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`UNTTED STATES DEPARTMENT OF COMMERCE
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`FIRST NAMED APPLICANT
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`ATTY. DOCKET NO./TITLE
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`APPLICATION NUMBER
`
`FILING OR 371(C) DATE
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`61/677,346
`
`07/30/2012
`
`25883
`HOWISON & ARNOTT,L.L.P
`
`P.O. BOX 741715
`DALLAS, TX 75374-1715
`
`DAVID SIUCHEONG
`AUYEUNG
`
`UVLD-31391
`CONFIRMATIONNO. 3248
`
`MISCELLANEOUS NOTICE
`
`AA
`00000006849
`Date Mailed: 06/06/2014
`
`A communication which cannotbe delivered in electronic form has been mailed to the applicant.
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`page 1 of 1
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`Page 1 of 44
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`SAMSUNG EXHIBIT 1028
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`SAMSUNG EXHIBIT 1028
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`UNITED STATES PATENT AND TRADEMARK OFFICE
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`Doc Code: N572
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`x
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`APPLICATION NUMBER
`
`]
`
`61/677,346
`
`.
`
`FILING DATE
`
`07/30/2012
`
`FIRST NAMED APPLICANT
`DAVID SIUCHEONG
`
`AUYEUNG
`
`ATTY. DOCKET NO/TITLE
`
`Z
`
`UVLD-31391
`
`2588325083ARNOTTLLP Nc
`
`
`P.O. BOX 741715
`DALLAS, TX 75374-1715
`
`CONFIRMATION NO. 3248
`
`Cc: SLATER & MATSIL,L.L.P.
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`DALLAS, TX 75252-5793
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`Date Mailed: 06/06/2014
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`DENIAL OF REQUEST FOR POWER OF ATTORNEY
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`effective on June 25, 2004. See 37 CFR 1.32.
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`O The revocation is not signed by the applicant, the assignee of the entire interest, or one particular
`principal attorney having the authority to revoke.
`Athe PowerofAttorney is from an assignee andthe Certificate required by 37 CFR 3.73(b) has not been
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`received.
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`L) The person signing for the assignee has omitted their empowermentto sign on behalf of the assignee.
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`_aco-inventorin this application, has been omitted.
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`Doc Code: PA..
`PTO/AIA/82A (07-13)
`Approved for use through 11/30/2014. OMB 0651-0051
`Document Description: Powerof Attorney
`U.S. Patent and Trademark Office; US. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection ofinformation unless it displays a valid OMB control number.
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`TRANSMITTAL FOR POWER OF ATTORNEY TO ONE OR MORE
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`Application Number
`
`61/677 ,346
`
`Filing Date
`
`07/30/2012
`
`First Named Inventor
`
`David Siucheong Auyeung
`
`Heat Sink For LED Light Source
`
`forms are submitted.
`
`Attorney Docket Number|UVI-OQO2P
`
`SIGNATURE of Applicant or Patent Practitioner
`
`/Srinivasan Chakravarthi/|°**(©»m 5/30/2014
`Srinivasan Chakravarthi
`Noon
`
`Title (if Applicant is a
`juristic entity}
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`NOTE: This form must be signed in accordance with 37 CFR 1.33. See 37 CFR 1.4(d) for signature requirements and certifications. If
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`*Total of
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`ff you need assistance in completing the form, calf 17-800-PTO-9199 and select option 2.
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`Doc Code: PA..
`Document Description: Powerof Attorney
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`PTO/AIA/B2B (07-13)
`Approved foruse through 11/30/2014. OMB 0651-0051
`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995, no persons are required to respondto a collection of information untessit displays a valid OMB control number
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`POWEROF ATTORNEYBY APPLICANT
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`Filing Date
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`letter or the boxes aboveto:
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`The address associated with the above-mentioned Customer Number
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`OR
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`[] The addressassociated with Customer Number: | |
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`OR
`Fi
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`.
`Slater & Matsil, L.L-P.
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`[CityStateTip
`CS
`Telephone
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`
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`| am the Applicant(if the Applicant is a juristic entity, list the Applicant namein the box):
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`| hereby revoke all previous powers of attorney given in the application identified in either the attached transmittalletter or
`the boxes below.
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`(Note: The boxes above maybe left blank if information is provided on form PTO/AIA/82A.)
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`| hereby appoint the Patent Practitioner(s) associated with the following Customer Numberas my/our attorney(s) or agent(s),and
`to transact all business in the United States Patent and Trademark Office connected therewith for the application referencedin
`the attached transmittal letter (form PTO/AIA/82A)or identified above:
`
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`oR
`25962
`[| I hereby appoint Practitioner(s) namedin the attachedlist (form PTO/AIA/82C) as my/our attorney(s) or agent(s), and to transact
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` Please recognize or change the correspondence address for the application identified in the attached transmittal
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`Ultravision Holdings, LLC
`[] Inventoror Joint Inventor(title not required below)
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`[| Legal Representative of a Deceased or Legally incapacitated Inventor(title not required below)
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`Assignee or Person to Whom the Inventor is Under an Obligation to Assign (provide signer’stitle if applicantis a juristic entity)
`[] Person Who Otherwise Shows Sufficient Proprietary Interest (e.g., a petition under 37 CFR 1.46(b)(2) was granted in the
`
`
`application or is concurrently being filed with this document)
`(provide signer’stitle if applicantis a juristic enti
`SIGNATUREof Applicant for Patent
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`The undersigned (whosetitle is suppliedbelow)isguthé eAyGyact on behalf of the applicant (e.g., where the applicantis a juristic entity).
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`j
`9)
`|SignatureLeopel alyiate(Options)TOOOOOCO™C™~—OOSOCS
`[NameWitteman YN
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`
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`Page 4 of 44
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`NOTE: Signature - This form must be signed by the applicant in accordance with 37 CFR 1.33. See 37 CFR 1.4 for signature requirements
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`and certifications. If more than one applicant, use multiple forms.
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` 1 forms are submitted. Cbrotai of
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`This collection of information is required by 37 CFR 1.131, 1.32, and 1.33. The informationis required to obtain orretain a benefit by the public which is to file (and by the
`USPTOto process) an application. Confidentlatity is govemed by 35 U.S.C. 122 and 37 CFR 1.11 and 1.14. This collection is estimated to take 3 minutes to complete,
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`Page 4 of 44
`
`
`
`Electronic AcknowledgementReceipt
`
`
`
`Application Number: 61677346
`
`International Application Number:
`
`Confirmation Number:
`
`3248
`
`Title of Invention:
`
`HEAT SINK FOR LED LIGHT SOURCE
`
`
`
`ee
`
`Attorney Docket Number:
`
`[ore
`
`UVLD-31391
`
`
`
`Receipt Date: 30-MAY-2014
`
`Filing Date:
`
`30-JUL-2012
`
`Paymentinformation:
`
`437095
`
`File Size(Bytes)/
`.
`sas
`Document
`
`
`
`
`Number Message Digest|Part/.zip|DocumentDescription File Name (ifappl.)
`
`806534
`
`Power of Attorney
`
`UVI-002P_POA.pdf
`
`adbe84b832a2a3a6734ad39902ba59ce3d
`
`Warnings:
`Information:
`
`Page 5 of 44
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`Page 5 of 44
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`
`
`
`Total Files Size (in bytes) 806534
`
`This Acknowledgement Receipt evidences receipt on the noted date by the USPTOof the indicated documents,
`characterized by the applicant, and including page counts, where applicable.It serves as evidence of receipt similar to a
`Post Card, as described in MPEP 503.
`
`New Applications Under 35 U.S.C. 111
`If a new application is being filed and the application includes the necessary componentsforafiling date (see 37 CFR
`1.53(b)-(d) and MPEP 506), a Filing Receipt (37 CFR 1.54) will be issued in due course and the date shownon this
`AcknowledgementReceiptwill establish the filing date of the application.
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`National Stage of an International Application under 35 U.S.C. 371
`If a timely submission to enter the national stage of an international application is compliant with the conditions of 35
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`national stage submission under 35 U.S.C. 371 will be issued in addition to the Filing Receipt, in due course.
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`New International Application Filed with the USPTO as a Receiving Office
`If a new international application is being filed and the international application includes the necessary components for
`an international filing date (see PCT Article 11 and MPEP 1810), a Notification of the International Application Number
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`www.uspto.gov
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`UNITED STATES DEPARTMENT OF COMMERCE
`United States Patent and Trademark Office
`Address:COMMISSIONER FOR PATENTS
`P.O. Box 1450
`Alexandria, Virgnia 22313-1450
`
` APPLICATION
`
`ATTY.DOCKET.NO
`
`TOT CLAIMSJIND CLAIMS
`
`NUMBER
`
`FILING or
`371(c) DATE
`
`GRP ART
`UNIT
`
`
`
`FIL FEE REC'D
`
`61/677,346
`
`07/30/2012
`
`125
`
`UVLD-31391
`
`25883
`HOWISON & ARNOTT, L.L.P
`
`P.0. BOX 741715
`
`DALLAS, TX 75374-1715
`
`CONFIRMATION NO. 3248
`
`FILING RECEIPT
`
`0000.09.000
`
`Date Mailed: 08/09/2012
`
`It will not be examined for patentability and will
`Receipt is acknowledged of this provisional patent application.
`become abandonednotlater than twelve monthsafter its filing date. Any correspondence concerning the application
`mustinclude the following identification information: the U.S. APPLICATION NUMBER, FILING DATE, NAME OF
`APPLICANT, and TITLE OF INVENTION. Feestransmitted by checkor draft are subject to collection. Please verify
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`changesnoted thereon. If you received a "Notice to File Missing Parts" for this application, please submit
`any correctionsto this Filing Receipt with your reply to the Notice. When the USPTO processesthe reply
`to the Notice, the USPTO will generate another Filing Receipt incorporating the requested corrections
`
`Applicant(s)
`
`DAVID SIUCHEONG AUYEUNG, CARROLLTON, TX;
`Power of Attorney:
`Timothy Bliss--50925
`
`If Required, Foreign Filing License Granted: 08/07/2012
`The country code and number of your priority application, to be usedfor filing abroad under the Paris Convention,
`is US 61/677,346
`Projected Publication Date: None, application is not eligible for pre-grant publication
`Non-Publication Request: No
`Early Publication Request: No
`** SMALL ENTITY **
`Title
`
`HEAT SINK FOR LED LIGHT SOURCE
`
`PROTECTING YOUR INVENTION OUTSIDE THE UNITED STATES
`
`Since the rights granted by a U.S. patent extend only throughoutthe territory of the United States and have no
`effect in a foreign country, an inventor who wishes patent protection in another country must apply for a patent
`in a specific country or in regional patent offices. Applicants may wish to consider the filing of an international
`application under the Patent Cooperation Treaty (PCT). An international (PCT) application generally has the same
`effect as a regular national patent application in each PCT-member country. The PCT process simplifies the filing
`of patent applications on the same invention in member countries, but does not result in a grant of "an international
`page 1 of 3
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`Page 7 of 44
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`Page 7 of 44
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`
`
`patent" and does noteliminate the need of applicants to file additional documents and fees in countries where patent
`protection is desired.
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`Almostevery country has its own patent law, and a person desiring a patent in a particular country must make an
`application for patent in that country in accordancewith its particular laws. Since the laws of many countries differ
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`
`Applicants also are advised that in the case of inventions madein the United States, the Director of the USPTO must
`issue a license before applicants can apply for a patent in a foreign country. Thefiling of a U.S. patent application
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`Applicants may wish to consult the USPTO booklet, "General Information Concerning Patents”(specifically, the
`section entitled "Treaties and Foreign Patents") for more information on timeframes and deadlinesfor filing foreign
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`can be viewed on the USPTO website at http://(www.uspto .gov/web/offices/pac/doc/general/index.html.
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`For information on preventing theft of your intellectual property (patents, trademarks and copyrights), you may wish
`to consult the U.S. Government website, http:/Avwww.stopfakes.gov. Part of a Department of Commerceinitiative,
`this website includes self-help "toolkits" giving innovators guidance on how to protect intellectual property in specific
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`LICENSE FOR FOREIGN FILING UNDER
`
`Title 35, United States Code, Section 184
`
`Title 37, Code of Federal Regulations, 5.11 & 5.15
`
`GRANTED
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`The applicant has been granted a license under 35 U.S.C. 184, if the phrase "IF REQUIRED, FOREIGN FILING
`LICENSE GRANTED"followed by a date appears on this form. Such licenses are issuedin all applications where
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`set forth in 37 CFR 5.15. The scope andlimitations of this license are set forth in 37 CFR 5.15(a) unless an earlier
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`37 CFR 5.13 or 5.14.
`
`This license is to be retained by the licensee and may be used at any time on or after the effective date thereof unless
`it is revoked. This license is automatically transferred to any related applications(s)filed under 37 CFR 1.53(d). This
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`The grant of a license does not in any waylessen the responsibility of a licensee for the security of the subject matter
`as imposed by any Governmentcontract or the provisions of existing laws relating to espionage and the national
`security or the export of technical data. Licensees should apprise themselves of current regulations especially with
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`page 2 of 3
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`Page 8 of 44
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`Page 8 of 44
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`
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`Security, Department of Commerce (15 CFR parts 730-774); the Office of Foreign AssetsControl, Department of
`Treasury (31 CFR Parts 500+) and the Department of Energy.
`
`NOT GRANTED
`
`if the phrase "IF REQUIRED, FOREIGN FILING
`No license under 35 U.S.C. 184 has been granted atthis time,
`LICENSE GRANTED" DOES NOTappear on this form. Applicant maystill petition for a license under 37 CFR 5.12,
`if a license is desired before the expiration of 6 months from thefiling date of the application. If 6 months has lapsed
`from the filing date of this application and the licensee has not received any indication of a secrecy order under 35
`U.S.C. 181, the licensee mayforeign file the application pursuant to 37 CFR 5.15(b).
`
`
`
`SelectUSA
`
`The United States represents the largest, most dynamic marketplace in the world and is an unparalleled location
`for business investment, innovation and commercialization of new technologies. The USAoffers tremendous
`resources and advantages for those who invest and manufacture goods here. Through SelectUSA, our nation
`works to encourage, facilitate, and accelerate business investment. To learn more about why the USAis the best
`country in the world to develop technology, manufacture products, and grow your business, visit SelectUSA.gov.
`
`page 3 of 3
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`Page 9 of 44
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`Page 9 of 44
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`
`
`UVLD-31391
`
`PATENT
`
`IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`
`PROVISIONAL APPLICATION FOR PATENT
`
`HEAT SINK FOR LED LIGHT SOURCE
`
`Inventor(s):
`
`AUYEUNG,David Stucheong — Carrollton, Texas
`
`Attorneys:
`
`Howison & Arnott, L.L.P.
`P.O. Box 741715
`Dallas, Texas 75374-1715
`(972) 479-0462
`
`Page 10 of 44
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`Page 10 of 44
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`
`
`UVLD-31391
`
`PATENT
`
`HEAT SINK FOR LED LIGHT SOURCE
`
`TECHNICAL FIELD
`
`[0001]
`
`The following disclosurerelates to lighting systems and, moreparticularly, to lighting
`
`systems using light emitting diodes to externally illuminate signs.
`
`Page 11 of 44
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`Page 11 of 44
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`
`
`UVLD-31391
`
`PATENT
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0002]
`
`For a more complete understanding,
`
`reference is now made to the following
`
`description taken in conjunction with the accompanying Drawings in which:
`
`[0003]
`
`Fig. 1A illustrates one embodiment of a billboard that may be externally lighted by
`
`one or morelighting assemblies;
`
`[0004]
`
`Figs. 1B-1D illustrate embodiments of angular positions of the lighting assembly of
`
`Fig. 1 relative to the billboard;
`
`[0005]
`
`Fig. 2 illustrates one embodimentof a lighting assembly that may be usedto light the
`
`billboard of Fig. 1;
`
`[0006]
`
`Figs. 3A and 3B illustrate one embodiment of a back panel that may be used in the
`
`lighting assembly ofFig. 2;
`
`[0007]
`
`Fig. 3C illustrates one embodiment of the back panel of Figs. 3A and 3B with a light
`
`panel and an optics panel that may also be used in the lighting assembly of Fig. 2;
`
`[0008]
`
`Figs. 4A and 4B illustrate one embodimentof a light panel that may be used with the
`
`lighting assembly ofFig. 2;
`
`[0009]
`
`Fig. 5A and 5B illustrate one embodimentof an optics panel that may be used with
`
`the lighting assemblyofFig. 2;
`
`[0010]
`
`Figs. 6A-6C illustrate a more detailed embodimentofthe lighting assembly ofFig. 2;
`
`[0011]
`
`Figs. 7A and 7B illustrate an embodimentof a back panel that may be used with the
`
`lighting assembly of Figs. 6A-6C;
`
`[0012]
`
`Fig. 8A illustrates an embodiment of an LED assembly andan optics panel that may
`
`be used with the lighting assembly ofFig. 6;
`
`Page 12 of 44
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`Page 12 of 44
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`
`
`UVLD-31391
`
`PATENT
`
`[0013]
`
`Figs. 8B-8J illustrates embodiments of the optics panel of Fig. 8A and optical
`
`elements that may be used to form part of the optics panel; and
`
`[0014]
`
`Fig. 9 illustrates a more detailed embodimentofthe lighting assembly ofFig. 2.
`
`Page 13 of 44
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`Page 13 of 44
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`
`
`UVLD-31391
`
`PATENT
`
`DETAILED DESCRIPTION
`
`[0015]
`
`Billboards, such as those commonly used for advertising in citics and along roads,
`
`often have a picture and/or text that must be externally illuminated to be visible in low-light
`
`conditions. As technology has advanced and introduced new lighting devices such as the light
`
`emitting diode (LED), such advances have been applied to billboards. However, current lighting
`
`designs have limitations and improvements are needed. Although billboards are used herein for
`
`purposes of example, it is understood that the present disclosure may be applied to lighting for
`
`any type of sign that is externally illuminated.
`
`[0016]
`
`Referring to Fig. 1A, one embodimentof a billboard 100is illustrated. The billboard
`
`100 includes a surface 102 onto which a picture and/or text may be painted, mounted, or
`
`otherwise affixed. The surface 102 may be any size, such as a commonly used size having a
`
`width of forty-eight feet wide and a height of fourteen feet. The surface 102 may be provided by
`
`placing a backing material on a frame 104 made of steel and/or other materials. The frame 104
`
`may be mounted on one or more support poles 106, which may be considered part of the frame
`
`104 or separate from the frame 104. The billboard 100 may include a walkway or other support
`
`structure 108 that cnables the surface 102 to be more casily accessed.
`
`[0017]
`
`One or more lighting assemblies 110 may be coupled to the walkway 108 (e.g., to a
`
`safety rail or to the walkwayitself) and/or to another structural memberofthe billboard 100 to
`
`illuminate someorall of the surface 102 in lowlight conditions. The lighting assembly 110 may
`
`be mounted at or near a top edge 112 of the billboard 100, a bottom edge 114 ofthe billboard
`
`100, a right edge 116 of the billboard 100, and/or a bottom edge 118 of the billboard 100. The
`
`lighting assembly 110 may be centered (e.g., located in approximately the center of the billboard
`
`100) or off center as illustrated in Fig. 1A.
`
`[00138]
`
`With additional reference to Figs. 1B-1D, a surface 120 of the lighting assembly 110
`
`may be parallel with respect
`
`to the surface 102 of the billboard 100 (Fig. 1B), may be
`
`perpendicular with respect to the surface 102 (Fig. 1C), or may be angled with respect to the
`
`surface 102 (Fig. 1D).
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`It is understood that the lighting assembly 110 may be placed in many
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`different orientations and locations relative to the billboard 100 and to one another, and the
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`illustrated positions are only for purposes of example.
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`Furthermore,
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`it
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`is understood that
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`references to “top,” “bottom,” “left,” and “right” are used in the present disclosure for purposes
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`of description and do not necessarily denote a fixed position. For example, the billboard 100
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`may be turned on end, and the referenced “top,” “bottom,” “Icft,” and “right” cdges maystill be
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`readily identifiable although the “top” edge would bethe “left” edge or the “right” edge.
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`[0019]
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`Oneproblem with current lighting technologyis that it can be difficult to direct light
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`only onto the surface 102 and even moredifficult to do so evenly. This may be duepartly to the
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`placementofthe lighting assembly 110, as shown in Figs. 1B-1D. Asthe lighting assembly 110
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`is off center relative to the surface 102, light emitted from the lighting assembly 110 may not
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`evenly strike the surface 102. One problem with uneven illumination is that certain parts of the
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`surface 102 may be more brightly illuminated than other parts. This creates “hot spots” that may
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`be undesirable. Attempting to evenly illuminate the surface 102 may cause light to be directed
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`past the edges 112, 114, 116, and 118 as attempts are madeto balance out hot spots in particular
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`areas. However, light that does not strike the surface 102 is wasted and may create problems
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`(e.g., light pollution), as well as waste illumination that could be used for the surface 102.
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`[0020]
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`In addition to the difficulties of evenly illuminating the surface 102, the use of LEDs
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`in an exterior lighting environment involves issues such as heat dissipation and protecting the
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`LEDsagainst environmental conditions such as moisture. The presence of moving mechanical
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`features such as fans that may be used to provide increased airflow for cooling may create
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`additional reliability problems. Dueto the difficulty and expense of replacing and/or repairing
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`the lighting assembly 110 in combination with the desire to provide consistent lighting while
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`minimizing downtime, such issues should be addressed in a manner that enhancesreliability and
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`uptime.
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`[0021]
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`Referring to Fig. 2, one embodimentof a lighting assembly 200 is illustrated. The
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`lighting assembly 200 provides a more detailed embodimentof the lighting assembly 110 ofFig.
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`1. The lighting assembly 200 includes a back panel 202, a light panel 204 (e.g., a printed circuit
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`board (PCB)) having a plurality of LEDs (not shown) mounted thereon, and an optics panel 206.
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`Aswill be described below in more detailed examples, light from the LEDs ofthe light panel
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`204 maybe directed by the optics panel 206 to illuminate the surface 102 of the billboard 100 of
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`Fig. 1. The back panel 202 may be configured to serve as a supporting substrate for the light
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`panel 204 and optics panel 206, as well as to dissipate heat produced by the LEDs.
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`[0022]
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`It is understood that any of the back panel 202, light panel 204, and optics panel 206
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`may actually be two or more physical substrates rather than a single panel as illustrated in Fig. 2.
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`Furthermore, it is understood that there may be additional pancls positioned behind the back
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`panel 202, in front of the optics panel 206, and/or between the back panel 202 and light panel
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`204 and/or betweenthe light panel 204 and optics panel 206.
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`[0023]
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`Referring to Figs. 3A-3C, one embodiment of the back panel 202 is illustrated with a
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`front surface 302 and a back surface 304. The back panel 202 includes a top edge 306, a bottom
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`edge 308, a right edge 310, and a left edge 312. The panel 202 may be formed of one or more
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`thermally conductive materials (e.g., aluminum) and/or other materials.
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`[0024]
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`The front surface 302 provides a mounting surface for the light panel 204.
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`In some
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`embodiments, the front surface 302 of the panel 202 may include one or moreprotrusions 314a
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`and 314b that are substantially parallel to the top edge 306. The protrusions 314a and 314b may
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`be configured to protect the light panel 204 from moisture. Although only two protrusions 314a
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`and 314b are illustrated, it is understood that a single protrusion may be provided or three or
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`more protrusions may be provided. Furthermore, such protrusions may vary in length, shape
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`(e.g., may have angled or curved surfaces), orientation, and/or location on the front surface 302.
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`[0025]
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`Referring specifically to Fig. 3C, a light panel 204 and an optical panel 206 may be
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`mounted under the protrusion 314a (Fig. 3C). Moisture running down the front surface 302 in
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`the direction of arrow 316 maystrike the protrusion 314a and be directed away from the light
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`panel 204 and optical panel 206 as shown by arrow 318. Although not shown, moisture may
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`also be directed length down the protrusion 314a. Accordingly, protrusion 314a may serve as a
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`gutter and aid in directing moisture away from a joint 320 where the optical panel 206 abuts the
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`front surface 302. This may be beneficial even when a moisture resistant compound is used to
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`seal the joint 320. In embodiments where there are multiple light panels 204 arranged vertically
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`on the front surface 302, there may be a protrusion positioned above each light panel 204. For
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`example, the protrusion 314a may be positioned directly above one light panel 204 and the
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`protrusion 314b may be positioned directly above anotherlight panel 204.
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`[0026|
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`Referring specifically to Fig. 3B, the back surface 304 may be configured to increase
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`heat dissipation. For example, the back surface 304 may be configured with a heat sink provided
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`by fins 322a-322N, where N denotes a total number of fins. The fins 322a-322N increase the
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`surface area of the back surface 304, thereby providing for additional heat dissipation to the
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`surrounding air. The fins 322a-322N may be formed as part of the pancl 202 or may be
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`otherwise coupled to the panel 202 (e.g., may be part of a discrete heat sink that is coupled to the
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`back surface 304). Someorall of the fins 322a-322N may be angled, as shown by fins 322a and
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`322b. In some embodiments, holes (not shown) may be provided in someorall of the fins 322a-
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`322N to aid in air circulation.
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`In such embodiments, the holes may cause a chimneyeffect in
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`which heated air rises through the holes and is replaced by cooler air. This may beparticularly
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`effective in environments where natural air movementis limited.
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`[0027]
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`Referring to Figs. 4A and 4B, one embodiment of a single PCB 402 ofthe light pancl
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`204 is illustrated.
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`In the present example, the light panel 204 may include multiple PCBs 402,
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`although it is understood that any number of PCBs may be used based on design issues such as
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`the amountof illumination needed, the amountof illumination provided by a single PCB 402, the
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`size of the surface 102 of the billboard 100, and/or other factors. As shown in the present
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`embodiment with a substantially rectangular cross-section, the PCB 402 includes a front surface
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`404, a back surface 406, a top edge 408, a bottom edge 410, a right edge 412, and a left edge
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`414.
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`[00238]
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`The PCB 402 may include one or more strings of LEDs 416, with multiple LEDs 416
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`in a string. For example, a string may include eight LEDs 416 and each PCB 402 may include
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`twostrings for a total of sixteen LEDs 416.
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`In this configuration, a light panel 204 having eight
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`PCBs 402 would include ninety-six LEDs 416.
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`It is understood that although the PCBs 404 are
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`shownas being substantially identical, they may be different in terms of size, shape, and other
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`factors for a single light panel 204.
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`[0029]
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`In the present example, the LEDs 416 are surface mounted, but it is understood that
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`the LEDs 416 may be coupled to the panel 204 using through hole or another coupling process.
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`The surface mounted configuration may ensure that a maximum surface area of each LED 416 is
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`in contact with the PCB 404, whichis in turn in contact with the back panel 202 responsible for
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`heat dissipation. Each string of LEDs may receive a constant current with the current divided
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`evenly among the LEDs 416.
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`[0030]
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`Referring to Figs. 5A and 5B, one embodimentof a single lens panel 500 ofthe optics
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`panel 206 is illustrated.
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`In the present example, the optics panel 206 may include multiple lens
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`pancls 500, although it is understood that any number of Icns pancls may be uscd based on
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`design issues such as the number, arrangement, and orientation of the LEDs 416, the size of the
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`surface 102, and/or other factors. As shown in the present embodiment with a substantially
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`rectangular cross-section that is configured for use with the PCB 402 of Fig. 4, a single lens
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`panel 500 includes a front surface 502, a back surface 504, a top side 506, a bottom side 508, a
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`right side 510, and a left side 512. The sid