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`Application Data Sheet 37 CFR 1.76
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`Attorney Docket Number 02074-24012.NP.CIP2
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`.
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`Application Number
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`Title of Invention
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`CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED METHODS
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`The application data sheet is part of the provisional or nonprovisional application for which it is being submitted. The following form contains the
`bibliographic data arranged in a format specified by the United States Patent and Trademark Office as outlined in 37 CFR 1.76.
`This document may be completed electronically and submitted to the Office in electronic format using the Electronic Filing System (EFS) or the
`document may be printed and included in a paper filed application.
`
`
`
`Secrecy Order 37 CFR 5.2
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`I:I Portions or all of the application associated with this Application Data Sheet may fall under a Secrecy Order pursuant to
`37 CFR 5.2 (Paper filers only. Applications that fall under Secrecy Order may not be filed electronically.)
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`Inventor
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`1
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`Inventor Information:
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`Legal Name
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`Prefix Given Name
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`Middle Name
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`Family Name
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`Suffix
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`Residence Information (Select One) 0 US Residency
`(9 Non US Residency 0 Active US Military Service
`City
`Tansui
`Country of Residence i
`ITW
`
`
`
`
`
`Mailing Address of Inventor:
`
`Address 1
`
`Address 2
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`4, Lane 32, Chung—Cheng Road
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`City
`Postal Code
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`Tansui, Taipei County
`251
`
`StatelProvince
`TW
`
`Inventor Information blocks may be
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`Correspondence Information:
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`Enter either Customer Number or complete the Correspondence Information section below.
`For further information see 37 CFR 1.33(a).
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`Customer Number
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`20551
`
`Email Address
`
` Addams"
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`|:| An Address is being provided for the correspondence Information of this application.
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`CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED METHODS
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`Application Information:
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`Title of the Invention
`
`
`
`Attorney Docket Number
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`Nonprovisional
`Application Type
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`
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`Utility
`Subject Matter
` Total Number of Drawing Sheets (if any)
`Suggested Figure for Publication (if any)
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`02074-24012.NP.C|P2
`
`Application Data Sheet 37 CFR 1.76
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`Application Number
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`Title of Invention
`CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED METHODS
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`Publication Information:
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`|:| Request Early Publication (Fee required at time of Request 37 CFR 1.219)
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`El
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`Request Not to Publish. I hereby request that the attached application not be published under
`35 U.S.C. 122(b) and certify that the invention disclosed in the attached application has not and will not be the
`subject of an application filed in another country, or under a multilateral international agreement, that requires
`publication at eighteen months after filing.
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`Representative Information:
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`@ Customer Number
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`0 us Patent Practitioner 0 Limited Recognition (37 CFR11_9)
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`When referring to the current application, please leave the application number blank.
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`Prior Application Status
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`Pending
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`Continuity Type
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`Continuation in part of
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`Pending
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`Continuity Type
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`Continuation in pad of
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`Expired
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`Claims benefit of provisional
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` Continuation in part of
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`Pending
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`Patented
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`Application Number
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`Prior Application Status
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`Application Number
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`13802112
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`Application Number
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`13479148
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`Prior Application Status
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`Application Number
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`Prior Application Status
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`2013-03-13
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`2012-05-23
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`Filing Date (YYYY-MM-DD)
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`2011-05-23
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`Filing Date (YYYY-MM-DD)
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`2013—03—12
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`13802112
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`13479148
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`CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED METHODS
`Title of Invention
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`Application Number
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`Application Data Sheet 37 CFR 1.76
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`Application
`Number
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`ContinUIty Type
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`Prior Application
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`Filing Date
`(YYYY—M M—DD)
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`13797704
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`Continuation in part of
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`12726786
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`2010-03-18
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`Patented
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`Application
`Number
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`ContinUIty Type
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`Filing Date
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`12726786
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`Continuation in part of
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`12255823
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`2008-10-22
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`Patented
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`Number
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`ContinUIty Type
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`Prior Application
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`Filing Date
`(YYYY-M M-DD)
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`12255823
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`Continuation in part of
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`12168110
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`2008-07-05
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`Prior Application Status
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`Expired
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`Patent Number
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`8622787
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`ISSUE Date
`(YYYY-MM-DD)
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`2014-01-07
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`Remove
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`Patent Number
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`8393934
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`ISSUE Date
`(YYYY—MM—DD)
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`2013-03-12
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`Patent Number
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`8398466
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`ISSUE Date
`(YYYY-MM-DD)
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`2013-03-19
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`Application Number
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`Continuity Type
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`Prior Application Number
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`Filing Date (YYYY-MM-DD)
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`12168110
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`Claims benefit of provisional
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`60976198
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`2007-09-28
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`Patented
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`Prior Application Status
`Afi‘tifiiii?”
`ContinUiWTvpe
`12726786
`Continuation in part of
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`misfit?”
`11560817
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`(Yttlt’moiitfim
`2006-11-16
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`PatentNumber
`7762872
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`(visit/$1130)
`2010-07-27
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`11357713
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`Prior Application Number
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`60681798
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`Prior Application Number
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`11223786
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`Filing Date (YYYY-MM-DD)
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`2006-02-17
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`Filing Date (YYYY-MM-DD)
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`2005-05-16
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`Filing Date (YYYY-MM-DD)
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`2005-09-09
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`Prior Application Number
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`61246816
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`Prior Application Number
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`13034213
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`Filing Date (YYYY-MM-DD)
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`2009-09-29
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`Filing Date (YYYY-MM-DD)
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`2011-02-24
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`11560817
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`11357713
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`Continuation in part of
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`Expired
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`Claims benefit of provisional
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`Prior Application Status Abandoned
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`Application Number
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`11560817
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`Continuity Type
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`Continuation in part of
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`Patented
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`Application Data Sheet 37 CFR 1.76
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`
`Application Number
`
`
`CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED METHODS
`Title of Invention
`
`
`
`
`Application Number
`
`Continuity Type
`
`Prior Application Number
`
`Filing Date (YYYY-MM-DD)
`
`Claims benefit of provisional
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`61333162
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`2010-05-10
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` 13034213
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`Applications
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`contains, or contained at any time, a claim to a claimed invention that has an effective filing date on or after March
`|:| 16, 2013.
`NOTE: By providing this statement under 37 CFR 1.55 or 1.78, this application, with a filing date on or after March
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`Thorpe North & Western, LLP
`Attorney Docket No.: 02074—24012.NP.CIP2
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`CMP PAD DRESSERS HAVING LEVELED TIPS AND ASSOCIATED
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`METHODS
`
`5
`
`PRIORITY DATA
`
`This application is a continuation-in-part of U. S. Patent Application Serial No.
`
`13/802,112, filed on March, 13, 2013, which is a continuation-in—part of United States
`
`Patent Application Serial No. 13/479,148, filed on May 23, 2012, which claims the
`
`benefit of U. S. Provisional Patent Application Serial no. 61/489,074, filed on May 23,
`
`10
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`2011. This application is also a continuation-in-part of U. S. Patent Application Serial
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`No. 13/797,704, filed March 12, 2013, which is a continuation-in-part of US. Patent
`
`Application Serial No. 12/726,786, filed on March 18, 2010, which is a is a continuation-
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`in-part of US. Patent Application Serial No. 12/255,823, filed October 22, 2008, which is
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`a continuation-in-part of US. Patent Application Serial No. 12/168,110, filed on July 5,
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`2008, which claims the benefit of US. Provisional Patent Application Serial No.
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`60/976,198, filed September 28, 2007. US. Patent Application Serial No. 12/726,786,
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`filed on March 18, 2010 is also a continuation-in-part of US. Patent Application Serial
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`No. 11/560,817, filed November 16, 2006, which is a continuation-in—part of US. Patent
`
`Application Serial No. 11/357,713, filed February 17, 2006, which claims the benefit of
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`20 US. Provisional Patent Application Serial No. 60/681,798, filed May 16, 2005. US.
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`Patent Application Serial No. 11/560,817 is additionally a continuation-in-part of US.
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`Patent Application Serial No. 11/223,786, filed September 9, 2005. US. Patent
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`Application Serial No. 13/797,704 is also a continuation-in-part of US. Patent
`
`Application Serial No. 12/850,747, filed August 5, 2010, which claims the benefit of
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`United States Provisional Patent Application Serial No. 61/246,816, filed on September
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`29, 2009. US. Patent Application Serial No. 13/797,704 is fiarther a continuation-in—part
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`of US. Patent Application Serial No. 13/034,213, filed February 24, 2011, which claims
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`the benefit of US. Provisional Patent Application Serial No. 61/333,162, filed on May
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`10, 2010. Each of these applications is incorporated herein by reference.
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`KINIK EXHIBIT 1002
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`KINIK EXHIBIT 1002
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`Thorpe North & Western, LLP
`Attorney Docket No.: 02074—24012.NP.CIP2
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`BACKGROUND OF THE INVENTION
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`The semiconductor industry currently spends in excess of one billion US. dollars
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`each year manufacturing silicon wafers that must exhibit very flat and smooth surfaces.
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`Known techniques to manufacture smooth and even-surfaced silicon wafers are plentiful.
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`The most common of these involves the process known as Chemical Mechanical
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`Polishing (CMP) which includes the use of a polishing pad in combination with an
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`abrasive slurry. Of central importance in all CMP processes is the attainment of high
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`performance levels in aspects such as uniformity of polished wafer, smoothness of the IC
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`circuitry, removal rate for productivity, longevity of consumables for CMP economics,
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`etc.
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`SUMMARY OF THE INVENTION
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`The present disclosure provides CMP pad dressers and associated methods,
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`including without limitation, methods directed to the manufacture and use of such
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`dressers. In one aspect, for example, a CMP pad dresser can include a support substrate
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`and a plurality of superabrasive particles secured to the support substrate with each
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`superabrasive particle extending away from the support substrate to a protrusion distance.
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`The plurality of superabrasive particles can be positioned such that the highest protruding
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`tip of each of the plurality of superabrasive particles align along a designated profile with
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`a tip variation of from about 5 microns to about 100 microns. In another aspect, the
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`highest protruding tip of each of the plurality of superabrasive particles align along the
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`designated profile with a tip variation of from about 10 microns to about 50 microns. In
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`yet another aspect, the highest protruding tip of each of the plurality of superabrasive
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`particles align along the designated profile with a tip variation of from about 20 microns
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`to about 40 microns. In a filrther aspect, the highest protruding tip of each of the plurality
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`of superabrasive particles align along the designated profile with a tip variation of less
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`than about 20 microns. The designated profile can include any geometric configuration
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`that can be useful in dressing a CMP pad, and any such configuration is considered to be
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`within the present scope. Non-limiting examples can include a plane, a slope, a curved
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`shape, a dome shape, and the like, including appropriate combinations thereof
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`KINIK EXHIBIT 1002
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`Thorpe North & Western, LLP
`Attorney Docket No.: 02074—24012.NP.CIP2
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`The positioning of superabrasive particles relative to the support substrate can
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`also be described in terms of the depths that the superabrasive particles cut into a CMP
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`pad when used to abrade the CMP pad. In one aspect, for example, the protrusions of the
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`plurality of superabrasive particles produce cutting depths of less than about 20 microns
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`5
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`when used to abrade a CMP pad. In another aspect, the protrusions of the plurality of
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`superabrasive particles produce cutting depths of from about 1 micron to about 20
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`microns when used to abrade a CMP pad. In yet another aspect, the protrusions of the
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`plurality of superabrasive particles produce cutting depths of from about 10 microns to
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`about 20 microns when used to abrade a CMP pad.
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`10
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`As another exemplary aspect of the present disclosure, a CMP pad dresser can
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`include a rigid support substrate and a mono layer of a plurality of superabrasive particles
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`coupled to the support substrate, where each superabrasive particle in the mono layer
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`extends from the support substrate to a protrusion distance. In one aspect, the difference
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`in protrusion distance between the highest protruding tip and the second highest
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`protruding tip of the mono layer of superabrasive particles is less than or equal to about 50
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`microns, and the difference in protrusion distance between the highest 1% of the
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`protruding tips of the mono layer of superabrasive particles is within about 80 microns or
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`less. In another aspect, the difference in protrusion distance between the highest
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`protruding tip and the second highest protruding tip is less than or equal to about 10
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`20
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`microns. In yet another aspect, the difference in protrusion distance between the highest
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`protruding tip and the second highest protruding tip is less than or equal to about 10
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`microns. In a fiarther aspect, the difference in protrusion distance between the highest
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`protruding tip and the 10th highest protruding tip is less than or equal to about 20 microns.
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`In yet another aspect, the difference in protrusion distance between the highest protruding
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`tip and the 100th highest protruding tip is less than or equal to about 40 microns.
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`As yet another exemplary aspect of the present disclosure, a CMP pad dresser can
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`include a rigid support substrate and a mono layer of a plurality of superabrasive particles
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`coupled to the support substrate, where the plurality of superabrasive particles includes a
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`plurality of working superabrasive particles, such that rotating the dresser against a CMP
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`pad cuts asperities into the CMP pad having a cutting depth of less than or equal to about
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`50 microns. In another aspect, the cutting depth is from about 10 microns to about 50
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`Thorpe North & Western, LLP
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`microns. In yet another aspect, the plurality of working superabrasive particles includes
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`at least 100 working superabrasive particles. In a fiarther aspect, the plurality of working
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`superabrasive particles includes at least 1000 working superabrasive particles. In yet
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`another aspect, the plurality of working superabrasive particles includes from about 1000
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`5
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`to about 6000 working superabrasive particles. In another aspect, the plurality of
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`working superabrasive particles includes from about 2000 to about 5000 working
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`superabrasive particles. In a fiarther aspect, the plurality of working superabrasive
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`particles include at least about 1000 working superabrasive particles that protrude from
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`the rigid support substrate to distances within about 30 microns of one another.
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`10
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`As another exemplary aspect of the present disclosure, a method of dressing a
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`CMP pad can include applying a CMP pad dresser to a CMP pad, and moving at least one
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`of the CMP pad or the CMP pad dresser with respect to one another to cut asperities into
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`the CMP pad having a cutting depth of from about 10 microns to about 50 microns.
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`As a fiarther exemplary aspect of the present disclosure, a CMP pad dresser is
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`15
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`provided including a support substrate and a plurality of superabrasive particles secured
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`to the support substrate and positioned to engage and dress a CMP pad, where the
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`plurality of superabrasive particles cut to depths of less than 50 microns into a CMP pad
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`during a dressing procedure.
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`There has thus been outlined, rather broadly, various features of the invention so
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`20
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`that the detailed description thereof that follows may be better understood, and so that the
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`present contribution to the art may be better appreciated. Other features of the present
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`invention will become clearer from the following detailed description of the invention,
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`taken with the accompanying claims, or may be learned by the practice of the invention.
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`BRIEF DESCRIPTION OF THE DRAWINGS
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`FIG. 1 is a schematic side view of a CMP pad dresser in accordance with an
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`embodiment of the present disclosure;
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`FIG. 2 is a schematic side view of a CMP pad dresser in accordance with an
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`embodiment of the present disclosure;
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`FIG. 3 is a schematic side view of a CMP pad dresser in accordance with an
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`embodiment of the present disclosure; and
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`Thorpe North & Western, LLP
`Attorney Docket No.: 02074—24012.NP.CIP2
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`FIG. 4 is a schematic side view of a CMP pad dresser in accordance with an
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`embodiment of the present disclosure.
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`It will be understood that the above figures are merely for illustrative purposes in
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`5
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`furthering an understanding of the invention. Further, the figures are not drawn to scale,
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`thus dimensions, particle sizes, and other aspects may, and generally are, exaggerated to
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`make illustrations thereof clearer. Therefore, departure can be made from the specific
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`dimensions and aspects shown in the figures in order to produce the heat spreaders of the
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`present invention.
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`1 0
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`DETAILED DESCRIPTION
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`Before the present invention is disclosed and described, it is to be understood that
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`this invention is not limited to the particular structures, method steps, or materials
`
`disclosed herein, but is exte