as) United States
`a2) Patent Application Publication 10) Pub. No.: US 2010/0310106 Al
`
` Blanchardet al. (43) Pub. Date: Dec.9, 2010
`
`
`US 20100310106A1
`
`IN-EAR HEADPHONES
`
`Publication Classification
`
`HOAR 31/00
`
`(2006.01)
`G1) eT02
`D00601
`HO4R 25/00
`(52) US. CD wceeeeeeeeeees 381/351; 29/594; 381/380
`(57)
`ABSTRACT
`
`2006.01
`
`An earphone is disclosed that is used in connection with
`reproducing audio sounds that are supplied from an audio-
`frequency source. The earphone includes a housing that
`includes a boot assembly positioned in the housing. A first
`audio driver is positionedin the boot assembly suchthata first
`output of the first audio driver is in acoustic communication
`with a mixing chamber. A second audio driver is also posi-
`tioned in the boot assembly such that a second output of the
`second audio driver is in acoustic communication with a
`chamberin the boot assembly. A tubular needle is positioned
`in the boot assembly havinga first end in acoustic communi-
`cation with the chamber and a second end in acoustic com-
`munication with the mixing chamber.
`
`(54)
`
`(76)
`
`Inventors:
`
`(US); Bradley C. Geswein,
`:
`
`MarkA.Blanchard, Lebanon, IN
`Plainfield, IN (US)
`Correspondence Address:
`KRIEG DEVAULT LLP
`ONE INDIANA SQUARE,SUITE 2800
`INDIANAPOLIS,IN 46204-2079 (US)
`
`(21) Appl. No.:
`
`12/797,886
`
`(22)
`
`Filed:
`
`Jun. 10, 2010
`
`Related U.S. Application Data
`
`(63) Continuation of application No. PCT/US2008/
`013536, filed on Dec. 10, 2008.
`
`(60) Provisional application No. 61/012,482,filed on Dec.
`10, 2007.
`
`[~
`
`311
`
`1
`
`APPLE 1084
`Apple v. GUI
`IPR2021-00471
`
`1
`
`APPLE 1084
`Apple v. GUI
`IPR2021-00471
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 1 of 40
`
`US 2010/0310106 Al
`
`r
`
`24
`
`Fig. 1
`
`2
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 2 of 40
`
`US 2010/0310106 Al
`
`r'
`
`20
`
`3
`
`

`

`>WsTRS
`
`2sa\ARi—F
`UNSS8S_
`
`SAKsat
`
`Fig. 3
`
`.Sy
`
`4
`
`
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 4 of 40
`
`US 2010/0310106 Al
`
`
`
`5
`
`

`

`
`
`Fig. 5a
`
`6
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 6 of 40
`
`US 2010/0310106 Al
`
`
`
`7
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 7 of 40
`
`US 2010/0310106 Al
`
`
`
`8
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 8 of 40
`
`US 2010/0310106 Al
`
`
`
`Fig. 5d
`
`9
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 9 of 40
`
`US 2010/0310106 Al
`
`
`(SonTatpes
`firey)A)7
`
`
`bea
`
`
`
`10
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 10 of 40
`
`US 2010/0310106 Al
`
`
`
`11
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010
`
`Sheet 11 of 40
`
`US 2010/0310106 Al
`
`
`
`Fig. 6
`
`12
`
`12
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 12 of 40
`
`US 2010/0310106 Al
`
`
`
`Fig. /
`
`13
`
`13
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 13 of 40
`
`US 2010/0310106 Al
`
`co
`oy)“
`
`12b
`
`Fig.8
`
`14
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 14 of 40
`
`US 2010/0310106 Al
`
`
`
`15
`
`15
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 15 of 40
`
`US 2010/0310106 Al
`
`
`
`16
`
`16
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 16 of 40
`
`US 2010/0310106 Al
`
`
`
`17
`
`17
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 17 of 40
`
`US 2010/0310106 Al
`
` —
`
`_L
`
`ae)
`
`18
`
`18
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 18 of 40
`
`US 2010/0310106 Al
`
` —
`
`—o
`
`y
`
`19
`
`19
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 19 of 40
`
`US 2010/0310106 Al
`
`Fig.14 _—
`
`—~
`
`20
`
`20
`
`

`

`Dec. 9, 2010 Sheet 20 of 40
`
`Fig.15 —
`
`21
`
`= ©
`
`Patent Application Publication
`
`US 2010/0310106 Al
`
`21
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 21 of 40
`
`US 2010/0310106 Al
`
`'
`
`24
`
`22
`
`22
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 22 of 40
`
`US 2010/0310106 Al
`
`i"
`
`20
`
`Fig. 2
`
`23
`
`23
`
`

`

`se)
`
`oO
`
`—
`
`a=Ot+vw
`
`5SakTf
`Af}SE
`
`MY
`
`(OSES
`LSEZz
`RFORICTS
`>\-(AoS;
`
`\ C
`
`y
`
`Fig. 3
`
`24
`
`
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 24 of 40
`
`US 2010/0310106 Al
`
`
`
`>>
`
`32
`2 ,
`SLemKe
`GES (®
`fewaos
`AE Set
`7 \er)|SN)
`60
`weLF "
`
`Ve
`
`
`
`
`
`
`
`
`25
`
`25
`
`

`

`ent Application Publication
`
`
`anAK o CSS |
`
`
`
`
`
`
`Fig. 5a
`
`26
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 26 of 40
`
`US 2010/0310106 Al
`
`
`
`27
`
`27
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010
`
`Sheet 27
`
`of 40
`
`US 2010/0310106 Al
`
`
`
`Fig. 5c
`
`28
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010
`
`Sheet 28 of 40
`
`US 2010/0310106 Al
`
`
`
`Fig. 5d
`
`29
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 29 of 40
`
`US 2010/0310106 Al
`
`
`
`30
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 30 of 40
`
`US 2010/0310106 Al
`
`
`
`31
`
`31
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 31 0f40
`
`US 2010/0310106 Al
`
`
`
`Fig. 6
`
`32
`
`32
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 32 of 40
`
`US 2010/0310106 Al
`
`
`
`Fig. /
`
`33
`
`33
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010
`
`Sheet 33 of 40
`
`US 2010/0310106 Al
`
`Fig.8
`
`12b
`
`©o
`
`D—_
`
`
`
`124
`
`130
`
`180
`
`34
`
`34
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 34 of 40
`
`US 2010/0310106 Al
`
`34
`
`47a
`
`35
`
`35
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 35 of 40
`
`US 2010/0310106 Al
`
`
`
`36
`
`36
`
`

`

`Patent Application Publication
`
`US 2010/0310106 Al
`
`Dec. 9, 2010 Sheet 36 of 40
`
`[-
`
`Fig.11
`
`37
`
`37
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 37 of 40
`
`US 2010/0310106 Al
`
`Fig.12 —
`
`38
`
`=o
`
`O
`
`38
`
`

`

`Patent Application Publication
`
`US 2010/0310106 Al
`
`Dec. 9, 2010 Sheet 38 of 40
`
`Fig.13 —
`
`39
`
`—o
`
`O
`
`39
`
`

`

`Patent Application Publication
`
`Dec. 9, 2010 Sheet 39 of 40
`
`US 2010/0310106 Al
`
` -
`
`ao
`
`O
`
`40
`
`40
`
`

`

`Dec. 9, 2010 Sheet 40 of 40
`
`US 2010/0310106 Al
`
`Patent Application Publication
`
`308 —
`
`41
`
`— o
`
`)
`
`41
`
`

`

`US 2010/0310106 Al
`
`Dec. 9, 2010
`
`IN-EAR HEADPHONES
`
`CROSS REFERENCE TO RELATED
`APPLICATIONS
`
`[0001] The present application is a continuation of PCT/
`2008/013536 filed Dec. 10, 2008, which claimspriority to
`USS. Provisional Patent Application No. 61/012,482 filed
`Dec. 10, 2007, each of which is incorporated herein by ref-
`erence.
`
`FIELD OF THE INVENTION
`
`[0002] The present invention relates generally to earphones
`and hearing aids for audio playback or reinforcement and
`more particularly, to an earphone that includes two drivers
`and a tube functioning as a low pass filter.
`
`BACKGROUND
`
`in-ear monitors,
`[0003] Headphones, personal monitors,
`earphones, earbuds and hearing aids are a pair of loudspeak-
`ers that are configured to be positioned close to a user’s ear
`drumsor in a user’s ear canal with a means for connecting
`them psycho-acoustically to an audio source. Headphonesare
`commonly used with electronic equipment such as CD or
`DVDplayers, home theater systems, personal computers, as
`well as portable electronic devices such as portable music
`players, mobile phones, and so forth. Wired headphones
`attach to the audio source andtypically use a common con-
`nector known as a stereophonic jack to be connected to the
`audio source. Some headphonesfit over the outer portion of a
`user’s ear and other headphonesare designedto fit within an
`outer part of the ear canal of the user. In addition, some are
`designedto fit in the ear canal close to the ear drum. Head-
`phonesthat are designedto fit within the outerpart of the ear
`canal are commonly referred to as earbuds and headphones
`which occlude andreside in the ear canal are consideredin ear
`monitors, personal monitors and canal phones.
`
`SUMMARY
`
`[0004] One embodiment of the present application dis-
`closes an in-ear headphone system or assembly containing
`two acoustic drivers per ear. Other embodiments include
`unique apparatus, devices, systems, and methods for repro-
`ducing electric audio signals in earphones or hearing aids.
`Further embodiments, forms, objects, features, advantages,
`aspects, and benefits of the present application shall become
`apparent from the detailed description and figures included
`herewith.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0005] The figures are not necessarily to scale, emphasis
`instead being placed upon illustrating the principles of the
`invention. Moreover, in the figures, like reference numerals
`designate correspondingparts throughoutthe different views.
`[0006]
`FIG. 1 is a perspective view of a representative
`earphone.
`[0007]
`FIG. 2 is a perspective view of another representa-
`tive earphone.
`[0008]
`FIG. 3 is a perspective view of the earphoneillus-
`trated in FIG. 2 with a rear cover removed from a housing.
`[0009]
`FIG.4 is a perspective view of the earphoneillus-
`trated in FIG. 3 with a cable cover removed.
`[0010]
`FIG. 5a is a front view of a boot assembly of the
`representative earphone.
`[0011]
`FIG. 5d is a top view of the boot assembly.
`[0012]
`FIG. 5c is a rear view of the boot assembly.
`
`FIG. 5d is arear view ofa high frequencydriver boot
`[0013]
`of the boot assembly.
`[0014]
`FIG. 5e is aside view ofa low frequencydriver boot
`of the boot assembly.
`[0015]
`FIG. 5/1s atop perspective view illustrating the front
`of the low frequencydriver boot.
`[0016]
`FIG. 6 is a rear perspective view illustrating the
`orientation of drivers of the earphonein relation to the high
`frequency driver boot.
`[0017]
`FIG. 7 is a perspective view ofthe drivers, a needle,
`and an acoustic damperof the earphone.
`[0018]
`FIG. 8 is a cross-sectional view of the earphone
`illustrating acoustic routing ports of the earphone.
`[0019]
`FIG. 9 is a perspective view of a portion of the
`earphoneillustrating the electrical hardware of the earphone.
`[0020]
`FIG. 10 is a block diagram illustrating various
`aspects of the earphone.
`[0021]
`FIG. 11 illustrates another representative earphone.
`[0022]
`FIG. 12 illustrates another representative earphone
`including at least one cylinder in an acoustic channel.
`[0023]
`FIG. 13 illustrates another representative earphone
`including an acoustic damperin an acoustic channel.
`[0024]
`FIG. 14 illustrates another representative earphone
`includingat least one baffle in an acoustic channel.
`[0025]
`FIG. 15 illustrates another representative earphone
`including a constriction memberin an acoustic channel.
`
`DETAILED DESCRIPTION
`
`For the purposes of promoting an understanding of
`[0026]
`the principles ofthe invention, reference will now be madeto
`the embodimentillustrated in the drawings andspecific lan-
`guage will be used to describe the same.It will nevertheless
`be understoodthat no limitation of the scope of the invention
`is thereby intended, such alterations and further modifica-
`tions in the illustrated device, and such further applications of
`the principles of the invention is illustrated therein being
`contemplated as would normally occur to one skilled in the art
`to which the inventionrelates.
`
`[0027] Referring to FIGS. 1 and 2, an in-ear earphone or
`canal phone 10 is disclosed that is configured and operable to
`convert electric audio signals supplied by an audio sourceinto
`audible sound. The earphone 10 includes a housing 12 that
`contains components configured to reproduce audible
`sounds. Housing 12 includesa rear portion or cover 12a and
`a front portion or cover 126 of housing 12. An end of housing
`12 includes a generally tubular shaped nozzle housing 14 that
`protrudes outwardly from a forward surface of housing 12. A
`front end ofnozzle housing 14 includes a detachableear tip 16
`that is removably connected with the front end of nozzle
`housing 14, as set forth in greater detail below.
`[0028]
`In one form, detachable ear tip 16 comprises one of
`the illustrative ear tips disclosed in U.S. patent application
`Ser. No. 11/584,862 filed on Oct. 23, 2006 entitled “Ear Tip”,
`which is incorporated herein by reference in its entirety.
`Althoughnotillustrated, two earphones10 are includedin the
`preferred form, but only one earphone 10, in this case a left
`earphone 10, has beenillustrated for the sake of clarity. Ear
`tips 16 are preferentially made from a flexible rubber type of
`material, such as silicone, so that they are capable of con-
`forming to the contour of the inner ear canal of a user of
`earphone 10. However, other types of suitable material may
`be used to form ear tips 16.
`[0029] An upper end of housing 12 includes a tubular
`extension 18 that protrudes upwardly and outwardly from the
`upper end ofhousing 12. A sleeve 20 extends outwardly from
`extension member18 and,as set forth in greater detail below,
`a portion of sleeve 20 forms an ear hook assembly 22thatfits
`
`42
`
`42
`
`

`

`US 2010/0310106 Al
`
`Dec. 9, 2010
`
`around the upperpinna or auricle portion of the outer ear ofa
`user of earphone 10. In one form, sleeve 20 comprises a
`thermoset resin made ofpolyethylene (“PE”) cable tube. Ear
`hook assembly 22 is used to help secure earphone10 to the ear
`ofthe user. Ear tip 16 fits within the outer ear canal ofthe user
`of earphone 10 andincludes an output port 24 that is used to
`transmit audible sounds or frequencies to the ear ofthe user.
`[0030] As illustrated in FIG. 2, nozzle housing 14 includes
`a nozzle 28, a lower portion of which is positioned inside at
`least a portion of nozzle housing 14. Nozzle 28 has an upper
`tapered connection member30 and a port or passageway 32
`that runs through the entire interior portion of nozzle 28.
`Nozzle 28 also includesa rib 33 that is used to secureeartip
`16 to the portion of nozzle 28 that protrudes outwardly from
`nozzle housing 14. In this form, nozzle housing 14 and nozzle
`28 have a generally circular shaped cross-sectional configu-
`ration. However, it should be appreciated that other shapes
`and configurations may beutilized in alternative forms, such
`as elliptical, rectangular, square, and triangular, to name a
`few. As previously set forth, an interior portionof ear tip 16 is
`removably connected with a portion ofnozzle 28. Output port
`24 of ear tip 16 is aligned with port 32 of nozzle 28. A flexible
`audio cable 34 is positioned inside sleeve 20 that includes
`audio wires that are used to provide electric audio signals to
`earphone 10. A ring 36 is positioned around an upperportion
`of extension 18 and serves as a clamping member to hold
`covers 12a, 126 together.
`[0031] Referring to FIG. 3, rear portion or cover 12a of
`housing 12 has been removed from housing 12. As illustrated,
`housing 12 includes a front portion or cover 126 that is con-
`nected with rear portion 12a of housing 12. Sleeve 20 is
`positioned within an aperture or passageway 40 defined by
`extension member18. A copperring 42 1s positioned within a
`portion of passageway 40 of housing 12 to prevent or inhibit
`movement of ring 42 within housing 12. Sleeve 20 passes
`through a central portion ofring 42 and is connectedto ring 42
`such that sleeve 20 is snugly secured within the central por-
`tion of ring 42. Sleeve 20 may be connected to ring 42 by a
`friction fit or using conventional connection mechanisms
`such as adhesive or clamping for example.
`[0032] Referring collectively to FIGS. 3 and 4, a flexible
`wire or gumby wire 44 is also positioned inside sleeve 20 and
`housing 12. In particular, flexible wire 44 and sleeve 20 form
`ear hook assembly 22. See also FIG. 1. Flexible wire 44 is
`capable ofbendingto take on desirable shapes, in this case the
`shapeof the upperportion ofthe ear of a user of earphone10,
`to help secure earphone 10 to the head ofa user. As such, ear
`tip 16 and ear hook assembly 22 cooperate with one another
`to secure earphone 10 to the user.
`[0033] A portion of flexible wire 44 fits within housing 12
`through extension member18 into an interior portion defined
`by housing 12 and includesa bend 46 that directs flexible wire
`44 downwardly a predetermined distance into housing 12.
`Audio cable 34 protrudes outwardly from sleeve 20 and
`includes audio wires 47a, 476 that are connectedto a flexible
`circuit board 48, whichis discussed in greaterdetail below. In
`one form, audio cable 34 comprises a flexible fabric jacketed
`audio cable that includes conductive wires (e.g.—audio wires
`47a, 47b) surroundedby a fabric material.
`[0034] A boot assembly or chassis 50 is positioned within
`an interior portion or cavity defined by housing 12 and
`includesa high frequency driver boot 52 and a low frequency
`driver boot 54. See FIGS. 5a-5f In one form, boot assembly
`50 is made from a shock absorbent or gasket like material
`such as an elastomer, silicone, orplastic, for example. Refer-
`ring to FIG.5a, a front view ofboot assembly 50 is illustrated
`removed from housing 12. As depicted, a lower surface por-
`
`tion 54a and a side surface portion 546 of low frequency
`driver boot 54 is connected with an uppersurface portion 52a
`and a side surface portion 525 of high frequency driver boot
`52. In one form,
`low frequency driver boot 54 and high
`frequency driver boot 52 are connected to one another using
`any type of suitable adhesive.
`[0035] A forward section 52c of high frequency driver boot
`52 includesa first aperture or channel 56 positioned within a
`recessed portion 58 of high frequency driver boot 52. A spout
`60 of a high frequency audio driver (discussed in detail
`below) protrudes outwardly a predetermined distance
`throughfirst aperture 56. A second aperture or channel 62 is
`located in forward section 52c of boot assembly 50 and runs
`through high frequency driver boot 52 and a portion of low
`frequency driver boot 54. As such, high frequencydriver boot
`52 and low frequencydriver boot 54 both include channel 62.
`A stainless steel tubular needle, or non-corrosive metal or
`rigid polymerresin tube 64is inserted into channel 60, which
`is discussed in greater detail below. A portion of needle 64
`protrudes outwardly a predetermineddistance from high fre-
`quencydriver boot 52. In one form, needle 64 is inserted into
`channel 62 of high frequency driver boot 52 during manufac-
`turing prior to low frequency driver boot 54 being connected
`with high frequency driver boot 52.
`[0036] Referring to FIG. 55, which depicts a top view of
`boot assembly 50, low frequency driver boot 54 includes an
`aperture or vent 66 located at a rearward section of low
`frequency driver boot 54. A vent 68 of a low frequency audio
`driver 70 is exposed through aperture 66 thereby exposing
`vent 68 to an interior portion or chamberdefined by housing
`12. In one form, low frequency driver boot 54 includesa flap
`72 that is located on a rearward section of low frequency
`driver boot 54. As illustrated in FIGS. 2-4, in one form flap 72
`protrudes outwardly from a flap aperture 74 in a rearward
`section or portion of housing 12. In another form, when
`earphone10 is assembled, flap 72 flips up on a backside 75 of
`driver 70 to provide a concentrated force vector to the back-
`side of driver 70. As such, when housing 12 is assembled, flap
`72 is positioned inside housing 12 and applies force or pres-
`sure to backside 75 of driver 70. This concentrated force
`vector forces the front portion of driver 70 against a front face
`110 (See FIG. 5e) of low frequency driver boot 54so there is
`compression around snout 130 of driver 70 to prevent air
`leaks. Preventing air leaks around snout 130 improvesbass or
`low frequency performance of earphone 10.
`[0037] Referring to FIGS. 5c and 5d, which depict back or
`rear views of boot assembly 50 and high frequency driver
`boot 52, high frequency driver boot 52 includes a generally
`U-shapedslot or passageway 80 that extends a predetermined
`distance into high frequency driver boot 52. Asillustrated in
`FIG. 5c, a high frequency audio driver 82 is positioned in
`U-shaped passageway 80. Passageway 80 includes a front
`face 84 that includes aperture 56 from which spout 60 of
`driver 82 protrudes outwardly as illustrated in FIG. 5a.
`[0038] A front portion of driver 82 is positioned against
`front face 84 when driver 82is positioned in passageway80.
`Thefront portion of driver 82 is positioned againstfront face
`84 so that a seal is formed betweenthe front portion of driver
`82 and front face 84 to prevent air leaks. Passageway 80
`includes a lower surface 86, a right-side surface 88, and a
`left-side surface 90. A lower portion 92, a right-side portion
`94, and a left-side portion 96 of driver 80 are respectively
`positioned against lowersurface 86, right-side surface 88, and
`left-side surface 90 of high frequency driver boot 52. As best
`illustrated in FIG. 5d, a rearward portion of channel 62a, in
`which needle 64is inserted, is located ona side surface 98 of
`high frequency driver boot 52.
`
`43
`
`43
`
`

`

`US 2010/0310106 Al
`
`Dec. 9, 2010
`
`low frequency
`[0039] As further illustrated in FIG. 5c,
`driver boot 54 includes a generally rectangular shapedslot or
`passageway 100 that extends a predetermined distance into
`low frequencydriver boot 54. Driver 70 is positioned inside or
`within passageway 100. Referring to FIG. 5e, which illus-
`trates a left-side view of low frequency driver boot 54 with
`driver 70 removed, passageway 100 includes an upper surface
`102, a right-side surface 104, a left-side surface 106, a lower
`surface 108, and a front surface or face 110. Front face 110
`includes an aperture 112 through which, although notillus-
`trated in this view, a spout 130 of driver 70 protrudes out-
`wardly. A front portion of driver 70 is positioned against front
`face 110 such that a seal is formed betweenthe tworespective
`elements.
`
`high Q resonance of frequency response generally in the mid
`to high frequency range of the sound spectrum.
`[0044]
`Spout 130 of low frequency driver 70 is offset from
`spout 60 of high frequency driver 82 at approximately a 45°
`angle. Other configurations are envisioned and unless other-
`wise claimed, the specific arrangement of drivers 70, 82
`should not be construed as a limitation of the present inven-
`tion. First end 122 of needle 64 is aligned generally perpen-
`dicular to an output 138 of driver 70 and second end 126 is
`oriented in the general direction of acoustic damper 134.
`During operation, acoustic energy or sound produced by high
`frequency driver 82 is directed toward acoustic damper 134.
`Acoustic energy produced by low frequency driver 70 is
`directed into chamber 124, which in turn,enters first end 122
`of needle 64, passes through needle 64 andis directed out
`[0040] An upperportion 114, a lowerportion 116, a right-
`second end 126 to acoustic damper 134.
`side portion 118, andaleft-side portion 120 of driver 70 are
`[0045]
`Asillustrated in FIG. 8, which depicts a cross-sec-
`respectively positioned against upper surface 102, lower sur-
`tional view of a portion of earphone 10, spout 130 of low
`face 108, right-side surface 104, and left-side surface 106 of
`frequency driver 70 protrudes outwardly from low frequency
`low frequency driver boot 54. Referring to FIGS. 5e and 5f, a
`driver boot 54 a predetermined distance into chamber 124.
`front portion 121 of low frequency driver boot 54 includes a
`Needle 64 protrudes into chamber 124 a predetermineddis-
`channel or aperture 625 through which needle 64is inserted.
`tance and includes an aperture or bore 150 running through
`A first end 122 of needle 64 protrudes into a chamber 124
`the entire length or interior portion of needle 64 for transmit-
`formedin an interior portion of low frequency driver boot 54.
`ting acoustic energy to an acoustic combining or summation
`chamber 152 formedin housing 12. In one form, rear housing
`[0041] As set forth in greater detail below, spout 130 of
`126 includes a needle port or aperture 154 and a portion of
`driver 70 also protrudes into chamber 124. See FIG. 8. A
`needle 64 that protrudes outwardly from high frequency
`second end 126 of needle 64 extends outwardly from low
`driver boot 52 is secured orpositioned within access port 156.
`frequency driver boot 54 and needle 64 is positioned within
`Access port 156 transitions into needle port 154 in rear hous-
`channel 62 of high frequency driver boot 52. See FIGS. 3-4.
`ing 124, which has an opening into acoustic combining cham-
`Asillustrated in FIG. 5f front portion 121 of low frequency
`ber 152. Spout 60 of high frequency driver 82 protrudes into
`driver boot 54 includes channel 626. Asillustrated in FIG. 6,
`acoustic combining chamber 152, which mixes the audio
`front portion 52c¢ of high frequency driver boot 54 includes
`signals produced by drivers 70, 82 before being channeled or
`channel 62a. Channels 62a and 625 are aligned with one
`directed to acoustic damper 134.
`another and form a unitary channel 62 through high frequency
`driver boot 52 and low frequencydriver boot 54 when boots
`[0046]
`Inone form, nozzle housing 14 includes a generally
`52, 54 are connectedor aligned together.
`circular shaped internal rib 160 that rests against or is con-
`nected with circular recess 58 in high frequency driver boot
`[0042] Referring to FIG.6, a rear view ofboot assembly 50
`52. See FIG. 3. An internal surface of acoustic combining
`is illustrated with low frequency driver boot 54 removed or
`chamber 152 is connected with or surrounds spout 60 of
`disconnected from high frequency driver boot 52. As previ-
`driver 82. As such, combining chamber 152 is in acoustic
`ously set forth, low frequency driver 70 includes a spout 130
`communication with the output of low frequency driver 80
`that protrudes outwardly from a forward end of driver 70. As
`and the second end 126 of needle 64. In this form, access port
`set forth previously with respect to FIG. 5e, spout 130 pro-
`156 andinput port 154 are also located in a portion of internal
`trudes into audio chamber 124 of low frequency driver boot
`rib 160. As further illustrated, a lower portion of acoustic
`54. See FIG.8. In this form, spout 130 is aligned generally
`damper 134 is positioned within an internal recess 162 of
`perpendicular in relation to needle 64 in chamber 124, but
`nozzle housing 14. An upperportion of acoustic damper 134
`spout 130 and needle 64 are not connected to one another in
`is positioned within a nozzle recess 164 of nozzle 28. A
`chamber124. As such, chamber 124 forms an air chamberor
`portion of nozzle 28 is positioned within a nozzle recess 166
`acoustic path between spout 130 andfirst end 122 of needle
`of nozzle housing 14.
`64. In other representative forms, spout 130 and needle 64
`may be aligned at other respective angles relative to one
`[0047] An external lip 170 of front housing 12a is con-
`another and not necessarily in a generally perpendicular rela-
`nected with an internal lip 172 of rear housing 126. A first
`tionship.
`interlocking member 174 of front housing 12a is connected
`with a second interlocking member 176 of rear housing 125.
`[0043] Referring to FIG. 7, an illustrative view of the
`As such, as depicted in FIG. 1, rear and front housings 12a,
`arrangement of drivers 70, 82 and needle 64 with high fre-
`12 snap together to form unitary housing 12. A decorative
`quency driver boot 52 and low frequency driver boot 54
`member178 (e.g.,_trademark emblem) is connected with an
`removed isillustrated. As illustrated, in this form an output
`outside surface 180 of front housing 12a bya friction fit or an
`port 132 of spout 60 ofhigh frequencydriver 82 is positioned
`adhesive.
`in relative alignment with a generally cylindrical shaped
`acoustic damper134 that is positioned within nozzle housing
`14. Acoustic damper 134 includes a cylindrical bore or pas-
`sageway 136 that runs through the entire width or length of
`acoustic damper 134. Acoustic damper 134 is configured as
`an acoustic resistor to absorb the reactive components of the
`audio output or tunedto effectively control the rate at which
`sound energy is dissipated as it exits spout 60 and needle 64
`before traveling to nozzle 28 and out port 24 ofear tip 16. In
`one form, acoustic damper 134 is configured to reduce the
`
`[0048] Referring to FIG. 9, as previously set forth, audio
`cable 34 includesat least two audio wires 47a, 476 that are
`connected with flexible circuit board 48. In one form, the
`audio signals supplied by wires 47a, 475 are supplied to a low
`order electronic crossover 252. See FIG. 10. Low orderelec-
`tronic crossover 252 includes a low pass crossover 190 anda
`high pass crossover 192. A first audio signal is supplied to low
`pass crossover 190 and a second audio signal is supplied to
`high pass crossover 192. In one form, low pass crossover 190
`
`44
`
`44
`
`

`

`US 2010/0310106 Al
`
`Dec. 9, 2010
`
`includesa pair of resistors 194 and a capacitor 196 and high
`pass crossover 192 includes a resistor 198 and a capacitor
`200. Low passcrossover 190 is configuredto pass frequencies
`falling within a predetermined low frequency range andfilter
`out or block frequencies falling outside the predetermined
`low frequency range. High pass crossover 192 is configured
`to pass frequencies falling within a predeterminedhigh fre-
`quency range andfilter out or block frequencies falling out-
`side the predetermined high frequency range.
`[0049]
`Flexible circuit board 48 is connected with low fre-
`quency driver 70 and high frequencydriver 82. In particular,
`an analog audio output signal of low pass crossover 190 is
`supplied to low frequency driver 70 and a second analog
`output signal of high pass crossover 192 is supplied to high
`frequency driver 82. In one form, low frequency driver 70
`comprises a balanced armature receiver supplied by Klipsch,
`LLC as receiver model number KG731. High frequency
`driver 82 comprises a balanced armature receiver supplied by
`Klipsch, LLC as receiver model number KG732. In other
`forms, other types of drivers capable of reproducing acoustic
`energy or sound maybeutilized.
`[0050] Referring back to FIG.8, in one form bore or pas-
`sageway 150 ofneedle 64 hasan inside diameter ofabout 0.33
`millimeters (0.013 inches) and needle 64 has an outside diam-
`eter of about 0.7 millimeters (0.026 inches). In addition, the
`length of needle 64 is approximately 4-4.5 millimeters
`(0.1575-0.1772 inches), but different lengths may be utilized
`in alternative forms. Needle 64 may haveother inside diam-
`eters, outside diameters and lengths, but this inside diameter
`allows earphone 10 to be configured to have a crossover point
`around 1.0-1.5 kHz. Due to the small size of earphone 10,
`knownprior earphone designs were only capable of having
`crossover points configured at about 4 kHz. Lowering the
`crossover point together with providing at least two drivers
`allows earphones 10 to provide optimum audio reproduction.
`In particular, bass frequencies, in this case frequencies falling
`below about 1.0-1.5 kHz are capable of optimally being
`reproduced by low frequency driver 70 and frequencies above
`1.0-1.5 kHz are capable of optimally being reproduced by
`high frequency driver 82. A tunable cutoff frequency is
`capable of being provided by varying the length of needle 64.
`[0051] Referring to FIG. 10, a block diagram is depicted
`that illustrates earphone 10 in a more simplified block dia-
`gram format. As illustrated, audio cable 34 is connected with
`an audio source 250. In this form, a low order electronic
`crossover 252 is included in earphone 10. As previously set
`forth, low order electronic crossover 252 is configured to
`generate two audio output signals. A first audio output signal
`254 is supplied to low frequency driver 70 and a second audio
`output signal 256 is supplied to high frequency driver 82.
`[0052]
`In one form, low frequency audio driver 70 com-
`prises a dual balanced armature such as the one disclosed in
`USS. patent application Ser. No. 11/897,380 filed Aug. 30,
`2007 and entitled “Balanced Armature with Acoustic Low
`Pass Filter”, which is hereby incorporated by reference in its
`entirety. In an alternative form, low frequency audio driver 70
`comprises a dual balanced armaturethat hasa gridfilter 258
`located in spout 130. In this arrangement, grid filter 258
`includesa plurality of apertures or holes 260 that are config-
`ured to act as low passfiltering elements. In yet another form,
`acoustic damper 134 includesa grid filter 258 that is config-
`ured and operable to remove unwanted acoustic sounds.
`[0053] As illustrated, the audio output of low frequency
`driver 70 is directed into chamber 124. Tube 64is positioned
`in chamber124 and extends into combining chamber 152. As
`set forth above, tube 64 acts as a tuned low passfilter. High
`frequency driver 82 includes a snout 60 that is positioned in
`
`combining chamber 152. As such, the audio output of high
`frequency driver 82 is supplied to combining chamber 152.
`Combining chamber 152 combines the audio outputs sup-
`plied by tube 64 and high frequency driver 82 into an output
`thatis directed to acoustic damper 134. Acoustic damper 134
`also acts as a filter to remove undesirable audio signals. As
`such, low order electronic crossover 252, grid filter 258, tube
`64, and damper 134 create a 4th order low pass filter G.e—
`four separatefilters) in earphone 10.
`[0054] Referring to FIG. 11, yet another form ofthe present
`invention discloses an earphone 300 that includes a low fre-
`quency audio driver 302 and a high frequency audio driver
`304 positioned in a boot assembly or housing 306. A nozzle
`308 is connected with boot assembly 306 and acts as an
`acoustic exit in a mannersubstantially the same as pr