`
`�
`
`ATTORNEYS AT LAW
`
`..
`-.J
`,. , 220FIFTHAVENUE,NEWYORK,N.Y. 10001-7708
`O
`g
`�-0-��HOLTZ
`U, ��DMAN
`-TIF:-VigLJ.CHICK
`�.BARTH
`DOUGL_QHOLTZ
`ROBERT P. MICHAL
`TELEPHONE: (212) 319-4900
`FACSIMILE: (212) 319-5101
`
`Commissioner for Patents
`p_Q_ Box 1450,
`Alexandria, VA 22313-1450
`
`Express Mail Mailing Label
`No. : EV 720 476 889 US
`
`Date of Deposit: September 21, 2005
`
`I hereby certify that this paper is
`being deposited with the United
`States Postal Service "Express Mail
`Post Office to Addressee" service
`under 37 CFR 1.10 on the date
`indicated above and is addressed to
`
`.
`°:co
`CJ)('t)
`'/ //_
`.--=-------�-----' _____ =>_·�
`
`the Commissioner for Patents, P.O.
`Box 1450¾Al andria, VA0
`2d313-
`450.
`I-co
`"Barbara Villani
`ff5� �T"""
`
`..- T"""
`
`Attorney Docket No. 05621/LH
`CUSTOMER NO. 01933
`Pursuant to 37 CFR 1.53(b ), transmitted herewith for filing is the patent application of
`·
`Fil.ING WITHOUT EXECUTED
`DECLARATION (37 CFR l.53(t))
`
`lnventor(s):
`
`Satoru SHIMO DA of Fussa-shi, Japan
`Tomoyuki SHIRASAKI of Higashiyamato-shi, Japan
`Jun OGURA ofFussa-shi, Japan
`Minoru KUMAGAI of Tokyo, Japan
`Title: "TRANSISTOR ARRAY SUBSTRATE AND DISPLAY PANEL"
`Priority Claim (35 U.S.C. 119) is made, based upon:
`Japan
`No. 2004-273532
`filed September 21, 2004
`Japan
`No. 2004-273580
`filed September 21, 2004
`Japan
`filed September 16, 2005
`No. 2005-269434
`ASSIGNMENT INFORMATION FOR PUBLICATION:
`
`Casio Computer Co., Ltd.
`Tokyo, Japan
`
`Enclosed herewith are:
`Specification (Description, Claims, Abstract): Pages 1 - 98 ; Number of claims 1 --2�5 __
`[X l
`Declaration and Power of Attorney
`--=2'-'-7 __ Sheets of drawings, Figures 1 -�
`( X ] Formal
`[ ] Informal
`Assignment and Recordation Form Cover Sheet (PTO-1595) AND $40. RECORD A TION FEE.
`Two Certified copies of priority documents identified above
`( X ] Form PTO/S:W08A
`Information Disclosure Statement;
`Change of Correspondence Address (Form PTO/SB/122)
`PTO Form 2038 (Payment by Credit Card)
`TO THE EXTENT NOT TENDERED BY CREDIT CARD PAYMENT ATTACHED HERETO,
`AUTHORIZATION IS GIVEN TO CHARGE ANY FEES UNDER 37 CFR 1.16 AND 1.17 DURING
`PENDENCY OF THE APPLICATION, OR TO CREDIT ANY OVERPAYMENT, TO DEPOSIT
`ACCOUNT NO. 06-1378. DUPLICATE COPY OF THIS LETTER IS ENCLOSED.
`Receipt Postcard
`
`[ ]
`[X ]
`[ ]
`[X
`[X ]
`[X]
`[X]
`[X]
`
`[X ]
`
`Number Filed
`Total Claims
`25
`-20
`Independent Claims
`3
`- 3
`Application Size Fee
`MULTIPLE DEPENDENT CLAIMS
`
`Number Extra Rate
`5
`X $ 50.00
`--'0'--
`X $200.00
`+ $360.00
`BASIC FEE
`(Including Filing, Search
`and Examination Fees)
`Total of above Calculations
`
`Calculations
`$ 250.00
`$
`s:-..,,.2-=-so,,...._=oo-=-
`$
`$.---,1,....,,0=0=0."""'o=o
`
`$ 1500.00
`
`AN & CHICK, P.C.
`
`LH:bv
`10/04
`
`i............_
`
`IPR2020-01546
`Apple EX1002 Page 1
`
`
`
`)
`
`PTO/SB/122 110-00)
`Approved for use through 10/31/2002. 0MB 0651-0035
`U.S. Patent and Trademark Office: U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no oersons are reauired to resoond to a collection of information unless it dlsolavs a valid 0MB control number.
`
`CHANGEOF
`
`CORRESPONDENC E ADDRESS
`Application
`
`Address to:
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`P.O. Box 1450
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`
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`
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`Attorney Docket Number
`
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`Herewith
`SHIMODA
`
`05621/LH
`
`Please change the Correspondence Address for the above-identified application to:
`[X]
`]
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`Address
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`Address
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`City
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`an existing Customer Number use "Request for Customer Number Data Change" (PTO/SB/124).
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`
`Applicant/Inventor.
`
`[ 1
`l Assignee of record of the entire interest. Statement under 37 CFR 3.73(b) is enclosed. (Form PTO/SB/96).
`[
`
`Attorney or Agent of record. Registration No. 22,974
`
`IX]
`
`I 1
`
`Telephone:
`
`(212) 319-4900
`
`,
`NOTE: Signatures of all the inventors or assignees of record of the entire interest or their representative(s) are required.
`Submit multiple forms if more than one signature is required. See below.
`
`..
`
`forms are submitted.
`I l Total of
`This collect1on of information Is required by 37 CFR 1.33. The information Is required to obtain or retain a benefit by the pubhc which Is to file (and by the USPTO to
`process) an application. Confidentiality Is govered by 35 USC 122 and 37 CFR 1.14. This collection is estimated to take 3 minuted t o complete, Including
`gathering, preparing and submitting the completed application to the USPTO. Time will vary depending upon the Individual case. Any comments on the amount of
`time you require to complete this form and/or suggestions for reducing this burden, should be sent to the Chief Information Officer, U.S. Patent and Trademark
`Office, U.S. Department of Commerce, P.O. Box 1450,Alexandria, VA 22313•1450. DO NOT SEND FEES OR COMPLETED FORMS TO THIS ADDRESS. SEN D TO:
`Commissioner for Patents, P.O. Box 1450, Alexandria, VA 22313-1450.
`
`Registered practitioner named in the application transmittal letter in an application without an executed oath or
`declaration. See 37 CFR 1.33(a)(1 ). Regi!ltration Number
`.
`Typed or Printed
`Name
`
`Reg. No. 22,974
`
`Leonar/ttoltz,
`Signature -------;;;;77
`Date September 21, .}'6os
`
`IPR2020-01546
`Apple EX1002 Page 2
`
`
`
`FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C.
`
`�
`
`ATTORNEYS AT LAW
`
`..
`-.J
`,. , 220FIFTHAVENUE,NEWYORK,N.Y. 10001-7708
`O
`g
`�-0-��HOLTZ
`U, ��DMAN
`-TIF:-VigLJ.CHICK
`�.BARTH
`DOUGL_QHOLTZ
`ROBERT P. MICHAL
`TELEPHONE: (212) 319-4900
`FACSIMILE: (212) 319-5101
`
`Commissioner for Patents
`p_Q_ Box 1450,
`Alexandria, VA 22313-1450
`
`Express Mail Mailing Label
`No. : EV 720 476 889 US
`
`Date of Deposit: September 21, 2005
`
`I hereby certify that this paper is
`being deposited with the United
`States Postal Service "Express Mail
`Post Office to Addressee" service
`under 37 CFR 1.10 on the date
`indicated above and is addressed to
`
`.
`°:co
`CJ)('t)
`'/ //_
`.--=-------�-----' _____ =>_·�
`
`the Commissioner for Patents, P.O.
`Box 1450¾Al andria, VA0
`2d313-
`450.
`I-co
`"Barbara Villani
`ff5� �T"""
`
`..- T"""
`
`Attorney Docket No. 05621/LH
`CUSTOMER NO. 01933
`Pursuant to 37 CFR 1.53(b ), transmitted herewith for filing is the patent application of
`·
`Fil.ING WITHOUT EXECUTED
`DECLARATION (37 CFR l.53(t))
`
`lnventor(s):
`
`Satoru SHIMO DA of Fussa-shi, Japan
`Tomoyuki SHIRASAKI of Higashiyamato-shi, Japan
`Jun OGURA ofFussa-shi, Japan
`Minoru KUMAGAI of Tokyo, Japan
`Title: "TRANSISTOR ARRAY SUBSTRATE AND DISPLAY PANEL"
`Priority Claim (35 U.S.C. 119) is made, based upon:
`Japan
`No. 2004-273532
`filed September 21, 2004
`Japan
`No. 2004-273580
`filed September 21, 2004
`Japan
`filed September 16, 2005
`No. 2005-269434
`ASSIGNMENT INFORMATION FOR PUBLICATION:
`
`Casio Computer Co., Ltd.
`Tokyo, Japan
`
`Enclosed herewith are:
`Specification (Description, Claims, Abstract): Pages 1 - 98 ; Number of claims 1 --2�5 __
`[X l
`Declaration and Power of Attorney
`--=2'-'-7 __ Sheets of drawings, Figures 1 -�
`( X ] Formal
`[ ] Informal
`Assignment and Recordation Form Cover Sheet (PTO-1595) AND $40. RECORD A TION FEE.
`Two Certified copies of priority documents identified above
`( X ] Form PTO/S:W08A
`Information Disclosure Statement;
`Change of Correspondence Address (Form PTO/SB/122)
`PTO Form 2038 (Payment by Credit Card)
`TO THE EXTENT NOT TENDERED BY CREDIT CARD PAYMENT ATTACHED HERETO,
`AUTHORIZATION IS GIVEN TO CHARGE ANY FEES UNDER 37 CFR 1.16 AND 1.17 DURING
`PENDENCY OF THE APPLICATION, OR TO CREDIT ANY OVERPAYMENT, TO DEPOSIT
`ACCOUNT NO. 06-1378. DUPLICATE COPY OF THIS LETTER IS ENCLOSED.
`Receipt Postcard
`
`[ ]
`[X ]
`[ ]
`[X
`[X ]
`[X]
`[X]
`[X]
`
`[X ]
`
`Number Filed
`Total Claims
`25
`-20
`Independent Claims
`3
`- 3
`Application Size Fee
`MULTIPLE DEPENDENT CLAIMS
`
`Number Extra Rate
`5
`X $ 50.00
`--'0'--
`X $200.00
`+ $360.00
`BASIC FEE
`(Including Filing, Search
`and Examination Fees)
`Total of above Calculations
`
`Calculations
`$ 250.00
`$
`s:-..,,.2-=-so,,...._=oo-=-
`$
`$.---,1,....,,0=0=0."""'o=o
`
`$ 1500.00
`
`AN & CHICK, P.C.
`
`LH:bv
`10/04
`
`i............_
`
`IPR2020-01546
`Apple EX1002 Page 3
`
`
`
`)
`
`PTO/SB/122 110-00)
`Approved for use through 10/31/2002. 0MB 0651-0035
`U.S. Patent and Trademark Office: U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no oersons are reauired to resoond to a collection of information unless it dlsolavs a valid 0MB control number.
`
`CHANGEOF
`
`CORRESPONDENC E ADDRESS
`Application
`
`Address to:
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA. 22313-1450
`
`Application Number
`
`Filing Date
`
`First Named Inventor
`
`Group Art Unit
`
`Examiner Name
`
`Attorney Docket Number
`
`Not yet assigned
`Herewith
`SHIMODA
`
`05621/LH
`
`Please change the Correspondence Address for the above-identified application to:
`[X]
`]
`Customer Number [ 01933
`
`-+
`
`OR
`
`[ I Firm or
`Individual Name
`
`Address
`
`Address
`
`City
`
`Country
`
`I State
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`
`I ZIP
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`I
`
`Telephone
`
`I
`I Fax
`This form cannot be used to change the data associated with a Customer Number. To change the data associated with
`an existing Customer Number use "Request for Customer Number Data Change" (PTO/SB/124).
`
`I am the:
`
`Applicant/Inventor.
`
`[ 1
`l Assignee of record of the entire interest. Statement under 37 CFR 3.73(b) is enclosed. (Form PTO/SB/96).
`[
`
`Attorney or Agent of record. Registration No. 22,974
`
`IX]
`
`I 1
`
`Telephone:
`
`(212) 319-4900
`
`,
`NOTE: Signatures of all the inventors or assignees of record of the entire interest or their representative(s) are required.
`Submit multiple forms if more than one signature is required. See below.
`
`..
`
`forms are submitted.
`I l Total of
`This collect1on of information Is required by 37 CFR 1.33. The information Is required to obtain or retain a benefit by the pubhc which Is to file (and by the USPTO to
`process) an application. Confidentiality Is govered by 35 USC 122 and 37 CFR 1.14. This collection is estimated to take 3 minuted t o complete, Including
`gathering, preparing and submitting the completed application to the USPTO. Time will vary depending upon the Individual case. Any comments on the amount of
`time you require to complete this form and/or suggestions for reducing this burden, should be sent to the Chief Information Officer, U.S. Patent and Trademark
`Office, U.S. Department of Commerce, P.O. Box 1450,Alexandria, VA 22313•1450. DO NOT SEND FEES OR COMPLETED FORMS TO THIS ADDRESS. SEN D TO:
`Commissioner for Patents, P.O. Box 1450, Alexandria, VA 22313-1450.
`
`Registered practitioner named in the application transmittal letter in an application without an executed oath or
`declaration. See 37 CFR 1.33(a)(1 ). Regi!ltration Number
`.
`Typed or Printed
`Name
`
`Reg. No. 22,974
`
`Leonar/ttoltz,
`Signature -------;;;;77
`Date September 21, .}'6os
`
`IPR2020-01546
`Apple EX1002 Page 4
`
`
`
`05Sl046
`
`1
`
`TITLE OF THE INVENTION
`
`TRANSISTOR ARRAY SUBSTRATE AND DISPLAY PANEL
`
`
`
`CROSS-REFERENCE TO RELATED APPLICATIONS
`
`This application is based upon and claims the
`
`5
`
`benefit of priority from prior Japanese Patent
`
`
`
`Applications No. 2004-273532, filed September 21, 2004;
`
`
`
`
`
`No. 2004-273580, filed September 21, 2004; and
`
`
`
`No. 2005-269434, filed September 16, 2005, the entire
`
`
`
`contents of all of which are incorporated herein by
`
`10 reference.
`
`BACKGROUND OF THE INVENTION
`
`1. Field of the Invention
`
`The present invention relates to a transistor
`
`array substrate having a plurality of transistors and,
`
`to a display panel using light-
`15 more particularly,
`
`emitting elements which cause self emission when a
`
`current is supplied by the transistor array substrate.
`
`2. Description of the Related Art
`
`
`
`Organic electroluminescent display panels can
`
`20 roughly be classified into passive driving types and
`
`active matrix driving types. Organic
`
`
`
`electroluminescent display panels of active matrix
`
`driving type are more e�cellent than those of passive
`
`
`
`
`
`driving type because of high contrast and high
`
`25 resolution. In a conventional
`organic
`
`
`
`electroluminescent display panel of active matrix
`
`display type described in, e.g., Jpn. Pat. Appln. KOKAI
`
`IPR2020-01546
`Apple EX1002 Page 5
`
`
`
`\1'
`
`1
`
`2
`
`5
`
`. '"\
`,J)-" Publication No. 8-330600, an organic electroluminescent
`element (to be referred to as an organic EL element
`
`hereinafter), a driving transistor which supplies a
`current to the organic EL element when a voltage signal
`
`corresponding to image data is applied to the gate of
`the transistor, and a switching transistor which
`performs switching to supply the voltage signal
`
`corresponding to image data to the gate of the driving
`transistor are arranged for each pixel. In this
`10 display panel, when a predetermined scan line is
`selected, the switching transistor is turned on. At
`
`this time, a voltage of level representing the
`
`luminance is applied to the gate of the driving
`transistor through a signal line. Thus, the driving
`
`15 transistor is turned on. A driving current having a
`
`magnitude corresponding to the level of the gate
`voltage is supplied from the power supply to the
`organic EL element through the source-to-drain path of
`
`the driving transistor. Consequently, the EL element
`20 emits light at a luminance corresponding to the
`magnitude of the current. During the period from the
`
`end of scan line selection to the next scan line
`
`25
`
`selection, the level of the gate voltage of the driving
`
`
`transistor is continuously held even after the
`switching transistor is turned off. Hence, the organic
`EL element keeps emitting light at a luminance
`corresponding
`to the magnitude of the driving current
`
`IPR2020-01546
`Apple EX1002 Page 6
`
`
`
`3
`
`
`
`corresponding to the voltage.
`
`
`
`To drive the organic electroluminescent display
`
`panel, a driving circuit is provided around the display
`
`panel to apply a voltage to the scan lines, signal
`
`5
`
`lines, and power supply lines laid on the display
`
`panel.
`
`In the conventional organic electroluminescent
`
`display panel of active matrix driving type,
`
`interconnections such as a power supply line to.supply
`
`10 a current to an organic EL element are patterned
`
`
`
`simultaneously in the thin-film transistor patterning
`
`step by using the material of a thin-film transistor
`
`such as a switching transistor or driving transistor.
`
`
`
`More specifically, in manufacturing the display panel,
`
`15 a conductive thin film as a prospective electrode of a
`
`thin-film transistor is subjected to·photolithography
`
`and etching to form the electrode of a thin-film
`
`transistor from the conductive thin film. At the same
`
`
`
`time, an interconnection connected to the electrode is
`
`20
`
`also formed. For this reason, when the interconnection
`
`is formed from the conductive thin film, the thickness
`
`
`
`of the interconnection equals that of the thin-film
`
`transistor.
`
`The electrode of the thin-film transistor.is
`
`25 designed assuming that it functions as a transistor.
`
`In other words, the electrode is not designed assuming
`
`
`
`that it supplies a current to a light-emitting element.
`
`IPR2020-01546
`Apple EX1002 Page 7
`
`
`
`4
`
`Hence, the thin-film transistor is thin literally. If
`
`
`
`a current is supplied from the interconnection to a
`
`
`
`plurality of light-emitting elements, a voltage drop
`
`occurs, or the current flow through the interconnection
`
`5
`
`delays due to the electrical resistance of the
`
`interconnection.
`To suppress the voltage drop or
`
`
`
`interconnection delay, the resistance of the
`
`
`
`interconnection is preferably low. If the resistance
`
`
`
`of the interconnection is reduced by making a metal
`
`10 layer serving as the source and drain of the transistor
`
`or a metal layer serving as the gate electrode thick,
`
`
`
`or patterning the metal layers considerably wide to
`
`
`
`sufficiently flow the current through the metal layers,
`
`
`
`the overlap area of the interconnection on another
`
`
`
`15 interconnection or conductor when viewed from the upper
`
`side increases, and a parasitic capacitance is
`
`generated between them. This retards the flow of the
`
`
`
`current. Alternatively, in a so-called bottom emission
`
`structure which emits EL light from the transistor
`
`20 array substrate side, light emitted from the EL
`
`
`
`elements is shielded by the interconnections, resulting
`
`in a decrease in opening ratio, i.e., the ratio of the
`
`light emission area. If the gate electrode of the
`
`thin-film transistor is made thick to lower the
`
`25 resistance, a planarization film (corresponding
`to a
`
`gate insulating film when the thin-film transistor has,
`
`e.g., an inverted stagger structure) to eliminate the
`
`IPR2020-01546
`Apple EX1002 Page 8
`
`
`
`•
`
`5
`
`step of the gate electrode must also be formed thick.
`
`This may lead to a large change in transistor
`
`When the source and drain are formed
`characteristic.
`
`thick, the etching accuracy of the source and drain
`
`5
`
`degrades. This may also adversely affect the
`
`transistor characteristic.
`
`BRIEF SUMMARY OF THE INVENTION
`
`It is an object of the present invention to
`
`
`
`satisfactorily drive a light-emitting element while
`
`10 suppressing any voltage dfOP and signal delay.
`
`A transistor array substrate according to a first
`
`aspect of the present invention comprises:
`
`a substrate;
`
`a plurality of driving transistors which are
`
`15 arrayed in a matrix on the substrate, each of the
`
`driving transistors having a gate, a source, a drain,
`
`
`
`and a gate insulating film inserted between the gate,
`
`and the source and drain;
`
`a plurality of signal lines which are patterned
`
`20 together with the gates of the plurality of driving
`
`transistors and arrayed to run in a predetermined
`
`direction on the substrate;
`
`a plurality of supply lines which are patterned
`
`together with the sources and drains of the plurality
`
`25 of driving transistors and arrayed to cross the
`
`plurality of signal lines via the gate insulating film,
`
`each of the supply lines being electrically connected
`
`IPR2020-01546
`Apple EX1002 Page 9
`
`
`
`1
`
`•
`
`6
`
`to one of the source and the drain of the driving
`
`transistor; and
`
`
`
`a plurality of feed interconnections which are
`
`formed on the plurality of supply lines along the
`
`5
`
`plurality of supply lines, respectively.
`
`
`
`Preferably, a substrate according to claim 1,
`
`further comprising a plurality of scan lines which are
`
`patterned together with the sources and drains of the
`
`
`
`plurality of driving transistors and arrayed to cross
`
`10 the plurality of supply lines via the gate insulating
`
`film.
`
`
`
`Preferably, a substrate according to claim 2,
`
`which further comprises a plurality of switch
`
`
`
`transistors which are arrayed in a matrix on the
`
`
`
`15 substrate, each of the switch transistors having the
`
`gate insulating film inserted between a gate and a
`
`source and drain, and
`
`in which one of the source and drain of each of
`
`the plurality of switch transistors is electrically
`
`20 connected to the other of the source and drain of a
`
`
`
`corresponding one of the plurality of driving
`
`transistors,
`
`the gate of each of the plurality of switch
`
`
`
`transistors is electrically connected to the scan line
`
`25 through a contact hole formed in the gate insulating
`
`film, and
`
`the other of the source and drain of each of the
`
`IPR2020-01546
`Apple EX1002 Page 10
`
`
`
`•
`
`7
`
`plurality of switch transistors is electrically
`
`connected to the signal line through a contact hole
`
`formed in the gate insulating film.
`
`Preferably,
`a substrate according to claim 2,
`
`5
`
`which further comprises a plurality of holding
`
`transistors which are arrayed in a matrix on the
`
`substrate, each of the holding transistors having the
`
`
`
`gate insulating film inserted between a gate and a
`
`source and drain, and
`
`10
`
`in which one of the source and drain of each of
`
`the plurality of holding transistors is electrically
`
`
`
`connected to the gate of a corresponding one of the
`
`plurality of driving transistors through a contact hole
`
`formed in the gate insulating film,
`
`15
`
`the other of the source and drain of each of the
`
`
`
`plurality of holding transistors is electrically
`
`connected to one of the supply line and the scan line,
`
`and
`
`the gate of each of the plurality of holding
`
`
`
`20 transistors is electrically connected to the scan line
`
`through a contact hole formed in the gate insulating
`
`film.
`
`
`
`A display panel according to a second aspect of
`
`the present invention is a display panel comprising:
`
`25
`
`a substrate;
`
`a plurality of driving transistors which are
`
`arrayed in a matrix on the substrate, each of the
`
`IPR2020-01546
`Apple EX1002 Page 11
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`8
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`driving transistors having a gate, a source, a drain,
`
`and a gate insulating film inserted between the gate,
`
`and the source and drain;
`
`a plurality of signal lines which are patterned
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`5
`
`together with the gates of the plurality of driving
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`transistors and arrayed to run in a predetermined
`
`direction on the substrate;
`
`a plurality of supply lines which are patterned
`
`together with the sources and drains of the plurality
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`10 of driving transistors and arrayed to cross the
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`plurality of signal lines via the gate insulating film,
`
`
`
`each of the supply lines being electrically connected
`
`to one of the source and the drain of the driving
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`transistor; and
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`15
`
`
`
`a plurality of feed interconnections which are
`
`connected to the plurality of supply lines along the
`
`plurality of supply lines;
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`a plurality of pixel electrodes each of which .is
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`
`
`electrically connected to the other of the source and
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`20 the drain of each of the plurality of driving
`
`transistors;
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`
`
`a plurality of light-emitting layers which are
`
`formed on the plurality of pixel electrodes,
`
`
`
`respectively; and
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`25
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`a counter electrode which covers the plurality of
`
`
`
`light-emitting layers.
`
`
`
`Preferably, a panel according to claim 13, further
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`IPR2020-01546
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`9
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`comprising a plurality of scan lines which are
`
`patterned together with the sources and drains of the
`
`
`
`plurality of driving transistors and arrayed to cross
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`the plurality of supply lines via the gate insulating
`
`5
`
`film.
`
`According to this aspect, the signal lines are
`
`patterned together with the gates of the driving
`
`transistors. However, since the feed interconnections
`
`are stacked on the supply lines, the feed
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`
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`10 interconnections are formed separately for the drains,
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`sources, and gates of the driving transistors. For
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`
`
`this reason, the feed interconnection can be made thick
`
`without increasing its width, and the resistance of the
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`feed interconnection can be reduced. Hence, even when
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`15 a signal is output to the driving transistor and pixel
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`
`
`electrode through the feed interconnection, the voltage
`
`drop and signal delay can be suppressed.
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`
`
`When the feed interconnections are to be formed by
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`
`
`electroplating, the supply lines are formed on the
`
`20
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`signal lines.
`When the structure is dipped in a
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`plating solution while a voltage is applied to the
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`
`
`supply lines in the manufacturing step of the
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`transistor array substrate and the display panel,
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`
`
`the feed interconnections can be grown on the supply
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`25 lines.
`
`According to this aspect, since the feed
`
`
`
`interconnections can be made thick, the resistance of
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`Apple EX1002 Page 13
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`10
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`the feed interconnections can be reduced. When the
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`resistance of the feed interconnections decreases, the
`
`signal delay and voltage drop can be suppressed.
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`
`
`A display panel manufacturing method according to
`
`5
`
`a fourth aspect of the present invention is claim 18.
`
`
`
`A thick interconnection can suppress the voltage
`
`drop and can also be used as a partition wall in
`
`
`
`forming an organic compound-containing solution. Since
`
`the liquid repellent conductive layer exhibits liquid
`
`10 repellency, an organic compound layer can
`
`
`
`satisfactorily be patterned. A liquid repellent
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`conductive layer containing, �.g., a triazine compound
`
`can selectively be formed on a metal surface so as to
`
`exhibit liquid repellency but cannot be formed on the
`
`15 surface of an insulator or a metal oxide to exhibit
`
`liquid repellency. In addition, the liquid repellent
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`conductive layer is formed on the metal surface very
`
`thin. Hence, the electrical conductivity on the metal
`
`surface is not lost.
`
`20
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`
`
`BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
`
`FIG. 1 is a view showing the circuit arrangement
`
`of an EL display panel together with an insulating
`
`substrate;
`
`FIG. 2 is an equivalent circuit diagram of a pixel
`
`25 circuit of the EL display panel;
`
`FIG. 3 is a plan view showing the electrode of the
`
`pixel circuit of the EL display panel;
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`11
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`FIG. 4 is a plan view showing the electrode of the
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`pixel circuit of the EL display panel;
`
`FIG. 5 is a sectional view taken along a line
`
`V - V in FIG. 3;
`
`5
`
`FIG. 6 is a sectional view taken along a line
`
`VI - VI in FIG. 3;
`
`FIG. 7 is a sectional view taken along a line
`
`VII - VII in FIG. 3;
`
`FIG. 8 is a sectional view taken along a line
`
`10 VIII - VIII in FIG. 3;
`
`FIG. 9 is a plan view showing a state wherein a
`
`gate layer is patterned;
`
`FIG. 10 is a plan view showing a state wherein a
`
`drain layer is patterned;
`
`15
`
`FIG. 11 is a plan view showing a state wherein the
`
`drain layer is superposed on the patterned gate layer;
`
`FIG. 12 is a schematic plan view showing the
`
`layout of an organic EL layer of the EL display panel;
`
`FIG. 13 is a timing chart for explaining a driving
`
`20 method of the EL display panel;
`
`FIG. 14 is a timing chart for explaining another
`
`
`
`driving method of the EL display panel;
`
`FIG. 15 is a graph showing the current vs. voltage
`
`
`
`characteristic of the driving transistor and organic EL
`
`
`
`
`
`25 element of each pixel circuit;
`
`FIG. 16 is a graph showing the correlation between
`
`the maximum voltage drop and the interconnection
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`IPR2020-01546
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`resistivity p/sectional area S of the feed
`
`
`
`interconnection and common interconnection of a 32-inch
`
`
`
`EL display panel;
`
`FIG. 17 is a graph showing the correlation between
`
`5
`
`the sectional area and the current density of the feed
`
`
`
`interconnection and common interconnection of the
`
`
`
`32-inch EL display panel;
`
`FIG. 18 is a graph showing the correlation between
`
`the maximum voltage drop and the interconnection
`
`10 resistivity p/sectional area S of the feed
`
`
`
`interconnection and common interconnection of a 40-inch
`
`
`
`EL display panel l;
`
`FIG. 19 is a graph showing the correlation between
`
`
`
`the sectional area and the current density of the feed
`
`
`
`15 interconnection and common interconnection of the
`
`
`
`40-inch EL display panel;
`
`FIG. 20 is a view showing the circuit arrangement
`
`of an EL display panel together with an insulating
`
`substrate;
`
`20
`
`FIG. 21 is an equivalent circuit diagram of a
`
`pixel circuit of the EL display panel;
`
`FIG. 22 is a plan view showing the electrodes of
`
`pixel circuits Pi,j and Pi,j+l of the EL d�splay panel;
`
`FIG. 23 is a sectional view taken along a plane
`
`
`
`25 perpendicular to the channel width of a driving
`
`transistor;
`
`FIG. 24 is a sectional view taken along a line
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`IPR2020-01546
`Apple EX1002 Page 16
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`..
`
`13
`
`XXIV - XXIV in FIG. 22;
`
`FIG. 25 is a sectional view taken along a line
`
`XXV - XXV in FIG. 22;
`
`FIG. 26 is a schematic view showing the coating
`
`5
`
`structure of a liquid repellent conductive film;
`
`FIG. 27 is a schematic plan view showing the
`
`layout of the organic EL layers of the EL display
`
`panel; and
`
`FIG. 28 is a timing chart for explaining the
`
`10 operation of the EL display panel.
`
`DETAILED DESCRIPTION OF THE INVENTION
`
`[First Embodiment]
`
`
`
`The best mode for carrying out the present
`
`invention will be described below with reference to the
`
`
`
`15 accompanying drawing. Various kinds of limitations
`
`
`
`which are technically preferable in carrying out the
`
`
`
`present invention are added to the embodiments to be
`
`described below.
`However, the spirit and scope of the
`
`present invention are not limited to the following
`
`20 embodiments and illustrated examples.
`
`[Overall Arrangement of EL Display Panel]
`
`FIG. 1 is a schematic view showing an EL display
`
`panel 1 of active matrix driving type. As shown in
`
`FIG. 1, the EL display panel 1 comprises an insulating
`
`25 substrate 2, � (a plurality of) signal lines Y1 to Yn,
`
`� (a plurality of) scan lines X1 to Xm, � (a plurality
`
`of) supply lines Z1 to Zrn, (m X n} pixel circuits P1, 1
`
`IPR2020-01546
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`14
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`to Pm,n, a plurality of feed interconnections
`90, and
`common interconnections 91. The insulating substrate 2
`
`is optically transparent and has a flexible sheet shape
`
`or a rigid plate shape. The signal lines Y1 to Yn are
`arrayed on the insulating substrate 2 in parallel to
`
`
`5
`
`each oiher. The scan lines X1 to Xm are arrayed on the
`
`insulating substrate 2 to be perpendicularly to the
`
`signal lines Y1 to Yn when the insulating substrate 2
`
`
`is viewed from the upper side. The supply lines Z1 to
`
`10
`
`Zm are arrayed on the insulating substrate 2 between
`the scan lines X1 to Xm to be parallel to them so that
`The pixel
`the supply lines and scan lines alternate.
`
`circuits P1,1 to Pm,n are arrayed on the insulating
`
`substrate 2 in a matrix along the signal lines Y1 to Yn
`and scan lines X1 to Xm. The feed interconnections 90
`
`
`15
`
`are provided in parallel to the supply lines Z1 to Zm
`
`when viewed from the upper side. The common
`
`
`
`interconnections 91 are provided in parallel to the
`
`
`
`signal lines Y1 to Yn when viewed from the upper side.
`In the following description, the direction in
`
`20
`
`which the signal lines Y1 to Yn run will be defined as
`the vertical direction (column direction), and the
`
`direction in which the scan lines X1 to Xm run will be
`defined as the horizontal direction (row direction).
`
`25 In addition,� and n are natural numbers (m > 2,
`
`n > 2). The subscript added to a scan line X
`
`represents the sequence from the top in FIG. 1. The
`
`IPR2020-01546
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`15
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`subscript added to a supply line Z represents the
`
`sequence from the top in FIG. 1. The subscript added
`
`to a signal line Y represents the sequence from the
`
`left in FIG. 1. The first subscript added to a pixel
`
`5
`
`circuit P represents the sequence from the top, and the
`
`second subscript represents the sequence from the left.
`
`
`
`More specifically, let i be an arbitrary natural number
`
`of 1 to�, and i be an arbitrary natural number of 1 to
`
`�, a scan line Xi is the ith row from the top, a supply
`
`10 line Zi is the ith row from the top, a signal line Yj
`
`is the jth column from the left, and a pixel circuit
`
`Pi,j is located on the ith row from the top and the jth
`
`left. The pixel circuit Pi,j is
`column from the
`
`connected to the scan line Xi, supply line Zi, and
`
`15 signal line Yj·
`
`
`
`The total number of feed interconnections 90 ism.
`
`
`
`A voltage VL to flow a write current and a voltage VH
`
`to flow a driving current are applied from a left
`
`terminal 90b and right terminal 90c on the insulating
`
`20
`
`
`
`substrate 2 to each feed interconnection 90. For this
`
`
`
`reason, the voltage drop of the feed interconnection 90
`
`can be suppressed small as compared to when applying
`
`the voltages VL and VH from one of the left terminal
`
`90b and right terminal 90c. The feed interconnections
`
`
`
`25 90 are formed on the upper surfaces of the supply lines
`
`Z1 to Zm to be electrically
`connected to them.
`
`
`
`The total number of common interconnections 91 is
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`IPR2020-01546
`Apple EX1002 Page 19
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`16
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`
`
`n+l. Two common interconnections 91 adjacent in the
`
`row direction also function as partition walls to
`
`partition, in film formation, organic EL layers 20b of
`
`
`
`organic EL elements (light-emitting elements) 20
`
`5
`
`
`
`arranged between them. The common interconnections 91
`
`are connected to a lead interconnection
`91a on the
`
`
`
`front side and to a lead interconnection 91b on the
`
`
`
`rear side. The lead interconnections 91a and 91b have
`
`
`
`the same thickness as the common interconnections 91
`
`10 and also function as partition walls to partition the
`
`
`
`organic EL layers 20b in the fore-and-aft direction in
`
`
`
`film formation. The common interconnections 91 are
`
`connected to an external device through interconnection
`
`terminals 91c. A common potential Vcom is