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`(19) United States
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`(12) Patent Application Publication (10) Pub. No.: US 2008/0084693 A1
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` Shimada et al. (43) Pub. Date: Apr. 10, 2008
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`US 20080084693A1
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`(54) LIGHTING SYSTEM
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`Publication Classification
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`(75)
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`Inventors:
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`Junichi Shimada, Kyoto-shi (JP);
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`Youichi Kawakami, Kusatsu-shi
`(JP); Motokazu Yamada,
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`Tokushima-shi (JP); Masaru Kato,
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`Sagamihara-shi (JP)
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`Correspondence Address:
`OLIFF & BERRIDGE PLC
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`PO. BOX 320850
`’
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`ALEXANDRIA’ VA 22320-4850
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`(73) Assignee:
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`YANCHERS CORPORATION,
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`Kyoto-shi (JP)
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`(21) Appl. NO‘:
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`11/544’706
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`22
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`(
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`Filed:
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`Oct. 10 2006
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`(51)
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`Int. Cl.
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`(2006.01)
`F21 V 5/00
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`......................... 362/240; 362/238; 362/244
`(52) us. Cl.
`(57)
`ABSTRACT
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`The lighting system according to the present
`invention
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`includes an electrical wiring substrate in which a connector
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`to a power source is formed, a plurality of LED chips
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`mounted in a predetermined array pattern on the electrical
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`yviring sublstraIteES dfiflection lens airangiISDpoied in grog-
`1m1ty to t e
`etween t e
`0 1p an
`c 1ps
`t e
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`predetermined illumination region and a housing for receiV-
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`ing the electrical wiring substrate and the deflection lens
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`array. A plurality of deflection lenses are integrally molded
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`in the deflection lens array to lead lights from the LED chips
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`to the predetermined illumination region in a state where the
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`lights from the LED chips are superposed with each other.
`The lights emitted from the LED chips are collected in a
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`state where they all are superposed in a common, single
`illumination re ion throu h the deflection lenses.
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`Patent Application Publication Apr. 10, 2008 Sheet 4 0f 8
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`Patent Application Publication
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`Apr. 10, 2008 Sheet 5 of 8
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`Patent Application Publication
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`Apr. 10, 2008 Sheet 6 0f 8
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`US 2008/0084693 A1
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`Apr. 10, 2008 Sheet 8 0f 8
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`US 2008/0084693 A1
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`US 2008/0084693 A1
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`Apr. 10, 2008
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`LIGHTING SYSTEM
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`BACKGROUND OF THE INVENTION
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`1. Field of the Invention
`[0001]
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`[0002] The present invention relates to a compact lighting
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`system having a high illumination and a uniform luminous
`distribution characteristic.
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`2. Description of the Related Art
`[0003]
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`[0004] A light emitting diode (LED) has an advantage that
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`is compact and the power consumption is small and
`it
`therefore,
`the lifetime is more than ten times that of a
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`fluorescent light. Incorporation of a condenser lens into this
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`LED allows approximately 90% of the emitted lights to be
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`projected ahead without an additional, specific reflector.
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`This type of lighting system can project
`light having
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`extremely strong directivity and high luminance. There is
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`developed a large-sized LED (power LED) a light emitting
`area of which is larger than conventional and which has
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`extremely high luminance. There are studies on an applica-
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`tion of such a power LED in various fields as a compact light
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`source for illumination in low consumption power instead of
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`a conventional incandescent lamp or a fluorescent light.
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`[0005] Techniques with respect to LEDs applicable to
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`such a light source for illumination are proposed by Japa-
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`nese Patent Application Laid-open No. 9-069561 (1997),
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`Japanese Patent Application Laid-open No. 2002-049326,
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`Japanese Patent No. 3118798 and so on. Japanese Patent
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`Application Laid-open No. 9-069651 (1997) discloses a
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`semiconductor light emitting module capable of increasing
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`reliability and having no variation in characteristics by
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`avoiding characteristic degradation and characteristic defect
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`due to bonding of a lead thin line by using a selected light
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`emitting diode device. Japanese Patent Application Laid-
`open No. 2002-049326 discloses a planar semiconductor
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`light emitting device in which optical elements for collima-
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`tion having an array corresponding to an array of LED chips
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`are arranged as a micro lens array. By the planar semicon-
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`ductor light emitting device, a large part of lights emitted by
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`individual LED chips can be projected within an extremely
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`narrow range. Japanese Patent No. 3118798 discloses a
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`semiconductor light emitting module in which outer lenses
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`are located as opposed respectively to light emitting diodes
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`arranged by predetermined intervals,
`thereby making it
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`possible to illuminate a larger area.
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`[0006] The power LED having a light emitting area larger
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`than that of the conventional LED has a relatively large
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`variation in light emitting luminance for each product.
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`Therefore,
`in order to produce a product having a light
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`emitting luminance within a predetermined tolerance, the
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`manufacturing yield is only several dozens of percentages
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`according to the current technology. Accordingly, in a case
`where this power LED is used as a light source for illumi-
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`nation requiring a uniform luminous distribution character-
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`it leads to an extremely high cost due to the low
`istic,
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`manufacturing yield as described above.
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`In the semiconductor light emitting module dis-
`[0007]
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`closed in Japanese Patent Application Laid-open No.
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`9-069651 (1997), selection of light emitting diode device is
`made for avoiding variations in characteristic. Therefore, as
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`a result of basically eliminating use of a light emitting diode
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`device exceeding a predetermined tolerance, the manufac-
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`turing yield of light emitting diodes deteriorates in the same
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`way as in the case of the power LED, leading to an increase
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`of a manufacturing cost of the semiconductor light emitting
`module.
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`[0008] The planar semiconductor light emitting device
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`disclosed in Japanese Patent Application Laid-open No.
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`2002-049326 locates optical elements for collimation hav-
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`ing an array corresponding to an array of the LED chips, as
`a micro lens array. Therefore,
`there occurs illumination
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`unevenness in response to the variation in light emitting
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`luminance of the individual LED chip. Yet since a LED chip
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`array having an area in accordance with the illumination
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`region is required, in a case of illuminating a large region in
`an uniform luminous distribution characteristic, a large
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`amount of LED chips corresponding thereto are required to
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`be used. Accordingly, this light emitting device is not nearly
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`practical in terms of costs.
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`In the semiconductor light emitting module dis-
`[0009]
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`closed in Japanese Patent No. 3118798, the respective light
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`emitting diodes and outer lenses are designed to separately
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`illuminate only a part of the entire illumination region. This
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`is apparent because the light emitting diodes and the outer
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`lenses are arranged coaxially. As a result, in the same way
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`as in the case of Japanese Patent Application Laid-open No.
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`2002-049326, the variation in the light emitting luminance
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`of each light emitting diode leads directly to illumination
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`unevenness in the illumination region, so that the uniform
`luminous distribution characteristic, i.e., the uniform illu-
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`mination distribution can not be basically obtained.
`In
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`addition, in a case of selecting the light emitting diodes for
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`avoiding this problem, the manufacturing cost increases.
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`SUMMARY OF THE INVENTION
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`[0010] A lighting system according to the present inven-
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`tion comprises a wiring substrate in which a connecting
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`portion to a power source is formed, a plurality of semicon-
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`ductor light emitting devices mounted in a predetermined
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`array pattern on the wiring substrate, a light deflection
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`optical element disposed in proximity to the semiconductor
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`light emitting devices between the semiconductor light
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`emitting device and a predetermined spatial region to lead
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`lights emitted from the semiconductor light emitting devices
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`to the predetermined spatial region in a state where the lights
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`are superposed with each other, and a housing for receiving
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`the light deflection optical element and the wiring substrate
`therein.
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`[0011]
`In FIG. 1 showing the principle of the present
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`invention, lights L emitted from respective semiconductor
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`light emitting devices 1 are led in a state where they are
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`superposed in a predetermined spatial region Z through a
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`light deflection optical element 2. In other words, the lights
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`emitted from the respective semiconductor light emitting
`devices 1 are condensed in a state where they are all
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`superposed in a single predetermined spatial region Z.
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`[0012] According to the lighting system of the present
`invention, since all lights emitted from the semiconductor
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`light emitting devices are led to the same location in such a
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`manner as to be mutually superposed, the lighting system
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`can illuminate a predetermined spatial
`region in an
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`extremely high luminance. In addition, even if luminance
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`unevenness occurs in each semi conductor light emitting
`device itself, since all lights are led to the same location, the
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`influence of each semiconductor light emitting device itself
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`does not occur at all. Therefore, a plurality of semiconductor
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`light emitting devices having a lot of variations in luminance
`can be used without selection thereof, and particularly an
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`effective use of a power LED having a low manufacturing
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`yield is possible. Even if one of the plurality of the semi-
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`conductor light emitting devices does not emit light due to
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`any cause, the illumination in the illumination region is just
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`lowered by the corresponding amount. Accordingly,
`this
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`Page 10 of 14
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`Page 10 of 14
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`

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`US 2008/0084693 A1
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`Apr. 10, 2008
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`lighting system of the present invention is extremely con-
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`venient in a state where the lighting system can not be
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`replaced.
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`Furthermore, since a plurality of semiconductor
`[0013]
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`light emitting devices are mounted in a wiring substrate, it
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`is possible to modularize the plurality of the semiconductor
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`light emitting devices mounted in the wiring substrate.
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`Thereby, the number of the modules is increased/decreased
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`in accordance with illumination required in the illumination
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`region, easily changing the illumination of the lighting
`system.
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`[0014] The present invention does not require to precisely
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`superpose all of the light beams emitted from the individual
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`semiconductor light emitting devices 1 in a predetermined
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`spatial region Z. It is naturally possible to intentionally form
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`a region in which light beams emitted from the individual
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`semiconductor light emitting devices 1 are not superposed
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`on each other at a boundary portion of the spatial region Z
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`by shifting a relative position between the semiconductor
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`light emitting device 1 and the light deflection optical
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`element 2 or a relative position between this lighting system
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`and the predetermined spatial region Z. The present inven-
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`tion also encompasses the above-described aspect.
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`[0015]
`In the lighting system according to the present
`invention, at least two kinds of the semiconductor light
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`emitting devices having different color rendering properties
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`may be mounted on the wiring substrate in such a manner as
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`to be mixed in a predetermined ratio. In this case,
`it is
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`possible to obtain illumination light having desired color
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`rendering properties. Therefore, for example, two kinds of
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`semiconductor light emitting devices are simply prepared,
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`each color temperature having 4800K and 7200K and by
`changing a combination of the number of the two to be used,
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`it is possible to produce an illumination light having sub-
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`stantially any color temperature between 4800K and 7200K.
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`Accordingly, it is not required to use a semiconductor light
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`emitting device having a specific color rendering properties.
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`[0016] A filter through which the light emitted from at
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`least one of the semiconductor light emitting devices passes
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`may be disposed between the semiconductor light emitting
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`device and the predetermined spatial region or between the
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`light deflection optical element and the predetermined spa-
`tial region. In this case, the filter may be a color filter for
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`correcting a color rendering property, a ND filter which has
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`a distribution to the light transmissivity, or a light diffuser for
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`diffusing light. This allows a color temperature of the
`illumination region to be modified subtly or an illumination
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`in the illumination region to be uniformly corrected. It is
`also effective to mount a filter on a housing so as to seal the
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`inside of the housing. In particular, when this filter is
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`employed as a light diffuser,
`it is preferable to form an
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`optical element for diffusing light on an internal face of a
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`filter opposed to the light deflection optical element. This
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`can prevent a dust or the like from being deposited on the
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`optical element, making it possible to facilitate to clean a
`surface of the filter.
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`[0017] The semiconductor light emitting device may be a
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`LED into which a condenser lens is incorporated integrally,
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`especially a white LED, and optical axes of the LEDs may
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`be in parallel with each other. In this case, a general white
`light as an illumination light can be obtained and besides, a
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`mounting job of the LED to the wiring substrate can be
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`easily and quickly done.
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`[0018] A predetermined spatial region of the present
`invention may be made of a two-dimensional plane inter-
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`secting with or in parallel to an optical axis of the LED or
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`a three-dimensional plane. In a case where the predeter-
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`Page 11 of 14
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`mined spatial region is made of the three-dimensional plane,
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`a hologram is suitable for a light deflection optical element.
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`In this case, even if the predetermined spatial region is made
`of the three-dimensional plane, a uniform illumination can
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`be certainly made. Additionally, the distance form the semi-
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`conductor light emitting device to the hologram is set as the
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`shortest to provide a more compact lighting system.
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`[0019] The light deflection optical element may include a
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`plurality of plano-convex lenses corresponding to the
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`respective semiconductor light emitting devices, the plano-
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`convex lens may have a flat optical surface facing toward the
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`semiconductor light emitting device and a convex optical
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`surface facing toward the predetermined spatial region, and
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`all the flat optical surfaces of the individual plano-convex
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`lenses may be on a common plane. In this case, it is possible
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`to prevent occurrence of a shade or a luminescent line due
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`to a boundary part of neighboring plano-convex lenses. In
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`addition, this allows a further high density package of the
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`LEDs. Furthermore, it is possible to reduce a distance from
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`the semiconductor light emitting device to a flat optical
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`surface of each plano-convex lens. By a combination of
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`these advantages, the lighting system can be made smaller in
`Size.
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`[0020] A convex optical surface of each plano-convex lens
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`as described above is shaped to be in an asymmetric,
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`aspheric surface,
`thus inclining an optical axis of these
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`plano-convex lens in the direction of the predetermined
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`spatial region. Alternatively, the optical axis of the LED is
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`set in parallel to the optical axis of the plano-convex lens
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`corresponding thereto and an array pattern of the plano-
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`convex lenses is set to be similar to an array pattern of the
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`semiconductor light emitting devices,
`thereby setting an
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`interval between the neighboring plano-convex lenses
`shorter than an interval between the neighboring semicon-
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`ductor light emitting devices.
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`[0021] The plurality of the plano-convex lenses may be
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`integrally molded in an array. In this case, positioning of the
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`plano-convex lens to each semiconductor light emitting
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`device is extremely easily made, thus easily manufacturing
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`a lighting system.
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`[0022]
`In the present invention, two or more predeter-
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`mined spatial regions may be formed so as to be distant from
`each other.
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`invention will
`features of the present
`[0023]
`Further
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`become apparent from the following description of exem-
`plary embodiments (with reference to the attached draw-
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`ings).
`BRIEF DESCRIPTION OF THE DRAWINGS
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`FIG. 1 is a schematic diagram of the present
`[0024]
`invention;
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`FIG. 2 is a three-dimensional projected view show-
`[0025]
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`ing an outside appearance in an embodiment where a
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`lighting system of the present invention is applied to a
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`reading lamp incorporated into a writing desk;
`FIG. 3 is a cross-sectional view of a main part of
`[0026]
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`the embodiment shown in FIG. 2;
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`[0027]
`FIG. 4 is a three-dimensional, exploded, projected
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`view showing an outside appearance of the embodiment in
`FIG. 2;
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`FIG. 5 is a three-dimensional projected view show-
`[0028]
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`ing a different embodiment where a lighting system of the
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`present invention is applied to a down spot lighting;
`FIG. 6 is a cross-sectional view of the embodiment
`[0029]
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`shown in FIG. 5;
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`Page 11 of 14
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`

`

`
`
`US 2008/0084693 A1
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`
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`Apr. 10, 2008
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`FIG. 7 is three-dimensional projected view show-
`[0030]
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`ing another embodiment where a lighting system of the
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`present invention is applied to a down spot lighting; and
`[0031]
`FIG. 8 is a cross-sectional view of the embodiment
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`shown in FIG. 7.
`
`
`DESCRIPTION OF THE EMBODIMENTS
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`[0032] A lighting system in an embodiment of the present
`invention will be described in detail with reference to FIGS.
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`2 to 6. The present invention is, however, not limited to the
`embodiment, but can include all alternations and modifica-
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`tions included in the concept of the present
`invention
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`described in claims. Accordingly,
`it
`is apparent that the
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`present invention can be applied to any other technology
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`within the spirit thereof.
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`[0033]
`FIG. 2 shows an outside appearance in an embodi-
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`ment where the present invention is applied to a reading
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`lamp incorporated into a study desk, FIG. 3 shows a cross-
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`sectional structure thereof and FIG. 4 shows an exploded
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`state of an outside appearance of a main part thereof. A
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`reading lamp 10 in the embodiment is mounted on the back
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`side of the shelf board S of a writing desk D and designed
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`to illuminate on a top board T. The reading lamp 10 has a
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`main part composed of a LED module into which a plurality
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`of LED chips 11 are incorporated in a predetermined array
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`pattern, a deflection lens array 13 for irradiating lights from
`the LED module 12 toward a surface of the top board T, and
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`a housing 14 for receiving the LED module 12 and the
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`deflection lens array 13 in a positioned state. The deflection
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`lens array 13 is located ahead of the LED module 12 in
`
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`proximity thereto.
`[0034] The LED module 12 includes a plurality of LED
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`chips 11, an electrical wiring substrate 15 on which the LED
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`chips 11 are mounted by predetermined intervals, a cable for
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`supplying power to each LED chip 11 and the like. Con-
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`denser lenses 11a are incorporated integrally into the respec-
`tive LED chips 11 so that optical axes of the condenser
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`lenses 11a are in parallel to each other. The cable 16 is
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`connected to connectors 15a disposed in the electrical
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`wiring substrate 15. The LED chip 11 used as the semicon-
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`ductor light emitting device of the present invention is made
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`of a white power LED and for radiating heat, the base of the
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`electrical wiring substrate 15, the housing 14 or the like is
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`formed of aluminum having a relatively high thermal con-
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`ductivity. In the embodiment, 17 pieces of the LED chips 11
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`are arrayed in two rows on the electrical wiring substrate 15
`and mounted in a state where they are shifted by a half pitch
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`with each other along the direction of each row. However, an
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`array state or the like of the LED chips 11 to the electrical
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`wiring substrate 15 can be changed as needed in accordance
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`with a characteristic required in the lighting system.
`[0035] When a special illumination effect is not intended
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`for an object to be illuminated, it is general to use a white
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`LED having color rendering properties close to sunlight as
`in the case of the embodiment. In a case where desired color
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`rendering properties can not be obtained only with a single
`kind of white LED, at least two kinds of white LEDs having
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`different color rendering properties are combined and sub-
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`traction mixing of the colors is used, whereby an illumina-
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`tion light adjusted to desired color rendering properties can
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`be obtained. For example, in a case of obtaining an illumi-
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`nation light having a color temperature of 5600K, a white
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`LED having a color temperature of 7200K and a white LED
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`having a color temperature of 4800K, which are commer-
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`cially available, are adopted in a ratio of l to 2 to obtain an
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`illumination light having a color temperature close to about
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`5600K. That is, according to this method, it is not required
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`to manufacture the white LED having a color temperature of
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`5600K and it is possible to effectively use commercially
`available white LEDs.
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`[0036]
`Since the modulation of color temperatures on the
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`chromaticity coordinates is depicted in a curve, not linearly,
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`a linear interpolation of the color temperatures as described
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`above is possible in a limited region (for example, a range
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`of 4800K to 7200K). Accordingly, in a case of using a LED
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`having a color temperature out of this range, it is required to
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`adjust a ratio of a LED combination based upon a color
`temperature curve.
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`[0037] The deflection lens array 13 in this embodiment
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`located at a predetermined distance from and in proximity to
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`the LED module 12 is a product molded of optically
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`transparent polymethylmethacrylate (PMMA). The deflec-
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`tion lens array 13 includes deflection lenses 17 (plano-
`convex lenses in the embodiment) set in a reduced array
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`pattern similar and corresponding to the respective LED
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`chips 11. Each deflection lens 17 includes a flat optical
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`surface 17a facing toward the LED chip 11, and a convex
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`optical surface 17b facing an illumination region Z, i.e., to
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`the top board T. An optical axis 170 of the deflection lens 17
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`is set in parallel to an optical axis 11b of the condenser lens
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`11a of the LED chip 11. The respective deflection lenses 17
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`are set in a reduced array pattern corresponding and similar
`to the LED chips 11. Therefore, an interval between the
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`adjacent deflection lenses 17 is set to be shorter than that
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`between the adjacent condenser lenses 11a. The optical axis
`170 of the deflection lens 17 is offset to the central side of
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`the illumination region Z from the optical axis 11b of the
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`corresponding condenser lens 11a. An offset amount of each
`deflection lens 17 is set depending on a focus distance
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`thereof or a relative position between the corresponding
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`LED chip 11 and the illumination region Z.
`[0038]
`In this embodiment, the flat optical surfaces 1711
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`directed toward the LED chip 11 are all positioned on a
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`common plane so as to be perpendicular to the optical axis
`11b of the condenser lens 11a. This causes easy manufacture
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`of a mold for injection-molding the deflection lens array 13
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`and further, eliminates an eclipse occurring due to the
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`shoulder in the boundary part between the adjacent deflec-
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`tion lenses 17, making it possible to prevent occurrence of
`a dark line or a bright line in the illumination region Z. As
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`a result,
`it is possible to pr