US00840
`
`1219B2
`
`(12) United States Patent
`US 8,401,219 B2
`(10) Patent No.:
`Mar. 19, 2013
`(45) Date of Patent:
`Hankey et al.
`
`(54) HEADSET CONNECTOR
`
`(75)
`
`Inventors: M. Evans Hankey, San Francisco, CA
`(US); Emery Sanford, San Francisco,
`CA (US); Christopher D Prest,
`Mountain View, CA (US); Way Chet
`Lim, San Jose, CA (US)
`
`(73) Assignee: Apple Inc., Cupertino, CA (US)
`
`( * ) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 1455 days.
`
`(21) Appl.No.: 11/824,444
`
`(22)
`
`Filed:
`
`Jun. 28, 2007
`
`(65)
`
`Prior Publication Data
`
`US 2008/0165982 A1
`
`Jul. 10, 2008
`
`Related US. Application Data
`
`(60) Provisional application No. 60/879,177, filed on Jan.
`6, 2007, provisional application No. 60/879,195, filed
`on Jan. 6, 2007.
`
`(51)
`
`Int. Cl.
`(2006.01)
`H04R 25/00
`(52) US. Cl.
`....................................................... 381/384
`(58) Field of Classification Search .................. 381/381,
`381/74, 3707371, 374, 376, 3787380, 382,
`381/384
`
`See application file for complete search history.
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`6,464,509 B1
`7,094,086 B2
`7,311,526 B2
`7,351,066 B2
`7,496,671 B2
`7,517,222 B2
`
`10/2002 Emberty et a1.
`8/2006 Teicher
`12/2007 Rohrbach et a1.
`4/2008 DiFonzo et a1.
`2/2009 Engel et a1.
`4/2009 Rohrbach et a1.
`
`7,589,536 B2
`7,641,477 B2
`7,645,143 B2
`2004/0023560 A1
`2004/0209489 A1
`2005/0239261 A1
`2008/0024470 A1
`2008/0084404 A1
`2008/0163663 A1
`2008/0164770 A1
`2008/0164825 A1
`2008/0164934 A1
`2008/0166001 A1
`2008/0166004 A1
`2008/0166005 A1
`2008/0166006 A1
`2008/0166007 A1
`2008/0166907 A1
`2008/0166968 A1
`2008/0167088 A1
`2008/0319562 A1
`2009/0267613 A1
`
`9/2009 Terlizzi et a1.
`1/2010 DiFonzo et a1.
`1/2010 Rohrbach et a1.
`2/2004 Swoboda
`10/2004 Clapper
`10/2005 Tai et a1.
`1/2008 Andre et a1.
`4/2008 Andre et a1.
`7/2008 Hankey et a1.
`7/2008 Terlizzi
`7/2008 Terlizzi et a1.
`7/2008 Hankey et a1.
`7/2008 Hankey et a1.
`7/2008 Sanford et a1.
`7/2008 Terlizzi et a1.
`7/2008 Hankey et a1.
`7/2008 Hankey et a1.
`7/2008 Sanford et a1.
`7/2008 Tang et a1.
`7/2008 Rabu et a1.
`12/2008 Forstall
`10/2009 Terlizzi et a1.
`
`DE
`DE
`WO
`WO
`
`FOREIGN PATENT DOCUMENTS
`10333403 A1
`9/2004
`202004012084 U1
`11/2004
`03090321 A1
`10/2003
`2006126881 A2
`11/2006
`
`Primary Examiner 7 Hoa B Trinh
`(74) Attorney, Agent, or Firm 7 Dorsey & Whitney LLP
`
`(57)
`
`ABSTRACT
`
`Headset assemblies and headset connectors are provided.
`Headset connectors can include a magnetic mating face and a
`plurality of electrical contacts disposed within the mating
`face. Engaging assemblies and engaging connectors are also
`provided. The engaging connectors can include a housing
`having a mating side, a magnetic array structure, and a plu-
`rality of spring biased contact members. The magnetic array
`structure can be fixed within the housing and house a plurality
`of spring biased contact members. The spring biased contact
`members can include tips that extend out of the mating side.
`The tips can electrically couple with electrical contacts in a
`headset connector.
`
`38 Claims, 60 Drawing Sheets
`
`
`
`APPLE 1005
`
`1
`
`APPLE 1005
`
`

`

`U.S. Patent
`
`Diar.19,2013
`
`Sheet10f60
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`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`Sheet 2 of 60
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`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`Sheet 3 of 60
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`U.S. Patent
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`US. Patent
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`Mar. 19, 2013
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`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`U.S. Patent
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`Mar. 19, 2013
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`Sheet 7 of 60
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`US 8,401
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`US. Patent
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`US. Patent
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`Mar. 19, 2013
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`US. Patent
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`Mar. 19, 2013
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`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`US 8,401,219 B2
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`U.S. Patent
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`Diar.19,2013
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`US 8,401,219 B2
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`U.S. Patent
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`U.S. Patent
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`US. Patent
`
`Mar. 19, 2013
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`Sheet 19 0f 60
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`US 8,401,219 B2
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`FIG.21B
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`

`US. Patent
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`Mar. 19, 2013
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`Sheet 20 of 60
`
`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`Sheet 21 of 60
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`US 8,401,219 B2
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`FIG.23
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`

`

`US. Patent
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`Mar. 19, 2013
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`Sheet 22 of 60
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`US 8,401,219 B2
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`

`U.S. Patent
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`Diar.19,2013
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`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`Sheet 24 of 60
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`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`Sheet 25 of 60
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`US 8,401,219 B2
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`U.S. Patent
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`Diar.19,2013
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`US 8,401,219 B2
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`U.S. Patent
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`Mar. 19, 2013
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`Sheet 27 0f 60
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`US. Patent
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`Mar. 19, 2013
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`Sheet 28 of 60
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`US 8,401,219 B2
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`US. Patent
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`Mar. 19, 2013
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`Sheet 29 of 60
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`US 8,401,219 B2
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`PLACING BOTTOM INSERT INTO TUBE
`
`2901
`
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`
`APPLYING THREAD-LOCKING GLUE
`TO THE BOTTOM INSERT THREADS
`
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`TO A PREDETERMINED LEVEL
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`2903
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`THAT ONE OR MORE TABS ON THE NECK
`FIT WITHIN ONE OR MORE NOTCHES ON THE TUBE
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`2904
`
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`BOTTOM INSERT WHILE THE NECK IS
`ROTATIONALLY FIXED TO THE TUBE
`
`2905
`
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`
`2906
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`2907
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`
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`FIG. 29
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`30
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`U.S. Patent
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`Diar.19,2013
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`Sheet300f60
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`US 8,401,219 B2
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`US 8,401,219 B2
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`2
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`1
`HEADSET CONNECTOR
`
`CROSS REFERENCE TO RELATED
`APPLICATIONS
`
`This application claims the benefit of certain copending,
`commonly assigned US. Provisional Patent Applications,
`namely Application No. 60/879,177 filed on Jan. 6, 2007 and
`Application No. 60/879,195 filed on Jan. 6, 2007, both of
`which are incorporated herein by reference.
`Commonly assigned DiFonzo et al. US. patent application
`Ser. No. 11/235,873, filed Sep. 26, 2005, entitled “Electro-
`magnetic Connector for Electronic Device” is hereby incor-
`porated by reference in its entirety.
`Commonly assigned Rohrbach et al. US. patent applica-
`tion Ser. No. 11/235,875, filed Sep. 26, 2005, entitled “Mag-
`netic Connector for Electronic Device” is hereby incorpo-
`rated by reference in its entirety.
`Commonly assigned Andre et al. US. patent application
`Ser. No. 11/456,833, filed Jul. 11, 2006, entitled “Invisible,
`Light-Transmissive Display System” is hereby incorporated
`by reference in its entirety.
`Commonly assigned Andre et al. US. patent application
`Ser. No. 11/551,988, filed Oct. 23, 2006, entitled “Invisible,
`Light-Transmissive Display System” is hereby incorporated
`by reference in its entirety.
`Commonly assigned Sanford et al. US. patent application
`Ser. No. 11/651,094, filed Jan. 6, 2007, entitled “Antenna and
`Button Assembly for Wireless Devices” is hereby incorpo-
`rated by reference in its entirety.
`Commonly assigned Terlizzi et al. US. patent application
`Ser. No. 11/650,130, filed Jan. 5, 2007, entitled “Systems and
`Methods for Determining the Configuration of Electronic
`Connections” is hereby incorporated by reference in its
`entirety.
`Commonly assigned Rabu et al. US. patent application
`Ser. No. 1 1/620,669, filed Jan. 6, 2007, entitled “Apparatuses
`and Methods that Facilitate the Transfer of Power and Infor-
`
`mation Among Electrical Devices” is hereby incorporated by
`reference in its entirety.
`Commonly assigned Terlizzi et al. US. Provisional Patent
`Application No. 60/878,852, filed Jan. 5, 2007, entitled “Sys-
`tems and Methods for Multi-State Switch Networks” is
`
`hereby incorporated by reference in its entirety.
`Commonly assigned Forstall US. Provisional Patent
`Application No. 60/936,965, filed Jun. 22, 2007, entitled
`“Single User Input Mechanism for Controlling Electronic
`Device Operations” is hereby incorporated by reference in its
`entirety.
`
`FIELD OF INVENTION
`
`The present invention can relate to headsets. More particu-
`larly, the present invention can relate to headsets for commu-
`nicating with an electronic device.
`
`BACKGROUND OF THE INVENTION
`
`Headsets for providing hands-free communications are
`known in the art. Such headsets typically can be used in
`conjunction with a cellular telephone or a computer (e.g.,
`Voice over IP). Some existing headsets include a microphone,
`a speaker (also referred to as a receiver), electronics for con-
`trolling the headset and communicating with another device
`(e.g., a cellular telephone), a battery and a connector for
`re-charging the battery.
`
`There are many aspects involved in the design of headsets.
`For example, the size and weight ofheadsets can be key issues
`because of how they typically mount to a user’s ear. A heavy
`or large headset can pull on a user’s ear, creating an uncom-
`fortable fit. The shape of headset earpieces (e. g., earbuds)
`may also be an important design consideration to take into
`account as it is desirable for earpieces to fit comfortably in,
`on, or over a wide range of different sizes and shapes of ears.
`Additionally, the acoustic performance ofheadsets, such as
`receiver sound generation quality and microphone sound
`reception quality (e.g., ability to pick up a user’s voice with-
`out undue background noise), can be important design con-
`siderations. Achieving desired receiver and microphone
`acoustic performance can become increasingly difficult as the
`size of a headset decreases.
`
`Another example of an important design consideration can
`be the user interface ofa headset. It may be desirable for a user
`interface to be intuitive for a first-time user, yet convenient for
`an experienced user.
`Aesthetics may be yet another important design consider-
`ation for headsets.
`
`Further still, ease ofmanufacturing headsets can be another
`design consideration. For example,
`it can be desirable to
`design a headset that can be mass produced in an affordable
`fashion.
`
`In view of the foregoing, there is a need for an improved
`headset that addresses one or more of the above-identified
`considerations.
`
`SUMMARY OF THE INVENTION
`
`In accordance with one embodiment of the present inven-
`tion, a headset that includes a tube housing and a magnetic
`connector fixed within the tube housing is provided. The
`magnetic connector can include a mating face and a plurality
`of electrical contacts disposed within the mating face.
`In accordance with another embodiment of the present
`invention, an engaging connector assembly that includes a
`housing, a magnetic array structure, and a plurality of spring
`biased contact members is provided. The housing can have a
`mating side. The magnetic array structure can be fixed within
`the housing and constructed to house a plurality of spring
`biased contact members. The plurality of spring biased con-
`tact members can be housed within the magnetic array struc-
`ture. The spring biased contact members can include tips that
`extend out of the mating side.
`In accordance with yet another embodiment of the present
`invention, a connector that includes at least one magnetic
`component, a mating face, at least two contacts, and circuitry
`is provided. The mating face can be proximal to the at least
`one magnetic component. The at least two contacts can be
`disposed in the mating face. The circuitry can be electrically
`coupled to the at least two contacts. The mating face can be
`angled with respect to a plane passing lengthwise through the
`connector.
`
`In accordance with yet another embodiment of the present
`invention, a connector that includes at least one triangle
`shaped magnetic component and at least one contact disposed
`adjacent to the at least one triangle shaped magnetic compo-
`nent is provided.
`In accordance with yet another embodiment of the present
`invention, a system that includes a headset connector and an
`engagement connector is provided. The headset connector
`can include at least one electrical contact housed within a
`
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`connector plate having an angled headset mating surface. The
`engagement connector can include at least one spring biased
`connector member having a tip portion that is electrically
`62
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`3
`coupled to the at least one electrical contact when the angled
`headset mating surface is in close proximity to an angled
`engagement connector mating surface.
`In accordance with yet another embodiment of the present
`invention, a system that includes a headset assembly and a
`headset engaging assembly is provided. The headset assem-
`bly can include a magnetic connector having an angled mat-
`ing face. The connector can include a plurality of electrical
`contacts disposed within the angled mating face. The headset
`engaging assembly can include a magnetic component. The
`magnetic component can include at least one angled surface
`and at least one spring biased contact member. Each contact
`member can include a tip that extends beyond the at least one
`angled surface.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`The present invention will be apparent upon consideration
`of the following detailed description, taken in conjunction
`with accompanying drawings, in which:
`FIG. 1 is a simplified block diagram of a headset in accor-
`dance with an embodiment of the present invention;
`FIG. 2 is a simplified block diagram of a headset connector
`system in accordance with an embodiment of the present
`invention;
`FIG. 3 is a simplified cross-sectional illustration of a con-
`nector assembly in accordance with an embodiment of the
`present invention;
`FIG. 4 is a simplified cross-sectional illustration of another
`connector assembly in accordance with an embodiment ofthe
`present invention;
`FIG. 5 is a simplified block diagram of a headset in accor-
`dance with an embodiment of the present invention;
`FIG. 6A is a simplified cross-sectional illustration of a
`portion of a headset in accordance with an embodiment of the
`present invention;
`FIG. 6B is a simplified cross-sectional illustration of a
`screw in accordance with an embodiment of the present
`invention;
`FIG. 7 is a simplified block diagram of a display system in
`accordance with an embodiment of the present invention;
`FIG. 8 is a simplified block diagram of a power distribution
`system in accordance with an embodiment of the present
`invention;
`FIG. 9 is a simplified block diagram of another power
`distribution system in accordance with an embodiment of the
`present invention;
`FIGS. 10A and 10B are illustrations of a headset in accor-
`
`dance with an embodiment of the present invention;
`FIG. 11 is an exploded view of a headset in accordance
`with an embodiment of the present invention;
`FIG. 12 is an exploded view of a headset in accordance
`with another embodiment of the present invention;
`FIG. 13 is a simplified diagram showing how software in a
`Bluetooth device is organized in accordance with an embodi-
`ment of the present invention;
`FIG. 14 is a simplified block diagram of the electrical
`system of a headset in accordance with an embodiment of the
`present invention;
`FIG. 15 is a simplified block diagram ofthe core processor
`of a headset in accordance with an embodiment ofthe present
`invention;
`FIG. 16 is a simplified schematic diagram of a power
`distribution system in accordance with an embodiment of the
`present invention;
`FIGS. 17A-17C are illustrations of a traditional circuit
`
`board and distribution of electrical components in a headset;
`
`4
`
`FIG. 18 is a simplified block diagram of a circuit board
`with an improved distribution of electrical components in a
`headset in accordance with an embodiment of the present
`invention;
`FIGS. 19A and 19B are illustrations comparing the tradi-
`tional circuit board of FIGS. 7A-7C to a circuit board with an
`
`improved distribution ofelectrical components in a headset in
`accordance with an embodiment of the present invention;
`FIGS. 20A-20C are illustrations of an improved distribu-
`tion of electrical components in a headset in accordance with
`an embodiment of the present invention;
`FIG. 21A is an illustration of a headset earbud in accor-
`
`dance with an embodiment of the present invention;
`FIG. 21B is a simplified exploded view of a headset earbud
`in accordance with an embodiment of the present invention;
`FIGS. 22-25 and FIG. 26A are simplified illustrations of a
`headset earbud in various states of assembly in accordance
`with some embodiments of the present invention;
`FIG. 26B is a simplified cross-sectional view of an audio
`receiver in accordance with an embodiment of the present
`invention;
`FIG. 27A is a simplified cross-sectional view of a partially
`assembled headset earbud in accordance with an embodiment
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`20
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`of the present invention;
`FIG. 27B is a simplified cross-sectional view of a fully
`assembled headset earbud in accordance with an embodiment
`
`30
`
`of the present invention;
`FIG. 28 is an exploded view of an attachment system in
`accordance with an embodiment of the present invention;
`FIG. 29 is a flowchart of an illustrative process for assem-
`bling a portion of a headset in accordance with an embodi-
`ment of the present invention.
`FIGS. 30A and 30B are illustrations of a tool that can be
`
`35
`
`used to assist in assembly of a portion of a headset in accor-
`dance with an embodiment of the present invention;
`FIG. 30C is an illustration ofthe tool ofFIGS. 30A and 30B
`
`being used in accordance with an embodiment of the present
`invention;
`FIG. 31 is a cross-sectional view of a “finished” tube in
`
`accordance with an embodiment of the present invention;
`FIG. 32 is a cross-sectional view of an initially manufac-
`tured tube in accordance with an embodiment of the present
`invention;
`FIG. 33 is a perspective view ofa cross section ofthe tube
`of FIG. 31 in accordance with an embodiment of the present
`invention;
`FIG. 34 is an illustrative die and stamper for modifying the
`initially manufactured tube of FIG. 32 in accordance with an
`embodiment of the present invention;
`FIG. 35 is a cross-sectional view ofthe tube ofFIG. 34 once
`
`the stamper and die are removed from the tube in accordance
`with an embodiment of the present invention;
`FIG. 36 is a perspective view ofthe tube ofFIG. 35 once the
`tube is machined to create an internal wall in accordance with
`
`an embodiment of the present invention;
`FIG. 37 is a cross-sectional view of an illustrative tube
`
`formed using a single impact extrusion in accordance with an
`embodiment of the present invention;
`FIG. 38 is a perspective view ofthe tube ofFIG. 37 once the
`tube is machined to create an internal wall in accordance with
`
`an embodiment of the present invention;
`FIG. 39 is a cross-sectional view of an illustrative tube
`
`formed using a double impact extrusion in accordance with an
`embodiment of the present invention;
`FIG. 40 is a perspective view ofthe tube ofFIG. 39 once the
`tube is machined to create an internal wall in accordance with
`
`40
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`50
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`60
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`65
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`an embodiment of the present invention;
`63
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`US 8,401,219 B2
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`5
`FIG. 41 is a cross-sectional view of an illustrative tube
`
`formed using a progressive deep draw process in accordance
`with an embodiment of the present invention;
`FIG. 42 is a perspective view of a cross section of the tube
`of FIG. 41 in accordance with an embodiment of the present
`invention;
`FIG. 43 is a perspective view ofthe tube of FIGS. 41 and 42
`once the tube is machined to create an internal wall in accor-
`
`dance with an embodiment of the present invention;
`FIG. 44 is a flow chart ofan illustrative process for forming
`an extruded tube with a feature on the internal surface of the
`
`tube with using a die and stamper in accordance with an
`embodiment of the present invention;
`FIG. 45 is a flow chart ofan illustrative process for forming
`a tube with a feature on the internal surface of the tube using
`a single impact extrusion in accordance with an embodiment
`of the present invention;
`FIG. 46 is a flow chart ofan illustrative process for forming
`a tube with a feature on the internal surface of the tube using
`a impact extrusion on both ends ofthe tube in accordance with
`an embodiment of the present invention;
`FIG. 47 is a flow chart ofan illustrative process for forming
`a tube with a feature on the internal surface of the tube using
`a progressive deep draw process in accordance with an
`embodiment of the present invention;
`FIG. 48 is a cross-sectional view of a visual indicator
`
`system in accordance with an embodiment of the present
`invention;
`FIG. 49 is an illustration of a visual indicator system of a
`headset in accordance with an embodiment of the present
`invention;
`FIGS. 50A and 50B are illustrations of a headset in accor-
`
`10
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`15
`
`20
`
`25
`
`30
`
`dance with an embodiment of the present invention;
`FIG. 51 is an illustration of a connector in accordance with
`
`35
`
`an embodiment of the present invention;
`FIG. 52 is an exploded view of a connector in accordance
`with an embodiment of the present invention;
`FIG. 53 is an illustration of a microphone boot in accor-
`dance with an embodiment of the present invention;
`FIG. 54 is a cross-sectional view of a connector in accor-
`
`40
`
`dance with an embodiment of the present invention;
`FIGS. 55A-55D are illustrations of a headset in accordance
`
`with an embodiment of the present invention;
`FIG. 56 is a cross-sectional view of an electrical contact
`
`45
`
`assembly coupled to a circuit board in accordance with an
`embodiment of the present invention;
`FIGS. 57A and 57B are illustrations of an electrical contact
`
`assembly in accordance with an embodiment of the present
`invention;
`FIGS. 58A-58C are illustrations of an electrical contact
`
`50
`
`assembly in accordance with an embodiment of the present
`invention;
`FIGS. 59A and 59B are illustrations of electrical contacts
`
`in accordance with an embodiment of the present invention;
`FIGS. 60A and 60B are illustrations of a connector plate in
`accordance with an embodiment of the present invention;
`FIGS. 61A and 61B are illustrations of magnetic compo-
`nents ofa connector in accordance with an embodiment ofthe
`
`present invention;
`FIGS. 62A and 62B are illustrations of a connector in
`
`accordance with an embodiment of the present invention;
`FIGS. 63A and 63B are illustrations of a connector in
`
`accordance with an embodiment of the present invention;
`FIG. 64 is an illustration of a headset coupling with a
`complementary connector in accordance with an embodi-
`ment of the present invention;
`
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`60
`
`65
`
`6
`FIG. 65 is a simplified graph ofmagnetic and spring forces
`involved in the coupling of a headset with a complementary
`connector in accordance with an embodiment of the present
`invention;
`FIG. 66 is an illustration of a docking device that can
`receive a headset in accordance with an embodiment of the
`
`present invention;
`FIG. 67A is an illustration of a connector in accordance
`
`with an embodiment of the present invention;
`FIG. 67B is an illustration of a headset coupling with a
`complementary connector in accordance with an embodi-
`ment of the present invention; and
`FIG. 68 is a chart listing exemplary modes and functions of
`a communications system in accordance with an embodiment
`of the present invention.
`
`DETAILED DESCRIPTION OF THE INVENTION
`
`The present invention relates to headsets and methods for
`manufacturing the same. Headsets are communication
`devices that are worn on a user’s head in order to allow hands
`free data and/or voice communication with a ho st device such
`
`as a computer, phone handset, cellular phone, an automobile
`and/or the like. Headsets can include one or more speakers (in
`proximity to one or both ears) for audio output and/or one or
`more microphones for audio input.
`Headsets can come in a variety ofform factors or shapes. In
`some cases, headsets can be embodied as an earpiece that
`serves as the primary support mechanism for wearing the
`headset. For example the headset may be supported on the
`head by an earpiece worn over or in the ear. Alternatively, the
`headset may be supported by a frame or band that fits on or
`over the user’s head. The headset may include a fixed or
`movable boom that places the microphone closer to the user’ s
`mouth (wraps around the face). Alternatively, the headset
`may be boomless such that the microphone is integrated with
`the earpiece thereby forming a more compact device (e.g.,
`smaller, lighter, more aesthetically pleasing, etc.).
`According to one aspect of the invention, the headset can
`be embodied as a small compact unit including a primary
`housing and an earbud member extending therefrom. The
`earbud member may be attached to or integrally formed with
`the primary housing. Various components can be placed at the
`surface ofor within the confines ofthe earbud member and the
`
`primary housing. In fact, both of them can include one or
`more components depending on the needs of the device. The
`components contained within each of these can be widely
`varied. Examples of operational components can include
`speakers, microphones, antennas, connectors, buttons, dis-
`plays, indicators, battery, and associated processors, control-
`lers and circuitry. Generally, the earbud member includes at
`least a speaker while the primary housing includes at least a
`microphone (although this is not a requirement). Depending
`on their size, each of these members can include additional
`components of the headset. In one embodiment, the primary
`housing includes an antenna, user interface button, indicator
`or display (e.g., LEDs), battery, microphone, and/or a con-
`nector along with any accompanying circuitry while a
`speaker, a processor, and its accompanying circuitry can be
`located in the earbud. The button can be located on one end of
`
`the main housing. A user can interface with this button to
`perform various functions (e.g., terminating calls).
`The shape and size and orientation of the earbud member
`and primary housing can be widely varied. In one embodi-
`ment, the earbud member is configured for insertion into the
`ear such that it supports the remaining portions ofthe headset
`(e.g., primary housing) proximate the user’s head. In one
`
`64
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`

`

`US 8,401,219 B2
`
`8
`multiple rigid circuit boards that are interconnected by flex-
`ible orbendable circuit boardportions that canbe bent around
`various internal shapes and/or folded over itself while still
`functioning properly.
`Another aspect of t