`Wafer-level packaging of semiconductor devices
`
`O’Melveny & Meyers LLP
`Elm 3DS Innovations, LLC v. Micron Technologies Inc., et al
`Patent infringement (USDC Delaware) – Testifying Expert
`Three dimensional semiconductor memory structures
`
`Covington & Burling LLP and
`Kellog, Huber, Hansen, Todd, Evans & Figel, PLLC
`MIICS & Partners, America and Goldcharm v. Funai Electric Co. Ltd. and Samsung
`Display Co. Ltd.
`Patent infringement, (USDC Delaware) – Testifying Expert
`TFT/LCD flat panel display technology
`
`Finnegan, Henderson, Farabow, Garrett & Dunner LLP
`Taiwan Semiconductor Manufacturing Ltd. v. Godo Kaisha IP Bridge
`Inter Partes Review (IPR) – Testifying Expert
`Semiconductor processing and metal interconnect structures
`
`Wilmer Cutler Pickering Hale and Dorr LLP
`ASML Holding NV and Carl Zeiss SMT v. Nikon Corp.
`Various including International Centre for Dispute Resolution – Testifying Expert
`Semiconductor lithography equipment and processing
`
`Dentons US LLP (McKenna Long & Aldridge LLP)
`Eidos Display, LLC v. AU Optronics Corp. et al (AU, Chi Mei Innolux, Chunghwa,
`Hannstar, and Hannspree)
`Patent Infringement (USDC, E. Texas) – Testifying Expert
`Thin film transistor (TFT) processing for LCD flat panel devices
`
`Weil, Gotshal & Manges LLP
`DSS Technology Management, Inc. vs. Samsung Electronics Co. Ltd.
`Inter Partes Review (IPR) petition
`Multiple patterning for integrated circuit processing
`
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`2013-2015
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`2013-2014
`Case:
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`Project:
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`2012–2015
`Case:
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`2011 –2012
`Case:
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`Project:
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`2011
`Case:
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`2010-2011
`Case:
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`2011-2014
`Case:
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`2010-2011
`Case:
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`2010
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`2010-2011
`Case
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`2010-2011
`Case:
`Project:
`Field
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`Ropes and Gray LLP
`Spansion LLC v. Macronix America Co., Ltd. et al
`ITC patent infringement case – Testifying Expert
`Flash memory chip method and processes
`
`Mintz, Levin, Cohn, Ferris, Glovsky, and Pepeo PC
`Graphics Properties Holdings, Inc. v. Panasonic Corp. of North America et al (Toshiba,
`Barnes and Noble, Google, Hewlett-Packard, Lenova, and ZTE) – Testifying Expert
`Patent infringement (Delaware Federal District)
`Wide angle LCD display devices and backlighting
`
`Bunsow, DeMory, Smith, & Allison LLP
`NXP B.V. v. Research in Motion Ltd. et. al. (TriQuint, SanDisk, Hynix, and Qualcomm)
`Patent Infringement (USDC, FLA Middle District), IPR (USPTO) – Testifying Expert
`Dummy pattern fill for integrated circuit fabrication
`
`Mintz, Levin, Cohn, Ferris, Glovsky, and Pepeo PC
`Graphics Properties Holdings v. Respondents (RIM, HTC, LG, Apple, Samsung, and
`Sony)
`ITC Patent Infringement – Testifying Expert
`LCD stack configuration for display devices
`
`O’Melveny and Meyers
`Samsung Electronics Co. Ltd. v. AU Optronics Corp. et al (Acer, BenQ, and SANYO)
`ITC Patent infringement
`Flat panel (LCD) display device manufacturing processes
`
`McDermott Will & Emery
`Spansion Inc. v. Samsung Electronics Co
`ITC patent infringement case – Testifying Expert
`Contact hole processes for flash memory chips
`
`Keker and Van Nest LLP
`STC UNM v. Intel Corp.
`Patent infringement (USDC, New Mexico) – Testifying Expert
`Lithography techniques and integrated circuit products
`
`Irell & Manella LLP
`Patent re-examination
`USPTO re-examination and hearing – Testifying Expert
`Flat panel LCD illumination devices
`
`Keker and Van Nest LLP
`STC UNM v. Taiwan Semiconductor Manufacturing Co.
`ITC patent infringement
`Lithography techniques and integrated circuit products
`
`McDermott Will & Emery
`Spansion LLC v. Samsung Electronics Co. (and counter-claim)
`Patent infringement case (USDC, E.D. Va. District) – Testifying Expert
`Flash memory device processes
`
`Irell & Manella LLP
`Chi Mei Innolux v. Sony Corporation
`ITC patent infringement case
`LCD flat panel patterned electrodes
`
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`2010-2011
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`2010
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`2010
`Case:
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`2010
`Case:
`Project:
`Field
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`2009-2011
`Case:
`Project:
`Field:
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`2009-10
`Case:
`Project:
`Field:
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`2009
`Case:
`Project:
`Field:
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`2009
`Case:
`Project:
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`2008
`Case:
`Project:
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`2006 –2012
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`Case:
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`Project:
`Field:
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`2007-08
`Case:
`Project:
`Field:
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`Ropes and Gray LLP
`Samsung Electronics Co. v. Spansion Japan Ltd.
`ITC patent infringement case
`Lithography and etch processing for flash memory products
`
`Sidley Austin LLP
`Agere Systems Inc. and LSI Corp. v. Xilinx, Inc.
`Patent infringement (USDC, S.D. NY)
`Metallization of integrated circuits
`
`McDermott Will & Emery
`Samsung Electronics Co. v. Spansion LLC and Spansion Inc.
`ITC patent infringement case
`Lithography and etch processing for flash memory products
`
`Standley Law Group LLP
`American Panel v. Vertex
`Patent infringement arbitration
`Flat panel display technology
`
`Irell & Manella LLP
`Apeldyn Corp. v. Chi Mei Optoelectronics Corp. et al (AU, Samsung, Sharp, and Sony)
`Patent infringement (USDC, Delaware) – Testifying Expert
`LCD flat panel response time
`
`Fish and Richardson P.C.
`Semiconductor Energy Laboratory Co. Ltd. v. Eastman Kodak
`Patent interference case (USPTO)
`Organic light emitting diode (OLED) display devices
`
`Steptoe and Johnson, LLP
`Qimonda AG v. Seagate Technology
`ITC patent infringement case - Testifying Expert
`Polysilicon and amorphous silicon technology; silicon-oxi-nitride anti-reflection coating
`deposition technology
`
`Fish and Richardson P.C.
`Sharp Corp. v. Samsung Electronics Co. Ltd.
`Patent infringement, (USDC, E.D. TX)
`Liquid crystal display polarizers and electro static discharge (ESD) technology
`
`Steptoe and Johnson, LLP
`Neumark-Rothschild v. Toshiba Corp.
`ITC patent infringement case
`Wide bandgap (II-VI and III-V) semiconductor materials processing for short-
`wavelength LEDs and laser diodes
`
`Wolf Block Schorr and Solis-Cohen, LLP
`Bernstein Litowitz Berger & Grossmann LLP
`Anvik Corp. v. Nikon Corp., et al (Toshiba, Samsung, LG Electronics, Sharp, LG, Chi
`Mei, AU, AFPD, Panasonic, IPS, and Hitachi, )
`Patent infringement (USDC, S.D. NY District) – Testifying Expert
`Lithography method for LCD flat panel manufacturing
`
`Ropes & Gray, LLP
`Akrion Inc., v. Solid State Equipment Corp.
`Patent infringement
`Silicon wafer cleaning and preparation
`
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`Page 4 of 15
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`2007-08
`Case:
`Project:
`Field:
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`2005-06
`Case:
`Project:
`Field:
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`2004-05
`Case:
`Project:
`Field:
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`1997-03
`Case:
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`Field:
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`1997-03
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`Cases:
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`Field:
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`Fish and Richardson P.C.
`Renesas Technology v. Samsung Electronics
`ITC patent infringement case – Testifying Expert
`Thin film and diffractive elements for photomask mask light blocking
`
`Vinson & Elkins, LLP
`Advanced Micro Devices v. Oki Electronics
`Patent infringement (USDC, N. CA District) – Testifying Expert
`Silicon wafer preparation and coating
`
`Irell & Manella, LLP
`Ultratech Stepper, Inc. v. ASM Lithography, Inc.
`Patent infringement (USDC, N. CA District) – Testifying Expert
`Optical microlithography scanning
`
`Ward Norris Heller & Reidy, LLP – Testifying Expert
`IBM Fishkill, NY and Essex, VT, including Union Carbide Corp., Eastman Kodak, J. T.
`Baker Chemical, KTI, Shipley, Ashland Oil, E. I. DuPont de Nemours and Industri-
`Chem, suppliers of solvents for the IBM cleanroom operations
`Multi-state litigation, allegations regarding various chemicals used in the manufacturing
`of semiconductor devices
`
`Ward Norris Heller & Reidy, LLP – Testifying Expert
`Kasowitz Benson Torres & Friedman, LLP
`Steptoe & Johnson, LLP
`San Jose IBM Workers Litigation v. Shipley Company, American Hoechst Corporation,
`Ashland Chemical Company, Union Carbide Corporation, Fischer Scientific Company,
`and Eastman Kodak Company; Rubio v. IBM et al.
`Allegations regarding various chemicals used in an manufacturing of semiconductor
`devices
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`
`
`SERVICE
`
`
`
`Professional Associations
`
`Fellow, IEEE – the Institute of Electrical and Electronics Engineers, for outstanding technical and educational
`contributions in the field of semiconductor microelectronics
`Fellow, OSA – the Optical Society of America, for the advancement of optics and photonics through distinguished
`contributions to education, research, and engineering
`Fellow, SPIE – the Society for Photo-optical Instrumentation Engineering, for distinguished and valuable technical
`achievements in the multidisciplinary fields of optics and photonics
`Senior Member, National Academy of Inventors
`Member, American Vacuum Society (AVS)
`Member, American Society for Engineering Education (ASEE)
`
`
`External Service
`2014-2018 SPIE Microlithography Symposium Co-Chairman
`2012-2014 OSA Awards Committee
`1997-2014 SPIE Optical Microlithography, Program Committee
`2010-2014 EIPBN Program Committee
`2003-2014 SPIE Zernike Award Committee
`2009-2010 Councilor, Optical Society of America (OSA), Rochester Section
`2008-2009 Program Chairman, International Symposium on Immersion Lithography Extensions
`2004-2005 Conference Chairman, SPIE Optical Microlithography Conference
`1997-2002 EIPBN Program Committee
`1997-1998 SPIE/ISMA Singapore Program Committee
`1995-1997 Chairman, OSA Lithography / Patterning Technical Working Group
`1990-1996 Faculty Advisor, SPIE Student Chapter
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`Page 5 of 15
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`

`
`Honors and Awards
`2018
`Inventor of the Year, Rochester Intellectual Property Law Association (RIPLA)
`2017
`American Vacuum Society – Excellence in Leadership Award
`2016
`Fellow, Institute of Electrical and Electronics Engineering (IEEE)
`2014
`IEEE Technology Innovation Award
`2014
`RIT College of Engineering Research and Publication Awards
`2013
`RIT Innovation Hall of Fame
`2012
`Fellow, Optical Society of America
`2011
`SPIE Research Mentor Award
`2008
`Visiting Professor, IMEC Micro and Nanoelectronics Research Center
`2007
`Trustees Excellence in Scholarship and Teaching Award, Rochester Institute of Technology
`2007
`Fellow, SPIE International Society for Optical Engineering
`2007
`Rush Henrietta Outstanding Alumni Award
`2005
`Million Dollar Principle Investigator Award, Rochester Institute of Technology
`2005
`Patenting Productivity Award, Rochester Institute of Technology
`2002
`Intellectual Property Productivity Award, Rochester Institute of Technology
`2001
`Visiting Professor, IMEC Micro and Nanoelectronics Research Center
`2000
`Intel Professor of Research and Technology, Intel Corp.
`1999
`RIT Creators Award, Rochester Institute of Technology
`1997
`Visiting Scholar, International Sematech
`1993
`Texas Instruments, Douglas Harvey Award
`
`
`Editorial Review
`Editorial review of IEEE, JVAC, JM3, and SPIE, journals.
`
`
`
`PATENTS
`
`
`
`1. 8,852,850 Method of photolithography using a fluid and a system thereof
`2. 7,768,648 Method for aberration evaluation in a projection system
`3. 7,345,735 Apparatus for aberration detection and measurement
`4. 7,233,887 Method of photomask correction and its optimization using localized frequency analysis
`5. 7,170,588 Reduction Smith-Talbot interferometer prism for micropatterning
`6. 7,136,143 Method for aberration detection and measurement
`7. 7,092,073 Method of illuminating a photomask using chevron illumination
`8. 6,934,010 Optical proximity correction method utilizing gray bars as sub-resolution assist features
`9. 6,881,523 Optical proximity correction method utilizing ruled ladder bars as sub-resolution assist features
`10. 6,846,595 Method of improving photomask geometry
`11. 6,835,505 Mask for projection photolithography at or below about 160 nm and a method thereof
`12. 6,791,667 Illumination device for projection system and method for fabricating
`13. 6,788,388 Illumination device for projection system and method for fabricating
`14. 6,556,361 Projection imaging system with a non-circular aperture and a method thereof
`15. 6,541,750 Modification of a projection imaging system with a non-circular aperture and a method thereof
`16. 6,525,806 Apparatus and method of image enhancement through spatial filtering
`17. 6,480,263 Apparatus and method for phase shift photomasking
`18. 6,466,304 Illumination device for projection system and method for fabricating
`19. 6,395,433 Photomask for projection lithography at or below about 160 nm and a method thereof
`20. 6,388,736 Imaging method using phase boundary masking with modified illumination
`21. 6,368,755 Masks for use in optical lithography below 180 nm
`22. 6,309,780 Attenuated phase shift mask and a method for making the mask
`23. 5,939,227 Multi-layered attenuated phase shift mask and a method for making the mask
`24. JP2010079303 Method of improving photomask geometry
`25. JP2006079117 Optical proximity correction method utilizing gray bar as sub-resolution assist feature
`26. EP1240557 Imaging method using phase boundary masking with modified illumination
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`Page 6 of 15
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`SELECTED PUBLICATIONS
`
`1. “Lithographic pattern formation in the presence of aberrations in anamorphic optical systems,” ZA Levinson, BW
`Smith, Extreme Ultraviolet (EUV) Lithography XI 11323, 2020.
`2. “EUV mask polarization effects on sub-7nm node imaging,” L Neim, BW Smith, G Fenger, Extreme Ultraviolet
`(EUV) Lithography XI 11323, 2020
`3. “EUV mask polarization effects,” L Neim, BW Smith, International Conference on Extreme Ultraviolet Lithography
`2019 11147, 2019
`4. “Rapid image-based pupil plane characterization for EUV lithography systems,” Z Levinson, E Verduijn, T
`Brunner, O Wood, BW Smith, International Conference on Extreme Ultraviolet Lithography 10809, 2018.
`5. “Image-based pupil plane characterization via a space-domain basis,” Zac Levinson, Andrew Burbine, Erik
`Verduijn, Obert Wood, Kenneth A Goldberg, Markus P Benk, Antoine Wojdyla, Bruce W Smith, Journal of
`Micro/Nanolithography, MEMS, and MOEMS, 16(2) 2017.
`6. “Image-based pupil plane characterization for anamorphic lithography systems,” Zac Levinson, Bruce W Smith,
`SPIE International Society for Optics and Photonics, Extreme Ultraviolet (EUV) Lithography VIII 10143 (2017).
`7. “Measurement of EUV lithography pupil amplitude and phase variation via image-based methodology,” Zachary
`Levinson ; Erik Verduijn ; Obert R. Wood ; Pawitter Mangat ; Kenneth A. Goldberg ; Markus P. Benk ; Antoine
`Wojdyla ; Bruce W. Smith, J. Micro/Nanolith. MEMS MOEMS. 15(2), 023508, 2016.
`8. “Image-based pupil plane characterization via principal component analysis for EUVL tools,” Zac Levinson ;
`Andrew Burbine ; Erik Verduijn ; Obert Wood ; Pawitter Mangat ; Kenneth A. Goldberg ; Markus P. Benk ;
`Antoine Wojdyla ; Bruce W. Smith, Proc. SPIE 9776, Extreme Ultraviolet (EUV) Lithography VII, 977618, 2016.
`9. “3D mask effects of absorber geometry in EUV lithography systems,” Riaz R. Haque ; Zac Levinson ; Bruce W.
`Smith, Proc. SPIE 9776, Extreme Ultraviolet (EUV) Lithography VII, 97760F, 2016.
`10. “An automated image-based tool for pupil plane characterization of EUVL tools,” Zac Levinson ; Jack S. Smith ;
`Germain Fenger ; Bruce W. Smith, Proc. SPIE 9776, Extreme Ultraviolet (EUV) Lithography VII, 97762M, 2016.
`11. “Bayesian inference for OPC modeling,” Andrew Burbine ; John Sturtevant ; David Fryer ; Bruce W. Smith, Proc.
`SPIE 9780, Optical Microlithography XXIX, 97800I, 2016.
`12. “A method of image-based aberration metrology for EUVL tools,” Zac Levinson ; Sudharshanan Raghunathan ;
`Erik Verduijn ; Obert Wood ; Pawitter Mangat ; Kenneth Goldberg ; Markus Benk ; Antoine Wojdyla ; Vicky
`Philipsen ; Eric Hendrickx ; Bruce W. Smith, Proc. SPIE 9422, Extreme Ultraviolet (EUV) Lithography VI, 942215,
`2015.
`13. “Experimental measurements of telecentricity errors in high-numerical-aperture extreme ultraviolet mask images,”
`Sudharshanan Raghunathan, Obert R Wood, Pawitter Mangat, Erik Verduijn, Vicky Philipsen, Eric Hendrickx, Rik
`Jonckheere, Kenneth A Goldberg, Markus P Benk, Patrick Kearney, Zachary Levinson, Bruce W Smith, Journal of
`Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and
`Phenomena, 32, 06F801, 2014.
`14. “The saga of sigma: influences of illumination throughout optical generations,” BW Smith - SPIE Advanced
`Lithography, Proc. SPIE 9052, Optical Microlithography XXVII, 905204, 2014.
`15. “Optical Projection Lithography,” B.W. Smith, Nanolithography: The Art of Fabricating Nanoelectronic and
`Nanophotonic Devices and Systems, Woodhead Publishing, 2014.
`16. “Feasibility of compensating for EUV field edge effects through OPC,” C Maloney, J Word, GL Fenger, A
`Niroomand, BW Smith, SPIE Advanced Lithography, 2014.
`17. “Optimization of image-based aberration metrology for EUV lithography,” Z Levinson, G Fenger, A Burbine, AR
`Schepis, BW Smith, SPIE Advanced Lithography, 2014.
`18. “Study of angular effects for optical systems into the EUV,” A Burbine, Z Levinson, A Schepis, BW Smith, SPIE
`Advanced Lithography, 2014.
`19. “Alternative method for variable aspect ratio vias using a vortex mask,” AR Schepis, Z Levinson, A Burbine, BW
`Smith - SPIE Advanced Lithography, 2014.
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`Page 7 of 15
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`20. "Extreme ultraviolet lithography resist-based aberration metrology," Germain L. Fenger; Lei Sun; Sudharshanan
`Raghunathan; Obert R. Wood; Bruce W. Smith, J. Micro/Nanolith. MEMS MOEMS. 12 (4), 2013.
`21. “The Impact of Pupil Plane Filtering on Mask Roughness Transfer,” Burak Baylav, Chris Maloney, Zac Levinson,
`Joost Bekaert, Alessandro Vaglio Pret, and Bruce W. Smith, J. Vac. Sci. Technol. B 31, 06F801, 2013.
`22. “Modeling the effects of pupil-manipulated spherical aberration in optical nanolithography”, M. K. Sears, B.W.
`Smith, J. Micro/Nanolith. MEMS MOEMS. 12(1), 2013.
`23. “Scanning interference evanescent wave lithography for sub-22-nm generations,” P. Xie, B. W. Smith, J.
`Micro/Nanolithography, MEMS, and MOEMS. 12(1), 2013.
`24. “Lens wavefront compensation for 3D photomask effects in subwavelength optical lithography,” M.K. Sears, J.
`Bekaert, B.W. Smith, Applied Optics 52 (3), 314-322, 2013.
`25. “Line edge roughness (LER) mitigation studies specific to interference-like lithography,: B Baylav, A Estroff, P Xie,
`BW Smith, Proc. SPIE 8683, Optical Microlithography XXVI, 86831Y, 2013
`26. “Pupil wavefront manipulation to compensate for mask topography effects in optical nanolithography,” MK Sears,
`BW Smith, Proc. SPIE 8683, Optical Microlithography XXVI, 86830G, 2013.
`27. “EUVL resist-based aberration metrology,” Germain L. Fenger ; Sudharshanan Raghunathan ; Lei Sun ; Obert R.
`Wood ; Bruce W. Smith, Proc. SPIE 8679, Extreme Ultraviolet (EUV) Lithography IV, 86790P, 2013.
`28. “Tuning Metamaterials for Applications at DUV Wavelengths,” A. Estroff, B.W. Smith, Intl. Journal of Optics,
`2012.
`29. “Aqueous developable dual switching photoresists for nanolithography”, L. Chen, Y.K. Goh, H.H. Cheng, B.W.
`Smith, P. Xie, W. Montgomery, A.K. Whittaker, I. Blakey, Journal of Polymer Science Part A: Polymer Chemistry
`1, 2012.
`30. “The saga of lambda: spectral influences throughout lithography generations,” B.W. Smith, Proc. SPIE 8325, 2012.
`31. “Pupil wavefront manipulation for optical nanolithography,” Monica Kempsell Sears, Joost Bekaert, and Bruce W.
`Smith, Proc. SPIE 8326, 2012.
`32. “Longer wavelength EUV lithography (LW-EUVL),” Christopher W. Maloney and Bruce W. Smith, Proc. SPIE
`8322, 2012.
`33. “Scanning interference evanescent wave lithography for sub-22 nm generations,” Peng Xie and Bruce W. Smith,
`Proc. SPIE 8326, 2012.
`34. “3D mask modeling for EUV lithography,” Julien Mailfert, Christian Zuniga, Vicky Philipsen, Konstantinos Adam,
`Michael Lam, James Word, Eric Hendrickx, Geert Vandenberghe, and Bruce Smith, Proc. SPIE 8322, 2012.
`35. “Aqueous Developable Dual Switching Photoresists for Nanolithography,” Lan Chen, Yong Keng Goh, Han Hao
`Cheng, Bruce W. Smith, Peng Xie, Warren Montgomery, Andrew K. Whittaker, Idriss Blakey, Journal of Polymer
`Science Part A: Polymer Chemistry, 2012.
`36. “Lithography beyond the IC”, B.W. Smith, Proc. SPIE, v 7973-01, 2011.
`37. “PAG-free chain scissioning resists fro 193-nm immersion lithography that can be developed by aqueous base,” I.
`Blakey, L. Chen, Y. K. Goh, A. Dorgelo, P. Xie, N. Lafferty, B. Smith, P. Zimmerman, M.W. Montgomery, A.
`Whittaker, Proc. SPIE, v 7972-86, 2011.
`38. “Development of an inorganic nanoparticle photoresist for EUV, e-beam, and 193-nm lithography,” M. Krysak, M.
`Trikeriotis, E. Schwarz, N. lafferty, P. Xie, B.W. Smith, P. Zimmerman, M.W. Montgomery, E. Giannelis, C. Ober,
`Proc. SPIE v 7972-48, 2011.
`39. “Extending SMO into the pupil plane,” M. Kempsell Sears, B.W. Smith, Proc. SPIE v 7973-46, 2011.
`40. “Projection lithography below lambda/7 through deep-ultraviolet evanescent optical imaging,” P. Xie and B. W.
`Smith, J. Vac. Sci. Technol. B 28, 2010.
`41. “Photo-patternable inorganic hardmask,” Alan Telecky, Peng Xie, Jason Stowers, Andrew Grenville, Bruce Smith,
`and Douglas A. Keszler, J. Vac. Sci. Technol. B 28, 2010.
`42. “Alternatives to Chemical Amplification for 193 nm Lithography,” Baylav, B.; Meng Zhao; Ran Yin; Peng Xie;
`Scholz, C.; Smith, B.; Smith, T.; Zimmerman, P. Source: Proceedings of the SPIE - The International Society for
`Optical Engineering, v 7639, 2010.
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`Page 8 of 15
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`43. “Non-chemically amplified resists for 193-nm immersion lithography: influence of absorbance on performance,”
`Lan Chen; Yong-Keng Goh; Lawrie, K.; Smith, B.; Montgomery, W.; Zimmerman, P.A.; Blakey, I.; Whittaker,
`A.K., Proceedings of the SPIE - The International Society for Optical Engineering, v 7639, 2010
`44. “Metamaterials for enhancement of DUV lithography,” Estroff, A.; Lafferty, N.V.; Peng Xie; Smith, B.W.,
`Proceedings of the SPIE - The International Society for Optical Engineering, v 7640, 2010.
`45. “Achieving Interferometric Double Patterning through Wafer Rotation,” Peng; Lafferty, N.V.; Smith, B.W. ,
`Proceedings of the SPIE - The International Society for Optical Engineering, v 7640, 2010.
`46. “Development of an inorganic photoresist for DUV, EUV, and electron beam imaging,” Trikeriotis, M.; Woo Jin
`Bae; Schwartz, E.; Krysak, M.; Lafferty, N.; Peng Xie; Smith, B.; Zimmerman, P.; Ober, C.K.; Giannelis, E.P.,
`Proceedings of the SPIE - The International Society for Optical Engineering, v 7639, 2010.
`47. “Analysis of higher order pitch division for sub-32 nm lithography,” Peng Xie; Smith, B.W. , Proceedings of the
`SPIE - The International Society for Optical Engineering, v 7274, 2009.
`48. “Alternative optical technologies: more than curiosities?,” Smith, B.W., Proceedings of the SPIE - The International
`Society for Optical Engineering, v 7274, 2009
`49. “Inverse lithography for 45-nm-node contact holes at 1.35 numerical aperture Kempsell, M.L.; Hendrickx, E.;
`Tritchkov, A.; Sakajiri, K.; Yasui, K.; Yoshitake, S.; Granik, Yu.; Vandenberghe, G.; Smith, B.W., Journal of
`Microlithography, Microfabrication, and Microsystems, v 8, n 4, Oct. 2009.
`50. “EUV resist requirements: absorbance and acid yield,” Gronheid, R.; Fonseca, C.; Leeson, M.J.; Adams, J.R.;
`Strahan, J.R.; Willson, C.G.; Smith, B.W., Proceedings of the SPIE - The International Society for Optical
`Engineering, v 7273, 2009
`51. “Design and analysis of a compact EUV interferometric lithography system,” B.W. Smith, J. Micro/Nanolith.
`MEMS MOEMS, Vol. 8, 021207, 2009.
`52. “Enhancement of hyper-NA imaging through selective TM polarization,” B.W. Smith, J. Zhou, P. Xie, J. Vac. Soc.
`B: Microelectronics and Nanometer Structures, Volume 26 (6) 2008.
`53. “Photomask image enhancement using grating generated surface waves,” N. Lafferty, A. Estroff, A. Bourov. B.W.
`Smith, J. Vac. Soc. B: Microelectronics and Nanometer Structures, Volume 26 (6) 2008.
`54. “Applications of TM polarized illumination,” Bruce Smith, Jianming Zhou, and Peng Xie, Proc. SPIE 6924, 2008.
`55. “Quantum state control interference lithography and trim double patterning for 32-16 nm nodes,” Robert D. Frankel,
`Bruce W. Smith, and Andrew Estroff , Proc. SPIE 6520, 2007.
`56. “Snell or Fresnel – The influence of material index on hyper NA lithography,” B. W. Smith, J. Zhou, Proc. SPIE
`6520, 2007.
`57. “Immersion Lithography with Numerical Apertures above 2.0 using High Index Optical Materials," J. Zhou, N.
`Lafferty, B. W. Smith, J. H. Burnett, Proc. SPIE 6520, 2007.
`58. “On the quality of measured optical aberration coefficients using phase wheel monitor,” L. Zavyalova, A. Robinson,
`A. Bourov, N. Lafferty, B. W. Smith, Proc. SPIE 6520, 2007.
`59. “Mask Enhancement Using and Evanescent Wave Effect,” N. Lafferty, J. Zhou, B. W. Smith, Proc. SPIE 6520,
`2007.
`60. “Evanescent wave imaging in optical lithography,” Bruce W Smith, Yongfa Fan, Jianming Zhou, Neal Lafferty,
`Andrew Estroff, Proc. SPIE Optical Microlithography XIX, 6154, 2006.
`61. “Effects of beam pointing instability on two-beam interferometric lithography,” Yongfa Fan, Anatoly Bourov,
`Michael Slocum, Bruce W Smith, Proc. SPIE Optical Microlithography XIX, 6154, 2006.
`62. “Resist process window characterization for the 45-nm node using an interferometric immersion microstepper,”
`Anatoly Bourov, Stewart A Robertson, Bruce W Smith, Michael A Slocum, Emil C Piscani, Proc. SPIE Advances in
`Resist Technology and Processing XXIII, 6153, 2006.
`63. “Comparison of immersion lithography from projection and interferometric exposure tools,” Stewart A Robertson,
`Joanne M Leonard, Bruce W Smith, Anatoly Bourov, Proc. Optical Microlithography XIX, 6154, 2006.
`64. “Three-dimensional imaging of 30-nm nanospheres using immersion interferometric lithography,” Jianming Zhou,
`Yongfa Fan, Bruce W Smith, Proc. Optical Microlithography XIX, 6154, 2006.
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`Page 9 of 15
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`65. “Experimental measurement of photoresist modulation curves, “Anatoly Bourov, Stewart A Robertson, Bruce W
`Smith, Michael Slocum, Emil C Piscani, Proc. Optical Microlithography XIX, 6154, 2006.
`66. “Practical approach to full-field wavefront aberration measurement using phase wheel targets,” Lena V Zavyalova,
`Bruce W Smith, Anatoly Bourov, Gary Zhang, Venugopal Vellanki, Patrick Reynolds, Donis G Flagello, Proc.
`Optical Microlithography XIX, 6154, 2006.
`67. “High NA 193nm Immersion Lithography for 32nm Half-Pitch Imaging’” J. Zhou, Y. Fan, A. Bourov, B.W. Smith,
`Appl. Opt., 2006.
`68. “25nm Immersion Lithography at a 193nm Wavelength,” B. W. Smith, Y. Fan, M. Slocum, L. Zavyalova, , Proc.
`SPIE Optical Microlithography, vol. 5754, 2005.
`69. “Amphibian XIS: An Immersion Lithography Microstepper Platform,” B. W. Smith, A. Bourov, Y. Fan, F.
`Cropanese, Proc. SPIE Optical Microlithography, vol. 5754, 2005.
`70. “ILSim - A compact simulation tool for interferometric lithography,” Y. Fan, A. Bourov, L. Zavyalova, J. Zhou, A.
`Estroff, N. Lafferty, B.W. Smith, , Proc. SPIE Optical Microlithography, vol. 5754, 2005.
`71. “Air bubble-induced light-scattering effect on image quality in 193 nm immersion lithography,” Yongfa Fan, Neal
`Lafferty, Anatoly Bourov, Lena Zavyalova, Bruce W. Smith , Appl. Opt., Vol. 44 Issue 19 , 3904, 2005.
`72. “Photoresist Modulation Curves,” A. Bourov, Y. Fan, F. C. Cropanese, B. W. Smith, Proc. SPIE Optical
`Microlithography, vol. 5754, 2005.
`73. “Automated Aberration Extraction using Phase Wheel Targets,” L. Zavyalova, A. Bourov, B.W. Smith, Proc. SPIE
`Optical Microlithography, vol. 5754, 2005.
`74. “Synthetic defocus in interferometric lithography,” Frank C. Cropanese, Anatoly Bourov, Yongfa Fan, Jianming
`Zhou, Lena Zavyalova, Bruce W. Smith, SPIE Optical Microlithography, vol. 5754, 2005.
`75. “Hyper NA water immersion lithography a