`
`(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2007/0145255 A1
`(43) Pub. Date: Jun. 28, 2007
`
`Nishikawa et al.
`
`(54) LENS-EQUIPPED LIGHT-EMITTING DIODE
`DEVICE AND METHOD OF
`MANUFACTURING THE SAME
`
`(76)
`
`Inventors: Shouichi Nishikawa, Yokohama-shi
`(JP); Tetsuro Komatsu, Yokohama-shi
`(JP); Hatsuo Takezawa, Yokohama-shi
`(JP); Yukinori Aoki, Yokohama-shi (JP)
`
`Correspondence Address:
`OBLON, SPIVAK, MCCLELLAND, MAIER &
`NEUSTADT, RC.
`1940 DUKE STREET
`
`ALEXANDRIA, VA 22314 (US)
`
`(21) Appl. No.:
`
`11/613,503
`
`(22)
`
`Filed:
`
`Dec. 20, 2006
`
`(30)
`
`Foreign Application Priority Data
`
`Dec. 26, 2005
`
`(JP) ...................................... 2005-373498
`
`Publication Classification
`
`(51)
`
`Int. Cl.
`(2006.01)
`H01] 5/02
`(2006.01)
`H01] 40/14
`(52) use. .............................................................. 250/239
`
`(57)
`
`ABSTRACT
`
`A lens-equipped light-emitting diode device of the present
`invention includes a lead frame in which an electrode is
`
`formed, a light-emitting diode which is mounted on the
`electrode of the lead frame, an outer peripheral unit which
`is made of a first resin, which is provided on the lead frame,
`and in which a hollow portion is formed while an area
`including at least the light-emitting diode is exposed in the
`outer peripheral unit, a sealing portion which is made of a
`second resin filled in the lead frame of the hollow portion of
`the outer peripheral unit, and which seals the light-emitting
`diode, and a lens unit made of a third resin laminated and
`filled in the sealing portion.
`
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`Patent Application Publication Jun. 28, 2007 Sheet 1 0f 3
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`US 2007/0145255 A1
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`Patent Application Publication Jun. 28, 2007 Sheet 3 0f 3
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`US 2007/0145255 A1
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`US 2007/0145255 A1
`
`Jun. 28, 2007
`
`LENS-EQUIPPED LIGHT-EMITTING DIODE
`DEVICE AND METHOD OF MANUFACTURING
`THE SAME
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`
`[0001] This application is based upon and claims the
`benefit of priority from prior Japanese Patent Application
`No. 2005-373498, filed Dec. 26, 2005, the entire contents of
`which are incorporated herein by reference.
`
`BACKGROUND OF THE INVENTION
`
`[0002]
`
`1. Field of the Invention
`
`[0003] The present invention relates to a lens-equipped
`light-emitting diode device which extracts light from a
`light-emitting diode through a lens and a method of manu-
`facturing the same, and particularly to a lens-equipped
`light-emitting diode device which is excellent for light
`extraction efficiency and reliability and whose production
`cost can be reduced.
`
`[0004]
`
`2. Description of the Related Art
`
`[0005] FIG. 13 is a longitudinal sectional view showing a
`conventional lens-equipped light-emitting diode device 100.
`In the lens-equipped light-emitting diode device 100, a
`light-emitting diode element 102 is mounted through a die
`mounting material (not shown) on a lead frame 101 in which
`an electrode is formed, and an electrode of the light-emitting
`diode element 102 and an electrode exposed outside the lead
`frame are connected by a bonding wire 103.
`
`[0006] A sealing portion 104 made of resin is formed
`around the light-emitting diode element 102, and an outer
`peripheral unit 105 is formed outside the lead frame 101 and
`light-emitting diode element 102 using a white thermoplas-
`tic resin. A lens 106 is attached to upwardly collect light
`emitted from the light-emitting diode element, and the lens
`106 is made of a transparent resin produced in a different
`process. In FIG. 13, the number 107 designates a bonding
`agent.
`
`[0007] Generally a transparent resin is used as the sealing
`portion 104. Recently, a white light-emitting diode device is
`proceeding toward the practical use in illumination. In this
`case, frequently a fluorescent material for converting blue or
`UV light emitted from the light-emitting diode element is
`mixed into the transparent resin.
`
`lens-equipped light-emitting
`In the conventional
`[0008]
`diode device, the lens 106 produced in the different process
`is attached to the outer peripheral unit 105 by bonding or
`fitting. A method of casting a thermosetting resin into the
`outer peripheral unit 105 is also adopted (for example, see
`Jpn. Pat. Appln. KOKAI Publication No. 2004-343059).
`
`lens-equipped light-emitting
`In the conventional
`[0009]
`diode device, there are the following problems. In the case
`where the lens 106 is attached to the outer peripheral unit
`105 by bonding or fitting, sometimes a micro-gap is gener-
`ated between the sealing portion 104 and lens 106, which
`decreases light extraction efficiency. There is also generated
`the problem that mechanical strength or a heat-resistant
`property is degraded due to poor adhesion between the lens
`106 and the outer peripheral unit 105.
`
`[0010] On the other hand, in a production process, the
`following factors become an obstacle for reducing assembly
`cost. That is, an assembly process of attaching the lens 106
`to the outer peripheral unit 105 is required, and an optical
`axis adjustment process is required to accurately attaching
`the lens 106 to the outer peripheral unit 105. In the case
`where the lens 106 is formed by casting, only the thermo-
`setting resin is used. However, generally a long-time curing
`process is required for the casting, so that the cost reduction
`also becomes the problem in the casting.
`
`BRIEF SUMMARY OF THE INVENTION
`
`In view of the foregoing, an object of the invention
`[0011]
`is to provide a lens-equipped light-emitting diode which is
`excellent in light extraction efficiency and reliability while
`production cost can be reduced, and a production method
`thereof.
`
`In order to achieve the object, the lens-equipped
`[0012]
`light-emitting diode device according to the invention and
`the production method thereof have the following configu-
`rations.
`
`[0013] A lens-equipped light-emitting diode device com-
`prises: a support member in which an electrode is formed; a
`light-emitting diode which is mounted on the electrode of
`the support member; an outer peripheral unit which is
`provided on the support member, a hollow portion being
`formed while an area including at least the light-emitting
`diode is exposed in the outer peripheral unit made of a first
`resin; a sealing portion which is made of a second resin, the
`support member side of the hollow portion of the outer
`peripheral unit being filled with the second resin to seal the
`light-emitting diode; and a lens unit which is made of a third
`resin, the lens unit being laminated on the sealing portion by
`integral molding.
`
`[0014] A method of producing a lens-equipped light-
`emitting diode device comprises: a process of mounting a
`light-emitting diode element on a support member; a first
`positioning process of positioning the support member in a
`first die; an outer peripheral unit forming process of sup-
`plying a resin into the first die to form an outer peripheral
`unit; a sealing process of sealing the light-emitting diode
`element; a second positioning process of positioning the
`support member in a second die; and a lens unit forming
`process of supplying a resin into the second die to form a
`lens unit.
`
`[0015] Additional objects and advantages of the invention
`will be set forth in the description which follows, and in part
`will be obvious from the description, or may be learned by
`practice of the invention. The objects and advantages of the
`invention may be realized and obtained by means of the
`instrumentalities and combinations particularly pointed out
`hereinafter.
`
`BRIEF DESCRIPTION OF THE SEVERAL
`VIEWS OF THE DRAWING
`
`[0016] The accompanying drawings, which are incorpo-
`rated in and constitute a part of the specification, illustrate
`embodiments of the invention, and together with the general
`description given above and detailed description of the
`embodiments given below, serve to explain the principles of
`the invention.
`
`5
`
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`US 2007/0145255 A1
`
`Jun. 28, 2007
`
`[0017] FIG. 1 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device according to a
`first embodiment of the invention;
`
`22, and the bonding wire 23 is connected to the electrode 21.
`In FIG. 1, the number 20b designates a backside of the lead
`frame 20.
`
`[0018] FIG. 2 is a longitudinal sectional view showing a
`process of producing the lens-equipped light-emitting diode
`device according to the first embodiment;
`
`[0019] FIG. 3 is a longitudinal sectional view showing a
`process of producing the lens-equipped light-emitting diode
`device according to the first embodiment;
`
`[0020] FIG. 4 is a longitudinal sectional view showing a
`process of producing the lens-equipped light-emitting diode
`device according to the first embodiment;
`
`[0021] FIG. 5 is a longitudinal sectional view showing a
`process of producing the lens-equipped light-emitting diode
`device according to the first embodiment;
`
`[0022] FIG. 6 is a longitudinal sectional view showing a
`process of producing the lens-equipped light-emitting diode
`device according to the first embodiment;
`
`[0023] FIG. 7 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device according to a
`second embodiment of the invention;
`
`[0024] FIG. 8 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device according to a
`third embodiment of the invention;
`
`[0025] FIG. 9 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device according to a
`fourth embodiment of the invention;
`
`[0026] FIG. 10 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device according to a
`fifth embodiment of the invention;
`
`[0027] FIG. 11 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device according to a
`sixth embodiment of the invention;
`
`[0028] FIG. 12 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device according to a
`seventh embodiment of the invention; and
`
`[0029] FIG. 13 is a longitudinal sectional view showing an
`example of a conventional
`lens-equipped light-emitting
`diode device.
`
`DETAILED DESCRIPTION OF THE
`INVENTION
`
`[0030] FIG. 1 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device 10 according to a
`first embodiment of the invention. The lens-equipped light-
`emitting diode device 10 includes a lead frame 20, an outer
`peripheral unit 30, a sealing portion 40, and a lens unit 50.
`The lead frame 20 is a support member in which an electrode
`is formed. The outer peripheral unit 30 is formed on the lead
`frame 20. The sealing portion 40 is provided in the outer
`peripheral unit 30 and seals a light-emitting diode 22 and a
`bonding wire 23. The lens unit 50 is arranged in an upper
`portion of the sealing portion 40.
`
`[0031] Plural electrodes 21 are formed on the side of a
`surface 20a of the lead frame 20, and a light-emitting diode
`22 is mounted on the electrode 21. A bonding wire 23 is
`connected to one of the electrodes of the light-emitting diode
`
`[0032] A white color thermoplastic resin such as PPA, PC,
`and epoxy resin is used as a first resin forming the outer
`peripheral unit 30. A thermosetting resin or a UV curing
`resin, such as a transparent epoxy resin and transparent
`silicone,
`is used as a second resin forming the sealing
`portion 40. In the case of the device which emits white light,
`sometimes a fluorescent material for wavelength conversion
`is mixed to the resin. The thermosetting resin such as the
`transparent epoxy resin and the transparent silicone or the
`thermoplastic resin such as PMMA, PC, and COP is used as
`a third resin forming the lens unit 50.
`
`[0033] A method of producing the lens-equipped light-
`emitting diode device 10 will be described below. The lead
`frame 20 is prepared as shown in FIG. 2, and the light-
`emitting diode element is mounted on the lead frame with a
`die mounting material (not shown) as shown in FIG. 3. Then,
`these components are inserted in an injection molding die to
`form the outer peripheral unit 30 using a first white ther-
`moplastic resin as shown in FIG. 4.
`
`[0034] As shown in FIG. 5, wire bonding is performed
`between the electrode of the light-emitting diode element 22
`and the electrode 21 of the lead frame 20, and the sealing
`portion 40 is formed around the light-emitting diode element
`22 using a second sealing resin. At this point, the sealing
`portion 40 may be formed by the injection mold with the die
`or a potting method.
`
`[0035] These molded components are inserted in the injec-
`tion molding die different from those for molding the outer
`peripheral unit 30 and the sealing portion 40, and a lens unit
`50 is integrally molded using a third transparent resin as
`shown in FIG. 6. A LIM method is adopted in the case where
`the thermosetting resin is used, and the injection molding
`method is adopted in the case where the thermoplastic resin
`is used.
`
`In the lens-equipped light-emitting diode device 10
`[0036]
`formed in the above-described manner, because the molding
`of the lens unit 50 and the attachment of the lens unit 50 to
`
`the outer peripheral unit 30 can simultaneously be per-
`formed, a process of attaching a resin lens produced by
`another process to the outer peripheral unit and a process of
`adjusting an optical axis are not required, which allows cost
`to be reduced in an assembly process.
`
`[0037] A gap generated between the lens unit 50 and the
`outer peripheral unit 30 and a gap generated between the
`lens unit 50 and the sealing portion 40 can be prevented to
`improve the light extraction efficiency. Furthermore, attach-
`ment strength can be enhanced because the resins are fused
`at a boundary surface between the lens unit 50 and the
`sealing portion 40.
`
`lens-equipped light-emitting diode
`the
`[0038] Thus,
`device of the first embodiment
`is excellent
`in the light
`extraction efficiency and the reliability, and the production
`cost can be reduced.
`
`FIG. 7 is a longitudinal sectional view showing a
`[0039]
`lens-equipped light-emitting diode device 10A according to
`a second embodiment of the invention. In FIG. 7, the same
`
`6
`
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`US 2007/0145255 A1
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`Jun. 28, 2007
`
`components as those of FIG. 1 are designated by the same
`numbers, and detailed description thereof will be omitted.
`
`[0040] A penetration portion 51 is provided in the lens unit
`50, and the penetration portion 51 is latched in the lead
`frame 20 at a front-edge portion 52 of the penetration portion
`51. The penetration portion 51 penetrates the lead frame 20
`to the backside 20b where the light-emitting diode 22 is not
`mounted.
`
`In the lens-equipped light-emitting diode device
`[0041]
`10A of the second embodiment,
`the same effect as the
`lens-equipped light-emitting diode device 10 can also be
`obtained. The lens-equipped light-emitting diode device
`10A further has the following effect. In the case where the
`resins forming the outer peripheral unit 30 and the lens unit
`50 are different from each other,
`it is difficult to secure
`adhesive strength between the outer peripheral unit 30 and
`the lens unit 50. Therefore, in the integral molding with the
`lens unit 50, the penetration portion 51 is formed to prevent
`drop-out of the lens unit 50 in such a manner that the
`penetration portion 51 is filled with a transparent resin to the
`backside 20b of the lead frame 20. This enables the adhesive
`strength to be enhanced to improve the reliability. The resin
`having a large shrinkage ratio and linear thermal expansion
`coefficient is used as the third resin forming the lens unit 51,
`which allows the effect to be increased. The thermoplastic
`resin or the thermosetting resin can be used as the third resin.
`
`[0042] FIG. 8 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device 10B according to
`a third embodiment of the invention. In FIG. 8, the same
`components as those of FIG. 1 are designated by the same
`numbers, and detailed description thereof will be omitted.
`
`[0043] A penetration portion 53 is provided in the lens unit
`50, and the penetration portion 53 is latched in the lead
`frame 20 at a front-edge portion 54 of the penetration portion
`53. The penetration portion 53 penetrates the outer periph-
`eral unit 30 and the lead frame 20 to the backside 20b where
`the light-emitting diode 22 is not mounted.
`
`In the lens-equipped light-emitting diode device
`[0044]
`10B of the third embodiment, the same effect as the lens-
`equipped light-emitting diode device 10A can also be
`obtained.
`
`[0045] FIG. 9 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device 10C according to
`a fourth embodiment of the invention. In FIG. 9, the same
`components as those of FIG. 1 are designated by the same
`numbers, and detailed description thereof will be omitted.
`
`In the fourth embodiment, a micro-rib 31 is pro-
`[0046]
`vided in an upper edge portion of the outer peripheral unit
`30. In the lens-equipped light-emitting diode device 10C of
`the fourth embodiment, the same effect as the lens-equipped
`light-emitting diode device 10 can also be obtained, and only
`the micro-rib 31 is re-melted to weld the lens unit 50 by heat
`of the transparent resin when the lens unit 50 is molded. At
`this point, the welding strength can be enhanced by utilizing
`the resin having a higher melting point. In this case, the
`thermoplastic resin is used as the first resin and the third
`res1n.
`
`[0048] Anotch portion 24 is provided in the lead frame 20.
`A latch portion 55 is provided in the lens unit 50, and a
`front-edge portion 56 of the latch portion 55 is engaged with
`the notch portion 24. The latch portion 55 penetrates the lead
`frame 20, and is extended to the backside 20b where the
`light-emitting diode 22 is not mounted.
`
`In the lens-equipped light-emitting diode device
`[0049]
`10D of the fifth embodiment, the same effect as the lens-
`equipped light-emitting diode device 10A can also be
`obtained.
`
`FIG. 11 is a longitudinal sectional view showing a
`[0050]
`lens-equipped light-emitting diode device 10E according to
`a sixth embodiment of the invention. In FIG. 11, the same
`components as those of FIG. 1 are designated by the same
`numbers, and detailed description thereof will be omitted.
`
`[0051] The lens-equipped light-emitting diode device 11E
`can be applied to the case where the latch portion 55 is
`provided in a side face different from that of the lens-
`equipped light-emitting diode device 10D. The notch por-
`tion 24 is provided in the lead frame 20. The latch portion
`55 is also provided in the lens unit 50, and the front-edge
`portion 56 of the latch portion 55 is engaged with the notch
`portion 24. The latch portion 55 is extended along the side
`face of the lead frame 20, and the latch portion 55 is
`extended to the backside 20b where the light-emitting diode
`22 is not mounted.
`
`In the lens-equipped light-emitting diode device
`[0052]
`10E of the sixth embodiment, the same effect as the lens-
`equipped light-emitting diode device 10D can also be
`obtained. In the lens-equipped light-emitting diode device
`10E, it is not necessary that the latch portion 55 penetrate the
`lead frame 20.
`
`FIG. 12 is a longitudinal sectional view showing a
`[0053]
`lens-equipped light-emitting diode device 10F according to
`a seventh embodiment of the invention. In FIG. 12, the same
`components as those of FIG. 1 are designated by the same
`numbers, and detailed description thereof will be omitted.
`
`[0054] A through hole 32 is provided in the outer periph-
`eral unit 30. A latch portion 57 is provided in the lens unit
`50 while inserted into the through hole 32, and a front-edge
`portion 58 is engaged with the through hole 32. The notch
`portion may be provided in place of the through hole 32.
`
`In the lens-equipped light-emitting diode device
`[0055]
`10F of the seventh embodiment,
`the same effect as the
`lens-equipped light-emitting diode device 10A can also be
`obtained.
`
`[0056] The structures and processes in the above embodi-
`ments are illustrated by way of example, and obviously the
`structures and processes may be replaced as appropriate. For
`example, the electrode of the light-emitting diode element
`22 may be connected to the external electrode 21 not by the
`wire bonding but by the flip chip bonding. In the production
`process,
`the light-emitting diode element 22 may be
`mounted after the outer peripheral unit 30 is formed in the
`lead frame 20 using the white resin. The lens integral
`molding can also be injection-molded not on the lead frame
`20 but on a support member in which the electrode is
`formed, e.g., a glass epoxy substrate and a ceramic substrate.
`
`[0047] FIG. 10 is a longitudinal sectional view showing a
`lens-equipped light-emitting diode device 10D according to
`a fifth embodiment of the invention. In FIG. 10, the same
`components as those of FIG. 1 are designated by the same
`numbers, and detailed description thereof will be omitted.
`
`[0057] The invention is not limited to the above embodi-
`ments, but various modifications could be made without
`departing from the scope of the invention. Various inven-
`tions could also be made by the appropriate combination of
`the plural components disclosed in the embodiments. For
`
`7
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`US 2007/0145255 A1
`
`Jun. 28, 2007
`
`example, some components shown in the embodiments can
`be eliminated from all the components. The components in
`the different embodiments may appropriately be combined.
`
`[0058] Additional advantages and modifications will
`readily occur to those skilled in the art. Therefore,
`the
`invention in its broader aspects is not limited to the specific
`details
`and representative
`embodiments
`shown
`and
`described herein. Accordingly, various modifications may be
`made without departing from the spirit or scope of the
`general inventive concept as defined by the appended claims
`and their equivalents.
`What is claimed is:
`
`1. A lens-equipped light-emitting diode device compris-
`ing:
`
`a support member in which an electrode is formed;
`
`a light-emitting diode which is mounted on the electrode
`of the support member;
`
`an outer peripheral unit which is provided on the support
`member, a hollow portion being formed while an area
`including at least the light-emitting diode is exposed in
`the outer peripheral unit made of a first resin;
`
`a sealing portion which is made of a second resin, the
`support member side of the hollow portion of the outer
`peripheral unit being filled with the second resin to seal
`the light-emitting diode; and
`
`a lens unit which is made of a third resin, the lens unit
`being laminated on the sealing portion by integral
`molding.
`2. The lens-equipped light-emitting diode device accord-
`ing to claim 1, wherein the first resin is a white resin.
`3. The lens-equipped light-emitting diode device accord-
`ing to claim 1, wherein the second resin is a transparent
`thermosetting resin, a transparent UV curing resin, or a
`material
`in which a fluorescent material for wavelength
`conversion is mixed with each of the transparent resins.
`4. The lens-equipped light-emitting diode device accord-
`ing to claim 1, wherein the third resin is a transparent
`thermosetting resin or a transparent thermoplastic resin.
`5. The lens-equipped light-emitting diode device accord-
`ing to claim 1, wherein the lens unit has an engagement
`portion which is engaged with the support member or the
`outer peripheral unit.
`6. The lens-equipped light-emitting diode device accord-
`ing to claim 5 wherein the engagement portion has a
`penetration portion which is pierced to a backside from a
`surface on which the light-emitting diode element
`is
`mounted.
`
`7. The lens-equipped light-emitting diode device accord-
`ing to claim 5, wherein the engagement portion has a
`penetration portion which is pierced from the outer periph-
`eral unit to a backside of a surface of the support member on
`which the light-emitting diode element is mounted.
`8. The lens-equipped light-emitting diode device accord-
`ing to claim 5, wherein the first resin and the third resin are
`a thermoplastic resin, and
`
`the engagement portion has a micro projection and a
`fusion portion, the micro projection being formed in an
`upper edge portion of the outer peripheral unit, the
`fusion portion being generated by melting the micro
`projection and the lens unit.
`
`9. The lens-equipped light-emitting diode device accord-
`ing to claim 5, wherein the engagement portion has a latch
`member which is latched in a backside of a surface of the
`
`support member on which the light-emitting diode element
`is mounted.
`
`10. A method of producing a lens-equipped light-emitting
`diode device comprising:
`
`mounting a light-emitting diode element on a support
`member;
`
`first positioning the support member in a first die;
`
`supplying a resin into the first die to form an outer
`peripheral unit;
`
`sealing the light-emitting diode element;
`
`second positioning the support member in a second die;
`and
`
`supplying a resin into the second die to form a lens unit.
`11. The method of producing a lens-equipped light-
`emitting diode device according to claim 10, wherein the
`resin supplied into the first die is a white resin.
`12. The method of producing a lens-equipped light-
`emitting diode device according to claim 10, wherein a resin
`seals the light-emitting diode, and
`
`the resin is a transparent thermo setting resin, a transparent
`UV curing resin, or a material in which a fluorescent
`material for wavelength conversion is mixed with each
`of the transparent resins.
`13. The method of producing a lens-equipped light-
`emitting diode device according to claim 10, wherein the
`resin supplied into the second die is a transparent thermo-
`setting resin or a transparent thermoplastic resin.
`14. The method of producing a lens-equipped light-
`emitting diode device according to claim 10, wherein the
`lens unit is an engagement portion which is engaged with the
`support member or the outer peripheral unit.
`15. The method of producing a lens-equipped light-
`emitting diode device according to claim 14, wherein the
`engagement portion has a penetration portion which is
`pierced to a backside from a surface on which the light-
`emitting diode element is mounted.
`16. The method of producing a lens-equipped light-
`emitting diode device according to claim 14, wherein the
`engagement portion has a penetration portion which is
`pierced from the outer peripheral unit to a backside of a
`surface of the support member on which the light-emitting
`diode element is mounted.
`
`17. The method of producing a lens-equipped light-
`emitting diode device according to claim 14, wherein the
`first resin and the third resin are a thermoplastic resin, and
`
`the engagement portion has a micro projection and a
`fusion portion, the micro projection being formed in an
`upper edge portion of the outer peripheral unit, the
`fusion portion being generated by melting the micro
`projection and the lens unit.
`18. The method of producing a lens-equipped light-
`emitting diode device according to claim 14, wherein the
`engagement portion has a latch member which is latched in
`a backside of a surface of the support member on which the
`light-emitting diode element is mounted.
`*
`*
`*
`*
`*
`
`8
`
`