`(12) Patent Application Publication (10) Pub. No.: US 2008/0166001 A1
`Hankey et al.
`(43) Pub. Date:
`Jul. 10, 2008
`
`US 2008O166001A1
`
`(54) HEADSET WITH MICROPHONE AND
`CONNECTOR CO-LOCATION
`
`(75)
`
`Inventors:
`
`M. Evans Hankey, San Francisco,
`CA (US); Emery Sanford, San
`Francisco, CA (US); Christopher
`D. Prest, Mountain View, CA (US)
`
`Correspondence Address:
`ROPES & GRAY LLP
`PATENT DOCKETING39/361,1211 AVENUE OF
`THE AMERICAS
`NEW YORK, NY 10036-8704
`
`(73) Assignee:
`Appl. No.:
`
`(21)
`
`Apple Inc, Cupertino, CA (US)
`
`11/823,922
`
`(22)
`
`Filed:
`
`Jun. 28, 2007
`
`Related U.S. Application Data
`(60) Provisional application No. 60/879,177, filed on Jan.
`6, 2007, provisional application No. 60/879,193, filed
`on Jan. 6, 2007, provisional application No. 60/879,
`195, filed on Jan. 6, 2007, provisional application No.
`
`60/878,852, filed on Jan. 5, 2007, provisional applica
`tion No. 60/936,965, filed on Jun. 22, 2007.
`Publication Classification
`
`(51) Int. Cl.
`(2006.01)
`H04R L/10
`(52) U.S. Cl. ......................................... 381/364; 381/.361
`(57)
`ABSTRACT
`An electronic device is provided that includes a housing and
`a connector assembly coupled to the housing. The connector
`assembly can include a microphone port. The electronic
`device can further include a microphone mounted within the
`housing and a channel that fluidically couples the microphone
`to the microphone port. A joint connector and microphone
`assembly is also provided. The assembly can include a micro
`phone with a top Surface and side surfaces. The top surface of
`the microphone can include a microphone input. The assem
`bly can include a microphone boot mounted to the micro
`phone such that the boot interfaces with a portion of the top
`Surface and the side Surfaces to form a seal around the micro
`phone input. The microphone boot can include a connector
`sealing portion and an aperture for fluidically coupling the
`microphone input to a microphone port. The assembly can
`include a connector plate mounted to the connector sealing
`portion.
`
`10
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`MCROPHONE-7:
`MICROPHONE 17
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`APPLE 1005
`
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`Patent Application Publication
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`US 2008/O166001 A1
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`-
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`SPEAKER
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`McROPHONE-17
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`US 2008/O166001 A1
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`
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`SWITCHING
`CIRCUITRY
`
`FIG 2
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`3
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`US 2008/O166001 A1
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`ZZZZZZZZZZZZZZ///////
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`
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`CIRCUITRY
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`US 2008/O166001 A1
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`Patent Application Publication
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`Jul. 10, 2008 Sheet 29 of 60
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`US 2008/0166001 A1
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`PLACING BOTTOM INSERT INTO TUBEN2901
`
`2900
`
`APPLYING THREAD-LOCKING GLUE
`TO THE BOTTOMINSERT THREADS
`
`2902
`
`SCREWING NECKONTO THE INSERT -N-2903
`TO APREDETERMINED LEVEL
`
`ALIGNING THE NECK TO THE TUBE SO
`THAT ONE ORMORE TABS ON THENECK
`FIT WITHIN ONE OR MORE NOTCHES ON THE TUBE
`
`2904
`
`USING THE CUSTOMTOOL TO TURN THE
`BOTTOM INSERT WHILE THE NECK IS
`ROTATIONALLY FIXED TO THE TUBE
`
`2905
`
`TIGHTENING THE BOTTOM INSERT TO
`APREDETERMINED TOROUE
`
`2906
`
`2907
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`MOUNTING EARBUD HOUSING TO THE NECK SO THAT
`ONE OR MORE TABS ON THE NECKFIT WITHIN ONE
`ORMORE NOTCHES ON THE EARBUD HOUSING
`
`APPLYING THREAD-LOCKING GLUE
`TO THE TOPINSERT THREADS
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`2908
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`2909
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`APREDETERMINED TOROUE
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`2910
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`FIG. 29
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`HEADSET WITH MICROPHONE AND
`CONNECTOR CO-LOCATION
`
`CROSS REFERENCE TO RELATED
`APPLICATIONS
`0001. This application claims the benefit of certain
`copending, commonly assigned U.S. Provisional Patent
`Applications, namely, Ser. No. 60/878,852 filed on Jan. 5,
`2007: Ser. No. 60/879,177 filed on Jan. 6, 2007: Ser. No
`60/879,193 filed on Jan. 6, 2007: Ser. No. 60/879, 195 filed on
`Jan. 6, 2007; and Ser. No.
`filed on Jun. 22, 2007
`(Attorney Docket No. 104677-0102-001 (P5389USP1)),
`entitled “Single User Input Mechanism for Controlling Elec
`tronic Device Operations’; all of which are incorporated
`herein by reference.
`0002 Commonly assigned DiFonzo et al. U.S. patent
`application Ser. No. 1 1/235,873, filed Sep. 26, 2005 (Attor
`ney Docket No. P3794US1/119-0060US.1), entitled “Elec
`tromagnetic Connector for Electronic Device' is hereby
`incorporated by reference in its entirety.
`0003 Commonly assigned Rohrbach et al. U.S. patent
`application Ser. No. 1 1/235,875, filed Sep. 26, 2005 (Attor
`ney Docket No. P3593US1/119-0060US), entitled “Mag
`netic Connector for Electronic Device' is hereby incorpo
`rated by reference in its entirety.
`0004 Commonly assigned Andre et al. U.S. patent appli
`cation Ser. No. 1 1/456,833, filed Jul. 11, 2006 (Attorney
`Docket No. P3981US1), entitled “Invisible, Light-Transmis
`sive Display System” is hereby incorporated by reference in
`its entirety.
`0005 Commonly assigned Andre et al. U.S. patent appli
`cation Ser. No. 1 1/551,988, filed Oct. 23, 2006 (Attorney
`Docket No. P4246USX1), entitled “Invisible, Light-Trans
`missive Display System” is hereby incorporated by reference
`in its entirety.
`0006 Commonly assigned Sanford et al. U.S. patent
`application Ser. No. 1 1/651,094, filed Jan. 6, 2007 (Attorney
`Docket No. P4983US2), entitled “Antenna and Button
`Assembly for Wireless Devices” is hereby incorporated by
`reference in its entirety.
`0007 Commonly assigned Terlizzietal. U.S. patent appli
`cation Ser. No. 1 1/650,130, filed Jan. 5, 2007 (Attorney
`Docket No. 104677-0015-101 (P4630US1)), entitled “Sys
`tems and Methods for Determining the Configuration of Elec
`tronic Connections” is hereby incorporated by reference in its
`entirety.
`0008 Commonly assigned Rabu et al. U.S. patent appli
`cation Ser. No. 1 1/620,669, filed Jan. 6, 2007 (Attorney
`Docket No. 104677-0011-102 (P4628US2)), entitled “Appa
`ratuses and Methods that Facilitate the Transfer of Power and
`Information Among Electrical Devices” is hereby incorpo
`rated by reference in its entirety.
`
`FIELD OF INVENTION
`0009. The present invention can relate to headsets. More
`particularly, the present invention can relate to headsets for
`communicating with an electronic device.
`
`BACKGROUND OF THE INVENTION
`0010 Headsets for providing hands-free communications
`are known in the art. Such headsets typically can be used in
`conjunction with a cellular telephone or a computer (e.g.,
`Voice over IP). Some existing headsets include a microphone,
`
`a speaker (also referred to as a receiver), electronics for con
`trolling the headset and communicating with another device
`(e.g., a cellular telephone), a battery and a connector for
`re-charging the battery.
`0011. There are many aspects involved in the design of
`headsets. For example, the size and weight of headsets can be
`key issues because of how they typically mount to a user's ear.
`A heavy or large headset can pull on a user's ear, creating an
`uncomfortable fit. The shape of headset earpieces (e.g., ear
`buds) may also be an important design consideration to take
`into account as it is desirable for earpieces to fit comfortably
`in, on, or over a wide range of different sizes and shapes of
`CaS.
`0012. Additionally, the acoustic performance of headsets,
`Such as receiver Sound generation quality and microphone
`Sound reception quality (e.g., ability to pick up a user's voice
`without undue background noise), can be important design
`considerations. Achieving desired receiver and microphone
`acoustic performance can become increasingly difficult as the
`size of a headset decreases.
`0013 Another example of an important design consider
`ation can be the user interface of a headset. It may be desirable
`for a user interface to be intuitive for a first-time user, yet
`convenient for an experienced user.
`0014) Aesthetics may be yet another important, design
`consideration for headsets.
`0015. Further still, ease of manufacturing headsets can be
`another design consideration. For example, it can be desirable
`to design aheadset that can be mass produced in an affordable
`fashion.
`0016. In view of the foregoing, there is a need for an
`improved headset that addresses one or more of the above
`identified considerations.
`
`SUMMARY OF THE INVENTION
`
`0017. In accordance with one embodiment of the present
`invention, an electronic device is provided. The electronic
`device can include a housing and a connector assembly
`coupled to the housing. The connector assembly can include
`a microphone port. The electronic device can include a micro
`phone mounted within the housing and a channel that fluidi
`cally couples the microphone to the microphone port.
`0018. In accordance with another embodiment of the
`present invention, a joint connector and microphone assem
`bly is provided. The assembly can include a microphone with
`a top Surface and side Surfaces. The top surface of the micro
`phone can include a microphone input. The assembly can
`include a microphone boot mounted to the microphone Such
`that the boot interfaces with a portion of the top surface and
`the side Surfaces to form a seal around the microphone input.
`The microphone boot can include a connector sealing portion
`and an aperture for fluidically coupling the microphone input
`to a microphone port. The assembly can include a connector
`plate mounted to the connector sealing portion.
`0019. In accordance with yet another embodiment of the
`present invention, an electronic device is provided. The
`device can include an earbudassembly and a primary housing
`assembly fixed to the earbudassembly. The primary housing
`assembly can include an integrated connector and micro
`phone assembly. The integrated connector and microphone
`assembly can include a microphone port and a microphone
`operative to receive acoustic signals transmitted through the
`microphone port.
`
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`BRIEF DESCRIPTION OF THE DRAWINGS
`0020. The present invention will be apparent upon consid
`eration of the following detailed description, taken in con
`junction with accompanying drawings, in which:
`0021
`FIG. 1 is a simplified block diagram of a headset in
`accordance with an embodiment of the present invention;
`0022 FIG. 2 is a simplified block diagram of a headset
`connector System in accordance with an embodiment of the
`present invention;
`0023 FIG.3 is a simplified cross-sectional illustration of a
`connector assembly in accordance with an embodiment of the
`present invention;
`0024 FIG. 4 is a simplified cross-sectional illustration of
`another connector assembly in accordance with an embodi
`ment of the present invention;
`0025 FIG. 5 is a simplified block diagram of a headset in
`accordance with an embodiment of the present invention;
`0026 FIG. 6A is a simplified cross-sectional illustration
`of a portion of a headset inaccordance with an embodiment of
`the present invention;
`0027 FIG. 6B is a simplified cross-sectional illustration of
`a screw in accordance with an embodiment of the present
`invention;
`0028 FIG. 7 is a simplified block diagram of a display
`system in accordance with an embodiment of the present
`invention;
`0029 FIG. 8 is a simplified block diagram of a power
`distribution system in accordance with an embodiment of the
`present invention;
`0030 FIG. 9 is a simplified block diagram of another
`power distribution system inaccordance with an embodiment
`of the present invention;
`0031
`FIGS. 10A and 10B are illustrations of a headset in
`accordance with an embodiment of the present invention;
`0032 FIG. 11 is an exploded view of a headset in accor
`dance with an embodiment of the present invention;
`0033 FIG. 12 is an exploded view of a headset in accor
`dance with another embodiment of the present invention;
`0034 FIG. 13 is a simplified diagram showing how soft
`ware in a Bluetooth device is organized in accordance with an
`embodiment of the present invention;
`0035 FIG. 14 is a simplified block diagram of the electri
`cal system of a headset in accordance with an embodiment of
`the present invention;
`0036 FIG. 15 is a simplified block diagram of the core
`processor of a headset in accordance with an embodiment of
`the present invention;
`0037 FIG. 16 is a simplified schematic diagram of a
`power distribution system inaccordance with an embodiment
`of the present invention;
`0038 FIGS. 17A-17C are illustrations of a traditional cir
`cuitboard and distribution of electrical components in ahead
`Set;
`0039 FIG. 18 is a simplified block diagram of a circuit
`board with an improved distribution of electrical components
`in a headset in accordance with an embodiment of the present
`invention;
`0040 FIG. 19A and 19B are illustrations comparing the
`traditional circuit board of FIGS. 7A-7C to a circuit board
`with an improved distribution of electrical components in a
`headset in accordance with an embodiment of the present
`invention;
`
`FIG. 20A-20C are illustrations of an improved dis
`0041
`tribution of electrical components in a headset in accordance
`with an embodiment of the present invention;
`0042 FIG. 21A is an illustration of a headset earbud in
`accordance with an embodiment of the present invention;
`0043 FIG.21B is a simplified exploded view of a headset
`earbud in accordance with an embodiment of the present
`invention;
`0044 FIGS. 22-25 and FIG. 26A are simplified illustra
`tions of a headset earbud in various states of assembly in
`accordance with some embodiments of the present invention;
`0045 FIG. 26B is a simplified cross-sectional view of an
`audio receiver in accordance with an embodiment of the
`present invention;
`0046 FIG. 27A is a simplified cross-sectional view of a
`partially assembled headset earbud in accordance with an
`embodiment of the present invention;
`0047 FIG. 27B is a simplified cross-sectional view of a
`fully assembled headset earbud in accordance with an
`embodiment of the present invention;
`0048 FIG.28 is an exploded view of an attachment system
`in accordance with an embodiment of the present invention;
`0049 FIG. 29 is a flowchart of an illustrative process for
`assembling a portion of a headset in accordance with an
`embodiment of the present invention.
`0050 FIGS. 30A and 30B are illustrations of a tool that
`can be used to assist in assembly of a portion of a headset in
`accordance with an embodiment of the present invention;
`0051 FIG.30C is an illustration of the tool of FIGS. 30A
`and 30B being used in accordance with an embodiment of the
`present invention;
`0052 FIG.31 is a cross-sectional view of a “finished tube
`in accordance with an embodiment of the present invention;
`0053 FIG. 32 is a cross-sectional view of an initially
`manufactured tube in accordance with an embodiment of the
`present invention;
`0054 FIG.33 is a perspective view of a cross section of the
`tube of FIG. 31 in accordance with an embodiment of the
`present invention;
`0055 FIG. 34 is an illustrative die and stamper for modi
`fying the initially manufactured tube of FIG.32 in accordance
`with an embodiment of the present invention;
`0056 FIG.35 is a cross-sectional view of the tube of FIG.
`34 once the stamper and die are removed from the tube in
`accordance with an embodiment of the present invention;
`0057 FIG. 36 is a perspective view of the tube of FIG.35
`once the tube is machined to create an internal wall in accor
`dance with an embodiment of the present invention;
`0058 FIG. 37 is a cross-sectional view of an illustrative
`tube formed using a single impact extrusion in accordance
`with an embodiment of the present invention;
`0059 FIG.38 is a perspective view of the tube of FIG. 37
`once the tube is machined to create an internal wall in accor
`dance with an embodiment of the present invention;
`0060 FIG. 39 is a cross-sectional view of an illustrative
`tube formed using a double impact extrusion in accordance
`with an embodiment of the present invention;
`0061 FIG. 40 is a perspective view of the tube of FIG. 39
`once the tube is machined to create an internal wall in accor
`dance with an embodiment of the present invention;
`0062 FIG. 41 is a cross-sectional view of an illustrative
`tube formed using a progressive deep draw process in accor
`dance with an embodiment of the present invention;
`
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`0063 FIG.42 is a perspective view of a cross section of the
`tube of FIG. 41 in accordance with an embodiment of the
`present invention;
`0064 FIG. 43 is a perspective view of the tube of FIGS. 41
`and 42 once the tube is machined to create an internal wall in
`accordance with an embodiment of the present invention;
`0065 FIG. 44 is a flow chart of an illustrative process for
`forming an extruded tube with a feature on the internal sur
`face of the tube with using a die and Stamper in accordance
`with an embodiment of the present invention;
`0066 FIG. 45 is a flow chart of an illustrative process for
`forming a tube with a feature on the internal surface of the
`tube using a single impact extrusion in accordance with an
`embodiment of the present invention;
`0067 FIG. 46 is a flow chart of an illustrative process for
`forming a tube with a feature on the internal surface of the
`tube using a impact extrusion on both ends of the tube in
`accordance with an embodiment of the present invention;
`0068 FIG. 47 is a flow chart of an illustrative process for
`forming a tube with a feature on the internal surface of the
`tube using a progressive deep draw process in accordance
`with an embodiment of the present invention;
`0069 FIG. 48 is a cross-sectional view of a visual indica
`tor system in accordance with an embodiment of the present
`invention;
`0070 FIG.49 is an illustration of a visual indicator system
`of a headset in accordance with an embodiment of the present
`invention;
`(0071
`FIGS. 50A and 50B are illustrations of a headset in
`accordance with an embodiment of the present invention;
`0072 FIG. 51 is an illustration of a connector in accor
`dance with an embodiment of the present invention;
`0073 FIG. 52 is an exploded view of a connector in accor
`dance with an embodiment of the present invention;
`0074 FIG. 53 is an illustration of a microphone boot in
`accordance with an embodiment of the present invention;
`0075 FIG. 54 is a cross-sectional view of a connector in
`accordance with an embodiment of the present invention;
`0076 FIGS. 55A-55D are illustrations of a headset in
`accordance with an embodiment of the present invention;
`0077 FIG. 56 is a cross-sectional view of an electrical
`contact assembly coupled to a circuit board in accordance
`with an embodiment of the present invention;
`0078 FIGS. 57A and 57B are illustrations of an electrical
`contact assembly in accordance with an embodiment of the
`present invention;
`007.9
`FIGS. 58A-58C are illustrations of an electrical
`contact assembly in accordance with an embodiment of the
`present invention;
`0080 FIGS. 59A and 59B are illustrations of electrical
`contacts in accordance with an embodiment of the present
`invention;
`0081
`FIGS. 60A and 60B are illustrations of a connector
`plate inaccordance with an embodiment of the present inven
`tion;
`0082 FIGS. 61A and 61B are illustrations of magnetic
`components of a connector in accordance with an embodi
`ment of the present invention;
`0083 FIGS. 62A and 62B are illustrations of a connector
`in accordance with an embodiment of the present invention;
`0084 FIGS. 63A and 63B are illustrations of a connector
`in accordance with an embodiment of the present invention;
`
`I0085 FIG. 64 is an illustration of a headset coupling with
`a complementary connector in accordance with an embodi
`ment of the present invention;
`I0086
`FIG. 65 is a simplified graph of magnetic and spring
`forces involved in the coupling of a headset with a comple
`mentary connector in accordance with an embodiment of the
`present invention;
`I0087 FIG. 66 is an illustration of a docking device that can
`receive a headset in accordance with an embodiment of the
`present invention;
`0088 FIG. 67A is an illustration of a connector in accor
`dance with an embodiment of the present invention;
`I0089 FIG. 67B is an illustration of a headset coupling
`with a complementary connector in accordance with an
`embodiment of the present invention; and
`0090 FIG. 68 is a chart listing exemplary modes and func
`tions of a communications system in accordance with an
`embodiment of the present invention.
`
`DETAILED DESCRIPTION OF THE INVENTION
`0091. The present invention relates to headsets and meth
`ods for manufacturing the same. Headsets are communication
`devices that are worn on a user's head in order to allow hands
`free data and/or voice communication with a host device Such
`as a computer, phone handset, cellular phone, an automobile
`and/or the like. Headsets can include one or more speakers (in
`proximity to one or both ears) for audio output and/or one or
`more microphones for audio input.
`0092 Headsets can come in a variety of form factors or
`shapes. In some cases, headsets can be embodied as an ear
`piece that serves as the primary Support mechanism for wear
`ing the headset. For example the headset may be Supported on
`the head by an earpiece worn over or in the ear. Alternatively,
`the headset may be supported by a frame or band that fits on
`or over the user's head. The headset may include a fixed or
`movable boom that places the microphone closer to the user's
`mouth (wraps around the face). Alternatively, the headset
`may be boomless Such that the microphone is integrated with
`the earpiece thereby forming a more compact device (e.g.,
`Smaller, lighter, more aesthetically pleasing, etc.).
`0093. According to one aspect of the invention, the head
`set can be embodied as a small compact unit including a
`primary housing and an earbud member extending therefrom.
`The earbud member may be attached to or integrally formed
`with the primary housing. Various components can be placed
`at the surface of or within the confines of the earbud member
`and the primary housing. In fact, both of them can include one
`or more components depending on the needs of the device.
`The components contained within each of these can be widely
`varied. Examples of operational components can include
`speakers, microphones, antennas, connectors, buttons, dis
`plays, indicators, battery, and associated processors, control
`lers and circuitry. Generally, the earbud member includes at
`least a speaker while the primary housing includes at least a
`microphone (although this is not a requirement). Depending
`on their size, each of these members can include additional
`components of the headset. In one embodiment, the primary
`housing includes an antenna, user interface button, indicator
`or display (e.g., LEDs), battery, microphone, and/or a con
`nector along with any accompanying circuitry while a
`speaker, a processor, and its accompanying circuitry can be
`located in the earbud. The button can be located on one end of
`the main housing. A user can interface with this button to
`perform various functions (e.g., terminating calls).
`
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`0094. The shape and size and orientation of the earbud
`member and primary housing can be widely varied. In one
`embodiment, the earbud member is configured for insertion
`into the ear Such that it supports the remaining portions of the
`headset (e.g., primary housing) proximate the user's head. In
`one embodiment, the primary housing can be configured as a
`longitudinal member (e.g., a tube). In one example, an earbud
`member, which contains a speaker, perpendicularly protrudes
`away from one end of a longitudinally extending primary
`housing, which includes a microphone at an opposite end of
`the longitudinally extending primary housing. Furthermore,
`the earbud member can expand outwardly and then inwardly
`from a neck portion that couples to the primary housing in
`order to form a bud that fits into an ear.
`0095. The primary housing can include a tube that forms a
`housing and receives internal components through an open
`end. The tube can be manufactured using one of several
`processes in order to reduce costs and increase speed and
`efficiency. In one embodiment, the tube can be manufactured
`to include features on the inner surface of the tube for Sup
`porting electronic components of the headset. Processes for
`creating Such a tube can include applying a die and stamp to
`an extruded tube, single or double impact extrusion, or a
`progressive deep draw process.
`0096. The headset can include a hollow neck between the
`earbud and the primary housing in order to allow electrical
`wires to connect sets of discrete electronics disposed within
`the earbud and primary housing. In one embodiment, dual
`threaded inserts can be used to structurally reinforce the hol
`low neck without adding size to the device.
`0097 Small compact headsets have limited surface area
`for placing components. Therefore, one aspect of the inven
`tion relates to integrating multiple components into the same
`surface area of the headset in order to help form a small
`compact headset. Put another way, multiple components can
`be built into the same location on the headset in order to
`achieve the desired level of functionality without impacting a
`desired small size of the headset. The components may for
`example be selected from connectors, microphones, speak
`ers, buttons, indicators, displays and/or the like. In one
`embodiment, an antenna and a button function at the same
`location of the headset. In another embodiment, a micro
`phone and connector function at the same location of the
`headset. Other embodiments can also be realized. For
`example, a button can function at the same location of a
`speaker (e.g., at an earbud) or an indicator can function at the