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`UNITED STATES PATENT AND TRADEMARK OFFICE
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`UNITED STATES DEPARTMENT OF COMMERCE
`United States Patent and Trademark Office
`Address COMMISSIONER FOR PATENTS
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`144
`Alexandria, Vipinia 22313-1450
`www.uspts pov
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`60/954 ,987
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`08/09/2007
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`200
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`47621-65
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`23971
`BENNETT JONES
`C/O MS ROSEANN CALDWELL
`4500 BANKERS HALL EAST
`855 - 2ND STREET, SW
`CALGARY, ABT2P 4K7
`CANADA
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`CONFIRMATIONNO.3611
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`FILING RECEIPT
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`Date Mailed: 08/21/2007
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`Receipt is acknowledgedof this provisional patent application. It will not be examined for patentability and
`will become abandoned notlater than twelve monthsafter its filing date. Any correspondence concerning the
`application must include the following identification information: the U.S. APPLICATION NUMBER, FILING
`DATE, NAME OF APPLICANT, and TITLE OF INVENTION. Feestransmitted by checkor draft are subject to
`collection. Please verify the accuracy of the data presented on this receipt. If an error is noted on this
`Filing Receipt, please write to the Office of Initial Patent Examination's Filing Receipt Corrections.
`Please provide a copy of this Filing Receipt with the changes noted thereon.If you received a "Notice
`to File Missing Parts" for this application, please submit any corrections to this Filing Receipt with
`your reply to the Notice. When the USPTO processesthereply to the Notice, the USPTO will generate
`another Filing Receipt incorporating the requested corrections
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`Applicant(s)
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`GEOFF SEAN LYON, Calgary, CANADA;
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`Powerof Attorney: The patent practitioners associated with Customer Number 23971
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`If Required, Foreign Filing License Granted: 08/20/2007
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`The country code and number of your priority application, to be used for filing abroad under the Paris Convention, is
`US60/954,987
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`Projected Publication Date: None, application is not eligible for pre-grant publication
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`Non-Publication Request: No
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`Early Publication Request: No
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`Title
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`FLUID HEAT EXCHANGER
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`PROTECTING YOUR INVENTION OUTSIDE THE UNITED STATES
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`Since the rights granted by a U.S. patent extend only throughoutthe territory of the United States and have
`no effect in a foreign country, an inventor who wishes patent protection in another country must apply for a
`patent in a specific country or in regional patent offices. Applicants may wish to consider thefiling of an
`international application under the Patent Cooperation Treaty (PCT). An international (PCT) application
`generally has the same effect as a regular national patent application in each PCT-member country. The
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`Asetek Exhibit 1005
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`PCT process simplifies the filing of patent applications on the same invention in member countries, but
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`does notresult in a grant of "an international patent" and does not eliminate the need of applicants to file
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`additional documents and fees in countries where patent protection is desired.
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`Almost every country has its own patent law, and a person desiring a patent in a particular country must
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`make an application for patent in that country in accordance with its particular laws. Since the laws of many
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`countries differ in various respects from the patent law of the United States, applicants are advised to seek
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`guidancefrom specific foreign countries to ensure that patent rights are not lost prematurely.
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`Applicants also are advised that in the case of inventions made in the United States, the Director of the
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`USPTO mustissue a license before applicants can apply for a patent in a foreign country. The filing of a U.S.
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`patent application serves as a request for a foreign filing license. The application's filing receipt contains
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`further information and guidanceasto the status of applicant's license for foreign filing.
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`Applicants may wish to consult the USPTO booklet, "General Information Concerning Patents" (specifically,
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`the section entitled "Treaties and Foreign Patents") for more information on timeframes and deadlines for
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`filing foreign patent applications. The guide is available either by contacting the USPTO Contact Center at
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`800-786-9199, or it can be viewed on the USPTO website at
`htto:/Avww.uspto.gov/web/offices/pac/doc/general/index.html.
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`For information on preventing theft of your intellectual property (patents, trademarks and copyrights), you
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`may wish to consult
`the U.S. Government website, http:/Awww.stopfakes.gov. Part of a Department of
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`Commerceinitiative, this website includes self-help “toolkits” giving innovators guidance on howto protect
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`intellectual property in specific countries such as China, Korea and Mexico. For questions regarding patent
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`enforcementissues, applicants may call the U.S. Governmenthotline at 1-866-999-HALT (1-866-999-4158).
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`LICENSE FOR FOREIGN FILING UNDER
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`Title 35, United States Code, Section 184
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`Title 37, Code of Federal Regulations, 5.11 & 5.15
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`GRANTED
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`if the phrase "IF REQUIRED, FOREIGN
`The applicant has been granted a license under 35 U.S.C. 184,
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`FILING LICENSE GRANTED"followed by a date appears on this form. Such licenses are issued in all
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`applications where the conditions for issuance of a license have been met, regardless of whether or not a
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`license may be required as set forth in 37 CFR 5.15. The scope andlimitations of this license are set forth in
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`37 CFR 5.15(a) unless an earlier license has been issued under 37 CFR 5.15(b). The license is subject to
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`revocation upon written notification. The date indicated is the effective date of the license, unless an earlier
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`license of similar scope has been granted under 37 CFR 5.13 or 5.14.
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`This license is to be retained by the licensee and may be used at any time on or after the effective date
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`thereof unlessit is revoked. This license is automatically transferred to any related applications(s) filed under
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`37 CFR 1.53(d). This license is not retroactive.
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`The grant of a license does not in any way lessen the responsibility of a licensee for the security of the
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`subject matter as imposed by any Government contract or the provisions of existing laws relating to
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`espionage and the national security or the export of technical data. Licensees should apprise themselves of
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`current regulations especially with respect to certain countries, of other agencies, particularly the Office of
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`Defense Trade Controls, Department of State (with respect to Arms, Munitions and Implements of War (22
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`CFR 121-128)); the Bureau of Industry and Security, Department of Commerce (15 CFR parts 730-774); the
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`Office of Foreign AssetsControl, Department of Treasury (31 CFR Parts 500+) and the Departmentof
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`Energy.
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`NOTGRANTED
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`Page 2 of 20
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`Page 2 of 20
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`if the phrase "IF REQUIRED, FOREIGN
`No license under 35 U.S.C. 184 has been granted atthis time,
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`FILING LICENSE GRANTED" DOES NOTappear on this form. Applicant maystill petition for a license
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`under 37 CFR 5.12,
`if a license is desired before the expiration of 6 months from the filing date of the
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`application.
`If 6 months has lapsed from the filing date of this application and the licensee has not received
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`any indication of a secrecy order under 35 U.S.C. 181, the licensee mayforeign file the application pursuant
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`to 37 CFR 5.15(b).
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`Page 3 of 20
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`Page 3 of 20
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`PTO/SB/14 (06-07)
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`Approved for use through 06/30/2007. OMB 0651-0032
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`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
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`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number.
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`icati
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`Application Data Sheet 37 CFR 1.76
`Application Number
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`FLUID HEAT EXCHANGER
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`Title of Invention
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`The application data sheetis part of the provisional or nonprovisional application for which it is being submitted. The following form contains the
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`bibliographic data arrangedin a format specified by the United States Patent and Trademark Office as outlined in 37 CFR 1.76.
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`This document may be completed electronically and submitted to the Office in electronic format using the Electronic Filing System (EFS) or the
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`document may be printed and included in a paper filed application.
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`Secrecy Order 37 CFR 5.2
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`Portionsorall of the application associated with this Application Data Sheet may fall under a Secrecy Order pursuantto
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`37 CFR 5.2 (Paper filers only. Applications that fall under Secrecy Order may notbefiled electronically.)
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`Applicant Information:
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`Applicant 1
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`Applicant Authority @/nventor|()Legal Representative under 35 U.S.C. 117 CParty ofInterest under 35 U.S.C. 118
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`Prefix} Given Name
`Middle Name
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`LYON
`SEAN
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`Residence Information (Select One) © US Residency ) NonUS— ©) Active US Military Service
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`city
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`Mailing Address of Applicant
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`Address 1
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`Add
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`3920 - 29th Street NE——
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`All
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`Inventors Must Be Listed - Additional
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`generatedwithin this form by selecting the Add button.
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`Correspondence Information:
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`Enter either Customer Number or complete the CorrespondenceInformation section below.
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`For further information see 37 CFR 1.33(a).
`[|] An Addressis being provided for the correspondenceInformation of this application.
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`Customer Number
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`caldwellr@bennettjones.ca
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`Application Information:
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`Title of the Invention
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`FLUID HEAT EXCHANGER
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`Attorney Docket Number! 47621-65
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`Application Type
`Provisional
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`PTO/SB/14 (06-07)
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`Approved for use through 06/30/2007. OMB 0651-0032
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`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
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`Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number.
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`Attorney Docket Number|47621-65
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`Application Data Sheet 37 CFR 1.76
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`Publication Information:
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`[_] Request Early Publication (Fee required at time of Request 37 CFR 1.219)
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`Request Not to Publish. | hereby requestthat the attached application not be published under 35 U.S.
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`C. 122(b} and certify that the invention disclosed in the attached application has not been and will not be the
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`subject of an application filed in another country, or under a multilateral agreement, that requires publication at
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`FLUID HEAT EXCHANGER
`eighteen monthsafterfiling.
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`Representative Information:
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`Representative information should be provided for all practitioners having a power of attorney in the application. Providing
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`this information in the Application Data Sheet does not constitute a powerof attorney in the application (see 37 CFR 1.32).
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`Enter Representative Name_sectioneither Customer Number or complete the below. If both sections
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`are completed the Customer Numberwill be used for the Representative Information during processing.
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`Please Select One: (e) Customer Number | ©) US PatentPractitioner C) US Representative (37 CFR 11.9)
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`Customer Number 23971
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`Domestic Priority Information:
`This section allows for the applicant to claim benefit under 35 U.S.C. 119(e), 120, 121, or 365(c). Providing this information in the
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`application data sheet constitutes the specific reference required by 35 U.S.C. 119(e)} or 120, and 37 CFR 1.78(a){2) or CFR 1.78{a)
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`(4), and need not otherwise be made part of the specification.
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`Prior Application Status
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`Additional Domestic Priority Data may be generated within this form by selecting
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`Foreign Priority Information:
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`and 37 CFR 1.55{a).
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`Providing this information in the application data sheet does not substitute for compliance with any requirementof part 3 of Title 37
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`U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
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`Attorney Docket Number|47621-65
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`Application Data Sheet 37 CFR 1.76
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`FLUID HEAT EXCHANGER
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`If the Assignee is an Organization check here.
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`2007-08-09
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`Signature
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`|/Roseann B. Caldwell/
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`Date (YYYY-MM-DD)|
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`First Name|Roseann Last Name|Caldwell Registration Number|37077
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`review (35 U.S.C. 181) and for review pursuant to the Atomic Energy Act (42 U.S.C. 218(c)).
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`managementpractices and programs, under authority of 44 U.S.C. 2904 and 2906. Such disclosure shall be made in accordance with the
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`to 35 U.S.C. 122(b) or issuance of a patent pursuant to 35 U.S.C. 151. Further, a record may be disclosed, subject to the limitations of 37
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`CFR 1.14, as a routine use, to the public if the record wasfiled in an application which became abandoned or in which the proceedings were
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`terminated and which application is referenced by either a published application, an application open to public inspections or an issued
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`patent.
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`USPTO becomes aware of a violation or potential violation of law or regulation.
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`Fluid Heat Exchanger
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`Background
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`Fluid heat exchangers are used to cool electronic devices by accepting and dissipating thermal
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`Brief Description of the Drawings
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`Referring to the drawings wherein like reference numerals indicate similar parts throughout the
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`several views, several aspects of the present invention are illustrated by way of example, and not
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`by way oflimitation, in detail in the figures, wherein:
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`Figure 1
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`is a top plan view of a fluid heat exchanger according to one embodiment of the
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`invention, with the top cap cut awayto facilitate viewing internal components;
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`Figure 2 is a sectional view alongline I-I of Figure 1;
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`Figure 3 is a sectional view along line II-II of Figure 2;
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`Figure 4 is an exploded, perspective view of a fluid heat exchanger according to another
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`embodimentof the invention; and
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`Figure 5 is a top plan view of the fluid heat exchanger of Figure 4 assembled with its top cap
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`Description of Various Embodiments
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`The detailed description set forth below in connection with the appended drawings is intended as
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`a description of various embodiments of the present invention and is not intended to represent
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`the only embodiments contemplated by the inventor. The detailed description includes specific
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`details for the purpose of providing a comprehensive understanding of the present invention.
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`However,it will be apparent to those skilled in the art that the present invention may be practiced
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`Withreference to Figures 1 to 3, a fluid heat exchanger 100 is shown. Fluid heat exchangeris a
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`heat exchanger which includes a heat spreader plate 102, an arrangement of microporous fluid
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`channels 103, a fluid inlet passage 104, and a fluid outlet passage 106. A housing 109 operates
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`with heat spreader plate 102 to form an outer limit of the heat sink and to define fluid flow
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`passages 104, 106.
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`As shown in Figures 2 and 3, in use, the heat exchanger 100 is coupled to a heat source 107, such
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`as an electronic device, including, but not limited to a microchip and integrated circuit. The heat
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`exchanger may be thermally coupled to the heat source by a thermal interface material disposed
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`therebetween, by coupling directly to the surface of the heat source, or by integrally forming the
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`heat source and at least the heat spreader plate 102 of the fluid heat exchanger. The heat
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`exchanger 100 may take various forms and shapes, but heat spreader plate 102 is formed to
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`accept thermal energy from heat source 107.
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`In the illustrated embodiment, heat spreader plate
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`102 includes a protrusion 102b that controls the positioning of the heat spreaderplate relative to
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`the heat source. Heat spreader plate 102 may include a portion of more conductive material to
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`facilitate and control heat transfer, if desired.
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`Microporous fluid channels 103 are formed to accept the flow of heat exchanging fluid for
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`thermal pick up and dissipation of heat passing through heat spreader plate 102.
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`embodiment, microporousfluid channels 103 are defined by walls 110 that are thermally coupled
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`to the heat spreader plate to accept thermal energy therefrom, For example, heat spreaderplate
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`102 may include an upper surface 102a and a plurality of microchannel walls 110 may extend
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`upwardly therefrom, wherebythe area in between upper surface 102a and the microchannel walls
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`110 channels or directs fluid along a fluid flow path. The surfaces of upper surface 102a and
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`walls 110 have a high thermal conductivity to allow sufficient heat transfer from the heat source
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`107 to fluid passing through channels 103. The surfaces forming channels 103 may beflat,
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`formed with a porous structure, such as of sintered metal and/or silicon foam or roughened,for
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`including troughs and/or crests designed to collect or repel fluid from a particular
`example,
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`location. The microchannel walls 110 may be configured in a parallel configuration, as shown,
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`or otherwise provided fluid can flow between the microchannel walls 110 along a fluid path.
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`It
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`is apparent to one skilled in the art that
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`the microchannel walls 110 may be alternatively
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`configured in any other appropriate configuration depending on various factors of desired flow,
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`DMSLega04762 10005512678483¥1
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`Page 9 of 20
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`Page 9 of 20
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`thermal exchange, etc. For instance, grooves may be formed between sections of microchannel
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`walls 110, Generally, microchannel walls 110 may desirably have dimensions andproperties
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`which seek to reduce or possibly minimize the pressure drop or differential of fluid flowing
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`through the channels defined therebetween.
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`In
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`The microchannel walls 110 allow the fluid to undergo thermal exchange of thermal energy from
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`the heat spreader plate to cool the heat source coupled to the heat spreader plate. As will be
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`appreciated, some regions of the heat spreader plate may be exposed to greater inputs of thermal
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`energy than other regions on that plate by nature of the components coupled directly thereto.
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`such a way, hot spot regions will be formed on the heat spreader plate and on the microchannel
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`walls 110 in that region. The microchannel walls 110 may have a width dimension within the
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`range of 20 microns -1 millimeter and a height dimension within the range of 100 micronsto five
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`millimeters, depending on the power of the heat source 107, desired cooling effect, etc. The
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`microchannel walls 110 may have a length dimension which ranges between 100 microns and
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`several centimeters, depending on the dimensionsof the heat source, as well as the size of the hot
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`spots and the heat flux density from the heat source. Alternatively, any other microchannel wall
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`dimensions are contemplated. The microchannel walls 110 may be spaced apart by a separation
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`dimension range of 20 microns -1 millimeter, depending on the power of the heat source 99,
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`although any other separation dimension range is contemplated.
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`together with
`Other microporous channel configurations may be used alternatively to or
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`microchannels, such as for example, a series of pillars, fins, or undulations, etc. which extend
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`upwards from the heat spreader plate upper surface or tortuous channels as formed by a foam or
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`Fluid heat exchanger 100 further includes a fluid inlet passage 104, which in the illustrated
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`embodiment includes a port 111 through the housing opening to a header 112 and thereafter a
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`fluid inlet opening 114 to the microporousfluid channels 103.
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`The port and the header can be formed in various ways and configurations. For example, port
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`111 may be positioned on top, as shown, side or end regions of the heat exchanger, as desired.
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`Port 111 and header 112 are generally of a larger cross sectional area than openings 114, so that
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`a mass flow off