(12) United States Patent
`Kinoshita et al.
`
`(54) BENDABLE DISPLAY APPARATUS AND
`METHOD OF MANUFACTURING THE SAME
`
`(75) Inventors: Masaki Kinoshita, Saku (JP); Kenji
`Kawamata, Kumagaya (JP); Satoru
`Yamanaka, Fukaya (JP); Hiroyuki
`Kurisu, Ageo (JP); Tatsuya Miyazaki,
`Fukaya (JP); Yasushi Kawata, Ageo
`(JP)
`
`(73) Assignee: Toshiba Matsushita Display
`Technology Co., Ltd., Tokyo (JP)
`
`(*) Notice: (cid:9)
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`(21) Appl. No.: 10/807,186
`
`(22) Filed: (cid:9)
`
`Mar. 24, 2004
`
`111111111111111111111111111111111111111111111111111111111111111111111111 II DI IIi
`
`US007148944B2
`
`(10) Patent No.: (cid:9)
`(45) Date of Patent: (cid:9)
`
`US 7,148,944 B2
`Dec. 12, 2006
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`5,396,351 A * (cid:9)
`3/1995 Gessel (cid:9) ........................ 349/159
`6,262,787 B1 * (cid:9)
`7/2001 Kamoi et al .................. 349/96
`6,335,771 B1 * (cid:9)
`1/2002 Hiraishi (cid:9) ....................... 349/42
`6,356,330 B1 * (cid:9)
`3/2002 Ando (cid:9) et al .................. 349/141
`6,473,140 B1 * (cid:9) 10/2002 Mizobata et al . (cid:9)
`............. 349/12
`6,512,504 B1 * (cid:9)
`1/2003 Yamauchi et al . (cid:9)
`............ 345/87
`6,812,974 B1 * (cid:9) 11/2004 Hinata et al . (cid:9)
`................. 349/12
`FOREIGN PATENT DOCUMENTS
`0 342 925 A2
`11/1989
`51-83496
`7/1976
`53-93858
`8/1978
`58-114085
`7/1983
`60-188929
`9/1985
`60-247618
`12/1985
`2-264217
`10/1990
`4-235527
`8/1992
`5-61011
`3/1993
`6-67135
`3/1994
`6-194615
`7/1994
`6-230356
`8/1994
`8-50282
`2/1996
`9-160052
`6/1997
`2678325
`8/1997
`(Continued)
`
`EP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`JP
`
`Primary Examiner (cid:9) Andrew Schechter
`Assistant Examiner (cid:9) Richard Kim
`(74) Attorney, Agent, or Firm Oblon, Spivak, McClelland,
`Maier & Neustadt, P.C.
`
`(57)
`
`ABSTRACT
`
`A display apparatus with a plurality of display pixel sections
`includes glass substrate, which are formed to have a thick-
`ness that permits bending of the display apparatus, and
`polarizer plates, which are disposed on the glass substrates,
`respectively. The polarizer plates are thicker than the glass
`substrates.
`
`12 Claims, 14 Drawing Sheets
`
`(cid:9) (cid:9) 349/158
`
`(65) (cid:9)
`
`Prior Publication Data
`
`Sep. 16, 2004
`US 2004/0179165 Al (cid:9)
`Related U.S. Application Data
`
`(63) Continuation of application No. PCT/7P03/06071,
`filed on May 15, 2003.
`
`(30) (cid:9)
`
`Foreign Application Priority Data
`
`May 17, 2002
`May 17, 2002
`May 17, 2002
`May 13, 2003
`
`(JP) (cid:9)
`(JP) (cid:9)
`(JP) (cid:9)
`(JP) (cid:9)
`
`............................. 2002 -143812
`............................. 2002 -143813
`............................. 2002 -143814
`............................. 2003 -134349
`
`(51) Int. Cl.
`(2006.01)
`G02F 1/1333 (cid:9)
`(52) U.S. Cl .......................................................
`(58) Field of Classification Search ................ 349/158,
`349/96
`See application file for complete search history.
`
`110 (cid:9)
`
`102
`
`Ki
`
`800
`
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`

`US 7,148,944 B2
`Page 2
`
`FOREIGN PATENT DOCUMENTS
`
`JP
`JP
`JP
`JP
`
`10-48663 (cid:9)
`11-38395 (cid:9)
`11-174463 (cid:9)
`3059866 (cid:9)
`
`2/1998
`2/1999
`7/1999
`4/2000
`
`JP (cid:9)
`KR (cid:9)
`KR (cid:9)
`
`2001-202028 (cid:9)
`1998-020094 (cid:9)
`2002-0001638 (cid:9)
`
`7/2001
`6/1998
`1/2002
`
`* cited by examiner
`
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`(cid:9)
`(cid:9)
`(cid:9)
`

`

`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 1 of 14 (cid:9)
`
`US 7,148,944 B2
`
`PX
`
`Y
`
`-- -- 251
`~~
`--------------------- ----- ------ --~,- -
`
`'~ (cid:9) `• (cid:9)
`
`
`
`N ____ 500
`
`950
`
`"' (cid:9)
`
`-
`
`~' (cid:9)
`
`403
`
`403
`
`--'
`~. (cid:9)
`
`- (cid:9)
`
`'yam
`
`12
`
`- (cid:9)
`
`-- 403
`
`1R 15
`
`107
`
`FIG.1
`
`403 (cid:9)
`
`I (cid:9)
`
`I
`
`Page 3
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`

`M
`
`U-
`
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`

`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 4 of 14
`
`US 7,148,944 B2
`
`18 (cid:9)
`
`403 (cid:9)
`
`12
`
`i
`
`10
`
`106
`
`106
`
`F I G . 5 (cid:9)
`
`16 (cid:9)
`
`106 (cid:9)
`
`14 (cid:9)
`
`15
`
`12 (cid:9)
`
`403 (cid:9)
`
`410
`
`107 (cid:9)
`
`F I G. 6A (cid:9)
`
`116 (cid:9)
`
`14 (cid:9)
`
`,o
`
`12 (cid:9)
`
`403
`
`FIG.6B
`
`107
`
`16 106
`
`201
`
`12
`
`410
`
`14 (cid:9)
`
`403
`
`FIG.6C 107 16 106
`
`201
`
`14 410 240 241
`
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`

`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 5 of 14 (cid:9)
`
`US 7,148,944 B2
`
`401
`
`"' (cid:9)
`
`' ~' (cid:9)
`
`201 (cid:9)
`FIG. 7A
`
`240
`
`107 (cid:9)
`
`106 410 403 401 223 205 106
`
`A/ (cid:9)
`16 (cid:9)
`
`Y AV
`/ (cid:9)
`l (cid:9)
`)
`I (cid:9)
`14 (cid:9)
`241 (cid:9)
`240
`201 (cid:9)
`FIG. 7B
`
`
`
`n~ 223 205 AnV A1n Am
`
`106
`
`FIG. 7C
`
`Page 7
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`(cid:9)
`

`

`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 6 of 14 (cid:9)
`
`US 7,148,944 B2
`
`-- (cid:9)
`
`401 (cid:9)
`
`AM (cid:9)
`
`.....
`
`14 (cid:9)
`F I G. 8A
`
`201
`
`Ann (cid:9)
`
`4n7
`
`106
`
`LU I (cid:9)
`F I G. 8B
`
`14 (cid:9)
`
`220
`
`Page 8
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`U.S. Patent
`
`v
`
`9
`
`N
`
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`

`U.S. Patent
`
`Dec. 12, 2006
`
`Sheet 8 of 14
`
`US 7,148,944 B2
`
`O O_
`
`ti O
`
`O O
`
`(V O
`
`LL
`
`O
`
`M
`O c O O CV
`
`Page 10
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`

`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 9 of 14 (cid:9)
`
`US 7,148,944 B2
`
`1107A
`
`.1105A (cid:9)
`
`1101 (cid:9)
`
`X electrode
`
`1103
`
`1107B
`
`a)
`O
`
`a)
`
`N
`
`1105B't
`
`X electrode
`
`FIG. 11
`
`Input circuit (cid:9)
`
`I-1109
`
`1121 (cid:9)
`
`1131
`
`1105B ~ (cid:9)
`
`1111 1103A (cid:9)
`
`~~
`
`1107B
`
`1123
`
`
`
`1131
`
`1105A
`
`FIG. ~ Z (cid:9)
`
`1113
`1107A" 1131 (cid:9)
`
`y (cid:9)
`
`X
`
`1121
`
`1107A
`1111-
`
`1123
`
`07B
`
`1113
`
`1103A (cid:9)
`
`1103B
`
`FIG. 13
`
`Page 11
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`(cid:9)
`(cid:9)
`(cid:9)
`

`

`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 10 of 14 (cid:9)
`
`US 7,148,944 B2
`
`x
`0
`
`MA
`
`J
`
`M4
`
`U
`
`Page 12
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`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 12 of 14 (cid:9)
`
`US 7,148,944 B2
`
`N
`
`N`
`
`J
`L
`
`Page 14
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`

`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 13 of 14 (cid:9)
`
`US 7,148,944 B2
`
`N
`
`0
`
`W
`LL
`
`J
`L
`
`Y-
`
`C')
`
`
`
`Page 15
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`U.S. Patent (cid:9)
`
`Dec. 12, 2006 (cid:9)
`
`Sheet 14 of 14 (cid:9)
`
`US 7,148,944 B2
`
`z (cid:9)
`° (cid:9)
`_J m (cid:9)
`a.
`Cl)
`
`w
`
`Q ~ 0 -i
`
`w LL
`
`a,
`
`LL
`
`I
`Cl,
`
`cO
`
`N N
`
`Page 16
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`

`

`US 7,148,944 B2
`
`1
`BENDABLE DISPLAY APPARATUS AND
`METHOD OF MANUFACTURING THE SAME
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`
`This is a Continuation Application of PCT Application
`No. PCT/JP03/06071, filed May 15, 2003, which was not
`published under PCT Article 21 (2) in English.
`This application is based upon and claims the benefit of io
`priority from prior Japanese Patent Applications No. 2002-
`143812, filed May 17, 2002; No. 2002-143813, filed May
`17, 2002; No. 2002-143814, filed May 17, 2002; and No.
`2003-134349, filed May 13, 2003, the entire contents of all
`of which are incorporated herein by reference. (cid:9)
`
`15
`
`BACKGROUND OF THE INVENTION
`
`30
`
`40
`
`1. Field of the Invention
`The present invention relates to a display apparatus and a 20
`manufacturing method thereof, and, more particularly, to a
`structure of a display apparatus that can achieve reduction in
`thickness.
`2. Description of the Related Art
`Flat panel display apparatuses represented by a liquid 25
`crystal display apparatus are applied to various fields, taking
`advantage of such features as light weight, thin shape and
`low power consumption. In particular, a liquid crystal dis-
`play apparatus is widely applied to mobile information
`apparatuses represented by personal computers. (cid:9)
`In recent years, there is a demand for further reduction in
`thickness of the liquid crystal display apparatus. To meet the
`demand, there is an idea that a thin glass substrate is used.
`However, fabrication with use of a glass substrate that has a
`thickness of less than 0.5 mm may lead to a decrease in 35
`manufacturing yield, since conveyance, etc. thereof is dif-
`ficult because of a problem of bending due to its own weight.
`A display apparatus formed with such a substrate may easily
`suffer crack or chip at its end part due to weak shock, and
`moreover the entirety of the apparatus may be broken. There
`is an alternative idea that a resin film, for instance, is used
`in place of the glass substrate. This, however, is not practical
`since constraints such as film formation temperatures are
`imposed
`On the other hand, a manufacturing method has been
`proposed, wherein the outer surface of one of substrates that
`are components of the liquid crystal apparatus is thinned by
`etching (see, e.g. Japanese Patent No. 2678325). According
`to this manufacturing method, one of the substrates is
`thinned to about 0.1 to 0.2 mm by etching, while the other
`substrate is about 0.3 to 1.1 mm thick and has a high strength
`as the substrate. Moreover, a sufficient strength of the liquid
`crystal display apparatus is achieved.
`The liquid crystal display apparatus fabricated by this
`manufacturing method, however, still fails to realize the
`reduction in thickness and weight that is required in the
`market. With this manufacturing method, it is not possible to
`manufacture a liquid crystal display apparatus that is flexible
`while maintaining display performance.
`
`2
`is to provide a display apparatus and a manufacturing
`method thereof, which can achieve further reduction in
`thickness while having high durability.
`In order to solve the problem and achieve the object, a first
`aspect of the invention provides a display apparatus having
`an optical material between a pair of substrates, and having
`a plurality of display pixel sections,
`wherein each of the substrates has a glass substrate and a
`film that is attached to an outer surface of the glass substrate
`and has a thickness greater than a thickness of the glass
`substrate,
`at least one of the films is formed of a polarizer plate, and
`each of the glass substrate is formed to have a thickness
`that permits bending of the display apparatus.
`A second aspect of the invention provides a display
`apparatus having a plurality of display pixel sections on one
`of major surfaces of a substrate,
`wherein the substrate has a glass substrate and a polarizer
`plate that is disposed to extend to an end part of the glass
`substrate on the other major surface of the substrate, and has
`a thickness greater than a thickness of the glass substrate,
`and
`the glass substrate is formed to have a thickness that
`permits bending of the display apparatus.
`A third aspect of the invention provides a method of
`manufacturing a display apparatus having an optical mate-
`rial between a pair of glass substrates comprising:
`(a) a step of attaching the pair of glass substrates together
`with a predetermined distance;
`(b) polishing an outer surface of each of the glass sub-
`strates to a thickness of 0.15 mm or less;
`(c) attaching a film to the outer surface of at least one of
`the glass substrates, the film having a thickness greater than
`a thickness of the glass substrate; and
`(d) cutting the film and the pair of glass substrates into a
`predetermined size.
`
`BRIEF DESCRIPTION OF THE SEVERAL
`VIEWS OF THE DRAWING
`
`FIG. 1 schematically shows the structure of a liquid
`crystal display apparatus according to an embodiment of the
`present invention;
`FIG. 2 is a cross-sectional view schematically showing an
`45 example of the structure of a light-transmission type liquid
`crystal panel that is applicable to a liquid crystal display
`apparatus according to a first embodiment of the invention;
`FIG. 3 is a cross-sectional view schematically showing an
`example of the structure of a light-reflection type liquid
`50 crystal panel that is applicable to a liquid crystal display
`apparatus according to a second embodiment of the inven-
`tion;
`FIG. 4 is a view for explaining a manufacturing method
`of a liquid crystal display panel according to an embodi-
`55 ment-of the invention;
`FIG. 5 is a view for explaining a manufacturing method
`of a liquid crystal display panel according to an embodiment
`of the invention;
`FIG. 6A to FIG. 6C are views illustrating the manufac-
`60 turing method of the liquid crystal display panel according
`to the embodiment of the invention;
`FIG. 7A to FIG. 7C are views illustrating the manufac-
`turing method of the liquid crystal display panel according
`to the embodiment of the invention;
`FIG. 8A and FIG. 8B are views illustrating the manufac-
`turing method of the liquid crystal display panel according
`to the embodiment of the invention;
`
`65 (cid:9)
`
`BRIEF SUMMARY OF THE INVENTION
`
`The present invention has been made in order to solve the
`above problems, and its object is to provide a display
`apparatus and a manufacturing method thereof, which can
`achieve further reduction in thickness while maintaining
`display performance. In addition, the object of the invention
`
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`US 7,148,944 B2
`
`3
`FIG. 9 is a cross-sectional view schematically showing an
`example of the structure of a light-transmission type liquid
`crystal panel that is applicable to a liquid crystal display
`apparatus according to a third embodiment of the invention;
`FIG. 10 is a cross-sectional view schematically showing
`an example of the structure of a light-reflection type liquid
`crystal panel that is applicable to a liquid crystal display
`apparatus according to a fourth embodiment of the inven-
`tion;
`FIG. 11 is a block diagram schematically showing the
`structure of a touch panel that is mountable on the liquid
`crystal display apparatuses according to the third and fourth
`embodiments;
`FIG. 12 is a perspective view schematically showing an
`example of the structure of the touch panel shown in FIG.
`11;
`FIG. 13 is a view for explaining a touch operation on the
`touch panel shown in FIG. 12;
`FIG. 14 shows an equivalent circuit associated with the
`touch operation on the touch panel shown in FIG. 13;
`FIG. 15 is a cross-sectional view schematically showing
`an example of the structure of a light-transmission type
`liquid crystal panel that is applicable to a liquid crystal
`display apparatus according to a fifth embodiment of the
`invention;
`FIG. 16 is a view schematically showing the structure of
`an organic EL display apparatus according to an embodi-
`ment of the present invention;
`FIG. 17 is a cross-sectional view schematically showing
`a first example of the structure of an organic EL display
`apparatus according to a sixth embodiment of the invention;
`FIG. 18 is a cross-sectional view schematically showing
`a second example of the structure of the organic EL display
`apparatus according to the sixth embodiment of the inven-
`tion; and
`FIG. 19 is a cross-sectional view schematically showing
`a third example of the structure of the organic EL display
`apparatus according to the sixth embodiment of the inven-
`tion.
`
`DETAILED DESCRIPTION OF THE
`INVENTION
`
`Display apparatuses according to embodiments of the
`present invention will now be described with reference to
`the accompanying drawings.
`
`(First Embodiment)
`As is shown in FIG. 1 and FIG. 2, a display apparatus
`according to a first embodiment, that is, a liquid crystal
`display apparatus 1, comprises a light-transmission type
`liquid crystal panel 100, a drive circuit board 500 that
`supplies drive signals to the liquid crystal panel 100, and a
`backlight unit 800 that illuminates the liquid crystal panel
`100 from its back side. The liquid crystal panel 100 and
`drive circuit board 500 are electrically connected by a
`flexible wiring board 950. The flexible wiring board 950 is
`electrically connected to the liquid crystal panel 100 and
`drive circuit board 500 by, e.g. an anisotropic conductive
`film (ACF) 951.
`The liquid crystal panel 100 has an effective display
`region 102 with a diagonal size of 12.1 inches. The effective
`display region 102 includes a plurality of display pixel
`sections PX arranged in a matrix. The liquid crystal panel
`100 includes an array substrate 200, a counter substrate 400,
`and a liquid crystal layer 410 that is held between the array
`substrate 200 and counter substrate 400, with alignment
`
`4
`films 219 and 405 interposed, respectively. This liquid
`crystal panel 100 suitably adopts a display mode in which
`display is not greatly affected by a variation in cell gap, for
`example, a twisted nematic (TN) display mode or an IPS (In
`5 Plane Switching) display mode. This embodiment adopts a
`TN display mode in which liquid crystal molecules provided
`between substrates are aligned with 900 twist.
`In order to achieve further reduction in thickness, the
`10 array substrate 200 includes a light-transmissive insulation
`substrate 201 that is formed of glass with a thickness of 0.15
`mm or less, preferably 0.1 mm or less (with a thickness of
`0.1 mm in the first embodiment). The insulation substrate
`201 includes, on one of its major surfaces (i.e. front surface),
`15 a plurality of signal lines X and a plurality of scan lines Y
`arranged in a matrix, switch elements 211 disposed near
`intersections of the signal lines X and scan lines Y, and pixel
`electrodes 213 connected to the switch elements 211.
`The switch element 211 comprises a thin film transistor
`20 (TFT). The switch element 211 includes a polysilicon (p-Si)
`film as an active layer. The p-Si film includes a channel
`region 212c, and a source region 212s and a drain region
`212d that sandwich the channel region 212c.
`A gate electrode 215 of the switch element 211 is formed
`25 of, e.g. an MoW (molybdenum-tungsten) alloy film that is
`integral with the scan line Y, and it is connected to the scan
`line Y. The gate electrode 215 is located just above the
`channel region 212c of the p-Si film and is disposed on a
`gate insulation film 214 that is formed of, e.g. a TEOS (tetra
`30 ethoxy silane) film.
`A source electrode 216s of the switch element 211 is
`formed of, e.g. an A1Nd (aluminum-neogymium) alloy film.
`The source electrode 216s is connected to the source region
`212s of the p-Si film and to the pixel electrode 213. A drain
`3s electrode 216d of the switch element 211 is formed of, e.g.
`an A1Nd (aluminum-neogymium) alloy film, which is inte-
`gral with the signal line X. The drain electrode 216d is
`connected to the drain region 212d of the p-Si film and to the
`signal line X.
`The switch element 211 with the above structure is
`covered with an interlayer insulation film 217 that is formed
`of an oxide film such as Si02, or a nitride film such as SiNx.
`The interlayer insulation film 217 is covered with a color
`45 filter layer CF that is formed of a color resist layer, which is
`processed to have a predetermined pattern by a photo-
`lithography process. In the first embodiment, the interlayer
`insulation film 217 is formed of, e.g. silicon nitride. The
`color filter layer CF is formed of a negative type color resist
`layer, which is colored with, e.g. red, green or blue. Color
`filter layers with the respective colors are disposed on the
`associated display pixel sections PX of the corresponding
`colors.
`The pixel electrode 213 is formed of a light-transmissive
`55 conductive material such as ITO (indium tin oxide) or IZO
`(indium zinc oxide). The pixel electrode 213 is disposed on
`the color filter layer CF. The alignment film 219 is disposed
`over the entire effective display region 102 so as to cover all
`pixel electrodes 213.
`The counter substrate 400 includes a light-transmissive
`insulation substrate 401 that is formed of glass with a
`thickness of 0.15 mm or less, preferably 0.1 mm or less (with
`a thickness of 0.1 mm in the first embodiment). The insu-
`lation substrate 401 includes, on one of its major surfaces
`65 (i.e. front surface), a counter electrode 403 that is disposed
`to face the pixel electrode 213. The counter electrode 403 is
`formed of a light-transmissive conductive material such as
`
`40
`
`50
`
`60 (cid:9)
`
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`
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`TIANMA MICROELECTRONICS
`CO. LTD. v. JDI/PLD
`IPR2021-01028
`
`

`

`US 7,148,944 B2
`
`5
`ITO. The alignment film 405 is disposed over the entire
`effective display region 102 so as to cover all counter
`electrodes 403.
`A columnar spacer 104 for providing a predetermined gap
`between the array substrate 200 and counter substrate 400 is 5
`disposed within the effective display region 102. The colum-
`nar spacer 104 is fixed to one of the substrates. For example,
`the columnar spacer 104 is formed of a black resin disposed
`on the array substrate 200, and is fixed to the array substrate
`200. A light-shield layer 250 is formed in a frame-like shape io
`on the outside of the effective display region 102. The
`light-shield layer 250 is formed of a resin having light-
`shielding properties. For example, the light-shield layer 250
`is formed of the same black resin as the columnar spacer
`104. The array substrate 200 and counter substrate 400 are 15
`attached to each other by a seal material 106, with a
`predetermined gap of, e.g. 4 µm, being maintained by the
`columnar spacer 104.
`A drive circuit section 110 that is formed integral with the
`array substrate 200 is disposed on a peripheral region of the 20
`effective display region 102. Specifically, the drive circuit
`section 110 includes a scan line drive circuit 251 and a signal
`line drive circuit 261. The scan line drive circuit 251 is
`connected to one end of each scan line Y and supplies a scan
`pulse to an associated scan line Y. The signal line drive 25
`circuit 261 is connected to one end of each signal line X and
`supplies a video signal to an associated signal line X. The
`scan line drive circuit 251 and signal line drive circuit 261,
`like the switch element 211 within the effective display
`region 102, are formed of thin-film transistors including 30
`polysilicon films.
`The liquid crystal panel 100 includes a pair of polarizer
`plates 220 and 407 that are arranged on an outer surface of
`the array substrate 200 and an outer surface of the counter
`substrate 400, respectively. The directions of polarization of 35
`the polarizer plates 220 and 407 are set in accordance with
`characteristics of the liquid crystal layer 410. Specifically,
`the polarizer plate 220 is attached to the other major surface
`(back surface) of the insulation substrate 201 of array
`substrate 200 by an adhesive 221. The polarizer plate 407 is 40
`attached to the other major surface (back surface) of the
`insulation substrate 401 of counter substrate 400 by an
`adhesive 406.
`The polarizer plates 220 and 407 are formed of a resin
`with flexibility. Specifically, the polarizer plates 220 and 407 45
`are formed such that a resin layer in which iodine is aligned
`is interposed between TAC films. Each of the polarizer
`plates 220 and 407 is sufficiently extended to the end part of
`the insulation substrate. In other words, the polarizer plate
`220 has a dimension that is equal to or greater than the 50
`dimension of the array substrate 200, and the polarizer plate
`407 has a dimension that is equal to or greater than the
`dimension of the counter substrate 400. In the first embodi-
`ment, the end of the insulation substrate is made to corre-
`spond to the end of the polarizer plate. Alternatively, the end 55
`of the polarizer plate may extend beyond the end of the
`insulation substrate so as to cover the corner of the insulation
`substrate. Each of the polarizer plates 220 and 407 is thicker
`than each of the insulation substrates 201 and 401, and it has
`a thickness of, e.g. 0.3 mm. (cid:9)
`In order to reduce the thickness of the liquid crystal panel
`100, each of the insulation substrates 201 and 401 is
`extremely thinned to, e.g. about 0.1 mm. Even in this case,
`the provision of the polarizer plates 220 and 407 can
`reinforce the insulation substrates 201 and 401. Thereby, 65
`even if a bending stress is applied to the liquid crystal panel
`100, crack of the insulation substrate 201, 401 can be
`
`60
`
`prevented, and a liquid crystal display apparatus with flex-
`ibility, which is not easily broken, can be provided. In
`particular, since the polarizer plates are fully extended to the
`ends of the insulation substrates, the occurrence of crack and
`chip in the insulation substrates can remarkably be reduced.
`It was found that even where the liquid crystal panel 100
`with the above-described structure was bent with a radius of
`curvature of 200 mm or less, and further with a radius of
`curvature of 150 mm, no damage occurred and the display
`quality was maintained.
`A method of manufacturing the light-transmission type
`liquid crystal panel in the liquid crystal display apparatus
`with the above-described structure will now be described.
`As is shown in FIG. 4 and FIG. 5, a first glass substrate
`10 and a second glass substrate 12, each having a thickness
`of about 0.7 mm and formed of non-alkali glass, are pre-
`pared. In the manufacturing method to be described below,
`bending of the substrates in a conveyance step, for instance,
`is taken into account, and the glass substrates each with a
`thickness of 0.7 mm are prepared. Alternatively, relatively
`thin glass substrates each with a thickness of, e.g. 0.5 mm
`may be employed to shorten the time for polishing the
`substrates in a subsequent step. The first glass substrate 10
`and second glass substrate 12 are formed in a rectangular
`shape with such a size that four liquid crystal panels, for
`instance, can be assigned.
`A display device circuit section 14 including a switch
`element formed by using a polysilicon film as an active
`layer, a pixel electrode, a color filter, etc. is formed in each
`of four display regions 15 provided on the first glass
`substrate 10. For example, the polysilicon (p-Si) film is
`formed in the following manner. To begin with, an amor-
`phous (a-Si) film is formed by CVD, for instance. An
`excimer laser beam, for example, is applied to the a-Si film,
`thus causing crystal growth. Then, impurities, as desired, are
`doped. The doped impurities are activated at about 600° C.
`Thus, a polysilicon film is formed. Since the glass substrate
`is used, a high-temperature process of 450° C. or more can
`be employed. A connection electrode section 16 for wiring
`inside and outside the liquid crystal panel is formed on the
`peripheral region of each display region 15. Further, the
`drive circuit section is formed on the peripheral region.
`Subsequently, a seal material 106 is coated in a frame-like
`shape around each display region 15. Further, a dummy seal
`107 is coated along an entire peripheral portion on the first
`glass substrate 10. The seal material 106 and dummy seal
`107 are formed of an adhesive such as a thermosetting
`adhesive or a light (UV) curing adhesive. In this example,
`the seal material 106 and dummy seal 107 are applied by a
`dispenser using, e.g. an epoxy adhesive. The connection
`electrode section 16 extends to the outside of the seal
`material 106.
`On the other hand, the counter electrode 403 of ITO, etc.
`are formed at four areas on the second glass substrate 12,
`which correspond to the display regions.
`A predetermined amount of liquid crystal material 18 is
`dropped on each region surrounded by each seal material
`106 on the first glass substrate 10. Then, the first glass
`substrate 10 and second glass substrate 12 are positioned
`such that each display region 15 on the first glass substrate
`10 faces the associated counter electrode 403 on the second
`glass substrate 12.
`Thereafter, as shown in FIG. 6A, the first glass substrate
`10 and second glass substrate 12 are pressed under a
`predetermined pressure in directions toward each other.
`Thus, the first glass substrate 10 and second glass substrate
`12 are attached by the seal material 106 and dummy seal
`
`Page 19
`
`JDI/PLD - EX. 2008
`TIANMA MICROELECTRONICS
`CO. LTD. v. JDI/PLD
`IPR2021-01028
`
`

`

`US 7,148,944 B2
`
`8
`7
`107. Then, the seal material 106 and dummy seal 107 are (cid:9)
`polarizer plate 407 with a thickness of about 0.3 mm is
`cured and the first glass substrate 10 and second glass (cid:9)
`attached to the outer surface of the glass substrate 401 via an
`substrate 12 are attached to each other. (cid:9)
`adhesive 406.
`Through the above-described steps, the light-transmission
`Then, the outer surfaces of the first glass substrate 10 and
`type liquid crystal panel is completed.
`second glass substrate 12 are polished and thinned. In this 5
`embodiment, as shown in FIG. 6B, the first glass substrate
`In the above-described method of manufacturing the
`10, on which the display device circuit section 14 is pro- (cid:9)
`liquid crystal panel, the liquid crystal material is dropped
`vided, is first polished. The polishing was carried out by (cid:9)
`onto one of the substrates that are to be attached together,
`chemical etching using a hydrofluoric-acid-based etchant. (cid:9)
`and thus the liquid crystal layer 410 is formed. Thereby, the
`While the first glass substrate 10 is being polished, the io manufacturing time can be decreased. Alternatively, after an
`second glass substrate 12 is protected by a sheet having (cid:9)
`empty liquid crystal cell is formed, and a liquid material may
`resistance to chemicals. The polishing may be carried out by (cid:9)
`vacuum-injected in the liquid crystal cell.
`mechanical polishing or chemical mechanical polishing
`Specifically, necessary structural components are formed
`(CMP). (cid:9)
`on the first glass substrate 10 and second glass substrate 20
`The first glass substrate 10 is polished into a glass 15 by the same steps as described above. Then, the seal material
`substrate 201 with a thickness of about 0.1 mm. In consid- (cid:9)
`106 and dummy seal 107 are coated and the first glass
`eration of conditions such-as flexibility, polishing precision, (cid:9)
`substrate 10 and second glass substrate 12 are attached
`mechanical strength and internal stress in formation of
`together. When the seal material 106 is coated, an inlet for
`display device circuits, it is desirable that the thickness of
`injecting a liquid crystal material in a later step is formed.
`the glass substrate 201 be set at about 0.15 mm or less, and 20 (cid:9)
`Then, the outer surfaces of the first glass substrate 10 and
`preferably 0.1 mm or less. If the glass substrate has a (cid:9)
`second glass substrate 12 are polished and thinned, and the
`thickness greater than 0.15 mm, flexibility of the glass (cid:9)
`reinforcement plates 240 and 205 are attached to the outer
`substrate against bending would be lost. On the other hand, (cid:9)
`surfaces of the glass substrates 201 and 401 via adhesive
`if the glass substrate is extremely thinned, entrance of
`layers 241 and 223. The glass substrates 201 and 401 and
`moisture cannot be prevented and the reliability of the liquid 25 reinforcement plates 240 and 205 are cut along at predeter-
`crystal panel will deteriorate. Therefore, it is desirable that (cid:9)
`mined positions into four sections each forming a liquid
`the thickness of the glass substrate 201 be about 0.01 mm or (cid:9)
`crystal panel.
`more. (cid:9)
`The reinforcement plate 240 and adhesive layer 241 that
`Subsequently, as shown in FIG. 6C, a reinforcement plate (cid:9)
`are attached to the glass substrate 201 of each cut-out liquid
`240 that is about 0.1 mm thick is attached to the outer 30 crystal panel are removed by etching or the like. In addition,
`surface of the polished glass substrate 201 via an adhesive (cid:9)
`the reinforcement p