(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2013/0078895 A1
`Mar. 28, 2013
`Dinh-Ngoc et al.
`(43) Pub. Date:
`
`US 2013 0078895A1
`
`(54)
`
`(71)
`
`(72)
`
`ABRASIVE TOOL FOR USE ASA CHEMICAL
`MECHANICAL PLANARIZATION PAD
`CONDITIONER
`
`Applicants: Charles Dinh-Ngoc, Holliston, MA
`(US); Srinivasan Ramanath, Holden,
`MA (US); Eric M. Schulz, Worcester,
`MA (US); Jianhui Wu, Westerville, MA
`(US); Thomas Puthanangady,
`Shrewsbury, MA (US); Ramanujam
`Vedantham, Worcester, MA (US);
`Taewook Hwang, Acton, MA (US)
`Inventors: Charles Dinh-Ngoc, Holliston, MA
`(US); Srinivasan Ramanath, Holden,
`MA (US); Eric M. Schulz, Worcester,
`MA (US); Jianhui Wu, Westerville, MA
`(US); Thomas Puthanangady,
`Shrewsbury, MA (US); Ramanujam
`Vedantham, Worcester, MA (US);
`Taewook Hwang, Acton, MA (US)
`
`(21)
`
`Appl. No.: 13/682,524
`
`(22)
`
`Filed:
`
`Nov. 20, 2012
`
`(63)
`
`(60)
`
`Related U.S. Application Data
`Continuation of application No. 12/631,326, filed on
`Dec. 31, 2009, now Pat. No. 8,342,910.
`Provisional application No. 61/162,893, filed on Mar.
`24, 2009, provisional application No. 61/235,980,
`filed on Aug. 21, 2009.
`Publication Classification
`
`(51)
`
`(52)
`
`Int. C.
`B24B 53/07
`U.S. C.
`CPC .................................... B24B53/017 (2013.01)
`USPC .......................................................... 451A443
`
`(2006.01)
`
`(57)
`ABSTRACT
`An abrasive tool including a CMP pad conditioner having a
`Substrate including a first major Surface, a second major Sur
`face opposite the first major Surface, and a side Surface
`extending between the first major Surface and the second
`major, whereina first layerofabrasive grains is attached to the
`first major Surface and a second layer of abrasive grains is
`attached to the second major surface. The conditioner further
`includes a first sealing member extending in a peripheral
`direction along a portion of the side Surface of the Substrate.
`
`
`
`221
`
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`
`
`Placing a first bonding layer material on a
`first major surface of a substrate
`
`101
`
`Placing a first layer of abrasive grains
`within the first bonding layer material
`
`103
`
`Placing a second bonding layer material on
`a second major surface of the Substrate
`
`105
`
`Placing a second layer of abrasive grains
`within the second bonding layer material
`
`107
`
`Forming a CMP pad conditioner having a
`first abrasive surface defined by the first
`layer of abrasive grains and a Second
`abrasive surface defined by the second
`layer of abrasive grains
`
`109
`
`FIG. 1
`
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`US 2013/0078895 A1
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`
`
`261
`
`
`
`257-1
`
`223
`
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`Patent Application Publication
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`Mar. 28, 2013 Sheet 4 of 22
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`US 2013/0078895 A1
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`257-1
`
`3OO
`
`
`
`331
`
`\
`
`221
`
`261
`
`203
`
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`US 2013/0078895 A1
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`400
`
`
`
`331
`
`\
`
`A
`
`M /N /\ M M /N M MM M
`
`
`
`500
`
`200
`
`501
`
`Page 6 of 46
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`Mar. 28, 2013 Sheet 6 of 22
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`US 2013/0078895 A1
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`600
`
`700
`
`
`
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`Mar. 28, 2013 Sheet 7 of 22
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`US 2013/0078895 A1
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`800
`
`N N N
`
`8
`
`NVY V YY VNVY
`9
`8
`223
`
`801
`
`81
`O
`
`a.
`E.
`
`900
`
`200
`
`221
`
`
`
`
`
`
`
`955
`
`934
`
`O1
`801
`
`AN
`931 223
`
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`Mar. 28, 2013 Sheet 8 of 22
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`US 2013/0078895 A1
`
`1034
`
`801.
`
`1031
`
`223
`
`955
`
`
`
`1103
`
`1108
`
`1102
`
`1105
`
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`US 2013/0078895 A1
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`1200
`
`1207
`
`1213
`
`1214
`
`FIG. 12A
`
`
`
`1200
`
`1207
`
`1209
`
`FIG. 12B
`
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`US 2013/0078895 A1
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`1250
`
`1202
`
`1217
`
`1219
`
`FIG. 12C
`
`
`
`1300
`
`1301
`
`1303
`t
`2
`
`1306
`1308
`
`\l
`1305
`2
`2 --
`2 2 1.
`
`71
`V
`
`1307
`
`1304
`
`FIG. 13
`
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`US 2013/0078895 A1
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`1400
`
`1402
`
`1500
`
`
`
`2OO
`
`1514
`
`1507
`
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`US 2013/0078895 A1
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`1600
`
`1603
`
`FIG. 16
`
`1700
`
`1701
`
`1703
`
`1705
`
`FIG. 17
`
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`Mar. 28, 2013 Sheet 13 of 22
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`US 2013/0078895 A1
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`
`
`1801
`
`FIG. 19
`
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`US 2013/0078895 A1
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`2000
`
`2100
`
`\
`
`
`
`FIG. 21
`
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`US 2013/0078895 A1
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`
`
`2310
`
`4
`
`FIG. 23
`
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`US 2013/0078895 A1
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`
`
`
`
`Fig.24A
`
`- 2436
`
`2409 -
`
`-24s,
`FIG.24B
`
`- 2436
`
`5
`
`A
`
`-24s
`
`2431
`
`2432
`
`A
`
`v
`
`FIG. 24C
`
`FIG.24D
`
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`US 2013/0078895 A1
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`2501
`
`MN
`
`2514
`
`2519
`
`2508
`2506
`
`
`
`2501
`
`2591
`
`FIG. 25B
`
`2507
`5
`
`2505
`
`2517
`
`2515
`
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`Mar. 28, 2013 Sheet 18 of 22
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`US 2013/0078895 A1
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`
`
`FIG. 25F
`
`FIG. 25G
`
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`US 2013/0078895 A1
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`2521
`
`2528
`
`2600
`
`
`
`2521
`
`M
`
`2513
`
`Page 20 of 46
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`Patent Application Publication
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`Mar. 28, 2013 Sheet 20 of 22
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`US 2013/0078895 A1
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`2722
`
`2513
`2721
`
`FIG. 27B
`
`
`
`FIG. 27C
`
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`Mar. 28, 2013 Sheet 21 of 22
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`US 2013/0078895 A1
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`2804
`
`
`
`FIG. 28A
`
`MN
`2861 y 2866
`
`2823
`
`FIG. 28B
`
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`Patent Application Publication
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`Mar. 28, 2013 Sheet 22 of 22
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`US 2013/0078895 A1
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`2800
`
`2831
`
`2805
`
`2804
`
`2803
`
`FIG. 28C
`
`
`
`2900
`
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`US 2013/0078895 A1
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`Mar. 28, 2013
`
`ABRASIVE TOOL FOR USE ASA CHEMICAL
`MECHANICAL PLANARIZATION PAD
`CONDITIONER
`
`CROSS-REFERENCE TO RELATED
`APPLICATION(S)
`0001. The present application is a Continuation of U.S.
`Non-Provisonal Patent Application No. 127651,326 (atty
`docket no. BD-06045-US), filed Dec. 31, 2009, entitled
`“Abrasive Tool For Use As A Chemical Mechanical Pla
`narization Pad Conditioner.” naming inventors Charles Dinh
`Ngoc, Srinivasan Ramanath, Eric M. Schulz, Jianhui Wu,
`Thomas Puthanangady, Ramanujam Vedantham, and Tae
`wook Hwang, and claims priority from (i) U.S. Provisional
`Patent Application No. 61/162,893, filed Mar. 24, 2009,
`entitled “Abrasive Tool For Use As A Chemical Mechanical
`Planarization Pad Conditioner naming inventors Charles
`Dinh-Ngoc, Srinivasan Ramanath, Eric M. Schulz, Jianhui
`Wu, Thomas Puthanangady, Ramanujam Vedantham, and
`Taewook Hwang, and (ii) U.S. Provisional Patent Application
`No. 61/235.980, filed August 21, 2009, entitled “Abrasive
`Tool For Use As A Chemical Mechanical Planarization Pad
`Conditioner.” naming inventors Charles Dinh-Ngoc, Srini
`vasan Ramanath, Eric M. Schulz, Jianhui Wu, Thomas Putha
`nangady, Ramanujam Vedantham, and Taewook Hwang,
`which applications are both incorporated by reference herein
`in their entirety
`
`BACKGROUND
`0002 1. Field of the Disclosure
`0003. The following application is directed to an abrasive
`tool, and more particularly to an abrasive tool for use as a
`chemical mechanical planarization pad conditioner.
`0004 2. Description of the Related Art
`0005. In the fabrication of electronic devices, multiple
`layers of various types of material are deposited including for
`example conducting, semiconducting, and dielectric materi
`als. Successive deposition or growth and removal of various
`layers results in a non-planar upper Surface. A wafer Surface
`that is not sufficiently planar will result in structures that are
`poorly defined, with the circuits being nonfunctional or
`exhibiting less than optimum performance. Chemical
`mechanical planarization (CMP) is a common technique used
`to planarize or polish workpieces such as semiconductor
`wafers.
`0006. During a typical CMP process, a workpiece is
`placed in contact with a polishing pad and a polishing slurry
`is provided on the pad to aid in the planarization process. The
`polishing slurry can include abrasive particles which may
`interact with the workpiece in an abrasive manner to remove
`materials, and may also act in a chemical manner to improve
`the removal of certain portions of the workpiece. The polish
`ing pad is typically much larger than the workpiece, and is
`generally a polymer material that can include certain features,
`such as micro-texture suitable for holding the slurry on the
`surface of the pad.
`0007. During such polishing operations, a pad conditioner
`is typically employed to move over the surface of the polish
`ing pad to clean the polishing pad and properly condition the
`Surface to hold slurry. Polishing pad conditioning is important
`to maintaining a desirable polishing Surface for consistent
`polishing performance, since the Surface of the polishing pad
`wears down over time and resulting in Smoothing of micro
`
`texture of the pad. Still, the conditioning operation faces
`certain obstacles, including the presence of polishing debris
`which can clog the components, chemical corrosion, condi
`tioner geometry irregularity, conditioner over-use, and grain
`pull-out, which can interfere with conditioning operations
`and damage the sensitive electronic components being pol
`ished.
`0008 Accordingly, the industry continues to demand
`improved CMP pad conditioners and methods of forming
`thereof.
`
`SUMMARY
`0009. According to a first aspect an abrasive tool includes
`a CMP pad conditioner having a substrate including a first
`major Surface and a second major Surface opposite the first
`major Surface, a first layer of abrasive grains attached to the
`first major Surface, and a second layer of abrasive grains
`attached to the second major Surface. The abrasive tool can
`further include a first indicia on the Substrate corresponding
`to the first major Surface and identifying a wear status of the
`first layer of abrasive grains.
`0010. In another aspect, an abrasive tool includes a CMP
`pad conditioner having a Substrate including a first major
`Surface, a second major Surface opposite the first major Sur
`face, and a side Surface extending between the first major
`surface and the second major. The CMP pad conditioner
`further includes a first layer of abrasive grains attached to the
`first major surface, a second layer of abrasive grains attached
`to the second major surface, and a first sealing member
`extending in a peripheral direction along a portion of the side
`surface of the substrate.
`0011. In still other aspects, an abrasive tool for use as a
`CMP pad conditioner is disclosed that includes a plate, and an
`abrasive article that includes a Substrate having a first major
`Surface and a second major Surface opposite the first major
`surface. The CMP pad conditioner also includes a first layer
`ofabrasive grains attached to the first major Surface, a second
`layer of abrasive grains attached to the second major Surface,
`and an engagement structure configured to engage a portion
`of the plate and removably couple the abrasive article and the
`plate.
`0012. Other aspects are directed to an abrasive tool for use
`as a CMP pad conditioner including a plate and an abrasive
`article having a Substrate including a first major Surface and a
`second major Surface opposite the first major surface, a first
`layerofabrasive grains attached to the first major Surface, and
`a second layer of abrasive grains attached to the second major
`surface. The abrasive tool is formed such that the plate and
`abrasive article are removably coupled via a coupling mecha
`nism.
`0013. In accordance with another aspect, an abrasive tool
`for use as a CMP pad conditioner includes an abrasive article
`made of a Substrate having a first major Surface and a second
`major Surface opposite the first major surface, a first layer of
`abrasive grains attached to the first major Surface, and a
`second layer of abrasive grains attached to the second major
`Surface. In particular, the plate includes a magnet for remov
`ably coupling the plate and abrasive article.
`0014. According to still another aspect, an abrasive tool
`for use as a CMP pad conditioner is disclosed that includes a
`plate comprising a recess, and an abrasive article removably
`coupled within the recess. The abrasive article includes a
`Substrate having a first major Surface and a first layer of
`abrasive grains attached to the first major Surface, and
`
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`
`wherein the first layer of abrasive grains have a flatness of not
`greater than about 0.02 cm as measured by optical auto
`focusing technology.
`0015. Other aspects of the present disclosure are directed
`to a method of forming an abrasive article that includes the
`steps of placing a first bonding layer material on a first major
`Surface of a Substrate, wherein the Substrate comprises an
`engagement structure configured to removably couple the
`Substrate to a plate, and placing a first layer of abrasive grains
`within the first bonding layer material. The method further
`includes placing a second bonding layer material on a second
`major surface of the Substrate, wherein the second major
`Surface is opposite the first major Surface, placing a second
`layer of abrasive grains within the second bonding layer
`material, and forming a CMP pad conditioner comprising a
`first abrasive surface defined by the first layer of abrasive
`grains on the first major Surface and a second abrasive Surface
`defined by the second layer of abrasive grains on the second
`major Surface.
`0016. In another aspect an abrasive tool includes a CMP
`pad conditioner made of a Substrate having a first major
`Surface and a second major Surface opposite the first major
`Surface, wherein the first major Surface includes an abrasive
`texture including a first upper Surface defined by upper por
`tions of a first set of protrusions extending from a lower
`Surface defined by a first set of grooves separating the first set
`of protrusions. The second major Surface includes an abrasive
`texture including a second upper Surface defined by upper
`portions of a second set of protrusions extending from a lower
`Surface defined by a second set of grooves separating the
`second set of protrusions.
`0017. According to still another aspect, a method of dress
`ing a CMP pad is disclosed that includes the steps of coupling
`an abrasive article to a dressing machine, the abrasive article
`includes a Substrate having a first major Surface and a second
`major Surface opposite the first major Surface, wherein the
`abrasive article includes a first abrasive surface at the first
`major Surface of the Substrate, and a second abrasive Surface
`at the second major surface of the substrate, and wherein the
`abrasive article is mounted on the dressing machine to expose
`the first abrasive surface. The method further includes con
`tacting the first abrasive surface to a surface of a first CMP pad
`and moving the first CMP pad relative to the first abrasive
`surface to condition the first CMP pad, inverting the abrasive
`article to expose the second abrasive surface, and contacting
`the second abrasive surface to a surface of a second CMP pad
`and moving the second CMP pad relative to the second abra
`sive surface to condition the second CMP pad.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`0018. The present disclosure may be better understood,
`and its numerous features and advantages made apparent to
`those skilled in the art by referencing the accompanying
`drawings.
`0019 FIG. 1 includes a flowchart for forming an abrasive
`article in accordance with an embodiment.
`0020 FIGS. 2A-2E include cross-sectional illustrations of
`an abrasive article in accordance with an embodiment.
`0021
`FIG. 3 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0022 FIG. 4 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`
`0023 FIG. 5 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0024 FIG. 6 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0025 FIG. 7 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0026 FIG. 8 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0027 FIG. 9 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0028 FIG. 10 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0029 FIG. 11 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0030 FIG. 12A includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0031 FIGS. 12B-12C include top views of an abrasive
`tool in accordance with an embodiment.
`0032 FIG. 13 includes a top view of an abrasive tool in
`accordance with an embodiment.
`0033 FIG. 14 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0034 FIG. 15 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0035 FIG. 16 includes a top view of an abrasive tool in
`accordance with an embodiment.
`0036 FIG. 17 includes a top view of an abrasive tool in
`accordance with an embodiment.
`0037 FIG. 18 includes a top view of an abrasive tool in
`accordance with an embodiment.
`0038 FIG. 19 includes a top view of an abrasive tool in
`accordance with an embodiment.
`0039 FIG. 20 includes a top view of an abrasive tool in
`accordance with an embodiment.
`0040 FIG. 21 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`FIG. 22 includes a cross-sectional illustration of a
`0041
`portion of an abrasive tool in accordance with an embodi
`ment.
`0042 FIG. 23 includes a cross-sectional illustration of a
`portion of an abrasive tool in accordance with an embodi
`ment.
`0043 FIGS. 24A-24D include illustrations of a method of
`using an abrasive article for conducting a CMP pad condi
`tioning operation in accordance with an embodiment.
`0044 FIG. 25A includes a top view of a backside of a plate
`in accordance with an embodiment.
`004.5
`FIG. 25B includes a cross-sectional illustration of a
`portion of the plate of FIG. 25A in accordance with an
`embodiment.
`0046 FIG. 25C includes a cross-sectional illustration of a
`CMP pad conditioner in accordance with an embodiment.
`
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`
`0047 FIGS. 25D-25G include cross-sectional illustra
`tions of portions of side regions of a CMP pad conditioner in
`accordance with embodiments.
`0.048
`FIG. 26A includes a cross-sectional illustration of a
`conditioning system including a plate and CMP pad condi
`tioner in accordance with an embodiment.
`0049 FIG. 26B includes a cross-sectional illustration of a
`conditioning system including a plate and CMP pad condi
`tioner in accordance with an embodiment.
`0050 FIGS. 27 A-27C include cross-sectional illustra
`tions of a portion of a CMP pad conditioner and plate in
`accordance with an embodiment.
`0051
`FIG. 28A includes a top view of a plate in accor
`dance with an embodiment.
`0.052
`FIG. 28B includes a cross-sectional illustration of
`the plate of FIG. 28A in accordance with an embodiment.
`0053 FIG. 28C includes a top view of a plate and CMP
`pad conditioner in accordance with an embodiment.
`0054 FIG. 29 includes a top view illustration of an abra
`sive tool in accordance with an embodiment.
`0055. The use of the same reference symbols in different
`drawings indicates similar or identical items.
`
`DETAILED DESCRIPTION
`0056. The following is directed to an abrasive tool for use
`as a chemical mechanical planarization (CMP) pad condi
`tioner, also referred to as a dresser. The abrasive tool includes
`a plurality of features including anabrasive article having two
`(first and second) abrading Surfaces and coupling mecha
`nisms for removably coupling the abrasive article with a
`fixture or plate. The abrasive tool can include different types
`of engagement structures facilitating removal and reversing
`of the abrasive tool such that both first and second abrading
`Surfaces are useable.
`0057 FIG. 1 includes a flowchart demonstrating a method
`of forming an abrasive tool in accordance with an embodi
`ment. As illustrated, the process can be initiated at step 101 by
`placing a first bonding layer material on a first major Surface
`of a substrate.
`0058 Generally, the substrate is made of a material suit
`able for withstanding the rigors of abrasive processing. For
`example, the Substrate can be a material having an elastic
`modulus of at least 2E3 MPa. In other embodiments, the
`Substrate may be made of a material having a greater elastic
`modulus, such as on the order of at least about 5E3 MPa, such
`as at least about 1E4MPa, or even at least about 1E5 MPa. In
`particular instances, the Substrate material has an elastic
`modulus within a range between about 2E3 MPa and about
`4E5.
`0059 For example, the substrate can include materials
`Such as metals, metal alloys, ceramics, polymers, or a com
`bination thereof. In accordance with one particular embodi
`ment, the Substrate is made of a metal alloy, such as Steel. For
`Some embodiments, as will be appreciated herein, the Sub
`strate can include a material that is magnetized or capable of
`being magnetized.
`0060. The substrate can have a certain shape, including for
`example, a generally disk-like shape having a first major
`Surface and a second major Surface that are opposite each
`other and substantially parallel with each other. The first
`major Surface and second major surface can be connected by
`a side surface that defines the height of the substrate. While
`the Substrate can have a disk-like shape with a circular con
`tour, such that the shape of the substrate is cylindrical, other
`
`shapes are contemplated. For example, the Substrate can have
`a rectangular or polygonal shape. Such that the Substrate has
`Substantially planar sides that may be parallel to each other.
`Notably, the substrate can include other features (e.g.,
`engagement structures) that will be described in more detail
`herein.
`Placement of a first bonding layer material on the
`0061
`first major surface of the Substrate can include the application
`of a layer of material, which may be applied to the substrate
`surface in the form of a film, foil, tape, or the like. Typically,
`the application of the bonding layer material is in a manner
`Such that the bonding layer has a Sufficient thickness to con
`tain abrasive grains therein and form a homogeneous bonding
`layer material during processing. For example, in one
`embodiment, the bonding layer material can include a metal
`or metal alloy. Particularly useful metals can include transi
`tion metals. For example, the bonding layer material can be a
`braze material that includes transition metals such as nickel,
`chromium, titanium, tin, gold, palladium, silver, and a com
`bination thereof.
`0062. In still other embodiments, the first bonding layer
`material can be a polymer material. Particularly suitable poly
`mer bonding layer materials can include thermoplastics and
`thermosets, polyamides, polyimides, polyesters, polyethers,
`fluoropolymers, and a combination thereof. For example,
`particularly suitable polymer materials for use in the first
`bonding layer can include epoxies, acrylics, and a combina
`tion thereof. Certain bonding layer materials can also incor
`porate phenol formaldehyde.
`0063. The first bonding layer material can include fillers,
`which may improve the mechanical characteristics of the
`bond material making the bond material more durable. Addi
`tionally, filler particles can be used to match the coefficient of
`thermal expansion of braze-filler combination to that of
`braze-abrasive combination to inhibit out-of-flatness. Like
`wise, suchinert fillers can be used to prevent sticking of braze
`to the plate or refractory on which the unfinished tool rests
`during thermal processing, so as to inhibit out-of-flatness. In
`addition, such inert fillers may improve wear resistance and
`can operate as an abrasive, if so desired.
`0064. After placing a first bonding layer material on a first
`major surface at step 101, the process continues at step 103 by
`placing a first layer of abrasive grains within the first bonding
`layer material. Various methods may be used for placement of
`the abrasive grains within the bonding layer material. For
`example, the abrasive grains may be placed within the bond
`ing layer in a random arrangement having no short range or
`long range order. Alternatively, the placement of the abrasive
`grains may be completed in a manner Such that the grains have
`a pattern, and even arranged in a pattern having long range
`order, Such as an array (e.g., face centered cubic pattern, cubic
`pattern, hexagonal pattern, rhombic pattern, spiral pattern,
`random pattern, and combinations of Such patterns). In par
`ticular instances, the abrasive grains may be placed at par
`ticular locations within the bonding layer such that they are
`arranged in a self-avoiding random distribution (i.e., a
`SARDTM pattern), which is particularly suitable for condi
`tioning CMP pads.
`0065. The abrasive grains may be particularly hard mate
`rials, such that the abrasive grains can have a Vickers hardness
`of at least about 1500 kg/mm. In particular instances, the
`abrasive grains can include materials such as oxides, borides,
`nitrides, carbides, carbon-based structures (including man
`made carbon-based materials such as fullerenes), and a com
`
`Page 26 of 46
`
`KINIK EXHIBIT 1012
`
`

`

`US 2013/0078895 A1
`
`Mar. 28, 2013
`
`bination thereof. In some instances, Superabrasive materials
`Such as cubic boron nitride or diamond can be used as the
`abrasive grains.
`0066. The abrasive grains can have an average grit size
`suitable for conditioning pads in CMP processing. For such
`applications, the average grit size can be less than about 250
`microns. However, in other instances, Smaller abrasive grains
`may be used Such that the average grit size is not greater than
`about 200 microns, not greater than about 100 microns, or
`even not greater than about 50 microns. In particular
`instances, the abrasive grains have an average grit size within
`a range between about 1 micron and about 250 microns. Such
`as within a range between about 1 micron and about 100
`microns.
`0067. After placing the first layer of abrasive grains within
`the first bonding layer material at step 103, the process can
`continue at Step 105 by placing a second bonding layer mate
`rial on a second major Surface of the Substrate. As described
`above, the Substrates can have a disk like or cylindrical shape
`Such that the first major Surface and second major Surface are
`opposite to and substantially parallel with each other. The first
`and second major Surfaces can be spaced apart from each
`other and connected to each other by the side surface. Place
`ment of the second bonding layer material can include pro
`cesses that are similar to, or the same as, the placement of the
`first bonding layer material on the first major Surface. In
`particular processes, the placement of the second bonding
`layer may include Suspension of the Substrate Such that the
`completed first bonding layer material and the first layer of
`abrasive grains are not in contact with any surfaces. Suspen
`sion of the Substrate while forming the second bonding layer
`avoids a change in the placement or orientation of the first
`layer of abrasive grains, or even dulling of the first layer of
`abrasive grains. The Substrate may be suspended using
`mechanical means, pressurized means, or the like.
`0068. In accordance with one embodiment, the second
`bonding layer material can be the same bonding layer mate
`rial as the first bonding layer material. Still, in alternative
`designs, it may be Suitable that the second bonding layer
`material be a different material than the first bonding layer
`material. Such designs may be suitable for varying the capa
`bilities of the abrasive article such that the first bonding layer
`material is Suitable for a first type of dressing operation and
`the second major surface of the substrate is suitable for a
`different dressing operation.
`0069. After placing the second bonding layer material on
`the second major Surface at step 105, the process can continue
`at step 107 by placing a second layer of abrasive grains within
`the second bonding layer material. Like step 102 described
`above, the placement of the second layer of abrasive grains
`can be completed in a random arrangement, a patterned
`arrangement, or even a self-avoiding random distribution
`(SARDTM). Moreover, the second layerofabrasive grains can
`have the same arrangement as the first layer of abrasive
`grains.
`0070 Additionally, the abrasive grains used in the second
`layer can be the same as the abrasive grains of the first layer,
`including the same type of material and the same average grit
`size. However, in particular embodiments, the abrasive grains
`of the second layer can be different from the abrasive grains
`used in the first layer of abrasive grains. Use of different
`abrasive grains between the first major Surface and second
`major Surface may facilitate formation of an abrasive article
`capable of conducting different dressing operations. For
`
`example, the abrasive grains of the second layer may contain
`a different type of material than the abrasive grains of the first
`layer. In some designs, the abrasive grains of the second layer
`can have a different average grit size for completing a differ
`ent dressing operation either on the same CMP pad or a
`different type of CMP pad.
`0071. After placing the second layer of abrasive grains
`within the second bonding layer material at step 107, the
`process continues at step 109 by heating the substrate to form
`a CMP pad conditioner. Heating can be completed in a man
`ner suitable for forming a braze layer from the first and second
`bonding layer material to secure the abrasive grains to the
`substrate.
`0072. In particular embodiments, the process of heating
`includes Suspending the Substrate material, such the abrasive
`grains of the first layer and the second layer are spaced apart
`from any contact surfaces. Such an arrangement avoids reori
`enting, rotating, and/or dulling of the abrasive grains during
`processing. In certain processes, during heating the Substrate
`can be suspended in a vertical position above the furnace
`floor, such that the substrate is oriented at a perpendicular
`angle to the furnace floor. In other embodiments, the substrate
`can be suspended in a horizontal position above the furnace
`floor, such that the first major surface and second major
`surface are substantially parallel to the furnace floor. And still,
`in other embodiments, the substrate may be angled relative to
`the furnace floor, such that the first major Surface and second
`major Surface of the Substrate are neither parallel nor perpen
`dicular to the furnace floor.
`0073. According to one process, the substrate may change
`position during the heating process relative to a starting posi
`tion and a stopping position. Changing the position of the
`Substrate during heating can facilitate the formation of an
`abrasive article having a particular uniform bonding layer
`while also facilitating maintaining the original position of the
`