21100198
`
`
`
`(19) TAIWAN INTELLECTUAL PROPERTY OFFICE
`
`(12) INVENTION SPECIFICATION PUBLICATION
`
`(11) PUBLICATION NUMBER: TW 201100198 A1
`
`(43) PUBLICATION DATE: 01 JANUARY 2011
`
`(21) APPLICATION NUMBER: 098136436
`
`(22) APPLICATION DATE: 28 OCTOBER 2009
`
`(51) INT. CL.: B24B 53/12 (2006. 01)
`
`B24B 37/04 (2006. 01)
`
`H01L 21/304 (2006 .01)
`
`(30) PRIORITY: 2009/06/19
`
`TW
`
`098120545
`
`(71) APPLICANTS: SUNG, CHIEN MIN (TW)
`
`NO. 4, LANE 32, CHUNG CHENG ROAD, TAMSUI TOWN, TAIPEI COUNTY
`
`CHEN, YING TUNG (TW)
`
`NO. 344, CHUNG CHENG ROAD, TAOYUAN CITY, TAOYUAN COUNTY
`
`(72) INVENTORS: SUNG, CHIEN MIN (TW); CHEN, YING TUNG (TW)
`
`(74) AGENT: WANG, MINGCHANG
`
`APPLICATION FOR SUBSTANTIVE EXAMINATION: YES
`
`NUMBER OF CLAIMS: 30 NUMBER OF FIGURES: 9 25 PAGES IN TOTAL
`
`(54) TITLE
`
`COMPOSITE CONDITIONER
`
`(57) ABSTRACT
`
`A composite conditioner comprises a large substrate, provided with a bonding surface, a bottom surface and a plurality
`
`of through holes or a plurality of accommodating grooves; and a plurality of polishing units, respectively having a
`
`plurality of grits; the plurality of grits respectively have a plurality of cutting ends; the plurality of through holes or the
`
`plurality of accommodating grooves respectively accommodate the plurality of polishing units, and the plurality of
`
`cutting ends respectively protrude from the bonding surface; the plurality of polishing units and the large substrate are
`
`fixed and bonded with a bonding agent; the height difference between the plurality of cutting ends of the plurality of
`
`grits and a plane is within 20 microns; it is easier to make the cutting ends of most grits of a large-area composite
`
`conditioner at the same height, different grits may be changed as needed, and the cost of making a plurality of small
`polishing units and then combining them into a large-area conditioner is relatively low.
`
`1: composite conditioner
`
`11: large substrate
`
`12: polishing unit
`
`13: bonding agent
`
`14: reference plane
`
`15: plane
`
`110: bonding surface
`
`111: bottom surface
`
`112: through hole
`
`113: inner wall
`
`114: concave-convex structure
`
`
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`120: small substrate
`
`121: grit
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`122: side
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`123: cutting end
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`124: the other side
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`1
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`TW 201100198 A1
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`125: outer wall
`126: concave-convex structure
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`(19) TAIWAN INTELLECTUAL PROPERTY OFFICE
`
`(12) INVENTION SPECIFICATION PUBLICATION
`
`
`
`(11) PUBLICATION NUMBER: TW 201100198 A1
`
`(43) PUBLICATION DATE: 01 JANUARY 2011
`
`(21) APPLICATION NUMBER: 098136436
`
`(22) APPLICATION DATE: 28 OCTOBER 2009
`
`(51) INT. CL.: B24B 53/12 (2006. 01)
`
`B24B 37/04 (2006. 01)
`
`H01L 21/304 (2006 . 01)
`
`(30) PRIORITY: 2009/06/19
`
`TW 098120545
`
`(71) APPLICANTS: SUNG, CHIEN MIN (TW)
`
`NO. 4, LANE 32, CHUNG CHENG ROAD, TAMSUI TOWN, TAIPEI COUNTY
`
`CHEN, YING TUNG (TW)
`
`NO. 344, CHUNG CHENG ROAD, TAOYUAN CITY, TAOYUAN COUNTY
`
`(72) INVENTORS: SUNG, CHIEN MIN (TW); CHEN, YING TUNG (TW)
`
`(74) AGENT: WANG, MINGCHANG
`
`APPLICATION FOR SUBSTANTIVE EXAMINATION: YES
`
`NUMBER OF CLAIMS: 30 NUMBER OF FIGURES: 9 25 PAGES IN TOTAL
`
`(54) TITLE
`
`COMPOSITE CONDITIONER
`
`(57) ABSTRACT
`
`A composite conditioner comprises a large substrate, provided with a bonding surface, a bottom surface and a plurality
`
`of through holes or a plurality of accommodating grooves; and a plurality of polishing units, respectively having a
`
`plurality of grits; the plurality of grits respectively have a plurality of cutting ends; the plurality of through holes or the
`
`plurality of accommodating grooves respectively accommodate the plurality of polishing units, and the plurality of
`
`cutting ends respectively protrude from the bonding surface; the plurality of polishing units and the large substrate are
`
`fixed and bonded with a bonding agent; the height difference between the plurality of cutting ends of the plurality of
`
`grits and a plane is within 20 microns; it is easier to make the cutting ends of most grits of a large-area composite
`
`conditioner at the same height, different grits may be changed as needed, and the cost of making a plurality of small
`polishing units and then combining them into a large-area conditioner is relatively low.
`
`1: composite conditioner
`
`11: large substrate
`
`12: polishing unit
`
`13: bonding agent
`
`14: reference plane
`
`15: plane
`
`110: bonding surface
`
`111: bottom surface
`
`112: through hole
`
`113: inner wall
`
`114: concave-convex structure
`
`120: small substrate
`
`
`
`121: grit
`
`122: side
`123: cutting end
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`21100198
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`Invention Patent Specification
`
`(Please do not modify the format and sequence of this specification arbitrarily and do not fill in the parts marked with
`
`※ Application Number: 98136436
`
`※)
`
`※ Application Date: 28 October 2009
`
`※ IPC Category: B24B 53/12 (2006. 01)
`
`B24B 37/04 (2006. 01)
`
`H01L 21/304 (2006. 01)
`
`I.
`
`Title of the Invention: (Chinese/English)
`
`COMPOSITE CONDITIONER
`
`II.
`
`Invention Abstract in Chinese:
`
`A composite conditioner comprises a large substrate, provided with a bonding surface,
`
`a bottom surface and a plurality of through holes or a plurality of accommodating grooves;
`
`and a plurality of polishing units, respectively having a plurality of grits; the plurality of
`
`grits respectively have a plurality of cutting ends; the plurality of through holes or the
`
`plurality of accommodating grooves respectively accommodate the plurality of polishing
`
`units, and the plurality of cutting ends respectively protrude from the bonding surface; the
`
`plurality of polishing units and the large substrate are fixed and bonded with a bonding
`
`agent; the height difference between the plurality of cutting ends of the plurality of grits
`
`and a plane is within 20 microns; it is easier to make the cutting ends of most grits of a
`
`large-area composite conditioner at the same height, different grits may be changed as
`
`needed, and the cost of making a plurality of small polishing units and then combining
`
`them into a large-area conditioner is relatively low.
`
`III. Abstract in English:
`
`
`
`
`
`1
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`21100198
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`IV. Designated Representative Image:
`
`(I) The designated representative image of the present application is: Fig. (2).
`
`(II) Brief description of signs in the representative image:
`
`1 composite conditioner
`
`11 large substrate
`
`110 bonding surface
`
`111 bottom surface
`
`112 through hole
`
`113 inner wall
`
`114, 126 concave-convex structures
`
`12 polishing unit
`
`120 small substrate
`
`121 grit
`
`122 side
`
`123 cutting end
`
`124 the other side
`
`125 outer wall
`
`13 bonding agent
`
`14 reference plane
`
`15 plane
`
`
`
`V.
`
`If there are chemical formulae, please disclose the chemical formula that can
`
`best show the features of the invention:
`
`
`
`
`
`2
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`21100198
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`VI. Description:
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`[TECHNICAL FIELD]
`
`The present invention relates to a conditioner, particularly to a composite conditioner
`
`of a CMP pad and a method for manufacturing the same.
`
`[PRIOR ART]
`
`Chemical mechanical planarization (CMP) is currently the most attractive technology
`
`in the process of planarization of semiconductor wafers. In the CMP process, the function
`
`of a polishing pad is to stably and uniformly transport a polishing solution to between a
`
`wafer and the polishing pad. Under the interaction of chemical etching and mechanical
`
`grinding, the protruding deposited layer on the chip is removed.
`
`In order to meet the needs of wafer processing and mass production and maintain the
`
`stability of quality, a diamond conditioner (diamond dresser) must be used to condition the
`
`polishing pad in a timely manner during the CMP process. The diamond conditioner
`
`removes the polishing byproducts on the surface, restores the rough surface of the
`
`polishing pad, improves its ability to accommodate the slurry, and restores the pores on the
`
`surface of the polishing pad and its ability to hold and transport the polishing solution. In
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`this way, the cost of polishing pads can be reduced and the requirement for stable quality
`
`during wafer mass production can be met.
`
`A conventional diamond conditioner fixes diamond particles of an average particle
`
`size on a metal disc. This diamond conditioner is suitable for conditioning hard polishing
`
`pads (e.g., IC1000). A conventional conditioner not only needs to remove the waste
`
`generated during polishing of wafers but also needs to cut a layer of polishing pad to
`
`restore certain roughness of the polishing pad, but this conventional type of diamond
`
`conditioner is not suitable for the CMP process of below 45 nm. As the line width of
`
`integrated circuits is getting smaller, for example, a 65 nm process was implemented as of
`
`2006, the requirements for flattening and smoothness of the wafer surface are getting
`
`higher, and the requirements for conditioning polishing pads are also increasing. It is
`
`expected that in the 45nm process in 2010, the polishing must adopt an extremely low
`
`pressure to avoid wearing through the nano-scale copper wires and the fragile low-k
`
`resistance layer. Therefore, the conditioned polishing pad needs higher flatness and needs
`
`to be redesigned to meet the requirements of large-size wafers. In the future, higher
`
`requirements will be set for the diamond particle distribution rules and leveling of
`
`3
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`21100198
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`diamond conditioners. In addition, the conditioner also needs to score finer and more
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`uniform marks on the polishing pad, but conversely, the conditioner shall have a lower
`
`removal rate of the polishing pad. Such requirements cannot be met by conventional
`
`conditioners.
`
`There are patents for different conditioners. For example, Taiwan patent I228066
`
`discloses a conditioner for polishing cloth and a method for conditioning the polishing
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`cloth. The conditioner comprises a metal table provided with an adjusting mechanism to
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`adjust the height difference of a reference plane formed by front ends of most grindstone
`
`particles in all or some of the grindstone particle groups.
`
`Taiwan public patent 200821093 discloses a diamond conditioner, wherein different
`
`types of diamond grits are respectively bonded to diamond grit bonding portions, and the
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`diamond grit bonding portions are fixed to a conditioner substrate by bolts or adhesive.
`
`US patent US6, 054, 183 discloses a conditioner, wherein a plurality of diamond
`
`particles and a layer of CVD diamonds are formed on a substrate; and the plurality of
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`diamond particles are clad with the CVD diamonds, thereby being fixed to the substrate
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`surface.
`
`International patent with publication number WO00/64630 discloses that a polishing
`
`layer comprises a plurality of grits, and the grits comprises organic resin, metal salt and
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`diamond grits averagely distributed among a plurality of grits.
`
`US public patent US20060128288 discloses a conditioner, comprising a plurality of
`
`diamond particles fixed to a metal substrate by a metal adhesive.
`
`Japanese public patent JP2006-315088 discloses a conditioner comprising a
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`disc-shaped base bonded to a plurality of round PCD diamond pieces.
`
`In general, the diameter of a conditioner is approximately 108 mm. Due to the large
`
`area, the amount of deformation is large, too. It is not easy to bond various grits of
`
`different sizes, shapes and materials and keep the apices of most grits at the same height.
`
`Further, conditioners with a large area are expensive.
`
`[SUMMARY OF THE INVENTION]
`
`In order that a conditioner with a large area can more easily bond various grits of
`
`different sizes, shapes and materials and keep the apices of most grits at the same height,
`
`the present invention is proposed.
`
`4
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`21100198
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`A main object of the present invention is to provide a composite conditioner in a way
`
`that the same polishing end of a large substrate bonds most of the small substrates having
`
`grits, the cutting ends of a plurality of grits are kept at the same height easily and various
`
`grits of different sizes, shapes and materials are bonded more easily.
`
`Other objects and effects of the present invention are shown in the drawings and
`
`embodiments. The detailed description is as follows.
`
`[DETAILED DESCRIPTION]
`
`As shown in Fig. 1 and Fig. 2, a composite conditioner 1 in the first embodiment of
`
`the present invention, particularly a conditioner used as a CMP pad, comprises a large
`
`substrate 11 and a plurality of polishing units 12.
`
`As shown in Fig. 2, the large substrate 11 is provided with a bonding surface 110, a
`
`bottom surface 111 and a plurality of through holes 112 corresponding to a plurality of
`
`polishing units 12; the plurality of through holes 112 respectively accommodate the
`
`plurality of polishing units 12 and the plurality of polishing units 12 protrude from the
`
`bonding surface 110; and the plurality of polishing units 12 and the large substrate 11 are
`
`fixed and bonded with a bonding agent 13.
`
`The plurality of polishing units 12 respectively comprise a small substrate 120 and a
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`plurality of grits 121; a side 122 of the small substrate 120 bonds the plurality of grits 121;
`
`each grit 121 has a cutting end 123 that can cut a work piece; the other side 124 of the
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`small substrate 120 opposite to the side provided with the plurality of grits 121 and the
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`bottom surface 111 of the large substrate 11 are approximately on the same reference plane
`
`14. A plurality of inner walls 113 forming a plurality of through holes 112 of the large
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`substrate 11 and a plurality of outer walls 125 of the plurality of polishing units 12
`
`respectively have a plurality of concave-convex structures 114 and 126. After the bonding
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`agent 13 permeates into the plurality of concave-convex structures 114 and 126 and is
`
`cured to bond the plurality of inner walls 113 and the plurality of outer walls 125, the
`
`bonding between the large substrate 11 and the plurality of polishing units 12 will be even
`
`firmer. In a polishing operation, the plurality of polishing units 12 cannot move
`
`perpendicularly relative to the large substrate 11, so they will not break away from the
`
`large substrate 11. Alternatively, the plurality of concave-convex structures 114 and 126
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`are not arranged in the plurality of inner walls 113 and the plurality of outer walls 125, or
`
`are arranged in either the plurality of inner walls 113 or the plurality of outer walls 125.
`
`5
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`21100198
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`As shown in Fig. 1, the section between the plurality of through holes 112 of the large
`
`substrate 11 and the plurality of polishing units 12 may be round or polygonal, for
`
`example in a square shape.
`
`The plurality of polishing units 12 in this embodiment are respectively higher than the
`
`large substrate 11. From the height of the plurality of polishing units 12, the height that a
`
`plurality of cutting ends 123 of a plurality of grits 121 protrude from the bonding surface
`
`110 of the large substrate 11 is determined. The difference in the height that the plurality
`
`of cutting ends 123 protrude from the large substrate 11 is within 20 microns to keep the
`
`height difference between the plurality of cutting ends 123 and a plane 15 within 20
`
`microns. The height that the plurality of cutting ends 123 protrude from the bonding
`
`surface 110 of the large substrate 11 is 0.05 to 5 mm.
`
`As shown in Fig. 2 and Fig. 3, a composite conditioner 2 in the second embodiment of
`
`the present invention is roughly the same as the composite conditioner 1 in the foregoing
`
`first embodiment in terms of structure except that a plurality of through holes 212 of a
`
`large substrate 21 are in a tapered shape, the diameter of the through holes are larger at the
`
`top and smaller at the bottom and the tilt angle of inner walls 213 is 1 to 15 degrees. The
`
`large substrate 21 is provided with a bonding surface 210, a bottom surface 211 and a
`
`plurality of through holes 212 corresponding a plurality of polishing units 12, the plurality
`
`of inner walls 213 forming the plurality of through holes 212 of the large substrate 21 also
`
`have a plurality of concave-convex structures 214 opposite to the plurality of
`
`concave-convex structures 126; the plurality of polishing units 12 are respectively placed
`
`in the plurality of through holes 112, the other side 124 of the plurality of grits 121 is
`
`inlaid in the lower end of one of the plurality of through holes 212 with a smaller diameter
`
`in a clamped manner and in on the same reference plane 14 with the bottom surface 211,
`
`and then are fixed and bonded with a bonding agent 22. During a polishing operation,
`
`when a plurality of polishing units 12 are pressed, perpendicular movement should be
`
`avoided, and the plurality of through holes 212 are designed to be in a tapered shape for
`
`the purpose of ensuring that the plurality of polishing units 12 when being pressed are
`
`unable to move towards the narrower sides of the plurality of through holes 212, thereby
`
`becoming firmer. Alternatively, the plurality of concave-convex structures 214 are 126 are
`
`not arranged in the plurality of inner walls 213 and the plurality of outer walls 125, or are
`
`arranged in either the plurality of inner walls 213 or the plurality of outer walls 125.
`
`As shown in Fig. 2, Fig. 4A and Fig. 4B, a composite conditioner 3 in the third
`
`6
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`21100198
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`embodiment of the present invention is roughly the same as the composite conditioner 1 in
`
`the foregoing first embodiment in terms of structure except that a plurality of polishing
`
`units 31 are respectively shorter than the large substrate 11 and the height that the plurality
`
`of polishing units 31 protrude from a bonding surface 110 of a large substrate 11 is
`
`controlled through the thickness of a template 32. The plurality of polishing units 31 are
`
`also composed of a plurality of grits 311 bonded to a plurality of small substrates 310; a
`
`side 312 of each of the small substrates 310 bonds a plurality of grits 311; each grit 311
`
`has a cutting end 313 that can cut a work piece; the other side 314 of each of the small
`
`substrates 310 opposite to the side provided with a plurality of grits 311 is placed in a
`
`through hole 112 of the large substrate 11, and the other side 314 is higher than the bottom
`
`surface 111; a bonding agent 13 closes the through holes 112 on the bottom surface 111 of
`
`the large substrate 11. A plurality of inner walls 113 forming the plurality of through holes
`
`112 of the large substrate 11 and a plurality of outer walls 315 of the plurality of polishing
`
`units 31 respectively have a plurality of opposite concave-convex structures 114 and 316.
`
`Alternatively, the plurality of concave-convex structures 214 are 316 are not arranged in
`
`the plurality of inner walls 213 and the plurality of outer walls 315, or are arranged in
`
`either the plurality of inner walls 213 or the plurality of outer walls 315. The template 232
`
`may be a metal plate.
`
`As shown in Fig. 4B, during manufacturing in this embodiment, a template 32 is
`
`bonded to a large substrate 11, the cutting ends 313 of a plurality of polishing units 31
`
`respectively pass through a plurality of through holes 112 of the large substrate 11 and
`
`enter the template 32, the amount of protrusion of the plurality of polishing units 31 is
`
`controlled through the thickness of the template 32, then a bonding agent 13 is injected
`
`from the plurality of through holes 112 of the large substrate 11 so that the large substrate
`
`11 is fixed and bonded to the plurality of polishing units 31, and then the template 32 is
`
`separated from the large substrate 11 to form a composite conditioner 3 as shown in Fig.
`
`4A.
`
`As shown in Fig. 2 and Fig. 5, a composite conditioner 4 in the fourth embodiment of
`
`the present invention is roughly the same as the composite conditioner 1 in the foregoing
`
`first embodiment in terms of structure except that a large substrate 41 is provided with a
`
`plurality of accommodating grooves 411 instead of the plurality of through holes 112 of
`
`the large substrate. Further, a plurality of inner walls 412 forming the plurality of
`
`accommodating grooves 411 of the large substrate 41 also have a plurality of
`
`concave-convex structures 413; the plurality of accommodating grooves 411 of the large
`
`7
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`21100198
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`substrate 41 respectively accommodate a plurality of polishing units 12, which protrude
`
`from a bonding surface 410; the plurality of polishing units 12 and the large substrate 11
`
`are fixed and bonded with a bonding agent 13. The other side 124 of each of the small
`
`substrates 120 opposite to the side provided with the plurality of grits 121 and a plurality
`
`of bottom walls 414 forming bottoms of the plurality of accommodating grooves 411 of
`
`the large substrate 41 are on the same reference plane 14.
`
`As shown in Fig. 5 and Fig. 6, a composite conditioner 5 in the fifth embodiment of
`
`the present invention is roughly the same as the composite conditioner 4 in the foregoing
`
`fourth embodiment in terms of structure except that the diameter of a plurality of
`
`accommodating grooves 511 of a large substrate 51 is smaller than the diameter of the
`
`plurality of accommodating grooves 411 of the large substrate 41, and is slightly smaller
`
`than the outer diameter of the small substrates 120. The plurality of accommodating
`
`grooves 511 of the large substrate 51 respectively accommodate a plurality of polishing
`
`units 12; the plurality of polishing units 12 and the large substrate 11 are fixed and bonded
`
`by means of close fit. In this embodiment, the polishing units 12 are mechanically
`
`squeezed into the metal accommodating grooves 511 of the large substrate 51 and are
`
`fixed using the deformation of the concave-convex structures, and finally, a bonding agent
`
`may be used to fill up the clearances.
`
`As shown in Fig. 5 and Fig. 7, a composite conditioner 6 in the sixth embodiment of
`
`the present invention is roughly the same as the composite conditioner 4 in the foregoing
`
`fourth embodiment in terms of structure except that the depth of a plurality of
`
`accommodating grooves 611 of a large substrate 61 is greater than the depth of the
`
`plurality of accommodating grooves 411 of the large substrate 41, and greater than the
`
`height of the small substrates 120. The plurality of accommodating grooves 611 of the
`
`large substrate 61 respectively accommodate a plurality of polishing units 12; the plurality
`
`of polishing units 12 and the large substrate 61 are fixed and bonded with a bonding agent
`
`13. The other side 124 of each of the plurality of small substrates 120 opposite to the side
`
`provided with a plurality of grits 121 has a certain distance from a plurality of bottom
`
`walls 612 forming bottoms of the plurality of accommodating grooves 611 of the large
`
`substrate 61; and the bonding agent 13 is respectively filled between the other side 124 of
`
`the plurality of grits 121 and the plurality of bottom walls 612.
`
`As shown in Fig. 3 and Fig. 8, a composite conditioner 7 in the seventh embodiment
`
`of the present invention is roughly the same as the composite conditioner 2 in the
`
`8
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`21100198
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`foregoing second embodiment in terms of structure except that a large substrate 71 is
`
`provided with a plurality of accommodating grooves 711 instead of the plurality of
`
`through holes 212 of the large substrate 21. The diameter of the plurality of
`
`accommodating grooves 711 is larger at the top and smaller at the bottom and the tilt angle
`
`of inner walls 713 is 1 to 15 degrees; the other side 124 of each of the small substrates 120
`
`opposite to the side provided with the plurality of grits 121 is inlaid in the lower end of
`
`one of the plurality of accommodating grooves 711 with a smaller diameter in a clamped
`
`manner, and the plurality of polishing units 12 protrude from a bonding surface 710; the
`
`plurality of inner walls 713 forming the plurality of accommodating grooves 711 of the
`
`large substrate 71 also have a plurality of concave-convex structures 714; the plurality of
`
`polishing units 12 and the large substrate 71 are fixed and bonds with a bonding agent 22.
`
`The other side 124 of each of the small substrates 120 opposite to the side provided with
`
`the plurality of grits 121 and the plurality of bottom walls 715 forming the plurality of
`
`accommodating grooves 711 of the large substrate 71 are on the same reference plane 14.
`
`As shown in Fig. 9, a composite conditioner 8 in the eighth embodiment of the present
`
`invention comprises a large substrate 81 and a plurality of polishing units 82, and the
`
`structures of the large substrate 81 and the plurality of polishing units 82 that use a
`
`bonding agent 83 for bonding or adopt close fit may be shown in the foregoing composite
`
`conditioners 1, 2, 3, 4, 5, 6 and 7 in the first embodiment to the seventh embodiment of the
`
`present invention. 8 polishing units 82 are arranged at an equal interval in a ring shape on
`
`the inner side of the periphery of the large substrate 81 in this embodiment and 4 polishing
`
`units 82 are arranged at an equal interval on the inner side of the forgoing 8 polishing units
`
`82 arranged at an equal interval in a ring shape. The special arrangement mode of the
`
`plurality of polishing units 82 in this embodiment can avoid the screw holes arranged on
`
`the lower end face of the large substrate 81.
`
`The grits of the present invention may be made of man-made or non-man-made
`
`diamond, polycrystalline diamond (PCD), cubic boron nitride (CBN), polycrystalline
`
`cubic boron nitride (PCBN), the hardest crystal, polycrystalline material, or a mixture of
`
`the foregoing materials. The grits of the present invention can be bonded to small
`
`substrates by methods such as bonding at high temperature and high pressure, brazing,
`
`sintering, electroplating, polymer gluing or ceramic bonding.
`
`The large substrate of the present invention is made of metal, metal alloy, polymer,
`
`ceramic product, carbon product, or a mixture of the foregoing materials, preferably 316L
`
`9
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`21100198
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`stainless steel.
`
`The bonding agent of the present invention is made of metal, metal alloy, polymer,
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`ceramic, or a mixture of the foregoing materials, polymer is a representative embodiment,
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`and the bonding agent may also be made of a welding alloy material.
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`The large substrate of the present invention may be in a disc shape, with a diameter of
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`approximately 90 to 120 mm. The small substrates may be in a disc shape, with a diameter
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`of approximately 10 to 30 mm, preferably 20 mm. The size of the grits is 100 to 500
`
`microns, preferably 160 to 200 microns. A preferred embodiment of the large substrate of
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`the present invention is stainless steel; a preferred embodiment of the bonding agent may
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`be resin; and a preferred embodiment of the method for fixing the grits and the small
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`substrates may be resin gluing or bonding by copper zinc alloy containing chromium and
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`titanium; the external surface of the small substrates has a nickel-containing electroplated
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`layer.
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`The present invention adopts a composite method, a plurality of polishing units are
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`manufactured at first, it is easier for smaller polishing units to make cutting ends of most
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`grits at the same height, then a large substrate bonds a plurality of polishing units to form a
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`large-area composite conditioner, and it is easier to make the cutting ends of most grits of
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`a large-area composite conditioner at the same height. The advantage of the present
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`invention is that the manufacturing of smaller polishing units has a lower cost and the
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`composite conditioner may change grits as needed. For example, diamonds in a larger
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`particle size may be used on the outer ring of the composite conditioner, and diamonds in a
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`smaller particle size may be used on the inner ring; or diamonds with a poor cutting ability,
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`but high wear resistance and a complete crystal form may be used on the outer ring, and
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`diamonds with a good cutting ability, but lower wear resistance and a poor crystal form
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`may be used on the inner ring. The diamond particles of the same small polishing unit are
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`the same in size, shape and material, but the diamond particles of a plurality of polishing
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`units in the composite conditioner may be the same or different in size, shape and material.
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`A plurality of polishing units are combined into a larger composite conditioner. The
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`cutting rate and wear rate of the composite conditioner can be controlled.
`
`The above record is only embodiments applying the technical content of the present
`
`invention. All the modifications and changes made by those skilled in the art by using the
`
`present invention shall fall in the scope of the claims of the present invention. The present
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`invention is not limited to the embodiments.
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`10
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`Page 13 of 58
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`KINIK EXHIBIT 1017
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`21100198
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`[BRIEF DESCRIPTION OF THE DRAWINGS]
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`Fig. 1 is a schematic view of a composite conditioner in the first embodiment of the
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`present invention.
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`Fig. 2 is a schematic view of A-A section in Fig. 1.
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`Fig. 3 is a sectional view of a composite conditioner in the second embodiment of the
`
`present invention.
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`Fig. 4A is a sectional view of a composite conditioner in the third embodiment of the
`
`present invention.
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`Fig. 4B is a schematic view of a composite conditioner in the third embodiment of the
`
`present invention.
`
`Fig. 5 is a schematic view of a composite conditioner in the fourth embodiment of the
`
`present invention.
`
`Fig. 6 is a sectional view of a composite conditioner in the fifth embodiment of the
`
`present invention.
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`Fig. 7 is a sectional view of a composite conditioner in the sixth embodiment of the
`
`present invention.
`
`Fig. 8 is a sectional view of a composite conditioner in the seventh embodiment of the
`
`present invention.
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`Fig. 9 is a sectional view of a composite conditioner in the eighth embodiment of the
`
`present invention.
`
`[Description of Reference Signs]
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`1, 2, 3, 4, 5, 6, 7, 8 composite conditioners
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`11, 21, 41, 51, 61, 71, 81 large substrates
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`110, 210, 410, 710 bonding surfaces
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`111, 211 bottom surfaces
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`112, 212 through holes
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`113, 213, 412, 713 inner walls
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`114, 214, 126, 316, 413, 714 concave-convex structures
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`12, 31, 82 polishing units
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`11
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`Page 14 of 58
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`KINIK EXHIBIT 1017
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`21100198
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`120, 310 small substrates
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`121, 311grits
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`122, 312 sides
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`123, 313 cutting ends
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`124, 314 the other sides
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`125, 315 outer walls
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`13, 22, 83 bonding agents
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`14 reference plane
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`15 plane
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`32 template
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`411, 511, 611, 711 accommodating grooves
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`414, 612, 715 bottom walls
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`
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`
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`12
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`Page 15 of 58
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`KINIK EXHIBIT 1017
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`21100198
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`VII. Claims:
`
`1. A composite conditioner, which is a conditioner used as a CMP pad, comprising:
`
`a large substrate, provided with a bonding surface, a bottom surface and a plurality
`
`of through holes or a plurality of accommodating grooves; and
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`a plurality of polishing units, respectively having a plurality of grits, which
`
`respectively have a plurality of cutting ends;
`
`wherein the plurality of through holes or the plurality of accommodating grooves
`
`respectively accommodate the plurality of polishing units, and the plurality of
`
`cutting ends respectively protrude from the bonding surface; the plurality of
`
`polishing units and the large substrate are fixed and bonded by means of a bonding
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`agent or close fit; and the height difference between the plurality of cutting ends of
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`the plurality of grits and a plane is within 20 microns.
`
`2.
`
`The composite conditioner according to claim 1, wherein the plurality of polishing
`
`units respectively comprise a small substrate; one side of each of the plurality of
`
`small substrates is respectively provided with the plurality of grits.
`
`3.
`
`The composite conditioner according to claim 2, wherein the large substrate is
`
`provided with a plurality of through holes; and the other side of each of the small
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`substrates opposite to the side provided with the plurality of grits and the bottom
`
`surface of the large substrate are on the same reference plane.
`
`4.
`
`The composite conditioner according to claim 2, wherein the large substrate is
`
`provided with a plurality of accommodating gr