INTEGRATED CIRCUITS
`
`DDATA SHEET
`
`PCA8521
`Infrared remote control transmitter
`RC5
`
`Product specification
`Supersedes data of 1997 Jul 03
`File under Integrated Circuits, IC02
`
`1999 Jun 15
`
`Roku EX1016
`U.S. Patent No. 7,589,642
`
`1
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`FEATURES
`• RC5 protocol
`• Maximum of:
`– 56 keys (20-pin version)
`– 30 keys (16-pin version).
`• Option of multi-system or single system transmitter
`– Multi-system: maximum 8 systems, selection by key
`– Single system: maximum 8 different systems per IC,
`selection by jumper wire or switch.
`• Power-down and key wake-up
`• High output current (≤ 45 mA)
`• Oscillator frequency of 432 kHz or 4 MHz
`• Multiple key protection
`• Option of 25% or 33% duty factor
`• Contained in DIP16, SO16, DIP20 or SO20 packages.
`
`GENERAL DESCRIPTION
`The PCA8521 can be used in infrared remote control
`transmitters. It generates output pulses, in accordance
`with the RC5 protocol, when a key is pressed. The IC does
`not contain a software programmable processor.
`However, it does contain a ROM in which the codes that
`have to be transmitted are stored. An example of an
`application diagram using a 20-pin IC is illustrated in Fig.7.
`The oscillator frequency may be optionally chosen as
`432 kHz or 4 MHz. For 432 kHz additional external
`capacitors must be connected. The capacitors for a 4 MHz
`oscillator is integrated. When a key in the key-matrix is
`pressed a drive line will be connected to a sense line. This
`causes the oscillator to start and a corresponding code will
`be generated conforming to the RC5 protocol.
`Seven drive lines (DR0 to DR6) and eight sense lines
`(SN0 to SN7) may be connected via the key matrix to scan
`the keys (see Fig.1).
`When two or more keys are activated simultaneously no
`transmission will take place.
`
`ORDERING INFORMATION
`
`TYPE
`NUMBER
`
`PCA8521FP
`PCA8521FT
`PCA8521BP
`PCA8521BT
`
`PACKAGE
`DESCRIPTION
`plastic dual in-line package; 16 leads (300 mil)
`plastic small outline package; 16 leads; body width 7.5 mm
`plastic dual in-line package; 20 leads (300 mil)
`plastic small outline package; 20 leads; body width 7.5 mm
`
`NAME
`DIP16
`SO16
`DIP20
`SO20
`
`VERSION
`SOT38-4
`SOT162-1
`SOT146-1
`SOT163-1
`
`1999 Jun 15
`
`2
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`BLOCK DIAGRAM
`
`handbook, full pagewidth
`
`SN0
`SN1
`SN2
`SN3
`SN4
`SN5
`SN6
`SN7
`DR0
`DR1
`DR2
`DR3
`DR4
`DR5
`DR6
`
`4
`5
`6
`7
`9
`10
`8
`3
`16
`15
`14
`13
`12
`11
`17
`
`432 kHz or 4 MHz
`
`XTAL1
`
`1
`
`XTAL2
`2
`
`OSCILLATOR
`
`STOP
`
`TIMING GENERATOR
`AND
`CONTROL
`
`36 kHz
`
`1K x 8
`ROM
`
`PULSE
`GENERATOR
`
`OUTPUT
`DRIVER
`
`19
`
`LOUT
`
`KEY
`SCANNING
`
`SHIFT REGISTER
`
`PCA8521
`
`20
`VDD
`
`18
`VSS
`
`MBH038
`
`Fig.1 Block diagram (for DIP20 and SO20 packages).
`
`1999 Jun 15
`
`3
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`PINNING
`16-pin dual in-line and small outline package
`SYMBOL
`PIN
`DESCRIPTION
`XTAL1
`1
`oscillator input
`XTAL2
`2
`oscillator output
`SN0
`3
`sense line 0 for key matrix
`SN1
`4
`sense line 1 for key matrix
`SN2
`5
`sense line 2 for key matrix
`SN3
`6
`sense line 3 for key matrix
`SN4
`7
`sense line 4 for key matrix
`SN5
`8
`sense line 5 for key matrix
`DR4
`9
`drive line 4 for key matrix
`(active LOW)
`drive line 3 for key matrix
`(active LOW)
`drive line 2 for key matrix
`(active LOW)
`drive line 1 for key matrix
`(active LOW)
`drive line 0 for key matrix
`(active LOW)
`ground
`output signal (active LOW)
`power supply
`
`DR3
`
`DR2
`
`DR1
`
`DR0
`
`16
`
`VDD
`
`15
`
`LOUT
`
`14
`
`13
`
`VSS
`
`DR0
`
`12
`
`DR1
`
`11
`
`DR2
`
`10
`
`DR3
`
`9
`
`DR4
`
`PCA8521
`
`MBH032
`
`1 2 3 4 5 6 7 8
`
`XTAL1
`
`XTAL2
`
`SN0
`
`SN1
`
`SN2
`
`SN3
`
`SN4
`
`SN5
`
`handbook, halfpage
`
`Fig.2 Pin configuration (DIP/SO16).
`
`10
`
`11
`
`12
`
`13
`
`14
`15
`16
`
`VSS
`LOUT
`VDD
`
`1999 Jun 15
`
`4
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`20-pin dual in-line and small outline package
`SYMBOL
`PIN
`DESCRIPTION
`XTAL1
`1
`oscillator input
`XTAL2
`2
`oscillator output
`SN7
`3
`sense line 7 for key matrix
`SN0
`4
`sense line 0 for key matrix
`SN1
`5
`sense line 1 for key matrix
`SN2
`6
`sense line 2 for key matrix
`SN3
`7
`sense line 3 for key matrix
`SN6
`8
`sense line 6 for key matrix
`SN4
`9
`sense line 4 for key matrix
`SN5
`10
`sense line 5 for key matrix
`DR5
`11
`drive line 5 for key matrix
`(active LOW)
`drive line 4 for key matrix
`(active LOW)
`drive line 3 for key matrix
`(active LOW)
`drive line 2 for key matrix
`(active LOW)
`drive line 1 for key matrix
`(active LOW)
`drive line 0 for key matrix
`(active LOW)
`drive line 6 for key matrix
`(active LOW)
`ground
`output signal (active LOW)
`power supply
`
`20
`
`19
`
`18
`
`17
`
`16
`
`15
`
`14
`
`VDD
`
`LOUT
`
`VSS
`
`DR6
`
`DR0
`
`DR1
`
`DR2
`
`13
`
`DR3
`
`12
`
`11
`
`DR4
`
`DR5
`
`PCA8521
`
`1 2 3 4 5 6 7 8 9
`
`handbook, halfpage
`XTAL1
`
`XTAL2
`
`SN7
`
`SN0
`
`SN1
`
`SN2
`
`SN3
`
`SN6
`
`SN4
`
`SN5
`
`10
`
`MBH033
`
`Fig.3 Pin configuration (DIP/SO20).
`
`12
`
`13
`
`14
`
`15
`
`16
`
`17
`
`18
`19
`20
`
`DR4
`
`DR3
`
`DR2
`
`DR1
`
`DR0
`
`DR6
`
`VSS
`LOUT
`VDD
`
`1999 Jun 15
`
`5
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`FUNCTIONAL DESCRIPTION
`Key numbering for the matrix is given in Tables 1 and 2.
`
`Table 1 Key numbering for 16-pin package
`
`DRIVER
`LINES
`
`DR0
`DR1
`DR2
`DR3
`DR4
`
`SN0
`0
`8
`16
`24
`32
`
`SN1
`1
`9
`17
`25
`33
`
`Table 2 Key numbering for 20-pin package
`
`DRIVER
`LINES
`
`DR0
`DR1
`DR2
`DR3
`DR4
`DR5
`DR6
`
`SN0
`0
`8
`16
`24
`32
`40
`48
`
`SN1
`1
`9
`17
`25
`33
`41
`49
`
`SN2
`2
`10
`18
`26
`34
`42
`50
`
`SENSE LINES
`SN2
`SN3
`2
`3
`10
`11
`18
`19
`26
`27
`34
`35
`
`SENSE LINES
`SN3
`SN4
`3
`4
`11
`12
`19
`20
`27
`28
`35
`36
`43
`44
`51
`52
`
`SN4
`4
`12
`20
`28
`36
`
`SN5
`5
`13
`21
`29
`37
`45
`53
`
`SN6
`6
`14
`22
`30
`38
`46
`54
`
`SN5
`5
`13
`21
`29
`37
`
`SN7
`7
`15
`23
`31
`39
`47
`55
`
`When the keys have been scanned the key-number of the
`activated key serves as the address of the ROM to obtain
`the required code-word. When a 16-pin IC is used the
`following sense lines and driver lines will not be connected;
`SN6, SN7, DR5 and DR6. Consequently, key numbers 6,
`7, 14, 15, 22, 23, 30, 31, 38, 39 and 40 to 55 will not be
`addressed.
`The ROM contains 8 banks of 64 code-words. Thus for
`each key a maximum of 8 different code-words may be
`generated. With multi-system use, 8 different systems
`(e.g. TV, VCR, tuner, CD etc.) may be selected. Apart from
`the system bits the command bits may also be different in
`different banks (true multi-function keys). Selection can be
`performed using the keys. For each key three bank select
`bits are present that determine which bank will be selected
`for the next key.
`For each key an ‘inhibit’ bit is also present. When this bit is
`at logic 1 at an address in a given bank, and when the
`corresponding key is pressed (when this bank has been
`selected) no transmission will take place.
`
`A single system option is available however, whereby
`instead of keys a jumper wire and/or a switch may be used
`for bank selection. Using this option it is possible to
`program different transmitter models in one IC and select
`the required bank by means of a jumper wire. Instead of a
`jumper wire a side-switch may also be used to change the
`generated code temporarily (select different bank) to
`obtain multi-function keys. With this option the jumper
`wires or switch must be connected between sense line
`SN0 and one of the drive lines DR0 to DR6 or ground. This
`means that SN0 cannot be used to connect keys and the
`maximum number of keys will be 25 keys for a 16-pin
`package and 49 keys for a 20-pin package.
`It is not possible to use a combination of jumper wires and
`selection keys for bank selection in one unit.
`The output of the ROM is loaded into a shift register that
`provides the input bits for the pulse generator. This pulse
`generator drives the output pin.
`
`1999 Jun 15
`
`6
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`Timing generator
`A schematic diagram of the timing generator is illustrated
`in Fig.4. The oscillator frequency is 432 kHz or 4 MHz.
`The timing generator is stopped when no key is activated
`and started again when a key is pressed.
`The output of the oscillator (CLK1) is divided by 111 for
`4 MHz or by 12 for 432 kHz. Selection is achieved using a
`mask option. The output of the divider is CLK2 which is
`used for clocking of the control timer. The frequency of
`CLK2 is 36 kHz and the inverse is used to generate the
`output pulses in the subcarrier frequency. By mask option
`the duty factor can be chosen to be 25% or 33%.
`The control timer has a length of 4096 subcarrier (pulse)
`periods. This is equal to the transmission repetition time.
`A bit time is equal to 64 pulses and the repetition time is
`64 bit times. The control timer provides the timing of the
`key scanning, the ROM access and the code transmission.
`When the control timer has arrived at a certain state, and
`no key has been pressed for at least 28 ms, a stop signal
`will be generated which will stop the oscillator. All drive
`lines will then be set to logic 0. As soon as a key is pressed
`one of the sense lines will become logic 0. This will
`generate a start signal which will restart the oscillator.
`
`Key scanning
`Six bits of the control timer are used to control the key
`scanning, subsequently 64 time slots are available. Each
`time slot corresponds to a key number. The 3 most
`significant bits (MSBs) control the drive lines and the
`3 least significant bits (LSBs) control the sense lines.
`The scan timing is illustrated in Fig.5. In the first 8 time
`slots drive line DR0 is LOW. During this time the 8 sense
`lines SN0 to SN7 are sequentially tested. The same
`occurs for the next 8 time slots when DR1 is at logic 0 and
`so on until DR6 is at logic 0. After testing there are 8 time
`slots when no drive line is at logic 0 (all drive lines HIGH).
`When, during time slots 0 to 63, one of the sense lines is
`at logic 0 the contents of the 6 bits is stored in the key
`register. This register is used to address the ROM.
`No transmission will take place when two or more keys are
`activated. This situation is considered to be the same as
`‘no key’ and the control bit in the command word for the
`next transmission will be toggled.
`
`When no key is pressed the oscillator will stop at the end
`of the control timer (see Section “Timing generator”).
`In this situation all drive lines will be set to logic 0. When
`one of the keys is pressed again a wake-up will occur by
`starting the oscillator.
`An option is available to select ‘single’ or ‘multi’ system.
`
`Single system
`SN0 should be connected to one of the drive lines or
`ground.
`The bank that will be selected is equal to drive line number
`to which SN0 is connected. When connected to ground the
`number will be 7. This is achieved by loading the bank
`select flip-flops BS0 to BS2 with the contents of C5 to C7
`of the control timer (see Fig.4) when sense line SN0 is at
`logic 0. In this way it is possible to use two different
`systems in one transmitter by using a side switch. With this
`option SN0 cannot be used to connect keys, so the
`maximum number of keys will be lower. (49 keys with
`20-pin IC and 25 keys with 16-pin IC).
`
`Multi system
`The bank is selected by key for maximum 8 different
`systems (e.g. TV, VCR, CD, etc.), any key is flexible for
`bank selection. When a user inserts a new battery, the
`default bank is always in bank 7. If only bank 7 is used,
`then maximum number of keys can be:
`• 56 keys for a 20-pin IC
`• 30 keys for 16-pin IC.
`
`ROM
`A schematic diagram of the ROM is illustrated in Fig.6.
`The ROM is divided into 8 banks of 2 × 64 bytes. Bank
`selection is performed using flip-flops BS0 to BS2 that are
`the 3 highest bits of the address. With the ‘single system’
`these bits are loaded from the 3 MSBs of the scan control
`when SN0 = 0. At power-on the bank select flip-flops will
`be in an arbitrary state.
`When a key was activated, the key number is stored in the
`6-bit key register. This register forms the lower bits of the
`ROM address. For each command the ROM will be
`accessed twice. This gives 16 bits in total (M0L to M7L
`and M0H to M7H). The bits are described in Table 3.
`
`1999 Jun 15
`
`7
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`Table 3 ROM bit description
`BITS
`M0L to M5L
`M6L
`
`M7L
`
`M0H to M4H
`M5H to M7H
`
`FUNCTION
`
`Command bits 0 to 5.
`Field bit. This bit indicates whether command codes 0 to 63 are used (field bit is at logic 1) or
`command codes 64 to 127 are used (field bit is at logic 0).
`Inhibit bit. When this bit is at logic 1 no transmission will take place. When this bit is at logic 0
`the appropriate code-word will be transmitted.
`System bits 0 to 4.
`Bank select. Will be stored in BS0 to BS2 when the ‘multi-system’ option is selected. With
`single system bits M5H to M7H are don't care.
`
`Pulse output
`The bits of the remote control word, as indicated by the addressed ROM locations, are loaded into a shift register every
`bit-time this register is shifted. The output is used to generate a logic 0 or a logic 1 in the biphase (Manchester) coding,
`modulated with a frequency of 36 kHz. The duty factor of the modulation pulses may be selected (optionally) to be 25%
`or 33.3%. The output of the pulse generator controls the output driver that can provide a maximum current of 45 mA.
`
`4 MHz
`
`DIVIDE BY 111
`
`432 kHz
`
`DIVIDE BY 12
`
`handbook, full pagewidth
`
`432 kHz
`or
`4 MHz
`
`OSCILLATOR
`
`CLK1
`
`STOP
`
`Q
`
`Q
`
`S
`
`CLK
`
`R
`
`CLR
`
`no key
`end control
`
`start input
`
`CLK2
`
`INV
`
`pulse
`
`CONTROL
`TIMER
`DIVIDE-BY-4096
`
`C0
`
`C11
`
`MBH035
`
`Fig.4 Timer schematic diagram.
`
`1999 Jun 15
`
`8
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`handbook, full pagewidth
`
`DR0
`
`DR1
`
`DR2
`
`DR3
`
`DR4
`
`DR5
`
`DR6
`
`SN0
`
`SN1
`
`SN2
`
`SN3
`
`SN4
`
`SN5
`
`SN6
`
`SN7
`
`MBH037
`
`Fig.5 Scan timing.
`
`1999 Jun 15
`
`9
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`handbook, full pagewidth
`
`address
`BS2
`BS1
`BS0
`KN5
`KN4
`KN3
`KN2
`KN1
`KN0
`
`ROM 1K x 8
`
`BANK 0 LSB
`BANK 1 LSB
`BANK 2 LSB
`BANK 3 LSB
`BANK 4 LSB
`BANK 5 LSB
`BANK 6 LSB
`BANK 7 LSB
`BANK 0 MSB
`BANK 1 MSB
`BANK 2 MSB
`BANK 3 MSB
`BANK 4 MSB
`BANK 5 MSB
`BANK 6 MSB
`BANK 7 MSB
`
`M7H
`
`M6H M5H M4H M3H M2H M1H M0H M7L
`
`M6L M5L M4L M3L M2L M1L M0L
`MBH036
`
`Fig.6 ROM schematic diagram.
`
`CHARACTERISTICS
`
`CONDITIONS
`
`VDD = 5 V; Tamb = 25 °C
`VDD = 3 V; Tamb = 25 °C
`
`MIN.
`2.0
`−
`−
`−10
`
`PARAMETER
`SYMBOL
`operating supply voltage
`VDD
`IDD
`supply current
`quiescent current
`IDD(q)
`Tamb
`operating ambient temperature
`Sense lines (input only and will have a weak internal pull-up resistance)
`−
`VIL
`LOW level input voltage
`VIH
`0.7VDD
`HIGH level input voltage
`50
`VDD = 2 V
`pull-up resistance
`Rpu
`Driver lines (output only; open drain; maximum on-resistance when LOW)
`−
`Ron
`maximum on-resistance
`VDD = 2 V
`Output driver (has a weak pull-up resistance)
`Isink
`sink current
`Rpu
`pull-up resistance
`
`VDD = 2 V; Vo = 1 V
`VDD = 2 V
`
`−
`−
`
`1999 Jun 15
`
`10
`
`TYP.
`
`−
`−2
`−1
`−
`
`−0.3V
`−
`−
`
`−2
`
`−45
`−5
`
`MAX.
`5.5
`mA
`
`UNIT
`V
`
`μA
`°C
`
`+50
`
`−V
`100
`
`k
`
`mA
`k
`
`DD V
`
`kΩ
`
`Ω
`
`Ω
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`SYSTEM DEVELOPMENT
`Software (RC8521)
`A PC program is provided that enables the user to fill in system and command codes for each key number in each bank.
`This program converts the input data into a ROM code-file needed to produce the metal mask and to program an EPROM
`to be used in the hardware emulator.
`
`Hardware (OM4839)
`An emulator is available that functionally emulates the IC. An EPROM with the ROM code information is inserted into the
`emulator to produce the required remote control codes corresponding to the keys in the prototype device.
`
`VDD
`
`LOUT
`VSS
`
`DR6
`
`DR0
`
`DR1
`
`DR2
`
`DR3
`
`DR4
`
`DR5
`
`20
`
`19
`
`18
`
`17
`
`16
`
`15
`
`14
`
`13
`
`12
`
`11
`
`PCA8521
`
`1 2 3 4 5 6 7 8 9 1
`
`0
`
`APPLICATION INFORMATION
`
`handbook, full pagewidth
`
`432 kHz
`or
`4 MHz
`
`XTAL1
`
`XTAL2
`
`SN7
`
`SN0
`
`SN1
`
`SN2
`
`SN3
`
`SN6
`
`SN4
`
`SN5
`
`Fig.7 Application diagram (for DIP20 and SO20 packages).
`
`MBH034
`
`1999 Jun 15
`
`11
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`INTERNAL PIN CONFIGURATION
`
`VDD
`
`VDD
`
`4
`
`VDD
`
`VDD
`
`3, 5 to 10
`
`MBH322
`
`MBH323
`
`Fig.8 Pin configuration for pin SN0.
`
`Fig.9 Pin configuration for pins SN1 to SN7.
`
`VDD
`
`11 to 17
`
`MBH324
`
`VDD
`
`VDD
`
`19
`
`MBH325
`
`Fig.10 Pin configuration for pins DR0 to DR6.
`
`Fig.11 Pin configuration for pin LOUT.
`
`1999 Jun 15
`
`12
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`PACKAGE OUTLINES
`
`DIP16: plastic dual in-line package; 16 leads (300 mil)
`
`SOT38-4
`
`ME
`
`(e )1
`
`MH
`
`c
`
`A2
`
`A
`
`A1
`
`D
`
`seating plane
`
`L
`
`Z
`
`16
`
`1
`
`pin 1 index
`
`e
`
`w M
`
`b2
`
`b1
`
`9
`
`b
`
`E
`
`8
`
`0
`
`5
`scale
`
`10 mm
`
`L
`
`3.60
`3.05
`0.14
`0.12
`
`ME
`
`8.25
`7.80
`0.32
`0.31
`
`M
`
`H
`
`10.0
`8.3
`0.39
`0.33
`
`w
`
`(1)
`Z
`max.
`
`0.254
`
`0.76
`
`0.01
`
`0.030
`
`EUROPEAN
`PROJECTION
`
`ISSUE DATE
`
`92-11-17
`95-01-14
`
`DIMENSIONS (inch dimensions are derived from the original mm dimensions)
`A
`(1)
`max.
`
`b
`
`Am
`
`2
`ax.
`
`Am
`
`1
`in.
`
`UNIT
`
`b1
`
`b2
`
`c
`
`D
`
`E
`
`(1)
`
`e
`
`e1
`
`mm
`
`4.2
`
`0.51
`
`3.2
`
`inches
`
`0.17
`
`0.020
`
`0.13
`
`1.73
`1.30
`0.068
`0.051
`
`0.53
`0.38
`0.021
`0.015
`
`1.25
`0.85
`0.049
`0.033
`
`0.36
`0.23
`0.014
`0.009
`
`19.50
`18.55
`0.77
`0.73
`
`6.48
`6.20
`0.26
`0.24
`
`2.54
`
`7.62
`
`0.10
`
`0.30
`
`Note
`1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
`
`OUTLINE
`VERSION
`
`SOT38-4
`
` IEC
`
` REFERENCES
` JEDEC
` EIAJ
`
`1999 Jun 15
`
`13
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`SO16: plastic small outline package; 16 leads; body width 7.5 mm
`
`SOT162-1
`
`D
`
`y
`
`Z
`
`16
`
`pin 1 index
`
`1
`
`e
`
`E
`
`HE
`
`A
`
`X
`
`v M A
`
`c
`
`9
`
`A2
`
`A1
`
`(A )3
`
`A
`
`θ
`
`Q
`
`Lp
`L
`
`detail X
`
`5
`scale
`
`10 mm
`
`8
`
`w M
`
`bp
`
`0
`
`θ
`
`o o
`80
`
`L
`
`1.4
`
`0.055
`
`Lp
`
`1.1
`0.4
`0.043
`0.016
`
`Q
`
`v
`
`w
`
`y
`
`1.1
`1.0
`0.043
`0.039
`
`0.25
`
`0.25
`
`0.1
`
`0.01
`
`0.01
`
`0.004
`
`(1)
`
`Z
`
`0.9
`0.4
`0.035
`0.016
`
`EUROPEAN
`PROJECTION
`
`ISSUE DATE
`
`95-01-24
`97-05-22
`
`DIMENSIONS (inch dimensions are derived from the original mm dimensions)
`A
`D (1)
`E (1)
`max.
`
`UNIT
`
`A1
`
`A2
`
`A3
`
`bp
`
`c
`
`e
`
`HE
`
`mm
`
`2.65
`
`inches
`
`0.10
`
`0.30
`0.10
`0.012
`0.004
`
`2.45
`2.25
`0.096
`0.089
`
`0.25
`
`0.01
`
`0.49
`0.36
`0.019
`0.014
`
`0.32
`0.23
`0.013
`0.009
`
`10.5
`10.1
`0.41
`0.40
`
`7.6
`7.4
`0.30
`0.29
`
`1.27
`
`0.050
`
`10.65
`10.00
`0.419
`0.394
`
`Note
`1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
`
`OUTLINE
`VERSION
`
` SOT162-1
`
` IEC
`
` 075E03
`
` REFERENCES
` JEDEC
` EIAJ
`
` MS-013AA
`
`1999 Jun 15
`
`14
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`DIP20: plastic dual in-line package; 20 leads (300 mil)
`
`SOT146-1
`
`ME
`
`(e )1
`
`MH
`
`c
`
`A2
`
`A
`
`A1
`
`w M
`
`E
`
`b1
`
`11
`
`10
`
`D
`
`e
`
`b
`
`Z
`
`20
`
`pin 1 index
`
`1
`
`seating plane
`
`L
`
`0
`
`5
`scale
`
`10 mm
`
`e
`
`e1
`
`2.54
`
`7.62
`
`0.10
`
`0.30
`
`L
`
`3.60
`3.05
`0.14
`0.12
`
`ME
`
`8.25
`7.80
`0.32
`0.31
`
`MH
`
`10.0
`8.3
`0.39
`0.33
`
`w
`
`(1)
`Z
`max.
`
`0.254
`
`2.0
`
`0.01
`
`0.078
`
`EUROPEAN
`PROJECTION
`
`ISSUE DATE
`
`92-11-17
`95-05-24
`
`DIMENSIONS (inch dimensions are derived from the original mm dimensions)
`A
`(1)
`(1)
`max.
`
`Am
`
`2
`ax.
`
`Am
`
`1
`in.
`
`UNIT
`
`b
`
`b1
`
`c
`
`D
`
`E
`
`mm
`
`4.2
`
`0.51
`
`3.2
`
`inches
`
`0.17
`
`0.020
`
`0.13
`
`1.73
`1.30
`0.068
`0.051
`
`0.53
`0.38
`0.021
`0.015
`
`0.36
`0.23
`0.014
`0.009
`
`26.92
`26.54
`1.060
`1.045
`
`6.40
`6.22
`0.25
`0.24
`
`Note
`1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
`
`OUTLINE
`VERSION
`
`SOT146-1
`
`1999 Jun 15
`
` IEC
`
` REFERENCES
` JEDEC
` EIAJ
`
`SC603
`
`15
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`SO20: plastic small outline package; 20 leads; body width 7.5 mm
`
`SOT163-1
`
`D
`
`y
`
`Z
`
`20
`
`c
`
`11
`
`E
`
`HE
`
`A
`
`X
`
`v M A
`
`pin 1 index
`
`1
`
`e
`
`10
`
`w M
`
`bp
`
`A2
`
`A1
`
`(A )3
`
`A
`
`θ
`
`Q
`
`Lp
`L
`
`detail X
`
`0
`
`5
`scale
`
`10 mm
`
`θ
`
`o o
`80
`
`L
`
`1.4
`
`0.055
`
`Lp
`
`1.1
`0.4
`0.043
`0.016
`
`Q
`
`v
`
`w
`
`y
`
`1.1
`1.0
`0.043
`0.039
`
`0.25
`
`0.25
`
`0.1
`
`0.01
`
`0.01
`
`0.004
`
`(1)
`
`Z
`
`0.9
`0.4
`0.035
`0.016
`
`EUROPEAN
`PROJECTION
`
`ISSUE DATE
`
`95-01-24
`97-05-22
`
`DIMENSIONS (inch dimensions are derived from the original mm dimensions)
`A
`D (1)
`E (1)
`max.
`
`UNIT
`
`A1
`
`A2
`
`A3
`
`bp
`
`c
`
`e
`
`HE
`
`mm
`
`2.65
`
`inches
`
`0.10
`
`0.30
`0.10
`0.012
`0.004
`
`2.45
`2.25
`0.096
`0.089
`
`0.25
`
`0.01
`
`0.49
`0.36
`0.019
`0.014
`
`0.32
`0.23
`0.013
`0.009
`
`13.0
`12.6
`0.51
`0.49
`
`7.6
`7.4
`0.30
`0.29
`
`1.27
`
`0.050
`
`10.65
`10.00
`0.419
`0.394
`
`Note
`1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
`
`OUTLINE
`VERSION
`
` SOT163-1
`
` IEC
`
` 075E04
`
` REFERENCES
` JEDEC
` EIAJ
`
` MS-013AC
`
`1999 Jun 15
`
`16
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`SOLDERING
`Introduction
`This text gives a very brief insight to a complex technology.
`A more in-depth account of soldering ICs can be found in
`our “Data Handbook IC26; Integrated Circuit Packages”
`(document order number 9398 652 90011).
`There is no soldering method that is ideal for all IC
`packages. Wave soldering is often preferred when
`through-hole and surface mount components are mixed on
`one printed-circuit board. However, wave soldering is not
`always suitable for surface mount ICs, or for printed-circuit
`boards with high population densities. In these situations
`reflow soldering is often used.
`
`Through-hole mount packages
`SOLDERING BY DIPPING OR BY SOLDER WAVE
`The maximum permissible temperature of the solder is
`260 °C; solder at this temperature must not be in contact
`with the joints for more than 5 seconds. The total contact
`time of successive solder waves must not exceed
`5 seconds.
`The device may be mounted up to the seating plane, but
`the temperature of the plastic body must not exceed the
`specified maximum storage temperature (Tstg(max)). If the
`printed-circuit board has been pre-heated, forced cooling
`may be necessary immediately after soldering to keep the
`temperature within the permissible limit.
`
`MANUAL SOLDERING
`Apply the soldering iron (24 V or less) to the lead(s) of the
`package, either below the seating plane or not more than
`2 mm above it. If the temperature of the soldering iron bit
`is less than 300 °C it may remain in contact for up to
`10 seconds. If the bit temperature is between
`300 and 400 °C, contact may be up to 5 seconds.
`
`Surface mount packages
`REFLOW SOLDERING
`Reflow soldering requires solder paste (a suspension of
`fine solder particles, flux and binding agent) to be applied
`to the printed-circuit board by screen printing, stencilling or
`pressure-syringe dispensing before package placement.
`Several methods exist for reflowing; for example,
`infrared/convection heating in a conveyor type oven.
`Throughput times (preheating, soldering and cooling) vary
`between 100 and 200 seconds depending on heating
`method.
`
`Typical reflow peak temperatures range from
`215 to 250 °C. The top-surface temperature of the
`packages should preferable be kept below 230 °C.
`
`WAVE SOLDERING
`Conventional single wave soldering is not recommended
`for surface mount devices (SMDs) or printed-circuit boards
`with a high component density, as solder bridging and
`non-wetting can present major problems.
`To overcome these problems the double-wave soldering
`method was specifically developed.
`If wave soldering is used the following conditions must be
`observed for optimal results:
`• Use a double-wave soldering method comprising a
`turbulent wave with high upward pressure followed by a
`smooth laminar wave.
`• For packages with leads on two sides and a pitch (e):
`– larger than or equal to 1.27 mm, the footprint
`longitudinal axis is preferred to be parallel to the
`transport direction of the printed-circuit board;
`– smaller than 1.27 mm, the footprint longitudinal axis
`must be parallel to the transport direction of the
`printed-circuit board.
`The footprint must incorporate solder thieves at the
`downstream end.
`• For packages with leads on four sides, the footprint must
`be placed at a 45° angle to the transport direction of the
`printed-circuit board. The footprint must incorporate
`solder thieves downstream and at the side corners.
`During placement and before soldering, the package must
`be fixed with a droplet of adhesive. The adhesive can be
`applied by screen printing, pin transfer or syringe
`dispensing. The package can be soldered after the
`adhesive is cured.
`Typical dwell time is 4 seconds at 250 °C.
`A mildly-activated flux will eliminate the need for removal
`of corrosive residues in most applications.
`
`MANUAL SOLDERING
`Fix the component by first soldering two
`diagonally-opposite end leads. Use a low voltage (24 V or
`less) soldering iron applied to the flat part of the lead.
`Contact time must be limited to 10 seconds at up to
`300 °C.
`When using a dedicated tool, all other leads can be
`soldered in one operation within 2 to 5 seconds between
`270 and 320 °C.
`
`1999 Jun 15
`
`17
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`Suitability of IC packages for wave, reflow and dipping soldering methods
`
`MOUNTING
`
`PACKAGE
`
`Through-hole mount DBS, DIP, HDIP, SDIP, SIL
`Surface mount
`BGA, SQFP
`HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
`SMS
`PLCC(4), SO, SOJ
`LQFP, QFP, TQFP
`SSOP, TSSOP, VSO
`
`SOLDERING METHOD
`WAVE
`REFLOW(1) DIPPING
`−
`suitable(2)
`suitable
`−
`not suitable
`suitable
`−
`not suitable(3)
`suitable
`
`suitable
`suitable
`not recommended(4)(5) suitable
`not recommended(6)
`suitable
`
`−
`−
`−
`
`Notes
`1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
`temperature (with respect to time) and body size of the package, there is a risk that internal or external package
`cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
`Drypack information in the “DataHandbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
`2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
`3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
`(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
`If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
`The package footprint must incorporate solder thieves downstream and at the side corners.
`5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
`it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
`6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
`definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
`
`4.
`
`1999 Jun 15
`
`18
`
`

`

`Philips Semiconductors
`
`Infrared remote control transmitter RC5
`
`Product specification
`
`PCA8521
`
`DEFINITIONS
`
`This data sheet contains target or goal specifications for product development.
`This data sheet contains preliminary data; supplementary data may be published later.
`This data sheet contains final product specifications.
`
`Data sheet status
`Objective specification
`Preliminary specification
`Product specification
`Limiting values
`Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
`more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
`of the device at these or at any other conditions above those given in the Characteristics sections of the specification
`is not implied. Exposure to limiting values for extended periods may affect device reliability.
`Application information
`Where application information is given, it is advisory and does not form part of the specification.
`
`LIFE SUPPORT APPLICATIONS
`These products are not designed for use in life support appliances, devices, or systems where malfunction of these
`products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
`use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
`improper use or sale.
`
`PURCHASE OF PHILIPS RC5 COMPONENTS
`
`Purchase of Philips RC5 components conveys a license under the Philips RC5 patent to use the components in RC5
`system products conforming to the RC5 standard UATM-5000 for allocation of remote control commands defined
`by Philips.
`
`1999 Jun 15
`
`19
`
`

`

`Philips Semiconductors – a worldwide company
`
`Argentina: see South America
`Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
`Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
`Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
`Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
`Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
`220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
`Belgium: see The Netherlands
`Brazil: see South America
`Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
`51 James Bourchier Blvd., 1407 SOFIA,
`Tel. +359 2 68 9211, Fax. +359 2 68 9102
`Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
`Tel. +1 800 234 7381, Fax. +1 800 943 0087
`China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
`72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
`Tel. +852 2319 7888, Fax. +852 2319 7700
`Colombia: see South America
`Czech Republic: see Austria
`Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
`Tel. +45 33 29 3333, Fax. +45 33 29 3905
`Finland: Sinikalliontie 3, FIN-02630 ESPOO,
`Tel. +358 9 615 800, Fax. +358 9 6158 0920
`France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
`Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
`Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
`Tel. +49 40 2353 60, Fax. +49 40 2353 6300
`Hungary: see Austria
`India: Philips INDIA Ltd, Band Box Building, 2nd floor,
`254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
`Tel. +91 22 493 8541, Fax. +91 22 493 0966
`Indonesia: PT Philips Development Corporation, Semiconductors Division,
`Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
`Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
`Ireland: Newstead, Clonskeagh, DUBLIN 14,
`Tel. +353 1 7640 000, Fax. +353 1 7640 200
`Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
`TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
`Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
`20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557
`Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
`TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
`Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
`Tel. +82 2 709 1412, Fax. +82 2 709 1415
`Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
`Tel. +60 3 750 5214, Fax. +60 3 757 4880
`Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
`Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
`Middle East: see Italy
`
`Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
`Tel. +31 40 27 82785, Fax. +31 40 27 88399
`New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
`Tel. +64 9 849 4160, Fax. +64 9 849 7811
`Norway: Box 1, Manglerud 0612, OSLO,
`Tel. +47 22 74 8000, Fax. +47 22 74 8341
`Pakistan: see Singapore
`Philippines: Philips Semiconductors Philippines Inc.,
`106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
`Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
`Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
`Tel. +48 22 612 2831, Fax. +48 22 612 2327
`Portugal: see Spain
`Romania: see Italy
`Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
`Tel. +7 095 755 6918, Fax. +7 095 755 6919
`Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
`Tel. +65 350 2538, Fax. +65 251 6500
`Slovakia: see Austria
`Slovenia: see Italy
`South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
`2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
`Tel. +27 11 471 5401, Fax. +27 11 471 5398
`South America: Al. Vicente Pinzon, 173, 6th floor,
`04547-130 SÃO PAULO, SP, Brazil,
`Tel. +55 11 821 2333, Fax. +55 11 821 2382
`Spain: Balmes 22, 08007 BARCELONA,
`Tel. +34 93 301 6312, Fax. +34 93 301 4107
`Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
`Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
`Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
`Tel. +41 1 488 2741 Fax. +41 1 488 3263
`Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
`TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
`Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
`209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
`Tel. +66 2 745 4090, Fax. +66 2 398 0793
`Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
`ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
`Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
`252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
`United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
`MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
`United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
`Tel. +1 800 234 7381, Fax. +1 800 943 0087
`Uruguay: see South America
`Vietnam: see Singapore
`Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
`Tel. +381 11 62 5344, Fax.+381 11 63 577